Female Mold Or Preform Support Vertically Movable Patents (Class 425/125)
  • Patent number: 10427966
    Abstract: Disclosed here are a glass forming apparatus and a method of forming a glass. A glass forming apparatus of the present invention includes a transfer unit which moves a material, a preheating unit which preheats the material supplied by the transfer unit, a curved surface forming unit which forms the material in a curved shape, and a cooling unit which cools the material in the curved shape transformed by the curved surface forming unit, wherein the curved surface forming unit includes a moving mold in which a plurality of curved surface-shaped cores configured to seat the preheated material are formed and the moving mold is provided to be movable, a first mold disposed to face the moving mold, a plurality of cavities formed between the moving mold and the first mold, and a pneumatic device which generates a vacuum pressure in the plurality of cavities to adhere the material to the curved surface-shaped cores.
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: October 1, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jeong Soo Yea, Sang Jun Jung, Kyong Rok Kang, Dong Oh Min, In Youl Seo, Sung Jin Jang
  • Patent number: 10245771
    Abstract: The invention relates to a method for filling a mold cavity of a molding tool in a volumetrically correct manner. A molded part/volume equivalence is ascertained during a learning phase, and production injection-molding cycles are influenced during a production phase such that the molded part/volume equivalence ascertained during the learning phase is also satisfied during the production injection-molding cycle.
    Type: Grant
    Filed: October 2, 2014
    Date of Patent: April 2, 2019
    Assignee: KRAUSSMAFFEI TECHNOLOGIES GMBH
    Inventors: Reinhard Schiffers, Stefan Moser, Stefan Kruppa
  • Patent number: 9993942
    Abstract: This document describes systems and processes for forming improved synthetic molded slabs suitable for use in living or working spaces (e.g., along a countertop, table, floor, or the like).
    Type: Grant
    Filed: October 9, 2015
    Date of Patent: June 12, 2018
    Assignee: Cambria Company LLC
    Inventors: Jon Louis Grzeskowiak, II, Martin E. Davis
  • Patent number: 9158037
    Abstract: A resin molded product includes a primary molded object molded by a primary molding die, and a secondary molded object formed to be integrated with the primary molded object by a secondary molding die, the secondary molding die including a shared molding die which shares a part of the primary molding die. The primary molded object includes a rotation regulation portion making a mutual concave-convex fit engagement at a joint portion between the primary molded object and a molding surface of the shared molding die and regulating rotation and shift of the primary molded object in circumferential directions about a center axis of the primary molded object.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: October 13, 2015
    Assignee: OLYMPUS CORPORATION
    Inventors: Yoshitaka Otsuka, Kazuhiro Kikumori
  • Patent number: 9082775
    Abstract: The present invention describes two systems (100, 300) for encapsulation of semiconductor dies. Both systems (100, 300) involve attaching an encapsulation spacer (102, 302, 302a, 302b) having one or more apertures (104, 304) on an associated substrate (150) so that a group of chips is located within the aperture (104, 304). The first system (100) involves dispensing encapsulant (103) directly into an aperture. The second system (300) involves attaching an encapsulant delivery layer (350, 351) onto the encapsulation spacer and discharging encapsulant into an aperture via a recessed gate (308).
    Type: Grant
    Filed: November 17, 2009
    Date of Patent: July 14, 2015
    Assignee: Advanpack Solutions Pte Ltd
    Inventors: Amlan Sen, Chin Guan Khaw
  • Patent number: 9011748
    Abstract: A die for producing pressed, fiber-reinforced plastic components, as well as a method for producing the plastic component, and the plastic component itself. The plastic components comprising at least two structural parts which overlap one another a pressing direction such that the die comprises at least one upper die portion formed with a pressing unit for applying a pressing force in the pressing direction, and at least one lower die portion which cooperates with the upper die portion to form a cavity in which the plastic component is formed. A die insert is fitted in the die and can move by and with the upper die portion and is designed to transmit the pressing force to the at least one structural part of the plastic component which is overlapped by the other structural part of the plastic component in the pressing direction.
    Type: Grant
    Filed: May 22, 2012
    Date of Patent: April 21, 2015
    Assignee: ZF Friedrichshafen AG
    Inventors: Thomas Eifflaender, Daniel Wolf, Jens Heimann
  • Patent number: 8974224
    Abstract: Method and apparatus for overmolding delicate parts are disclosed. A mold unit for an injection molding apparatus can be provided. The mold unit can include a clamping mechanism and a locking mechanism. The clamping mechanism can be positioned in contact with the delicate part. The position of the clamping mechanism can be selected such that the clamping mechanism does not exert a force that damages the delicate part. The delicate part can vary in size from part to part. Thus, as the overmolding process is repeated, the position that is selected each time for the clamping mechanism can vary depending on the size of a part that is used. The locking mechanism can be configured to lock the clamping mechanism into the position selected for the part.
