Plural Mold Cavities Patents (Class 425/588)
  • Patent number: 5409362
    Abstract: Encapsulation molding equipment includes individual loading bars each having an elongated support surface which receives strip-like carriers supporting semi-conductor chips and like objects for encapsulation. Cavity inserts having plural rows of cavities of different size and dimension individual to carriers having like numbers of chips of a range of size and dimension fit over the strips with each cavity on an insert surrounding the chip to be encapsulated. Converging gate passages and vent passages are formed on the surface of the insert spaced away from the mold base member for supply of resin from a central resin receptacle to the cavities. Support of the cavity inserts independent of the loading bars and resilient mounting of the loading bars is disclosed. The mold is completed by an upper mold member which closes the mold and effects a seal between the mold parts and provides for delivery of encapsulating resin to the cavities in the cavity inserts.
    Type: Grant
    Filed: July 6, 1994
    Date of Patent: April 25, 1995
    Assignee: Neu Dynamics Corp.
    Inventor: H. Karl Neu
  • Patent number: 5405255
    Abstract: Encapsulation molding equipment includes individual mold bases each having an elongated shallow recess which receives strip-like carriers supporting semi-conductor chips and like objects for encapsulation. Cavity inserts having various numbers of cavities of different size and dimension individual to carriers having like numbers of chips of a range of size and dimension fit over the strips with each cavity on an insert surrounding the chip to be encapsulated. Gate and vent passages are formed on the surface of the insert spaced away from the mold base member for supply of resin from a central resin receptacle. The mold is completed by an upper mold insert plate which closes the mold and effects a seal between the mold parts and provides for delivery of encapsulating resin to the cavities in the cavity inserts. Each mold base has a plurality of recesses, each of which receives a carrier strip and a cavity insert.
    Type: Grant
    Filed: April 23, 1993
    Date of Patent: April 11, 1995
    Assignee: Neu Dynamics Corp.
    Inventor: H. Karl Neu
  • Patent number: 5399025
    Abstract: A bearing structure for a motor includes an adjustable bearing for providing radial support to a rotor housed within a casing. The adjustable bearing is positionable along a radial direction relative to the casing, and forms a space with inner wall of the casing. The casing has an open injection port for communicating with the space. The space is filled with a resineous filling material that is injected through the injection port, for securing the adjustable bearing within the casing.
    Type: Grant
    Filed: December 18, 1992
    Date of Patent: March 21, 1995
    Assignee: Asmo Co., Ltd.
    Inventors: Yoji Higuchi, Katsuhiko Torii
  • Patent number: 5380184
    Abstract: An injection mold typically defines multiple cavities. A mold gate is provided which comprises a rotary spherical member having a sprue conduit extending transversely therethrough. Highly accurate sequential molding of multiple cavities can be achieved in this manner, as well as other advantages. Also, this arrangement permits a linear, straight sprue conduit which is free of any sharp turns.
    Type: Grant
    Filed: August 18, 1993
    Date of Patent: January 10, 1995
    Inventor: John W. Von Holdt, Sr.
  • Patent number: 5378422
    Abstract: A molding mechanism and method of using that mechanism for simultaneously forming, by injection molding, two molded parts intended to be interference fit together and then, while the two molded parts are still within the molding mechanism, repositioning them and fitting them together. The sequenced interplay of the moving parts of the molding mechanism which accomplishes this process may be controlled by either a two-part or a single-part camming mechanism. The two molded parts may be an actuator-overcap and a spray nozzle insert.
    Type: Grant
    Filed: February 25, 1994
    Date of Patent: January 3, 1995
    Assignee: S. C. Johnson & Son, Inc.
    Inventors: D. James Musiel, William C. Hadsell, Craig R. Oestreich
  • Patent number: 5370523
    Abstract: A triple stack mold which is operated by a standard mold press and which presents three molding interfaces. Molten plastic is supplied to all molding cavities in equal amounts through a distribution system that includes manifolds in the mold components which receive the plastic and distribute it through passages leading to the mold cavities. The main passages leading to the manifolds are equipped with special nozzles constructed to compensate for differential thermal expansion of the mold parts.
