Abstract: A lead-free solder alloy, a solder ball and an electronic member comprising a solder bump which enable the prevention of the occurrence of yellow discoloration on the surface of a solder after soldering, the surface of a solder bump after the formation of the bump in a BGA, and the surface of a solder bump after a burn-in test of a BGA. Specifically disclosed are: a lead-free solder alloy; a solder ball; and an electronic member comprising a solder bump, containing at least one additive element selected from Li, Na, K, Ca, Be, Mg, Sc, Y, lanthanoid series elements, Ti, Zr, Hf, Nb, Ta, Mo, Zn, Al, Ga, In, Si and Mn in the total amount of 1 ppm by mass to 0.1% by mass inclusive, with the remainder being 40% by mass or more of Sn.

Abstract: A high-strength copper alloy contains 20 to 45% of zinc, 0.3 to 1.5% of iron, 0.3 to 1.5% of chromium, and a balance of copper, based on mass.

Abstract: According to one embodiment of the invention, a Cu—Ga alloy material has an average composition consisting of not less than 32% and not more than 53% by mass of gallium (Ga) as well as the balance consisting of copper (Cu) and an inevitable impurity. In the Cu—Ga alloy material, a region containing less than 47% by mass of copper accounts for 2% or less by volume of the whole Cu—Ga alloy material.

Abstract: A palladium-dominated dental alloy, in particular a ceramic-bonding dental alloy for the manufacture of dental prostheses such as crowns, bridges, inlays, or onlays, containing at least gold, palladium, and silver, as well as a grain-growth inhibitor in the form of ruthenium. In order to achieve a fine-grained separation without the formation of agglomerates to obtain a dental alloy with high mechanical stability and excellent polishing characteristics, it is proposed that the dental alloy contain—in addition to ruthenium as grain-growth inhibitor—at least one element of the group tantalum, niobium, yttrium, zirconium, chromium, and molybdenum as grain-refinement control element.

Abstract: The present disclosure relates to white precious metal alloy compositions comprising at least one of platinum and palladium alloyed with gold, silver, and optionally one or more additional alloying elements. More specifically, and in one embodiment, the present disclosure relates to white precious metal alloy compositions that are suitable for the manufacture of jewelry and other finished articles. In addition, the present invention also relates to a method of manufacturing finished articles from such white precious metal alloy compositions.

Abstract: Provided is a filler metal alloy composition capable of improving appearance of a welded zone and fluidity, penetration, etc., of an inexpensive filler metal by minimizing a content of silver (Ag) and adding tin (Sn) and silicon (Si) components. The filler metal alloy composition, brazed to a joint between parent metals to stably join the parent metals formed of the same material or different materials, is characterized in that the composition comprises silver (Ag), copper (Cu), zinc (Zn), tin (Sn), silicon (Si), and other unavoidable impurities.

Abstract: A cadmium-free silver brazing filler metal containing gallium, indium, nickel and cerium falls into the field of metal material and metallurgy. Its chemical composition includes (by mass percentage) Cu 28.0%-35.0%, Zn 28.0%-38.0%, Ga 0.1%-2.5%, In 0.1%-2.5%, Ni 0.1%-2.5%, Ce 0.002%-0.1%, and Ag in balance.

Abstract: A gold alloy that is usable for jewelry and other applications. The gold alloy is made by combining Y % gold with Z % of a master alloy, wherein Y+Z=100. The gold alloy may be made by first forming the master alloy and then mixing the gold with the master alloy. The gold alloy may also be made by mixing gold with the elements of the master alloy without first forming the master alloy. In another embodiment, the master alloy used to make a white gold (variable) karat alloy will include from about 23.33% to about 43.33% copper, from about 23.33% to about 43.33% nickel, from about 3.33% to about 23.33% zinc, and from about 10 to about 30% silver. Another embodiment of a master alloy used to make a white gold (variable) karat alloy will include from about 43.33% to about 66% copper, from about 8 to about 39.33% nickel, and from about 4.67% to about 36.67% zinc.

Abstract: A gold alloy that is usable for jewelry and other applications. The gold alloy is made by combining Y % gold with Z % of a master alloy, wherein Y+Z=100. The gold alloy may be made by first forming the master alloy and then mixing the gold with the master alloy. The gold alloy may also be made by mixing gold with the elements of the master alloy without first forming the master alloy. In another embodiment, the master alloy used to make a white gold (variable) karat alloy will include from about 23.33% to about 43.33% copper, from about 23.33% to about 43.33% nickel, from about 3.33% to about 23.33% zinc, and from about 10 to about 30% silver. Another embodiment of a master alloy used to make a white gold (variable) karat alloy will include from about 43.33% to about 66% copper, from about 8 to about 39.33% nickel, and from about 4.67% to about 36.67% zinc.