    Type: Grant
    Filed: March 8, 2011
    Date of Patent: March 10, 2015
    Inventor: Craig M. Stanley
  • Patent number: 8936453
    Abstract: An apparatus for continuously forming a continuous element made of expanded plastic material comprises: a loading section of a mass of granules made of expandable plastic material; a sintering section of the continuous element made of expanded plastic material extending downstream of the loading section; a stabilizing section of the continuous element made of expanded plastic material extending downstream of the sintering section; a forming tunnel extending along the sintering and stabilizing sections and defined between a pair of lateral walls and a pair of gas permeable conveyor belts, supported by respective supporting tracks. Further, at least one of the supporting tracks of the gas permeable conveyor belts comprises at least one portion extending in the sintering section and angularly tiltable with respect to a transversal centerline plane (?) of the forming tunnel for varying the height of the tunnel in a longitudinal direction.
    Type: Grant
    Filed: June 25, 2008
    Date of Patent: January 20, 2015
    Assignee: Gilanberry Trading Ltd.
    Inventor: Piero Cretti
  • Patent number: 8932038
    Abstract: A sealing apparatus that includes a first mold in which a core is formed and a second mold in which a skin is formed which are combined to attach the core and the skin to seal a foaming space between the core and the skin. The apparatus further includes a slide mold installed to be moved horizontally in the first mold or the second mold to be moved forward by a restoring force of a support member to attach the skin to the core. The resilient support member is installed to support the slide mold and a position constraining member is coupled to the slide mold to release the constraint of the slide mold to allow the slide mold to be moved forward when the foaming space is sealed while the movement of the slide mold is constrained.
    Type: Grant
    Filed: April 22, 2013
    Date of Patent: January 13, 2015
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventor: Byung Seok Kong
  • Patent number: 8911225
    Abstract: [Problem] To suppress the deviation of a synthetic resin to be fed to a metal mold and to enable the to-be-compression-molded synthetic resin to be easily molded into a shape of a pre-molded article that is to be molded. [Means for Solution] A female mold 31 includes a moving rod 34 and female mold body 33 surrounding the moving rod 34, the female mold body 33 forming a cavity 33a that is opened upward, the moving rod 34 moving up and down between a normal position and an elevated position above the normal position, and when a synthetic resin 8 is to be fallen down from the a synthetic resin cutting/holding unit 14, the moving rod 34 moves to the elevated position so that the synthetic resin 8 falls down on the upper surface of the center member.
    Type: Grant
    Filed: October 23, 2008
    Date of Patent: December 16, 2014
    Assignee: Toyo Seikan Kaisha, Ltd.
    Inventors: Yutaka Asano, Norihisa Hirota, Jotaro Nagao
  • Patent number: 8858858
    Abstract: A method of forming a container from a construct. The method includes obtaining a tool having a cavity, a core, and an articulated section for being moveable within the cavity relative to the cavity and the core. The method further includes placing a construct between the cavity and the core, moving the core relative to the cavity so that the articulated section at least partially initially grips a portion of the construct, and further moving the core into the cavity. The portion of the construct remains gripped by the articulated section in the cavity during the further moving of the core.
    Type: Grant
    Filed: July 16, 2012
    Date of Patent: October 14, 2014
    Assignee: Graphic Packaging International, Inc.
    Inventors: Scott William Middleton, Mark Richard Sinclair, Brian Robert O'Hagan, Patrick Henry Wnek, Terrence Philip Lafferty, Peter Walrave Blaas, Kevin James Hjort, Patrick James Smith
  • Patent number: 8859339
    Abstract: A mold chase for packaging a semiconductor die includes first and second toothed mold clamps, each having teeth, recesses located between the teeth, and an open cavity located in a center of the first mold clamp. The second mold clamp is in facing arrangement with the first mold clamp and the teeth in the first mold clamp mate with corresponding recesses in the second mold clamp and vice-versa. In an open position a lead frame can be inserted into one of the first or second mold clamps and in a closed position, the teeth and recesses of the first and second mold clamps bend leads of the lead frame into two spaced, planar rows.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: October 14, 2014
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Zhigang Bai, Jinzhong Yao
  • Patent number: 8851875
    Abstract: A semiconductor package molding system includes a press unit, a loading apparatus for loading the first member and the first resin member on the first press apparatus and the second member and the second resin member on the second press apparatus, an unloading apparatus which is adapted to unload a molded first mold from the first press apparatus and a molded second mold from the second press apparatus, and a control unit which is adapted to apply a control signal to the press unit, the loading apparatus, and the unloading apparatus. The press unit includes at least one first press apparatus which is adapted to press a first resin member against a first member to mold a first mold, and at least one second press apparatus which is adapted to press a second resin member against a second member to mold a second mold.
