Antimony, Or Bismuth Containing Patents (Class 420/561)
  • Patent number: 10442037
    Abstract: A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag3Sn blades.
    Type: Grant
    Filed: February 24, 2015
    Date of Patent: October 15, 2019
    Assignee: Iowa State University Research Foundation, Inc.
    Inventors: Iver E. Anderson, Joel L. Harringa, Adam J. Boesenberg
  • Patent number: 10286497
    Abstract: Provided is a lead-free solder alloy and soldering capable of maintaining strong joining strength even in a high-temperature state after soldering and having high reliability and versatility. The lead-free solder alloy composition of the present invention has Sn—Cu—Ni as a basic composition, which includes 0.1 to 2.0 mass % of Cu, and 0.01 to 0.5 mass % of Ni, 0.1 to 5 mass % of Bi, and 76.0 to 99.5 mass % of Sn, such that it is possible to implement soldering with high reliability without decreasing joining strength of a soldered joint even in a state of being exposed to high temperature for a long time, as well as joining strength at the time of bonding.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: May 14, 2019
    Assignee: Nihon Superior Co., Ltd.
    Inventors: Tetsuro Nishimura, Takatoshi Nishimura
  • Patent number: 9445508
    Abstract: A solder alloy is a tin-silver-copper solder alloy, and contains tin, silver, copper, bismuth, nickel, and cobalt. Relative to the total amount of the solder alloy, the silver content is 2 mass % or more and 4 mass % or less, the nickel content is 0.01 mass % or more and 0.15 mass % or less, and the cobalt content is 0.001 mass % or more and 0.008 mass % or less.
    Type: Grant
    Filed: June 25, 2013
    Date of Patent: September 13, 2016
    Assignee: HARIMA CHEMICALS, INCORPORATED
    Inventors: Kensuke Nakanishi, Kosuke Inoue, Kazuya Ichikawa, Tetsuyuki Shigesada, Tadashi Takemoto
  • Patent number: 9435376
    Abstract: The invention relates to a multi-layered plain bearing (1) comprising a sliding layer (5) made from a tin-based alloy, which contains between 1 wt. % and 8 wt. % Sb, between 8 wt. % and 20 wt. % Cu and if necessary at least one of the elements Si, Cr, Ti, Zn, Ag and Fe, wherein the proportion of each of these elements is between 0.1 wt. % and 2 wt. %, the total content of all of the alloy elements is a maximum of 30 wt. % and remainder is formed by Sn, wherein at least a proportion of the Cu with Sn is present as a copper-rich deposit in the tin matrix with a maximum particle size of 50 nm and/or in addition contains at least one further element from a second group consisting of Al, Bi and Ni, wherein the proportion of the at least one further element is between 0.1 wt. % and 5 wt. % for each of said elements, and wherein the sliding layer (5), which contains at least one element of the second element group, is deposited by a PVD-method when the particle size of the nanoparticles is greater than 50 nm.
    Type: Grant
    Filed: December 16, 2014
    Date of Patent: September 6, 2016
    Assignee: Miba Gleitlager Austria GmbH
    Inventors: Walter Gaertner, Johann Nagl, Christian Uebleis, Jakob Zidar
  • Patent number: 9260768
    Abstract: Lead-free solder alloys and solder joints thereof with improved drop impact resistance are disclosed. In one particular exemplary embodiment, the lead-free solder alloys preferably contain 0.0-4.0 wt. % of Ag, 0.01-1.5 wt. % of Cu, at least one of the following additives: Mn in an amount of 0.001-1.0 wt. %, Ce in an amount of 0.001-0.8 wt. %, Y in an amount of 0.001-1.0 wt. %, Ti in an amount of 0.001-0.8 wt. %, and Bi in an amount of 0.01-1.0 wt. %, and the remainder of Sn.
    Type: Grant
    Filed: December 6, 2006
    Date of Patent: February 16, 2016
    Assignee: Indium Corporation
    Inventors: Weiping Liu, Ning-Cheng Lee
  • Patent number: 9227258
    Abstract: A lead-free solder alloy having improved surface properties which suppresses minute irregularities and shrinkage cavities has a composition consisting essentially of Ag: 0.1-1.5%, Bi: 2.5-5.0%, Cu: 0.5-1.0%, optionally Ni: 0.015-0.035% and/or at least one of Ge and Ga: 0.0005-0.01%, and a remainder of Sn and unavoidable impurities.
    Type: Grant
    Filed: April 23, 2009
    Date of Patent: January 5, 2016
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Yuji Kawamata, Minoru Ueshima, Min Kang, Kayako Nakagawa, Yasuaki Kokubu
  • Patent number: 9221129
    Abstract: A solder alloy of a tin-silver-copper solder alloy, containing tin, silver, antimony, bismuth, copper, and nickel, and substantially does not contain germanium, relative to the total amount of the solder alloy, the silver content is more than 1.0 mass % and less than 1.2 mass %, the antimony content is 0.01 mass % or more and 10 mass % or less, and the bismuth content is 0.01 mass % or more and 3.0 mass % or less.
