Copper Containing Patents (Class 420/502)
  • Patent number: 6726877
    Abstract: Silver alloys having properties of fire scale resistance, reduced porosity and oxide formation and reduced grain size relative to traditional sterling silver alloys and useful work hardening performance are provided, comprising about 80-99.0% by weight silver, about 0.5-6% by weight copper, about 0.02-7% by weight of a firescale resisting additive selected from one or a mixture of zinc and silicon, and about 0.01-2.5% by weight germanium. Master alloys for production of the above alloys are also provided for, having the general composition comprising, by weight, about 2.5-99.85% copper, about 0.1-35% zinc or silicon or mixtures thereof, and about 0.05-12.5% germanium.
    Type: Grant
    Filed: May 8, 1996
    Date of Patent: April 27, 2004
    Inventor: Anthony Phillip Eccles
  • Publication number: 20040048193
    Abstract: An optical data recording and storage medium includes a reflective layer formed from a silver alloy that contains, in addition to silver, about 0.1 to about 4.0 wt. %, based on the total weight of alloy, of samarium (Sm).
    Type: Application
    Filed: June 26, 2003
    Publication date: March 11, 2004
    Inventors: Heiner Lichtenberger, Derrick L. Brown, Scott Haluska
  • Publication number: 20030180176
    Abstract: The present invention relates to a silver braze alloy having improved wetting properties. The silver braze alloy consists essentially of from about 52.25 wt % to about 57.0 wt % silver, from about 38.95 to about 43.0 wt % copper, from about 0.5 wt % to about 5.5 wt %, preferably from about 1.0 wt % to about 5.5 wt %, manganese, and up to about 2.5 wt %, preferably from about 1.5 wt % to about 2.5 wt %, nickel. The alloy further may contain 0.15 wt % total of other trace elements.
    Type: Application
    Filed: April 15, 2003
    Publication date: September 25, 2003
    Inventors: Wangen Lin, Brian Schwartz, Viktor Fedorovich Khorunov, F. Michael Hosking, Svitlana Vasylivna Maksymova
  • Patent number: 6620378
    Abstract: Platinum, silver and gold solder compositions for repairing, assembling, or sizing jewelry. Platinum compositions having about 90% to about 95% by weight platinum. Silver compositions having at least 92.5% by weight silver. Gold solder compositions having about 25% to about 91.6% gold. The platinum and silver solder compositions further consisting of about 8.3% to about 75% by weight of an alloy consisting essentially of gallium, indium and copper in respective ratios of 6:3:1. The gold solder compositions further consisting of about 2% to about 14% by weight of an alloy consisting essentially of gallium, indium, and copper in respective ratios of 6:3:1. The melting temperature ranges of the respective solder compositions are from about 1300° C. to about 1500° C. for platinum, from about 1000° F. to about 1400° F. for silver, and from about 1100° F. to about 1550° F.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: September 16, 2003
    Inventor: Keith Weinstein
  • Patent number: 6596229
    Abstract: The present invention relates to a silver braze alloy having improved wetting properties. The silver braze alloy consists essentially of from about 52.25 wt % to about 57.0 wt % silver, from about 38.95 to about 43.0 wt % copper, from about 0.5 wt % to about 5.5 wt %, preferably from about 1.0 wt % to about 5.5 wt %, manganese, and up to about 2.5 wt %, preferably from about 1.5 wt % to about 2.5 wt %, nickel. The alloy further may contain 0.15 wt % total of other trace elements.
    Type: Grant
    Filed: December 29, 2000
    Date of Patent: July 22, 2003
    Assignee: United Technologies Corporation
    Inventors: Wangen Lin, Brian Schwartz, Viktor Fedorovich Khorunov, F. Michael Hosking, Svitlana Vasylivna Maksymova
  • Publication number: 20020085944
    Abstract: The present invention relates to a silver braze alloy having improved wetting properties. The silver braze alloy consists essentially of from about 52.25 wt % to about 57.0 wt % silver, from about 38.95 to about 43.0 wt % copper, from about 0.5 wt % to about 5.5 wt %, preferably from about 1.0 wt % to about 5.5 wt %, manganese, and up to about 2.5 wt %, preferably from about 1.5 wt % to about 2.5 wt %, nickel. The alloy further may contain 0.15 wt % total of other trace elements.
