Abstract: A molding die used for concurrently packaging semiconductor chips in a large piece of synthetic resin has a cavity rectangular in cross section and having two long peripheral lines and two short peripheral lines for accommodating a circuit panel where the semiconductor chips are mounted, melted synthetic resin is supplied through a gate extending along one of the long peripheral lines to the cavity so that the melted synthetic resin smoothly flows over the cavity, and the smooth flow prevents the molded product from voids and a wire weep.

Abstract: A waterproof connector housing is provided. This waterproof connector housing includes a housing main body, a hood portion for engaging with a mating housing via a stair portion provided on the housing main body, an elastic seal ring for maintaining water-tightness with the mating housing inside the hood portion, and a holding portion for the elastic seal ring on the terminal insertion surface of the housing main body. With this waterproof connector housing, the elastic seal ring can be easily molded, and the amount of wasted raw material can be dramatically reduced. Also, the hood portion can take various forms and be made smaller.

Abstract: An aluminum foil mold is placed in a rigid back-up mold with a cavity matching the contour of the foil mold. Fluid food deposited in the foil mold is compressed therein by a mold top that is pressed down against the back-up mold. Heat applied to the back-up mold and mold top flows to the foil mold and fluid food therein to effect baking under pressure. Thus, a unified food product is formed in the foil mold that can protect the food product against handling damage until it is eaten. A foil mold of novel design is used to form a food product shaped like an upside-down pizza shell.

Abstract: In the method, after the pattern-bearing film is fed to the female mold, the distal end of the film is fixed under a lower portion of the female mold, and at the same time the film is retreated by a force from the film supply portion. Thus, this tightens up the film so that the slacks or wrinkles cannot be formed on the film. Therefore, the film can be fortunately spread around the parting surface of the female mold. In the apparatus, the film suppressing frame is pressed to the female mold through the sliding rod arranged in the female mold, in such a manner that the female mold embraces the frame. Thus, the pressing of the frame is performed by a simple structure, and the film is accurately positioned to the internal surface of the female mold. Also, the film suppressing frame is constituted to advance from and retreat to the female mold. Thus, this causes a space between the both molds and an outside standby position to be useless. A space around the apparatus can be effectively utilized.

Abstract: An apparatus (100) for constructing a composite structure (112) is disclosed. The apparatus (100) comprises a flexible layer (104), which has a working surface (106) and an underside surface (108), coupled to a base (102). At least one support element (302) is coupled to the underside surface (108) of the flexible layer (104), and at least one adjustable element (304) is coupled to the support element (302) for adjusting the position of the flexible layer (104). More specifically, the flexible layer (104) may have internal reinforcing elements (300) for added strength and durability.

Abstract: An apparatus and method for molding and curing silicone includes a press, one nozzles operatively engaged to the press, a liquid cooled manifold plate disposed to cool the nozzles, a heatable top platen having nozzle receptacles therein to receive the nozzles therein and a mold plate having a mold cavity therein. The mold plate and top platen are oriented for placement in the injecting position to allow the top platen to contact the mold plate while the nozzles are inserted into the nozzle receptacles of the top platen so that silicone is injected into the mold plate and into the mold cavity. The apparatus may be placed in the curing position when the top platen is heated and contacts the mold plate to allow silicone injected in mold plate to cure. The apparatus may be placed in a home position where the mold plate is uncontacted by the heated top platen which is uncooled by the manifold plate in the home position.

Abstract: A system and method for continuous automated production of insert pieces and insert injection molded parts has insert material supply reels loaded with a flexible insert material which is fed into an insert cutter and feeder assembly. The insert material supply reels supply large quantities of insert material ready for fabrication into insert pieces for direct insertion into an injection mold. The insert cutter and feeder assembly has one or more tracks along which the insert material is guided by unit-directional rollers to a cutter which severs insert pieces from the continuous strand of insert material. The continuously produced insert pieces are inserted into injection mold cavities by various inserted/pusher mechanisms between injection molding cycles. A control system synchronizes the cutting and feeding of insert pieces with the molding cycle for continuous production of insert molded parts.

Abstract: A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.

