Abstract: A mold structure for package fabrication is proposed, and includes a top mold, a fixture and a bottom mold. The top mold is formed with at least an upwardly recessed portion; the fixture is formed with a plurality of downwardly recessed portions; and the bottom mold has a recessed cavity for receiving the fixture therein, and adapted to be engaged with the top mold, wherein a resilient member is disposed on an inner wall of the recessed cavity, and interposed between the fixture and the recessed cavity of the bottom mold, allowing the resilient member to provide a resilient force for properly positioning the fixture. By using the above mold structure, chips mounted on a substrate can be firmly supported in the mold structure without causing chip cracks during a molding process for encapsulating the chips.

Abstract: A method and apparatus for molding a plate having highly detailed surface features from a thermosetting resin with a high concentration of a filler such as graphite. The method an apparatus provides for the formation of a preform of casting material and the placement of the material in a cavity mold which is precisely temperature controlled, has vacuum assist operating throughout the molding operation. The molding pressure is rapidly increased to flow the material through the molding cavity prior to the onset of curing and uniquely positioned ejector pins are provided for removal of the molded plate without damage to the detailed surface features.

Abstract: An apparatus and method for moulding opening devices onto a packaging material sheet at respective holes provided in the sheet includes first and second mould tools arrangeable in a closed position so as to be in contact with opposite sides of the sheet and in an open position so as to be positioned distally from the sheet. In the closed positions a mould cavity is formed between the first and second mould tools for accommodating a hole edge in the sheet. One of the mould tools includes a pair of half mould tools which are simultaneously moved from the open position to the closed position and vice versa such that the direction of movement of each of said half mould tools between the open and closed positions have a directional component extending substantially parallel to the extension plane and a directional component extending substantially perpendicularly to the extension plane, for reducing wear of the mould tools.

Abstract: Blanks (12) of thermoplastic material are heated, and a thermoforming step is performed in which the heated blanks are deformed plastically by stretching. Before the thermoforming step, a die-punching step is performed in which the peripheral regions of the blanks are deformed by die-punching while the material of the blanks is held captive on the outside. The installation includes heater means (16) for heating said blanks, thermoforming means (24), and a die-punching tool (26, 28) suitable for deforming the peripheral regions of the blanks before they are thermoformed.

Abstract: The present invention provides an apparatus for forming concrete structures, such as railroad crossing signal foundations. The apparatus includes a generally hollow form, which is made from a strong and durable material, such as metal (e.g., steel) or composite material. The form is tapered and includes two halves that are selectively attached together for easy removal from a completed foundation. The form further includes several cantilever bolt holders that extend over the form and include holes that receive cantilever bolts that are incorporated into the foundation. One or more vibrating elements may be removably attached to the tops of the cantilever bolts and/or to the sides of the form. The air vibrators may be selectively activated during the cement pouring process to vibrate the concrete and substantially reduce or eliminate air bubbles and defects within the foundation. A pair of adjustable legs is attached to the form and allows the form to be positioned and supported over a foundation hole.

Abstract: The bottom mold portion for a transfer molding system is covered with a deformable material. During mold clamping, the deformable material contacts the bottom surface of the packaging substrate on which the integrated circuit die is mounted. Deformation of this relatively soft covering on the bottom mold portion accommodates thickness variations in the packaging substrate, as well as non-planarity of the adhesive layer between the integrated circuit die and packaging substrate in exposed active area integrated circuits.

Abstract: Molding equipment and related techniques for forming a golf ball are disclosed. The golf ball comprises a core and a cover layer, wherein the cover layer provides one or more deep dimples that extend through the cover layer to and/or into a layer or component underneath are disclosed. The molding equipment provides one or more selectively positionable knock-out pins along the surface of the molding chamber. These pins are specially tailored such that after their retraction subsequent to molding, the resulting voids are deep dimples. The molding equipment and related processes are particularly useful when forming the various layers by reaction injection molding.

