Copper Containing Patents (Class 420/587)
-
Patent number: 6299835Abstract: Cadmium-free hard solders having working temperatures of less than 630° C., which are easily workable and yield ductile soldered joints, are composed of 30 to 60% by weight of silver, 10 to 36% by weight of copper, 15 to 32% by weight of zinc, 0.5 to 7% by weight of gallium, 0.5 to 7% by weight of tin and 0 to 5% by weight of indium.Type: GrantFiled: July 12, 1994Date of Patent: October 9, 2001Assignee: Degussa AGInventors: Wolfgang Weise, Willi Malikowski, Dieter Kaufmann, Harald Krappitz
-
Patent number: 6210636Abstract: A family of copper-nickel-zinc-palladium alloys for sliding and static electrical contact applications comprises, on a weight percent basis, about 15-65 percent copper, up to about 30 percent nickel, about 5-30 percent zinc, about 5-45 percent palladium, and up to about 35 percent silver. One embodiment of the family of alloys is age hardenable and provides alloys with hardness values in excess of 300 Knoop (100g load) and significant improvement in high-temperature properties, formability, tensile strength and ductility. A second embodiment provides an alloy with increased strength and hardness in the wrought condition, relative to the prior art Cu—Ni—Zn alloys.Type: GrantFiled: April 30, 1999Date of Patent: April 3, 2001Assignee: The J. M. Ney CompanyInventor: Arthur S. Klein
-
Patent number: 6086683Abstract: Ag and Cu are added to a base material of a Sn/Pb/Bi composition. Since Bi is contained in greater quantities in Sn/Pb, the alloy has a low melting point (120 to 150.degree. C.) and is surely melted at reflow temperatures from 170 to 200.degree. C. Preferably, the addition amount of Ag is from 0.1 to 5 wt % and the addition amount of Cu is from 0.05 to 1.0 wt %. A low-melting alloy having all the required performances and excellent with view points of cost and safety and a cream solder using a powder of the alloy can be obtained.Type: GrantFiled: July 12, 1996Date of Patent: July 11, 2000Assignees: Toshiba Corp., Alpha Metals of Japan Ltd.Inventors: Tadahiro Toki, Masayoshi Yamaguchi, Koichi Aono, Hirofumi Sakamoto, Yasuhide Ogasawara, Masuo Hotta, Akihiro Kiyosue, Takao Enomoto
-
Patent number: 6074604Abstract: Provided is a brazing filler metal for brazing stainless steel at low temperatures so as not to adversely affect the properties of the stainless steel, and without producing any brittleness in the brazed joint. The brazing filler metal essentially consists of 5 to 30 weight % of Mn or Sn, 20 to 70 weight % of Cu, inevitable impurities, and a balance of Ni. The brazing filler metal may further include no more than 3 weight % of Cr and/or Si.Type: GrantFiled: May 29, 1998Date of Patent: June 13, 2000Assignee: NHK Spring Co., Ltd.Inventors: Shinji Saito, Takashi Kayamoto
-
Patent number: 6059901Abstract: Bismuth bearing copper-nickel-manganese-zinc corrosion and gall resistant castable alloy, particularly for use in food processing machinery, with the following weight percentage range:Nickel=12-28Manganese=12-28Zinc=12-28Aluminum=0.5-2.00Bismuth=2-6Phosphorus=0-0.3Tin =0-1.5Iron=0-1.Type: GrantFiled: September 21, 1998Date of Patent: May 9, 2000Assignee: Waukesha Foundry, Inc.Inventor: Sudhari Sahu
-
Patent number: 5962156Abstract: A nickel-metal hydride storage battery having a high capacity and excellent cycle life is disclosed. The battery employs, as its material for the negative electrode, a hydrogen storage alloy powder having a composition represented by the general formula Zr.sub.1-x M3.sub.x Mn.sub.a Mo.sub.b Cr.sub.c M1.sub.d M2.sub.e Ni.sub.f, where M1 represents at least one element selected from the group consisting of V, Nb and rare earth elements, M2 represents at least one element selected from the group consisting of Fe, Co and Cu, and M3 represents at least one element selected from the group consisting of Ti and Hf, and where 0.ltoreq.x.ltoreq.0.3, 0.3.ltoreq.a.ltoreq.0.7, 0.01.ltoreq.b.ltoreq.0.2, 0.05.ltoreq.c.ltoreq.0.3, 0.ltoreq.d.ltoreq.0.1, 0.ltoreq.e.ltoreq.0.2, 0.8.ltoreq.f.ltoreq.1.3, and 1.6.ltoreq.a+b+c+d+e+f.ltoreq.2.2, and wherein said hydrogen storage alloy has at least one of a Laves phase having a crystal structure of the MgCu.sub.2 -type (C15) and a Laves phase having a crystal structure of the MgZn.Type: GrantFiled: February 19, 1997Date of Patent: October 5, 1999Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yoichi Izumi, Yoshio Moriwaki, Katsumi Yamashita, Takashi Tokuhiro
-
