Abstract: The invention is a mold apparatus for making multi-component products. The apparatus includes an elongate turret, a plurality of product connection pairs attached on opposite sides of the turret, a first mold disposed proximate to the turret and a second mold disposed on the opposite side of the turret. The first mold has a plurality of cavities for molding a first molded layer of the multi-component product, and the second mold has cavities for molding a second layer onto the first molded layer. The turret is rotatable between the first mold and the second mold by rotation about its longitudinal axis of the turret.

Abstract: A process and an apparatus for making a papermaking belt are provided, the belt comprising a reinforcing structure and a resinous framework joined together. The preferred continuous process comprises the steps of depositing a flowable resinous material onto a patterned molding surface; continuously moving the molding surface and the reinforcing structure at a transport velocity such that at least a portion of the reinforcing structure is in a face-to-face relationship with a portion of the molding surface; transferring the flowable resinous material from the molding surface onto the reinforcing structure; causing the flowable resinous material and the reinforcing structure to join together; and solidifying the resinous material thereby forming the resinous framework joined to the reinforcing structure.

Abstract: Method and apparatus for manufacturing a synthetic resin-made hollow member incorporating an intermediate element are provided which enable operations of molding half bodies, abutting and joining the half bodies together, and molding an intermediate element in a series of steps, and which eliminate the necessity of such a manual work as may otherwise be required in incorporating the intermediate element into the half bodies. A pair of rotary injection molding dies are used which can be opened and closed relative to each other and are rotatable relative to each other over an angle of 60° for each turn, each die having a half body molding section including one male molding portion and two female molding portions in the direction of rotation for each rotational run over an angle of 120°, each die also having an intermediate element molding portion provided between specified half body molding portions in the direction of each rotational run over an angle of 120°.

Abstract: Method and apparatus for manufacturing a synthetic resin-made hollow member incorporating an intermediate element are provided which enable operations of molding half bodies, abutting and joining the half bodies together, and molding an intermediate element in a series of steps, and which eliminate the necessity of such a manual work as may otherwise be required in incorporating the intermediate element into the half bodies. A pair of rotary injection molding dies are used which can be opened and closed relative to each other and are rotatable relative to each other over an angle of 60° for each turn, each die having a half body molding section including one male molding portion and two female molding portions in the direction of rotation for each rotational run over an angle of 120°, each die also having an intermediate element molding portion provided between specified half body molding portions in the direction of each rotational run over an angle of 120°.

Abstract: The method of manufacturing semiconductor devices is capable of efficiently manufacturing semiconductor devices and preventing production of bad products. The method is executed in a molding machine including an tipper die and a lower die, in one of which a plurality of cavities corresponding to resin-molded parts of the semiconductor devices are formed. And, the method comprises the steps of: covering inner faces of the cavities and a parting face of one of the dies, which contacts a substrate of the semiconductor devices, with release film, which is easily peelable from the dies and resin for molding; clamping the substrate with the dies; filling the resin in the cavities; and forming the semiconductor devices by cutting the molded substrate.

Abstract: A injection molding device for manufacturing golf balls is disclosed. The device includes first and second hemispherical mold halves that form an interior cavity where the injection molding process occurs. A plurality of retractable pins are preferably used to support a core within the mold cavity. The first and second mold halves further include a plurality of subgates. The subgates are connected to a runner system for delivery of a fluid stock material into the void of the cavity. The plurality of subgates includes a first and second set of subgates. The first set of subgates and the second set of subgates enter the respective cavities at an angle between 30 and 40 degrees to the parting line.

Abstract: A method of injection molding an over-molded article in which a cavity extension associated with a core is first moved to a disengaged position and the core is inserted into a first cavity having a defined volume in a first geometrical configuration. A first injection operation is performed into the first cavity to form a first layer of the article. The core is then removed from the first cavity with the first layer of the article on the core. The cavity extension is moved to an engagement position and the core and first layer are inserted into a second cavity. The second cavity and the cavity extension engage to form a composite cavity having a larger volume than the defined volume and define a second geometrical configuration. A second injection operation is performed into the composite cavity to over-mold the first layer to form the article. The core and cavity extension are separated from the second cavity to remove the article therefrom.