Abstract: An improved golf ball injection mold is characterized by upper and lower support plates each containing corresponding hemispherical cavities which define spherical mold cavities when the plates are brought together. A plurality of retractable core pins are arranged in each cavity for supporting a core of a golf ball. Fluid thermoplastic material is supplied to each cavity to form the cover layer on the golf ball core. A valve pin is arranged in a gate in the upper plate in the center of the upper hemispherical cavity adjacent to a pole of the golf ball being formed in the cavity. The valve pin is operable between extended and retracted positions relative to the gate to deliver the thermoplastic material to the cavity and a closed position intermediate of the extended and retracted positions to stop the flow of thermoplastic material during curing of the cover layer.

Abstract: The present invention relates to a multiple foam substrate of predetermined shape and a method of manufacturing the substrate. The substrate is a multiple foam substrate which may be manufactured by the method with a mold having first and second mold cavities. The method includes injecting a first foam into the first mold cavity sufficiently to fill the first mold cavity and storing the first foam in the first mold cavity for a predetermined time sufficient to form a substantially non-mixing surface on the first foam. The method further includes injecting a second foam into the second mold cavity and onto the non-mixing surface on the first foam sufficiently to fill the second mold cavity. The method further includes storing the second foam in the second mold cavity for a predetermined time sufficient to bond the first foam to the second foam along the non-mixing surface.

Abstract: A peripherally encapsulated product is molded by placing a piece of glass between mold clamping portions of movable closed bodies when the latter are in an open position. The bodies are heated and thermosetting polymeric material is placed upon one of the mold bodies outboard of a peripheral edge of a piece of glass. The glass is clamped and the mold bodies are closed creating compression forces which extrude the polymeric material into the annular cavity and into complete encapsulation of a peripheral edge of the piece of glass. The thermosetting polymeric material is cured, the mold bodies are opened and the product is removed therefrom.

Abstract: A mold to make a plastics material piece includes two parts defining a cavity corresponding to the piece to be made, each part has a peripheral zone for coming into contact with the other part's peripheral zone to define the mold's joint face. One part is made up of two blocks, namely a central block and a peripheral block, the two blocks suitable for sliding relative to each other in the mold closure direction, and the peripheral block capable of movement so as to move the peripheral zone away from the edges of the sheet. A method of making a plastics material piece includes placing a sheet in a part of a mold, moving a peripheral block, closing the mold, and moving the peripheral block to a molding position while keeping the first and second peripheral zones in contact.

Abstract: A tool for foaming of a component to a pane for a motor vehicle, which forms at least one part of a boundary of an area to be peripherally foamed and includes a rigid insert for holding the component. The insert includes a bottom having an opening for insertion of an end of the component facing away from the peripheral foaming area. An elastic sealing ring surrounds the opening and lies on the bottom. A pressure element is used to press the sealing ring against the bottom to deform the sealing ring in the lateral direction to make tight lateral contact with a part of the component which has been inserted through the opening.

Abstract: The resin molding machine and a method of resin molding of the present invention are capable of securely and efficiently mold a work piece, on which a plurality of elements are arranged. The resin molding machine comprises: a lower die on which a work piece to be molded is set; an upper die clamping the work piece with the lower die; a clamper being provided to the upper die, the clamper enclosing a resin molding space of the upper die, the clamper being capable of vertically moving in the upper die and always biased downward, wherein a lower end of the clamper is downwardly projected from a resin molding face of the upper die when the lower die and upper die are opened; and a release film feeding mechanism feeding release film, which is easily peelable from the upper die and resin for molding, so as to cover the rein molding space.

Abstract: An apparatus comprising a mould (11) having a first mould part (20) and a second mould part (21), the second mould part (21) being movable relative to the first mould part (20), foam supply means to supply foam to said mould, and a positioning tool (10) for positioning a covering (14) in at least one of the first mould part (20) and the second mould part (21) wherein the positioning tool (0) is shaped to co-operate with aid at least one mould part, characterised in that the positioning tool (10) is provided with a groove (13) whereby a projecting part (18) of the covering (14) may be received in the groove (13).

Abstract: A principal object of the present invention is to provide a method for manufacturing a filter element having a resin-molded frame, which permits to easily form the resin-molded frame, even when the filter has a complicated shape. The above-mentioned object can be achieved by providing the method for manufacturing the filter element, which is characterized by comprising the steps of: semi-curing resin in a prescribed shape to prepare a semi-cured resin; inserting forcedly at least one part of a filter into the semi-cured resin; and curing the semi-cured resin into which the at least one part of the filter has been forcedly inserted.