Patent number: 5945066Abstract: A Zn--Cu based alloy is disclosed including from about 11 to about 50 wt. % of Cu, from about 0.1 to about 10 wt. % of Al, from about 0.01 to about 1.0 wt. % of Mg, and from about 0.001 to about 0.1 wt. % of at least one member of the group consisting of Ti, Pb, Sn, Cd, Ni, Mn, Cr, Fe and mixtures thereof; and the balance being Zn. The Ti component may be added via an Al--Ti alloy. This alloy yields high-part-number castings especially useful in the automotive parts field.Type: GrantFiled: December 30, 1997Date of Patent: August 31, 1999Inventors: James D. Griffin, David A. Griffin, Michael H. Griffin
-
Patent number: 5851690Abstract: A hydrogen absorbing alloy for use in an environment where the alloy has the possibility of contacting oxygen is capable of inhibiting impairment of the hydrogen absorbing ability thereof when coming into contact with oxygen. The alloy has a composition represented in atomic ratio by Ti.sub.1-x Y.sub.x Mn.sub.y wherein x and y are in the range of 0<x.ltoreq.0.2 and 1.5.ltoreq.y.ltoreq.2.0, respectively, and comprises a C14-type crystal structure of Laves phase, the Laves phase having a segregaton phase of high Y concentration. Ti can be replaced by Hf and/or Zr within the range of over 0 to not greater than (1-x)/2 included in 1-x for the Ti atom. Mn can be replaced by V or Fe within the range of over 0 to not greater than y/2 included in y for the Mn atom.Type: GrantFiled: August 22, 1997Date of Patent: December 22, 1998Assignee: Sanyo Electric Co., Ltd.Inventors: Yumiko Nakamura, Hiroshi Nakamura, Maki Kamikawa, Hiroshi Watanabe, Shin Fujitani, Ikuo Yonezu
-
Patent number: 5843243Abstract: A wear-resistant copper-based alloy includes 10.0 to 30.0% by weight Ni, 2.0 to 15.0% by weight Fe, 2.0 to 15.0% by weight Co, 0.5 to 5.0% by weight Si, 1.0 to 10.0% by weight Cr, 2.0 to 15.0% by weight at least one first optional element selected from the group consisting of Mo, Ti, Zr, Nb and V, at least one second optional element selected from the group consisting of C and O, and the balance of Cu and inevitable impurities. A carbon content "X" and an oxygen content "Y" satisfy the following relationships; namely: 0.ltoreq."X".ltoreq.0.5, 0.ltoreq."Y".ltoreq.0.05, and "Y".gtoreq.(-0.8)("X")+0.04. The wear-resistant copper-based alloy enables to improve the toughness of weld bead, and to inhibit weld bead from cracking effectively in the solidifying process of a building-up operation.Type: GrantFiled: February 14, 1996Date of Patent: December 1, 1998Assignees: Toyota Jidosha Kabushiki Kaisha, Fukuda Metal Foil & Powder Co., Ltd.Inventors: Minoru Kawasaki, Noboru Takayanagi, Hiromi Nomura, Akio Sato, Isaka Kanazawa, Kensuke Hidaka, Shozo Nagai
-
Patent number: 5833774Abstract: A silver/palladium alloy for electrical contact applications comprises, on a weight percent basis, 20-50 silver, 20-50 palladium, 20-40 copper, less than 1.0 nickel, 0.1-5 zinc, 0.01-0.3 boron, and up to 1 percent by weight of modifying elements selected from the group consisting of rhenium, ruthenium, gold, and platinum. The combination of zinc and boron provides an alloy of high strength and hardness and permits the use of lower amounts of both copper and palladium.Type: GrantFiled: April 10, 1997Date of Patent: November 10, 1998Assignee: The J. M. Ney CompanyInventors: Arthur S. Klein, Edward F. Smith, III
-
Patent number: 5807468Abstract: An electrode having an excellent corrosion resistance and long service life even in a severe corrosive environment such as in NaCl solutions for anode electrolysis in which chlorine gas or the like is produced at a high potential from the alloy surface. The electrode of the invention is provided using a precious metal-based amorphous alloy which has a good plasticity processibility and is applicable to a large-sized component. The object is implemented by provision of an electrode material for anode electrolysis which utilizes a precious metal-based amorphous alloy which satisfies the general formula NM.sub.100-a-b-c Ni.sub.a Cu.sub.b P.sub.c wherein NM comprises one or two precious metal elements selected from Pd and Pt; a, b and c being atomic percent, satisfy that 30.ltoreq.a+b.ltoreq.45,3.ltoreq.b/a.ltoreq.7, and 18.ltoreq.c.ltoreq.25, respectively; Pt is contained from 10 to 30 atom percent (at. %); and wherein a temperature width .DELTA.Tx in the supercooled liquid region (.DELTA.Type: GrantFiled: April 9, 1997Date of Patent: September 15, 1998Assignee: Japan Science and Technology CorporationInventors: Takumi Sakamoto, Takeshi Suto, Takahiro Aoki, Nobuyuki Nishiyama, Akihisa Inoue, Hisamichi Kimura, Yasusi Takahagi, Takeshi Kamoshida, Kazuya Saito
