Copper Containing Patents (Class 420/560)
  • Patent number: 10376994
    Abstract: The invention relates to a soldering material comprising an alloy that in addition to Sn (tin) as the major constituent, comprises 10 wt. % or less Ag (silver), 10 wt. % or less Bi (bismuth), 10 wt. % or less Sb (antimony) and 3 wt. % or less Cu (copper). Furthermore, the invention relates to a soldering material comprising a plurality of soldering components with such alloy compositions and contents in the soldering material that on fusing the soldering components an alloy is formed that comprises Sn, Ag, Bi, Sb and Cu in the abovementioned alloy contents.
    Type: Grant
    Filed: April 21, 2004
    Date of Patent: August 13, 2019
    Inventors: Hans-Jürgen Albrecht, Klaus Heinrich Georg Bartl, Werner Kruppa, Klaus Müller, Mathias Nowottnick, Gunnar Petzold, Hector Andrew Hamilton Steen, Klaus Wilke, Klaus Wittke
  • Patent number: 10307868
    Abstract: In order to improve the strength and elongation of a solder and improve the reliability of a joining portion joined by the solder, the present invention provides a solder alloy that comprises 2.0 to 4.0 mass % of Ag, 0.5 to 1.0 mass % of Cu, 0.1 to 0.5 mass % of an additive element selected from the group consisting of Ca and Mn, and a balance of Sn.
    Type: Grant
    Filed: April 25, 2016
    Date of Patent: June 4, 2019
    Assignee: NEC CORPORATION
    Inventor: Yuuki Momokawa
  • Patent number: 10213879
    Abstract: A solder alloy has an alloy composition consisting of, in mass %: Bi: 0.1 to 0.8%; Ag: 0 to 0.3%; Cu: 0 to 0.7%; P: 0.001 to 0.1%, with the balance being Sn. A total amount of Ag and Bi is from 0.3 to 0.8% in the alloy composition.
    Type: Grant
    Filed: November 28, 2016
    Date of Patent: February 26, 2019
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Shunsaku Yoshikawa, Hikaru Nomura
  • Patent number: 10180035
    Abstract: The disclosure describes soldering a first component (200) to a second component (226) for use in a downhole circuit, device and/or tool. The first component (200) includes an electrically conductive contact region (402) finished with a metallic finish layer (404). The soldering includes disposing a layer of manganese (408) adjacent to the metallic finish layer (404), and applying solder (406) to the layer of manganese (408). The solder (406) used in the soldering of the two components is a mixture of copper, silver and tin.
    Type: Grant
    Filed: March 12, 2015
    Date of Patent: January 15, 2019
    Assignees: SCHLUMBERGER TECHNOLOGY CORPORATION, UNIVERSITY OF MARYLAND, COLLEGE PARK
    Inventors: Chandradip Pravinbhai Patel, Mark Alex Kostinovsky, Francis Dupouy, Glen Dell Schilling, Gilles Iafrate, F. Patrick McCluskey
  • Patent number: 10105794
    Abstract: A method of forming a solder composition comprises mixing indium, nickel, copper, silver, antimony, zinc, and tin together to form an alloy that consists of about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper. about 0.03% to about 4% by weight nickel, about 0.03% to about 1.5% by weight zinc, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The solder composition formed by this method can be used to solder an electrical connector to an electrical contact surface on a glass component.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: October 23, 2018
    Assignee: ANTAYA TECHNOLOGIES CORPORATION
    Inventors: Jennie S. Hwang, John Pereira, Alexandra Mary Mackin, Joseph C. Gonsalves
  • Patent number: 9999945
    Abstract: A solder alloy may include a Sn—Cu hypereutectic area having Cu in the amount of up to 7.6 weight percent, from 0.006 to 0.5 weight percent of Al, Al2O3, or a combination thereof.
    Type: Grant
    Filed: April 6, 2012
    Date of Patent: June 19, 2018
    Assignees: NIHON SUPERIOR CO., LTD., THE UNIVERSITY OF QUEENSLAND
    Inventors: Tetsuro Nishimura, Kazuhiro Nogita, Stuart David McDonald, Jonathan James Read, Tina Ventura
  • Patent number: 9975207
    Abstract: A solder composition includes about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper, about 0.03% to about 4% by weight nickel, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The composition can further include about 0.2% to about 6% by weight zinc, and, independently, about 0.01% to about 0.3% by weight germanium. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component.
    Type: Grant
    Filed: May 28, 2014
    Date of Patent: May 22, 2018
    Assignee: Antaya Technologies Corporation
    Inventors: Jennie S. Hwang, John Pereira, Alexandra Mary Mackin, Joseph C. Gonsalves
  • Patent number: 9780055
    Abstract: A lead-free solder ball is provided which suppresses interfacial peeling in a bonding interface of a solder ball, fusion defects which develop between the solder ball and solder paste, and which can be used both with Ni electrodes plated with Au or the like and Cu electrodes having a water-soluble preflux applied atop Cu. The lead-free solder ball for electrodes of BGAs or CSPs consists of 1.6-2.9 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. It has excellent resistance to thermal fatigue and to drop impacts regardless of the type of electrodes of a printed circuit board to which it is bonded, which are Cu electrodes or Ni electrodes having Au plating or Au/Pd plating as surface treatment. The composition may include at least one element selected from Fe, Co, and Pt in a total amount of 0.003-0.1 mass % or at least one element selected from Bi, In, Sb, P, and Ge in a total amount of 0.003-0.1 mass %.