    Type: Grant
    Filed: September 22, 2011
    Date of Patent: October 7, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Young-jin Hwang
  • Publication number: 20140197567
    Abstract: A compacting and injection mold for a fiber preform is for use in fabricating a turbine engine guide vane out of composite material. The mold includes a shell forming a trough that is to receive the fiber preform and that is closed in leaktight manner by bottom and top covers, compacting blocks arranged inside the trough each having a surface pressing normally against a surface of the fiber preform that is to be compacted, and closure blocks arranged inside the trough. Each closure block has a surface pressing normally against a surface of a compacting block and does not have a surface in contact with the fiber preform.
    Type: Application
    Filed: May 3, 2012
    Publication date: July 17, 2014
    Applicant: SNECMA
    Inventors: Romain Plante, Lise Lacroix, Olivier Patrigeon, Jean-Pierre Cauchois, Pascal Burex
  • Patent number: 8727757
    Abstract: The molding die set includes: a first molding die having a first molding chase, a cavity piece, supported by the first molding chase, movably supported by the first molding chase and enclosing the cavity piece; a second molding die having a second molding chase, a work supporting section biased and supported by the second molding chase and on which a work will be mounted, and a center insert located adjacent to the work supporting section; and a pot being provided to one of the first molding die and the second molding die, the pot feeding resin for molding the work. The second molding die has a thickness adjusting mechanism, which makes the work supporting section absorb thickness variation of the work and brings the work into contact with the movable clamper when the work is clamped with the movable clamper of the first molding die.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: May 20, 2014
    Assignee: Apic Yamada Corporation
    Inventors: Masanori Maekawa, Tomokazu Takahashi
  • Patent number: 8721321
    Abstract: A tool for forming a container from a construct. The container comprises a bottom wall and at least one sidewall foldably connected to and extending upwardly from the bottom wall to form an interior space of the container. The tool comprises a cavity having at least one peripheral wall for at least partially forming the sidewall of the container. The tool comprises a core operatively associated with the cavity and being operable to move within the cavity to position the at least one sidewall of the container relative to the bottom wall to form the interior space. The tool comprises at least one articulated section movably received in the cavity. The at least one articulated section being for gripping at least a portion of the at least one sidewall of the construct, when the core is moved relative to the cavity to form the interior space of the container.
    Type: Grant
    Filed: November 19, 2010
    Date of Patent: May 13, 2014
    Assignee: Graphic Packaging International, Inc.
    Inventors: Scott William Middleton, Mark Richard Sinclair, Brian Robert O'Hagan, Patrick Henry Wnek, Terrence Philip Lafferty, Peter Walrave Blaas, Kevin James Hjort, Patrick James Smith
  • Patent number: 8684718
    Abstract: First, a horizontal nozzle is inserted between an upper mold section and a lower mold section in a horizontally extending state. Then, liquid resin is horizontally discharged from a discharge port of the horizontal nozzle. Thus, the liquid resin is supplied into a cavity. Thereafter the upper mold section and the lower mold section are closed. Consequently, an electronic component mounted on a substrate is dipped in the liquid resin stored in the cavity. Therefore, the electronic component is resin-sealed on the substrate by compression molding.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: April 1, 2014
    Assignees: Towa Corporation, Shin-Etsu Chemical Co., Ltd.
    Inventors: Tetsuya Yamada, Tomoyuki Gotoh
  • Patent number: 8556617
    Abstract: For manufacture of fiber-reinforced components, a positionable base frame is used on which a controllable holding device is provided for gripping and holding at least one reinforced fiber layer. A draping device is provided on the base frame, using which the reinforced fiber layer may be draped onto a mold core via the application of a vacuum.
    Type: Grant
    Filed: July 7, 2009
    Date of Patent: October 15, 2013
    Assignee: Broetje Automation GmbH
    Inventors: Raphael Reinhold, Stefan Juergens
  • Patent number: 8540917
    Abstract: An insert molding method includes holding a plurality of insert members in a molding die to be separated from one another, and subsequently filling a resin into the molding die to fill a gap between the insert members and a periphery thereof with the resin to form an insert molded product such that the insert members are separated at a preset interval from one another. The molding die includes a space-maintaining projection for maintaining a separation interval between the insert members at the preset interval or more, the projection being formed on an inner wall surface of the molding die opposite to a longitudinal end of the insert members, and a gate for filling the resin therethrough into the molding die, the gate being formed on an inner wall surface of the molding die opposite to a side of the insert members in a width direction thereof.
    Type: Grant
    Filed: December 1, 2010
    Date of Patent: September 24, 2013
    Assignee: Hitachi Cable, Ltd.
