Abstract: A co-extrusion head for forming high-aspect ratio gridline structures in a micro extrusion apparatus includes multiple sheets (e.g., metal plates) that are machined and assembled to define three-part fluidic channels having associated outlet orifice disposed along an edge surface of the head. Reference surfaces are also etched in the sheets and are aligned in a straight line that intersects output junctions of the three-channel cavities. After assembly (e.g., using high pressure bonding techniques), each reference surface is located inside a notch defined in the edge surface. The edge surface of the co-extrusion head is then trimmed (e.g., machined by wire EDM) using the reference surfaces as a precise guide, thereby producing uniform length outlet orifices with uniform flow impedance.

Abstract: A forming die for forming a head on a rope includes a first die block provided with a first die cavity which is provided with at least one first clamping rib, and a second die block provided with a second die cavity which is provided with at least one second clamping rib. Thus, the second clamping rib of the second die block is movable to abut the respective first clamping rib of the first die block to form an annular clamping rib which presses the head of the rope to form an annular clamping groove in a peripheral wall of the head so that the head is fixed on the rope closely by compression of the annular clamping groove to prevent the head from being detached from the rope due to a larger pulling force.

Abstract: The method of manufacturing a substrate, includes the steps of: preparing first and second members, the first member having a non-side face which is a top or bottom face of the first member, and side faces which intersect with the non-side face and have recess parts, the recess parts having first openings on the side faces and second openings on the non-side face, the second member having flat surfaces; in a state where the flat surfaces of the second member are in contact with the side faces of the first member so that the first openings are closed with the flat surfaces while the second openings are open, filling conductive paste into the recess parts from the second openings; curing the conductive paste filled in the recess parts; and separating the second member from the first member on which conducting parts are formed from the cured conductive paste.

Abstract: A closure cap and method of making the same wherein an annular or ring-shaped gasket is injection molded onto the inner surface of a cap shell formed of plastic or metal. The annular or ring-shaped gasket includes at least one radially extending tab integrally formed therewith. A channel in the working surface of a mold core cooperates with the inside surface of the cap to form a mold cavity having the shape of the gasket to be formed therein. The cavity includes a melt inlet and a melt outlet which is in flow communication with a cold well through a connecting portion of reduced cross-sectional area with respect to the cross-sectional areas of both the gasket-defining mold cavity and the cold well.

Abstract: A mold for forming a foam earplug including a lower mold portion including a lower cavity; and an upper mold portion including an upper cavity and a means for venting a gas during a rising of the foam, wherein the lower and upper mold portions are engageable so as to communicably engage the lower and upper cavities.

Abstract: The present disclosure provides a corrugated concrete wall panel form and a method of constructing a prefabricated concrete wall panel thereof. The method comprises the steps of placing a layer of insulation boards horizontally on a flat surface on site or in pre-cast plant; laying and attaching one layer of corrugated metal thin sheets, as the bottom concrete form, on top of the horizontally placed insulation boards; closing the sides of the corrugated metal sheets by peripheral angles as side forms; and then pouring concrete on top of the metal sheets. After concrete hardens the wall structure is ready for erection. This low cost lightweight wall panel system is self-containing and requires only one pour of concrete. It requires no complicated form structure and less labor work for form installation.

Abstract: Described herein is a process and apparatus for the production of an article made of moulded plastic material with a first component and at least one second component overmoulded on the first component, in which, in the second injection step for overmoulding the second component, the moulding cavity is at least in part delimited by at least one resting surface that is independent of and mobile with respect to the mobile surface of mould and is set in contact with the first component.

Abstract: There is described a method and apparatus for covering a cylindrical roll core with an elastomeric material, the roll core having a longitudinal axis of rotation and an outer surface for receiving the elastomeric material thereon, the apparatus comprising a pair of opposed vertically aligned rotatable chucks for receiving and securing the roll core therebetween for rotation of the roll core about its longitudinal axis, the chucks holding the roll core vertically stationary, a dispenser for helically winding a length of flexible tape around the roll core from the bottom to the top thereof in spaced apart relation to the roll core's outer surface to form a containment sheath defining an annular space between the outer surface and said tape, said tape being wound in response to rotation of the roll core by the chucks, a mixing head for discharging the elastomeric material into the annular space concurrently with the space's formation as the flexible tape is wound around the roll core, a support for the dispenser

Abstract: A molding apparatus is provided for molding a leadframe, the molding apparatus comprising a mold having a leadframe-receiving area on its surface that is configured to receive and clamp the leadframe in the leadframe-receiving area. At least one molding cavity and a plurality of vacuum suction holes formed adjacent to the molding cavity are located within the leadframe-receiving area. The vacuum suction holes are operative to evacuate air from the mold surface, especially the molding cavity, through air vents connecting the vacuum suction holes to the molding cavity.