Abstract: A molding apparatus for use in forming a flexible substrate based package comprises a plurality of pots. Two flexible substrates are installed at two sides of the pots. A plurality of sets of chips mounted on the upper surface of the substrate wherein each set of chips is in an array arrangement. The molding apparatus further comprises a plurality of runners. Each runner independently extends from one side of the pot to one side of the substrate, and connects to a cavity of a upper part of a mold disposed on the substrate through a gate. The present invention characterized in that, the molding apparatus is provided with a first communication channel formed corresponding to one side of the substrate and a second communication channel formed corresponding to the other side of the substrate. The first and the second communication channels interconnect the cavities at two opposite sides thereof.

Abstract: A resin-molding die for embedding in a molded resin a plurality of bus bars connected with each other via a bridge portion includes a supporting member formed on a first mold, for supporting the bus bars, a pin-receiving hole formed in the supporting member at a position associated with the bridge portion, and a pin provided on a second mold at the position associated with the bridge portion and the pin-receiving hole, for cutting and raising the bridge portion substantially at an intermediate part thereof.

Abstract: A method of manufacturing a film-covered article by the following steps. A thermoplastic film is heated to become pliable. The film has a decorative surface and a backing surface. The heated film is positioned between an open mold. The open mold has a first mold surface, a sealing surface and a sealing member. The sealing surface contacts the sealing member and forms a chamber between the mold and the film. A fluid pressure is applied between the mold and the film to cause the film to conform to the first mold surface. A molten resin is injected adjacent to the film-backing surface to form the film-covered article. The invention may be practiced by either applying a positive pressure to push the film to conform to the first mold surface or a negative pressure to drawing the film against a vacuum between the film and the first mold surface.

Abstract: An aluminum foil mold is placed in a rigid back-up mold with a cavity matching the contour of the foil mold. Fluid food deposited in the foil mold is compressed therein by a mold top that is pressed down against the back-up mold. Heat applied to the back-up mold and mold top flows to the foil mold and fluid food therein to effect baking under pressure. Thus, a unified food product is formed in the foil mold that can protect the food product against handling damage until it is eaten. A foil mold of novel design is used to form a food product shaped like an upside-down pizza shell.

Abstract: An apparatus and method for molding and curing silicone includes a press, one nozzles operatively engaged to the press, a liquid cooled manifold plate disposed to cool the nozzles, a heatable top platen having nozzle receptacles therein to receive the nozzles therein and a mold plate having a mold cavity therein. The mold plate and top platen are oriented for placement in the injecting position to allow the top platen to contact the mold plate while the nozzles are inserted into the nozzle receptacles of the top platen so that silicone is injected into the mold plate and into the mold cavity. The apparatus may be placed in the curing position when the top platen is heated and contacts the mold plate to allow silicone injected in mold plate to cure. The apparatus may be placed in a home position where the mold plate is uncontacted by the heated top platen which is uncooled by the manifold plate in the home position.

Abstract: An apparatus and method utilize vacuum injected molding of a liquid in a plurality of mold cells for solidification therein. An injection head includes spaced apart vacuum and injection slots positionable atop a mold plate in flow communication with the mold cells therein. Relative axial sliding is effected between the injection head and the mold plate for sequentially evacuating gas from the mold cells using a continuous vacuum followed in turn by sequentially injecting into the evacuated mold cells the liquid from a continuous source thereof. Sliding of the injection head over the mold plate automatically provides self valving for sequentially evacuating and filling the mold cells from the same side of the mold plate. In a preferred embodiment, the vacuum and injection slots are linked together at the mold plate so that surface tension of the liquid restrains flow of the liquid from the injection slot to the vacuum slot while allowing gas flow therebetween for effecting the vacuum in the mold cells.

Abstract: A foil-decorating injection molding method and a foil-decorating injection molding apparatus adjust the tautness of a decorative sheet fed onto a parting surface of a female mold so that tensions T1, T2 and T3 of the decorative sheet during a sheet feed operation of the sheet feed means, at the start of the sheet clamping operation of the clamper for pressing and fixing the decorative sheet and at a moment immediately before the completion of the sheet clamping operation, respectively, meet an inequality: T1≧T2>T3 to prevent the decorative sheet from breaking or slipping off the clamper when clamping the decorative sheet on the parting surface of the female mold.

