Abstract: A bonded substrate includes: a silicon nitride ceramic substrate; a copper plate; and a bonding layer bonding the copper plate to the silicon nitride ceramic substrate, wherein the bonding layer has a first interface in contact with the silicon nitride ceramic substrate and a second interface in contact with the copper plate, and contains a nitride and a silicide of an active metal as at least one metal selected from the group consisting of titanium and zirconium, an atomic fraction of nitrogen of the bonding layer is greatest at the first interface and is smallest at the second interface, and a sum of atomic fractions of the active metal and silicon of the bonding layer is smallest at the first interface and is greatest at the second interface.

Abstract: An object of the present invention is to provide a Pd alloy, a Pd alloy material, and a probe pin for electric and electronic devices in which specific resistance, hardness, and processability are balanced at a higher level than before, and methods for manufacturing the same. In order to achieve this object, the Pd alloy for electric and electronic devices according to the present invention having a composition comprising 50.1 mass % or more and 55.5 mass % or less of Pd, 6.3 mass % or more and 16.1 mass % or less of Ag, 30.0 mass % or more and 38.0 mass % or less of Cu, and 0.5 mass % or more and 2.0 mass % or less of In is adopted.

Abstract: This invention discloses a method of manufacturing a desired metal part which comprises (1) providing an powder metal sinterbraze hard steel component and a wrought steel stamping component; (2) affixing the powder metal hard steel component and the wrought steel stamping component together with a brazing filler metal being alloyed at the interface between the powder metal hard steel component and the wrought steel stamping component; (3) sinter brazing the powder metal hard steel component and the wrought steel stamping component together to produce an in-process metal part; and (4) tempering the in-process metal part to produce the desired metal part.

Abstract: This invention provides low karat, low silver, 6 kt gold-copper-zinc alloys with acceptable workability that can be processed into wire, tube, sheet stock, or cast. The alloys are annealed at 1200° F., rapidly cooled, and heat treated at about 600° to 800° F., which increases the hardness and durability in finished parts made from these alloys. The alloys include grain refiners. The alloys are resistant to oxidation from sweat and tarnishing. Additional fabrication operations can form jewelry items such as balls, chain, hoops and studs.

Abstract: A zinc-free gold alloy containing by weight between 37% and 38.5% of gold, between 4 and 32% of palladium and/or silver, between 25% and 54% of copper and between 0% and 10% of gallium. A timepiece or piece of jewellery or gemstone jewellery made of this alloy.

Abstract: This invention provides low karat, low silver, 6 kt gold-copper-zinc alloys with acceptable workability that can be processed into wire, tube, sheet stock, or cast. The alloys are annealed at 1200° F., rapidly cooled, and heat treated at about 6000 to 800° F., which increases the hardness and durability in finished parts made from these alloys. The alloys include grain refiners. The alloys are resistant to oxidation from sweat and tarnishing. Additional fabrication operations can form jewelry items such as balls, chain, hoops and studs.

Abstract: A precipitation-hardening alloy, including 17 to 23.6 at % of Ag, 0.5 to 1.1 at % of B, and a total of 74.9 to 81.5 at % of Pd and Cu, wherein the at % ratio of the Pd and Cu is 1:1 to 1:1.2, and the rest includes In and inevitable impurities. This provides an alloy with good overall balance, having all of maintaining low specific resistance, at least almost equal to that of conventional Ag—Pd—Cu alloys, and also having contact resistance stability (oxidation resistance), good plastic workability, and higher hardness than before.

Abstract: An alloy material includes: a composition, in a composition range of a ternary alloy of silver (Ag), palladium (Pd), and copper (Cu), the composition containing 20 to 30 wt % of Ag, 35 to 55 wt % of Pd, and 20 to 40 wt % of Cu. The composition as a base is added with tin (Sn) in a range of 0.5 to 2.5 wt %, further added with any one of or a combination of cobalt (Co), chromium (Cr), and zinc (Zn) in a range of 0.1 to 1.0 wt %, and added with 0.01 to 0.1 wt % of either one of or a combination of iridium (Ir) and ruthenium (Ru).