Abstract: A gold alloy that is usable for jewelry and other applications. The gold alloy is made by combining Y % gold with Z % of a master alloy, wherein Y+Z=100. The gold alloy may be made by first forming the master alloy and then mixing the gold with the master alloy. The gold alloy may also be made by mixing gold with the elements of the master alloy without first forming the master alloy. In another embodiment, the master alloy used to make a white gold (variable) karat alloy will include from about 23.33% to about 43.33% copper, from about 23.33% to about 43.33% nickel, from about 3.33% to about 23.33% zinc, and from about 10 to about 30% silver. Another embodiment of a master alloy used to make a white gold (variable) karat alloy will include from about 43.33% to about 66% copper, from about 8 to about 39.33% nickel, and from about 4.67% to about 36.67% zinc.

Abstract: Compositions are disclosed comprising mercury, titanium, copper and one or more of tin, chromium and silicon, useful for the release of mercury in applications requiring the same, in particular in fluorescent lamps. A process for the preparation of these compositions is also disclosed.

Abstract: The present invention is a silver alloy suitable for use in a probe pin made of an Ag—Cu alloy, wherein the silver alloy comprises 30 to 50% by weight of Cu and Ag as balance. This silver alloy further comprises 2 to 10% by weight of Ni to further improve strength. A probe pin made of these materials has stable contact resistance even under low contact pressure. The probe pin has excellent strength and antifouling property to adhesion of a foreign matter from a contact object due to repetitive use. Thereby, the probe pin usable in a stable manner for a long period of time can be obtained.

Abstract: It is an object to provide an inexpensive alloy for heat dissipation having a small thermal expansion coefficient as known composite materials, a large thermal conductivity as pure copper, and excellent machinability and a method for manufacturing the alloy. In particular, since various shapes are required of the alloy for heat dissipation, a manufacturing method by using a powder metallurgy method capable of supplying alloys for heat dissipation, the manufacturing costs of which are low and which take on various shapes, is provided besides the known melting method. The alloy according to the present invention is a Cu—Cr alloy, which is composed of 0.3 percent by mass or more, and 80 percent by mass or less of Cr and the remainder of Cu and incidental impurities and which has a structure in which particulate Cr phases having a major axis of 100 nm or less and an aspect ratio of less than 10 are precipitated at a density of 20 particles/?m2 in a Cu matrix except Cr phases of more than 100 nm.

Abstract: To provide a silver-white copper alloy which represents a silver-white color equivalent to that of nickel silver and is excellent in hot workability and the like. The silver-white copper alloy includes 47.5 to 50.5 mass % of Cu, 7.8 to 9.8 mass % of Ni, 4.7 to 6.3 mass % of Mn, and the remainder including Zn, and the silver-white copper alloy has an alloy composition satisfying relationships of f1=[Cu]+1.4×[Ni]+0.3×[Mn]=62.0 to 64.0, f2=[Mn]/[Ni]=0.49 to 0.68, and f3=[Ni]+[Mn]=13.0 to 15.5 among a content [Cu] mass % of Cu, a content [Ni] mass % of Ni, and a content [Mn] mass % of Mn, and has a metal structure in which ? phases at an area ratio of 2 to 17% are dispersed in an ?-phase matrix. The copper alloy is provided as a hot processing material or continuous casting material formed by performing one or more heat treatments and cold processes on a hot processing raw material formed by performing a hot process on an ingot or a casting raw material obtained by continuous casting.

Abstract: Provided is a filler metal alloy composition capable of improving appearance of a welded zone and fluidity, penetration, etc., of an inexpensive filler metal by minimizing a content of silver (Ag) and adding tin (Sn) and silicon (Si) components. The filler metal alloy composition, brazed to a joint between parent metals to stably join the parent metals formed of the same material or different materials, is characterized in that the composition comprises silver (Ag), copper (Cu), zinc (Zn), tin (Sn), silicon (Si), and other unavoidable impurities.