    Type: Grant
    Filed: June 25, 2013
    Date of Patent: December 29, 2015
    Assignee: HARIMA CHEMICALS, INCORPORATED
    Inventors: Yoji Imamura, Kazuki Ikeda, JinYu Piao, Tadashi Takemoto
  • Patent number: 9221132
    Abstract: A solder alloy is a tin-silver-copper solder alloy containing tin, silver, copper, nickel, antimony, bismuth, and indium, and substantially does not contain germanium, wherein relative to the total amount of the solder alloy, the silver content is more than 0.05 mass % and less than 0.2 mass %, and the antimony content is 0.01 mass % or more and less than 2.5 mass %.
    Type: Grant
    Filed: November 16, 2012
    Date of Patent: December 29, 2015
    Assignee: HARIMA CHEMICALS, INCORPORATED
    Inventors: Yoji Imamura, Kazuki Ikeda, JinYu Piao, Tadashi Takemoto
  • Patent number: 9205513
    Abstract: A high-temperature solder alloy is a Bi—Sn based solder alloy containing at least 90 mass % of Bi, further containing 1-5 mass % of Sn, at least one element selected from Sb and/or Ag each in an amount of 0.5-5 mass %, and preferably further containing 0.0004-0.01 mass % of P.
    Type: Grant
    Filed: June 17, 2011
    Date of Patent: December 8, 2015
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Minoru Ueshima, Yoshimi Inagawa, Minoru Toyoda
  • Patent number: 9199339
    Abstract: Disclosed herein is a high-temperature Pb-free solder alloy having the strength required to join electronic parts to a substrate and having excellence in wettability and workability. The high-temperature Pb-free solder alloy contains 0.4% by mass or more but 13.5% by mass or less of Zn, 0.05% by mass or more but 2.0% by mass or less of Cu, 0.500% by mass or less of P, and a balance being Bi except for inevitable impurities. The Pb-free solder alloy may further contain 0.03% by mass or more but 0.7% by mass or less of Al.
    Type: Grant
    Filed: June 15, 2011
    Date of Patent: December 1, 2015
    Assignee: SUMITOMO METAL MINING CO., LTD.
    Inventors: Hiroaki Nagata, Takashi Iseki, Jiro Taguchi, Masato Takamori
  • Publication number: 20150146394
    Abstract: A solder ball which suppresses generation of voids in a joint, excels in a thermal fatigue property, and can also obtain a good drop impact resistance property, and an electronic member using the same are provided. The solder ball is formed of a Sn—Bi type alloy containing Sn as a main element, 0.3 to 2.0 mass % of Cu, 0.01 to 0.2 mass % of Ni, and 0.1 to 3.0 mass % of Bi, and an intermetallic compound of (Cu, Ni)6Sn5 is formed in the Sn—Bi alloy so that the generation of voids in the joint when being jointed to an electrode is suppressed, a thermal fatigue property is excellent, and a good drop impact resistance property can also be obtained.
    Type: Application
    Filed: May 12, 2014
    Publication date: May 28, 2015
    Applicant: NIPPON STEEL & SUMKIN MATERIALS CO., LTD.
    Inventors: Shinichi Terashima, Takayuki Kobayashi, Masamoto Tanaka, Katsuichi Kimura, Tadayuki Sagawa
  • Publication number: 20150144388
    Abstract: Solder material used in soldering of an Au electrode including Ni plating containing P includes Ag satisfying 0.3?[Ag]?4.0, Bi satisfying 0?[Bi]?1.0, and Cu satisfying 0?[Cu]?1.2, where contents (mass %) of Ag, Bi, Cu and In in the solder material are denoted by [Ag], [Bi], [Cu], and [In], respectively. The solder material includes In in a range of 6.0?[In]?6.8 when [Cu] falls within a range of 0<[Cu]<0.5, In in a range of 5.2+(6?(1.55×[Cu]+4.428))?[In]?6.8 when [Cu] falls within a range of 0.5?[Cu]?1.0, In in a range of 5.2?[In]?6.8 when [Cu] falls within a range of 1.0<[Cu]?1.2. A balance includes only not less than 87 mass % of Sn.
    Type: Application
    Filed: November 23, 2014
    Publication date: May 28, 2015
    Inventors: AKIO FURUSAWA, KIYOHIRO HINE, MASATO MORI, TAICHI NAKAMURA
  • Publication number: 20150136461
    Abstract: A solder alloy of a tin-silver-copper solder alloy, containing tin, silver, antimony, bismuth, copper, and nickel, and substantially does not contain germanium, relative to the total amount of the solder alloy, the silver content is more than 1.0 mass % and less than 1.2 mass %, the antimony content is 0.01 mass % or more and 10 mass % or less, and the bismuth content is 0.01 mass % or more and 3.0 mass % or less.