Abstract: An apparatus and method for molding and curing silicone includes a press, one nozzles operatively engaged to the press, a liquid cooled manifold plate disposed to cool the nozzles, a heatable top platen having nozzle receptacles therein to receive the nozzles therein and a mold plate having a mold cavity therein. The mold plate and top platen are oriented for placement in the injecting position to allow the top platen to contact the mold plate while the nozzles are inserted into the nozzle receptacles of the top platen so that silicone is injected into the mold plate and into the mold cavity. The apparatus may be placed in the curing position when the top platen is heated and contacts the mold plate to allow silicone injected in mold plate to cure. The apparatus may be placed in a home position where the mold plate is uncontacted by the heated top platen which is uncooled by the manifold plate in the home position.

Abstract: A molding apparatus for use in forming a flexible substrate based package comprises a plurality of pots. Two flexible substrates are installed at two sides of the pots. A plurality of sets of chips mounted on the upper surface of the substrate wherein each set of chips is in an array arrangement. The molding apparatus further comprises a plurality of runners. Each runner independently extends from one side of the pot to one side of the substrate, and connects to a cavity of a upper part of a mold disposed on the substrate through a gate. The present invention characterized in that, the molding apparatus is provided with a first communication channel formed corresponding to one side of the substrate and a second communication channel formed corresponding to the other side of the substrate. The first and the second communication channels interconnect the cavities at two opposite sides thereof.

Abstract: An apparatus and method for molding and curing silicone includes a press, one nozzles operatively engaged to the press, a liquid cooled manifold plate disposed to cool the nozzles, a heatable top platen having nozzle receptacles therein to receive the nozzles therein and a mold plate having a mold cavity therein. The mold plate and top platen are oriented for placement in the injecting position to allow the top platen to contact the mold plate while the nozzles are inserted into the nozzle receptacles of the top platen so that silicone is injected into the mold plate and into the mold cavity. The apparatus may be placed in the curing position when the top platen is heated and contacts the mold plate to allow silicone injected in mold plate to cure. The apparatus may be placed in a home position where the mold plate is uncontacted by the heated top platen which is uncooled by the manifold plate in the home position.

Abstract: A method and apparatus for encapsulating one or more small electronic devices, including for example light-emitting diodes, mounted directly on a substrate by providing a three-dimensional formation on the substrate adjacent to the device and injection molding a thermoplastic encapsulating material to cover the device and extend over the three-dimensional formation on the substrate and wherein the encapsulating material mechanically bonds to the three-dimensional formation. A gate plate for use in injection molding a thermoplastic encapsulating material over a small electronic device mounted directly on a substrate including a cavity formed to enclose the device, and a short gate formed entirely within the gate plate having an input for receiving an encapsulating material and an output communicating with the cavity.

Abstract: A mold assembly and method for holding a panel or sheet of material such as glass while molding a member around an attachment member and a gasket around a peripheral portion of the panel from a thermoplastic or other moldable material such as PVC. The assembly and method provides a movable, secondary pressure pad which reduces the percentage of broken panels of material. The mold assembly includes a first mold section and a second mold section, which define a mold cavity therebetween. The first mold section includes a first sheet holding surface adjacent the mold cavity, and the second mold section includes a movable, primary pressure pad having a second sheet holding surface adjacent the mold cavity. The primary pressure pad is urged toward the sheet by resilient members to hold the sheet between the first and second holding surfaces in a manner so that the peripheral portion of the sheet extends into the cavity for molding a gasket thereon.

Abstract: Apparatus for encapsulating products, for instance encapsulating lead frames with epoxy resin, wherein the apparatus comprises:one or more pressing devices for encapsulating the products at increased pressure and/or temperature;a first carriage device for transferring the products from supply means to the pressing device; anda second carriage device for discharging the encapsulated products from the pressing device to discharge means, wherein the first and second carriage are guidable along collective guide means.

