Female Mold Or Preform Support Vertically Movable Patents (Class 425/125)
  • Patent number: 6499983
    Abstract: A method and system for casting a thermoset layer over a golf ball precursor product is disclosed herein. The system includes multiple stations connected by a conveyor system. The thermoset flowable material is dispensed into a plurality of cavities on each of the mold halves. A plurality of golf ball precursor products are then centered and inserted into the first mold half cavities. The mold halves are mated, heated and cooled. Then, at a de-molding station, the mold halves are separated and the thermoset layered golf balls are removed from the second mold half. A preferred thermoset material is a thermoset polyurethane.
    Type: Grant
    Filed: November 2, 2001
    Date of Patent: December 31, 2002
    Assignee: Callaway Golf Company
    Inventors: Gary G. Marshall, Pijush K. Dewanjee
  • Publication number: 20020197344
    Abstract: There is provided a device for covering a core of a foothold with a synthetic resin capable of certainly and easily holding the core for the foothold in a floating state, enabling one supply passage to supply the synthetic resin so as to cover the outer periphery of the core for the foothold with the synthetic resin, eliminating a surface where the synthetic resins are mixed with each other as made in the prior art, thereby manufacturing a strong foothold.
    Type: Application
    Filed: July 25, 2001
    Publication date: December 26, 2002
    Inventor: Eizo Takahashi
  • Patent number: 6497837
    Abstract: A method for molding integrated circuit packages including a semiconductor integrated circuit chip and a lead frame with a plurality of leads is disclosed. The method employs a device formed of top and bottom mold dies having intermating teeth that provide a sealed mold cavity around the integrated circuit chip and the lead frame leads. The teeth of at least one of said mold dies are formed with inclined surfaces that assist in compensating for any misalignment between the lead frame and the dies.
    Type: Grant
    Filed: February 20, 2001
    Date of Patent: December 24, 2002
    Assignee: Accu-Mold Corp.
    Inventors: Gary O. Grams, Greg S. Peterson
  • Patent number: 6474970
    Abstract: A mould is described for moulding an elastomeric glazing profile in situ on a single major face of a sheet of glazing material, e.g. a glass sheet. The mould comprises a first mould segment and at least one further mould segment which are relatively movable into intimate contact, so that they define, together with the sheet, a mould cavity for moulding the profile on the single major face. The profile has a show face, (i.e. one which is visible in use), and the portion of the mould cavity that moulds the show face is entirely formed by a single mould segment to avoid mould lines on the show face. Also described are a corresponding moulding method and the glazing product thereby obtained, which may be used as a vehicle window.
    Type: Grant
    Filed: May 15, 2000
    Date of Patent: November 5, 2002
    Assignee: Societá Italiana Vetro-SIV-S.p.A.
    Inventors: Nicola Caldoro, Ciro Paudice
  • Patent number: 6464921
    Abstract: A method for manufacturing a multilayer tube shoulder wherein a first material component is injected into a cavity (22) and then removed from the cavity on a support (12) while in a partly-plastic state. Thereafter, following insertion of the first material component into a second cavity (23), a second material component is injected around the first material component, and thereby leads to a positive connection between the first and second material components.
    Type: Grant
    Filed: February 17, 2000
    Date of Patent: October 15, 2002
    Assignee: Foboha GmbH
    Inventor: Rainer Armbruster
  • Publication number: 20020140114
    Abstract: A sealing apparatus for sealing by resin a semiconductor wafer having semiconductor elements on its surface. The apparatus includes an upper mold and a lower mold having an area where the semiconductor wafer is mounted, the lower mold having an uneven surface in the area and a shock absorber under the lower mold.
    Type: Application
    Filed: March 25, 2002
    Publication date: October 3, 2002
    Inventor: Jiro Matsumoto
  • Publication number: 20020140122
    Abstract: An inventive mold is adapted to adhere skin materials having a boundary portion and a resin to each other, and is provided with a resin blocking member which is so embedded as to extend substantially along the boundary portion of the skin materials placed in the mold, and a movable member for projecting the resin blocking member from a molding surface. If such a mold is used, a flow of the resin supplied into the mold can be controlled by projecting the resin blocking member to thereby control an arrival timing of the resin at the boundary portion. Thus, displacement of the boundary portion and wrinkling can be securely prevented from occurring.