Abstract: A superconductor which comprises a new compound composition substituting for perovskite copper oxides. The superconductor is characterized by comprising a compound which is represented by the chemical formula A(TM)2Pn2 [wherein A is at least one member selected from the elements in Group 1, the elements in Group 2, or the elements in Group 3 (Sc, Y, and the rare-earth metal elements); TM is at least one member selected from the transition metal elements Fe, Ru, Os, Ni, Pd, or Pt; and Pn is at least one member selected from the elements in Group 15 (pnicogen elements)] and which has an infinite-layer crystal structure comprising (TM)Pn layers alternating with metal layers of the element (A).

Abstract: A Ni—Fe—Cr—Mo alloy containing a small amount of Cu and correlated percentages of Nb, Ti and Al to develop a unique microstructure to produce 145 ksi minimum yield strength. The unique microstructure is obtained by special annealing and age hardening conditions, by virtue of which the alloy has an attractive combination of yield strength, impact strength, ductility, corrosion resistance, thermal stability and formability, and is especially suited for corrosive oil well applications that contain gaseous mixtures of carbon dioxide and hydrogen sulfide. The alloy comprises in weight percent the following: 0-15% Fe, 18-24% Cr, 3-9% Mo, 0.05 3.0% Cu, 3.6-6.5% Nb, 0.5-2.2% Ti, 0.05-1.0% Al, 0.005-0.040% C, balance Ni plus incidental impurities and a ratio of Nb/(Al+Ti) in the range of 2.5-7.5. To facilitate formability, the composition range of the alloy is balanced to be Laves phase free.

Abstract: A gold alloy having, expressed by weight, about 24.5 to 25.5% Au, about 19.0 to 23.0% Ag, about 43.0 to 47.0% Cu, about 6.0 to 10.0% Zn, about 0.05 to 0.30% Si, and about 0.005 to 0.03% Ir. Alternatively, a alloy having, expressed by weight, about 16-17% Au, about 19-23% Ag, about 50-55% Cu, about 6-10% Zn, about 0.05-0.30% Si, and about 0.005-0.03% Ir.

Abstract: A method for producing high strength aluminum alloy consolidated billets containing L12 dispersoids by Ceracon forging is disclosed. The method comprises forming an aluminum alloy powder compact preform containing L12 dispersoid forming elements therein and encompassing the preform in a flowable pressure transmitting medium in a die in a hydraulic press. The die, pressure transmitting medium and preform are then heated and the preform is forged by applying pressure to the pressure transmitting medium by the ram of the hydraulic press. The unequal axial and radial strain resulting from this type of forging results in improved mechanical properties of L12 aluminum alloys.

Abstract: A boron-free, low-gold, and low-palladium metal alloy composition formulated to provide an alloy with an attractive yellow color, improved tarnish resistance, and enhanced castability. In certain implementations, the alloy contains gold, silver, copper, palladium and indium. The alloy preferably contains less than 25% by weight gold and the weight percent ratio of silver to copper is between 0.65 and 2.65 and the weight percent ratio of palladium to indium is between 1 and 5.

Abstract: A mechanical structure is provided with a crystalline superelastic alloy that is characterized by an average grain size and that is characterized by a martensitic phase transformation resulting from a mechanical stress input greater than a characteristic first critical stress. A configuration of the superelastic alloy is provided with a geometric structural feature of the alloy that has an extent that is no greater than about 200 micrometers and that is no larger than the average grain size of the alloy. This geometric feature is configured to accept a mechanical stress input.

Abstract: A cadmium-free silver brazing filler metal containing gallium, indium, nickel and cerium falls into the field of metal material and metallurgy. Its chemical composition includes (by mass percentage) Cu 28.0%-35.0%, Zn 28.0%-38.0%, Ga 0.1%-2.5%, In 0.1%-2.5%, Ni 0.1%-2.5%, Ce 0.002%-0.1%, and Ag in balance.

Abstract: Compositions are disclosed comprising mercury, titanium, copper and one or more of tin, chromium and silicon, useful for the release of mercury in applications requiring the same, in particular in fluorescent lamps. A process for the preparation of these compositions is also disclosed.

Abstract: Compositions are disclosed comprising mercury, titanium, copper and one or more of tin, chromium and silicon, useful for the release of mercury in applications requiring the same, in particular in fluorescent lamps. A process for the preparation of these compositions is also disclosed.