Abstract: A water stopping apparatus for causing a water stopping material to penetrate exposed core wires of a sheathed wire forming a wire harness includes a pair of dies which can abut against each other in a mutually opposed condition, thereby forming a pressurizing space in which an exposed portion of the core wires of the wire harness can be mounted, a filling portion for filling a water stopping material in the pressurizing space in which the exposed portion of the core wires is mounted, and a pressurizing portion for supplying pressurized gas into the pressurizing space to pressurize the same.

Abstract: A microcontact printing tool having a print unit including a stamp head with a stamp and a wafer chuck for retaining a substrate. The stamp contained by the stamped head movable relative to the substrate by an actuator and a stage. A plurality of sensors detect the position of the stamp relative to substrate. A method of using the printing tool that includes a real-time feedback for consistent and accurate application of force during the printing of the substrate. The stamp head includes a pressure chamber carrying the stamp. The stamp backing is deflected prior to contact of the stamp with the substrate to form a minimum point and the stamp backing and the stamp is returned to a plane to create a printing propagation contact. An apparatus has a master backing and a stamping backing in close proximity and the stamp material drawn in through a vacuum. The stamp is separated from the master by use of a parting fluid.

Abstract: A developing blade 10 is insert molded by forming a rib portion 13 which projects from an end portion in the longitudinal direction of a blade body 12 in the transverse direction of the blade body 12, opposite to the contact surface 12a side of the blade body 12, on the blade body 12 in contact with the developing roll of the developing blade 10 and forming the gate 21G of a metal mold 20 in which a metal plate 11 as an insert member has been installed only in a cavity 21b corresponding to the above rib portion 13. Therefore, a developing blade 10 without burrs and recesses on its contact surface with the developing roll or without welds can be easily manufactured.

Abstract: A molding system for foam-in-bag cushions comprises a mold defining a mold cavity, an air plenum separate from the mold cavity, a plurality of air passages that connect the mold cavity to the air plenum, and at least one port connected to the air plenum. The mold cavity has an open side and the mold includes a door that is movable between a closed position closing the open side of the mold cavity and an open position allowing a cushion to enter and exit through the open side. The system further comprises a pneumatic vacuum/blowout system connected with the at least one port. The vacuum/blowout system comprises a vacuum source, an air tank containing pressurized air, and a vacuum/blowout valve structured and arranged to alternately couple the at least one port either to the vacuum source or to the air tank.

Abstract: In connection with a memory card of a block molding type there is provided a method able to prevent the occurrence of a chip crack in transfer molding. The method includes a first step wherein a substrate having plural chips constituting plural memory cards and mounted on a surface of the substrate and further having connecting terminals in recesses formed on a substrate surface opposite to the chips-mounted surface is sandwiched between a first die (upper die) installed on the chips-mounted surface side and a second die (lower die) installed on the surface side where the connecting terminal are formed. The method further includes a second step of injecting sealing resin between the first die and the substrate to seal at a time the plural chips mounted on the substrate. Projecting portions (terminal supporting elements) projecting from the surrounding portion are formed in regions of the second die which regions are positioned just under the connecting terminals.

Abstract: An apparatus and method is disclosed for forming a compacted powder slug coated with a film. The powder, e.g. of a medicament, is compacted and enrobed to produce compacted powder slugs by preferably mechanically compacting a powder and forming a film of a material, preferably hydroxy propyl methyl cellulose, by vacuum or pressure differential, about the surface of the powder thus compacted.

Abstract: A molding apparatus including an upper half having a substrate mounting plate; and a lower half coupled with the upper half to form a cavity there between, wherein the substrate mounting plate faces the cavity, wherein the lower half includes a projecting part which has a top surface which faces the cavity and which projects from the bottom surface of the lower half toward a substantial center point of the substrate mounting plate, wherein the substrate mounting plate is adjustably mounted on the upper half and movable toward the lower half, and wherein the upper half includes a clamp mounted thereon which surrounds the projecting part when the upper and lower halves are coupled with each other.