    Type: Grant
    Filed: August 16, 1993
    Date of Patent: December 6, 1994
    Assignee: Dollins Tool, Inc.
    Inventor: Yosif Kushnir
  • Patent number: 5366368
    Abstract: A preheaterless manual transfer mold die for encapsulating semiconductor elements in a process for packaging semiconductors. The preheaterless manual transfer mold die includes a multi-plunger assembly adapted for upward and downward movement to press the resin. A tablet loader is inserted into an upper mold die in order to charge tablets into plunger bushes of the upper mold die. After charging, the loader is pulled out of the upper mold die. The upper mold die receives the tablets from the tablet loader. The tablets are pressed by the multi-plungers. A lower mold die, clamped to the upper mold die, receives the resin tablets in a gel state from the upper mold die and fills cavities of chases with the resin to mold semiconductor elements.
    Type: Grant
    Filed: October 14, 1992
    Date of Patent: November 22, 1994
    Assignee: Goldstar Electron Co., Ltd.
    Inventor: Keun Y. Jang
  • Patent number: 5366364
    Abstract: A plastic molding apparatus for semiconductor devices includes a first evacuation passage via which an ejector chamber in a lower die chase block is evacuated through a lower die common surface table, a second evacuation passage via which an ejector chamber in the upper die chase block is evacuated through the upper die common surface table, and a third evacuation passage via which a parting chamber on a parting surface between the lower die chase block and the upper die chase block is evacuated through one of the lower die common surface table and the upper die common surface table. Since the evacuation passages are separate and the volume of the evacuation chamber is reduced, evacuation performance is improved and the size of the apparatus is reduced. The plastic packaging performance is also improved.
    Type: Grant
    Filed: August 31, 1993
    Date of Patent: November 22, 1994
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Sueyoshi Tanaka, Zyunzi Sakakibara, Yasutsugu Tsutsumi
  • Patent number: 5348460
    Abstract: In an apparatus for producing flat plastic moldings, for example identity cards, the mold includes a conic core and a die-block member shaped in accordance with the core member. The opposing side surfaces of the core and die-block members, which are inclined to the opening direction of the mold, enclose a mold space on part of their surface. The core and die-block members are formed in such a way that the mold parts brace each other in the closed state.
    Type: Grant
    Filed: December 18, 1992
    Date of Patent: September 20, 1994
    Assignee: GAO Gesellschaft fur Automation and Organisation mbH
    Inventor: Helmut Baader
  • Patent number: 5340426
    Abstract: A ribbon adhering apparatus for a photographic film cassette has a turntable, which has holders fixed circumferentially at a regular pitch. Slidable supporters are mounted on the turntable in correspondence to the respective holders, at positions inward therefrom. Initially in rotation of the turntable, a cassette half of a film cassette is set on an empty holder. Ribbon web is lapped on to support surfaces of supporters arranged adjacently. The web is cut between the supporters to separate ribbons. Sucked and held on the supporter, the ribbon is then heated to activate hot-melt adhesive agent. By advancing the supporter to a holder corresponding thereto, the ribbon is pressed against the cassette half via the adhesive agent. The supporter then stops holding the ribbon. After cooling the adhesive agent, the supporter is withdrawn from the holder, from which the cassette half is removed.
    Type: Grant
    Filed: April 17, 1992
    Date of Patent: August 23, 1994
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Koichi Takahashi, Haruo Ichikawa
  • Patent number: 5326251
    Abstract: A heated injection molding nozzle having a melt channel which branches outwardly to several spaced edge gates. The nozzle has alternate thermocouple element receiving bores spaced longitudinally along a temperature gradient extending between the heating element and the front end of the nozzle. The nozzle facilitates the temperature control of materials having different thermal characteristics. When molding an amorphous material, a temperature somewhat lower than the prescribed operating temperature is desirable so the thermocouple element is mounted in the rearward bore closer to the heating element. If it is critical to maintain the temperature of the melt near the prescribed operating temperature for a material such as a crystalline material, the thermocouple element is received in the forward bore further along the temperature gradient from the heating element.