Abstract: An injection molding apparatus for underlaying a flexible top material with plastic inside a cavity, which is formed between a female mold core plate and a mold core, with a dipping edge on the female mold side and another dipping edge on the mold core side, which bound a dipping edge gap that adjoins the cavity, into which gap the top material situated in the cavity extends. The dipping edge on the female mold side is formed on a dipping edge slider that is movably mounted on the female mold plate.

Abstract: A method for injection molding of resin or rubber at an insert positioned in a lower mold injects and fills melted resin or rubber into a cavity of an upper mold through a gate. The lower metal mold has a flexible supporting member supporting the mold insert. The supporting member is vertically movable in a recess formed on the upper surface of the lower mold. The underside thereof is supported by the tip ends of shafts of pressing members that operate independently. The movable supporting member is moved while being pressed by the respective shafts of the pressing members to the upper mold at a plurality of positions. The resin or rubber is molded when the upper surface of the insert uniformly contacts the underside of the upper mold by bending of the movable supporting member.

Abstract: Connector terminals 13 connected to ends of respective electric wires 12 are inserted into an electric wire insertion section 11b formed in a housing body 11 of a waterproof connector 10. The connector terminals 13 are attached to respective terminal attachment sections 11a. The connector comprises a plug 14 which is molded on the outer peripheral surfaces of the electric wires 12 situated in the electric wire insertion section 11b and which is removably fitted into the electric wire insertion section 11b with a slight gap between the inner peripheral surface of the electric wire insertion section 11b and the plug 14; and a resiliently-deformable annular sealing body 15 which is retained in a retention groove formed along an outer peripheral surface of the plug 14 and which is brought into intimate contact with the inner peripheral surface of the electric wire insertion section 11b.

Abstract: A method of producing a bead inductor includes the steps of forming an outer portion outside of a conductor coil, and forming a molded body with the conductor coil embedded therein. The outer portion is formed outside of the conductor coil by disposing the conductor coil in a cavity defined by first and second mold portions, with first and second gates formed in the first mold portion, inserting first and second spacer pin portions, which define a spacer pin which passes through the conductor coil and extends to and closes the second gate, and supplying material containing magnetic powder into the mold cavity from the first gate. The molded body is formed by closing the first gate after the formation of the outer portion, and supplying from the second gate material containing magnetic powder into a space formed by removing the spacer pin portions.

Abstract: An apparatus for making a molded article containing an insert includes an upper mold half and a lower mold half for mating with the upper mold half to provide a mold cavity therein. Either mold half can include a recess, an elevator opening in a lower portion of the recess, and an inwardly directed lip at an upper portion of the elevator opening. An elevator mechanism is provided which includes a lifter for supporting an insert to be secured to the article during a molding operation, and a lifting arrangement for raising and lowering the lifter through the elevator opening such that a peripheral edge of the insert supported on the lifter is clamped between the lifter and the lip when the lifting arrangement raises the lifter.

Abstract: A mold apparatus and method for forming a shaped laminate in one step are provided where the laminate includes a cladding layer and a foam backing layer. The apparatus includes a male mold half matable to a female mold half that define a mold cavity. An inlet is mounted on the mold apparatus for introducing foamable materials into the mold cavity. Edge folding members, carried by one of the mold halves, movable from a retracted position to an extended position, fold the cladding layer over at least part of the edge of the foam backing layer. Trim blades are located adjacent to the edge folding members movable from a retracted position adjacent the cavity to an extended position engaging the other mold half to sever the cladding layer to define the finished shape of the laminate.

Abstract: The invention relates to a process and a production installation for producing shell-shaped, fibre-reinforced plastic parts. According to the invention, it is intended that the plastic parts can be produced efficiently, in an automated manner which is flexible with respect to the process and workpiece and is operationally reliable. For this purpose, the following process steps are provided: a blank of the endless fibre mat corresponding to a workpiece is placed in an automated manner by industrial robots onto a clamping frame surrounding the female mould and is taken over by the clamping frame in a clamping manner and in such a way that it can slide after itself against a defined resistance. Wide-ranging accessibility required for this is created by a horizontally movable unit, comprising a female mould and a clamping frame, being temporarily moved completely out from the forming press and moved back again into the forming press after completion of loading.