Abstract: An apparatus for manufacturing a semiconductor device includes an upper mold (21), a lower mold (22), and a plate (30, 130, 230) that includes at least one cavity (31) that receives resin and defines an outer shape and a thickness of a resin sealing portion, and a gate (32) through which the resin is guided to the cavity (31), the plate (30) being interposed between the upper mold (21) and the lower mold (22). The plate (130) further includes a resin film (132) fixed by viscoelastic or adhesive bonding to a side of thin plates (131) towards a substrate on which electrodes are provided. The semiconductor device is provided which has no resin burrs that occur on a substrate in an end portion of the molded body. The plate (30, 130, 230) is formed by multiple thin plates (231, 232, 233) joined by welding or positioned by positioning pins (237, 238).

Abstract: A molding system for provided which is configured for molding a substrate comprising a plurality of individual carriers each of which is pre-cut into a shape of a memory card device and connected to a frame of the substrate by narrow tie bars. A molding plate is configured to receive the substrate, and a cavity plate configured to be clamped to the molding plate further comprises a plurality of molding cavities each constructed in the shape of the said carriers. The cavities are operative to create molded packages onto the carrier conforming to a shape of the memory card device without need for further forming of the molded compound after molding. Additionally, a nozzle on the surface of each cavity is operative to introduce molding material into the cavity in a direction that is substantially perpendicular to a plane of the substrate placed on the molding plate.

Abstract: A degating device applied to remove a cull between two chip carriers comprises a lower mold, an upper mold, a blowing-opening, and a cooling pipe. The lower mold is used to load chip carriers and has a plunger set for propping and degating the cull. The upper mold is fit in with the lower mold tightly. The airflow blown out from the blowing-opening blows to lower the temperature around the chip carriers. The cooling pipe is disposed according to the position of the blowing-opening to cool down the temperature around the blowing-opening. The two chip carriers are disposed on the lower mold and fixed between the upper mold and the lower mold while the upper mold combines with the lower mold. By changing the position of the plunger set relative to the upper mold and the lower mold, the cull can be stripped from the chip carriers.

Abstract: Division members (31, 32) separately molded to form a hollow component are brought into contact with each other and are arranged in dies (14, 24). The peripheral edge of the contact parts is formed with a peripheral edge path (330) to be filled with a molten resin. In the peripheral edge path (330), protrusions (316, 326) are projected from the division members (31, 32) continuously over the whole periphery of the peripheral edge path (330). The molten resin is filled in the peripheral edge path 330, and is welded with the protrusions (316, 326). As a result, a weld structure is obtained in which portions having a high welding strength are continuously formed over the whole periphery of the peripheral edge path (330).

Abstract: Adhesive injection apparatus, designed to inject an adhesive into gaps between a plurality of layers of flat plate members, includes: a receptacle for holding therein the flat plate members; an evacuation section for evacuating the interior of the receptacle and the gaps between the flat plate members; an adhesive supply section for supplying the adhesive into the receptacle; and a gas introduction section for introducing a gas into the receptacle to produce a pressure difference between the interior of the receptacle and the gaps between the flat plate members, so as to allow the adhesive to be injected from all around the flat plate members into the gaps.

Abstract: A radiator core support is made by an insert injection molding method. Four core members shaped in a triangular prism are built into a quadric-prism core and inserted into a rectangular tube, an upper radiator core support member. Then, an outwardly pressing member is inserted into a longitudinal slanted hole of the core to move and contact its members to the inner surfaces of the tube. The tube is located in a mold, into which molten molding material is injected. The tube is overmolded at the tops of a hood lock stay, and right and left side support members, being integrally formed out of resin. After cooling, the method includes drawing the pressing member from the core; then the core from the mold; and the molded part is removed from the mold.

Abstract: A method and apparatus for securing an encapsulated transducer to an interface cup for attachment with a machine includes an interface cup configured substantially as a cylinder defined by a cylinder wall and a bottom wall closing a bottom of the cylinder, the cylinder including a first bore corresponding to an inner diameter defined by the cylinder wall, the first bore corresponding to an outside diameter of the plastic encapsulated transducer; a second bore extending through opposing sides defining an exterior of the cylinder wall transverse to the first bore; an undercut in the first bore intersecting the second bore; a cylindrical overmold surrounding the interface cup having the plastic encapsulated transducer disposed in the first bore, wherein injection of plastic flows axially of the overmold toward the interface cup and circumferentially into the undercut via the second bore, forming a solid interference therebetween upon solidification restricting axial movement therebetween.