    Type: Application
    Filed: December 29, 2000
    Publication date: July 4, 2002
    Inventors: Wangen Lin, Brian Schwartz, Viktor Fedorovich Khorunov, F. Michael Hosking, Svitlana Vasylivna Maksymova
  • Patent number: 6413649
    Abstract: The present invention is directed to brazing filler metals that can be used in the infiltration brazing of porous matrix materials without the need for a flux. The brazing filler metals contain two different Group II metals and a third metal of Group 9 and 10. A particular brazing filler metal of the invention contains silver, copper, and nickel. The invention is also directed to composite materials formed by infiltration of the brazing material into a porous matrix, and to methods for preparing the composite materials. The invention is further directed to composite articles fabricated from composite materials, including steel bearings or bushings, and to methods of preparing the composite articles.
    Type: Grant
    Filed: March 6, 1998
    Date of Patent: July 2, 2002
    Assignee: The Morgan Crucible Company plc
    Inventors: David J. Kepniss, Toshimasa Oyama
  • Patent number: 6406664
    Abstract: A fire stain and tarnish resistance silver composition containing germanium, tin, and trace amounts of boron and nickel, as well as copper.
    Type: Grant
    Filed: August 15, 2000
    Date of Patent: June 18, 2002
    Inventor: Lawrence H. Diamond
  • Patent number: 6399019
    Abstract: A metal-ceramic composite substitute is produced by joining a metal plate to a ceramic substrate by using a brazing material in a paste form prepared by adding 10-14 parts by weight of a vehicle to 100 parts by weight of a powder of which the solid centent comprises 90.0˜99.5% of an Ag powder, 0˜9.5% of a Cu powder and 0.5˜4.0% of an active metal powder, and 0.0˜0.9% of a titanium oxide powder if necessary.
    Type: Grant
    Filed: August 16, 2000
    Date of Patent: June 4, 2002
    Assignee: Dowa Mining Co., Ltd.
    Inventors: Masami Sakuraba, Masami Kimura, Masaya Takahara, Junji Nakamura
  • Publication number: 20010053456
    Abstract: The present invention is directed to brazing filler metals that can be used in the infiltration brazing of porous matrix materials without the need for a flux. The brazing filler metals contain two different Group II metals and a third metal of Group 9 and 10. A particular brazing filler metal of the invention contains silver, copper, and nickel. The invention is also directed to composite materials formed by infiltration of the brazing material into a porous matrix, and to methods for preparing the composite materials. The invention is further directed to composite articles fabricated from composite materials, including steel bearings or bushings, and to methods of preparing the composite articles.
    Type: Application
    Filed: March 6, 1998
    Publication date: December 20, 2001
    Inventors: DAVID J. KEPNISS, TOSHIMASA OYAMA
  • Publication number: 20010035237
    Abstract: A physical vapor deposition target includes an alloy of copper and silver, with the silver being present in the alloy at from less than 1.0 at % to 0.001 at %. In one implementation, a physical vapor deposition target includes an alloy of copper and silver, with the silver being present in the alloy at from 50 at % to 70 at %. A physical vapor deposition target includes an alloy of copper and tin, with tin being present in the alloy at from less than 1.0 at % to 0.001 at %. In one implementation, a conductive integrated circuit metal alloy interconnection includes an alloy of copper and silver, with the silver being present in the alloy at from less than 1.0 at % to 0.001 at %. A conductive integrated circuit metal alloy interconnection includes an alloy of copper and silver, with the silver being present in the alloy at from 50 at % to 70 at %. A conductive integrated circuit metal alloy interconnection includes an alloy of copper and tin, with tin being present in the alloy at from less than 1.0 at % to 0.
    Type: Application
    Filed: February 14, 2001
    Publication date: November 1, 2001
    Inventors: Shozo Nagano, Hinrich Hargarter, Jianxing Li, Jane Buehler
  • Patent number: 5972131
    Abstract: An Ag--Cu alloy for a sliding contact containing:a) 0.1 to 8.0 wt. % of Cu, based on the weight of the alloy, wherein at least 70 wt. % of the Cu contained in the alloy is solid-solubilized in an Ag-.alpha.-phase; andb) 0.1 to 4.0 wt. %, based on the weight of the alloy, of at least one metal selected from the group consisting of Ge, Ni, Sn, In, Zn, Mg, Mn, Sb, Pb and Bi.The Ag--Cu alloy is desirably utilized to form a composite with a Cu or Cu alloy base material. Such composite has been found to be very useful for fabricating the commutator of a compact DC motor.
    Type: Grant
    Filed: November 14, 1997
    Date of Patent: October 26, 1999
    Assignees: Tanaka Kikinzoku Kogyo K.K., Mabuchi Motor Co., Ltd.