Abstract: Device to produce polyurethane articles (37) covered by a film (19), including a mold (30) comprising a female part (13) and a male part (12) defining a molding cavity (18) inside which polyurethane material (24) is able to be injected. The device also comprises, in association with the perimeter edge of said female part (13), means able to exert a connection function in substantial cooperation with the zone of discontinuity between said female part (13) and said male part (12). The means comprise a movable annular ring-nut (22) including a first position (22a) to load a segment of said film (19) in order to insert said segment inside the mold, and a second position (22b) at least partly overlapping on the perimeter of said female part (13) in order to cooperate with said female part (13) during the molding of said polyurethane material (24).

Abstract: The present invention provides a molding system as well as a method for encapsulating semiconductor packages, wherein a cavity plate is kept at a desired temperature during molding. The system includes a mold comprising a first mold piece and a second mold piece adapted to define a mold cavity for enclosing one or more semiconductor devices for molding, and a cavity plate adapted for mounting in the cavity to introduce encapsulation material to the semiconductor device(s). The system also includes retaining means adapted selectively to hold the cavity plate against the first mold piece or the second mold piece whereby to maintain the cavity plate at the desired temperature.

Abstract: In an air passage switching door, a packing material having a size approximately corresponding to a plate surface of a door base member is used, and the door base member is crossed with the packing material at a portion around a rotation shaft for rotating the door base member, so that both plate portions of the door base member are bonded to opposite surfaces of the packing material at different areas of the packing material. Accordingly, the air passage switching door can be manufactured using the single packing material.

Abstract: A method and apparatus for encapsulating microelectronic devices. In one embodiment, a microelectronic device is engaged with a support member having a first edge, a second edge opposite the first edge, and an engaging surface with at least a portion of the engaging surface spaced apart from the first and second edges. The first edge of the support member is positioned proximate to a wall of a mold and an aligning member is moved relative to the wall of the mold to contact the engaging surface of the support member and bias the first edge of the support member against the wall of the mold. The microelectronic device is then encapsulated by disposing an encapsulating material in the mold adjacent to the microelectronic device. By biasing the first edge of the support member against the wall of the mold, the method can prevent encapsulating material from passing between the first edge of the support member and the wall of the mold, where the encapsulating material would otherwise form flash.

Abstract: Method of making a proximity probe including providing a preform having an interior cavity accessible by an opened rearward end; coupling a coil to the preform proximate a forward most end of the preform for defining an assembly; locating a single support pin through the rearward end such that the support pin extends within the interior cavity while having an end emanating from the rearward end; cantilevering the emanating end between an upper and a lower mold plate defining a mold cavity for supporting the assembly; injecting moldable material into the mold cavity for molding an encapsulation of material over the assembly for defining an encapsulated probe tip, allowing the encapsulated probe tip to cure; removing the encapsulated probe tip from the mold cavity; removing the support pin from the assembly, and coupling a cable to the encapsulated probe tip for forming the proximity probe.

Abstract: A resin encapsulation mold of the present invention comprises a lower mold, which is mounted on a lead frame, includes an indentation into which a semiconductor device is placed, and forms a gate through which resin is injected; an upper mold, in which an indentation is formed opposite the indentation of the lower mold to configure a cavity for holding the semiconductor device; a plurality of ejection pins, which protrude from the respective bottoms of the indentation of the upper mold and the indentation of the lower mold into a resin package body formed by injecting the resin from the gate into the cavity, and eject the resin package body; a vertical drive mechanism, which brings into contact and separates the upper mold and the lower mold; and protrusion adjustment means for adjusting the amount of protrusion of the respective ends of the plurality of ejection pins.