-
Patent number: 5738953Abstract: As an active material for its negative electrode, a hydrogen storage alloy for a Ni/H battery has the compositionMmNi.sub.v Al.sub.w Mn.sub.x Co.sub.y M.sub.z,where Mm is a misch metal, M is Fe, Cu, or a mixture of Fe and Cu, and where0.1.ltoreq.z.ltoreq.0.4,0.2.ltoreq.y.ltoreq.0.4,0.3.ltoreq.w.ltoreq.0.5,0.2.ltoreq.x.ltoreq.0.4, and4.9.ltoreq.v+w+x+y+z.ltoreq.5.1.The partial substitution of Co by M, in conjunction with a special production method including the steps of atomizing the molten alloy, followed by heat-treatment and pulverization, leads to an alloy having a particularly high cycle lifetime and discharge capability.Type: GrantFiled: April 5, 1996Date of Patent: April 14, 1998Assignee: Varta Batterie AktiengesellschaftInventors: Frank Lichtenberg, Uwe Kohler, Klaus Kleinsorgen, Andreas Folzer, Alexander Bouvier
-
Patent number: 5714117Abstract: Method and apparatus for making a Cu-Cr melt involves melting Cu-bearing alloy component in a melting vessel disposed in ambient air atmosphere, retaining Cr-bearing alloy component in an inverted ceramic crucible held submerged in the melted Cu-bearing alloy component, introducing inert gas into the melted Cu-bearing alloy component, and flowing the melted Cu-bearing alloy component in the melting vessel through openings in the submerged crucible to contact the Cr-bearing alloy component.Type: GrantFiled: January 31, 1996Date of Patent: February 3, 1998Assignee: Iowa State University Research Foundation, Inc.Inventors: Paul M. Berge, Edwin D. Gibson, Seong-Tcho Kim, John D. Verhoeven
-
Patent number: 5658401Abstract: A copper-zinc alloy for semi-finished products and articles which are highly loaded and subjected to extreme wear especially synchronizing rings. The alloy possesses a composition of 40 to 65% Cu, 8 to 25% Ni, 2.5 to 5% Si, 0 to 3% Al, 0 to 3% Fe, 0 to 2% Mn and 0 to 2% Pb, with the balance being zinc and unavoidable impurities. The Ni:Si ratio is about 3 to 5:1, and the structure consists of at least 75% .beta.-phase, with the balance .alpha.-phase, in the absence of a .gamma.-phase. Nickel silicides occur predominantly as a round intermetallic phase. The alloy provides quite substantially higher levels of resistance to wear.Type: GrantFiled: December 29, 1995Date of Patent: August 19, 1997Assignee: Diehl GmbH & Co.Inventors: Norbert Gaag, Peter Ruchel
-
Patent number: 5637160Abstract: There is provided a machinable .alpha.+.beta. brass containing bismuth and phosphorous. By maintaining the phosphorous content within a critical range, the alloy exhibits good elevated temperature tensile elongation in the temperature range of 100.degree. C.-350.degree. C. without a decrease in machinability due to phosphide formation. In preferred embodiments, the alloy further contains a tin addition for enhanced corrosion resistance. The combination of tin and phosphorous provides enhanced corrosion resistance to the alloy than could be predicted from either addition alone.Type: GrantFiled: July 20, 1994Date of Patent: June 10, 1997Assignee: Olin CorporationInventors: Andrew J. Brock, John F. Breedis, Jack Crane, Julius C. Fister, Frank N. Mandigo, David D. McDevitt, Mark N. Pearman, Ronald N. Caron
-
Patent number: 5618359Abstract: At least quaternary alloys form metallic glass upon cooling below the glass transition temperature at a rate less than 10.sup.3 K/s. Such alloys comprise titanium from 19 to 41 atomic percent, an early transition metal (ETM) from 4 to 21 atomic percent and copper plus a late transition metal (LTM) from 49 to 64 atomic percent. The ETM comprises zirconium and/or hafnium. The LTM comprises cobalt and/or nickel. The composition is further constrained such that the product of the copper plus LTM times the atomic proportion of LTM relative to the copper is from 2 to 14. The atomic percentage of ETM is less than 10 when the atomic percentage of titanium is as high as 41, and may be as large as 21 when the atomic percentage of titanium is as low as 24. Furthermore, when the total of copper and LTM are low, the amount of LTM present must be further limited. Another group of glass forming alloys has the formula(ETM.sub.1-x Ti.sub.x).sub.a Cu.sub.b (Ni.sub.1-y Co.sub.y).sub.cwherein x is from 0.1 to 0.3, y.cndot.Type: GrantFiled: December 8, 1995Date of Patent: April 8, 1997Assignee: California Institute of TechnologyInventors: Xianghong Lin, Atakan Peker, William L. Johnson