Abstract: In a process for producing friction linings, a friction material is produced in granular form in a mixing reactor (1). The granular material is pressed for up to 120 seconds together with lining bases in press moulds (3) to produce friction linings. Immediately after leaving the press moulds, the finished pressed friction linings are hardened in a continuous furnace (5) for a predetermined period without being fixed. The friction linings are conveyed between the press moulds (3) and continuous furnace (5) on a continuous conveyer (4).

Abstract: In the resin molding machine of the present invention, molding dies, which are included in at least one of press units, can be exchanged, repaired or cleaned, or molding executed by respectively controlling the press unit can be executed by said molding dies without stopping the operation of the machine. Workpieces are conveyed from a work supplying section to the press units. And molded products are conveyed from the press units to a product accommodating section. A base unit includes the work supplying section, the product accommodating section and a loader and an unloader. The loader and the unloader convey the works and the products. The press units are detachably attached to said base unit.

Abstract: In an insert pin (1) for being pressed against a terminal (18), inserted in a mold, to hold the terminal against a flow of a resin material (19) poured into the mold, a resistance-alleviating portion (2) of a generally isosceles triangular shape, having an apex (2a) disposed on a symmetrical line (3) of a cross-section of the insert pin, is formed on and projects from a peripheral surface (1a) of the insert pin (1) in a direction of the flow.

Abstract: A composite molded product has a main body molded of a base material of a thermoplastic resin and defining at least one through opening. A porous skin material is integrated with the main body by thermal fusing. At least one rib is formed on the surface of the skin material at a position corresponding to the position of at least one through opening. At least one rib is integrated with the main body through porous structure of the skin material.

Abstract: A mold for BGA semiconductor packages which includes a height adjusting member adapted to adjust the height of the top cavity insert of the top mold or the bottom cavity insert of the bottom mold, an elastic member disposed between the height adjusting member and associated insert, clamping regions of different heights formed at its top or bottom cavity insert, or air vents having a width and depth of an optimum ratio to the area and depth of cavities, thereby being capable of maintaining an optimum and uniform clamping pressure between the top and bottom molds for a variety of PCB strips having a thickness deviation among different portions thereof or having various average thicknesses, upon molding resin encapsulants on those PCB strips, thereby achieving an improvement in the quality of finally produced packages while preventing a sweeping phenomenon of bonding wires electrically connecting a semiconductor chip to conductive traces.

Abstract: A method and apparatus for encapsulating an integrated circuit die and leadframe assembly using liquid mold compound. A prepackaged liquid mold compound insert 11 is placed in a rectangular receptacle 43 in a bottom mold chase 31. The receptacle 43 is coupled to a plurality of die cavities 37 by runners 39. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 31 such that the integrated circuit dies are each centered over a bottom mold die cavity 35. A top mold chase 53 is placed over the bottom mold chase 31 and the mold compound package 11. The top mold chase 53 has die cavities 57 corresponding to those in the bottom mold chase 31. The prepackaged liquid mold compound is packaged in a plastic film which has heat sealed edges 15. The mold compound is forced through the heat seals 15 during the molding process by the pressure applied by a rectangular plunger 61.

Abstract: An apparatus and method for molding thermosetting polymers onto clothing. The apparatus includes at least one molding device, at least one polymer supply and a control system for controlling the operation of the molding devices and polymer supplies. The molding devices include die sets having an input member and a mold. The polymer supplies supply polymers for injection into the input members of the molding devices for use in molding three dimensional bodies of polymers onto substrates such as clothing.

Abstract: Apparatus (10) is disclosed including first and second forming rollers (18, 21) which rotatably abut with an anvil roller (20). The forming rollers (18, 21) each include a periphery forming a continuous forming surface including a plurality of axially and circumferentially spaced grooves (24) each formed as a continuous depression arranged in a serpentine and non-intersecting manner. Food (14) is simultaneously fed between a continuous strip of support material (16) and a continuous ribbon of film material (66) as they pass between a first abutment nip of the first forming roller (18) and the anvil roller (20). After extending partially around the periphery of the first forming roller (18), the materials (16, 66) and the food therebetween pass around an adjustable idler roller (70) to between a second abutment nip of the second forming roller (21) and the anvil roller (20).