Abstract: Improved lifter (32) for injection molding apparatus and method of use thereof are disclosed. To inhibit the unsightly blemishes that may be formed in plastic parts wherein the lifter (32) comprises a leading edge (44) that is perpendicularly oriented relative to the longitudinal axis of the molded part, a lifter plate is provided wherein the leading edge (44) thereof is obliquely angled relative to the longitudinal axis of the molded part.

Abstract: A transfer molding arrangement for encapsulating a substrate with an encapsulating material comprising a bottom mold and a top mold, wherein a space is provided between the top mold and bottom mold for receiving the substrate, and the top mold and/or the bottom mold is/are arranged in such a way that when a clamping force is applied sufficiently strong, the top mold and bottom mold are abutted against each other, thereby distributing the force exerted on the substrate to the top mold and bottom mold.

Abstract: A golf ball mold having non-planar parting lines and a method for forming a cover using such mold are disclosed herein. The mold has a pair of mold halves, and each mold half has a non-planar perimeter. The non-planar perimeter has alternating extensions and indentations. Each of the extensions has an apex that may be curved, and each of the indentations has a depression that may be curved. The mold may be used in compression molding, injection molding and cast molding a layer on a golf ball. The mold may be used to produce golf balls having non-dimpled surfaces.

Abstract: An insert molding method and mold has an upper mold and a lower mold disposed to oppose each other. The cavity at the upper mold side is filled with molten resin or rubber material injected through a gate to perform injection molding of the resin or rubber around an insert set at the lower mold side. A movable supporting member sets the insert, and is fitted in a recessed part formed on the upper face of the lower mold. The position of the center of gravity at the lower face of the movable supporting member is supported and pressed towards the upper mold side by the tip of a shaft of a pressing mechanism. A gap is between the side face part of the recessed part and the side face part of the movable supporting member to cause the movable supporting member to tilt about the point at which the movable supporting member is pressed and supported by the shaft inside the recessed part so that the upper face of the insert will be in uniform surface contact with the lower face of the upper mold.

Abstract: A mold for manufacturing semiconductor packages, which allows leadframes to be easily separated from a top mold section after a molding process by utilizing eject pins therein. The mold includes a bottom mold section having housing parts on the upper surface so as to allow leadframes to be placed in a flat state therein, and a top mold formed with transports therethrough. The top mold also incorporates runners formed along a lower surface with connections to the transports to introduce encapsulation material into select regions. A plurality of gates and cavities for molding the semiconductor packages are in flow communication. The eject pins are reciprocally mounted in the top mold section contiguous with the runners thereof to facilitate separation of the leadframes from the top mold.

Abstract: A molding apparatus includes an upper mold tool having an upper-most mold half, a lower mold tool having a lowermost mold half, and an intermediate mold tool having a first auxiliary mold half cooperating with the uppermost mold half and a second auxiliary mold half cooperating with the lowermost mold half. In a first molding step, the intermediate mold tool is positioned between the upper and lower mold tools to form a first mold cavity between the upper and intermediate mold tools and a second mold cavity between the intermediate and lower mold tools. In this molding step upper and lower material layers are individually pre-molded in the two cavities. In a second molding step, the intermediate mold tool is moved laterally away, and the upper and lower mold tools are moved directly into molding cooperation with each other. Thereby, the separately pre-molded upper and lower material layers are brought together, laminated, bonded, and molded to produce a finished, two-layered molded component.

Abstract: There is provided a device for covering a core of a foothold with a synthetic resin capable of certainly and easily holding the core for the foothold in a floating state, enabling one supply passage to supply the synthetic resin so as to cover the outer periphery of the core for the foothold with the synthetic resin, eliminating a surface where the synthetic resins are mixed with each other as made in the prior art, thereby manufacturing a strong foothold. The device comprises a lower mold for holding the core of the foothold, an upper mold for covering the upper portion of the core, wherein a plurality of pins stand upright on the lower mold, which pins are urged by springs at portions corresponding to a tread and leg portions of the foothold, pistons for fixing the core to portions in the vicinity of both ends of the portion corresponding to the tread are provided in the back and forth direction of the core while opposing the core.