    Type: Grant
    Filed: June 30, 2012
    Date of Patent: October 3, 2017
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Yoshie Yamanaka, Ken Tachibana, Shunsaku Yoshikawa, Hikaru Nomura
  • Patent number: 9527167
    Abstract: A lead-free solder ball for electrodes of a BGA or CSP comprising 0.5-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. Even when a printed circuit board to which the solder ball is bonded has Cu electrodes or Au-plated or Au/Pd-plated Ni electrodes, the solder ball has good resistance to drop impacts. The composition may further contain at least one element selected from Fe, Co, and Pt in a total amount of 0.003-0.1 mass % or at least one element selected from Bi, In, Sb, P, and Ge in a total amount of 0.003-0.1 mass %.
    Type: Grant
    Filed: March 28, 2012
    Date of Patent: December 27, 2016
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Tsukasa Ohnishi, Yoshie Yamanaka, Ken Tachibana
  • Patent number: 9339893
    Abstract: The present invention provides a lead-free solder alloy having high reliability and excellent solder bonding properties and suited for the mounting of micronized electronic components at low cost. The lead-free solder alloy according to the present invention has a composition containing 0.5 to 1.5 wt % of Ag, 0.3 to 1.5 wt % of Cu, 0.01 to 0.2 wt % of Ni, 1.0 wt % or less of Ga, and the balance being Sn and unavoidable impurities.
    Type: Grant
    Filed: April 16, 2012
    Date of Patent: May 17, 2016
    Assignee: Nihon Superior Co., Ltd.
    Inventor: Tetsuro Nishimura
  • Patent number: 9221131
    Abstract: An alloy suitable for use in a wave solder process, reflow soldering process, hot air levelling process or a ball grid array, the alloy comprising from 0.08-3 wt. % bismuth, from 0.15-1.5 wt. % copper, from 0.1-1.5 wt. % silver, from 0-0.1 wt. % phosphorus, from 0-0.1 wt. % germanium, from 0-0.1 wt. % gallium, from 0-0.3 wt. % one or more rare earth elements, from 0-0.3 wt. % indium, from 0-0.3 wt. % magnesium, from 0-0.3 wt. % calcium, from 0-0.3 wt. % silicon, from 0-0.3 wt. % aluminum, from 0-0.3 wt. % zinc, and at least one of the following elements from 0.02-0.3 wt % nickel, from 0.008-0.2 wt % manganese, from 0.01-0.3 wt % cobalt, from 0.01-0.3 wt % chromium, from 0.02-0.3 wt % iron, and from 0.008-0.1 wt % zirconium, and the balance tin, together with unavoidable impurities.
    Type: Grant
    Filed: December 1, 2005
    Date of Patent: December 29, 2015
    Assignee: Alpha Metals, Inc.
    Inventors: Anthony E. Ingham, Gerard Campbell, Brian G. Lewis, Bawa Singh, John P. Laughlin, Ranjit Pandher
  • Patent number: 9079272
    Abstract: A solder joint with a multilayer IMC structure is provided. The solder joint includes a Cu pad, a Sn-based solder, a first, a second, and a third IMC layer. The Cu pad is disposed opposite to the Sn-based solder. The first IMC layer is disposed between the Cu pad and the Sn-based solder. The first IMC layer is a Cu3Sn layer. The second IMC layer is disposed between the first IMC layer and the Sn-based solder. The second IMC layer is a (Cu1-x1-y1Nix1Pdy1)6Sn5 layer, wherein x1 is in the range between 0 and 0.15, and y1 is in the range between 0 and 0.02. The third IMC layer is disposed between the second IMC layer and the Sn-based solder. The third IMC layer is a (Cu1-x2-y2Nix2Pdy2)6Sn5 layer, wherein x2 is in the range between 0 and 0.4, y2 is in the range between 0 and 0.02, and x2>x1.
    Type: Grant
    Filed: February 27, 2013
    Date of Patent: July 14, 2015
    Assignee: Yuan Ze University
    Inventors: Cheng-En Ho, Shih-Ju Wang, Yu-Hui Wu
  • Publication number: 20150144388
    Abstract: Solder material used in soldering of an Au electrode including Ni plating containing P includes Ag satisfying 0.3?[Ag]?4.0, Bi satisfying 0?[Bi]?1.0, and Cu satisfying 0?[Cu]?1.2, where contents (mass %) of Ag, Bi, Cu and In in the solder material are denoted by [Ag], [Bi], [Cu], and [In], respectively. The solder material includes In in a range of 6.0?[In]?6.8 when [Cu] falls within a range of 0<[Cu]<0.5, In in a range of 5.2+(6?(1.55×[Cu]+4.428))?[In]?6.8 when [Cu] falls within a range of 0.5?[Cu]?1.0, In in a range of 5.2?[In]?6.8 when [Cu] falls within a range of 1.0<[Cu]?1.2. A balance includes only not less than 87 mass % of Sn.