    Type: Application
    Filed: March 28, 2002
    Publication date: October 3, 2002
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Yoshitaka Kobayashi, Nobuhiro Usui
  • Publication number: 20020135101
    Abstract: The present invention relates to a method of producing an insert-molding product in which an insert product 2 is covered with a synthetic resin by arranging the insert product 2 in a cavity 11 of a mold 10, holding the insert product by a holding pin 12, pouring a molten synthetic resin 3 into the cavity 11, and retracting the holding pin 12. The moving pin 13 is provided adjacent to the holding pin 12. After the cavity 11 is filled with the synthetic resin 3, the holding pin 12 is retracted and the moving pin 13 is moved in the direction of the cavity 11 to extrude and introduce the synthetic resin 3 into the space where the holding pin 12 used to be positioned.
    Type: Application
    Filed: May 23, 2002
    Publication date: September 26, 2002
    Inventors: Tsutomu Onoue, Takehiro Sengoku, Hisashi Kayano
  • Patent number: 6454984
    Abstract: A molding die 1 for molding a laminated molding having a molding body with compressible surface members 23 and 24 partially laminated thereonto, where a flow-regulating portion for regulating flow of molten resin flowing toward the surface members 23 and 24 is provided to a die body 10 to regulate the flow of the molten resin flowing on the same plane as the surface members 23 and 24 toward the surface members 23 and 24. Accordingly, since resin lap at an peripheral end portion of the surface members 23 and 24, and position shift of the surface members 23 and 24 by the flow of the resin, laminated molding having good quality and appearance can be obtained.
    Type: Grant
    Filed: November 9, 1999
    Date of Patent: September 24, 2002
    Assignees: Idemitsu Petrochemical Co., Ltd., Sanwakako Co., Ltd.
    Inventors: Yoshiaki Saito, Tomokazu Abe, Terunobu Fukushima
  • Publication number: 20020132022
    Abstract: A device for foaming around a transparent pane for a motor vehicle roof, including a top tool having a top shaping structure mounted on a top carrier, and a bottom tool having a bottom shaping structure mounted on a bottom carrier. The shaping structures act as a boundary for the area to be peripherally foamed, and the top tool and the bottom tool are made adjustable relative to one another for inserting or removing the pane and the interchangeable bottom shaping structure. The top shaping structure is also interchangeable to enable matching of the peripheral foaming device to different size and shape panes to be peripherally foamed.
    Type: Application
    Filed: February 15, 2002
    Publication date: September 19, 2002
    Applicant: Webasto Vehicle systems International GmbH
    Inventors: Karl Stangl, Christian Dunzinger
  • Patent number: 6439871
    Abstract: A molding die for shaping a laminated molding including a molding body and a compressible surface member laminated thereonto has centering pins for determining a position of the surface member protrudable and retractable relative to a cavity inside a die body. Accordingly, since the surface member can be accurately and easily positioned and held, position shift of the surface member can be securely prevented. Further, by sinking the centering pins before molten resin is solidified, influence by the centering pins can be eliminated.
    Type: Grant
    Filed: September 22, 1999
    Date of Patent: August 27, 2002
    Assignees: Idemitsu Petrochemical Co., Ltd., Sanwakako Co., Ltd.
    Inventors: Yoshiaki Saito, Tomokazu Abe, Terunobu Fukushima
  • Publication number: 20020102319
    Abstract: A method of producing a bead inductor includes the steps of forming an outer portion outside of a conductor coil, and forming a molded body with the conductor coil embedded therein. The outer portion is formed outside of the conductor coil by disposing the conductor coil in a cavity defined by first and second mold portions, with first and second gates formed in the first mold portion, inserting first and second spacer pin portions, which define a spacer pin which passes through the conductor coil and extends to and closes the second gate, and supplying material containing magnetic powder into the mold cavity from the first gate. The molded body is formed by closing the first gate after the formation of the outer portion, and supplying from the second gate material containing magnetic powder into a space formed by removing the spacer pin portions.
    Type: Application
    Filed: February 6, 2002
    Publication date: August 1, 2002
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Takashi Shikama, Masami Sugitani, Hisato Oshima, Junichi Inoue
  • Publication number: 20020096801
    Abstract: The present invention is directed to a mold and method for forming a golf ball with at least a core. The mold and method comprise or use members with projections for forming multiple dimples on the core. The members can be retractable pins or sleeves or vent pins. In the case of the retractable pins, sets of pins with multiple dimple projections on the ends thereof are used to center the golf ball core within the mold. The members can have circular or non-circular cross-sections so that the dimple-forming projections can conform to any dimple pattern.
    Type: Application
    Filed: January 19, 2001
    Publication date: July 25, 2002
    Inventors: Paul A. Puniello, Robert A. Wilson
  • Patent number: 6422850
    Abstract: An improved vent pin for a golf ball injection mold is characterized by a non-circular configuration so that a non-circular dimple can be formed at one or both poles of the golf ball. The vent pin is coaxially arranged within a passage in the injection mold which is aligned with a radius of the ball which passes through one of the poles thereof. The pin is operable between a normal position where the end of the pin closes the passage lower end and a retracted position where the pin end is withdrawn into the passage so that air from a cavity of the mold where the cover layer of the ball is formed can be vented during delivery of thermoplastic material to the cavity to form the golf ball cover.