Abstract: A resin sealing method for a chip size package electrically connected to electrodes of a semiconductor chip in a chip face of the semiconductor chip with one end of leads joined and the other end thereof exposed to an outer face of a sealing resin for sealing the chip face as connection parts to a package substrate, includes the steps of: providing a first transfer mold formed with a cavity recess in which an object to be molded including the semiconductor chip joined to leads is set, and a second transfer mold mated with the first transfer mold; setting the object to be molded in the cavity recess with a transfer mold face containing the cavity recess of the transfer mold; covering the mold face of the first and second mold with release films having flexibility and heat resistance, respectively; clamping the object to be molded with the transfer mold face of the second mold; and filling the cavity of the first mold with a resin for sealing the package with the resin.

Abstract: A method and apparatus for manufacturing a film coated article by placing a pre-molded film into a loading station. The film has a decorative surface and a backing surface. The decorative surface is positioned juxtaposed the loading station. The film is transferred to a loader. The loader is positioned juxtaposed the backing surface. The loader and film are positioned in an open mold press between a cavity and a core. The film is transferred from the loader to the cavity. The decorative surface of the film is positioned juxtaposed the cavity. The cavity mates with the film and retains the film in position during the molding operation. The press is closed and a polymeric material is injected against the backing surface of the film. The polymeric material produces a molded article having a rigid substrate fused to the backing of the film and displaying the decorative surface. The press is opened and the molded article is transferred from the cavity to an unloader.

Abstract: A method of manufacturing a film-covered article. A moveable press having first and second mold surfaces is moved to an open position. The first mold surface has a sealing surface, and the second mold surface has a cutting surface. A thin flexible film having an offal portion is placed between the first and second mold surfaces. The offal portion is positioned between the sealing and cutting surfaces and acts as a seal between the mold halves. The press is moved to the closed position. The cutting surface contacts the film and partially cuts the offal portion along a perimeter of the film. The offal portion remains positioned between the cutting and sealing surfaces and seals the space between the first and second mold surfaces.

Abstract: A molding die used for concurrently packaging semiconductor chips in a large piece of synthetic resin has a cavity rectangular in cross section and having two long peripheral lines and two short peripheral lines for accommodating a circuit panel where the semiconductor chips are mounted, melted synthetic resin is supplied through a gate extending along one of the long peripheral lines to the cavity so that the melted synthetic resin smoothly flows over the cavity, and the smooth flow prevents the molded product from voids and a wire weep.

Abstract: In manufacturing an encapsulated optocomponent, the optocomponent is embedded in a plastics material. The optocomponent has guide grooves on one of its surfaces in which guide pins are to extend so that the encapsulated optocomponent will obtain an optical interface of standard type. For the encapsulating operation guide pins are placed in a mold cavity of a mold half and the optocomponent is placed in the cavity of the mold, so that the guide pins are engaged in the guide grooves and are accurately inserted therein. To achieve this effect, a resilient or elastic force, such as from a plunger, is applied to the other side of the optocomponent, so that it is pressed with some force against the guide pins. The cavity in the mold is then closed by placing a second mold half on top after which the encapsulating material can be introduced in the closed cavity of the mold.

Abstract: A paint film laminate is co-molded over a desired plastic substrate to produce an automobile bumper member, chin spoiler or rocker panel part. Along a desired surface of the part, such as, for example, a border between a part surface having one segment covered by paint film and a second segment comprising the exposed substrate, the edge of the paint film is embedded in the plastic substrate along a surface discontinuity such as a recess or ridge so that an aesthetically pleasing sight edge having a desired contour exists along this surface portion. The sight edge is formed during the co-molding process via the provision of an incline or ramp along a desired mold cavity surface. When the co-molded part is installed in its intended application, the paint film edge is substantially hidden from view by the surface discontinuity.

Abstract: A molding machine for encapsulating electronic devices mounted on one side of a substrate, and having a ball-grid array, pin-grid array, or land-grid array on the opposite side, has a two member biased floating plate apparatus to compensate for variations in substrate thickness, and a gas collection/venting apparatus for relieving gases emitted from the non-encapsulated underside of the substrate.