    Inventors: Takao Asada, Keiji Nakamura, Isao Shibuya, Toshiya Yamamoto, Tetsuya Nakamura, Kiyoshi Nakama
  • Patent number: 5955686
    Abstract: A brazing material having 0.25-0.9 wt % of titanium oxide added to a basic formula consisting of 60-94.25 wt % Ag, 5-30 wt % Cu and 0.5-4.5 wt % of an active metal is processed to form a paste, which is applied to an AlN substrate and overlaid with a copper plate and heat treated to form a joint between the AlN substrate and the copper plate. A resist is applied to the copper plate to form a circuit pattern, which is etched to form a metallized circuit, thereby producing a metal-ceramics composite substrate capable of operation on high electrical power. The substrate is improved in various characteristics of a power module device over the composite substrates produced by using the conventional brazing materials.
    Type: Grant
    Filed: May 2, 1997
    Date of Patent: September 21, 1999
    Assignee: Dowa Mining Co., Ltd.
    Inventors: Masami Sakuraba, Masami Kimura, Junji Nakamura, Takashi Ono
  • Patent number: 5922479
    Abstract: A brazing alloy for joining a pair of members at least one of which is a metallic member, contains Ag, Cu, In and Ti, and further contains from 0.03 wt. % to 1.2 wt. % Ni. A composite assembly of members at least one of which is a metallic member aid which are joined with such a brazing alloy, is also provided.
    Type: Grant
    Filed: October 25, 1995
    Date of Patent: July 13, 1999
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Masato Taniguchi, Osamu Suzuki
  • Patent number: 5916520
    Abstract: The brazing filler of the present invention is excellent in wetting properties towards the open end of a ceramic cylinder and a metal sealing cap can be sealed well on the open end. The present brazing filler comprises Ag, Cu and active metal, in which the Cu-active metal compound is contained in an amount of not more than 40% by volume.
    Type: Grant
    Filed: March 11, 1997
    Date of Patent: June 29, 1999
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Miho Maruyama, Masako Nakahashi, Kiyoshi Osabe, Rika Takigawa, Shoji Niwa
  • Patent number: 5882441
    Abstract: A silver colored alloy, highly tarnish resistant, corrosion resistant and brittleness free is provided. The alloy includes 90% to 94% by weight silver, 3.50% to 7.35% by weight zinc, 1% to 3% by weight copper, and 0.1% to 2.5% by weight silicon. The alloy is suitable for rings, earrings, bangles and other jewelry.
    Type: Grant
    Filed: August 1, 1997
    Date of Patent: March 16, 1999
    Inventor: Daniel Davitz
  • Patent number: 5817195
    Abstract: A silver colored alloy highly tarnish resistant, sterling silver is provided or having included therein: 90% to 92.5% by weight Silver; 5.75% to 7.5% by weight Zinc; 0.25% to less than 1% by weight Copper; 0.25% to 0.5% by weight Nickel; 0.1% to 0.25% by weight Silicon; and 0.0% to 0.5% by weight Indium.
    Type: Grant
    Filed: November 19, 1996
    Date of Patent: October 6, 1998
    Assignee: Astrolite Inc.
    Inventor: Daniel Davitz
  • Patent number: 5593514
    Abstract: Amorphous metal alloys rich in noble metals prepared by rapid solidification processing are disclosed. The alloys have at least a ternary composition having the formula M.sub.a G1.sub.b G2.sub.c, wherein M is at least one element selected from the group consisting of Ag, Au, Ru, Os, Rh, Ir, Pd, and Pt, and G1 is at least one element selected from the group consisting of B, C, Cu, Ni, Si, and Be, and G2 is at least one element selected from the group consisting of Y, the lanthanides, Zr, Hf, Ca, Mg, Ti, Nb, and Ta. The subscripts a, b, and c are atomic percentages; a ranges from 70 to 90 percent, and b and c range from 5 to 15 percent each. Preferably, a is at least 80 percent and b and c are generally equal. The amorphous metal alloys are readily glass forming and thermally stable at room temperatures.
    Type: Grant
    Filed: December 1, 1994
    Date of Patent: January 14, 1997
    Assignee: Northeastern University
    Inventors: Bill C. Giessen, Sunil V. Gokhale, Krassimir G. Marchev
  • Patent number: 5558833
    Abstract: A silver alloy having a reduced porosity surface after it has been cast in a mold is disclosed. The silver alloy consists of silver in a range from 92.50 to 99.00 percent by weight, indium in a range from 0.01 to 7.40 percent by weight, molybdenum in a range from 0.001 to 0.10 percent by weight, and the balance of copper. In one embodiment, the silver alloy consists of 93.50 percent by weight silver, 1.00 percent by weight indium, 0.05 percent by weight molybdenum, and the balance copper. A process for casting the silver alloy is also disclosed.