    Type: Grant
    Filed: October 19, 2000
    Date of Patent: July 23, 2002
    Assignee: Spalding Sports Worldwide, Inc.
    Inventors: Kevin J. Shannon, Thomas J. Kennedy, III, Gary Tavares
  • Publication number: 20020086074
    Abstract: An improved golf ball injection mold is characterized by upper and lower support plates each containing corresponding hemispherical cavities which define spherical mold cavities when the plates are brought together. A plurality of retractable core pins are arranged in each cavity for supporting a core of a golf ball. Fluid thermoplastic material is supplied to each cavity to form the cover layer on the golf ball core. A valve pin is arranged in a gate in the upper plate in the center of the upper hemispherical cavity adjacent to a pole of the golf ball being formed in the cavity. The valve pin is operable between extended and retracted positions relative to the gate to deliver the thermoplastic material to the cavity and a closed position intermediate of the extended and retracted positions to stop the flow of thermoplastic material during curing of the cover layer.
    Type: Application
    Filed: January 4, 2001
    Publication date: July 4, 2002
    Inventor: Gerald A. Lavallee
  • Patent number: 6409492
    Abstract: A method and system for inserting a golf ball precursor product into a cavity of a mold half for precision centering is disclosed herein. The precision centering allows for the concentricity of core in relation to the cover of a golf ball. The system includes an insertion mechanism that allows for the vertical movement of a plurality of vacuum cups along a longitudinal pathway. The vacuum cups retain the golf ball precursor products and insert each into a corresponding cavity on a mold half. As the vacuum cups are lowered along the longitudinal pathway, the mold half is elevated along the longitudinal pathway. The mold half and vacuum cups meet at an insertion position where the golf ball precursor products are released from the vacuum cups and set within a thermoset material contained in each of the cavities.
    Type: Grant
    Filed: November 2, 2001
    Date of Patent: June 25, 2002
    Assignee: Callaway Golf Company
    Inventor: Gary G. Marshall
  • Publication number: 20020058081
    Abstract: A multilayer molded article constitutes a resin body and a skin material which covers a part of the surface of the resin body so that an edge part of the skin material present on the surface of the resin body is placed in a groove formed on the surface of the resin body. The article is produced by providing an unclosed mold having a lower mold having at least one pin for fixing the edge part of the skin material at a position where the edge part of the skin material is placed and an upper mold having a kick for forming the groove, placing the skin material on the lower mold and fixing the edge part of the skin material with the pin, supplying a mass of resin melt between the skin material and the lower mold, and closing the upper and lower molds to form the multilayer molded article.
    Type: Application
    Filed: January 7, 2002
    Publication date: May 16, 2002
    Applicant: Sumitomo Chemical Company, Limited
    Inventors: Shohei Masui, Masahito Matsumoto, Nobuhiro Usui, Toshihiro Hosokawa, Ryuichi Ishitsubo
  • Publication number: 20020050658
    Abstract: A method for manufacturing a synthetic resin thermoplastic ophthalmic lens by injecting a thermoplastic material immediately adjacent to each side of a light polarizing wafer situated within a mold cavity. The light polarizing wafer includes tab appendages which are positionable into registration notches in the mold cavity in order to maintain the wafer in a desired position in the mold during lens formation. The thermoplastic material is then injected around the light polarizing wafer, whereupon a compression procedure is implemented where the contents of the mold cavity are compressed. The mold cavity is compressed to a predetermined position to achieve a desired shape of the lens. Uniform compression is exerted over the entire surface of lens during the compression procedure, resulting in all stresses being uniformly distributed over the lens surface to significantly negate stress-inducted birefringence in the formed ophthalmic lens.
    Type: Application
    Filed: September 10, 2001
    Publication date: May 2, 2002
    Inventor: David A. Richard
  • Patent number: 6379138
    Abstract: The present invention relates to a retractable pin assembly for an injection mold. One end of the retractable pin is inside the mold, while the other end extends outside of the mold cavity. The inside end of the retractable pin may by shaped to conform with the shape and texture of the mold cavity wall. The retractable pins are moved in and out of the mold cavity by cams that rotate around the injection mold.