    Type: Grant
    Filed: December 6, 1993
    Date of Patent: July 5, 1994
    Inventor: Jobst U. Gellert
  • Patent number: 5324192
    Abstract: A molding press (10) for simultaneously operating a pair of molds, each having a pair of mold sections (M1, M2; M3, M4), including a base (13) for mounting two horizontally displaced mold sections (M1, M3), each constituting one section of one of the pair of molds, a first bolster (11) for mounting a mold section (M2) in alignment for mating engagement with one mold section (M1) on the base, a second bolster (12) for mounting a mold section (M4) in alignment for mating engagement with the other mold section (M3) on the base, rod assemblies (30) for interconnecting the first bolster and the second bolster in fixed space relation, for guiding relative movement between the base and the bolsters during opening and closing of the pair of molds, and for mounting pistons (44, 160) operatively interrelated with cylinder assemblies (40,140) on the base, and an auxiliary cylinder assembly (70) for effecting relative movement between the base and the bolsters for opening of one of the pair of molds while closing the oth
    Type: Grant
    Filed: August 14, 1992
    Date of Patent: June 28, 1994
    Assignee: The Dow Chemical Company
    Inventor: Paul Zakich
  • Patent number: 5324191
    Abstract: The present invention relates to a hot runner sealed edge gated injection molding system. The system includes a mold cavity plate with at least one injection gate and a nozzle assembly having a tip end and at least one melt channel for transporting molten plastic material. The system further includes an annular seal ring which fits snugly over the tip end of the nozzle assembly. The seal ring has at least one melt channel and at least one orifice for transporting molten plastic material from the at least one melt channel in the nozzle assembly to the at least one injection gate in the mold cavity plate. In a preferred embodiment, the seal ring is formed from a material having a thermal coefficient of expansion lower than the thermal coefficient of expansion of the material forming the nozzle.
    Type: Grant
    Filed: September 30, 1992
    Date of Patent: June 28, 1994
    Assignee: Husky Injection Molding Systems Ltd.
    Inventor: Harald Schmidt
  • Patent number: 5324189
    Abstract: Apparatus for injection molding a plastic article having a hollow rib portion utilizing a spill cavity. A process includes the steps of sequentially injecting fluent plastic and gas into a mold cavity having a space defining at least one wall portion of the article and a channel defining a rib portion of the article. A quantity of fluent plastic is initially injected to substantially fill the mold cavity. A charge of pressurized gas is then injected into the channel of the mold cavity to displace a portion of the still fluent plastic into the spill cavity which is flow coupled to the channel. Preferably, the thickness of the rib portion in cross section is at least twice as large as the thickness of the wall portion in cross section along the entire length of the rib portion. Also, preferably, the channel is tapered along its length. The rib portion may be either internal or external to the article.
    Type: Grant
    Filed: April 26, 1993
    Date of Patent: June 28, 1994
    Assignee: Melea Limited
    Inventor: James W. Hendry
  • Patent number: 5318418
    Abstract: A plastic injection mould capable of producing, at each injection, twenty articles numbered in serie and in high relief. The mould has a fixed plate (2) across which pass two pluralities or groups of tapes (13-18) numbered in mirror image, each plurality passing two series of numbers fixed on the plate. The fixed numbers corresponding to one of the pluralities of tapes are 0, 2, 4, 6, 8, 0, 2, 4, 6, 8 while the numbers corresponding to the other plurality are 1, 3, 5, 7, 9, 1, 3, 5, 7, 9. The tape (18) of each plurality that passes adjacent the fixed numbers contains an even number of series of ten groups of five identical algorisms (0, 0, 0, 0, 0; 1, 1, 1, 1, 1; 9, 9, 9, 9) whereas each of the other tapes contains at least one series of ten groups of ten identical algorisms (0, 0, 0, 0, 0, 0, 0, 0, 0, 0; . . . 9, 9, 9, 9, 9, 9, 9, 9, 9, 9).