    Type: Application
    Filed: November 23, 2014
    Publication date: May 28, 2015
    Inventors: AKIO FURUSAWA, KIYOHIRO HINE, MASATO MORI, TAICHI NAKAMURA
  • Patent number: 8999519
    Abstract: A solder joint manufactured of an alloy essentially composed of 0.01-7.6 wt % Cu, 0.001-6 wt % Ni, and the remaining of Sn. Each of Cu and Ni has a maximum concentration range. The lower limit of the range of Ni is 0.01 wt % and preferably 0.03 wt %. The upper limit of the range of Ni is 0.3 wt % and preferably 0.1 wt %. The lower limit of the range of Cu is 0.1 wt % and preferably 0.2 wt %. The upper limit of the range of Cu is 7 wt % and preferably 0.92 wt %. The invention includes the solder joint essentially having these compositions.
    Type: Grant
    Filed: October 20, 2008
    Date of Patent: April 7, 2015
    Assignee: Nihon Superior Sha Co., Ltd.
    Inventor: Tetsuro Nishimura
  • Patent number: 8968488
    Abstract: A cream solder obtained by kneading an Sn—Ag—Cu alloy together with a flux, wherein the Sn—Ag—Cu alloy includes a mixture of a first powdery alloy and a second powdery alloy, the first powdery alloy is represented by an Sn—Ag phase diagram having a solid-liquid coexistence region and has a given silver amount which is larger than that in the eutectic composition (3.5 wt. % silver), and the second powdery alloy has a silver amount which is that in the eutectic composition (3.5 wt. % silver) or which is close to that in the eutectic composition and is smaller than that in the first powdery alloy. This cream solder has excellent strength and thermal stability, and satisfactory bonding properties. It is based on an inexpensive Sn—Ag—Cu solder alloy. It is suitable for use as a high-temperature-side lead-free solder material conformable to temperature gradation bonding. Also provided is a method of soldering.
    Type: Grant
    Filed: July 3, 2007
    Date of Patent: March 3, 2015
    Assignees: Fuji Electric Co., Ltd., Nihon Handa Co., Ltd.
    Inventors: Mitsuo Yamashita, Tomoaki Goto, Takeshi Asagi
  • Publication number: 20150037088
    Abstract: A lead-free solder alloy capable of forming solder joints in which electromigration and an increase in resistance during electric conduction at a high current density are suppressed has an alloy composition consisting essentially of 1.0-13.0 mass % of In, 0.1-4.0 mass % of Ag, 0.3-1.0 mass % of Cu, a remainder of Sn. The solder alloy has excellent tensile properties even at a high temperature exceeding 100° C. and can be used not only for CPUs but also for power semiconductors.
    Type: Application
    Filed: August 5, 2013
    Publication date: February 5, 2015
    Applicant: Senju Metal Industry Co., Ltd.
    Inventors: Tsukasa Ohnishi, Shunsaku Yoshikawa, Ken Tachibana, Yoshie Yamanaka, Hikaru Nomura, Kyu-oh Lee
  • Publication number: 20150029670
    Abstract: Provided is a solder alloy having excellent wettability on both of a Cu surface and an Ni surface. The solder alloy has such an alloy composition that 0.6 to 0.9 mass % of Cu and 0.01 to 0.1 mass % of Al are contained, 0.02 to 0.1 mass % of Ti and/or 0.01 to 0.05 mass % of Co may be contained as required and the remainder is made up by Sn.
    Type: Application
    Filed: December 25, 2012
    Publication date: January 29, 2015
    Inventors: Tsukasa Ohnishi, Shunsaku Yoshikawa, Seiko Ishibashi, Rei Fujimaki
  • Publication number: 20150004490
    Abstract: Novel intermetallic materials are provided that are composed of tin and one or more additional metal(s) having a formula M(1-x)-Sn5, where ?0.1?x?0.5, with 0.01?x?0.4 being more preferred and the second metallic element (M) is selected from iron (Fe), copper (Cu), cobalt(Co), nickel (Ni), and a combination of two or more of those metals. Due to low concentration of the second metallic element, the intermetallic compound affords an enhanced capacity applicable for electrochemical cells and may serve as an intermediate phase between Sn and MSn2. A method of synthesizing these intermetallic materials is also disclosed.
    Type: Application
    Filed: June 14, 2012
    Publication date: January 1, 2015
    Applicant: BROOKHAVEN SCIENCE ASSOCIATES, LLC
    Inventors: Xiao-Liang Wang, Weiqiang Han
  • Patent number: 8887980
    Abstract: When electrodes of a BGA plated by electroless Ni plating are soldered with solder balls of a lead-free solder, peeling of soldered joints readily takes place under an external impact. When a BGA electrode plated by electroless Ni plating is soldered with a lead-free solder to which 0.03-0.1 mass percent of P is added, the growth of brittle SnNi intermetallic compounds formed on the portion being soldered and a P layer on the electroless Ni plating surface is suppressed, resulting in an increased bonding strength.