Abstract: A wire reinforced cast member is produced by providing inner and outer mold forms. At least one mounting projection of a wire reinforcement support member is supported in at least one opening in one of the inner and outer mold forms. A plurality of support members cooperate to support and substantially accurately position a wire reinforcement member, which member is mounted into support slots in the support member, which slots may snap-fittingly receive the wire reinforcement. The support members maintain the wire reinforcements in proper position during the introduction of the cast material. After the cast material has set, the cast member is removed from the mold. The support members have mounting portions which easily break away from the main body of the support members as the wire reinforced cast member is removed from the mold.

Abstract: An apparatus and method for molding thermosetting polymers onto clothing. The apparatus includes at least one molding device, at least one polymer supply and a control system for controlling the operation of the molding devices and polymer supplies. The molding devices include die sets having an input member and a mold. The polymer supplies supply polymers for injection into the input members of the molding devices for use in molding three dimensional bodies of polymers onto substrates such as clothing.

Abstract: The invention comprises a fixture and method for holding optical waveguid such as fiber optic cable, in a relatively stable fashion for processing. The fixture includes a first frame and a second frame, releasably securable to the first frame to form a unitary structure. Chambers disposed in at least one of the frames are adapted for removably receiving optical fiber cable when the first and second frames are released from one another and for securely retaining with molding material optical fiber cables when the first and second frames form the unitary structure. A process area is defined in the unitary structure such that segments of optical fiber cables secured therein are accessible in the process area for processing. An optional coating fixture is securable to said unitary structure for forming with a molding material a protective coating about the cable segments in the processing area.

Abstract: An apparatus and method for molding thermosetting polymers onto clothing. The apparatus includes at least one molding device, at least one polymer supply and a control system for controlling the operation of the molding devices and polymer supplies. The molding devices include die sets having an input member and a mold. The polymer supplies supply polymers for injection into the input members of the molding devices for use in molding three dimensional bodies of polymers onto substrates such as clothing.

Abstract: The automatic molding machine of the present invention comprises: molding dies; a press mechanism to which the molding dies are attached, the press mechanism clamping and molding a work piece which is set in the molding die; a film feeding mechanism linking with molding action of the press mechanism, the film feeding mechanism feeding release film, which is formed into a long belt form, prescribed length so as to correspond a setting position of the work piece, which is set in the molding die; and a conveying mechanism linking with the molding action of the press mechanism, the conveying mechanism feeding the work piece and resin for molding into the molding die and taking out a molded product therefrom, wherein the work piece is molded by the molding dies whose molding sections are covered with the release film.

Abstract: An improved process for molding parts such as gaskets using an injection molding machine including upper and lower mold plates which are transparent to UV light and have pattern recesses of differing sizes and spaced apart locations, a UV light source, and a low pressure injection system for delivering elastomers to the mold plates. The elastomers are cured by exposure to UV light. An optional carrier plate may be inserted between the mold plates and provides a rigid surface for attachment of the elastomer. The carrier plate selectively covers the pattern recesses located in the mold plates.

Abstract: A gate portion constituting a gate of a resin molding die is made of a hard alloy having a hardness greater than the predetermined hardness in the iron-based hard alloy used to from a cavity block and a center block. Opposing surfaces of the cavity block halves include a silicone rubber layer at least at the portions thereof which contact portions of the lead frame in a semiconductor encapsulation molding apparatus.

Abstract: A closed mold for encapsulating LED alphanumeric display devices uses opposing platens and top and bottom plates to achieve a seal about the display device. By providing the display device with a dambar, splatter on the leads is avoided.

Abstract: A foil-decorating injection molding machine is provided with an injection mold having a male mold and a female mold. The female mold has a cavity surface for forming a cavity, and a parting surface having an outer peripheral section on which to hold a decorative sheet, and an inner peripheral section extending between the inner edge of the outer peripheral section of the parting surface and the edge of the cavity surface in a concavely curved shape to allow the expansion of a peripheral portion of the decorative sheet around a decorating portion of the same during preforming. This reduces local strains in the decorative portion of the sheet and ensures a uniform thickness distribution of the sheet to prevent breaking and creasing of the sheet.