Abstract: An automotive interior door panel having a decorative covering displayed to the interior compartment of a vehicle and a rigid substrate having a backing surface. The backing surface includes a plurality of energy absorbers integrally molded thereon. The method utilizing the following steps. A low-pressure or high pressure injection mold operable between open and closed positions is moved to the open position. The mold has a covering receiving surface and an energy absorber producing surface. A flexible covering is positioned juxtaposed the covering receiving surface. The mold is moved to the closed position to create a space between the covering and the energy absorber producing surface. A molten plastic material is injected into the space to form the door substrate. The substrate has a nominal cross-sectional thickness between said energy absorbers.

Abstract: A fixture 56 for disposing laser blocking material 52 on the interior of an airfoil 10 is disclosed. Various construction details are developed which allow for the repetitive disposition of the laser blocking material in one airfoil after another. In one embodiment, the fixture includes a sprue plate 62 and locating block 126 which are spanwisely spaced and engage the ends 14, 18 of the airfoil.

Abstract: A method and apparatus for encapsulating one or more small electronic devices, including for example light-emitting diodes, mounted directly on a substrate by providing a three-dimensional formation on the substrate adjacent to the device and injection molding a thermoplastic encapsulating material to cover the device and extend over the three-dimensional formation on the substrate and wherein the encapsulating material mechanically bonds to the three-dimensional formation. A gate plate for use in injection molding a thermoplastic encapsulating material over a small electronic device mounted directly on a substrate including a cavity formed to enclose the device, and a short gate formed entirely within the gate plate having an input for receiving an encapsulating material and an output communicating with the cavity.

Abstract: A mold assembly and method for holding a panel or sheet of material such as glass while molding a member around an attachment member and a gasket around a peripheral portion of the panel from a thermoplastic or other moldable material such as PVC. The assembly and method provides a movable, secondary pressure pad which reduces the percentage of broken panels of material. The mold assembly includes a first mold section and a second mold section, which define a mold cavity therebetween. The first mold section includes a first sheet holding surface adjacent the mold cavity, and the second mold section includes a movable, primary pressure pad having a second sheet holding surface adjacent the mold cavity. The primary pressure pad is urged toward the sheet by resilient members to hold the sheet between the first and second holding surfaces in a manner so that the peripheral portion of the sheet extends into the cavity for molding a gasket thereon.

Abstract: A mold core is provided for producing an overmolded flexible valve. The mold core comprises a mold body, a piston assembly, a piston retaining means, a collet bit positioning means and at least two collet bits. The mold core has a cylindrical void in a distal end and has a pressure means communicated with the cylindrical void. The piston assembly has a piston head sized and adapted for axial movement in the cylindrical void, with a piston shaft extending axially from the head. The shaft is tapered from a larger first diameter at one end to a smaller second diameter at the other end. The piston retaining means has a bore through it to allow insertion of the piston shaft. Each of the at least two collet bits has an inner cylindrical tapered surface segment, the taper of the surface segment being essentially the same as the taper in the piston shaft, and an outer cylindrical surface segment, sized and adapted to be inserted inside the flexible valve.

Abstract: Microplates and methods for manufacturing microplates. The microplate is designed to allow UV radiation to pass through the bottom wells of the microplate so that the microplate can be used for assaying samples by use of UV absorbance. In one embodiment, the microplate comprises at least first and second wells, each well having a UV permeable bottom. In another embodiment, the microplate comprises a frame having an upper portion and a lower portion contiguous with the upper portion and a sheet disposed between the upper portion and the lower portion and defining the bottom of at least one well of the microplate.

Abstract: A method for manufacturing a seal at a cylinder head of a vehicle motor includes providing a bearing groove at a cylinder head of a vehicle motor and providing a mold member for cooperating with the bearing groove to form the seal. The seal material is introduced into the mold member so as to provide a defined excess surpassing the volume of the sealing material required for filling the bearing groove. Curing of the seal material enclosed in the bearing groove and the mold member is achieved under pressure. The pressing device for performing the method includes a mold member with receiving groove for cooperation with the bearing groove of the cylinder groove.

