Copper Containing Patents (Class 420/587)
  • Patent number: 11401581
    Abstract: This invention provides low karat, low silver, 6 kt gold-copper-zinc alloys with acceptable workability that can be processed into wire, tube, sheet stock, or cast. The alloys are annealed at 1200° F., rapidly cooled, and heat treated at about 6000 to 800° F., which increases the hardness and durability in finished parts made from these alloys. The alloys include grain refiners. The alloys are resistant to oxidation from sweat and tarnishing. Additional fabrication operations can form jewelry items such as balls, chain, hoops and studs.
    Type: Grant
    Filed: January 7, 2020
    Date of Patent: August 2, 2022
    Assignee: LEACHGARNER, INC.
    Inventors: William Guenley, Mossig H. Makhoulian, Joe Esposito, Luke Autry, Scott Suvall
  • Patent number: 11371119
    Abstract: A precipitation-hardening alloy, including 17 to 23.6 at % of Ag, 0.5 to 1.1 at % of B, and a total of 74.9 to 81.5 at % of Pd and Cu, wherein the at % ratio of the Pd and Cu is 1:1 to 1:1.2, and the rest includes In and inevitable impurities. This provides an alloy with good overall balance, having all of maintaining low specific resistance, at least almost equal to that of conventional Ag—Pd—Cu alloys, and also having contact resistance stability (oxidation resistance), good plastic workability, and higher hardness than before.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: June 28, 2022
    Inventor: Ryu Shishino
  • Patent number: 10889878
    Abstract: An alloy material includes: a composition, in a composition range of a ternary alloy of silver (Ag), palladium (Pd), and copper (Cu), the composition containing 20 to 30 wt % of Ag, 35 to 55 wt % of Pd, and 20 to 40 wt % of Cu. The composition as a base is added with tin (Sn) in a range of 0.5 to 2.5 wt %, further added with any one of or a combination of cobalt (Co), chromium (Cr), and zinc (Zn) in a range of 0.1 to 1.0 wt %, and added with 0.01 to 0.1 wt % of either one of or a combination of iridium (Ir) and ruthenium (Ru).
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: January 12, 2021
    Assignees: NHK Spring Co., Ltd., YAMAKIN CO., LTD.
    Inventors: Toshio Kazama, Yoshihisa Tani, Satoshi Shoji, Teruo Anraku, Masayuki Ainoya, Tomohiro Kubota, Kotaro Toyotake, Hitoshi Abe
  • Patent number: 10619260
    Abstract: A galvanic bath, containing: gold metal in the form of alkaline aurocyanide; organometallic components; a wetting agent; a complexing agent; free cyanide; copper metal in the form of copper II cyanide and potassium; and indium metal in the form of a complex indium metal, where the galvanic bath does not contain cadmium and zinc, and where the galvanic bath deposits a yellow gold alloy comprising gold, copper, and indium as main components.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: April 14, 2020
    Assignees: The Swatch Group Research and Development Ltd., G. Aliprandini
    Inventors: Giuseppe Aliprandini, Michel Caillaud
  • Patent number: 10233555
    Abstract: The invention relates to an electrolytic deposition in the form of a gold alloy with a thickness of between 1 and 800 microns and which includes copper. According to the invention, the deposition includes indium as the third main compound. The invention concerns the field of electroplating methods.
    Type: Grant
    Filed: September 11, 2008
    Date of Patent: March 19, 2019
    Inventors: Giuseppe Aliprandini, Michel Caillaud
  • Patent number: 9289816
    Abstract: A production method uses ultrasonic forming but does not leave a bonding face exposed to the exterior in a final product. The production method of a leading edge member of a fan blade comprises the steps of causing superplastic forming by using a combination of a first mold having a flow path for gas and a second mold having a female mold to pressurize a plate member with the gas through the flow path to fit the plate member onto the female mold; bonding a backing with the plate member processed with the superplastic forming; and cutting out a periphery of the plate member to obtain a product shape.
    Type: Grant
    Filed: January 22, 2010
    Date of Patent: March 22, 2016
    Assignee: IHI Corporation
    Inventor: Takayuki Iwasaki
  • Patent number: 9162324
    Abstract: The invention provides a solder paste which has a solidus temperature of 255° C. or above and is improved in the wettability between Bi and Cu or Ag electrode to attain approximately equivalent wettability to those of Pb-containing high-temperature solders even in low-temperature soldering. The solder paste comprises a metal powder component consisting of Bi or a Bi alloy, a solidus temperature lowering metal for Bi, and a solid-phase metal capable of forming an intermetallic compound with the solidus temperature lowering metal, and a flux component.