    Type: Grant
    Filed: June 9, 1995
    Date of Patent: September 24, 1996
    Inventor: Marek R. Zamojski
  • Patent number: 5490870
    Abstract: A multi-component composition suitable for amalgamation with mercury to form a dental amalgam, an amalgam and a method for producing such a multi-component composition. The multi-component composition has: from 30 to 90% (by weight) of a first component containing at least 30% silver, at least 20% tin and at least 10% copper; from 10 to 70% (by weight) of a second component, or alternatively, from 5 to 65% (by weight) of a second component and from 5 to 65% (by weight) of a fourth component, the second and fourth components containing at least 30% silver, at least 20% tin and at least 10% copper; and up to 15% (by weight) of a third component containing silver and/or alloy powder containing at least 80% (by weight) silver. The first component is spherically shaped atomized alloy powder. The second component is mechanically worked atomized alloy powder. The surface area to volume ratio of the powder of the second component is greater than the surface area to volume ratio of the powder of the first component.
    Type: Grant
    Filed: July 12, 1994
    Date of Patent: February 13, 1996
    Assignee: Special Metals Corporation
    Inventors: Richard W. Fountain, Kamal Asgar
  • Patent number: 5425819
    Abstract: A granule-type magnetoresistive material is used to form a MR component, which is equipped in a magnetic head, or the like. When placing the magnetoresistive material in the external magnetic field, the electric resistance is altered responsive to a variation of the external magnetic field. In order to increase a magnetic-field sensitivity, the magnetoresistive material is composed of an alloy whose atomic composition is expressed by a chemical formula of (Co.sub.1-x Fe.sub.x).sub.y Ag.sub.1-y, where 0.45.ltoreq.x.ltoreq.0.55 and 0.24.ltoreq.y.ltoreq.0.35; or another chemical formula of (Co.sub.1-x Fe.sub.x).sub.y (Ag.sub.1-z Cu.sub.z).sub.1-y, where 0.45.ltoreq.x.ltoreq.0.55, 0.24.ltoreq.y.ltoreq.0.35 and z.ltoreq.0.14.
    Type: Grant
    Filed: August 29, 1994
    Date of Patent: June 20, 1995
    Assignee: Yamaha Corporation
    Inventors: Toshiyuki Oohashi, Naoshi Horiai, Makoto Shiraki
  • Patent number: 5352542
    Abstract: Cadmium-free brazing solders which also have working temperatures under 630.degree. C. containing 45 to 80 wt. % silver, 5 to 25 wt. % copper, 10 to 25 wt. % gallium, and 0.1 to 5 wt. % indium and/or tin.
    Type: Grant
    Filed: September 1, 1993
    Date of Patent: October 4, 1994
    Assignee: Degussa Aktiengesellschaft
    Inventors: Alexander Voelcker, Joerg Beuers, Sigurd Joensson, Dieter Kaufmann, Georg Ptaschek, Wolfgang Kaster
  • Patent number: 5341981
    Abstract: Cadmium-free brazing solders with working temperatures under 630.degree. C. containing 45 to 80 wt. % silver, 5 to 13 wt. % copper, 10 to 25 wt. % gallium, 8 to 20 wt. % zinc, and 0 to 5 wt. % indium and/or tin.
    Type: Grant
    Filed: September 1, 1993
    Date of Patent: August 30, 1994
    Assignee: Degussa Aktiengesellschaft
    Inventors: Wolfgang Weise, Alexander Voelcker, Dieter Kaufmann, Willi Malikowski, Joerg Beuers, Harald Krappitz
  • Patent number: 5330098
    Abstract: An alloy for brazing ceramics has the following composition, in weight percent: 0.5 to 3% titanium; 0.25 to 2% aluminum, silicon or tin; 2 to 6% copper; balance silver.
    Type: Grant
    Filed: November 13, 1992
    Date of Patent: July 19, 1994
    Assignee: The Morgan Crucible Co., PLC
    Inventor: Howard Mizuhara
  • Patent number: 5250229
    Abstract: The invention is directed to a thermal cycle adhesion additive composition consisting essentially of an admixture of finely divided particles of oxides of bismuth, copper, lead, zinc, and transition metal and to conductive thick film compositions made therefrom.