Abstract: Rotary press machine including dies, pairs of upper and lower punches with a part of each lower punch being movable in a respective die to selectively enable formation of a cavity in the die, a feeding system for feeding powder material into the cavities, when present, in a feeding stage, a pressing system for pressing the upper and lower punches together in a pressing stage and a tablet ejection system for ejecting formed tablets from the dies in a tablet ejection stage. The upper and lower punches are rotated sequentially through the feeding stage, the pressing stage and the tablet ejection stage to thereby enable formation of tablets if powder material is feed into the cavities in the dies. To enable selective formation of tablets and thereby optimize production thereof, an adjustment mechanism is provided and enables selective formation of the cavities in the dies.

Abstract: An improved method of forming fiber-reinforced plastic shells for bathtubs utilizes a fiber mat placed on a rear surface of a plastic shell. The fiber mat is infused with a resin, and is then cured. The mat and resin are preferably received within a vacuum chamber as the resin is infused. Further, the plastic shell is preferably supported on a fluidized bed during this process. The present invention eliminates the need for detailed air handling as is now required to handle impurities in the industrial air around the process of forming the bathtub shell.

Abstract: The present invention provides a method of making modular floor tiles. The method includes adding a protective layer to a modular floor tile, which may provide surface protection, a high gloss finish, or other advantageous features. The protective layer may comprise a polymer sheet that is melded to a top surface of the modular floor tile.

Abstract: A mold for molding is provided from which gas release can easily take place at the time of molding a foam body, which can minimize the amount of formation of burrs, and which can be easily processed. It is a mold for foam molding comprising a mold body comprising an upper mold half and a lower mold half, upper and lower outer peripheral portions provided on the peripheral portions of the upper and lower mold halves, and sealing surfaces provided on the contact surfaces of the upper and lower outer peripheral portions. A plurality of grooves are provided so as to surround the mold body on at least one of the sealing surfaces provided in the outer peripheral portions of the upper mold half and the lower mold half, and a tube for storing gas is embedded in the outermost groove of the plurality of grooves.

Abstract: When a separation layer is formed using a stamper between a substrate and the stamper on a thick substrate, on the surface of which a rewritable recording multilayer film provided with signal guide grooves or pits and the signal guide grooves or pits are transferred from the stamper to the surface, variations in the thickness of the separation layer are produced due to unevenness of the distance between the stamper and the substrate. The surface of the kth signal recording layer of the kth signal substrate is shaped parallel to the surface with the guide grooves and pits of the (k?1)th signal recording layer on the (k?1)th stamper, a (k?1)th separation layer is formed between the two and then the (k?1)th stamper is peeled off. The distance between the surface with the guide grooves and pits of the (k?1)th signal recording layer and the kth signal recording layer becomes uniform, and therefore the thickness of the (k?1)th separation layer can be kept uniform.

Abstract: The invention relates mold, particularly a mold for producing foam articles. In a preferred embodiment, the mold comprises a lid and a bowl releasingly engageable to define a mold cavity, the lid comprising: (i) a vent having a passageway for gas to escape from the mold cavity, and (ii) a plurality of grooves connected to the vent. The use of a plurality of grooves/slots in the mold cavity surface effectively acts as a siphon to draw gas away from the composition to be molded. The plurality of grooves/slots is connected to one or more vents which then allows for escape of the gas from the mold cavity to the exterior of the mold.

Abstract: A scrapless thermoforming machine includes a plurality of transport trays having frames configured to hold thermoplastic billets and billet clamps. An oven is configured to heat the billets and a forming press is configured to form the billets into containers. A loading and unloading station has a billet loading side and a container unloading side. The loading and unloading station includes a clamp transfer station having a clamp transfer shuttle configured to move the clamps from the container unloading side to the billet loading side and a transport tray unloading mechanism on the container unloading side configured to unload the clamps and formed containers from a selected transport tray to the clamp transfer station.

Abstract: A resin injecting apparatus includes a resin injecting nozzle for injecting a molten resin into a cavity configured between a first resin molded part and a second resin molded part connected to the first molded part, from a through-hole configured in the second molded part, and an ejection plunger for ejecting a predetermined amount of molten resin from the resin injecting nozzle. In addition, a thermal insulating bush is attached to the resin injecting nozzle, a coolant passage is formed in the thermal insulating bush and through which a coolant is passed, and a coolant supplying unit supplies the coolant to the coolant passage.