    Type: Grant
    Filed: August 10, 1992
    Date of Patent: June 7, 1994
    Inventor: Eduardo D. L. C. Netto
  • Patent number: 5316463
    Abstract: Encapsulation molding equipment includes individual mold bases each having an elongated shallow recess which receives strip-like carriers supporting semi-conductor chips and like objects for encapsulation. Cavity inserts having various numbers of cavities of different size and dimension individual to carriers having like numbers of chips of a range of size and dimension fit over the strips with each cavity on an insert surrounding the chip to be encapsulated. Gate and vent passages are formed on the surface of the insert spaced away from the mold base member for supply of resin from a central resin receptacle. The mold is completed by an upper mold insert plate which closes the mold and effects a seal between the mold parts and provides for delivery of encapsulating resin to the cavities in the cavity inserts. Each mold base has a plurality of recesses, each of which receives a carrier strip and a cavity insert.
    Type: Grant
    Filed: November 24, 1992
    Date of Patent: May 31, 1994
    Assignee: Neu Dynamics Corporation
    Inventor: H. Karl Neu
  • Patent number: 5302101
    Abstract: A mold for resin-packaging electronic components on a pair of leadframes includes an upper mold member and a lower mold member. The mold has two parallel rows of molding cavities, and a row of resin supplying portions arranged between the respective cavity rows. The respective molding cavities have corresponding corner portions formed with injection ports which communicate with the respective resin supplying portions through runners. The respective cavity rows together with the leadframes received in the mold are displaced relative to each other longitudinally thereof by a predetermined amount.
    Type: Grant
    Filed: January 21, 1993
    Date of Patent: April 12, 1994
    Assignee: Rohm Co., Ltd.
    Inventor: Hiroyuki Nishimura
  • Patent number: 5287970
    Abstract: A load carrier 1 of plastic, particularly a storage and transporting box or container as well as a pallet or shelf, is suggested in which a base 2 having a planar upper surface is stabilized on the underside by stiffening ribs 3 and in which flat foot strips 5 lying in the direction of the base plane extend at least along two defining edges 4 of the base 2 running parallel to one another, are supported at a distance below the base plane by webs 6 directed transversely relative to the respective defining edge 4, and form stand surfaces of the load carrier 1, wherein there are free spaces 7, 7a between the underside 2a of the base, the upper side of the foot strips and the transversely directed webs 6, which free spaces 7, 7a are enclosed to form pockets and are open at least toward the defining edge 4.
    Type: Grant
    Filed: June 25, 1992
    Date of Patent: February 22, 1994
    Assignee: Fritz Schafer Gesellschaft mit beschrankter Haftung
    Inventor: Karl A. Weidt
  • Patent number: 5281121
    Abstract: A resin sealing apparatus includes upper and lower dies each having a chase block with a plurality of cavities into which molten resin is injected and a supporting member for supporting the chase block, the chase blocks of the upper and lower dies being fitted to each other, and a position determining member attached to each of the chase blocks so that the positions of the chase blocks are determined when they are assembled, wherein each of the chase blocks is attached to each of the supporting members so as to be movable in the vertical and lateral directions within given ranges.
    Type: Grant
    Filed: January 6, 1992
    Date of Patent: January 25, 1994
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yasutsugu Tsutsumi, Sueyoshi Tanaka, Yutaka Morita
  • Patent number: 5275778
    Abstract: An injection mold typically defines multiple cavities. A mold gate is provided which comprises a rotary spherical member having a sprue conduit extending transversely therethrough. Highly accurate sequential molding of multiple cavities can be achieved in this manner, as well as other advantages. Also, this arrangement permits a linear, straight sprue conduit which is free of any sharp turns.
    Type: Grant
    Filed: October 26, 1992
    Date of Patent: January 4, 1994
    Inventor: John W. Von Holdt, Sr.
  • Patent number: 5238377
    Abstract: Apparatus for molding a strip of blind rivets, with each of the rivets having a pin within a sleeve and with the pin having a pulling head and shank, including a strip advance rod mounted in the apparatus for movement between first and second positions, a set of pin mold cavities and a set of sleeve mold cavities, a first runner for feeding the pin mold cavities and including a band around the rod, a second runner overlying the first runner for feeding the sleeve mold cavities, opposing mold members defining the sets of cavities and a sprue for feeding molding material to the runners, with the rod and strip moving together when the mold members are out of engagement for advancing the molded parts, and with the rod moving through the strip when the mold members are in engagement for returning the rod to the first position.