-
Patent number: 5531962Abstract: Cadmium-free brazing solders with working temperatures under 630.degree. C. containing 45 to 80 wt. % silver, 14 to 25 wt. % copper 10 to 25 wt. % gallium, 1 to 7 wt. % zinc and 0 to 5 wt. % indium and/or tin. The alloys have good cold workability and ductility.Type: GrantFiled: August 3, 1994Date of Patent: July 2, 1996Assignee: Degussa AktiengesellschaftInventors: Wolfgang Weise, Alexander Voelcker, Dieter Kaufmann, Willi Malikowski, Joerg Beuers, Harald Krappitz
-
Patent number: 5532076Abstract: A hydrogen storage alloy preferably used for electrodes in alkaline rechargeable battery is of the general formula: Zr.sub.1.2-a Ti.sub.a Mn.sub.v Al.sub.w Ni.sub.x M.sub.y Cr.sub.z wherein M represents at least one element selected from the group consisting of Si, Zn, Sn, Fe, Mo, Cu and Co; and wherein 0.1.ltoreq.a<1.2, 0.4.ltoreq.v.ltoreq.1.2, 0<w.ltoreq.0.3, 0.8.ltoreq.x.ltoreq.1.6, 0.ltoreq.y.ltoreq.0.2, 0.ltoreq.z.ltoreq.0.3, and 1.7.ltoreq.(v+w+x+y+z).ltoreq.2.7. The alloy has at least one of a C14-type Laves phase of a crystal structure similar to that of MgZn.sub.2 and a C15-type Laves phase of a crystal structure similar to that of MgCu.sub.2 as a main alloy phase.Type: GrantFiled: March 29, 1994Date of Patent: July 2, 1996Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yasuharu Yamamura, Hajime Seri, Yoichiro Tsuji, Naoko Owada, Tsutomu Iwaki
-
Patent number: 5514334Abstract: This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified position and improving a continuous workability and stability and to a connection material to be used in the connecting method, wherein any one of Pb, Sn, In is applied as a major element and the alloy having additive elements mixed with it is made as a fine wire under a rapid cooling and condensation process and further to a semiconductor device made by the above-mentioned connecting method.Type: GrantFiled: September 30, 1994Date of Patent: May 7, 1996Assignee: Tanaka Denshi Kogyo Kabushiki KaishaInventor: Toshinori Ogashiwa
-
Patent number: 5489417Abstract: Spray cast copper-manganese-zirconium alloys are disclosed. In one embodiment, the alloy is spray cast in nitrogen and contains from about 1 ppm to about 20 ppm of dissolved nitrogen. In a second embodiment, the alloy contains an addition selected from the group consisting of chromium, titanium, erbium and mixtures thereof. The alloys are useful for sound damping as the combination of zirconium and the addition inhibits degradation of the specific damping capacity of the alloy.Type: GrantFiled: April 14, 1994Date of Patent: February 6, 1996Assignee: Olin CorporationInventors: William G. Watson, Harvey P. Cheskis, Sankaranarayanan Ashok
-
Patent number: 5486225Abstract: A process for producing finely divided 20 to 500 angstrom metal particles, metals with oxide coatings or metal oxides using an alkalide or electride in a non-reactive solvent is described. The process produces various forms of the metal depending upon the oxidizability of the metal initially produced by the process. The process is useful for producing catalysts, alloys, colloidal solutions, semi-conductors and the like.Type: GrantFiled: April 4, 1994Date of Patent: January 23, 1996Assignee: Board of Trustees operating Michigan State UniversityInventors: James L. Dye, Ahmed S. Ellaboudy, Kuo-Lih Tsai
-
Patent number: 5484569Abstract: A silver/palladium alloy for electronic applications comprises, on a percent by weight basis, 35-60 silver, 20-44 palladium, 5-20 copper, 1-7 nickel, 0.1-5 zinc, to 0.18 boron, up to 0.05 rhenium and up to 1 percent by weight of modifying elements selected from the group consisting of ruthenium, zirconium and platinum. This alloy exhibits high oxidation and tarnish resistance and is formed into wrought electronic components such as contacts and brushes to provide low noise.Type: GrantFiled: August 12, 1994Date of Patent: January 16, 1996Assignee: The J. M. Ney CompanyInventors: Arthur S. Klein, Edward F. Smith, III
-
Patent number: 5441696Abstract: A copper-nickel based alloy, which comprises 3 to 25 wt % of Ni, 0.1 to 1.5 t % of Mn, 0.0001 to 0.01 wt % of B and the rest being Cu and an unavoidable element.Type: GrantFiled: June 26, 1992Date of Patent: August 15, 1995Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Kenji Kubosono, Iwao Asamizu, Masazumi Iwase, Toshihiro Kurita
-