    Type: Grant
    Filed: November 10, 2006
    Date of Patent: October 20, 2015
    Inventors: Kosuke Nakano, Hidekiyo Takaoka, Minoru Ueshima
  • Publication number: 20150132179
    Abstract: An advantage of the invention is to provide a master alloy used in a casting of a modified copper alloy, grains of which can be refined during a melt-solidification, and also a method of casting a modified copper alloy using the same. In order to achieve the advantage, master alloy for casting a copper alloy in a form of Cu: 40 to 80%, Zr: 0.5 to 35% and the balance of Zn; and Cu: 40 to 80%, Zr: 0.5 to 35%, P: 0.01 to 3% and the balance of Zn are used, and thus grain-refined copper alloy casting products are obtained.
    Type: Application
    Filed: November 6, 2014
    Publication date: May 14, 2015
    Inventor: Keiichiro OISHI
  • Patent number: 9017490
    Abstract: A high strength, corrosion resistant alloy suitable for use in oil and gas environments includes, in weight %: 0-12% Fe, 18-24% Cr, 3-6.2% Mo, 0.05-3.0% Cu, 4.0-6.5% Nb, 1.1-2.2% Ti, 0.05-0.4% 0.05-0.2% Al, 0.005-0.040% C, balance Ni plus incidental impurities and deoxidizers. A ratio of Nb/(Ti+Al) is equal to 2.5-7.5 to provide a desired volume fraction of ?? and ?? phases. The alloy has a minimum yield strength of 145 ksi.
    Type: Grant
    Filed: November 18, 2008
    Date of Patent: April 28, 2015
    Assignee: Huntington Alloys Corporation
    Inventor: Sarwan Kumar Mannan
  • Patent number: 8987586
    Abstract: A conductive paste including a conductive powder, a metallic glass, and an organic vehicle, wherein the metallic glass has a resistivity that is decreased when the metallic glass is heat treated at a temperature that is higher than a glass transition temperature of the metallic glass.
    Type: Grant
    Filed: August 10, 2011
    Date of Patent: March 24, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-Soo Jee, Eun-Sung Lee, Se-Yun Kim, Sang-Mock Lee, Jun Ho Lee, Do-Hyang Kim, Ka Ram Lim
  • Publication number: 20150072299
    Abstract: An orthodontic appliance includes a portion made of a shape memory alloy having a base alloy composition of at least two different metallic elements and a treated region having an alloy composition that is depleted in at least one of the metallic elements. The base alloy may include a nickel titanium alloy (NiTi), a copper chromium nickel titanium alloy (CuCrNiTi), or a copper aluminum nickel (CuAlNi) alloy. The treated region may be depleted in at least one of copper, aluminum, nickel, and titanium relative to the base alloy composition by exposing the base alloy to a source of energy. The base alloy composition has a first austenitic finish temperature and the treated region has an austenitic finish temperature that may be different than the first austenitic finish temperature. The treated region may form a part of an archwire, a stop, a hook, a crown, a band, or an orthodontic bracket.
    Type: Application
    Filed: September 5, 2014
    Publication date: March 12, 2015
    Inventors: Sammel Shahrier Alauddin, Jason Anthony Mohr, Benjamin Mark Nazeck, Nathan Wong
  • Publication number: 20150041028
    Abstract: The invention includes a copper-nickel-zinc alloy with the following composition in weight %: Cu 47.0 to 49.0%, Ni 8.0 to 10.0%, Mn 0.2 to 0.6%, Si 0.05 to 0.4%, Pb 1.0 to 1.5%, Fe and/or Co up to 0.8%, the rest being Zn and unavoidable impurities, wherein the total of the Fe content and double the Co content is at least 0.1 weight % and wherein mixing silicides containing nickel, iron and manganese and/or containing nickel, cobalt and manganese are stored as spherical or ellipsoidal particles in a structure consisting of an ?- and ?-phase. The invention further relates to a method for producing semi-finished products from a copper-nickel-zinc alloy.
    Type: Application
    Filed: February 8, 2013
    Publication date: February 12, 2015
    Inventors: Hans-Achim Kuhn, Rudolf Liebsch
  • Publication number: 20140377129
    Abstract: In materials using an Ag—Pd—Cu alloy for electric and electronic appliances, an improvement in weakness (fragility) to bending attained by adding Pt has been proposed since a material excellent in bending workability has been in demand. On the other hand, the proposal has entailed a problem of a considerable reduction in hardness though it depends on the added Pt amount. Also, there has been a problem that a material cost is increased by the addition of Pt. By adding 0.1 to 5.0 mass % of Co or 0.1 to 5.0 mass % of Ni to 20 to 50 mass % of Ag, 20 to 50 mass % of Pd, and 10 to 40 mass % of Cu, the hardness when precipitation hardened after plastic working was improved to 280 to 480 HV, and the bending workability was attained.