    Type: Grant
    Filed: November 8, 2000
    Date of Patent: April 30, 2002
    Assignee: Acushnet Company
    Inventors: Paul A. Puniello, Robert A. Wilson
  • Patent number: 6374475
    Abstract: Methods and apparatus for the manufacturing of prestressed reinforced concrete railroad ties in which the apparatus consists of an elongated spine or compression member which has no foundation but rather is independent of the supporting surface upon which it rests. In one version of the apparatus two bridge members confront the opposite ends of the spine and permanent tension resisting members pass beneath the spine from end to end of the spine and are attached to the lower ends of the bridge members. In another version two structural members are embedded in the concrete of the spine and protrude to provide terminal members.
    Type: Grant
    Filed: October 18, 1999
    Date of Patent: April 23, 2002
    Inventors: David P. Ollendick, Robert W. Ollendick
  • Publication number: 20020041911
    Abstract: A resin encapsulation mold of the present invention comprises a lower mold, which is mounted on a lead frame, includes an indentation into which a semiconductor device is placed, and forms a gate through which resin is injected; an upper mold, in which an indentation is formed opposite the indentation of the lower mold to configure a cavity for holding the semiconductor device; a plurality of ejection pins, which protrude from the respective bottoms of the indentation of the upper mold and the indentation of the lower mold into a resin package body formed by injecting the resin from the gate into the cavity, and eject the resin package body; a vertical drive mechanism, which brings into contact and separates the upper mold and the lower mold; and protrusion adjustment means for adjusting the amount of protrusion of the respective ends of the plurality of ejection pins protruding from the respective bottoms of the indentations of the lower mold and the upper mold comprising the cavity while resin is being inje
    Type: Application
    Filed: October 4, 2001
    Publication date: April 11, 2002
    Applicant: NEC CORPORATION
    Inventor: Tetsuichi Mine
  • Patent number: 6364648
    Abstract: The fixture of the invention provides a bottom portion into which a mold half is placed. Movably mounted above the bottom portion is a top portion having two horizontal plates adapted to slide relative to each other to control the X direction and Y direction and hold a preform or wafer. The top portion is further adapted to allow for the adjustment of the relative angle between the preform or wafer and mold half, as well as adjustment of the distance between the top portion and bottom portion.
    Type: Grant
    Filed: December 21, 1999
    Date of Patent: April 2, 2002
    Assignee: Johnson & Johnson Vision Care, Inc.
    Inventors: Joseph A. Bishop, Eric S. Dogan
  • Publication number: 20020037335
    Abstract: A golf ball mold having non-planar parting lines and a method for forming a cover using such mold are disclosed herein. The mold has a pair of mold halves, and each mold half has a non-planar perimeter. The non-planar perimeter has alternating extensions and indentations. Each of the extensions has an apex that may be curved, and each of the indentations has a depression that may be curved. The mold may be used in compression molding, injection molding and cast molding a layer on a golf ball. The mold may be used to produce golf balls having non-dimpled surfaces.
    Type: Application
    Filed: December 7, 2001
    Publication date: March 28, 2002
    Applicant: Callaway Golf Company
    Inventors: Steven S. Ogg, Donn A. Wilbur
  • Patent number: 6350113
    Abstract: A resin molding machine is capable of preventing molded products from forming resin flash on their surfaces. The resin molding machine includes a press section, a loading section, an unloading section, an accommodating section, a film feeding section, and an air sucking mechanism. By pressing the release film on the surface of the part of the work piece, the release film prevents the melted resin from invading into a gap between the release film and the work piece, so that no resin flash is formed on the surface of the work piece.
    Type: Grant
    Filed: February 25, 2000
    Date of Patent: February 26, 2002
    Assignee: Apic Yamada Corporation
    Inventor: Fumio Miyajima
  • Publication number: 20020017732
    Abstract: An insert is held in a cavity within a die set by a movable hold member. Molten resin is injected into the cavity when the insert is held by the hold member. The hold member is separated from the insert at a given timing. A surface of the hold member is heated to a temperature higher than a temperature of an inner surface of the die set. The hold-member surface contacts the molten resin. The die-set inner surface is exposed in the cavity.
    Type: Application
    Filed: September 19, 2001
    Publication date: February 14, 2002
    Applicant: NIPPONDENSO CO., LTD.
    Inventors: Hiroshi Koyama, Tsutomu Onoue, Keigo Asano, Tadatsugu Nakamura, Izuru Shoji
  • Publication number: 20010054781
    Abstract: An insert molding method and mold has an upper mold and a lower mold disposed to oppose each other. The cavity at the upper mold side is filled with molten resin or rubber material injected through a gate to perform injection molding of the resin or rubber around an insert set at the lower mold side. A movable supporting member sets the insert, and is fitted in a recessed part formed on the upper face of the lower mold. The position of the center of gravity at the lower face of the movable supporting member is supported and pressed towards the upper mold side by the tip of a shaft of a pressing mechanism. A gap is between the side face part of the recessed part and the side face part of the movable supporting member to cause the movable supporting member to tilt about the point at which the movable supporting member is pressed and supported by the shaft inside the recessed part so that the upper face of the insert will be in uniform surface contact with the lower face of the upper mold.