    Type: Grant
    Filed: June 10, 2005
    Date of Patent: November 18, 2014
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Ryoichi Kurata, Daisuke Soma, Hiroshi Okada
  • Publication number: 20140308158
    Abstract: The present invention addresses the problem of providing a novel, sold metal alloy. Provided is a metal alloy containing two or more types of metal, wherein an equilibrium diagram of the metal alloy shows the two or more types of metal in a finely mixed state at the nanolevel in a specific region where the two types of metal are unevenly distributed. This metal alloy has a substitutional solid solution of the two or more types of metal as the principal constituent thereof. This metal alloy is preferably one obtained by precipitation after mixing ions of two or more types of metal and a reducing agent in a thin-film fluid formed between processing surfaces, at least one of which rotates relative to the other, which are arranged so as to face one another and are capable of approaching and separating from one another.
    Type: Application
    Filed: November 16, 2012
    Publication date: October 16, 2014
    Inventors: Masaki Maekawa, Daisuke Honda, Masakazu Enomura, Kazuya Araki
  • Publication number: 20140290931
    Abstract: A downhole tool conveyable within a wellbore extending into a subterranean formation, wherein the downhole tool comprises a first component, a second component, and a solder electrically and mechanically coupling the first and second components, wherein the solder comprises or consists of: from 0.001 to 1.0 weight % of copper; from 2.5 to 4.0 weight % of silver; from 0.01 to 0.25 weight % of manganese; and tin.
    Type: Application
    Filed: March 31, 2014
    Publication date: October 2, 2014
    Applicants: University of Maryland, College Park, SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: Chandradip Patel, Francis Dupouy, F. Patrick McCluskey, Mark Kostinovsky, Glen Schilling
  • Patent number: 8834747
    Abstract: Compositions containing tin nanoparticles and electrically conductive particles are described herein. The tin nanoparticles can have a size below about 25 nm so as to make the compositions fusable at temperatures below that of bulk tin (m.p.=232° C.). Particularly, when the tin nanoparticles are less than about 10 nm in size, the compositions can have a fusion temperature of less than about 200° C. The compositions can contain a whisker suppressant to inhibit or substantially minimize the formation of tin whiskers after tin nanoparticle fusion. In some embodiments, the compositions contain tin nanoparticles, electrically conductive particles comprising copper particles, and a whisker suppressant comprising nickel particles. Methods for using the present compositions are also described herein. The present compositions can be used as a lead solder replacement that allows rework to be performed.
    Type: Grant
    Filed: March 3, 2011
    Date of Patent: September 16, 2014
    Assignee: Lockheed Martin Corporation
    Inventor: Alfred A. Zinn
  • Publication number: 20140138155
    Abstract: A glazing is disclosed comprising at least one ply of glass having an electrically conductive component on at least one surface, and an electrical connector electrically connected to the electrically conductive component through a soldered joint, the solder of the joint having a composition comprising 0.5 wt % or more indium, wherein the electrical connector comprises a nickel plated contact for contacting the solder. Also disclosed are solders having a composition comprising 14 to 75 wt % In, 14 to 75 wt % Sn, to 5 wt % Ag, to 5 wt % Ni, and less than 0.1 wt % Pb. Also disclosed is use of a solder having a composition comprising 0.5 wt % or more indium to solder a nickel plated electrical connector to an electrically conductive component on the surface of a ply of glass. The aspects of the invention improve the durability of electrical connections on glazing.
    Type: Application
    Filed: May 2, 2012
    Publication date: May 22, 2014
    Applicants: PILKINGTON GROUP LIMITED, NIPPON SHEET GLASS CO., LTD., UCHIHASHI ESTEC CO., LTD., NISHINIHON SHOKO CO., LTD
    Inventors: Michael Lyon, Naotaka Ikawa, Kazuo Inada, Mamoru Yoshida, Takashi Muromachi, Kazuhisa Ono, Kozo Okamoto, Takashi Suzuki
  • Patent number: 8691143
    Abstract: A lead-free solder alloy is provided which has improved impact resistance to dropping even after thermal aging and which is excellent with respect to solderability, occurrence of voids, and yellowing. A solder alloy according to the present invention consists essentially of, in mass percent, (1) Ag: 0.8-2.0%, (2) Cu: 0.05-0.3%, (3) at least one element selected from In: at least 0.01% and less than 0.1%, Ni; 0.01-0.04%, Co: 0.01-0.05%, and Pt: 0.01-0.1%, optionally (4) at least one element selected from Sb, Bi, Fe, Al, Zn, and P in a total amount of up to 0.1%, and a remainder of Sn and impurities.