Abstract: Disclosed herein is a method and apparatus for forming on-site tinted and coated optical elements from a mold. The apparatus is a mold having a polymer release layer; an optical coating, such as an anti-reflective coating; a coupling agent layer to bind to the optical coating and having unreacted chemical groups; and, optionally, a tinted hard coat layer having unreacted chemical groups. The mold can be shipped to a lab that prepares optical elements, such as ophthalmic lenses, after the coupling agent layer is added or after the tinted hard coat layer is added. When using the mold with a lens resin having unreacted chemical groups, the coupling agent layer, tinted hard coat layer and optical element all crosslink as the optical element is cured to form, on-site, a durable and stable lens with chemically bound optical coatings.

Abstract: A decoration sheet is retained on the cavity periphery by a sheet clamp in such a state that it is projected into a molding cavity of a female die. Then the decoration sheet is heated and softened by a curved hot platen, and thereafter it is drawn through suction ports of the female die to bring the sheet into close fit to the inner periphery of the molding cavity. The deformation amount of the decoration sheet heated and softened is decreased in premolding the sheet into the molding cavity surface of the female die. Therefore, distortion of the decoration sheet, appearance of wrinkles, and breakage thereof become little. Next, the female die and the male die are coupled with each other to effect die clamping, and a molten resin is poured to fill the molding cavity to effect injection molding.

Abstract: A decorative sheet including a decoration and a process for forming the sheet are disclosed. This process comprises the following steps:using a mold consisting of at least two parts, at least one part of which is formed of at least two elements, at least one element (5) corresponding to the medallion and at least one other element (6) corresponding to the periphery of the piece, around the medallion;placing the decorative sheet (20) on the element corresponding to the medallion and closing the mold;within the cavity of the mold, isolating the space (23) located below the decorative sheet from the peripheral space (21);injecting plastic material in succession into the spaces thus isolated; andejecting the piece obtained.

Abstract: A foil-decorating injection molding method including using a foil-decorating injection molding machine with an injection mold having a male mold and a female mold. The female mold has a cavity surface for forming a cavity, and a parting surface having an outer peripheral section on which to hold a decorative sheet, and an inner peripheral section extending between the inner edge of the outer peripheral section of the parting surface and the edge of the cavity surface in a concavely curved shape to allow the expansion of a peripheral portion of the decorative sheet around a decorating portion of the same during preforming. This reduces local strains in the decorative portion of the sheet and ensures a uniform thickness distribution of the sheet to prevent breaking and creasing of the sheet.

Abstract: According to the invention, a novel guide member for integrally forming the fastening parts with the urethane mold and an integral molding method using the guide member are provided. The guide member includes a guide body that has an extended body which includes concave cross-section and at least one open end (4, 7), and isolation members (5, 6) provided near the ends of said guide portion. The isolation members are detachable, and by engaging with the fastening surface of the fastening parts, they effectively block any seepage of liquid foaming raw material. With the integral forming method using said guide member of the invention, it is possible to embed the ends of the fastening parts within the urethane molding and to improve its peeling strength at low cost.

Abstract: A method and apparatus for molding an illumination device using an open mold are provided which allow for the addition of light extraction structures to a prefabricated light guide using a curable material. A mold containing the extraction structures is first provided. Curable molding material and the prefabricated light guide are placed into the mold, and an overlay comprising light extraction structures is cured onto the light guide, providing a functional illumination device.

Abstract: To postform the region of transition between the initial part and the end part of a section piece forming a closed frame and applied to window glass (1) by extrusion, use is made of a mould (14) which pivots about an axis parallel to the longitudinal axis of the extruded section piece and which is situated in the region of the surface of the window glass (1). The axis of pivoting of the mould (14) coincides with the cutting ridge (15) of a protrusion (16) which limits the calibrated cavity of the mould (14) on the internal face of the extruded section piece. As the mould (14) pivots, the excess polymer material is pushed back in the direction of the periphery of the window glass and beyond this periphery.

Abstract: A method of producing a composite insulator having a sheath and shed portions molded around a core rod, grasping metal fittings engagingly fitted and fixed at both end portions of the core rod, the sheath covering the core rod between the grasping metal fittings on the whole circumference of the core rod, and a plurality of shed portions extruding radially outwardly from the sheath at plural positions spaced from each other in the longitudinal direction of the core rod, by filling an insulative high molecular material and subsequent vulcanization thereof in the cavity of molding die portions. The methods includes positioning and retaining the core rod at a desired position in the cavity of the molding die portions by means of retaining rings engagingly fitted on the grasping metal fittings and allowing an excess portion of the insulative high molecular material filled in the cavity to flow out to the exterior of the cavity between the grasping metal fittings and the retaining rings.