Abstract: On an application stage of resin are provided two (2) sets of dispensers 20 and 40. The one dispenser 20 supplies the resin directing to an upper side corner on a liquid crystal cell 1, while the other dispenser 40 directing to a lower side corner thereon. The dispenser 40 has a syringe 41 and a needle-like nozzle 42, and the needle-like nozzle 42 emits the resin, directing upward obliquely, onto the lower side corner. Thereby, the resin can be supplied between an edge portion of a lower substrate and a lower surface of a connecting board, but without turning over the panel for display, such as, a liquid crystal cell, etc.

Abstract: The present invention relates to an injection mold device having a shear flow making part. The device comprises an injection mold provided with a cavity in which molten resin mixed with predetermined pigments is filled, a shearing force making part installed in the injection mold, some portion thereof being exposed to the cavity to be in contact with the molten resin injected into the cavity and driven by external power to cause the molten resin in contact with the surface thereof to generate shear flow by a viscosity thereby adjusting locations of the pigments within the molten resin; and a driving part for driving the shearing force making part.

Abstract: Provided are a mold die for molding a chip array, molding equipment including such a mold die and a molding method utilizing such molding equipment. The mold die provides for the selective injection of mold resin through a corner gate controlled by a gate block whereby the flow of the mold resin is neither perpendicular nor parallel to the side surfaces of the semiconductor chips arranged in the chip array. In this manner failures associated with the sweeping effects of the mold resin flowing past the bonding wires on the semiconductor chips may be reduced.

Abstract: A centrifugation injection mold comprising: a lower mold portion having a basic block the lower portion of which is mounted to and rotates within bearing means that are affixed to a machine structure, a plurality of axial columns the bottom portions of which are affixed around the outer portions of the basic block, and a moveable block defining a lower mold cavity and being mounted in a sliding relationship to the axial columns, in order to be axially displaced between an open mold position and a closed mold position; an impelling means operatively associated with the machine structure and with the moveable block for displacing the moveable block to the open mold position against the action of an elastic means; a locking means mounted to each axial column; and an upper mold portion to be removably seated on the axial columns and affixed thereto by the locking means in a closed mold position.

Abstract: To provide a method for coating the surface of an interior component for motor vehicles which can be carried out in a cost-effective and simple way it is proposed that the interior component is positioned at a distance from a molded part in the region of its surface to be coated, so that a gap is formed between the surface to be coated and the molded part, that the interior component is braced with the molded part, the gap is filled with a liquid surface coating material and said material is cured by exposure to UV radiation. Also proposed are a device for carrying out the method and an interior component which is produced by using the method.

Abstract: Apparatus for manufacturing a socket end (12) which is provided with a sealing ring (9). The apparatus comprises an outer mould (1) for forming the outer contour of the sealing ring (9) and for forming the outer side of the socket end (12), and a core for forming the inner side of the socket end (12) and the sealing ring (9). The core comprises a first core part (7a), a sleeve-like core part (7) which can be displaced on the first core part (7a), for forming a front for the sealing ring (9), a core part (8) which adjoins the first core part (7a) and can be contracted in the radial direction, for forming the inner contour of the sealing ring (9), and a second core part (6), which adjoins the contractable core part (8), for forming the inner side of the pipe part. The contractable core part (8) has a radially innermost position with an external diameter which is smaller than the internal diameter of the sleeve -like core part (7).

Abstract: A ceramic structure includes a plurality of porous ceramic members each being warped, each of the plurality of porous ceramic members having a bonding portion and end portions at both ends of each of the plurality of porous ceramic members in a longitudinal direction of each of the plurality of porous ceramic members, and an adhesive provided only on the bonding portion between the plurality of porous ceramic members to connect the plurality of porous ceramic members except for the end portions of the plurality of ceramic members.

Abstract: The preferred embodiments provide a lead frame wherein a first air vent 29 and a second air vent 30 are formed in an air vent forming region 32. When resin-molding, one end of this first air vent 29 is disposed within the cavity, whereby air in the cavity when resin-molding can be completely released to the outside of the cavity. As a result, a package after resin-molding includes no unfilled regions or voids, whereby a semiconductor device with excellent product quality can be provided. In the background, air in cavities could not be completely released when resin-molding since, for instance, one air vent was provided at a position apart from the cavity region, and unfilled regions or voids were created.