    Type: Grant
    Filed: October 10, 1991
    Date of Patent: October 5, 1993
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Hiroyuki Hara, Marc H. La Branche, Barry E. Taylor
  • Patent number: 5242305
    Abstract: The amount of mercury released from amalgam restorations in the teeth of living beings is significantly reduced without changing the composition of the silver-tin-copper alloy or changing the mercury-alloy ratio. This is achieved by introducing a mercury-absorbing metal component which acts only during the final setting stage of the amalgam. In a process embodiment, this is achieved by introducing a mercury-absorbing metal component which is applied to the prepared tooth cavity walls where it absorbs excess mercury from the setting amalgam. In a composition embodiment, the composition of the amalgam restoration consists of three components: a finely divided silver-tin-copper alloy; mercury; and a mercury-absorbing metal powder containing at least 50% by weight of palladium and the remainder of the group consisting of gold, copper, platinum, indium, zinc, and silver, some of which may be present as a coating on the palladium base powder.
    Type: Grant
    Filed: April 2, 1992
    Date of Patent: September 7, 1993
    Inventor: William J. O'Brien
  • Patent number: 5242511
    Abstract: A copper alloy composition comprising 100 parts by weight of powder of copper alloy represented by the general formula Ag.sub.x Cu.sub.y (wherein x and y are atomic ratio values; 0.001.ltoreq..times..ltoreq.0.999, 0.001.ltoreq.y.ltoreq.0.999, x+y=1), 5 to 200 parts by weight of one or more organic binders and 0.01 to 100 parts by weight of an additive capable of removing copper oxide; and a paste for screen printing, electromagnetic shielding, an electrically conductive additive, a paste for electrode and a paste for through hole, which are obtained by using said composition.
    Type: Grant
    Filed: October 18, 1991
    Date of Patent: September 7, 1993
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Akinori Yokoyama, Tsutomu Katsumata, Hitoshi Nakajima
  • Patent number: 5198154
    Abstract: A composition, which comprises copper alloy powder represented by a general formula Ag.sub.x Cu.sub.y M.sub.z (where M represents one or more metals selected from Pb, Bi and Zn; x, y and z are atomic ratio values, respectively; and 0.001.ltoreq.x.ltoreq.0.4, 0.6.ltoreq.y.ltoreq.0.999, 0.ltoreq.z.ltoreq.0.05 and x+y+z=1) having particle surface silver concentration higher than the average silver concentration thereof and a region in which a silver concentration increases toward the particle surface, glass frit and an organic vehicle, is useful for pastes for screen printing, electroconductive circuits, electrodes, electromagnetic wave shields and an electroconductive pastes for a resistance contacts.
    Type: Grant
    Filed: November 5, 1991
    Date of Patent: March 30, 1993
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Akinori Yokoyama, Tsutomu Katsumata, Hitoshi Nakajima
  • Patent number: 5171643
    Abstract: An electric contact material comprising 0.01 to 2.0 weight % of Li, 0.01 weight % or more to less than 0.2 weight % of at least one rare earth metal and the remainder being Ag. The electric contact material may further comprise 0.1 to 1.0 weight % of at least one element selected from a group consisting of In, Sn, Zn, Mn, Pd, Sb, Cu, Mg, Pb, Cd, Cr and Bi, however, for Zn and Mn, the amount is less than 0.5 % by weight; and/or 0.03 to 0.6 weight % of at least one element selected from a group consisting of Fe, Ni and Co. The electric contact material is excellent in arc resistance, wear resistance and lubricity in a small current region and is suitable as a material for a slide contact and a rotary slide contact.
    Type: Grant
    Filed: July 23, 1990
    Date of Patent: December 15, 1992
    Assignees: The Furukawa Electric Co., Ltd., Mabuchi Motor Kabushiki Kaisha
    Inventors: Satoshi Suzuki, Nobuyuki Shibata, Ryotomo Shirakawa, Akira Matsuda
  • Patent number: 5021214
    Abstract: Ag allow generally used for decorative purposes such as silverware and accessories, including In and Al as a substitute for conventionally used Pd provides the products with high discoloration resistance and elegant tint inherent to Ag. Additional content of Cu further improves mechanical properties of the products.