Abstract: Tooling for forming an article which includes an injection molded peripheral frame defining an opening closed by a panel insert. The panel insert is struck from sheet material and together with an associated punch or carrier cooperates with a split mold to completely define the cavity for injection molding of the article. Inasmuch as the panel insert is heat bondable to the injection molded frame and forms a portion of the walls of the cavity, it is automatically bonded to the injection molded frame. The panel insert may be peelable from the frame and include a pull tab for effecting the same. The pull tab may be formed by the same punch which cuts out the panel insert, or the pull tab may be separately formed from sheet material adjacent an intended position of a panel insert and folded into overlying relation to the intended position of the panel insert and staked to the sheet material, after which the panel insert is cut from the sheet material by a punch.

Abstract: The invention relates to a moulding apparatus for moulding a chip on a flat carrier, including a mould formed by two mould parts which are movable relative to each other and between which the carrier can be received, the one mould part of which is provided with a mould cavity against the peripheral edges of which the carrier can be pressed, and a device for exerting pressure in at least one cavity for moulding material arranged in the mould and connected to the mould cavity by a runner, wherein at least one compensation element is arranged whereby in the closed position of the mould parts one side of the carrier is held sealingly against the peripheral edge of the mould cavity.

Abstract: A molding machine for encapsulating electronic devices mounted on one side of a substrate, and having a ball-grid array, pin-grid array, or land-grid array on the opposite side, has a two member biased floating plate apparatus to compensate for variations in substrate thickness, and a gas collection/venting apparatus for relieving gases emitted from the non-encapsulated underside of the substrate.

Abstract: Apparatus for molding a plastic seal inside a closure for closing a container, having a line for transferring the closures through a closure heating station, a station for dispensing and preforming plastic material in the pasty state, suitable to deposit a dose of material inside a respective closure and preform each dose dispensed inside each closure in an annular configuration, and a final forming station, in which the preformed annular dose is molded so as to form the final seal inside the closure.

Abstract: A new method and device to encapsulate integrated circuits such as flip chips and BGA packages. A special mold to surrounds the chip to be encapsulated in a cavity, and the encapsulant is injected into the cavity at an elevated pressure, and possibly at an elevated temperature. This shortens the cavity filling time by two or three orders of magnitude, compared to the conventional dispensing process. The reliability of the package is increased by increasing the adhesion of encapsulant to the package, by controlling fillet shape through in-mold curing, and by completely filling the cavity through proper mold design and, optionally, evacuation of the cavity prior to injection. The invention also allows the use of a wider range of encapsulants, including highly viscous material, fast curing materials and reworkable materials.

Abstract: The forming surface of a forming mold (5) for postforming of a shaped cord (2) in the shape of a frame extruded onto a glass (1) is slightly curved in the direction of the length of shaped cord (2). In the final position of forming mold (4) during the postforming operation, lateral edges (11, 12) are thus slightly above the surface of shaped cord (2). This avoids the creation of imprints in the form of lines or edges on the shaped cord, and a smooth transition is achieved between the postformed length of the shaped cord that attaches there.

Abstract: A flat plug molding device comprised of a lower die, an upper die and a fixing seat in conjunction with conductor wire in practice, within, a cavity in proper thickness is provided and recessed at the center of the lower die, several holding ribs with arc top are provided on one side and a channel formed and recessed on the other side, with two penetrating holes provided at where appropriately in the center of said cavity, the upper die is provided in counter locked type, and a cavity is provided at the recess in the center of said upper die and a channel on one side corresponding to that at the lower die; the fixing seat are erected on it several protection walls at the right angle in proper height designed in conjunction with the route of the conductor wire and the shape of a conductor blade of the conductor wire, and two penetrating holes are provided at where appropriately; both ends of the conductor wire are each connected with a conductor blade which extends downward to form a plug blade with a hole; th

Abstract: A method and apparatus for transferring a pre-molded film into a cavity by the following steps. A robotically controlled arm having a loader receives flexible film. The loader by two moveable end portion and a main portion there between. The pre-molded film is transferred onto the loader. The end portions are retracted so that the loader is in a retracted position. The loader is moved to a position within a cavity. The cavity has an opening that is larger then the loader when the loader is in the retracted position. The film is transferred to the cavity by aligning the film with corresponding three-dimensional contours on the cavity. The edge portions are extended so that essentially the entire surface of the film contacts the cavity. The loader is withdrawn from the cavity by first retracting the end portions and removing the loader.