    Type: Application
    Filed: December 17, 2012
    Publication date: December 25, 2014
    Inventors: Ryu Shishino, Keiju Uruu
  • Publication number: 20140346038
    Abstract: Provided are a crystalline alloy having significantly better thermal stability than an amorphous alloy as well as glass-forming ability, and a method of manufacturing the crystalline alloy. The present invention also provides an alloy sputtering target that is manufactured by using the crystalline alloy, and a method of manufacturing the alloy target. According to an aspect of the present invention, provided is a crystalline alloy having glass-forming ability which is formed of three or more elements having glass-forming ability, wherein the average grain size of the alloy is in a range of 0.1 ?m to 5 ?m and the alloy includes 5 at % to 20 at % of aluminum (Al), 15 at % to 40 at % of any one or more selected from copper (Cu) and nickel (Ni), and the remainder being zirconium (Zr).
    Type: Application
    Filed: December 4, 2012
    Publication date: November 27, 2014
    Inventors: Seung-Yong Shin, Kyoung-Il Moon, Ju-Hyun Sun, Chang-Hun Lee
  • Publication number: 20140341799
    Abstract: There is provided a method for providing selenium dioxide and a copper indium gallium residue from a material comprising a compound of formula (I) CuInxGa(1-x)Se2 (I), wherein x has a value from 0.01 to 0.99, said method comprises the steps of: a) heating the material comprising the compound of formula (I) to at least 500° C., b) contacting the material with a gas flow comprising oxygen, and d) collecting the formed products. The method may be used in recycling in the field of solar cell technology.
    Type: Application
    Filed: December 14, 2012
    Publication date: November 20, 2014
    Inventors: Mark R. StJ. Foreman, Anna M. Gustafsson, Christian Ekberg
  • Publication number: 20140328717
    Abstract: The present invention is directed to a formulation of one or more low silver containing alloys (including those with silver content below 50 weight %, “w %”) that show one of the group of distinct pink, yellow and green colors and further demonstrate enhanced resistance to tarnish and other beneficial features described herein.
    Type: Application
    Filed: May 6, 2014
    Publication date: November 6, 2014
    Inventor: Grigory RAYKHTSAUM
  • Publication number: 20140314617
    Abstract: A dental alloy contains palladium (Pd) and indium (In) for CAD/CAM machining. The dental alloy can further include one component selected from the group consisting of gold (Au), silver (Ag), nickel (Ni), cobalt (Co), and platinum (Pt). The dental alloy has a yield strength of 250 MPa to 450 MPa, breaking elongation of 2% to 8%, metal-ceramic adhesion of 20 MPa to 70 MPa, coefficient of linear thermal expansion of 14.0×10?6/K to 17.0×10?6/K, or density of 8 g/cm3 to 15 g/cm3.
    Type: Application
    Filed: April 13, 2012
    Publication date: October 23, 2014
    Applicant: CERAGEM BIOSYS CO., LTD.
    Inventors: Kyeong Jun Park, Jeong Jong Park, Sun Wook Cho
  • Patent number: 8865062
    Abstract: A Sn—Sb—Ag—Cu based high-temperature lead-free solder alloy which has excellent connection reliability and which does not form a low melting point phase even when solidified by slow cooling is provided. It has an alloy composition consisting essentially of, in mass percent, Sb: 35-40%, Ag: 13-18%, Cu: 6-8%, and a remainder of Sn.
    Type: Grant
    Filed: August 8, 2012
    Date of Patent: October 21, 2014
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Minoru Ueshima, Rei Fujimaki
  • Publication number: 20140286820
    Abstract: The Be content of Be Al alloys suitable for investment casting, which contain a small but suitable amount of Ag, can be significantly reduced without adversely affecting their thermal or investment casting properties by including significantly more Si in the alloy than done in the past.
    Type: Application
    Filed: March 22, 2013
    Publication date: September 25, 2014
    Applicant: MATERION BRUSH INC.
    Inventors: Randolf S. Beals, Keith J. Smith, Lawrence H. Ryczek
  • Publication number: 20140219711
    Abstract: High Impact Toughness Alloy The invention provides an alloy, preferably a lead-free solder alloy, comprising: from 35 to 59% wt Bi; from 0 to 0.0 wt % Ag; from 0 to 1.0% wt Au; from 0 to 1.0% wt Cr; from 0 to 2.0% wt In; from 0 to 1.0% wt P; from 0 to 1.0% wt Sb; from 0 to 1.0% wt Sc; from 0 to 1.0% wt Y; from 0 to 1.0% wt Zn; from 0 to 1.0% wt rare earth elements; one or more of: 10 from greater than 0 to 1.0% wt Al; from 0.01 to 1.0% wt Ce; from greater than 0 to 1.0% wt Co; from greater than 0 to 0.0% wt Cu; from 0.001 to 1.0% wt Ge; from greater than 0 to 0.0% wt Mg; from greater than 0 to 1.0% wt Mn; from 0.01 to 1.0% wt Ni; and from greater than 0 to 1.0% wt Ti, and the 1 balance Sn, together with any unavoidable impurities.