Abstract: The present invention has an object of eliminating the holding pin trace of a composite-mold of the dichromatic molding by refilling with resin by the pushing pin and preventing the lateral-shift of the primary mold during the refilling. It is made possible to fill closed recess and cavity with resin through a communicating hole formed in the primary mold by the pushing pin. A primary cavity die 11 and a secondary cavity die 12 are juxtaposed at symmetrical positions of a fixed plate 1. Core dies 14 closing alternately with both thereof are juxtaposed on a rotary table 7 installed on a movable platen 4. Holding pins 15 of the primary mold 30 and a resin pushing pin 16 are installed in the core die 14 in a way to appear and disappear in respect to a cavity. The primary mold 30 is held in contact with the secondary cavity die surface by the holding pin 15. A pin hole 20 of resin for refilling is formed to be opened on a core die surface by retracting the pushing pin 16.

Abstract: The bellows (6) of a filter cartridge is inserted into an injection-molding die (3) and provided with the plastic frame (24) by an injection-molding process. The surfaces of the die (3) that lie opposite one another are provided, at least at their edge surfaces (15), with sawtooth-like profiles (1, 2; 30, 31). The sawtooth-like profiles engage with one another and hold the individual folds (22, 23; 35, 36) of the bellows (6) in a defined position relative to one another. The bellows (6) is held by the profiles (1, 2; 30, 31) at its face edges (19) over a narrow region (18), and pressed together, forming a seal, for the injection-molding process.

Abstract: A method is provided for rapidly forming a cementitious panel. A cementitious mixture is introduced into a mold configured to provide the desired surface appearance and profile of the cementitious panel. The cementitious mixture is then subject to an accelerated curing process by applying microwave energy to the cementitious mixture for a predetermined time period. After a relatively short resting or cooling period, the resulting cementitious panel is ready to be removed from the mold.

Abstract: A system and method for producing fuel cell separators can produce fuel cell separators with high contact performance. The fuel cell separator production system includes an upper mold which has a pattern corresponding to a pattern of gas passages for one surface of a fuel cell separator, a lower mold which has a pattern corresponding to a pattern of gas passages for other surface of the fuel cell separator, one or more nozzles which spray a gas on the periphery of the fuel cell separator on the lower mold, and a suction device which horizontally advances and retracts in a space between the upper mold and the lower mold and removes the fuel cell separator from the lower mold. The nozzles and the suction device are formed independently from the upper mold and the lower mold.

Abstract: A split-mold, which is used for manufacturing semiconductor devices by resin-encapsulating a substrate on which a plurality of semiconductor chips are formed, includes a first mold and a second mold. The second mold has a pressing surface that is provided with a mold release sheet. The second mold has a mold-release-sheet mechanism holding a mold release sheet outside the pressing surface of the second mold and applying tension to the mold release sheet.

Abstract: A molding device is provided for molding a blower fan that has a center member embedded in a center portion of the fan. The molding device comprises a pair of molding dies which define therebetween a shaped cavity when properly coupled; and an insert die fixed to one of the pair of molding dies in such a manner that at least a part of the insert die is exposed to a shaped cavity that is produced when the molding dies are coupled. The insert die includes a base block secured to one of the pair of molding dies; a cylindrical holding bore defined by the base block; a plurality of cylindrical eccentric members having eccentric through bores whose eccentric degrees are different from one another, each eccentric member being sized to be intimately received in the cylindrical holding bore; a positioning structure that establishes angular positioning of the cylindrical eccentric members.

Abstract: A mold assembly including: a first mold half; a second mold half relatively movable with respect to the first mold half; and a thin film disposes between the both mold halves and in contact with the surface of a semiconductor chip. Because of the contact between the edges of the surface of the semiconductor chip and the thin film, the portion of the semiconductor chip at which the burr is liable to be generated is protected and no burrs are generated.

Abstract: An apparatus and a process for the compression and/or injection in-mold lamination of a decorative material (1) and for the complete bordering of at least part of the edge (2) of this decorative material with a backing material (3) are proposed. The apparatus comprises at least two mold parts—forming a cavity (4). A first mold part (5) comprises pressing means (7) and a second mold part (6) comprises holding means (8) for holding a decorative material (1), placed into the cavity (4, 4′), at a distance from a surface (9) of the cavity formed by the second mold part (6), these holding means (8) being arranged raised with respect to this surface (9), entirely within the cavity (4, 4′) and immovably with respect to the surface (9) of the latter.