Abstract: A mold for BGA semiconductor packages which includes a height adjusting member adapted to adjust the height of the top cavity insert of the top mold or the bottom cavity insert of the bottom mold, an elastic member disposed between the height adjusting member and associated insert, clamping regions of different heights formed at its top or bottom cavity insert, or air vents having a width and depth of an optimum ratio to the area and depth of cavities, thereby being capable of maintaining an optimum and uniform clamping pressure between the top and bottom molds for a variety of PCB strips having a thickness deviation among different portions thereof or having various average thicknesses, upon molding resin encapsulants on those PCB strips, thereby achieving an improvement in the quality of finally produced packages while preventing a sweeping phenomenon of bonding wires electrically connecting a semiconductor chip to conductive traces.

Abstract: The present invention provides a mold comprising a pair of male and female mold pieces for manufacturing a multilayer molding in which a part of its thermoplastic resin substrate surface is partially laminated with a skin material. Either the male or the female mold piece has a mold surface provided with a molten resin feeding path opening inside an area where the skin material is placed and at least one dent into which a part of or the whole skin material fringing end can be inserted, at a part of or the whole position corresponding to a fringe of the skin material to be laminated and a block to be fitted into the dent. The block is fitted into the dent so that the skin material fringing end inserted into the dent is sandwiched and fixed between an inner wall of the dent and the block and at the same time an upper surface of the block can form an even mold surface with the mold surface surrounding the dent. The present invention also provides methods for manufacturing multilayer moldings using the mold.

Abstract: A mold system for encapsulating substrate-mounted ICs comprises a split mold having a lower cavity adapted for positioning the substrate and an upper cavity adapted for providing a volume space around the IC. The lower cavity is provided with a compressible shim plate adapted to lie on a bottom surface of the lower cavity such that a substrate of a substrate-mounted IC placed in the lower cavity will extend above the upper limit of the lower cavity, which is the split surface of the mold. As the split mold is closed, a lower surface of the upper mold portion encounters first an upper surface of the substrate, then the compressible shim plate is compressed until the mold is fully closed, at which time the lower surface of the upper mold portion is in intimate contact with both the substrate and the upper surface of the lower mold portion. The IC mounted on the substrate is then presented in the upper cavity for encapsulation.

Abstract: An apparatus for the production of drug-containing implants in the form of strings of beads, comprising chains of small drug-containing plastic bodies respectively arranged in series on a surgical wire or thread, has two elongate mold halves (1), which are accommodated in a mold housing (2). In the mutually facing mold parting surfaces (3) of the two mold halves (1) there are made two rows of mold cavities (4) for receiving in each case a small plastic body and a surgical wire or thread (6) joining the said bodies. The mold cavities (4) are respectively connected to a gate (14) opening out at, a mold outer surface (12 or 13). In each case, a plurality of mold cavities (4) of a row are connected to a common runner (15) which is made in an inner wan of the mold housing and into which there respectively opens out an injection opening (16) adapted such that it can be connected in a sealed manner to an injection device (1).

Abstract: An apparatus and method for making a beverage container which contains an instant beverage material individually sealed within the beverage container by a filter disk and an insert disk combination. The apparatus includes a mandrel having a flange and a forming die which is slideably mounted on the mandrel. The forming die has a chamfered outer surface which fits into a beverage container and an inner stepped portion which is configured to engage the flange of the mandrel and receive the filter disk and insert disk to be inserted into a beverage container. A funnel press is provided which has a funnel portion and a press portion. The press portion mates with the mandrel and forming die to draw a portion of the filter disk into the mandrel to simultaneously form a pocket in and crimp a filter disk which is subsequently loaded with an instant beverage material using the funnel portion.