Abstract: A galvanic bath, containing: gold metal in the form of alkaline aurocyanide; organometallic components; a wetting agent; a complexing agent; free cyanide; copper metal in the form of copper II cyanide and potassium; and indium metal in the form of a complex indium metal, where the galvanic bath does not contain cadmium and zinc, and where the galvanic bath deposits a yellow gold alloy comprising gold, copper, and indium as main components.

Abstract: The invention relates to an electrolytic deposition in the form of a gold alloy with a thickness of between 1 and 800 microns and which includes copper. According to the invention, the deposition includes indium as the third main compound. The invention concerns the field of electroplating methods.

Abstract: A production method uses ultrasonic forming but does not leave a bonding face exposed to the exterior in a final product. The production method of a leading edge member of a fan blade comprises the steps of causing superplastic forming by using a combination of a first mold having a flow path for gas and a second mold having a female mold to pressurize a plate member with the gas through the flow path to fit the plate member onto the female mold; bonding a backing with the plate member processed with the superplastic forming; and cutting out a periphery of the plate member to obtain a product shape.

Abstract: The invention provides a solder paste which has a solidus temperature of 255° C. or above and is improved in the wettability between Bi and Cu or Ag electrode to attain approximately equivalent wettability to those of Pb-containing high-temperature solders even in low-temperature soldering. The solder paste comprises a metal powder component consisting of Bi or a Bi alloy, a solidus temperature lowering metal for Bi, and a solid-phase metal capable of forming an intermetallic compound with the solidus temperature lowering metal, and a flux component.

Abstract: An advantage of the invention is to provide a master alloy used in a casting of a modified copper alloy, grains of which can be refined during a melt-solidification, and also a method of casting a modified copper alloy using the same. In order to achieve the advantage, master alloy for casting a copper alloy in a form of Cu: 40 to 80%, Zr: 0.5 to 35% and the balance of Zn; and Cu: 40 to 80%, Zr: 0.5 to 35%, P: 0.01 to 3% and the balance of Zn are used, and thus grain-refined copper alloy casting products are obtained.

Abstract: A high strength, corrosion resistant alloy suitable for use in oil and gas environments includes, in weight %: 0-12% Fe, 18-24% Cr, 3-6.2% Mo, 0.05-3.0% Cu, 4.0-6.5% Nb, 1.1-2.2% Ti, 0.05-0.4% 0.05-0.2% Al, 0.005-0.040% C, balance Ni plus incidental impurities and deoxidizers. A ratio of Nb/(Ti+Al) is equal to 2.5-7.5 to provide a desired volume fraction of ?? and ?? phases. The alloy has a minimum yield strength of 145 ksi.

Abstract: A conductive paste including a conductive powder, a metallic glass, and an organic vehicle, wherein the metallic glass has a resistivity that is decreased when the metallic glass is heat treated at a temperature that is higher than a glass transition temperature of the metallic glass.

Abstract: An orthodontic appliance includes a portion made of a shape memory alloy having a base alloy composition of at least two different metallic elements and a treated region having an alloy composition that is depleted in at least one of the metallic elements. The base alloy may include a nickel titanium alloy (NiTi), a copper chromium nickel titanium alloy (CuCrNiTi), or a copper aluminum nickel (CuAlNi) alloy. The treated region may be depleted in at least one of copper, aluminum, nickel, and titanium relative to the base alloy composition by exposing the base alloy to a source of energy. The base alloy composition has a first austenitic finish temperature and the treated region has an austenitic finish temperature that may be different than the first austenitic finish temperature. The treated region may form a part of an archwire, a stop, a hook, a crown, a band, or an orthodontic bracket.

Abstract: The invention includes a copper-nickel-zinc alloy with the following composition in weight %: Cu 47.0 to 49.0%, Ni 8.0 to 10.0%, Mn 0.2 to 0.6%, Si 0.05 to 0.4%, Pb 1.0 to 1.5%, Fe and/or Co up to 0.8%, the rest being Zn and unavoidable impurities, wherein the total of the Fe content and double the Co content is at least 0.1 weight % and wherein mixing silicides containing nickel, iron and manganese and/or containing nickel, cobalt and manganese are stored as spherical or ellipsoidal particles in a structure consisting of an ?- and ?-phase. The invention further relates to a method for producing semi-finished products from a copper-nickel-zinc alloy.