    Type: Grant
    Filed: September 6, 1991
    Date of Patent: August 24, 1993
    Assignee: The Hartwell Corporation
    Inventors: Douglas H. Adkins, John P. Anderson, Robert L. Conly, Thomas G. Singer
  • Patent number: 5229145
    Abstract: An injection mold for use with a molding press has four mold levels in axially stacked relation, permitting a substantial doubling of output for a given size of press as compared with a back-to-back two level stacked mold. The mold feeder flow path extends axially from the injector head to a flow distribution block located at the center of the stacked mold block series. The centrally located distribution block is connected, in use isolation, sealed relation with the injector head, being axially displaceable therefrom in continuing sealed relation upon the opening of the mold. A drool prevention valve system, located at two of the mold interfaces, to preclude drooling of fluid plastic stock upon opening of the molds includes pressure fluid actuators for operating the valves, wherein the pressure fluid may comprise the fluid plastic stock.
    Type: Grant
    Filed: June 27, 1990
    Date of Patent: July 20, 1993
    Inventors: David Brown, Harald Gaul, Yosif Kushnir, Nick Travaglini, Victor Wilson
  • Patent number: 5223275
    Abstract: The present invention refers to a hot runner manifold composed of two parallel hot runner plates disposed in parallel, one behind the other, to feed at least two different plastic materials along horizontal hot runners to injection nozzles bolted to the front hot runner manifolds.
    Type: Grant
    Filed: October 2, 1991
    Date of Patent: June 29, 1993
    Inventor: Jobst U. Gellert
  • Patent number: 5219594
    Abstract: Disclosed is a molding apparatus which includes(A) a mold for making an undercut part which includes coring sandwiched between top and bottom cavity halves, where the coring is divided into three or four sections; and(B) a press for(1) separating the coring from the top and bottom cavity halves; and(2) separating the sections from each other.
    Type: Grant
    Filed: August 10, 1992
    Date of Patent: June 15, 1993
    Assignee: Occidental Chemical Corporation
    Inventors: Leon G. Meyer, Thomas T. Brylinski
  • Patent number: 5211798
    Abstract: The invention relates to an apparatus for the production of tubes from prefinished pipe elements, by pressing cf a tube head from a heated blank (24) of a plastic, with simultaneous bonding of the latter to the tube pipe (13), with an indexed transport means which stops at several work stations (II-VII) arranged at equal distances from one another, with mandrels (7) that travel along to hold the pipe elements (13) and dies (5) arranged coaxial to the mandrels (7), which also travel along, and have central hole punches (21"), if necesary, where the mandrels (7) can be axially moved and are arranged to work together with a press (8) in such a way that they can be inserted into the dies (5) to press the tube head, as well as with a loading and unloading station (I, VIII) and with an extruder (12) and a metering device (11).
    Type: Grant
    Filed: November 25, 1991
    Date of Patent: May 18, 1993
    Assignee: AISA Automation Industrielle SA
    Inventor: Gerhard Keller
  • Patent number: 5208053
    Abstract: A runner shut-off for an injection molding system press fit into a blind bore formed in one of the mold plates. The bore cuts through one of the runners that supplies material to the mold cavities. The runner shut-off includes a casing and a core pin rotatably received in the casing. The core pin is movable to a number of discrete rotated positions with respect to the casing. Slots are formed in the casing and the core pin to join the runners cut by the bore when the core pin is rotated to a position allowing flow of material.
    Type: Grant
    Filed: October 3, 1991
    Date of Patent: May 4, 1993
    Inventor: Leo A. Vandenberg
  • Patent number: 5206040
    Abstract: This invention relates to a hot tip gated injection molding apparatus having a heated manifold to distribute melt to a number of spaced gates. An unheated sealing and conductive member is mounted directly between the heated manifold and the cooled cavity plate in alignment with each gate. The sealing and conductive member has an elongated hot tip shaft which is connected to extend centrally through the bore of an outer collar portion by a number of spaced spiral blades. The collar portion bridges an insulative air space between the hot manifold and cooled cavity plate to prevent melt leaking into it. Heat received through the rear end of the collar portion which abuts directly against the heated manifold is transferred through the blades and the hot tip shaft to the gate area which is aligned with the pointed forward end of the hot tip shaft. The rear end of the hot tip shaft extends rearwardly into a branch of the melt passage to pick up heat from the surrounding melt.