    Type: Application
    Filed: August 2, 2012
    Publication date: August 7, 2014
    Applicant: ALPHA METALS, INC.
    Inventors: Ranjit Pandher, Bawa Singh, Siuli Sarkar, Sujatha Chegudi, Anil K.N. Kumar, Kamanio Chattopadhyay, Dominic Lodge, Morgana de Avila Ribas
  • Publication number: 20140217883
    Abstract: An improved mercury dosing composition is described. A method for dispensing mercury with this composition and to discharge lamps containing each composition is also described.
    Type: Application
    Filed: May 13, 2013
    Publication date: August 7, 2014
    Inventors: Alessio Corazza, Diego Di Giampietro, Alberto Coda, Alessandro Gallitognotta
  • Publication number: 20140212324
    Abstract: Provided by the present invention are a fine crystallite high-function metal alloy member, a method for manufacturing the same, and a business development method thereof, in which a crystallite of a metal alloy including a high-purity metal alloy whose crystal lattice is a face-centered cubic lattice, a body-centered cubic lattice, or a close-packed hexagonal lattice is made fine with the size in the level of nanometers (10?9 m to 10?6 m) and micrometers (10?6 m to 10?3 m), and the form thereof is adjusted, thereby remedying drawbacks thereof and enhancing various characteristics without losing superior characteristics owned by the alloy.
    Type: Application
    Filed: April 10, 2012
    Publication date: July 31, 2014
    Applicant: THREE-O CO., LTD.
    Inventor: Kazuo Ogasa
  • Patent number: 8790574
    Abstract: A thrust bearing for a turbocharger of an internal-combustion engine is made of a copper alloy including a brass matrix and a needle-like Mn—Si-based compound dispersed in the brass matrix. Not less than 50% of the needle-like Mn—Si-based compound dispersed in a region from a surface of a sliding portion of the thrust bearing to a depth of 50 ?m have a major axis extending from the inside of the sliding portion to the surface. The major axis makes an angle of 30° to 150° with the surface of the sliding portion when observed in a sectional view perpendicular to the surface of the sliding portion.
    Type: Grant
    Filed: March 14, 2012
    Date of Patent: July 29, 2014
    Assignee: Daido Metal Company, Ltd.
    Inventors: Kazuaki Toda, Satoru Kurimoto, Ryo Sato
  • Publication number: 20140182948
    Abstract: A copper, manganese, nickel, zinc and tin binder metal composition having a melting point of 1500° F. or less that includes zinc and tin at a sum weight of about 26.5% to about 30.5% in which zinc is at least about 12% and Sn is at least about 6.5%. The binder metal having a melting point of 1500° F. or less can be used at an infiltrating temperature of 1800° F. or less in forming drilling tools and tool components.
    Type: Application
    Filed: March 15, 2013
    Publication date: July 3, 2014
  • Publication number: 20140178703
    Abstract: An electroconductive material that includes a metal component containing a first metal and a second metal having a higher melting point than the first metal, and has a configuration in which the first metal is Sn or an alloy containing Sn, and the second metal is a Cu—Al alloy which forms, with the first metal, an intermetallic compound exhibiting a melting point of 310° C. or higher. The first metal can be Sn alone or an alloy containing Sn and at least one of Cu, Ni, Ag, Au, Sb, Zn, Bi, In, Ge, Al, Co, Mn, Fe, Cr, Mg, Pd, Si, Sr, Te, and P.
    Type: Application
    Filed: March 3, 2014
    Publication date: June 26, 2014
    Inventors: Kosuke Nakano, Hidekiyo Takaoka
  • Publication number: 20140044479
    Abstract: A Sn—Sb—Ag—Cu based high-temperature lead-free solder alloy which has excellent connection reliability and which does not form a low melting point phase even when solidified by slow cooling is provided. It has an alloy composition consisting essentially of, in mass percent, Sb: 35-40%, Ag: 13-18%, Cu: 6-8%, and a remainder of Sn.