    Type: Grant
    Filed: May 31, 2006
    Date of Patent: April 8, 2014
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Tsukasa Ohnishi, Tokuro Yamaki, Daisuke Soma
  • Patent number: 8673490
    Abstract: Combinations of materials are described in which high energy density active materials for negative electrodes of lithium ion batteries. In general, metal alloy/intermetallic compositions can provide the high energy density. These materials can have moderate volume changes upon cycling in a lithium ion battery. The volume changes can be accommodated with less degradation upon cycling through the combination with highly porous electrically conductive materials, such as highly porous carbon and/or foamed current collectors. Whether or not combined with a highly porous electrically conductive material, metal alloy/intermetallic compositions with an average particle size of no more than a micron can be advantageously used in the negative electrodes to improve cycling properties.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: March 18, 2014
    Assignee: Envia Systems, Inc.
    Inventors: Sujeet Kumar, James P. Buckley
  • Publication number: 20140061287
    Abstract: A lead-free solder ball for electrodes of a BGA or CSP comprising 0.5-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. Even when a printed circuit board to which the solder ball is bonded has Cu electrodes or Au-plated or Au/Pd-plated Ni electrodes, the solder ball has good resistance to drop impacts. The composition may further contain at least one element selected from Fe, Co, and Pt in a total amount of 0.003-0.1 mass % or at least one element selected from Bi, In, Sb, P, and Ge in a total amount of 0.003-0.1 mass %.
    Type: Application
    Filed: March 28, 2012
    Publication date: March 6, 2014
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Tsukasa Ohnishi, Yoshie Yamanaka, Ken Tachibana
  • Publication number: 20140044589
    Abstract: The present invention provides a lead-free solder composition for glass. The lead-free solder composition for glass includes indium, zinc, and tin. The indium (In) ranges from about 30.0 wt % to about 60 wt %. The zinc (Zn) ranges from about 0.01 wt % to about 11.0 wt %. The tin (Sn) is included as a remaining component.
    Type: Application
    Filed: December 12, 2012
    Publication date: February 13, 2014
    Applicants: HYUNDAI MOTOR COMPANY, HEESUNG MATERIAL LTD., KOREA AUTOGLASS CORPORATION, KIA MOTORS CORPORATION
    Inventors: Hae Won Jeong, Hyun Dal Park, Tae Seung Lee, Seung Kyu Kim, Hong Nho Joo, Ho June Yoon, Min Ho Bak, Joo Dong Lee, Hyun Chae Jung, Sun Myung Lee
  • Publication number: 20140037369
    Abstract: The present invention provides a lead-free solder alloy having high reliability and excellent solder bonding properties and suited for the mounting of micronized electronic components at low cost. The lead-free solder alloy according to the present invention has a composition containing 0.5 to 1.5 wt % of Ag, 0.3 to 1.5 wt % of Cu, 0.01 to 0.2 wt % of Ni, 1.0 wt % or less of Ga, and the balance being Sn and unavoidable impurities.
    Type: Application
    Filed: April 16, 2012
    Publication date: February 6, 2014
    Applicant: NIHON SUPERIOR CO., LTD.
    Inventor: Tetsuro Nishimura
  • Patent number: 8641964
    Abstract: An alloy suitable for use in a ball grid array or chip scale package comprising from 0.05-1.5 wt. % copper, from 0.1-2 wt. % silver, from 0.005-0.3 wt % nickel, from 0.003-0.3 wt % chromium, from 0-0.1 wt. % phosphorus, from 0-0.1 wt. % germanium, from 0-0.1 wt. % gallium, from 0-0.3 wt. % of one or more rare earth elements, from 0-0.3 wt. % indium, from 0-0.3 wt. % magnesium, from 0-0.3 wt. % calcium, from 0-0.3 wt. % silicon, from 0-0.3 wt. % aluminum, from 0-0.3 wt. % zinc, from 0-2 wt. % bismuth, from 0-1 wt. % antimony, from 0-0.2 wt % manganese, from 0-0.3 wt % cobalt, from 0-0.3 wt % iron, and from 0-0.1 wt % zirconium, and the balance tin, together with unavoidable impurities.
    Type: Grant
    Filed: February 25, 2008
    Date of Patent: February 4, 2014
    Assignee: Fry's Metals, Inc.
    Inventors: Brian G. Lewis, Bawa Singh, John Laughlin, Ranjit Pandher
  • Publication number: 20140030140
    Abstract: A solder alloy may include a Sn—Cu hypereutectic area having Cu in the amount of up to 7.6 weight percent, from 0.006 to 0.5 weight percent of Al, Al2O3, or a combination thereof.
    Type: Application
    Filed: April 6, 2012
    Publication date: January 30, 2014
    Applicants: THE UNIVERSITY OF QUEENSLAND, NIHON SUPERIOR CO., LTD.
    Inventors: Tetsuro Nishimura, Kazuhiro Nogita, Stuart David McDonald, Jonathan James Read, Tina Ventura
  • Publication number: 20140009059
    Abstract: Energy-saving lamps contain a gas filling of mercury vapour and argon in a gas discharge bulb. Amalgam spheres are used for filling the gas discharge bulb with mercury. A tin amalgam having a high proportion by weight of mercury in the range from 30 to 70% by weight is proposed. Owing to the high mercury content, the amalgam spheres have liquid amalgam phases on the surface. Coating of the spheres with a tin or tin alloy powder converts the liquid amalgam phases on the surface into a solid amalgam having a high tin content. This prevents conglutination of the amalgam spheres during storage and processing.