Abstract: A fuel cell catalyst comprising platinum, chromium, and copper, nickel or a combination thereof. In one or more embodiments, the concentration of platinum is less than 50 atomic percent, and/or the concentration of chromium is less than 30 atomic percent, and/or the concentration of copper, nickel, or a combination thereof is at least 35 atomic percent.

Abstract: Techniques for improving energy conversion efficiency in photovoltaic devices are provided. In one aspect, an antimony (Sb)-doped film represented by the formula, Cu1-yIn1-xGaxSbzSe2-wSw, provided, wherein: 0?x?1, and ranges therebetween; 0?y?0.2, and ranges therebetween; 0.001?z?0.02, and ranges therebetween; and 0?w?2, and ranges therebetween. A photovoltaic device incorporating the Sb-doped CIGS film and a method for fabrication thereof are also provided.

Abstract: A Cu—Ni—Sn copper-based sintered alloy has a composition including 10 to 40% by mass of Ni, 5 to 25% by mass of Si, and the remainder containing Cu and inevitable impurities, and if necessary, 0.1 to 0.9% by mass of P, 1 to 10% by mass of C, 0.3 to 6% by mass of calcium fluoride or 0.3 to 6% by mass of molybdenum disulfide. In the structure of the alloy, a phase of a composition containing Cu(4-x-y)NixSny (where x: 1.7 to 2.3, y: 0.2 to 1.3) is dispersed.

Abstract: [Object] To provide a high strength Cr—Ni alloy material excellent in hot workability and stress corrosion cracking resistance, and seamless pipe for oil well. [Solution] A high strength Cr—Ni alloy material which consists of, by mass percent, C: 0.05% or less, Si: 0.05 to 1.0%, Mn: 0.01% or more and less than 3.0%, P: 0.05% or less, S: 0.005% or less, Cu: 0.01 to 4%, Ni: 25% or more and less than 35%, Cr: 20 to 30%, Mo: 0.01% or more and less than 4.0%, N: 0.10 to 0.30%, Al: 0.03 to 0.30%, O (oxygen): 0.01% or less, and REM (rare earth metal): 0.01 to 0.20%, with the balance being Fe and impurities, and also satisfies the conditions in the following formula (1). N×P/REM?0.40??formula (1) where P, N, and REM in the formula (1) respectively denote the contents (mass %) of P, N, and REM. The high strength Cr—Ni alloy material may further contain one or more types of W, Ti, Nb, Zr, V, Ca, and Mg, instead of part of Fe.

Abstract: A precision alloy for die-casting contains aluminum, silicon and zinc, wherein on the basis of the overall mass, the content of aluminum is 40% by mass or more and 45% by mass or less, and the content of silicon is 2% by mass or more and 8% by mass or less. Also other solving means will be described.

Abstract: An alloy having a formula: (Zr1Ti)100-x-u(Cu100-aNia)XAlu wherein X, U and a are in atomic percentages in the following ranges: 37?x?48, 3?u?14, and 3?a?30.

Abstract: A jewelry alloy that is approximately a 10% or 2.4 karat alloy that has similar color huge and shine and characteristics of 10 karat gold and higher. This alloy is considerably less expensive than traditional 10 karat gold and higher, but has all the similar working characteristics as working in sterling or 10 karat gold metal alloys. The alloy has the following compositions by weight; Gold 5.00-20.00%, Silver 35.00-55.00%, Copper 40.00-60.00%. In addition to its nice pink color and low cost it provides retailers with an affordable alloy for jewelry and provides jewelry craftsmen a low cost pink alloy that responds well to the jewelry manufacturing process (e.g., casting, milling, soldering, tooling, stone setting, polishing and plating).

Abstract: A method of manufacturing improved thin-film solar cells entirely by sputtering includes a high efficiency back contact/reflecting multi-layer containing at least one barrier layer consisting of a transition metal nitride. A copper indium gallium diselenide (Cu(InxGa1-x)Se2) absorber layer (X ranging from 1 to approximately 0.7) is co-sputtered from specially prepared electrically conductive targets using dual cylindrical rotary magnetron technology. The band gap of the absorber layer can be graded by varying the gallium content, and by replacing the gallium partially or totally with aluminum. Alternately the absorber layer is reactively sputtered from metal alloy targets in the presence of hydrogen selenide gas. RF sputtering is used to deposit a non-cadmium containing window layer of ZnS. The top transparent electrode is reactively sputtered aluminum doped ZnO. A unique modular vacuum roll-to-roll sputtering machine is described.