    Type: Grant
    Filed: February 14, 1992
    Date of Patent: April 27, 1993
    Inventor: Jobst U. Gellert
  • Patent number: 5204122
    Abstract: A mold system for use in resin encapsulation molding includes a cavity serving as a resin molding section in which small size electric elements such as semiconductor devices and electrical parts are encapsulated with a synthetic resin. The system also incudes at least one pot for receiving the synthetic resin material and melting the received synthetic resin material by heating, a cull section communicating with the pot and formed facing to an opening end face, and a conveying passage for communicating the cull section and the cavity to convey molten resin material through the cull section. The synthetic resin material is placed in the cavity and is heated to melt therein, and is extruded out of the pot by a plunger disposed in an axial direction of the pot. The inner bottom of the cull section facing to the opening end face of the pot is formed unevenly.
    Type: Grant
    Filed: January 23, 1992
    Date of Patent: April 20, 1993
    Assignee: Dai-Ichi Seiko Co., Ltd.
    Inventor: Akira Konishi
  • Patent number: 5185119
    Abstract: An injection molding machine and method of operation having a plurality of accessory arrangements for molding a plurality of piece parts in efficient overlapping time cycle using primary and secondary molten plastic injection units, primary and secondary clamping units, a plurality of injection units in various arrays including molding piece parts in reverse or uniform orientation.
    Type: Grant
    Filed: October 23, 1991
    Date of Patent: February 9, 1993
    Assignee: Husky Injection Molding Systems Ltd.
    Inventors: Robert D. Schad, Paul Brown
  • Patent number: 5183621
    Abstract: Single and double injection molding using a single molding machine is made possible by providing two injection units, each having an injection nozzle, and a stationary platen three insertion holes into which the nozzles can fit. For double injection, the injection units are moved transversely of the stationary platen so as to orient both injection nozzles with a respective one of the insertion holes. For single injection, the injection units again are moved transversely of the stationary platen so as to orient one of the injection nozzles with one of the insertion holes, with the other nozzle not being so oriented.
    Type: Grant
    Filed: February 14, 1991
    Date of Patent: February 2, 1993
    Assignees: The Japan Steel Works, Ltd., Matsushita Electric Industrial Co., Ltd.
    Inventors: Makoto Yukihiro, Mamoru Katagiri
  • Patent number: 5175007
    Abstract: A duo-cavity multigang pot molding assembly (10) for encapsulating semiconductor devices having an annular cavity (11) to form a molded carrier ring and an inner cavity (12) adapted to receive the item to be encapsulated. An outer mold pot (16) provides encapsulating material for the annular cavity (11) whereas a separate mold pot (17) provides encapsulating material for the inner cavity (12). Encapsulating material for the mold pots (16, 17) may be the same or in a preferred embodiment, different. Molding apparatus (10) promotes improved process control by delivering encapsulating material with a lower and more uniform viscosity to both the annular cavity (11) and the inner cavity (12). Further, use of separate mold pots (16, 17) allows cost savings because a less expensive encapsulating material may be used for molding the molded carrier ring since a high purity encapsulating material is not needed.
    Type: Grant
    Filed: May 28, 1991
    Date of Patent: December 29, 1992
    Assignee: Motorola, Inc.
    Inventor: Alexander J. Elliott
  • Patent number: 5169655
    Abstract: An injection mold typically defines multiple cavities. A mold gate is provided which comprises a rotary spherical member having a sprue conduit extending transversely therethrough. Highly accurate sequential molding of multiple cavities can be achieved in this manner, as well as other advantages. Also, this arrangement permits a linear, straight sprue conduit which is free of any sharp turns.
    Type: Grant
    Filed: October 24, 1991
    Date of Patent: December 8, 1992
    Inventor: John W. Von Holdt, Sr.
  • Patent number: 5158780
    Abstract: A device for simultaneously encapsulating a number of electronic components is provided with a locking mechanism in which a molding cycle has two phases, i.e. in a first transfer phase, during which plungers for injecting molten resin into encapsulation cavities are locked and driven at a high, controlled speed, followed by a second curing phase, during which the plungers are spring-loaded, unlocked, and stationary, and are subject to the same maximum pressure of the transfer phase. In this way damage to the products is prevented, while the cycle time is reduced and the products obtained have an even and smooth appearance.