Abstract: An apparatus for producing a molded plastic product including, feeding means for feeding plastic and an electromagnetic shielding part into a die having a cavity of predetermined configuration so that the electromagnetic shielding part is located between opposite inner walls of the plastic; and molding means for introducing compressed air between the opposite inner walls of the plastic inside the die so that the plastic accommodates the electromagnetic shielding part and has a hollow configuration between the opposite inner walls.

Abstract: An apparatus for inserting preformed miniature precision metal stampings into a mold cavity for a subsequent plastic molding operation includes close tolerance positioning pins that accurately locate a die head assembly by fitting into respective holes in the mold base and pneumatic and electric motors for moving the die head vertically and horizontally, as well as forward and backward relative to the mold base. The metal stampings are preformed on a metal strip that is indexed in the insertion head by a pneumatically driven pilot pin and then pneumatic cylinders operate cutoff punches that detach the stampings from the strips and place them in the mold cavity. The entire insertion head assembly is permitted a small amount of movement necessary to align the positioning pins in the mold base holes by the provision of ball bearing mounting assemblies used to attach the insertion head apparatus to the base plate of the machine.

Abstract: A plastic molding method for semiconductor devices, the method including placing semiconductor devices mounted on lead-frames between lower die cavities in a lower die chase block and upper die cavities in an upper die chase block and clamping the upper and lower die chase blocks together; evacuating an ejector chamber in the lower die chase block through a lower die common surface table, evacuating an ejector chamber in the upper die chase block through an upper die common surface table, and evacuating a parting chamber at a parting surface between the lower die chase block and the upper die chase block through one of the lower die common surface table and the upper die common surface table; and injecting a sealing resin into the upper die cavities and the lower die cavities to plastically package the semiconductor devices.

Abstract: An apparatus is provided for molding lead frames. The apparatus has a mold formed by two mold halves. An assembly for introducing a lead frame into one of the mold halves, an assembly for carrying encapsulating material into the cavities of the mold and an assembly for removing an encapsulated product from the mold are arranged on a carriage movable along a guide relative to the mold halves.

Abstract: A gate portion constituting a gate of a resin molding die is made of a hard alloy having a hardness greater than the predetermined hardness in the iron-based hard alloy used to form a cavity block and a center block. Opposing surfaces of the cavity block halves include a polytetrafluoroethylene layer at least at the portions thereof which contact portions of the lead frame in a semiconductor encapsulation molding apparatus.

Abstract: A resin encapsulating molding die for manufacturing a semiconductor device includes a cavity piece having a cavity on which a lead frame with a mounted semiconductor element may be placed, with the semiconductor element in the cavity, and a gate piece having a gate portion including a sub-runner through which a molten resin for encapsulating the semiconductor element is introduced into the cavity, the gate piece being detachable from the cavity piece. The molding die also includes a sealing dam disposed adjacent the sub-runner for blocking flow of molten resin from the sub-runner toward leads of the lead frame. The sealing dam may be a clamp structure for clamping the leads closest to the gate portion, the sealing dam and cavity piece may be a continuous unitary structure, and the sealing dam may have a parting surface substantially coplanar with a parting surface of the cavity piece.

Abstract: A transfer molding machine for encapsulation of semiconductor devices with a resin comprises a clamping mechanism with an electrically actuated toggle mechanism, a pair of upper and lower sections of a transfer mold, and at least one compensation unit including upper and lower plates and a plurality of elastic members held between said upper and lower plates. The compensation unit is arranged either between the upper stationary platen and the upper mold section or between the moving platen and the lower mold section to compensate the dimensional errors in the mold sections and clamping mechanism.