    Type: Application
    Filed: August 8, 2012
    Publication date: February 13, 2014
    Inventors: Minoru Ueshima, Rei Fujimaki
  • Publication number: 20140030139
    Abstract: The present invention relates to a Cu—P—Ag—Zn brazing alloy, and more particularly, to a brazing alloy composed of copper (Cu), phosphorus (P), zinc (Zn), and silver (Ag), and including one or two or more elements of indium (In), gallium (Ga), boron (B), tin (Sn), silicon (Si), germanium (Ge), lithium (Li), nickel (Ni), and manganese (Mn). The present invention is composed of 1% by weight to 50% by weight of silver (Ag), 10% by weight to 35% by weight of zinc (Zn), 0.01% by weight to 4% by weight of phosphorus (P), and the remainder of copper (Cu).
    Type: Application
    Filed: July 30, 2013
    Publication date: January 30, 2014
    Applicant: ALCOMA METAL CO., LTD.
    Inventor: Chu Hyon Cho
  • Patent number: 8557015
    Abstract: In a Cr—Cu alloy that is formed by powder metallurgy and contains a Cu matrix and flattened Cr phases, the Cr content in the Cr—Cu alloy is more than 30% to 80% or less by mass, and the average aspect ratio of the flattened Cr phases is more than 1.0 and less than 100. The Cr—Cu alloy has a small thermal expansion coefficient in in-plane directions, a high thermal conductivity, and excellent processibility. A method for producing the Cr—Cu alloy is also provided. A heat-release plate for semiconductors and a heat-release component for semiconductors, each utilizing the Cr—Cu alloy, are also provided.
    Type: Grant
    Filed: February 14, 2007
    Date of Patent: October 15, 2013
    Assignees: JFE Precision Corporation, JFE Steel Corporation
    Inventors: Hoshiaki Terao, Hiroki Ota, Hideaki Kobiki, Aya Uenosono
  • Patent number: 8512630
    Abstract: The present invention relates to pulverulent materials suitable for storing hydrogen, and more particularly to a method of preparing such a material, in which: (A) a composite metallic material having a specific granular structure is prepared by co-melting the following mixtures: a first metallic mixture (m1), which is an alloy (a1) of body-centered cubic crystal structure, based on titanium, vanadium, chromium and/or manganese, or a mixture of these metals in the proportions of the alloy (a1); and a second mixture (m2), which is an alloy (a2), comprising 38 to 42% zirconium, niobium, molybdenum, hafnium, tantalum and/or tungsten and 56 to 60 mol % of nickel and/or copper, or else a mixture of these metals in the proportions of the alloy (a2), with a mass ratio (m2)/(m1+m2) ranging from 0.1 wt % to 20 wt %; and (B) the composite metallic material thus obtained is hydrogenated, whereby the composite material is fragmented (hydrogen decrepitation).
    Type: Grant
    Filed: July 30, 2012
    Date of Patent: August 20, 2013
    Assignee: Centre National de la Recherche Scientifique (C.N.R.S.)
    Inventors: Jean Charbonnier, Patricia De Rango, Daniel Fruchart, Salvatore Miraglia, Sophie Rivoirard, Natalia Skryabina
  • Publication number: 20130209311
    Abstract: Provided are a metal alloy and more particularly, to an aluminum alloy used for electrical, electronic, and mechanical components, and an aluminum alloy casting manufactured using the aluminum alloy. The aluminum alloy according to an embodiment includes 4 to 13 wt % of silicon (Si), 1 to 5 wt % of copper (Cu), 26 wt % or more and less than 40 wt % of zinc (Zn), and a balance being aluminum (Al) and unavoidable impurities.
    Type: Application
    Filed: May 12, 2011
    Publication date: August 15, 2013
    Inventors: Seoung-Jin Lee, Hyung-Chul Lee
  • Publication number: 20130089459
    Abstract: In a copper-based slide member in which needle-shaped Mn—Si based compounds are dispersed in a brass structure, 50% or more of a total number of the needle-shaped Mn—Si based compounds having lengths of 50 ?m or more in a major axis direction are constituted of a plurality of small particles. Thereby, even if the needle-shaped Mn—Si based compounds fall off during sliding, the small particles which constitute the needle-shaped Mn—Si based compounds may fall off. Thus, the frequency of falling off of the coarse needle-shaped Mn—Si based compound which damages a shaft and a bearing is decreased. Therefore, seizure hardly occurs.
    Type: Application
    Filed: October 2, 2012
    Publication date: April 11, 2013
  • Publication number: 20120321506
    Abstract: An ingot includes at least two metals selected from copper, tin, zinc and bismuth, wherein: (a) the ingot is a mechanical ingot, the at least two metals are 40-95 wt. % copper, 3-80 wt. % tin, 1-40 wt. % bismuth and/or 1-80 wt. % zinc, and other metals are present in a collective amount of 0-2 wt. %; or (b) the ingot is a cast ingot, the at least two metals are 40-80 wt. % copper, 3-80 wt. % tin, 1-40 wt. % bismuth and/or 1-80 wt. % zinc, and other metals are present in a collective amount of 0-2 wt. %, provided that when copper is present in the cast ingot in an amount greater than 69 wt. %, zinc is present in an amount less than 30 wt. %. Methods for preparing and casting the ingot are also disclosed, as is a system for casting a copper-bismuth alloy.