Abstract: The invention relates to a metal matrix material based on shape-memory alloy powders, to the production method thereof and to the use of same. More specifically, the invention relates to a metal matrix material which is characterised in that it is based on particles of shape-memory alloy powder, having a base of copper at a concentration of between 45 vol.-% and 70 vol.-% in relation to the total volume of the material, said powder particles being supported by a metal matrix. The invention also relates to a method of producing the aforementioned material and to the use of same for absorbing vibrations, particularly acoustic and mechanical vibrations.

Abstract: This aims to provide a wear-resistant copper-based alloy, which is advantages in not only enhancing wear resistance in a high temperature range but also enhancing crack resistance and machinability and which is especially suitable for forming a cladding layer. The wear-resistant copper-based alloy comprises, by weight, 4.7 to 22.0% nickel, 0.5 to 5.0% silicon, 2.7 to 22.0% iron, 1.0 to 15.0% chromium, 0.01 to 2.00% cobalt, 2.7 to 22.0% one or more of tantalum, titanium, zirconium and hafnium, and the balance of copper with inevitable impurities.

Abstract: In a Cr—Cu alloy that is formed by powder metallurgy and contains a Cu matrix and flattened Cr phases, the Cr content in the Cr—Cu alloy is more than 30% to 80% or less by mass, and the average aspect ratio of the flattened Cr phases is more than 1.0 and less than 100. The Cr—Cu alloy has a small thermal expansion coefficient in in-plane directions, a high thermal conductivity, and excellent processability. A method for producing the Cr—Cu alloy is also provided. A heat-release plate for semiconductors and a heat-release component for semiconductors, each utilizing the Cr—Cu alloy, are also provided.

Abstract: A brazing material for brazing tungsten/carbide/cobalt substrates (e.g., wear pads) to substrates comprising titanium or alloys thereof (e.g., fan or compressor blades). The brazing material includes silver, aluminum, nickel, copper, and titanium present in respective amounts to provide a post-braze hardness of between 450 and 550 KHN to thereby increase the impact resistance of the braze joint. The substrates may be brazed by induction heating at temperatures up to about 1750° F. (about 954° C.).

Abstract: An amorphous Ti—Ni—Cu alloy comprising from 44 to 49 atomic % of Ti, from 20 to 30 atomic % of Cu, and the balance being Ni and unavoidable elements is heated at 500 to 700° C. for a period of time not exceeding 100 hours to crystallize the amorphous alloy.

Abstract: An advantage of the invention is to provide a master alloy used in a casting of a modified copper alloy, grains of which can be refined during a melt-solidification, and also a method of casting a modified copper alloy using the same. In order to achieve the advantage, master alloy for casting a copper alloy in a form of Cu: 40 to 80%, Zr: 0.5 to 35% and the balance of Zn; and Cu: 40 to 80%, Zr: 0.5 to 35%, P: 0.01 to 3% and the balance of Zn are used, and thus grain-refined copper alloy casting products are obtained.

Abstract: A composition for use as a catalyst in, for example, a fuel cell, the composition comprising platinum, copper and tungsten, or an oxide, carbide and/or salt of one or more of platinum, copper and tungsten, wherein the sum of the concentrations of platinum, copper and tungsten, or an oxide, carbide and/or salt thereof, is greater than 90 atomic percent.

Abstract: A solder composition having a mixture of elements including tin, indium, silver, and bismuth, and can include about 30% to 85% tin and about 15% to 65% indium.

Abstract: A sputtering target consists essentially of 0.1 to 50% by weight of at least one kind of element that forms an intermetallic compound with Al, and the balance of Al. The element that forms an intermetallic compound with Al is uniformly dispersed in the target texture, and in a mapping of EPMA analysis, a portion of which count number of detection sensitivity of the element is 22 or more is less than 60% by area ratio in a measurement area of 20×20 ?m. According to such a sputtering target, even when a sputtering method such as long throw sputtering or reflow sputtering is applied, giant dusts or large concavities can be suppressed in occurrence.

Abstract: The present invention relates to a method of producing W—Cu based composite powder, which is used in heat-sink materials for high-power integrated circuits, electric contact materials, etc, and to a method of producing a W—Cu based sintered alloy by using the composite powder. The method of producing tungsten-copper based composite powder includes first preparing composite oxide powder by dissolving ammonium metatungstate, [(NH4)6(H2W12O40).