Abstract: A segment used for producing a composite insulator having a core member and a housing member arranged around the core member and constructed by a trunk portion and a shed portion is disclosed. The segment has a pair of segment molds detachably connected at a partition plane and a heating and cooling passage arranged in the segment molds respectively. The segment molds have a through-hole through which the core member is arranged, an upper plane forming portion arranged at its one end surface for defining an upper plane of the shed portion, and a lower plane forming portion arranged at its other end surface for defining a lower plane of the shed portion. A heating or cooling medium is passed through the heating and cooling passage. Moreover, a mold is constructed by integrating a plurality of segments with the heating and cooling passage mentioned above.

Abstract: In a method and apparatus for manufacturing a slide fastener chain having rows of coupling elements and members of a separable bottom end stop assembly, two positioning holes are formed at predetermined positions on reinforcing films attached to a pair of fastener tapes. The positioning holes are used to position the fastener tapes relative to a molding unit with respect to each individual slide fastener length. Thus, even when a positioning error is produced due to a change in tension on the fastener tapes being processed, such error is limited to a small extent which is created only in the individual slide fastener length. Thus, the coupling elements and the first pin member and the second pin member can be molded precisely.

Abstract: A direct drive electro-mechanical press for encapsulating semiconductor devices has at least a clamping axis and a transfer axis. The clamping axis has a planetary roller screw coupled to a tie bar platen assembly on which at least one top mold is mounted. A two-speed gearbox is further coupled to the clamping axis for switching between a high speed mode and a high torque mode along the clamping axis. The two-speed gearbox has a high speed clutch coupled to a speed reducer and a high torque clutch respectively. The transfer axis is slidably located above the clamping axis; the transfer axis has another planetary roller screw coupled to a bottom platen on which at least one bottom mold is mounted. The transfer axis transfers the molding resin from the pot into the cavities formed when the top and bottom molds are clamped together.

Abstract: An apparatus is provided for making molded photointerrupters by using first and second leadframes. The first leadframe carries a plurality of light emitting devices, whereas the second leadframe carries a plurality of light receiving devices. The apparatus includes a molding unit which includes: a lower mold member which supports the first leadframe in a horizontal posture; an upper mold member movable vertically toward and away from the lower mold member; and a pair of side mold members movable laterally toward and away from each other between the upper and lower mold members, one of the respective side mold members supporting the second leadframe in a horizontal posture; wherein the respective mold members forms molding cavities when the mold is closed.

Abstract: Encapsulation molding equipment includes individual loading bars each having an elongated support surface which receives strip-like carriers supporting semi-conductor chips and like objects for encapsulation. Cavity inserts having plural rows of cavities of different size and dimension individual to carriers having like numbers of chips of a range of size and dimension fit over the strips with each cavity on an insert surrounding the chip to be encapsulated. Converging gate passages and vent passages are formed on the surface of the insert spaced away from the mold base member for supply of resin from a central resin receptacle to the cavities. Support of the cavity inserts independent of the loading bars and resilient mounting of the loading bars is disclosed. The mold is completed by an upper mold member which closes the mold and effects a seal between the mold parts and provides for delivery of encapsulating resin to the cavities in the cavity inserts.

Abstract: An improved transfer molding apparatus is provided for molding a preheated resin under pressure to thereby encapsulate a small element, such as a semiconductor device or package. In one aspect of the invention, the improvement consists of providing a shortened pot into which a piston is forcibly pressed to generate a flow of preheated resin in the encapsulating process, the improvement comprising the replacement of a single-element top drive plate, as found in a conventional apparatus, by a two-piece top drive plate which enables a shortening of the pot and corresponding reduction in the amount of air that would otherwise be trapped between the plunger and the resin during the process. The elimination of this air significantly reduces foaming, porosity, voids, and other defects in the cured resin which finally surrounds the electrical elements encapsulated thereby.

Abstract: A method of manufacturing three-dimensional parts using sheets of a thermoplastic resin high-performance fiber-reinforced composite material includes the steps of supplying the sheet of the high-performance resin-reinforced composite material which uses as a matrix a thermoplastic resin and in which reinforcing fiber is oriented, clamping an end portion of the sheet by a sheet clamping device, conveying the sheet to a heating/forming zone, heating the sheet to a predetermined temperature, clamping the sheet by upper and lower frames by driving cylinders, forming the three-dimensional part by operating a mold and thereby deep drawing the clamped sheet inwardly according to a stroke of the mold, and repeating the above-described series of steps continuously.