Abstract: In materials using an Ag—Pd—Cu alloy for electric and electronic appliances, an improvement in weakness (fragility) to bending attained by adding Pt has been proposed since a material excellent in bending workability has been in demand. On the other hand, the proposal has entailed a problem of a considerable reduction in hardness though it depends on the added Pt amount. Also, there has been a problem that a material cost is increased by the addition of Pt. By adding 0.1 to 5.0 mass % of Co or 0.1 to 5.0 mass % of Ni to 20 to 50 mass % of Ag, 20 to 50 mass % of Pd, and 10 to 40 mass % of Cu, the hardness when precipitation hardened after plastic working was improved to 280 to 480 HV, and the bending workability was attained.

Abstract: Provided are a crystalline alloy having significantly better thermal stability than an amorphous alloy as well as glass-forming ability, and a method of manufacturing the crystalline alloy. The present invention also provides an alloy sputtering target that is manufactured by using the crystalline alloy, and a method of manufacturing the alloy target. According to an aspect of the present invention, provided is a crystalline alloy having glass-forming ability which is formed of three or more elements having glass-forming ability, wherein the average grain size of the alloy is in a range of 0.1 ?m to 5 ?m and the alloy includes 5 at % to 20 at % of aluminum (Al), 15 at % to 40 at % of any one or more selected from copper (Cu) and nickel (Ni), and the remainder being zirconium (Zr).

Abstract: There is provided a method for providing selenium dioxide and a copper indium gallium residue from a material comprising a compound of formula (I) CuInxGa(1-x)Se2 (I), wherein x has a value from 0.01 to 0.99, said method comprises the steps of: a) heating the material comprising the compound of formula (I) to at least 500° C., b) contacting the material with a gas flow comprising oxygen, and d) collecting the formed products. The method may be used in recycling in the field of solar cell technology.

Abstract: The present invention is directed to a formulation of one or more low silver containing alloys (including those with silver content below 50 weight %, “w %”) that show one of the group of distinct pink, yellow and green colors and further demonstrate enhanced resistance to tarnish and other beneficial features described herein.

Abstract: A dental alloy contains palladium (Pd) and indium (In) for CAD/CAM machining. The dental alloy can further include one component selected from the group consisting of gold (Au), silver (Ag), nickel (Ni), cobalt (Co), and platinum (Pt). The dental alloy has a yield strength of 250 MPa to 450 MPa, breaking elongation of 2% to 8%, metal-ceramic adhesion of 20 MPa to 70 MPa, coefficient of linear thermal expansion of 14.0×10?6/K to 17.0×10?6/K, or density of 8 g/cm3 to 15 g/cm3.

Abstract: A Sn—Sb—Ag—Cu based high-temperature lead-free solder alloy which has excellent connection reliability and which does not form a low melting point phase even when solidified by slow cooling is provided. It has an alloy composition consisting essentially of, in mass percent, Sb: 35-40%, Ag: 13-18%, Cu: 6-8%, and a remainder of Sn.

Abstract: The Be content of Be Al alloys suitable for investment casting, which contain a small but suitable amount of Ag, can be significantly reduced without adversely affecting their thermal or investment casting properties by including significantly more Si in the alloy than done in the past.

Abstract: An improved mercury dosing composition is described. A method for dispensing mercury with this composition and to discharge lamps containing each composition is also described.

Abstract: High Impact Toughness Alloy The invention provides an alloy, preferably a lead-free solder alloy, comprising: from 35 to 59% wt Bi; from 0 to 0.0 wt % Ag; from 0 to 1.0% wt Au; from 0 to 1.0% wt Cr; from 0 to 2.0% wt In; from 0 to 1.0% wt P; from 0 to 1.0% wt Sb; from 0 to 1.0% wt Sc; from 0 to 1.0% wt Y; from 0 to 1.0% wt Zn; from 0 to 1.0% wt rare earth elements; one or more of: 10 from greater than 0 to 1.0% wt Al; from 0.01 to 1.0% wt Ce; from greater than 0 to 1.0% wt Co; from greater than 0 to 0.0% wt Cu; from 0.001 to 1.0% wt Ge; from greater than 0 to 0.0% wt Mg; from greater than 0 to 1.0% wt Mn; from 0.01 to 1.0% wt Ni; and from greater than 0 to 1.0% wt Ti, and the 1 balance Sn, together with any unavoidable impurities.