    Inventors: Satoshi Yamamoto, Akihiro Tanba, Masafumi Kaga
  • Patent number: 8529238
    Abstract: A tool for creating a container or tray having various features. The tool comprises a cavity operable to receive a blank. The cavity has at least one sidewall for forming at least one sidewall of the container. A core is operatively connected to the cavity. The core is operable to enter the cavity to least partially form the blank into the container. An injection cavity is for receiving liquid resin and directing liquid resin around at least a portion of the perimeter of the blank. The injection cavity comprises an advanced-flow section and a delayed-flow section. The advanced-flow section has a greater cross-sectional area than the delayed-flow section, and the advanced-flow section is located adjacent the at least one sidewall of the cavity.
    Type: Grant
    Filed: April 24, 2012
    Date of Patent: September 10, 2013
    Assignee: Graphic Packaging International, Inc.
    Inventors: Scott William Middleton, Mark Richard Sinclair, Brian Robert O'Hagan, Patrick Henry Wnek, Terrence Philip Lafferty, Peter Walrave Blaas, Kevin James Hjort, Patrick James Smith
  • Patent number: 8491298
    Abstract: A method is disclosed for the sealing of hard shell capsules having coaxial body parts which overlap when telescopically joined. Also described is an apparatus to seal the capsules. The method comprises the steps of holding the capsule in a precise and upright position and injecting a known quantity of sealing fluid in the overlap of the body parts. An apparatus for performing the method is also disclosed. The apparatus comprises a sealing clamp (1, 11, 21, 31, 41, 51, 61) to hold the capsule in an upright position and means (5, 15, 25, 35, 45, 55, 65) to inject the sealing fluid in the overlap of the body parts.
    Type: Grant
    Filed: June 22, 2011
    Date of Patent: July 23, 2013
    Assignee: Capsugel Belgium NV
    Inventors: Dominique Nicolas Cade, Hoehn Frederic, Robert Anthony Scott, Peter Charles Philippe
  • Patent number: 8465271
    Abstract: An injection mold for molding a product including an insert element, which includes a plurality of terminals each having a contacting portion, includes a male mold and a female mold movably engaged with the male mold. The male mold includes a male platen for fixing a fastening element therein. The fastening element defines a plurality of fastening grooves for fastening the contacting portions in a first male groove opened on the male platen. The male mold further includes a supporting element cooperating with the male platen to fixing a locating mold core in the male platen. A top end of the locating mold core projects into the first male groove and further defines a locating groove for fastening one contacting portion adjacent to a male sprue which is opened on the male platen and connected with the first male groove via a second male groove of the male platen.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: June 18, 2013
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Gang-Fu Cai, Ya-Bo Zou, Xin-Jin Gui, Kun-Hsueh Chiang
  • Patent number: 8454875
    Abstract: The present invention refers to a method and to a device fro producing a molded port having a plurality of different decorative regions that abut each other, wherein the different decorative films (9, 10) are inserted into a molding tool (1) by a gripper (4). There they are fixed be means of sliders (8) and are then back molded with a thermoplastic material.
    Type: Grant
    Filed: September 1, 2009
    Date of Patent: June 4, 2013
    Assignee: Peguform GmbH
    Inventor: Yann Buchet
  • Publication number: 20130087901
    Abstract: In one aspect of the present invention, an integrated circuit package with an exposed die and a protective housing will be described. The housing extends beyond the exposed back surface of the die to help protect it from damage. The integrated circuit package includes a lead frame and an integrated circuit die. The integrated circuit die is electrically and physically attached to the lead frame. The housing encapsulates the lead frame and the die. The housing also includes a recessed region at the bottom of the package where the back surface of the die is exposed. There is a protruding protective structure at the bottom of the package that helps to protect the die and prevent its exposed back surface from coming in contact with an external object.
    Type: Application
    Filed: October 10, 2011
    Publication date: April 11, 2013
    Applicant: NATIONAL SEMICONDUCTOR CORPORATION
    Inventors: Lee Han Meng @ Eugene LEE, Kok Leong YEO, Kooi Choon OOI, Chen Seong CHUA
  • Publication number: 20130082416
    Abstract: Compression overmold die tool (2) comprising a base die (4) and a counter compression die (6) mountable in a machine operable to move the dies towards and away from each other, the base die and counter compression die each having surfaces (8, 10) configured to receive a base element (16) there between and to form a shape of an overmold material (18) by compression overmolding on the base element. The compression overmold die tool further comprises at least one active core (12) mounted in a body (9) of at least one of the base die and counter compression die, the at least one active core relatively movable with respect to said body and configured and operable to be pressed against said base element prior to full closing of the compression overmold die tool to define at least one non-overmold surface portion (26) on the base element.
    Type: Application
    Filed: September 26, 2012
    Publication date: April 4, 2013
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventor: E I DU PONT DE NEMOURS AND COMPANY
  • Patent number: 8366982
    Abstract: The present disclosure relate to the field of depositing an underfill material between a microelectronic die and a substrate for flip-chip packages. In at least one embodiment, differential pressure is used to meter the underfill material during the underfill deposition process.