Abstract: Encapsulation molding equipment includes individual mold bases each having an elongated shallow recess which receives strip-like carriers supporting semi-conductor chips and like objects for encapsulation. Cavity inserts having various numbers of cavities of different size and dimension individual to carriers having like numbers of chips of a range of size and dimension fit over the strips with each cavity on an insert surrounding the chip to be encapsulated. Gate and vent passages are formed on the surface of the insert spaced away from the mold base member for supply of resin from a central resin receptacle. Gate passages in the cavity inserts are configured to provide a restriction at the edge of each mold cavity, thereby accelerating the flow of liquid resin, rapidly filling the cavities and avoiding the entrapment of gas bubbles. The inserts have mold vent passages which allow for rapid venting of displaced gases from the cavities.

Abstract: A method for forming a pattern onto an article during injection molding thereof. A pattern-bearing film is heated and softened by a heating board. The softened pattern-bearing film is transferred to the cavity surface of a female mold. Thereafter, the female mold and a male mold are closed. Then, a molten resin is injected into the cavity. When a pattern-bearing film is brought in contact with and heated by the heating board, marks or impressions of air blow holes on the surface of the heating board remain on the pattern-bearing film. To prevent the formation of these marks or impressions, a square-shaped holding frame is fixed on the surface of the heating board. The peripheral portion of the pattern-bearing film is held on the surface of the holding frame. Thus, while the pattern portion of the pattern-bearing film is spaced apart from the surface of the heating board, the film is heated.

Abstract: Encapsulation molding equipment includes individual mold bases each having an elongated shallow recess which receives strip-like carriers supporting semi-conductor chips and like objects for encapsulation. Cavity inserts having various numbers of cavities of different size and dimension individual to carriers having like numbers of chips of a range of size and dimension fit over the strips with each cavity on an insert surrounding the chip to be encapsulated. Gate and vent passages are formed on the surface of the insert spaced away from the mold base member for supply of resin from a central resin receptacle. The mold is completed by an upper mold insert plate which closes the mold and effects a seal between the mold parts and provides for delivery of encapsulating resin to the cavities in the cavity inserts. Each mold base has a plurality of recesses, each of which receives a carrier strip and a cavity insert.

Abstract: A twin screw extruder compounds a thermoplastic resin material with a randomly oriented fiber reinforcing material to produce a molten fiber reinforced thermoplastic extrusion from a die. The extrusion is cut into preforms which are immediately inserted into a compression mold for making parts. A unidirectionally oriented fiber reinforcing material can be added in the die. The fibers are monofilaments which are debundled and heated before entering either the extruder or the die.

Abstract: A method of carrying preforms of frictional material, in which a preform 2 of a frictional material is carried so as to be put into a heat middle mold 8b of a heat mold 8 after the frictional material is preformed with a preforming mold 1, the preforming upper mold 1a is moved down so that the preform 2 held in a preforming middle mold 1b is pushed from above into a through storage hole 4a of a carrier 4, and the heat upper mold 8a is moved down after this carrier 4 is carried to above the heat middle mold 8b so that the preform 2 is pushed into the heat middle mold 8b from the lower portion of the storage hole 4a of the carrier 4.

Abstract: A plastic molding apparatus for semiconductor devices includes a first evacuation passage via which an ejector chamber in a lower die chase block is evacuated through a lower die common surface table, a second evacuation passage via which an ejector chamber in the upper die chase block is evacuated through the upper die common surface table, and a third evacuation passage via which a parting chamber on a parting surface between the lower die chase block and the upper die chase block is evacuated through one of the lower die common surface table and the upper die common surface table. Since the evacuation passages are separate and the volume of the evacuation chamber is reduced, evacuation performance is improved and the size of the apparatus is reduced. The plastic packaging performance is also improved.