    Type: Application
    Filed: May 8, 2001
    Publication date: December 27, 2001
    Inventors: Toshio Saito, Ikuhiko Ozeki
  • Publication number: 20010048180
    Abstract: A injection molding device for manufacturing golf balls is disclosed. The device includes first and second hemispherical mold halves that form an interior cavity where the injection molding process occurs. A plurality of retractable pins are preferably used to support a core within the mold cavity. The first and second mold halves further include a plurality of subgates. The subgates are connected to a runner system for delivery of a fluid stock material into the void of the cavity. The plurality of subgates includes a first and second set of subgates. The first set of subgates and the second set of subgates enter the respective cavities at an angle between 30 and 40 degrees to the parting line.
    Type: Application
    Filed: June 15, 1999
    Publication date: December 6, 2001
    Inventor: VAL J. CUPPLES
  • Patent number: 6305921
    Abstract: A device and method for molding integrated circuit packages including a semiconductor integrated circuit chip and a lead frame with a plurality of leads is disclosed. The device is formed of top and bottom mold dies having intermating teeth that provide a sealed mold cavity around the integrated circuit chip and the lead frame leads. The teeth of at least one of said mold dies are formed with inclined surfaces that assist in compensating for any misalignment between the lead frame and the dies.
    Type: Grant
    Filed: July 12, 1999
    Date of Patent: October 23, 2001
    Assignee: Accu-Mold Corp.
    Inventors: Gary O. Grams, Greg S. Peterson
  • Patent number: 6303066
    Abstract: An apparatus and method for molding opening devices onto a packaging material sheet at respective holes provided in the sheet. The apparatus includes first and second mold tools arrangeable in a closed position so as to be in contact with opposite sides of the sheet and in an open position so as to be positioned distally from the sheet. In the closed positions a mold cavity is formed between the first and second mold tools for accommodating a hole edge in the sheet. The apparatus further includes an injection passage for injecting heated thermoplastics material into the mold cavity, which injection passage extends in one of the mold tools such that the thermoplastics material is injected directly into the mold cavity at an injection point of the mold cavity which is located distally from the hole edge, for providing effective formation of the opening device on the sheet.
    Type: Grant
    Filed: March 29, 1999
    Date of Patent: October 16, 2001
    Assignee: Tetra Laval Holdings & Finance S.A.
    Inventors: Per Gustafsson, Antonio Rendina
  • Publication number: 20010027840
    Abstract: A surface skin holding means in a lower mold for holding a folded part of a surface skin member includes a planar support frame and a support post for supporting it and prevents the folded part from a load by elevation of the support post with the elevation of an ejector plate. Also, when the support post moves upward to the uppermost position at the support frame, the support post is retained with a support-post retaining means including ball plungers to facilitate placing the surface skin member.
    Type: Application
    Filed: February 20, 2001
    Publication date: October 11, 2001
    Inventor: Tatsuro Hagai
  • Patent number: 6280660
    Abstract: In an optical recording medium manufacturing method for forming an optical recording medium by hardening photo curing resin between a resin plate (11) and a template in order to provide a technique for manufacturing an optical recording medium that has excellent optical properties and that is not apt to undergo failure during production, the resin plate (11) is produced by a heating step (104) for heating thermoplastic resin (10) to a predetermined temperature to be melted, a feeding step (103, 105) for feeding the melted thermoplastic resin (10) into a mold (1), and a molding step (101, 102) for molding the thermoplastic resin (10), which has been fed into the mold (1), into the resin plate (11) by compression. Since molding is performed by the mold in a low-pressure and low-temperature environment, it is possible to prevent deterioration due to oxidation, and molding strains.
    Type: Grant
    Filed: June 24, 1999
    Date of Patent: August 28, 2001
    Assignee: Seiko Epson Corporation
    Inventors: Atsushi Takakuwa, Takao Nishikawa, Satoshi Nebashi
  • Patent number: 6235230
    Abstract: The present invention is directed to the formation of a golf ball layer by injection molding the layer material into the mold cavity through a ring gate. After the golf ball core is securely positioned within an injection mold, layer material from at least one primary runner is introduced into a secondary runner that extends substantially around the mold cavity. The secondary runner fills with layer material until pressure within the secondary runner causes the layer material to be injected into the mold cavity through the ring gate. Injection of layer material continues until the mold cavity is completely filled. The layer material then cools and the ball is removed from the mold.