    Type: Application
    Filed: June 27, 2013
    Publication date: January 9, 2014
    Applicant: UMICORE AG & CO. KG
    Inventors: Georg Ptaschek, Calogero Di Vincenzo
  • Publication number: 20130336837
    Abstract: A lead-free solder alloy for a vehicle glass according to the present invention contains 26.0 to 56.0 mass % of In, 0.1 to 5.0 mass % of Ag, 0.002 to 0.05 mass % of Ti, 0.001 to 0.01 mass % of Si and the balance being Sn. The lead-free solder alloy may optionally contain 0.005 to 0.1 mass % of Cu and 0.001 to 0.01 mass % of B. This solder alloy can suitably be applied vehicle glasses and show good joint strength to glass materials and high acid resistance, salt water resistance and temperature cycle resistance.
    Type: Application
    Filed: February 27, 2012
    Publication date: December 19, 2013
    Applicant: Central Glass Company, Limited
    Inventors: Mizuki Nishi, Takayuki Ogawa, Mitsuo Hori
  • Patent number: 8562906
    Abstract: A lead-free solder alloy exhibiting good performance in impact resistance and vibration resistance. Also provided are a solder ball using such a lead-free solder alloy, and an electronic member having a solder bump using such a lead-free alloy. Specifically, the lead-free solder alloy consists of 1.0 to 2.0% by mass of Ag, 0.3 to 1.0% by mass of Cu, 0.005 to 0.1% by mass of Ni and the balance including Sn and unavoidable impurities. In an Sn—Ag—Cu based solder joint portion on a Cu electrode, a Cu3Sn intermetallic compound layer is formed directly on the Cu electrode, and then a Cu6Sn5 intermetallic compound layer is formed thereon. A Cu atomic site in the Cu6Sn5 intermetallic compound layer is replaced by Ni having a smaller atomic radius than Cu to thereby reduce strain in the Cu6Sn5 intermetallic compound layer, thus enabling impact resistance and vibration resistance to be improved therein.
    Type: Grant
    Filed: March 8, 2007
    Date of Patent: October 22, 2013
    Assignees: Nippon Steel & Sumikin Materials Co., Ltd., Nippon Micrometal Corporation
    Inventors: Masamoto Tanaka, Tsutomu Sasaki, Takayuki Kobayashi, Kazuto Kawakami, Masayoshi Fujishima
  • Patent number: 8530058
    Abstract: A lead free solder consisting of a ternary eutectic composition of Sn-3.9Ag-0.7Cu with Ce in the amount of 0.5 to 2% by weight exhibits improved oxidation resistance increased ductility in comparison with other RE metals and is characterized by a homogeneous mixture of large grain CeSn3 intermetallics in a Sn beta phase. In solder applications, the joints with the solder are resistance to interfacial fracture by distributing the strain within the solder interface increasing impact resistance.
    Type: Grant
    Filed: March 6, 2009
    Date of Patent: September 10, 2013
    Assignee: Arizona Board of Regents, for and on behalf of Arizona State University
    Inventors: Nikhilesh Chawla, Martha Dudek
  • Patent number: 8496873
    Abstract: The invention relates to Sn—Cu—Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calcinating temperature.
    Type: Grant
    Filed: June 13, 2012
    Date of Patent: July 30, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kwi-Jong Lee, Hyuck-Mo Lee, Hyun-Joon Song, Yun-Hwan Jo, Ji-Chan Park, Jung-Up Bang, Dong-Hoon Kim
  • Publication number: 20130175688
    Abstract: A tin(Sn)-based solder ball and a semiconductor package including the same are provided. The tin-based solder ball includes about 0.2 to 4 wt. % silver(Ag), about 0.1 to 1 wt. % copper(Cu), about 0.001 to 0.3 wt. % aluminum(Al), about 0.001% to 0.1 wt. % germanium(Ge), and balance of tin and unavoidable impurities. The tin-based solder ball has a high oxidation resistance.
    Type: Application
    Filed: December 13, 2012
    Publication date: July 11, 2013
    Applicant: MK ELECTRON CO., LTD.
    Inventor: MK ELECTRON CO., LTD.
  • Patent number: 8411455
    Abstract: A mounting structure 1 in which an electronic component 5 is surface-mounted with solder 4 to a wiring substrate 2 is disclosed. The solder is Sn—Ag—Bi—In-based solder containing 0.1% by weight or more and 5% by weight or less of Bi, and more than 3% by weight and less than 9% by weight of In, with the balance being made up of Sn, Ag and unavoidable impurities. The wiring substrate has a coefficient of linear expansion of 13 ppm/K or less in all directions. Thus, it is possible to realize a mounting structure using lead-free solder and for which the occurrence of cracks in a solder joint portion due to a 1000-cycle thermal shock test from ?40 to 150° C. has been suppressed.