    Type: Grant
    Filed: December 26, 1989
    Date of Patent: June 4, 1991
    Assignee: Kabushiki Kaisha Zero One
    Inventors: Hiroshi Sasaki, Makoto Nishiya
  • Patent number: 5000779
    Abstract: The subject of this invention is the development of new alloys along with new processing approaches for the utilization of the alloys. A particular class of alloys comprises at least one noble metal selected from the group comprising gold, palladium, silver and copper and an amount of between about 0.20 weight percent and about 0.80 weight percent of at least one metalloid selected from the group of metalloids consisting of boron, phosphorous, silicon and lithium. Rapid solidification technology in powder fabrication and the addition of metalloids have been combined to produce a new class of palladium based alloys. The metalloid additions greatly increase the hardness, enhance the fine grain structure and aid sintering densification. Net-shape forming is a benefit derived from the characteristics of the new alloys.
    Type: Grant
    Filed: May 18, 1988
    Date of Patent: March 19, 1991
    Assignee: Leach & Garner
    Inventors: Randall M. German, Laura L. Bourguignon, Dwarika P. Agarwal, Shaji Faroog
  • Patent number: 4971759
    Abstract: In the composition of a Ag alloy type material used for production of flutes, a specified amount of at least one of Ni, Fe, Co and Cr or at least one of Mn, Ti, Zi and Si is added to suppress softening and crystal grain size coarsening caused by annealing in production. Thus, flutes which generate brilliant sounds in mid to high notes can be obtained by using the above material.
    Type: Grant
    Filed: November 27, 1989
    Date of Patent: November 20, 1990
    Assignee: Yamaha Corporation
    Inventors: Osamu Watanabe, Takashi Nara, Kojiro Akagawa, Kuniaki Nomata
  • Patent number: 4948557
    Abstract: A gold colored, tarnish and corrosion resistant alloy is disclosed, usable for jewelry, dental purposes and the like. The alloy consists essentially of 24 to 27 percent palladium, 19 to 22 percent indium, 5 to 30 percent copper, 1 to 20 percent gold, and the balance is essentially silver.
    Type: Grant
    Filed: February 1, 1989
    Date of Patent: August 14, 1990
    Inventor: Daniel Davitz
  • Patent number: 4883745
    Abstract: A silver-copper-titanium brazing alloy contains a small amount of tin, indium, silicon, aluminum or manganese as a crust inhibiting element.
    Type: Grant
    Filed: November 7, 1988
    Date of Patent: November 28, 1989
    Assignee: GTE Products Corporation
    Inventor: Howard Mizuhara
  • Patent number: 4869757
    Abstract: A unique hardenable silver alloy is provided which is solution annealed and preferably age-hardened to yield a silver alloy of exceptional and reversible hardness. The alloys utilize intermetallic systems comprising; silver, copper, combined with lithium alone or tin alone in varying percent amounts, or silver, copper, lithium and either tin or antimony, or silver, copper, lithium, tin and antimony, or silver, copper, lithium, tin and bismuth, or silver, copper, lithium, tin, bismuth and antimony.
    Type: Grant
    Filed: April 13, 1987
    Date of Patent: September 26, 1989
    Assignee: Leach & Garner Company
    Inventors: Thomas W. Eagar, Dwarika P. Agarwal, Laura L. Bourguignon, Rosaire Marcotte
  • Patent number: 4859412
    Abstract: An economical alloyed powder for dental amalgams exhibiting good working properties is obtained from pressed and sintered molded bodies by mechanical comminution. The formed body is produced by mixing and pressing powders of elemental silver, copper and tin with a subsequent sintering between 150.degree. C. and the solidus temperature of the alloy being formed. The sintering is performed until a homogeneous distribution of the tin has been achieved in the silver and copper particles.
    Type: Grant
    Filed: May 23, 1988
    Date of Patent: August 22, 1989
    Inventors: Werner Groll, Doris Hathaway, Gernot Schock
  • Patent number: 4842955
    Abstract: A brazing foil is composed of metastable material having a microcrystalline structure and a composition consisting essentially of about 15 to 40 weight percent copper, 0 to 32 weight percent zinc, 0 to 24 weight percent cadmium, 0 to 3 weight percent nickel and 0 to 10 weight percent tin, the balance being silver and incidental impurities. The foil is clean, homogeneous, brittle and is especially adapted for comminution into powder.
    Type: Grant
    Filed: September 14, 1987
    Date of Patent: June 27, 1989
    Assignee: Allied-Signal Inc.