    Type: Grant
    Filed: April 2, 1999
    Date of Patent: May 22, 2001
    Assignee: Acushnet Company
    Inventor: Paul A. Puniello
  • Patent number: 6224362
    Abstract: A molding die for molding a magnetic tape cartridge case in which an electronic part for exchanging a signal with the outside via contacts is incorporated as the need arises is such that a molding die portion for use in molding openings for exposing the contacts of the electronic part is constituted of two kinds of inserts which are alternatively attachable to the molding die proper; and a first insert is used to form openings for exposing the contacts, whereas a second insert is used to shut the openings for exposing the contacts.
    Type: Grant
    Filed: January 30, 1998
    Date of Patent: May 1, 2001
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Kiyoo Morita, Katsuki Asano, Kazuo Hiraguchi
  • Patent number: 6196821
    Abstract: A mold assembly for injection-molding flat-type heat sinks, includes a male mold, a female mold engageable with the male mold, a base mounted on one side of the female mold and having a cavity in communication with the female mold, and a movable block disposed within the female mold and having one side formed with molding structure, whereby a clearance between a flat-type heat sink and the movable block will be eliminated by moving the movable block against the flat-type heat sink.
    Type: Grant
    Filed: January 19, 1999
    Date of Patent: March 6, 2001
    Inventor: Lily Chen
  • Patent number: 6193493
    Abstract: In manufacturing an encapsulated optocomponent, the optocomponent is embedded in a plastics material. The optocomponent has guide grooves on one of its surfaces in which guide pins are to extend so that the encapsulated optocomponent will obtain an optical interface of standard type. For the encapsulating operation guide pins are placed in a mold cavity of a mold half and the optocomponent is placed in the cavity of the mold, so that the guide pins are engaged in the guide grooves and are accurately inserted therein. To achieve this effect, a resilient or elastic force, such as from a plunger, is applied to the other side of the optocomponent, so that it is pressed with some force against the guide pins. The cavity in the mold is then closed by placing a second mold half on top after which the encapsulating material can be introduced in the closed cavity of the mold.
    Type: Grant
    Filed: August 6, 1999
    Date of Patent: February 27, 2001
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Odd Steijer, Hans-Christer Moll, Paul Eriksen, Jan-Åke Engstrand
  • Patent number: 6179599
    Abstract: The invention relates to an ejector pin receivable in a mold part of a mold for encapsulating electronic components mounted on a carrier, wherein the substantially cylindrical ejector pin is provided with a side wall in which at least one recess is arranged close to the end which makes contact with the product for ejecting. The invention also relates to a mold part in which an opening is arranged for guiding an ejector pin, wherein at least one recess is arranged in the wall of the opening. The invention further includes a mold for encapsulating electronic components, in addition to a method for sealing an interspace between an ejector pin and an opening in a mold part.
    Type: Grant
    Filed: April 5, 1999
    Date of Patent: January 30, 2001
    Assignee: FICO B.V.
    Inventors: Johannes Lambertus Gerardus Maria Venrooij, Marcel Gerardus Antonius Tomassen
  • Patent number: 6164946
    Abstract: A molding machine for encapsulating electronic devices mounted on one side of a substrate, and having a ball-grid array, pin-grid array, or land-grid array on the opposite side, has a two member biased floating plate apparatus to compensate for variations in substrate thickness, and a gas collection/venting apparatus for relieving gases emitted from the non-encapsulated underside of the substrate.
    Type: Grant
    Filed: July 13, 1999
    Date of Patent: December 26, 2000
    Assignee: Micron Technology, Inc.
    Inventor: Leonard E. Mess
  • Patent number: 6153140
    Abstract: A molding tool for insert-molding an insulator having a terminal section and an insulating section, the terminal section having a base portion and an upright portion projecting upward from the base portion, the molding tool having a fixed portion contacting against the base portion of the terminal section for support during molding, and a movable portion having a tip holding section for contacting against a tip of the upright portion of the terminal section and a side supporting projection section for contacting against a portion of a side of the upright portion of the terminal section for support during molding, wherein the movable portion is positioned during molding above the fixed portion to form a molding space therebetween along the base portion and extending upwardly toward the tip of the upright portion of the terminal section, but excluding the tip and the portion of the side of the upright portion that contacts against the movable portion, such that when insulation is injected into the molding space
    Type: Grant
    Filed: June 22, 1998
    Date of Patent: November 28, 2000
    Assignee: Kabushiki Kaisha Tokai Rika Denki Seisakusho
    Inventors: Koji Hirai, Fusatomo Miyake
  • Patent number: 6146122
    Abstract: A mold for molding a composite article has an upper half mold, a lower half mold having a base and a core mounted on the base, and a pressure plate. A plurality of holes are formed in the upper surface of the pressure plate, and springs are placed in the holes. A laminated sheet formed by laminating woven fabrics is placed on the core, and the pressure plate is put on the laminated sheet so as to press a part of the laminated sheet against the core by its weight without creasing the part of the laminated sheet. When joined to the lower mold, the upper mold compresses the springs to compress the part of the laminated sheet firmly between the pressure plate and the core, and then bends the laminated sheet along the side surfaces of the core so that the laminated sheet is shaped in a predetermined shape.