    Type: Grant
    Filed: April 7, 2010
    Date of Patent: February 5, 2013
    Assignee: Intel Corporation
    Inventor: Bogdan M. Simion
  • Patent number: 8252217
    Abstract: A container has a base panel, at least one side panel extending upwardly from the base panel, and at least one end panel extending upwardly from the base panel. At least one corner is formed at a junction between the side panel and end panel. A flange extends laterally outward from the upper edges of at least one of the side panel, end panel, and corner. An injection-molded structure extends along at least a portion of the flange, the injection-molded structure includes a base portion adjacent the upper edges of the side wall and the end wall, a distal portion extending laterally outward from the base portion, and an indentation in the distal portion extending along at least a portion of the flange of the container. An apparatus for forming the container and a method of manufacturing are also disclosed.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: August 28, 2012
    Assignee: Graphic Packaging International, Inc.
    Inventors: Patrick H. Wnek, James B. Kluz, Ronald P. Marx
  • Patent number: 8210838
    Abstract: A method and device for producing a battery electrode (5) by: pouring a powder mixture quantity (6a) into a cavity (2), laying an electrically conductive diverter (4) on powder mixture (6a), pouring a further quantity (6b) of same powder mixture (6) into same cavity (2), and compressing the two powder mixture quantities (6a, 6b). The device has a filling cavity (2) for powder mixture (6), at least one compression means (1) for compressing powder mixture (6), and support (7) and fixing means (8) for positioning and fixing an electrically conductive diverter (4). The diverter (4) is situated so that partial quantities (6a, 6b) of powder mixture (6) are located above and below diverter (4). The support means (7) and fixing means (8) are situated in such a way that a ratio of the partial quantities (6a, 6b) of powder mixture (6) above and below the diverter (4) remains essentially maintained.
    Type: Grant
    Filed: June 14, 2010
    Date of Patent: July 3, 2012
    Assignee: Biotronik CRM Patent AG
    Inventors: Gerd Fehrmann, Thomas Fischer, Thomas Hucke, Roland Staub, J├╝rgen Drews, Tim Traulsen
  • Publication number: 20120161359
    Abstract: A method of molding a resin member formed by solidifying molten resin M on a resin member on which molding is to be performed, includes first to third steps. The first step includes setting, on the member on which molding is to be performed, a first mold having a first cavity for molding a portion corresponding to a base portion of the resin member. The second step includes setting, on the first mold, a second mold having a second cavity for molding a portion corresponding to a main body portion of the resin member. The second cavity is formed so as to communicate with the first cavity. The third step includes pouring molten M resin into each of the cavities of both of the molds that have been set, and solidifying the molten resin M thus poured such that it is bonded to the member on which molding is to be performed.
    Type: Application
    Filed: December 28, 2010
    Publication date: June 28, 2012
    Applicant: KOJIMA PRESS INDUSTRY CO., LTD.
    Inventor: Hirofumi MIZUNO
  • Patent number: 8192190
    Abstract: An injection mold for molding an insert element which includes a material belt with two belt holes formed therein and a plurality of terminals. Each terminal has a fastening portion with an inserting hole formed therein and a contact portion. The injection mold includes a male mold, a plurality of locating elements, a fastening element, a plurality of locating pieces and a female mold. The male mold has a cavity and a plurality of inserting grooves. Each locating element mounted to the male mold has a locating head extending beyond the male mold for inserting into the belt holes. The fastening element mounted to the cavity has a plurality of fastening grooves for respectively receiving the fastening portions. Each locating piece inserted into the inserting grooves has an inserting portion passing through the inserting hole and supporting the contact portion. The female mold is engaged with the male mold.
    Type: Grant
    Filed: May 24, 2010
    Date of Patent: June 5, 2012
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Wen-Peng Gong, Xian-Yun Wang, Xiao-Ping Wu, Shih-Hsiung Ho
  • Patent number: 8187060
    Abstract: A poultry skinner including a conveyor having ribs aligned to engage the upper surface of a poultry product. A rotatably mounted gripper has a plurality of radially extending fins adapted to engage the lower surface of the poultry passing between the gripper and the conveyor. An arcuate surface is mounted in closely spaced relationship to the arcuate path traveled by the rotating gripper fins and defines an opening for trapping the skin attached to the poultry product. The skin is trapped between the arcuate surface and the outer end of a rotating fin to pull the skin from the poultry product. A rotatably mounted cleaning roller having a plurality of fins is positioned in a close clearance relationship with the gripper. The rapidly rotating fins of the cleaning roller strip the poultry skin from the fins of the gripper and eject it into a collection bin below.