Abstract: The present invention discloses a white gold composition consisting essentially of copper, silver, zinc, and manganese, and further consisting of small amounts of tin, cobalt, silicon/copper and boron/copper. More particularly, the white gold composition of the present invention discloses a white gold composition consisting essentially of about 36% to about 57% copper, about 10% silver, about 18.2% to about 24.2% zinc, about 14% to about 28.9% manganese, and the balance further consisting of about 1% tin, about 0.025% to about 0.03% cobalt, about 0.52% silicon/copper, and about 0.2% boron/copper. An objective of the present invention is to provide for methods and compositions of casting, fabricating and soldering white gold that does not incorporate nickel or palladium. The present invention also discloses no tarnish results when hydrogen is used as a catalyst to all compositions.

Abstract: A corrosive and tarnish resistant alloy comprising 13 to 25 percent by weight of gold, 20 to 36 percent by weight of silver, 23 to 32 percent by weight of copper, 16 to 25 percent by weight of zinc, and 1 to 4 percent by weight of silicate.

Abstract: A sputtering target consists essentially of 0.1 to 50% by weight of at least one kind of element that forms an intermetallic compound with Al, and the balance of Al. The element that forms an intermetallic compound with Al is uniformly dispersed in the target texture, and in a mapping of EPMA analysis, a portion of which count number of detection sensitivity of the element is 22 or more is less than 60% by area ratio in a measurement area of 20×20 &mgr;m. According to such a sputtering target, even when a sputtering method such as long throw sputtering or reflow sputtering is applied, giant dusts or large concavities can be suppressed in occurrence.

Abstract: The present invention concerns a non-precious dental alloy, including the following components, with the approximate proportions, in weight, given in %: gold, between 0.5 and 4, molybdenum, between 4 and 6, tungsten, between 2 and 7, indium, between 0.5 and 4, gallium, between 0.5 and 4, tin, between 0 and 4, titanium, between 0 and 2, copper, between 0 and 2, the remainder being obtained with a mixture containing approximately 70% cobalt and 30% chromium.

Abstract: A brazing alloy according to the present invention has a melting point equivalent to that of a copper brazing filler and is excellent in corrosion- and oxidation-resistance. The brazing alloy consists essentially of Mn, Ni and Cu, and has a composition in terms of weight percentage which, when plotted on a diagram as shown in FIG. 1, falls within a range defined by: the point A (37% Mn, 63% Ni, 0% Cu), the point B (18% Mn, 27% Ni, 55% Cu); the point C (42% Mn, 3% Ni, 55% Cu); the point D (50% Mn, 3% Ni, 47% Cu); and the point E (50% Mn, 50% Ni, 0% Cu), wherein Mn=50% is exclusive.

Abstract: The present invention is a precious metal-based amorphous alloy having a Pt—Cu—P based structure including in atomic %: 50≦Pt≦75%, 5≦Cu≦35%, and 15≦P≦25% and is a precious metal-based amorphous alloy having a Pt—Pd—Cu—P based structure including in atomic %: 5≦Pt≦70%, 5≦Pd≦50%, 5≦Cu≦50%, and 5≦P≦30%. Preferably, cooling rates for manufacturing the alloys having these compositions are 10−1 to 102° C./sec. for the Pt—Cu—P based structure and 101 to 102° C./sec. for the Pt—Pd—Cu—P based structure.

Abstract: A process for producing finely divided 20 to 500 angstrom metal particles, metals with oxide coatings or metal oxides using an alkalide or electride in a non-reactive solvent is described. The process produces various forms of the metal depending upon the oxidizability of the metal initially produced by the process. The process is useful for producing catalysts, alloys, colloidal solutions, semi-conductors and the like.

Abstract: This invention provides a copper foil for a printed wiring board, which comprises a copper foil, an alloy layer (A) comprising copper, zinc, tin and nickel which is formed on a surface of the copper foil, said surface to be brought into contact with a substrate for a printed wiring board, and a chromate layer which is formed on a surface of the alloy layer (A,. The copper foil for a printed wiring board has the following features: even if a printed wiring board is produced using a long-term stored copper foil, the interface between the copper foil and the substrate is only slightly corroded with chemicals; even if the copper foil contacts a varnish containing an organic acid, e.g., a varnish for an acrylic resin, in the formation of a copper-clad laminate, the bond strength is sufficient. Even if a printed circuit board made by using the copper foil is placed in a high temperature environment, e.g.