    Inventor: Anatol Rabinkin
  • Patent number: 4810308
    Abstract: A unique hardenable silver alloy is provided which is solution annealed and preferably age-hardened to yield a silver alloy of exceptional and reversible hardness. The alloys utilize intermetallic systems comprising silver, copper, combined with lithium alone or tin alone in varying percent amounts, or silver, copper, lithium and either tin or antimony, or silver, copper, lithium and either aluminum or indium or zinc, or silver, copper, antiomony and either aluminum or indium or zinc, or silver, copper, lithium, tin and antimony, or silver, copper, lithium, tin and bismuth, or silver, copper, lithium, tin, bismuth and antimony.
    Type: Grant
    Filed: January 19, 1988
    Date of Patent: March 7, 1989
    Assignee: Leach & Garner Company
    Inventors: Thomas W. Eagar, Dwarika P. Agarwal, Laura L. Bourguignon, Rosaire Marcotte
  • Patent number: 4775511
    Abstract: Sulfide tarnish inhibiting of silver base alloys selected from the group consisting of Ag-Cu, Ag-Au, and Ag-Cu-Au is achieved by adding to silver base alloys at least one element with passivating ability and with heat of sulfide formation which exceeds the heat of sulfide formation of silver and in the amount which does not exceed 1.5 weight % as substitute of silver, so as to form a thin layer of oxide of the element which is selected from the group consisting of Cr, Ta, Al, Ti and Th. The layer of oxide is thin and does not affect the properties of silver base alloys. The added element, in the event of damage to the oxide layer, forms a sulfide film of the element before formation of silver sulfide, to thereby protect silver base alloys from tarnishing.
    Type: Grant
    Filed: July 8, 1986
    Date of Patent: October 4, 1988
    Inventors: William Kono, John P. Nielsen
  • Patent number: 4766041
    Abstract: Reactive metal silver alloys containing controlled levels of copper, aluminum or mixtures thereof liquidus temperatures in the range of from about 750.degree. C. to about 950.degree. C., are ductile and after brazing are relatively free of hard dispersed phases. The level of reactive metal is kept below 4% by weight and from about 0.25% to about 2.5% is preferred.
    Type: Grant
    Filed: October 14, 1986
    Date of Patent: August 23, 1988
    Assignee: GTE Products Corporation
    Inventor: Howard Mizuhara
  • Patent number: 4735866
    Abstract: A method of joining ceramics and metals to themselves and to one another at about 800.degree. C. is described using a brazing filler metal consisting essentially of 35 to 50 at. % copper, 40 to 50 at. % silver, 1 to 15 at. % titanium, and 2 to 8 at. % tin. This method produces strong joints that can withstand high service temperatures and oxidizing environments.
    Type: Grant
    Filed: July 28, 1986
    Date of Patent: April 5, 1988
    Assignee: The United States of America as represented by the United States Department of Energy
    Inventor: Arthur J. Moorhead
  • Patent number: 4726858
    Abstract: A recording material made of an alloy capable of exhibiting different spectral reflectances at an equal temperature, depending on a heating-cooling cycle to which the alloy is subjected. The alloy can possess in solid state different crystal structures at a first temperature higher than the room temperature and at a second temperature lower than the first temperature but not lower than the room temperature. A part of the surface of the alloy exhibits, as a result of being quenched from the first temperature, a crystal structure which is different from the crystal structure at the second temperature, while the other part possesses the crystal structure at the second temperature, so that these two parts exhibit different spectral reflectances. Using this recording medium, it is possible to record, reproduce and erase information by means of, for example, laser beams.
    Type: Grant
    Filed: August 22, 1984
    Date of Patent: February 23, 1988
    Assignee: Hitachi, Ltd.
    Inventors: Tetsuro Minemura, Hisashi Ando, Isao Ikuta, Yoshiaki Kita
  • Patent number: 4721539
    Abstract: New alloys of Cu.sub.x Ag.sub.(1-x) InSe.sub.2 (where x ranges between 0 and 1 and preferably has a value of about 0.75) and CuIn.sub.y Ga.sub.(1-y) Se.sub.2 (where y ranges between 0 and 1 and preferably has a value of about 0.90) in the form of single crystals with enhanced structure perfection, which crystals are substantially free of fissures are disclosed. Processes are disclosed for preparing the new alloys of Cu.sub.x Ag.sub.(1-x) InSe.sub.2. The process includes placing stoichiometric quantities of a Cu, Ag, In, and Se reaction mixture or stoichiometric quantities of a Cu, In, Ga, and Se reaction mixture in a refractory crucible in such a manner that the reaction mixture is surrounded by B.sub.2 O.sub.3, placing the thus loaded crucible in a chamber under a high pressure atmosphere of inert gas to confine the volatile Se to the crucible, and heating the reaction mixture to its melting point.