    Type: Application
    Filed: June 25, 2013
    Publication date: May 21, 2015
    Inventors: Yoji Imamura, Kazuki Ikeda, JinYu Piao, Tadashi Takemoto
  • Patent number: 8999519
    Abstract: A solder joint manufactured of an alloy essentially composed of 0.01-7.6 wt % Cu, 0.001-6 wt % Ni, and the remaining of Sn. Each of Cu and Ni has a maximum concentration range. The lower limit of the range of Ni is 0.01 wt % and preferably 0.03 wt %. The upper limit of the range of Ni is 0.3 wt % and preferably 0.1 wt %. The lower limit of the range of Cu is 0.1 wt % and preferably 0.2 wt %. The upper limit of the range of Cu is 7 wt % and preferably 0.92 wt %. The invention includes the solder joint essentially having these compositions.
    Type: Grant
    Filed: October 20, 2008
    Date of Patent: April 7, 2015
    Assignee: Nihon Superior Sha Co., Ltd.
    Inventor: Tetsuro Nishimura
  • Publication number: 20150037087
    Abstract: A lead-free solder alloy consisting essentially of, in mass percent, Bi: 31-59%, Sb: 0.15-0.75%, at least one element selected from Cu: 0.3-1.0% and P: 0.002-0.055%, and a balance of Sn has a low melting point for suppressing warping of a thin substrate during soldering. It can form solder joints with high reliability even when used for soldering to electrodes having a Ni coating which contains P, since the growth of a P-rich layer is suppressed so that the shear strength of the joints is improved and the alloy has a high ductility and a high tensile strength.
    Type: Application
    Filed: August 5, 2013
    Publication date: February 5, 2015
    Applicant: Senju Metal Industry Co., Ltd.
    Inventors: Ken Tachibana, Hikaru Nomura, Kyu-oh Lee
  • Patent number: 8932519
    Abstract: A Sn—Ag—Cu based solder alloy capable of increasing the connection reliability of a solder joint when evaluated in a high temperature environment is provided. The alloy has an alloy composition consisting essentially of, in mass percent, Ag: 1.0-5.0%, Cu: 0.1-1.0%, Sb: 0.005-0.025%, Fe: 0.005-0.015%, and a remainder of Sn. The Fe content in mass percent is 0.006-0.014%. The Sb content in mass percent is 0.007-0.023%. Preferably Fe:Sb as a mass ratio is 20:80-60:40. The total content of Fe and Sb is preferably 0.012-0.032%.
    Type: Grant
    Filed: April 9, 2012
    Date of Patent: January 13, 2015
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Seiko Ishibashi, Shunsaku Yoshikawa, Tsukasa Ohnishi
  • Publication number: 20140328719
    Abstract: A lead-free solder composition includes: 3 wt % to 5 wt % of Ag, 0.2 wt % to 0.8 wt % of Cu, 1 wt % to 7 wt % of Bi, 0.005 wt % to 0.06 wt % of Ni, 0.005 wt % to 0.02 wt % of Ge, and the balance being Sn based on 100 wt % of the lead-free solder composition.
    Type: Application
    Filed: October 21, 2013
    Publication date: November 6, 2014
    Applicant: ACCURUS SCIENTIFIC CO., LTD.
    Inventor: Tien-Ting Chen
  • Patent number: 8865062
    Abstract: A Sn—Sb—Ag—Cu based high-temperature lead-free solder alloy which has excellent connection reliability and which does not form a low melting point phase even when solidified by slow cooling is provided. It has an alloy composition consisting essentially of, in mass percent, Sb: 35-40%, Ag: 13-18%, Cu: 6-8%, and a remainder of Sn.
    Type: Grant
    Filed: August 8, 2012
    Date of Patent: October 21, 2014
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Minoru Ueshima, Rei Fujimaki
  • Patent number: 8845826
    Abstract: A Sn—Ag—Cu—Bi lead-free solder which can be used for soldering of vehicle-mounted electronic circuits and which has excellent resistance to heat cycles and mechanical strength is provided. The solder contains Ag: 2.8-4 mass %, Bi: 1.5-6 mass %, Cu: 0.8-1.2 mass %, and a remainder of Sn.
    Type: Grant
    Filed: July 14, 2008
    Date of Patent: September 30, 2014
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Yuji Kawamata, Minoru Ueshima, Tomu Tamura, Kazuhiro Matsushita, Masashi Sakamoto
  • Publication number: 20140284794
    Abstract: A tin (Sn)-based solder ball having appropriate characteristics for electronic products and a semiconductor package including the same are provided. The tin-based solder ball includes about 0.3 to 3.0 wt. % silver (Ag), about 0.4 to 0.8 wt. % copper (Cu), about 0.01 to 0.09 wt. % nickel (Ni), about 0.1% to 0.5 wt. % bismuth (Bi), and balance of tin (Sn) and unavoidable impurities.