Abstract: A dual component molding assembly for packaging hot melt adhesives wherein a mold, preferably in the form of an open top pan, includes a cavity which is lined with a thin film of plastic material. The mold has openings formed therein which communicate with the cavity to facilitate vacuum forming of the film to the cavity's interior surface. The second component is a carrier for the mold and is also preferably in the form of an open top pan. The carrier also includes a cavity for receiving the mold, and functions not only to support the mold when nested therein, but also to act as a heat sink to effectively and rapidly remove, dissipate or absorb the heat from molten adhesive dispensed into the mold. After filling the mold with a mass of adhesive, the exposed open top surface of the adhesive is covered with a second layer of thin film of plastic material which is then sealed to the first film lining the interior of the mold.

Abstract: A process for the molding of an assembled object in at least two subsequent moldings and a machine for the performance of the process are provided. The object is molded in a mold comprising at least three mold parts. When the mold is open, at least one of the mold parts or a part thereof is rotatable about an axis which is parallel to the mutual direction of movement of the mold part in relation to the opposing mold part. In a mold consisting of three mold parts, the middle part may be rotatable in relation to the two outermost mold parts.

Abstract: A two-sided inmold molding method utilizing continuous film passing between a stationary mold and a movable mold, which thereby prevents cut scraps from being mixed into a molded product and prevents striking pock from being formed on the molded product, and which is capable of enhancing the yield of the molded product.

Abstract: Overmould comprising a base having a central section, from a first side of which hooks project which form the male part of a self-gripping member, two sections forming selvages, laterally from each side of the central section, and magnetic means which can cooperate with a magnet in order to attract the overmould, is characterized in that the selvages each comprise at least two ribs, preferably at least three or four ribs, which project from the selvages on the same side of the base as the hooks.

Abstract: Method for insert molding film covered plastic parts are disclosed that facilitate wrapping of the paint film around edges of the part. A mold cavity (210) is provided wherein the requisite edge extremities (212, 214) of the cavity (210) are provided in an offset or spaced relation to the mold parting line plane (216). Location of the mold extremities at this position helps to secure the paint film in the mold cavity (210) and prevents pinching of the film that would otherwise occur along the mold parting line (216).

Abstract: A tool creates a fastener-receiving cavity within a foam-filled structure that includes a panel with a slot for receiving the fastener and foam backing that is cast in place against on the underside of the panel. The tool includes a clip and a plunger. The clip is inserted into the slot and has legs joined by a hinge. The plunger is inserted between the legs to spread the legs and fills the space between the spread-apart legs that would otherwise become filled with foam. After the foam is cast, the plunger is removed so that the legs can be returned to a closely spaced relationship and the clip is removed from the slot, leaving a cavity for subsequently receiving a fastener.

Abstract: This dual use injection molding tool comprises injection molding tool with techniques for both low pressure and high pressure injection molding for injection of material into a bolster and a lifter. In the retracted, non-functional position, this tool is capable of low pressure injection molding techniques. In the extended, functional position, this tool is capable of high pressure injection molding techniques.

Abstract: A method and apparatus for producing a fastener product having a multiplicity of fastener elements extending from a sheet-form material. Molten resin is extruded through an extrusion nozzle and gas is introduced into the resin within the extruder to provide an interrupted flow of resin from the nozzle to deposit discrete regions of molten resin onto the sheet-form material. The discrete regions of molten resin are spread apart along a longitudinal direction of the sheet-form material. The molten resin is permanently bonded to the sheet-form material, and a multiplicity of fastener elements are molded from each discrete region of resin.

Abstract: A method and apparatus is provided for molding a semiconductor device in a mold including two mold halves. One mold half includes a compressible sealing mechanism constructed and configured to exert a sealing pressure between a surface of the mold half and a surface of a semiconductor device located in the mold. A compliant tape is positionable onto the mold half comprising the sealing mechanism between the semiconductor device and the sealing mechanism for molding of the semiconductor device.

Abstract: A separation wall transfer mold adaptive to form separation walls on a substrate, includes a main body. A separation wall concave section has concaves for separation walls and is formed in a surface of the main body for a material of the separation walls to be spewed into the separation wall concave section when the separation wall transfer mold is pressed to a substrate. A spew preventing concave section is formed in the surface of the main body for an excess portion of the material to be spewed in the spew preventing concave section.

Abstract: Manufacturing a coating for an impression cylinder whereby a carrier and a cylinder shape is provided. A hollow cylinder is positioned between the carrier and the cylinder shape, and material to form the coating in the spaces is introduced between the carrier and the hollow cylinder (the internal field) and between the hollow cylinder and the cylinder shape (the external field). The hollow cylinder is removed at a certain pre-selected velocity from between the carrier and the cylinder shape.