    Type: Grant
    Filed: July 15, 1986
    Date of Patent: January 26, 1988
    Assignee: The United States of America as represented by the United States Department of Energy
    Inventor: Theodore F. Ciszek
  • Patent number: 4714189
    Abstract: A sensor for assessing conditions within a metallic high pressure boiler 10, has a sensitive tip section 12, which is insulated from the boiler by virtue of a ceramic spacing member 101. The joins between the member 101 and sensor body 15 and tip 12 respectively are subject to full boiler pressure. The present invention provides a pressure seal by virtue of forming a brazed seal between the parts by forming a ceramic component to be brazed in a ceramic of average gain size of substantially between 5 and 15 microns and of purity exceeding 99% with a maximum silica content of substantially 0.2%, introducing between components a eutectic of substantially the composition: 80% to 90% silver; 5% to 6% copper; less than 6% titantium; and sufficient in quantity to fill gap therebetween, and subjecting the components to a temperature in excess of eutectic liquids temperature while maintaining the components in a vacuum.
    Type: Grant
    Filed: March 26, 1986
    Date of Patent: December 22, 1987
    Assignee: Schlumberger Electronics (U.K.) Limited
    Inventor: Stuart J. Tovey
  • Patent number: 4698271
    Abstract: A method of joining ceramics and metals to themselves and to one another is described using a brazing filler metal consisting essentially of 35 to 50 atomic percent copper, 15 to 50 atomic percent silver and 10 to 45 atomic percent titanium. This method produces strong joints that can withstand high service temperatures and oxidizing environments.
    Type: Grant
    Filed: December 30, 1985
    Date of Patent: October 6, 1987
    Assignee: The United States of America as represented by the Department of Energy
    Inventor: Arthur J. Moorhead
  • Patent number: 4684579
    Abstract: Reactive metal silver alloys containing controlled levels of copper, aluminum or mixtures thereof liquidus temperatures in the range of from about 750.degree. C. to about 950.degree. C., are ductile and after brazing are relatively free of hard dispersed phases. The level of reactive metal is kept below 4% by weight and from about 0.25% to about 2.0% is preferred.
    Type: Grant
    Filed: June 23, 1986
    Date of Patent: August 4, 1987
    Assignee: GTE Products Corporation
    Inventor: Howard Mizuhara
  • Patent number: 4664855
    Abstract: A process for manufacturing an atomized amalgamable alloy having mold adaptation characteristics superior to other atomized alloys and comparable or better than those for ad-mixed type alloys (alloys which are mixtures of spherical and irregularly shaped particles), and physical properties comparable to ad-mixed alloys. The process includes the steps of: producing a melt of an amalgamable alloy; atomizing the alloy so as to form particles which are primarily irregular in shape; collecting the particles; drying the particles; mechanically working the particles so as to fracture and change their shape; classifying the particles to finer than 53 microns; heat treating the particles; and reducing oxides from the surface of the particles.
    Type: Grant
    Filed: November 12, 1985
    Date of Patent: May 12, 1987
    Assignee: Special Metals Corporation
    Inventors: David L. Tremblay, Kamal Asgar
  • Patent number: 4643875
    Abstract: An alloy for brazing ceramic to a ceramic or a metal consists essentially of 35 to 95% tin, 0.5 to 70% silver, 0.5 to 20% copper, 0.1 to 4% titanium and/or vanadium and/or zirconium, 0 to 5% nickel, 0 to 2% chromium, all percentages by weight.
    Type: Grant
    Filed: July 24, 1985
    Date of Patent: February 17, 1987
    Assignee: GTE Products Corporation
    Inventor: Howard Mizuhara
  • Patent number: 4623513
    Abstract: Titanium-silver alloys containing specified amounts of silver and titanium and controlled amounts of copper, aluminum and mixtures thereof are suitable for brazing ceramics, other non-metallic and metallic materials. These alloys also may contain controlled amounts of tin, palladium, indium and mixtures thereof.
    Type: Grant
    Filed: September 20, 1984
    Date of Patent: November 18, 1986
    Assignee: GTE Products Corporation
    Inventor: Howard Mizuhara
  • Patent number: 4591535
    Abstract: An article is disclosed consisting essentially of a ceramic substrate bonded to a metal or ceramic member by a brazing alloy. In these processes, the ceramic surface is prepared such that it is relatively defect free prior to brazing.
    Type: Grant
    Filed: June 20, 1984
    Date of Patent: May 27, 1986
    Assignee: GTE Products Corporation
    Inventor: Howard Mizuhara