    Type: Grant
    Filed: April 21, 1998
    Date of Patent: November 14, 2000
    Assignee: Fuji Jukogyo Kabushiki Kaisha
    Inventor: Tomohisa Kato
  • Patent number: 6139304
    Abstract: A method and apparatus for encapsulating one or more small electronic devices, including for example light-emitting diodes, mounted directly on a substrate by providing a three-dimensional formation on the substrate adjacent to the device and injection molding a thermoplastic encapsulating material to cover the device and extend over the three-dimensional formation on the substrate and wherein the encapsulating material mechanically bonds to the three-dimensional formation. A gate plate for use in injection molding a thermoplastic encapsulating material over a small electronic device mounted directly on a substrate including a cavity formed to enclose the device, and a short gate formed entirely within the gate plate having an input for receiving an encapsulating material and an output communicating with the cavity.
    Type: Grant
    Filed: July 17, 1998
    Date of Patent: October 31, 2000
    Assignee: ITT Manufacturing Enterprises, Inc.
    Inventor: Charles A. Centofante
  • Patent number: 6131267
    Abstract: The encapsulated transducer (10) includes an injection molded encapsulation (20) having a front end (22) and a back end (24). The encapsulation (20) ensconces a sensing element (40) proximate the front end (22) and a portion of a cable (60) which extends from the back end (24). The sensing element or coil (40) is electrically and mechanically connected to the cable (60) by a pair of suitably sized front and rear ferrules (80), (90) secured to a center and coaxial conductor (66), (70) of the associated cable (60) thereby forming a coil and cable assembly (110). At least the rear ferrule (90) includes a shoulder (100) for firmly anchoring the coil and cable assembly (110) within the encapsulation (20). In addition an injection molding process provides the durable encapsulation (20) which bonds with a dielectric (68) of the cable (60) and symmetrically locks the coil and cable assembly (110) therein.
    Type: Grant
    Filed: June 22, 1998
    Date of Patent: October 17, 2000
    Assignee: Bently Nevada Corporation
    Inventor: Dave Van Den Berg
  • Patent number: 6129881
    Abstract: The present invention is directed to a retractable sleeve for a golf ball injection mold for forming a golf ball cover or intermediate layers of a golf ball. The retractable sleeves engage with a golf ball core to securely position the core within the injection mold and may be used to strike the golf ball out of the mold cavity after the injection molding process is completed. The faces of the retractable sleeves may be shaped to conform to the curvature and texture of the cavity wall of the golf ball mold.
    Type: Grant
    Filed: April 19, 1999
    Date of Patent: October 10, 2000
    Assignee: Acushnet Company
    Inventor: Paul A. Puniello
  • Patent number: 6123535
    Abstract: A molding apparatus and method of use thereof. The molding apparatus has a stationary mold base, and at least one moveable mold core rotatable into and out of a facing relationship with the stationary mold base. When the moveable mold core is in its closed position, it cooperates with the stationary mold base to define a mold cavity. The mold base may be shaped so as to aid in forming a part, or to hold a sheet of material onto which molding material is to be deposited so as to encapsulate the part on one or more edges or surface regions. Structure may also be encapsulated onto the surface of the material during the molding operation.
    Type: Grant
    Filed: July 22, 1997
    Date of Patent: September 26, 2000
    Assignee: Libbey-Owens-Ford Co.
    Inventors: Charles E. Ash, Gary W. Bernier, David W. Lahnala, H. Richard Voght
  • Patent number: 6103165
    Abstract: To provide a molding apparatus and a molding process which enable a primary product molded in a primary mold to be held in a secondary mold stably, so that the primary product may not be displaced by a synthetic resin material injected into the secondary mold. If a synthetic resin material is injected into a primary mold cavity 173 in a primary mold 85 into which molding protrusions 187 project, there is molded a primary product 340 having engaging holes 191 formed on its surface. Protrusions 227 projecting into a secondary mold cavity 225 in a secondary mold 87 are engaged in the engaging holes 191 of the primary product 340 to secure it in the secondary mold cavity 225, and a synthetic resin material is injected into the secondary mold cavity 225 to mold a secondary product 361 having through holes made by the engaging protrusions 227 formed on its surface through which the engaging protrusions 227 are removable.