Abstract: Provided by the present invention are a fine crystallite high-function metal alloy member, a method for manufacturing the same, and a business development method thereof, in which a crystallite of a metal alloy including a high-purity metal alloy whose crystal lattice is a face-centered cubic lattice, a body-centered cubic lattice, or a close-packed hexagonal lattice is made fine with the size in the level of nanometers (10?9 m to 10?6 m) and micrometers (10?6 m to 10?3 m), and the form thereof is adjusted, thereby remedying drawbacks thereof and enhancing various characteristics without losing superior characteristics owned by the alloy.

Abstract: A thrust bearing for a turbocharger of an internal-combustion engine is made of a copper alloy including a brass matrix and a needle-like Mn—Si-based compound dispersed in the brass matrix. Not less than 50% of the needle-like Mn—Si-based compound dispersed in a region from a surface of a sliding portion of the thrust bearing to a depth of 50 ?m have a major axis extending from the inside of the sliding portion to the surface. The major axis makes an angle of 30° to 150° with the surface of the sliding portion when observed in a sectional view perpendicular to the surface of the sliding portion.

Abstract: A copper, manganese, nickel, zinc and tin binder metal composition having a melting point of 1500° F. or less that includes zinc and tin at a sum weight of about 26.5% to about 30.5% in which zinc is at least about 12% and Sn is at least about 6.5%. The binder metal having a melting point of 1500° F. or less can be used at an infiltrating temperature of 1800° F. or less in forming drilling tools and tool components.

Abstract: An electroconductive material that includes a metal component containing a first metal and a second metal having a higher melting point than the first metal, and has a configuration in which the first metal is Sn or an alloy containing Sn, and the second metal is a Cu—Al alloy which forms, with the first metal, an intermetallic compound exhibiting a melting point of 310° C. or higher. The first metal can be Sn alone or an alloy containing Sn and at least one of Cu, Ni, Ag, Au, Sb, Zn, Bi, In, Ge, Al, Co, Mn, Fe, Cr, Mg, Pd, Si, Sr, Te, and P.

Abstract: A Sn—Sb—Ag—Cu based high-temperature lead-free solder alloy which has excellent connection reliability and which does not form a low melting point phase even when solidified by slow cooling is provided. It has an alloy composition consisting essentially of, in mass percent, Sb: 35-40%, Ag: 13-18%, Cu: 6-8%, and a remainder of Sn.

Abstract: The present invention relates to a Cu—P—Ag—Zn brazing alloy, and more particularly, to a brazing alloy composed of copper (Cu), phosphorus (P), zinc (Zn), and silver (Ag), and including one or two or more elements of indium (In), gallium (Ga), boron (B), tin (Sn), silicon (Si), germanium (Ge), lithium (Li), nickel (Ni), and manganese (Mn). The present invention is composed of 1% by weight to 50% by weight of silver (Ag), 10% by weight to 35% by weight of zinc (Zn), 0.01% by weight to 4% by weight of phosphorus (P), and the remainder of copper (Cu).

Abstract: In a Cr—Cu alloy that is formed by powder metallurgy and contains a Cu matrix and flattened Cr phases, the Cr content in the Cr—Cu alloy is more than 30% to 80% or less by mass, and the average aspect ratio of the flattened Cr phases is more than 1.0 and less than 100. The Cr—Cu alloy has a small thermal expansion coefficient in in-plane directions, a high thermal conductivity, and excellent processibility. A method for producing the Cr—Cu alloy is also provided. A heat-release plate for semiconductors and a heat-release component for semiconductors, each utilizing the Cr—Cu alloy, are also provided.

Abstract: The present invention relates to pulverulent materials suitable for storing hydrogen, and more particularly to a method of preparing such a material, in which: (A) a composite metallic material having a specific granular structure is prepared by co-melting the following mixtures: a first metallic mixture (m1), which is an alloy (a1) of body-centered cubic crystal structure, based on titanium, vanadium, chromium and/or manganese, or a mixture of these metals in the proportions of the alloy (a1); and a second mixture (m2), which is an alloy (a2), comprising 38 to 42% zirconium, niobium, molybdenum, hafnium, tantalum and/or tungsten and 56 to 60 mol % of nickel and/or copper, or else a mixture of these metals in the proportions of the alloy (a2), with a mass ratio (m2)/(m1+m2) ranging from 0.1 wt % to 20 wt %; and (B) the composite metallic material thus obtained is hydrogenated, whereby the composite material is fragmented (hydrogen decrepitation).