    Type: Application
    Filed: June 14, 2011
    Publication date: December 20, 2012
    Inventor: David SHORE
  • Publication number: 20120313230
    Abstract: A solder alloy is providing, the solder alloy including zinc, aluminum, magnesium and gallium, wherein the aluminum constitutes by weight 8% to 20% of the alloy, the magnesium constitutes by weight 0.5% to 20% of the alloy and the gallium constitutes by weight 0.5% to 20% of the alloy, the rest of the alloy including zinc.
    Type: Application
    Filed: June 7, 2011
    Publication date: December 13, 2012
    Inventors: Manfred MENGEL, Alexander HEINRICH, Steffen ORSO, Thomas BEHRENS, Oliver EICHINGER, Lim FONG, Evelyn NAPETSCHNIG, Edmund RIEDL
  • Publication number: 20120298264
    Abstract: An alloy having a formula Zr100-x-u (Cu100-aNia)xAlu wherein X, U and a are in atomic percentages wherein X is less than or equal to 48 and greater than or equal to 37, wherein U is less than or equal to 14 and greater than or equal to 3, and wherein a is less than or equal to ten and greater than or equal to 3. Methods of forming the alloy and bulk metallic glass comprising the alloy are also provided. The alloy and bulk metallic glass are useful in a wide number of applications which includes sports and luxury products, electronic goods, medical instruments, and military equipment.
    Type: Application
    Filed: January 19, 2012
    Publication date: November 29, 2012
    Inventors: Li Yi, Irene Lee, Dong Wang
  • Publication number: 20120301741
    Abstract: Methods of preparing nanowires having small diameters and large lengths are disclosed. Such nanowires are useful in electronics applications.
    Type: Application
    Filed: March 28, 2012
    Publication date: November 29, 2012
    Inventor: Junping Zhang
  • Patent number: 8298405
    Abstract: The invention provides a metal alloy fuel catalyst for decontaminating a hydrocarbon fuel, including diesel and bio-diesel fuel, of a bacterial contamination and for improving fuel combustion. The metal alloy fuel catalysts preferably includes about 70% Sn, about 22% Sb, about 4% Bi, and about 4% Pb, although other formulations are possible. The fuel catalyst can take the form of an in-line component in a fuel system or be coated within a fuel storage container.
    Type: Grant
    Filed: September 19, 2008
    Date of Patent: October 30, 2012
    Assignee: Advanced Power Systems International, Inc.
    Inventors: Alvin J. Berlin, Ralph H. Wright
  • Publication number: 20120251383
    Abstract: A thrust bearing for a turbocharger of an internal-combustion engine is made of a copper alloy including a brass matrix and a needle-like Mn-Si-based compound dispersed in the brass matrix. Not less than 50% of the needle-like Mn-Si-based compound dispersed in a region from a surface of a sliding portion of the thrust bearing to a depth of 50 ?m have a major axis extending from the inside of the sliding portion to the surface. The major axis makes an angle of 30° to 150° with the surface of the sliding portion when observed in a sectional view perpendicular to the surface of the sliding portion.
    Type: Application
    Filed: March 14, 2012
    Publication date: October 4, 2012
    Inventors: Kazuaki Toda, Satoru Kurimoto, Ryo Sato
  • Publication number: 20120244035
    Abstract: A noble alloy suitable for dental purposes that contains cobalt and chromium in addition to ruthenium and optionally gold and/or platinum group elements, and is non-magnetic is provided. In the alloy system cobalt-chromium-ruthenium-gallium it was found that gallium contents above about 10 weight percent may exhibit ferromagnetism upon slow cooling. Ferromagnetism is an undesirable feature for dental prosthesis. Reducing the gallium content below 10%, however, lowers the thermal expansion coefficient of the alloy.
    Type: Application
    Filed: January 12, 2012
    Publication date: September 27, 2012
    Applicant: The Argen Corporation
    Inventors: Paul J. Cascone, Arun Prasad
  • Publication number: 20120230861
    Abstract: A swash plate includes aluminum (Al) as a main component and 35˜45 wt % of zinc (Zn), 1.5˜3.5 wt % of copper (Cu), 6˜10 wt % of silicon (Si), 0.2˜0.5 wt % of magnesium (Mg) and other inevitable impurities. A method of manufacturing the swash plate is also provided.