Abstract: A resin-sealing mold for encapsulating a semiconductor device includes upper and lower molds with a first cavity insert forming a cavity side face portion; a first elastic post supporting the first cavity insert; an elastic plate, built in the first cavity insert, forming a cavity bottom portion; a second cavity insert embedded at a position adjacent to the elastic plate on the side opposite to the cavity; a second elastic post supporting the second cavity insert; a retainer including the first cavity insert and the second cavity insert; and a backing plate to which the first elastic post, the second elastic post and the retainer are attached. Generation of thin burrs that tend to appear on the periphery of the package and in the vicinity of the cull section is prevented, and, consequently, a resin-sealing mold with high reliability is produced.

Abstract: Device for the bordering of decorative material (1), in particular a carpet, a fabric or a sheet, a border (4) being capable of being formed in a die mold (2) for back-pressing and/or back-injection, at least parts of the edge (3) of this decorative material (1), characterized in that this border (4) comprises a rim (7) which extends essentially at right angles to the main direction of extent (8) and along the edge (3) of this decorative material (1) and which is essentially at right angles to the main direction of extent (8) of the decorative material (1) and comprises a multiplicity of fingers (9) engaging over and/or under the decorative material (1), this rim (7) and these fingers (9) being capable of being produced in one piece and of being connected to the decorative material (1) in the same operation.

Abstract: The present invention relates to a multiple foam substrate of predetermined shape and a method of manufacturing the substrate. The substrate is a multiple foam substrate which may be manufactured by the method with a mold having first and second mold cavities. The method includes injecting a first foam into the first mold cavity sufficiently to fill the first mold cavity and storing the first foam in the first mold cavity for a predetermined time sufficient to form a substantially non-mixing surface on the first foam. The method further includes injecting a second foam into the second mold cavity and onto the non-mixing surface on the first foam sufficiently to fill the second mold cavity. The method further includes storing the second foam in the second mold cavity for a predetermined time sufficient to bond the first foam to the second foam along the non-mixing surface.

Abstract: According to one embodiment of the present invention, there is provided a method of manufacturing a polymeric bearing component (22) for use in joint arthroplasty for cooperation with a first joint component (12) and a second joint component (16). The method includes the step of providing a non-linear reinforcing support (36) of a durable material having a first end (86) and a second end (94). The method further includes the step providing a molding die (62) adapted for manufacturing the bearing component (22) for use in total joint arthroplasty and having a first mold portion (66) and a second mold portion (76). The first mold portion (66) is adapted to provide a first surface (70) of the bearing component (22) for cooperation with the first joint component (12) and the second mold portion (76) is adapted to provide a second surface (80) of the bearing component (22) for cooperation with the second joint component (16).

Abstract: A mold has two mold halves (6, 7). One of the mold halves (6) includes a contact section (8) which is adapted to contact a surface (5) of a semiconductor chip (1) mounted in the mold, in use.

Abstract: Contacts connected to wires are set in a lower mold and an upper mold is then fitted on the lower mold. The upper and lower molds include contact restraining portions and wire restraining portions, and upper mold holding members and lower mold holding members extending into the cavity at opposite positions enabling these holding members to restrain the wires. The upper and lower molds further include elastic members arranged to urge the upper and lower mold holding members into the cavity of the upper and lower molds for restraining the wire before an insulating plastic material is poured into the cavity. Either of the upper and lower mold is provided with a contact positioning portion adapted to abut against distal ends of the contacts for positioning the contacts relative to the molds.

Abstract: A method and system for casting a thermoset layer over a golf ball precursor product is disclosed herein. The system includes multiple stations connected by a conveyor system. The thermoset flowable material is dispensed into a plurality of cavities on each of the mold halves. A plurality of golf ball precursor products are then centered and inserted into the first mold half cavities. The mold halves are mated, heated and cooled. Then, at a de-molding station, the mold halves are separated and the thermoset layered golf balls are removed from the second mold half. A preferred thermoset material is a thermoset polyurethane.