    Type: Grant
    Filed: February 22, 2010
    Date of Patent: April 2, 2013
    Assignee: Panasonic Corporation
    Inventors: Kenji Kondo, Masahito Hidaka, Koji Kuyama, Yutaka Kamogi
  • Publication number: 20120328361
    Abstract: A Sn—Ag—Cu-based lead-free solder alloy and solder joints thereof with superior drop shock reliability are disclosed. The solder comprises between greater than 0 wt. % and less than or equal to about 1.5 wt. % Ag; between greater than or equal to about 0.7 wt. % and less than or equal to about 2.0 wt. % Cu; between greater than or equal to about 0.001 and less than or equal to about 0.2 wt. % Mn; and a remainder of Sn.
    Type: Application
    Filed: July 5, 2012
    Publication date: December 27, 2012
    Inventors: WEIPING LIU, Ning-Cheng Lee
  • Publication number: 20120321506
    Abstract: An ingot includes at least two metals selected from copper, tin, zinc and bismuth, wherein: (a) the ingot is a mechanical ingot, the at least two metals are 40-95 wt. % copper, 3-80 wt. % tin, 1-40 wt. % bismuth and/or 1-80 wt. % zinc, and other metals are present in a collective amount of 0-2 wt. %; or (b) the ingot is a cast ingot, the at least two metals are 40-80 wt. % copper, 3-80 wt. % tin, 1-40 wt. % bismuth and/or 1-80 wt. % zinc, and other metals are present in a collective amount of 0-2 wt. %, provided that when copper is present in the cast ingot in an amount greater than 69 wt. %, zinc is present in an amount less than 30 wt. %. Methods for preparing and casting the ingot are also disclosed, as is a system for casting a copper-bismuth alloy.
    Type: Application
    Filed: June 14, 2011
    Publication date: December 20, 2012
    Applicant: INGOT METAL COMPANY LIMITED
    Inventor: David SHORE
  • Publication number: 20120280593
    Abstract: A solder material can be used for fastening an outer electrode on a piezoelectric component. The solder material contains tin as the main constituent and at least one addition from the group of cobalt, tungsten, osmium, titanium, vanadium, iron and rare earth metals. A piezoelectric component includes such a solder material. The solder material is applied by means of a base metallization.
    Type: Application
    Filed: November 22, 2010
    Publication date: November 8, 2012
    Applicant: EPCOS AG
    Inventors: Franz Rinner, Markus Weiglhofer, Marion Ottlinger, Reinhard Gabl, Martin Galler, Christoph Auer, Georg Kuegerl
  • Patent number: 8221560
    Abstract: Disclosed herein are a lead-free solder alloy and a manufacturing method thereof. More specifically, disclosed are: a lead-free solder alloy, which comprises 0.8-1.2 wt % silver (Ag), 0.8-1.2 wt % copper (Cu), 0.01-1.0 wt % palladium (Pd), 0.001-0.1 wt % tellurium (Te), and a balance of tin (Sn), and thus has a melting point similar to those of prior lead-free solder alloys, excellent wettability, very low segregation ratio, and excellent weldability with a welding base metal, such that it improves temperature cycle performance and drop impact resistance simultaneously, when it is applied to electronic devices and printed circuit boards; a manufacturing method of the above alloy; and electronic devices and printed circuit boards which include the same.
    Type: Grant
    Filed: September 4, 2008
    Date of Patent: July 17, 2012
    Assignee: Duksan Hi-Metal Co., Ltd.
    Inventors: Kang Hee Kim, Yong Cheol Chu, Myoung Ho Chun, Sang Ho Jeon, Hyun Kyu Lee
  • Patent number: 8216395
    Abstract: A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one of Ag and Sb in a total amount of at most 4 wt %, and/or at least one of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.
    Type: Grant
    Filed: March 22, 2010
    Date of Patent: July 10, 2012
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Osamu Munekata, Yoshitaka Toyoda, Tsukasa Ohnishi, Minoru Ueshima
  • Publication number: 20120038042
    Abstract: A lead-free solder alloy, a solder ball and an electronic member comprising a solder bump which enable the prevention of the occurrence of yellow discoloration on the surface of a solder after soldering, the surface of a solder bump after the formation of the bump in a BGA, and the surface of a solder bump after a burn-in test of a BGA. Specifically disclosed are: a lead-free solder alloy; a solder ball; and an electronic member comprising a solder bump, containing at least one additive element selected from Li, Na, K, Ca, Be, Mg, Sc, Y, lanthanoid series elements, Ti, Zr, Hf, Nb, Ta, Mo, Zn, Al, Ga, In, Si and Mn in the total amount of 1 ppm by mass to 0.1% by mass inclusive, with the remainder being 40% by mass or more of Sn.
    Type: Application
    Filed: April 12, 2010
    Publication date: February 16, 2012
    Applicants: Nippon Micrometal Corporation, Nippon Steel Materials Co., Ltd.
    Inventors: Tsutomu Sasaki, Shinichi Terashima, Masamoto Tanaka, Katsuichi Kimura
  • Patent number: 8083832
    Abstract: A composite paste for forming interconnects that includes a quantity of metallic binder particles, a quantity of metallic filler particles, and a quantity of flux, where the binder particles comprise no more than 94.5% of the total weight of the quantity of the composite paste, and the total weight of the filler particles and the flux comprise the balance of the total weight of the quantity of the composite paste, where the flux is no more than 10% of the total weight of the flux and the filler particles.