    Type: Application
    Filed: September 23, 2011
    Publication date: September 13, 2012
    Applicant: Hyundai Motor Company
    Inventor: Hee Sam Kang
  • Publication number: 20120207643
    Abstract: A homogenous brazing material essentially consisting of relatively low amounts of silver and nickel together with copper, zinc, and other constituents is provided. The brazing material has a working temperature exceeding 630° F. and is preferably between about 1250° F. and 1500° F. The brazing material preferably has about 30 percent by weight of silver, about 36 percent by weight of copper, about 32 percent by weight of zinc, and about 2 percent by weight of nickel. The addition of nickel in the above-specified amount improves resistance against interface corrosion in aqueous solutions, aids in the strength of the alloy, and provides improved wettability on ferrous and non-ferrous substrates. The brazing material may also include a flux, such as a core or a coating.
    Type: Application
    Filed: October 21, 2010
    Publication date: August 16, 2012
    Applicant: LUCAS-MILHAUPT, INC.
    Inventors: Alan Belohlav, Marcin Kuta
  • Publication number: 20120195790
    Abstract: A Ni based alloy material consists of by mass percent, C?0.03%, Si: 0.01 to 0.5%, Mn: 0.01 to 1.0%, P?0.03%, S?0.01%, Cr: not less than 20% to less than 30%, Ni: more than 40% to not more than 50%, Cu: more than 2.0% to not more than 5.0%, Mo: 4.0 to 10%, Al: 0.005 to 0.5%, W: 0.1 to 10% , N: more than 0.10% to not more than 0.35%, optionally one or more elements selected from Ca?0.01% and Mg?0.01%, with the balance being Fe and impurities, and the formula of “0.5Cu+Mo?6.5” is satisfied. The material has a surface hardness of a Vickers hardness of not less than 350 at 500° C., a corrosion resistance equivalent to that of Ni based alloys having high Mo contents, and excellent erosion resistance in a severe environment.
    Type: Application
    Filed: March 16, 2012
    Publication date: August 2, 2012
    Applicant: Sumitomo Metal Industries, Ltd.
    Inventors: Masaki UEYAMA, Masaaki Terunuma
  • Publication number: 20120171070
    Abstract: A alloy and a process of forming a alloy are disclosed. The alloy has a predetermined grain boundary morphology. The alloy includes by weight greater than about 0.06 percent carbon, up to about 0.0015 percent sulfur, less than about 16 percent chromium, between about 39 percent and about 44 percent nickel, between about 2.5 percent and about 3.3 percent niobium, between about 1.4 percent and about 2 percent titanium, up to about 0.5 percent aluminum, up to about 0.006 percent boron, up to about 0.3 percent copper, up to about 0.006 percent nitrogen, and greater than about 0.5 percent molybdenum.
    Type: Application
    Filed: January 3, 2011
    Publication date: July 5, 2012
    Inventors: Ganjiang FENG, George A. GOLLER, Raymond Joseph STONITSCH, Jason R. PAROLINI, Shan LIU
  • Publication number: 20120152928
    Abstract: The invention relates to an auxiliary material for soldering steel sheets, wherein the auxiliary material comprises weight percentages of 15 to 40% Zn, 5 to 30% Mn, 0.01 to 10% Ni, and typical impurities no greater than 1%, and the remainder Cu.
    Type: Application
    Filed: July 5, 2010
    Publication date: June 21, 2012
    Inventor: Eberhard Schmid
  • Publication number: 20120148440
    Abstract: A copper brazing filler metal includes Ni in an amount of from 20 or more to 36% or less by mass, Mn in an amount from 19 or more to 30% or less by mass, Fe in an amount of from 0 or more to 16% or less by mass, Si in an amount of from more than 0 (not inclusive) to 2% or less by mass, B in an amount of from 0.1 or more to 0.5% or less by mass, and the balance being copper (Cu) as well as inevitable impurities and/or a modifying element, when the entirety is taken as 100% by mass. Moreover, the copper brazing filler metal exhibits a ratio of the Ni content with respect to the Mn content (i.e., (Ni Content)/(Mn Content)) that falls in a range of from 1.1 or more to 2 or less when being free from Fe.
    Type: Application
    Filed: December 2, 2011
    Publication date: June 14, 2012
    Inventors: Kazuhiko ITOH, Tadashi OSHIMA, Hisaaki TAKAO
  • Publication number: 20120080216
    Abstract: Provided are a brazing material capable of being restrained from protruding unnecessarily in a joint region; a heat dissipation base having a high reliability of electric insulation, and does not easily cause a short circuit even when the base dissipates heat repeatedly; and an electronic device wherein an electronic component is mounted on circuit members of this heat dissipation base. The brazing material comprises silver and copper as main components; at least one element A selected from indium, zinc, and tin; at least one element B selected from titanium, zirconium, hafnium, and niobium; and at least one element C selected from molybdenum, osmium, rhenium, and tungsten.