Abstract: Provided are a metal alloy and more particularly, to an aluminum alloy used for electrical, electronic, and mechanical components, and an aluminum alloy casting manufactured using the aluminum alloy. The aluminum alloy according to an embodiment includes 4 to 13 wt % of silicon (Si), 1 to 5 wt % of copper (Cu), 26 wt % or more and less than 40 wt % of zinc (Zn), and a balance being aluminum (Al) and unavoidable impurities.

Abstract: In a copper-based slide member in which needle-shaped Mn—Si based compounds are dispersed in a brass structure, 50% or more of a total number of the needle-shaped Mn—Si based compounds having lengths of 50 ?m or more in a major axis direction are constituted of a plurality of small particles. Thereby, even if the needle-shaped Mn—Si based compounds fall off during sliding, the small particles which constitute the needle-shaped Mn—Si based compounds may fall off. Thus, the frequency of falling off of the coarse needle-shaped Mn—Si based compound which damages a shaft and a bearing is decreased. Therefore, seizure hardly occurs.

Abstract: An ingot includes at least two metals selected from copper, tin, zinc and bismuth, wherein: (a) the ingot is a mechanical ingot, the at least two metals are 40-95 wt. % copper, 3-80 wt. % tin, 1-40 wt. % bismuth and/or 1-80 wt. % zinc, and other metals are present in a collective amount of 0-2 wt. %; or (b) the ingot is a cast ingot, the at least two metals are 40-80 wt. % copper, 3-80 wt. % tin, 1-40 wt. % bismuth and/or 1-80 wt. % zinc, and other metals are present in a collective amount of 0-2 wt. %, provided that when copper is present in the cast ingot in an amount greater than 69 wt. %, zinc is present in an amount less than 30 wt. %. Methods for preparing and casting the ingot are also disclosed, as is a system for casting a copper-bismuth alloy.

Abstract: A solder alloy is providing, the solder alloy including zinc, aluminum, magnesium and gallium, wherein the aluminum constitutes by weight 8% to 20% of the alloy, the magnesium constitutes by weight 0.5% to 20% of the alloy and the gallium constitutes by weight 0.5% to 20% of the alloy, the rest of the alloy including zinc.

Abstract: An alloy having a formula Zr100-x-u (Cu100-aNia)xAlu wherein X, U and a are in atomic percentages wherein X is less than or equal to 48 and greater than or equal to 37, wherein U is less than or equal to 14 and greater than or equal to 3, and wherein a is less than or equal to ten and greater than or equal to 3. Methods of forming the alloy and bulk metallic glass comprising the alloy are also provided. The alloy and bulk metallic glass are useful in a wide number of applications which includes sports and luxury products, electronic goods, medical instruments, and military equipment.

Abstract: Methods of preparing nanowires having small diameters and large lengths are disclosed. Such nanowires are useful in electronics applications.

Abstract: The invention provides a metal alloy fuel catalyst for decontaminating a hydrocarbon fuel, including diesel and bio-diesel fuel, of a bacterial contamination and for improving fuel combustion. The metal alloy fuel catalysts preferably includes about 70% Sn, about 22% Sb, about 4% Bi, and about 4% Pb, although other formulations are possible. The fuel catalyst can take the form of an in-line component in a fuel system or be coated within a fuel storage container.

Abstract: A thrust bearing for a turbocharger of an internal-combustion engine is made of a copper alloy including a brass matrix and a needle-like Mn-Si-based compound dispersed in the brass matrix. Not less than 50% of the needle-like Mn-Si-based compound dispersed in a region from a surface of a sliding portion of the thrust bearing to a depth of 50 ?m have a major axis extending from the inside of the sliding portion to the surface. The major axis makes an angle of 30° to 150° with the surface of the sliding portion when observed in a sectional view perpendicular to the surface of the sliding portion.