    Type: Application
    Filed: November 7, 2012
    Publication date: September 25, 2014
    Applicant: MK ELECTRON CO., LTD.
    Inventors: Jae Hong Lee, II Ho Kim, Sung Jae Hong, Jeong Tak Moon
  • Publication number: 20140219711
    Abstract: High Impact Toughness Alloy The invention provides an alloy, preferably a lead-free solder alloy, comprising: from 35 to 59% wt Bi; from 0 to 0.0 wt % Ag; from 0 to 1.0% wt Au; from 0 to 1.0% wt Cr; from 0 to 2.0% wt In; from 0 to 1.0% wt P; from 0 to 1.0% wt Sb; from 0 to 1.0% wt Sc; from 0 to 1.0% wt Y; from 0 to 1.0% wt Zn; from 0 to 1.0% wt rare earth elements; one or more of: 10 from greater than 0 to 1.0% wt Al; from 0.01 to 1.0% wt Ce; from greater than 0 to 1.0% wt Co; from greater than 0 to 0.0% wt Cu; from 0.001 to 1.0% wt Ge; from greater than 0 to 0.0% wt Mg; from greater than 0 to 1.0% wt Mn; from 0.01 to 1.0% wt Ni; and from greater than 0 to 1.0% wt Ti, and the 1 balance Sn, together with any unavoidable impurities.
    Type: Application
    Filed: August 2, 2012
    Publication date: August 7, 2014
    Applicant: ALPHA METALS, INC.
    Inventors: Ranjit Pandher, Bawa Singh, Siuli Sarkar, Sujatha Chegudi, Anil K.N. Kumar, Kamanio Chattopadhyay, Dominic Lodge, Morgana de Avila Ribas
  • Publication number: 20140141273
    Abstract: By using a solder alloy consisting essentially of 0.2-1.2 mass % of Ag, 0.6-0.9 mass % of Cu, 1.2-3.0 mass % of Bi, 0.02-1.0 mass % of Sb, 0.01-2.0 mass % of In, and a remainder of Sn, it is possible to obtain portable devices having excellent resistance to drop impact and excellent heat cycle properties without developing thermal fatigue even when used in a high-temperature environment such as inside a vehicle heated by the sun or in a low-temperature environment such as outdoors in snowy weather.
    Type: Application
    Filed: March 23, 2012
    Publication date: May 22, 2014
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Masato Shimamura, Tsukasa Ohnishi, Mitsuhiro Kosai, Kazuyori Takagi, Tomoko Nonaka, Masayuki Suzuki, Toru Hayashida, Seiko Ishibashi, Shunsaku Yoshikawa, Yoshie Yamanaka
  • Publication number: 20140134042
    Abstract: A silver-free and lead-free solder composition includes: 2 wt % to 8 wt % of Bi, 0.1 wt % to 1.0 wt % of Cu, 0.01 wt % to 0.2 wt % of at least one of Ni, Fe, and Co, and the balance of Sn based on 100 wt % of the silver-free and lead-free solder composition.
    Type: Application
    Filed: August 26, 2013
    Publication date: May 15, 2014
    Applicant: ACCURUS SCIENTIFIC CO., LTD.
    Inventor: Tien-Ting Chen
  • Patent number: 8691143
    Abstract: A lead-free solder alloy is provided which has improved impact resistance to dropping even after thermal aging and which is excellent with respect to solderability, occurrence of voids, and yellowing. A solder alloy according to the present invention consists essentially of, in mass percent, (1) Ag: 0.8-2.0%, (2) Cu: 0.05-0.3%, (3) at least one element selected from In: at least 0.01% and less than 0.1%, Ni; 0.01-0.04%, Co: 0.01-0.05%, and Pt: 0.01-0.1%, optionally (4) at least one element selected from Sb, Bi, Fe, Al, Zn, and P in a total amount of up to 0.1%, and a remainder of Sn and impurities.
    Type: Grant
    Filed: May 31, 2006
    Date of Patent: April 8, 2014
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Tsukasa Ohnishi, Tokuro Yamaki, Daisuke Soma
  • Publication number: 20140061287
    Abstract: A lead-free solder ball for electrodes of a BGA or CSP comprising 0.5-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. Even when a printed circuit board to which the solder ball is bonded has Cu electrodes or Au-plated or Au/Pd-plated Ni electrodes, the solder ball has good resistance to drop impacts. The composition may further contain at least one element selected from Fe, Co, and Pt in a total amount of 0.003-0.1 mass % or at least one element selected from Bi, In, Sb, P, and Ge in a total amount of 0.003-0.1 mass %.