Patent number: 5409663Abstract: An indium-free, gold-colored, tarnish and corrosion-resistant alloy having no greater than 10% by weight gold and a color value, as measured according to the Cielab Color Measurement System, of approximately L=87.4, a=1.1, b=15.3. The alloy comprises 28-35% copper, 19.5-22.5% silver, 6-11% palladium, 22-32% zinc, 0.1-1% aluminum, and 0.5-3% platinum.Type: GrantFiled: May 3, 1994Date of Patent: April 25, 1995Inventors: Arthur D. Taylor, Norman J. LaMontagne, Jr., Malcolm Warren
-
Patent number: 5393723Abstract: The catalyst is provided for improving the performance of hydrocarbon fuels used in internal combustion engines. The catalyst is a based metal alloy catalyst including tin, antimony, lead, mercury and thallium in the following proportions by weight percent:Sb 18-20Pb 4.5-5.5Hg 12-14Tl 0.1-0.5and the balance consisting essentially of Sn. The catalyst operates at ambient temperatures and atmospheric pressure. The catalyst is intended to pretreat fuel before combustion and may be disposed in the fuel tank, fuel line or return fuel line.Type: GrantFiled: May 11, 1993Date of Patent: February 28, 1995Inventor: Anthony W. Finkl
-
Patent number: 5384089Abstract: The disclosure relates to yellow karat gold metal alloys particularly suited for the casting of jewelry articles such as rings, bracelets, earrings, and the like. The alloys include varying amounts of germanium up to about one percent by weight of the total volume of the alloy which serves as an oxygen scavenger, and which may be recycled along with scrap alloy material after casting. By varying the amounts of the grain refiners, it is possible to totally eliminate the use of deoxidizing agents such as silicon and boron and the accompanying disadvantageous effects of these elements, to result in a superior cast structure.Type: GrantFiled: May 2, 1994Date of Patent: January 24, 1995Inventor: Lawrence H. Diamond
-
Patent number: 5384090Abstract: This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified position and improving a continuous workability and stability and to a connection material to be used in the connecting method, wherein any one of Pb, Sn, In is applied as a major element and the alloy having additive elements mixed with it is made as a fine wire under a rapid cooling and condensation process and further to a semiconductor device made by the above-mentioned connecting method.Type: GrantFiled: October 30, 1992Date of Patent: January 24, 1995Assignee: Tanaka Denshi Kogyo Kabushiki KaishaInventor: Toshinori Ogashiwa
-
Patent number: 5368814Abstract: The lead free alloy is a low solidus temperature, multi-component solder alloy containing at least about 50 weight percent Bi, up to about 50 weight percent Sn (basis total Sn and Bi), and an effective amount of a physical and mechanical property enhancing third component. The third component can be Cu, In, Ag, and combinations of Cu and Ag.Type: GrantFiled: June 16, 1993Date of Patent: November 29, 1994Assignee: International Business Machines, Inc.Inventors: Stephen G. Gonya, James K. Lake, Randy C. Long, Roger N. Wild
-
Patent number: 5341981Abstract: Cadmium-free brazing solders with working temperatures under 630.degree. C. containing 45 to 80 wt. % silver, 5 to 13 wt. % copper, 10 to 25 wt. % gallium, 8 to 20 wt. % zinc, and 0 to 5 wt. % indium and/or tin.Type: GrantFiled: September 1, 1993Date of Patent: August 30, 1994Assignee: Degussa AktiengesellschaftInventors: Wolfgang Weise, Alexander Voelcker, Dieter Kaufmann, Willi Malikowski, Joerg Beuers, Harald Krappitz
-
Patent number: 5340529Abstract: A gold based jewelry alloy is disclosed of preferably the 10 to 18 karat range containing primarily gold, copper, zinc and silver. This alloy is formulated to create a unique color, a mid-range hue with a fresh, soft appearance that is very complimenting to a variety of skin tones and gem stones. Aside from characteristics of appearance, the alloy disclosed has an increased hardness over standard yellow alloys for longer wear and improved polish holding characteristics. The alloy disclosed has excellent castability and formability and responds well to typical jewelry manufacturing processes (i.e., tooling, stone setting, soldering, remelting, forging and plating). The alloy contains about 40% to about 76% gold, about 20% to about 52% copper, about 0% to about 12% zinc and about 0% to about 12% silver.Type: GrantFiled: July 1, 1993Date of Patent: August 23, 1994Inventors: Troy C. DeWitt, Vicki A. DeWitt
-