    Type: Grant
    Filed: May 17, 2011
    Date of Patent: May 29, 2012
    Assignee: Remington Holdings, LLC
    Inventor: Geno N. Gasbarro
  • Publication number: 20120126453
    Abstract: A pellet loading apparatus includes a tablet pusher including a support surfaces including a pusher mechanism coupled thereto for vertical movement upon actuation. A tablet holder on the tablet pusher includes locations framed by sidewall members aligned in the vertical direction that form columns having open tops for holding a pellet stacks of mold component pellets. A pellet separator having a solid portion and apertures is sized to fit around a portion of a top mold pellet in the pellet stacks. The pellet separator includes a pellet drive for lateral moving the top mold pellets relative to under pellets so that after lateral movement the top mold pellets are laterally offset from the under pellets. A tablet lifter includes a pellet stopper having receiving positions for receiving top mold pellets upon receipt after a transfer actuation of the pusher mechanism.
    Type: Application
    Filed: November 24, 2010
    Publication date: May 24, 2012
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Norbert Joson Santos, Edgar Dorotayo Balidoy, Anthony Steven Dominisac Panagan, Freddie Mariano Dela Cruz
  • Patent number: 8167605
    Abstract: An assembly and related process for mass producing a resin coated article including an input line transporting a plurality of inserts and an output line removing the resin coated articles. One or more mold supporting and closed loop conveyor lines extend between the input and output lines, the conveyor line including a mold assembly line and an empty mold return line. A first lift and transfer mechanism communicates between the input line and mold assembly line for collecting, in succession, an insert and an upper mold half for installation with a lower mold half supported upon the assembly line. A mixing and dispensing station communicates with each mold in succession to fill an interior thereof with a viscous and curable resin material.
    Type: Grant
    Filed: May 8, 2009
    Date of Patent: May 1, 2012
    Assignee: Oria Collapsibles, LLC
    Inventor: Miguel Linares
  • Patent number: 8123509
    Abstract: An injection molding process for the preparation of an oral delivery device comprising a core which contains a pharmaceutically active agent, having a coating with one or more openings leading to such a core. The invention also relates to devices produced by the process, and to injection molds suitable for performing the process.
    Type: Grant
    Filed: November 30, 2009
    Date of Patent: February 28, 2012
    Assignee: SmithKline Beecham Limited
    Inventors: Allan J. Clarke, Robert Glinecke, Ronald Raby, Chi Leung Li, Luigi Martini
  • Patent number: 8123507
    Abstract: A cotton candy machine includes a housing and a stick grabbing device mounted in the housing. A stick rotating device is mounted in the housing and aside corresponds to the stick grabbing device. A feeding device is mounted in the housing and a sugar floss maker is horizontally mounted in the housing under the stick rotating device. The stick grabbing device provides stick one by one and conveys the stick to the stick rotating device. The stick rotating temporarily holds the stick, rotates the stick and makes the stick longitudinally insert into the sugar floss maker for coiling the sugar floss from the sugar floss maker after the feeding device providing sugar material into the sugar floss maker.
    Type: Grant
    Filed: October 29, 2009
    Date of Patent: February 28, 2012
    Inventor: Yi-Chiang Yang
  • Patent number: 8119049
    Abstract: Injection-molding processes and systems are described herein. An exemplary method involves: (a) holding one or more inserts in a desired position within a mold cavity by contacting a retractable core to at least a portion of each insert, wherein the retractable core is a feature of a mold plate; (b) while the one or more inserts are being held in the desired position by the retractable core, initiating an injection of molten plastic into the mold cavity; (c) retracting the retractable core from the one or more inserts while continuing the injection of molten plastic into the mold cavity, wherein retracting the retractable core creates additional cavity space within the mold cavity between the retractable core and the one or more inserts; and (d) continuing the injection of molten plastic into the mold cavity until the mold cavity, including the additional cavity space, is filled.
    Type: Grant
    Filed: August 10, 2010
    Date of Patent: February 21, 2012
    Assignee: Pollmann North America, Inc.
    Inventors: Robert Pollmann, Andreas Reger, Roland Kuehtreiber
  • Patent number: 8119048
    Abstract: A housing case for a small electric device and communication device includes a flat plate having a dimension substantially the same as that of the front portion of the housing case and comprising at least a glass plate, and a resin frame integrated with the flat plate to support the backside periphery of the flat plate.
    Type: Grant
    Filed: September 20, 2007
    Date of Patent: February 21, 2012
    Assignee: Nissha Printing Co., Ltd.
    Inventor: Takeshi Nishimura
  • Patent number: 8062016
    Abstract: An injection molded article with which a sheet-like material, such as a decorative sheet, is integrated is manufactured without causing damage to the sheet-like material. A molten resin injected into a mold cavity, passes smoothly a peripheral edge of the mold cavity, and flows into a groove portion without accumulating in the vicinity of the peripheral edge. When cooling the molten resin, the temperature of the molten resin in the groove decreases more quickly than the temperature of the molten resin in the mold cavity, because the volume of the groove portion is smaller. As a result, the viscosity of the molten resin in the groove portion and in the vicinity of the peripheral edge of the mold cavity is increased rapidly, preventing a further volume of the molten resin from flowing into the groove portion. The sheet-like material in the vicinity of the peripheral edge is covered by the resinous material of diminished fluidity and protected against exposure to heat and/or pressure of the molten resin.