    Type: Grant
    Filed: April 22, 1997
    Date of Patent: August 15, 2000
    Assignee: Kabushiki Kaisha Bandai
    Inventor: Kazunori Miura
  • Patent number: 6093360
    Abstract: An injection mold includes a pair of mold sections which are removably mated to define a spherical cavity by their concave surfaces, support pins disposed in the mold sections for movement into and out of the cavity, and gates connected to the cavity for feeding a cover molding material from an injection molding machine into the cavity. A golf ball having a core and a cover is prepared by supporting the core in the cavity by the support pins, and injecting the cover molding material between the core and the cavity-defining surface through the gates, thereby molding the cover around the core. The gates are oriented relative to the cavity such that the cover molding material is injected in a direction off the center of the core.
    Type: Grant
    Filed: July 28, 1998
    Date of Patent: July 25, 2000
    Assignee: Bridgestone Sports Co., Ltd.
    Inventors: Michio Inoue, Keisuke Ihara
  • Patent number: 6077063
    Abstract: A composite gear includes one or more metal stamped plates, and two thermoplastic layers disposed on opposite sides of the plates. Apertures are provided in the stamped metal plates so that the molten thermoplastic material may flow through the apertures and anchor the two thermoplastic layers to each other as well as to the metal plates. The composite gear has composite gear teeth which consist of one or more metal gear teeth portions sandwiched between two thermoplastic gear teeth portions. The thermoplastic gear teeth portions extend outwardly from the metal gear teeth portions so that the thermoplastic teeth portions absorb loads under normal operating conditions. Under abnormal conditions such as when an abrupt stop occurs, the thermoplastic portions of the gear teeth are compressed and the higher torque forces resulting from the abnormal condition are absorbed by the metal gear teeth portions.
    Type: Grant
    Filed: July 13, 1998
    Date of Patent: June 20, 2000
    Assignee: Briggs & Stratton Corporation
    Inventor: John D. Santi
  • Patent number: 6065952
    Abstract: An apparatus for producing molded coils of the present invention includes a molding machine having threaded spindles for receiving the coils to be molded. The coils are threaded over the spindles so that during the molding process the pitch and diameter of the coils are accurately maintained. The process is automated by use of a controller and automated assembly machinery. The controller and automated assembly machinery integrate a coil winder, a molding machine, and an auto bagger to automate the entire process of producing the molded coils.
    Type: Grant
    Filed: May 7, 1998
    Date of Patent: May 23, 2000
    Assignee: Centurion International, Inc.
    Inventor: Stephen Prochaska
  • Patent number: 6065951
    Abstract: Disclosed is an electrical connector which includes a plug comprising at least one insulative lateral support, an insulative medial lateral support and a wire having a first longitudinal section fixed to the insulative lateral support, a second longitudinal sectional fixed to the insulative medial support and an exposed third longitudinal section interposed between said first longitudinal section and said second longitudinal section. The connector also includes a receptacle comprising at least one insulative support and a wire having a first longitudinal section fixed to the insulative support and an exposed second longitudinal section of the plug. Also disclosed is a method of manufacturing this connector and a mold for use therein.
    Type: Grant
    Filed: March 23, 1998
    Date of Patent: May 23, 2000
    Assignee: Berg Technology, Inc.
    Inventors: Timothy A. Lemke, Timothy W. Houtz
  • Patent number: 6056909
    Abstract: The invention relates to a method and apparatus for providing a casing for a sensor which is to be thin-walled in places. The principle of the invention is to align the sensor circuit precisely and completely seal it in plastic using separately actuatable support devices and a slowly curing plastic.
    Type: Grant
    Filed: March 20, 1997
    Date of Patent: May 2, 2000
    Assignee: ITT Manufacturing Enterprises Inc.
    Inventors: Hans Wilhelm Wehling, Reinhard Stumpe, Joachim Kuhn
  • Patent number: 6054087
    Abstract: A decorative sheet including a decoration and a process for forming the sheet are disclosed. This process comprises the following steps:using a mold consisting of at least two parts, at least one part of which is formed of at least two elements, at least one element (5) corresponding to the medallion and at least one other element (6) corresponding to the periphery of the piece, around the medallion;placing the decorative sheet (20) on the element corresponding to the medallion and closing the mold;within the cavity of the mold, isolating the space (23) located below the decorative sheet from the peripheral space (21);injecting plastic material in succession into the spaces thus isolated; andejecting the piece obtained.
    Type: Grant
    Filed: May 26, 1995
    Date of Patent: April 25, 2000
    Assignee: Centre d'Etudes et Recherche pour l'Automobile (Cera)
    Inventors: Daniel Noirot, Olivier Vitrant