    Type: Application
    Filed: March 28, 2012
    Publication date: March 6, 2014
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Tsukasa Ohnishi, Yoshie Yamanaka, Ken Tachibana
  • Patent number: 8641964
    Abstract: An alloy suitable for use in a ball grid array or chip scale package comprising from 0.05-1.5 wt. % copper, from 0.1-2 wt. % silver, from 0.005-0.3 wt % nickel, from 0.003-0.3 wt % chromium, from 0-0.1 wt. % phosphorus, from 0-0.1 wt. % germanium, from 0-0.1 wt. % gallium, from 0-0.3 wt. % of one or more rare earth elements, from 0-0.3 wt. % indium, from 0-0.3 wt. % magnesium, from 0-0.3 wt. % calcium, from 0-0.3 wt. % silicon, from 0-0.3 wt. % aluminum, from 0-0.3 wt. % zinc, from 0-2 wt. % bismuth, from 0-1 wt. % antimony, from 0-0.2 wt % manganese, from 0-0.3 wt % cobalt, from 0-0.3 wt % iron, and from 0-0.1 wt % zirconium, and the balance tin, together with unavoidable impurities.
    Type: Grant
    Filed: February 25, 2008
    Date of Patent: February 4, 2014
    Assignee: Fry's Metals, Inc.
    Inventors: Brian G. Lewis, Bawa Singh, John Laughlin, Ranjit Pandher
  • Publication number: 20130343809
    Abstract: A Sn—Ag—Cu based solder alloy capable of increasing the connection reliability of a solder joint when evaluated in a high temperature environment is provided. The alloy has an alloy composition consisting essentially of, in mass percent, Ag: 1.0-5.0%, Cu: 0.1-1.0%, Sb: 0.005-0.025%, Fe: 0.005-0.015%, and a remainder of Sn. The Fe content in mass percent is 0.006-0.014%. The Sb content in mass percent is 0.007-0.023%. Preferably Fe:Sb as a mass ratio is 20:80-60:40. The total content of Fe and Sb is preferably 0.012-0.032%.
    Type: Application
    Filed: April 9, 2012
    Publication date: December 26, 2013
    Applicant: Senju Metal Industry Co., Ltd.
    Inventors: Seiko Ishibashi, Shunsaku Yoshikawa, Tsukasa Ohnishi
  • Patent number: 8598464
    Abstract: A solder material includes 1.0-4.0% by weight of Ag, 4.0-6.0% by weight of In, 0.1-1.0% by weight of Bi, 1% by weight or less (excluding 0% by weight) of a sum of one or more elements selected from the group consisting of Cu, Ni, Co, Fe and Sb, and a remainder of Sn. When a copper-containing electrode part of an electronic component is connected to a copper-containing electrode land of a substrate by using this solder material, a part having an excellent stress relaxation property can be formed in the solder-connecting part and a Cu—Sn intermetallic compound can be rapidly grown from the electrode land and the electrode part to form a strong blocking structure.
    Type: Grant
    Filed: April 19, 2010
    Date of Patent: December 3, 2013
    Assignee: Panasonic Corporation
    Inventors: Shigeaki Sakatani, Akio Furusawa, Kenichiro Suetsugu, Taichi Nakamura
  • Patent number: 8562906
    Abstract: A lead-free solder alloy exhibiting good performance in impact resistance and vibration resistance. Also provided are a solder ball using such a lead-free solder alloy, and an electronic member having a solder bump using such a lead-free alloy. Specifically, the lead-free solder alloy consists of 1.0 to 2.0% by mass of Ag, 0.3 to 1.0% by mass of Cu, 0.005 to 0.1% by mass of Ni and the balance including Sn and unavoidable impurities. In an Sn—Ag—Cu based solder joint portion on a Cu electrode, a Cu3Sn intermetallic compound layer is formed directly on the Cu electrode, and then a Cu6Sn5 intermetallic compound layer is formed thereon. A Cu atomic site in the Cu6Sn5 intermetallic compound layer is replaced by Ni having a smaller atomic radius than Cu to thereby reduce strain in the Cu6Sn5 intermetallic compound layer, thus enabling impact resistance and vibration resistance to be improved therein.
    Type: Grant
    Filed: March 8, 2007
    Date of Patent: October 22, 2013
    Assignees: Nippon Steel & Sumikin Materials Co., Ltd., Nippon Micrometal Corporation
    Inventors: Masamoto Tanaka, Tsutomu Sasaki, Takayuki Kobayashi, Kazuto Kawakami, Masayoshi Fujishima
  • Publication number: 20130259738
    Abstract: A solder composition is provided. The solder composition consists essentially of from about 6.0 to 7.5 percent by weight of bismuth, from about 0.5 to 0.7 percent by weight of copper, and the remainder of the composition being tin.