    Type: Grant
    Filed: August 8, 2006
    Date of Patent: November 22, 2011
    Assignee: Moriroku Company, Ltd.
    Inventors: Hideki Baba, Koji Akasaka, Daiju Kawakami
  • Patent number: 8057719
    Abstract: A housing case for a small electric device and communication device includes a flat plate having a dimension substantially the same as that of the front portion of the housing case and comprising at least a glass plate, and a resin frame integrated with the flat plate to support the backside periphery of the flat plate.
    Type: Grant
    Filed: September 20, 2007
    Date of Patent: November 15, 2011
    Assignee: Nissha Printing Co., Ltd.
    Inventor: Takeshi Nishimura
  • Patent number: 8052115
    Abstract: An insert molding apparatus includes a first mold and a second mold. The first mold has at least two cavity plates which cooperatively define at least one receiving groove therebetween. At least two connecting elements each have its one end positioned in one of the at least two cavity plates while the other end passing through the other cavity plate for movably connecting the at least two cavity plates with each other. At least one elastic element is compressibly disposed between and against the cavity plates in such a manner such that the at least two cavity plates are capable of contacting with each other or separating from each other. The second mold is engaged with the first mold for compelling one of the at least two cavity plates to move toward the other cavity plate so that the at least two cavity plates are in contact with each other.
    Type: Grant
    Filed: September 3, 2008
    Date of Patent: November 8, 2011
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventor: Peng He
  • Patent number: 8052408
    Abstract: Disclosed is a two-way pre-stress system for applying pre-stress to a member of a structure by a pre-tendon method, the system comprising: a mold for forming the member, the mold having a concrete pouring space; a supporter installed outside the mold; at least one horizontal tendon installed in the mold in a horizontal direction; a horizontal tendon settling device installed at the supporter, for settling the horizontal tendon in the mold; at least one vertical tendon installed in the mold in a vertical direction; a vertical tendon settling device installed at the supporter, for settling the vertical tendons in the mold; and a bending device installed at the supporter and combined with at least one of the vertical tendon, for forming a bent portion in at least one vertical tendon in a deep portion of the member.
    Type: Grant
    Filed: June 4, 2008
    Date of Patent: November 8, 2011
    Assignee: Samsung Corporation
    Inventors: Dong-Ok Kang, Man-Geun Yoon, Hyun-Yang Shin, Yeong-Seon Kim
  • Patent number: 8043545
    Abstract: Methods and apparatus to evenly clamp semiconductor substrates in a transfer mold process are disclosed. A disclosed split mold base includes a first plate having a first surface, a second plate having a second surface opposite the first surface, and a plurality of springs that are disposed between the first and second plates to distribute a clamping pressure applied by a mold press.
    Type: Grant
    Filed: December 31, 2007
    Date of Patent: October 25, 2011
    Assignee: Texas Instruments Incorporated
    Inventors: Selvarajan Murugan, Abdul Rahman Mohamed Rafaie
  • Patent number: 8033806
    Abstract: Disclosed herein is an apparatus for manufacturing a secondary battery by performing insert injection molding with respect to a portion of a battery cell while the battery cell is located in a mold, wherein the apparatus comprises a pair of upper and lower molds, at which are formed shapes corresponding to the battery cell, the upper and lower molds are provided at the inside surfaces thereof with elastic members, and the elastic members are constructed in a structure in which the elastic members support a cell body of the battery cell and isolate a non-molding region from a molding region while the battery cell is mounted in the upper and lower molds.
    Type: Grant
    Filed: September 8, 2006
    Date of Patent: October 11, 2011
    Assignee: LG Chem, Ltd.
    Inventors: Junill Yoon, Ji Hoon Han, Heekook Yang
  • Patent number: 8033807
    Abstract: A foil-decorating injection molding apparatus having a male mold, a female mold, a transport chuck for feeding a decorative sheet S between the male mold and the female mold, and a clamper for pressing and fastening the decorative sheet onto a parting surface of the female mold. The transport chuck consists of two clamping devices each clamping a side edge of the decorative sheet. The clamper consists of a pressing frame and a connecting member. When the pressing frame is in abutment with the female mold, a space is provided between the connecting member and the female mold in which the clamping devices can pass through. After the decorative sheet is fed by the clamping chuck, the sheet can be fastened by the clamper without waiting until the chuck is brought back to an initial standby position, thereby reducing the manufacturing time.