Patent number: 5336444Abstract: A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particularly copper filled via) and ceramic upon sintering. The novel via composition exhibits enhanced adhesion to the ceramic. A sintering process by which shrinkage of the novel via composition is controlled and adhesion is improved is also disclosed.Type: GrantFiled: May 29, 1992Date of Patent: August 9, 1994Assignee: International Business Machines CorporationInventors: Jon A. Casey, Renuka S. Divakaruni, Govindarajan Natarajan, Srinivasa S. N. Reddy, Manfred Sammet
-
Patent number: 5330713Abstract: In accordance with this invention, a gold colored tarnish and corrosive resistant alloy is provided which includes the following: 6 to 20 percent by weight gold, 5 to 10 percent by weight of indium, 5 to 12 percent by weight of palladium, 23 to 40 percent copper, 5 to 10 percent by weight zinc, and 23 to 40 percent by weight silver. It has been found that the aforesaid alloys are sufficiently malleable to be rolled or stamped without fracturing.Type: GrantFiled: December 9, 1991Date of Patent: July 19, 1994Inventor: Daniel Davitz
-
Patent number: 5242511Abstract: A copper alloy composition comprising 100 parts by weight of powder of copper alloy represented by the general formula Ag.sub.x Cu.sub.y (wherein x and y are atomic ratio values; 0.001.ltoreq..times..ltoreq.0.999, 0.001.ltoreq.y.ltoreq.0.999, x+y=1), 5 to 200 parts by weight of one or more organic binders and 0.01 to 100 parts by weight of an additive capable of removing copper oxide; and a paste for screen printing, electromagnetic shielding, an electrically conductive additive, a paste for electrode and a paste for through hole, which are obtained by using said composition.Type: GrantFiled: October 18, 1991Date of Patent: September 7, 1993Assignee: Asahi Kasei Kogyo Kabushiki KaishaInventors: Akinori Yokoyama, Tsutomu Katsumata, Hitoshi Nakajima
-
Patent number: 5240172Abstract: White solder alloys for dental and jewelry parts, with working temperatures around 1000.degree. C., contain 38 to 70% by weight gold, 6 to 20% by weight palladium, 8 to 40% by weight silver, 1 to 6% by weight iron and/or cobalt, 0 to 10% by weight copper, 0-5% each by weight indium, zinc and tin, 0 to 4% each by weight gallium and germanium, ruthenium and/or rhenium. The sum of the contents of tin, zinc, indium, gallium and germanium can be between 1 and 5% by weight.Type: GrantFiled: July 6, 1992Date of Patent: August 31, 1993Assignee: Degussa AktiengesellschaftInventors: Rudi Steinke, Stefan Schittny, Bernd Kempf, Werner Groll
-
Patent number: 5188799Abstract: A wear-resistant copper-base alloy having superior self-lubricity includes, by weight %,Ni: 10.0 to 30.0%;Si: 0.5 to 3%;Co: 2.0 to 15.0%;at least one metal selected from the group consisting of Mo, W, Nb and V:2.0 to 15.0%; andthe balance being Cu and unavoidable impurities, and having a structure in which hard phase grains containing 5 vol% or more of silicide of at least one metal selected from the group consisting of Mo, W, Nb and V are uniformly dispersed in an amount of 10 to 60 vol% in a copper-rich matrix, to which 2.0 to 15.0% of Fe and/or 1.0 to 10.0% of Cr may be further added.Type: GrantFiled: March 19, 1992Date of Patent: February 23, 1993Assignees: Toyota Jidosha Kabushiki Kaisha, Kabushiki Kaisha Toyota Chuo KenkyushoInventors: Kazuhiko Mori, Minoru Kawasaki, Shin Yoshida, Hiroyuki Murase, Takashi Saito, Kouji Tanaka, Yoshio Shimura
-
Patent number: 5162100Abstract: An aluminum-based bearing alloy of the invention comprises 3-40% Sn, 0.1-10% Pb, 0.1-5% Cu, 0.1-3% Sb, total 0.05-1% of Ti and B which satisfy the equation: B/Ti+B=0.1 to 0.35, and the balance being essentially Al. The aluminum-based bearing alloy according to the present invention has excellent fatigue resistance and anti-seizure property.Type: GrantFiled: August 27, 1991Date of Patent: November 10, 1992Assignee: Daido Metal Company, Ltd.Inventors: Tadashi Tanaka, Masaaki Sakamoto, Koichi Yamamoto, Yoshiaki Sato, Tohru Kato
-
Patent number: 5122206Abstract: A precipitation strengthening type nickel base single crystal alloy, which consists essentially of, on a weight percent basis,10-30% chromium,0.1-5% niobium,0.1-8% titanium,0.1-8% aluminum,optionally one or more components selected from the group consisting of 0.1-3% tantalum, 0.05-0.5% copper, 0.05-3% hafnium, 0.05-3% rhenium, 0.05-3% molybdenum, 0.05-3% tungsten, 0.05-0.5% boron, 0.05-0.5% zirconium, andthe remainder being nickel and incidental impurities, and exhibits a narrow solidification temperature range.Type: GrantFiled: May 9, 1990Date of Patent: June 16, 1992Assignee: Mitsubishi Metal CorporationInventors: Saburo Wakita, Junji Hoshi, Toshiyuki Shimamura, Akira Mitsuhashi, Toshio Yonezawa