    Type: Application
    Filed: May 27, 2010
    Publication date: April 5, 2012
    Inventors: Yuuichi Abe, Kiyotaka Nakamura, Kiyoshi Yakubo
  • Patent number: 8147751
    Abstract: To provide a silver-white copper alloy which represents a silver-white color equivalent to that of nickel silver and is excellent in hot workability and the like. The silver-white copper alloy includes 47.5 to 50.5 mass % of Cu, 7.8 to 9.8 mass % of Ni, 4.7 to 6.3 mass % of Mn, and the remainder including Zn, and the silver-white copper alloy has an alloy composition satisfying relationships of f1=[Cu]+1.4×[Ni]+0.3×[Mn]=62.0 to 64.0, f2=[Mn]/[Ni]=0.49 to 0.68, and f3=[Ni]+[Mn]=13.0 to 15.5 among a content [Cu] mass % of Cu, a content [Ni] mass % of Ni, and a content [Mn] mass % of Mn, and has a metal structure in which ? phases at an area ratio of 2 to 17% are dispersed in an ?-phase matrix. The copper alloy is provided as a hot processing material or continuous casting material formed by performing one or more heat treatments and cold processes on a hot processing raw material formed by performing a hot process on an ingot or a casting raw material obtained by continuous casting.
    Type: Grant
    Filed: March 9, 2009
    Date of Patent: April 3, 2012
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventor: Keiichiro Oishi
  • Publication number: 20120038042
    Abstract: A lead-free solder alloy, a solder ball and an electronic member comprising a solder bump which enable the prevention of the occurrence of yellow discoloration on the surface of a solder after soldering, the surface of a solder bump after the formation of the bump in a BGA, and the surface of a solder bump after a burn-in test of a BGA. Specifically disclosed are: a lead-free solder alloy; a solder ball; and an electronic member comprising a solder bump, containing at least one additive element selected from Li, Na, K, Ca, Be, Mg, Sc, Y, lanthanoid series elements, Ti, Zr, Hf, Nb, Ta, Mo, Zn, Al, Ga, In, Si and Mn in the total amount of 1 ppm by mass to 0.1% by mass inclusive, with the remainder being 40% by mass or more of Sn.
    Type: Application
    Filed: April 12, 2010
    Publication date: February 16, 2012
    Applicants: Nippon Micrometal Corporation, Nippon Steel Materials Co., Ltd.
    Inventors: Tsutomu Sasaki, Shinichi Terashima, Masamoto Tanaka, Katsuichi Kimura
  • Publication number: 20120027638
    Abstract: A high-strength copper alloy contains 20 to 45% of zinc, 0.3 to 1.5% of iron, 0.3 to 1.5% of chromium, and a balance of copper, based on mass.
    Type: Application
    Filed: April 16, 2010
    Publication date: February 2, 2012
    Applicant: San-Etsu Metals Co., Ltd.
    Inventors: Yoshiharu Kosaka, Akimichi Kojima, Katsuyoshi Kondoh
  • Publication number: 20110284372
    Abstract: According to one embodiment of the invention, a Cu—Ga alloy material has an average composition consisting of not less than 32% and not more than 53% by mass of gallium (Ga) as well as the balance consisting of copper (Cu) and an inevitable impurity. In the Cu—Ga alloy material, a region containing less than 47% by mass of copper accounts for 2% or less by volume of the whole Cu—Ga alloy material.
    Type: Application
    Filed: May 5, 2011
    Publication date: November 24, 2011
    Applicant: HITACHI CABLE, LTD.
    Inventors: Yuichi HIRAMOTO, Tatsuya TONOGI, Noriyuki TATSUMI
  • Publication number: 20110236254
    Abstract: A palladium-dominated dental alloy, in particular a ceramic-bonding dental alloy for the manufacture of dental prostheses such as crowns, bridges, inlays, or onlays, containing at least gold, palladium, and silver, as well as a grain-growth inhibitor in the form of ruthenium. In order to achieve a fine-grained separation without the formation of agglomerates to obtain a dental alloy with high mechanical stability and excellent polishing characteristics, it is proposed that the dental alloy contain—in addition to ruthenium as grain-growth inhibitor—at least one element of the group tantalum, niobium, yttrium, zirconium, chromium, and molybdenum as grain-refinement control element.
    Type: Application
    Filed: March 24, 2011
    Publication date: September 29, 2011
    Applicant: DEGUDENT GMBH
    Inventors: Joerg HACHENBERG, Rudi STEINKE, Angela KLAUS, Irmgard WISSEL