    Type: Grant
    Filed: August 26, 2004
    Date of Patent: October 11, 2011
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventor: Hiroyuki Atake
  • Patent number: 8011917
    Abstract: A compression molding system comprising first and second mold halves is provided for an electronic device wherein a plurality of cavities are formed in the first mold half corresponding to molding locations on the electronic device. A plurality of plungers are located in the first mold half, each of which is drivable against a side of a respective cavity for applying a compacting force to encapsulation material located in the cavity during molding. A motor is operatively connected to the plungers for driving the plungers relative to the cavities.
    Type: Grant
    Filed: May 9, 2007
    Date of Patent: September 6, 2011
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Ji Yuan Hao, See Yap Ong, Jian Xiong Su, Teng Hock Kuah, Ee Ling Chiw
  • Patent number: 8007265
    Abstract: A positioning mechanism (24) for use in a mold structure (100) to position a film (30) within the mold structure is provided. The mold structure includes a core mold portion (10) and a cavity mold portion (20) mating with the core mold portion. The core mold portion includes a core plate (12) and a core insert (14) formed on the plate. The cavity mold portion includes a positioning mechanism having a moveable cavity insert (242) and an elastic member (244) for outwardly biasing the cavity insert.
    Type: Grant
    Filed: June 30, 2008
    Date of Patent: August 30, 2011
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventors: Juan-Rong Wu, Po-Feng Ho, Zhi-Zhong Xiao, Guan-Qun Zeng, Bo Zhang, Kao-Hua Guan
  • Patent number: 7968042
    Abstract: A method and apparatus for molding a structure on the top surface of a substrate. Mold material is dispensed onto an area of the top surface of the substrate. The mold apparatus is positioned over the area. The mold portion of the mold apparatus is positioned above the mold material and the mold material is surrounded with a shroud of the mold apparatus. A seal is formed between the shroud and the top surface of the substrate. The pressure is reduced within the shroud to below the ambient pressure. The mold portion of the mold apparatus is lowered toward the top surface of the substrate, so that at least the outer edge of the mold portion is in contact with the mold material. The pressure within the shroud is raised to at least the ambient pressure, and the mold material is cured to form the structure.
    Type: Grant
    Filed: April 16, 2008
    Date of Patent: June 28, 2011
    Assignee: Aptina Imaging Corporation
    Inventor: Rickie C. Lake
  • Patent number: 7934922
    Abstract: The invention relates to a device for moulding a plastic article in which the article is obtained by the compression of a quantity of plastic material (3) in the molten state between the two parts of a mould, comprising at least one supply of plastic material (1), a rod (11), sliding in a sleeve (8) suitable for temporarily supporting said quantity of plastic material (3), a mould for the head of the article (6, 7) and a mandrel (18) cooperating with said mould (6, 7), characterized in that it comprises non-elastic retaining means (12-14, 23, 24) which are suitable for limiting the bidirectional displacement of the rod (11) in the sleeve (8). The invention also relates to a method using the aforementioned device.
    Type: Grant
    Filed: April 24, 2007
    Date of Patent: May 3, 2011
    Assignee: Aisapack Holding S.A.
    Inventor: Dominique Hanot
  • Patent number: 7906056
    Abstract: A cup-shaped closing material having a convex section is fitted on a protrusion-like engagement section of a distal end of a mandrel with a gap from the engagement section of the mandrel, a molten resin is then disposed in a cavity of a molding die and a holepin having an outer peripheral section of a distal end that is smaller than an outer periphery of the distal end surface of the convex section of the closing material is pressed against the distal end surface of the convex section of the closing material, whereby the distal end surface of the convex section of the closing material is pleated to form an annular protrusion section at the outer peripheral section, and the molten resin is caused to envelope the annular protrusion section, while being pushed and charged into the cavity, whereby the head part with the closing material attached thereto is formed.
    Type: Grant
    Filed: March 3, 2006
    Date of Patent: March 15, 2011
    Assignee: Kansai Tube Co., Ltd.
    Inventor: Kazuo Nishikawa
  • Patent number: 7901196
    Abstract: A molding apparatus comprises first and second mold chases that are configured to clamp an electronic device therebetween, and a driving mechanism which drives the first and second mold chases to apply a clamping force onto the electronic device. A pressure adjustment mechanism communicates with at least one of the mold chases and applies an additional clamping pressure onto one or more portions of the mold chase. The pressure adjustment mechanism comprises movable supports that are displaceable in directions which are substantially perpendicular to the direction of the clamping force so as to transmit and apply the said additional clamping pressure onto the mold chase, and also a plurality of piezoelectric actuators which are operative to apply displacement forces to the movable supports in their displacement directions.
    Type: Grant
    Filed: March 3, 2008
    Date of Patent: March 8, 2011
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Srikanth Narasimalu, Sathish Kumar Balakrishnan, Ning Ying, Shu Chuen Ho