    Type: Application
    Filed: March 30, 2012
    Publication date: October 3, 2013
    Inventors: Polina SNUGOVSKY, Simin Bagheri, Marianne Romansky, Leonid Snugovsky, Doug Perovic
  • Patent number: 8501088
    Abstract: To provide a solder alloy, a solder ball and an electronic member having a solder bump, used for connection with a mother board or the like, having a melting temperature of less than 250° C. for the solder alloy, achieving high drop impact resistance required in mobile devices or the like. A solder alloy is used which consists of not less than 0.1 mass ppm of boron and not greater than 200 mass ppm of boron and a remainder comprising substantially not less than 40% by mass of Sn, in which its melting temperature is less than 250° C.
    Type: Grant
    Filed: December 30, 2008
    Date of Patent: August 6, 2013
    Assignees: Nippon Steel & Sumikin Materials Co., Ltd., Nippon Micrometal Corporation
    Inventors: Takayuki Kobayashi, Tsutomu Sasaki, Masamoto Tanaka, Katsuichi Kimura
  • Publication number: 20130084209
    Abstract: A tin based white metal alloy consisting essentially by weight of approximately 5.0%-0-9.0% antimony, approximately 3.0%-8.0% copper, approximately 0.1%-0.7% cobalt, and the balance tin.
    Type: Application
    Filed: August 21, 2012
    Publication date: April 4, 2013
    Applicant: Siemens Industry, Inc.
    Inventor: Karl F. Seelig
  • Patent number: 8411455
    Abstract: A mounting structure 1 in which an electronic component 5 is surface-mounted with solder 4 to a wiring substrate 2 is disclosed. The solder is Sn—Ag—Bi—In-based solder containing 0.1% by weight or more and 5% by weight or less of Bi, and more than 3% by weight and less than 9% by weight of In, with the balance being made up of Sn, Ag and unavoidable impurities. The wiring substrate has a coefficient of linear expansion of 13 ppm/K or less in all directions. Thus, it is possible to realize a mounting structure using lead-free solder and for which the occurrence of cracks in a solder joint portion due to a 1000-cycle thermal shock test from ?40 to 150° C. has been suppressed.
    Type: Grant
    Filed: February 22, 2010
    Date of Patent: April 2, 2013
    Assignee: Panasonic Corporation
    Inventors: Kenji Kondo, Masahito Hidaka, Koji Kuyama, Yutaka Kamogi
  • Publication number: 20120321506
    Abstract: An ingot includes at least two metals selected from copper, tin, zinc and bismuth, wherein: (a) the ingot is a mechanical ingot, the at least two metals are 40-95 wt. % copper, 3-80 wt. % tin, 1-40 wt. % bismuth and/or 1-80 wt. % zinc, and other metals are present in a collective amount of 0-2 wt. %; or (b) the ingot is a cast ingot, the at least two metals are 40-80 wt. % copper, 3-80 wt. % tin, 1-40 wt. % bismuth and/or 1-80 wt. % zinc, and other metals are present in a collective amount of 0-2 wt. %, provided that when copper is present in the cast ingot in an amount greater than 69 wt. %, zinc is present in an amount less than 30 wt. %. Methods for preparing and casting the ingot are also disclosed, as is a system for casting a copper-bismuth alloy.
    Type: Application
    Filed: June 14, 2011
    Publication date: December 20, 2012
    Applicant: INGOT METAL COMPANY LIMITED
    Inventor: David SHORE
  • Patent number: 8221560
    Abstract: Disclosed herein are a lead-free solder alloy and a manufacturing method thereof. More specifically, disclosed are: a lead-free solder alloy, which comprises 0.8-1.2 wt % silver (Ag), 0.8-1.2 wt % copper (Cu), 0.01-1.0 wt % palladium (Pd), 0.001-0.1 wt % tellurium (Te), and a balance of tin (Sn), and thus has a melting point similar to those of prior lead-free solder alloys, excellent wettability, very low segregation ratio, and excellent weldability with a welding base metal, such that it improves temperature cycle performance and drop impact resistance simultaneously, when it is applied to electronic devices and printed circuit boards; a manufacturing method of the above alloy; and electronic devices and printed circuit boards which include the same.
    Type: Grant
    Filed: September 4, 2008
    Date of Patent: July 17, 2012
    Assignee: Duksan Hi-Metal Co., Ltd.
    Inventors: Kang Hee Kim, Yong Cheol Chu, Myoung Ho Chun, Sang Ho Jeon, Hyun Kyu Lee
  • Patent number: 8220692
    Abstract: An inexpensive lead-free solder which prevents the occurrence of tin pest at extremely low temperatures and which has good wettability and impact resistance has a composition consisting essentially of, in mass %, Cu: 0.5-0.8%, Bi: at least 0.1% and less than 1%, Ni: 0.02-0.04%, and a remainder of Sn.