-
Patent number: 5082625Abstract: Herein disclosed, as a Ni-based corrosion-resistant alloy to be used for build-up welding, is an alloy which contains 0.5 to 2.3 wt % of copper, 0.1 to 5.3 wt % of molybdenum, 1.0 to 29.0 wt % of at least one carbide forming element except molybdenum, 1.0 to 30.0 wt % of iron, 0.6 to 2.5 wt % of silicon, 0.008 up to 1.0 wt % of boron, and 0.04 to 1.6 wt % of carbon, the remainder being composed of nickel and incidental impurities.Type: GrantFiled: December 6, 1989Date of Patent: January 21, 1992Assignee: Toyota Jidosha Kabushiki KaishaInventors: Sinji Kato, Soya Takagi, Minoru Kawasaki, Kazuhiko Mori, Katsuhiko Ueda
-
Patent number: 5075076Abstract: The invention relates to a novel palladium-based alloy.This palladium-based alloy comprises tin in an amount, preferably of 5 to 20% by weight, which is sufficient to impart an acceptable resistance to corrosion by molten glass, preferably being essentially equivalent to that of platinum-rhodium 10% alloys.An alloy of this type can be used in the glass industry for making components which come into contact with molten glass, which preferably essentially contains no oxides less stable than tin oxide, such as lead oxide, because it has an excellent resistance to corrosion by molten glass and is much less expensive than the platinum-rhodium 10% alloy normally used. Moreover, by the addition of at least one element selected from platinum (0-50% by weight), rhodium (0-20% by weight), iridium (0-20% by weight) and ruthenium 0-20% by weight), the mechanical strength at high temperature, especially the creep strength, is significantly improved.Type: GrantFiled: January 8, 1990Date of Patent: December 24, 1991Assignee: Comptoir Lyon-Alemand-Louyot, Societe AnonymeInventors: Jean-Paul Guerlet, Jean-Pierre Hilger
-
Patent number: 5051235Abstract: The invention relates to a novel palladium-based alloy.This palladium-based alloy comprises at least one additional element selected from indium, bismuth, silver and copper, in an amount sufficient to impart an acceptable resistance to corrosion by molten glass, preferably being essentially equivalent to that of platinum-rhodium 10% alloys.An alloy of this type can be used in the glass industry for making components which come into contact with molten glass, which preferably essentially contains no oxides less stable than the oxide of the additional element, such as lead oxide, because is has an excellent resistance to corrosion by molten glass and is less expensive than the platinum-rhodium 10% alloy normally used. Moreover, by the addition of at least one element selected from platinum (0-50% by weight), rhodium (0-20% by weight), iridium (0-20% by weight), ruthenium (0-20% by weight) and tin (0-20%), the mechanical strength at high temperature, especially the creep strength, is significantly improved.Type: GrantFiled: January 8, 1990Date of Patent: September 24, 1991Assignee: Comptoir Lyon-Alemand-Louyot, Societe AnonymeInventors: Jean-Paul Guerlet, Dan Weber
-
Patent number: 5045411Abstract: A gold based alloy containing gold, silver, copper, zinc, silicon, iron, boron, nickel and indium for the manufacture of gold articles is described which has a lower melting point, extended remelting capabilities, high resistance to cracking, improved color consistency and increased ductility.Type: GrantFiled: January 10, 1990Date of Patent: September 3, 1991Assignee: P.M. Refining, Inc.Inventors: Arthur D. Taylor, Malcolm Warren, Perry H. Berger
-
Patent number: 5039479Abstract: A silver alloy composition exhibiting the desirable properties of reduced fire scale, reduced porosity, reduced grain size and reduced oxide formation when heated, consists essentially of the following parts by weight: about 89-93.5% silver, about 0.02-2% silicon, about 0.001-2% boron, about 0.5-5% zinc, about 0.5-6% copper, about 0.25-6% tin, and about 0.01-1.25% indium. A master alloy composition adapted to be alloyed with silver, consisting essentially of the following parts by weight: about 5-35% zinc, about 5-80% tin, about 5-35% copper, about 0.05-14% silicon, about 0.01-1.25% indium, and about 0.05-17% boron.Type: GrantFiled: September 5, 1990Date of Patent: August 13, 1991Assignee: United Precious Metal Refining Co., Inc.Inventors: Melvin Bernhard, James T. Sivertsen