Abstract: A noble alloy suitable for dental purposes that contains cobalt and chromium in addition to ruthenium and optionally gold and/or platinum group elements, and is non-magnetic is provided. In the alloy system cobalt-chromium-ruthenium-gallium it was found that gallium contents above about 10 weight percent may exhibit ferromagnetism upon slow cooling. Ferromagnetism is an undesirable feature for dental prosthesis. Reducing the gallium content below 10%, however, lowers the thermal expansion coefficient of the alloy.

Abstract: A swash plate includes aluminum (Al) as a main component and 35˜45 wt % of zinc (Zn), 1.5˜3.5 wt % of copper (Cu), 6˜10 wt % of silicon (Si), 0.2˜0.5 wt % of magnesium (Mg) and other inevitable impurities. A method of manufacturing the swash plate is also provided.

Abstract: A homogenous brazing material essentially consisting of relatively low amounts of silver and nickel together with copper, zinc, and other constituents is provided. The brazing material has a working temperature exceeding 630° F. and is preferably between about 1250° F. and 1500° F. The brazing material preferably has about 30 percent by weight of silver, about 36 percent by weight of copper, about 32 percent by weight of zinc, and about 2 percent by weight of nickel. The addition of nickel in the above-specified amount improves resistance against interface corrosion in aqueous solutions, aids in the strength of the alloy, and provides improved wettability on ferrous and non-ferrous substrates. The brazing material may also include a flux, such as a core or a coating.

Abstract: A Ni based alloy material consists of by mass percent, C?0.03%, Si: 0.01 to 0.5%, Mn: 0.01 to 1.0%, P?0.03%, S?0.01%, Cr: not less than 20% to less than 30%, Ni: more than 40% to not more than 50%, Cu: more than 2.0% to not more than 5.0%, Mo: 4.0 to 10%, Al: 0.005 to 0.5%, W: 0.1 to 10% , N: more than 0.10% to not more than 0.35%, optionally one or more elements selected from Ca?0.01% and Mg?0.01%, with the balance being Fe and impurities, and the formula of “0.5Cu+Mo?6.5” is satisfied. The material has a surface hardness of a Vickers hardness of not less than 350 at 500° C., a corrosion resistance equivalent to that of Ni based alloys having high Mo contents, and excellent erosion resistance in a severe environment.

Abstract: A alloy and a process of forming a alloy are disclosed. The alloy has a predetermined grain boundary morphology. The alloy includes by weight greater than about 0.06 percent carbon, up to about 0.0015 percent sulfur, less than about 16 percent chromium, between about 39 percent and about 44 percent nickel, between about 2.5 percent and about 3.3 percent niobium, between about 1.4 percent and about 2 percent titanium, up to about 0.5 percent aluminum, up to about 0.006 percent boron, up to about 0.3 percent copper, up to about 0.006 percent nitrogen, and greater than about 0.5 percent molybdenum.

Abstract: The invention relates to an auxiliary material for soldering steel sheets, wherein the auxiliary material comprises weight percentages of 15 to 40% Zn, 5 to 30% Mn, 0.01 to 10% Ni, and typical impurities no greater than 1%, and the remainder Cu.

Abstract: A copper brazing filler metal includes Ni in an amount of from 20 or more to 36% or less by mass, Mn in an amount from 19 or more to 30% or less by mass, Fe in an amount of from 0 or more to 16% or less by mass, Si in an amount of from more than 0 (not inclusive) to 2% or less by mass, B in an amount of from 0.1 or more to 0.5% or less by mass, and the balance being copper (Cu) as well as inevitable impurities and/or a modifying element, when the entirety is taken as 100% by mass. Moreover, the copper brazing filler metal exhibits a ratio of the Ni content with respect to the Mn content (i.e., (Ni Content)/(Mn Content)) that falls in a range of from 1.1 or more to 2 or less when being free from Fe.

Abstract: Provided are a brazing material capable of being restrained from protruding unnecessarily in a joint region; a heat dissipation base having a high reliability of electric insulation, and does not easily cause a short circuit even when the base dissipates heat repeatedly; and an electronic device wherein an electronic component is mounted on circuit members of this heat dissipation base. The brazing material comprises silver and copper as main components; at least one element A selected from indium, zinc, and tin; at least one element B selected from titanium, zirconium, hafnium, and niobium; and at least one element C selected from molybdenum, osmium, rhenium, and tungsten.