    Type: Grant
    Filed: February 27, 2008
    Date of Patent: December 27, 2011
    Assignee: International Rectifier Corporation
    Inventor: Martin Standing
  • Publication number: 20110303448
    Abstract: A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag3Sn blades.
    Type: Application
    Filed: April 22, 2011
    Publication date: December 15, 2011
    Inventors: Iver E. Anderson, Joel L. Harringa, Adam J. Boesenberg
  • Publication number: 20110274937
    Abstract: [PROBLEMS TO BE SOLVED] To provide a low-silver lead-free solder alloy having an excellent wettability and being excellent in heat-fatigue resistance, and a solder-paste soldering material and resin-flux cored soldering material being excellent in fatigue resistance, and a joined product by using the soldering material. [MEANS FOR SOLVING] 0.1 to 1.5% by weight of Cu, 0.01% by weight or more and less than 0.05% by weight of Co, 0.05 to 0.25% by weight of Ag, 0.001 to 0.008% by weight of Ge, and the remainder being Sn. This low silver lead-free solder alloy is blended with a pasty flux or molded in a liner form by using a solid or pasty flux as a core. [SELECTED FIGURE] FIG.
    Type: Application
    Filed: January 18, 2010
    Publication date: November 10, 2011
    Applicants: KOKI COMPANY LIMITED, KABUSHIKI KAISHA NIPPON FILLER METALS
    Inventors: Kenichiro Sugimori, Seiji Yamada, Satoshi Kawakubo, Atsushi Irisawa
  • Publication number: 20110180311
    Abstract: A solder material with favorable mechanical properties and high corrosion resistance is provided. The solder material is not apt to be melted in a re-heating process after the soldering process is performed. The solder material includes first solder powder, Cu powder, and a flux. The first solder powder contains Cu, Si, Ti, and Sn. Here, Cu accounts for 7 wt %˜9 wt %, Si accounts for 0.001 wt %˜0.05 wt %, Ti accounts for 0.001 wt %˜0.05 wt %, and the rest is Sn. The Cu powder is coated by Ag. The flux is mixed with the first solder powder and the Cu powder.
    Type: Application
    Filed: January 19, 2011
    Publication date: July 28, 2011
    Applicant: NIHON DEMPA KOGYO CO., LTD.
    Inventors: TOSHIMASA TSUDA, MITSUO HORI
  • Publication number: 20110115084
    Abstract: Solder used for flip chip bonding inside a semiconductor package was a Sn—Pb solder such as a Pb-5Sn composition. Lead-free solders which have been studied are hard and easily form intermetallic compounds with Sn, so they were not suitable for a flip chip connection structure inside a semiconductor package, which requires stress relaxation properties. This problem is eliminated by a flip chip connection structure inside a semiconductor package using a lead-free solder which is characterized by consisting essentially of 0.01-0.5 mass percent of Ni and a remainder of Sn. 0.3-0.9 mass percent of Cu and 0.001-0.01 mass percent of P may be added to this solder composition.
    Type: Application
    Filed: March 3, 2009
    Publication date: May 19, 2011
    Inventors: Minoru Ueshima, Masayuki Suzuki, Yoshie Yamanaka, Shunsaku Yoshikawa, Tokuro Yamaki, Tsukasa Ohnishi
  • Publication number: 20110110813
    Abstract: A new kind of Sn—In based Pb-free solders with Zn addition is disclosed, which includes: 15˜25 wt % In; 0.05˜1.5 wt % Zn; and balance Sn. When the solder of the present invention is used in the assembly of electrical products, the dissolution rates of the substrates and the growth of the intermetallic compounds formed at the interfaces can be reduced; and thereby the properties of joints can be improved.
    Type: Application
    Filed: January 13, 2010
    Publication date: May 12, 2011
    Applicant: National Tsing Hua University
    Inventors: Sinn-Wen Chen, Ching-Feng Yang
  • Patent number: 7879455
    Abstract: The present invention intends to provide a power semiconductor device using a high-temperature lead-free solder material, the high-temperature lead-free solder material having the heat resistant property at 280° C. or more, and the bondability at 400° C. or less, and excellent in the suppliabilty and wettability of solder, and in the high-temperature storage reliability and the temperature cycle reliability. In the power semiconductor device according to the present invention, a semiconductor element and a metal electrode member were bonded each other by a high-temperature solder material comprising Sn, Sb, Ag, and Cu as the main constitutive elements and the rest of other unavoidable impurity elements wherein the high-temperature solder material comprises 42 wt %?Sb/(Sn+Sb)?48 wt %, 5 wt %?Ag<20 wt %, 3 wt %?Cu<10 wt %, and Ag+Cu?25 wt %.
    Type: Grant
    Filed: December 5, 2006
    Date of Patent: February 1, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Ryoichi Kajiwara, Kazutoshi Itou