-
Patent number: 5011658Abstract: Low melting temperature copper-containing solders are disclosed for soldering and rework on copper surfaces. The amount of copper required in the solder in order to inhibit dissolution of the copper surface to be soldered has been found to be dopant level, below the binary tin-copper eutectic point.Type: GrantFiled: May 31, 1989Date of Patent: April 30, 1991Assignee: International Business Machines CorporationInventor: Daniel S. Niedrich
-
Patent number: 5006054Abstract: Low density, high temperature and aluminum-rich intermetallic alloys displaying excellent elevated temperature properties, including oxidation resistance, are disclosed. Based on the aluminum/titanium system, specifically modifications of Al.sub.3 Ti compositions, useful alloys are derived from changes in crystal structure and properties effected by selected-site substitution alloying with manganese and/or chromium, and, where used, vanadium, or equivalent site-substituting alloying elements.Type: GrantFiled: March 30, 1989Date of Patent: April 9, 1991Assignee: Technology Development CorporationInventor: Donald E. Nikkola
-
Patent number: 5002731Abstract: Disclosed is a cobalt-base alloy that has a valuable combination of both corrosion- and wear-resistant properties. The alloy nominally contains, in percent by weight, 25.5 chromium, 8.5 nickel, 3.0 iron, 5 molybdenum, 2 tungsten, 0.40 silicon, 0.75 manganese, 0.06 carbon, 0.08 nitrogen and the balance cobalt plus normal impurities normally found in alloys of this class. The alloy may also contain copper and certain "carbide formers" (i.e., columbium, tantalum, titanium, vanadium and the like) to tie up excess carbon and/or nitrogen that may be present.Type: GrantFiled: April 17, 1989Date of Patent: March 26, 1991Assignee: Haynes International, Inc.Inventors: Paul Crook, Aziz I. Asphahani, Steven J. Matthews
-
Patent number: 4948557Abstract: A gold colored, tarnish and corrosion resistant alloy is disclosed, usable for jewelry, dental purposes and the like. The alloy consists essentially of 24 to 27 percent palladium, 19 to 22 percent indium, 5 to 30 percent copper, 1 to 20 percent gold, and the balance is essentially silver.Type: GrantFiled: February 1, 1989Date of Patent: August 14, 1990Inventor: Daniel Davitz
-
Patent number: 4909985Abstract: Economical, tarnish-resistant precious-metal alloys for dentistry consisting essentially of 36 to 39% silver, 28 to 32.5% gold, 17 to 19.5% palladium, 0 to 0.1% iridium, 9.5 to 10.5% copper, 0.5 to 3% indium and 0.5 to 2.5% zinc, whereby the sum of the indium and zinc contents does not exceed a maximum of 4%.Type: GrantFiled: June 2, 1989Date of Patent: March 20, 1990Assignee: Degussa AktiengesellschaftInventors: Rudolf Kropp, Wolfgang Kuerten
-
Patent number: 4902342Abstract: A method and an apparatus for the manufacture of non-allergy creating objects, especially objects of metal for direct contact with the skin of a human body, for instance jewelery, watches, glasses etc. whereby completely pure metals, especially precious metals like gold, silver, platinum, palladium, rodium etc. are alloyed with optimum pure zinc, copper, aluminum, nickel or chrome, and whereby any and all treatments both in hot and cold stage are made without access of air and without any contact with extraneous substances like salts or acids. Preferably all melting and heating is made under a protective gas.Type: GrantFiled: September 21, 1987Date of Patent: February 20, 1990Inventor: Hans G. E. Wahlbeck
-
Patent number: 4895701Abstract: A gold colored, tarnish and corrosion resistant gold free alloy is disclosed, usable for jewelry, dental purposes and the like. The alloy consists essentially of 24 to 27 percent palladium, 19 to 22 percent indium, 5 to 30 percent copper, and the balance is essentially silver.Type: GrantFiled: January 9, 1989Date of Patent: January 23, 1990Inventor: Daniel Davitz
-
Patent number: 4880482Abstract: A highly corrosion-resistant amorphous Cu alloys with at least one element selected from the group of Ta and Nb and other Cu-Ta alloys with at least one element selected from the group of Nb, Ti and Zr, wherein the total content of alloying elements other than Cu ranges from 15 to 85 at %.Type: GrantFiled: April 19, 1988Date of Patent: November 14, 1989Assignees: Mitsui Engineering & Shipbuilding Co., Ltd., Koji HashimotoInventors: Koji Hashimoto, Kimikado Miura, Katsuhiko Asami, Asahi Kawashima