    Type: Grant
    Filed: April 21, 2009
    Date of Patent: July 17, 2012
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Tsukasa Ohnishi, Toshihiko Taguchi
  • Publication number: 20120175020
    Abstract: A low silver solder alloy of the present invention comprises 0.05-2.0% by mass of silver; 1.0% by mass or less of copper; 3.0% by mass or less of antimony; 2.0% by mass or less of bismuth; 4.0% by mass or less of indium; 0.2% by mass or less of nickel; 0.1% by mass or less of germanium; 0.5% by mass or less of cobalt (provided that none of the copper, the antimony, the bismuth, the indium, the nickel, the germanium, and the cobalt is 0% by mass); and the residue is tin. According to the present invention, the long-term reliable low silver solder alloy is provided, wherein the low silver solder alloy permits the cost reduction by decreasing the Ag content, and has the excellent stretch, melting point, and strength, and also has the high fatigue resistance (thermal fatigue resistance).
    Type: Application
    Filed: May 12, 2011
    Publication date: July 12, 2012
    Applicant: Harima Chemicals, Inc.
    Inventors: Yoji Imamura, Kazuki Ikeda, Jin Yu Piao, Tadashi Takemoto
  • Patent number: 8216395
    Abstract: A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one of Ag and Sb in a total amount of at most 4 wt %, and/or at least one of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.
    Type: Grant
    Filed: March 22, 2010
    Date of Patent: July 10, 2012
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Osamu Munekata, Yoshitaka Toyoda, Tsukasa Ohnishi, Minoru Ueshima
  • Publication number: 20110204121
    Abstract: A lead-free solder alloy having improved surface properties which suppresses minute irregularities and shrinkage cavities has a composition consisting essentially of Ag: 0.1-1.5%, Bi: 2.5-5.0%, Cu: 0.5-1.0%, optionally Ni: 0.015-0.035% and/or at least one of Ge and Ga: 0.0005-0.01%, and a remainder of Sn and unavoidable impurities.
    Type: Application
    Filed: April 23, 2009
    Publication date: August 25, 2011
    Inventors: Yuji Kawamata, Minoru Ueshima, Min Kang, Kayako Nakagawa, Yasuaki Kokubu
  • Publication number: 20110198755
    Abstract: A solder alloy includes 5 to 15% by mass of Sb, 3 to 8% by mass of Cu, 0.01 to 0.15% by mass of Ni, and 0.5 to 5% by mass of In. The remainder thereof includes Sn and unavoidable impurities. Thereby, highly reliable solder alloy and semiconductor device suppressing a fracture in a semiconductor element and improving crack resistance of a solder material can be obtained.
    Type: Application
    Filed: April 13, 2009
    Publication date: August 18, 2011
    Applicant: Mitsubishi Electric Corporation
    Inventors: Akira Maeda, Kenji Otsu, Akira Yamada
  • Publication number: 20110089224
    Abstract: An inexpensive lead-free solder which prevents the occurrence of tin pest at extremely low temperatures and which has good wettability and impact resistance has a composition consisting essentially of, in mass %, Cu: 0.5-0.8%, Bi: at least 0.1% and less than 1%, Ni: 0.02-0.04%, and a remainder of Sn.
    Type: Application
    Filed: April 21, 2009
    Publication date: April 21, 2011
    Inventors: Tsukasa Ohnishi, Toshihiko Taguchi
  • Patent number: 7879455
    Abstract: The present invention intends to provide a power semiconductor device using a high-temperature lead-free solder material, the high-temperature lead-free solder material having the heat resistant property at 280° C. or more, and the bondability at 400° C. or less, and excellent in the suppliabilty and wettability of solder, and in the high-temperature storage reliability and the temperature cycle reliability. In the power semiconductor device according to the present invention, a semiconductor element and a metal electrode member were bonded each other by a high-temperature solder material comprising Sn, Sb, Ag, and Cu as the main constitutive elements and the rest of other unavoidable impurity elements wherein the high-temperature solder material comprises 42 wt %?Sb/(Sn+Sb)?48 wt %, 5 wt %?Ag<20 wt %, 3 wt %?Cu<10 wt %, and Ag+Cu?25 wt %.
    Type: Grant
    Filed: December 5, 2006
    Date of Patent: February 1, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Ryoichi Kajiwara, Kazutoshi Itou
  • Publication number: 20100307823
    Abstract: A lead-free solder alloy which can be used for soldering of vehicle-mounted electronic circuits and which exhibits high reliability is provided. The alloy consists essentially of Ag: 2.8-4 mass %, In: 3-5.5 mass %, Cu: 0.5-1.1 mass %, if necessary Bi: 0.5-3 mass %, and a remainder of Sn. In is at least partially in solid solution in the Sn matrix.
    Type: Application
    Filed: July 17, 2008
    Publication date: December 9, 2010
    Inventors: Yuji Kawamata, Minoru Ueshima, Tomu Tamura, Kazuhiro Matsushita, Masashi Sakamoto
  • Publication number: 20100294565
    Abstract: A Sn—Ag—Cu—Bi lead-free solder which can be used for soldering of vehicle-mounted electronic circuits and which has excellent resistance to heat cycles and mechanical strength is provided. The solder consists essentially of Ag: 2.8-4 mass %, Bi: 1.5-6 mass %, Cu: 0.8-1.2 mass %, and a remainder of Sn.
    Type: Application
    Filed: July 14, 2008
    Publication date: November 25, 2010
    Inventors: Yuji Kawamata, Minoru Ueshima, Tomu Tamura, Kazuhiro Matsushita, Masashi Sakamoto
  • Publication number: 20100297470
    Abstract: A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one of Ag and Sb in a total amount of at most 4 wt %, and/or at least one of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.
    Type: Application
    Filed: March 22, 2010
    Publication date: November 25, 2010
    Inventors: Osamu Munekata, Yoshitaka Toyoda, Tsukasa Ohnishi, Minoru Ueshima
  • Publication number: 20100233018
    Abstract: Provided is an SnCu lead-free solder alloy which eliminates a drawback that an intermetallic compound excessively precipitates and the precipitate serves as nuclei to form dross to thereby cause soldering defects including a needle-like protrusion to occur, thus to satisfy all of the properties required for practical use. A lead-free solder alloy contains 0.1 to 1.5% by weight of Cu, not less than 0.01 and less than 0.05% by weight of Co, 0.05 to 0.5% by weight of Ag and 0.01 to 0.1% by weight of Sb, the remainder being Sn, or further contains 0.001 to 0.008% by weight of Ge, whereby the formation of dross is prevented, and thus the drawback that soldering defects including a needle-like protrusion occur is eliminated.
    Type: Application
    Filed: July 20, 2007
    Publication date: September 16, 2010
    Applicants: TOPY KOGYO KABUSHIKI KAISHA,, KABUSHIKI KAISHA NIPPON FILLER METALS,
    Inventors: Seiji Yamada, Kenichiro Sugimori
  • Patent number: 7749340
    Abstract: A technique for technique for increasing the compliance of lead-free solders containing silver is disclosed. In one particular exemplary embodiment, the technique may be realized as a Sn—Ag—Al alloy composition comprising (0.01-20)% Ag, (0.01-2)% Al, balanced with Sn. In another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Cu—Al alloy composition comprising (0.01-20)% Ag, (0.01-1)% Cu, (0.01-2)% Al, balanced with Sn. In still another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Al—Ni composition comprising (0.01-20)% Ag, (0.01-2)% Al, (0.01-4)% Ni, balanced with Sn. In yet another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Cu—Al—Ni alloy composition comprising (0.01-20)% Ag, (0.01-1)% Cu, (0.01-2)% Al, (0.01-4)% Ni, balanced with Sn.
    Type: Grant
    Filed: October 18, 2006
    Date of Patent: July 6, 2010
    Assignee: Indium Corporation of America
    Inventors: Benlih Huang, Hong-Sik Hwang, Ning-Cheng Lee
  • Patent number: 7749336
    Abstract: A technique for increasing the compliance of tin-indium solders is disclosed. In one particular exemplary embodiment, the technique may be realized as a lead free solder alloy comprising from about 58.0% to about 99.998% by weight tin, from about 0.001% to about 40.0% by weight indium, and from about 0.001% to about 2.0% by weight at least one rare earth element.
    Type: Grant
    Filed: February 24, 2006
    Date of Patent: July 6, 2010
    Assignee: Indium Corporation of America
    Inventors: Benlih Huang, Hong-Sik Hwang, Ning-Cheng Lee
  • Patent number: 7682468
    Abstract: A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one element of Ag and Sb in a total amount of at most 4 wt %, and/or at least one element of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one element of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.
    Type: Grant
    Filed: August 10, 2007
    Date of Patent: March 23, 2010
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Osamu Munekata, Yoshitaka Toyoda, Tsukasa Ohnishi, Minoru Ueshima
  • Publication number: 20100059576
    Abstract: A lead-free and solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition comprises, by weight, about 0.2% to about 1% copper; about 0.001% to about 0.039% nickel; about 0.001% to about 0.039% cobalt; and the balance of tin. The alloy composition has a melting temperature of about 227° C., with superior wetting and mechanical strength making the alloy composition wells suited for electronic circuit board manufacture and lead less component bumping or column arrays, and replacement of conventional tin-lead solders.
    Type: Application
    Filed: September 5, 2008
    Publication date: March 11, 2010
    Applicant: American Iron & Metal Company, Inc.
    Inventor: Karl F. Seelig