    Type: Grant
    Filed: June 4, 1991
    Date of Patent: October 27, 1992
    Assignee: Boschman Technologies B.V.
    Inventors: Josephus J. M. Schraven, Marinus B. J. de Kruijff, Maarten Hoekstra
  • Patent number: 5145353
    Abstract: A molding press for simultaneously operating a pair of molds, each having a pair of mold sections (M1, M2; M3, M4), including a base for mounting two horizontally displaced mold sections (M1, M3), each constituting one section of one of the pair of molds, a first bolster for mounting a mold section M2) in alignment for mating engagement with one mold section M1) on the base, a second bolster for mounting a mold section (M4) in alignment for mating engagement with the other mold section (M3) on the base, rod assemblies for interconnecting the first bolster and the second bolster in fixed space relation, for guiding relative movement between the base and the bolsters during opening and closing of the pair of molds, and for mounting pistons operatively interrelated with cylinder assemblies on the base, and an auxiliary cylinder assembly for effecting relative movement between the base and the bolsters for opening of one of the pair of molds while closing the other of the pair of molds and vice versa.
    Type: Grant
    Filed: June 10, 1991
    Date of Patent: September 8, 1992
    Assignee: The Dow Chemical Company
    Inventor: Paul Zakich
  • Patent number: 5112558
    Abstract: An injection molding machine and method of operation having a plurality of accessory arrangements for molding a plurality of piece parts in efficient overlapping time cycle using primary and secondary molten plastic injection units, primary and secondary clamping units, a plurality of injection units in various arrays including molding piece parts in reverse or uniform orientation.
    Type: Grant
    Filed: August 24, 1989
    Date of Patent: May 12, 1992
    Assignee: Husky Injection Molding Systems Ltd.
    Inventors: Robert D. Schad, Paul Brown
  • Patent number: 5108278
    Abstract: A resin sealing apparatus includes upper and lower dies each having a chase block with a plurality of cavities into which molten resin is injected and a supporting member for supporting the chase block, the chase blocks of the upper and lower dies being fitted to each other, and a position determining member attached to a center block so that the positions of the chase blocks are determined when they are assembled, wherein each of the chase blocks is attached to each of the supporting members so as to be movable in the vertical and lateral directions within given ranges. The center block is provided on the supporting member and is disposed between two of the chase block with center plates interposed therebetween to form an integral unit.
    Type: Grant
    Filed: March 8, 1991
    Date of Patent: April 28, 1992
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yasutsugu Tsutsumi, Sueyoshi Tanaka, Yutaka Morita
  • Patent number: 5096411
    Abstract: A cast manifold for distributing pressurized melt in an injection molding system. The melt is received at a central inlet on the rear surface of the manifold to an inlet portion of a melt passage. Four identical outlet portions of the melt passage branch radially outward from the inlet portion to equally radially spaced outlets on the forward surface of the manifold. Each outlet portion extends around a first smoothly curved bend from the inlet portion, along a radial portion, and then around a second smoothly curved bend to the outlet. By casting on a removable ceramic mold, the bends in the melt passage are very smoothly curved and do not all have to extend in a common plane. Furthermore, the radial portions angle a substantial distance rearwardly as they extend outwardly which allows the thickness of the manifold to be reduced.
    Type: Grant
    Filed: May 16, 1991
    Date of Patent: March 17, 1992
    Inventor: Jobst U. Gellert
  • Patent number: 5094603
    Abstract: Multi-cavity injection molding apparatus to coinject pressurized melt from two or more melt sources. An inner melt passage extends through the central bore of a melt distribution plate and an adjacent heated nozzle. The nozzle has a tapered nose portion which extends into an adjacent heated cavity forming insert having a gate leading to one of the cavities. An outer melt passage is separated by curved conduits on opposite faces of the melt distribution plate into four channels which are radially spaced around the central bore of the nozzle. The four channels lead to a melt funnel duct which extends in the adjacent cavity forming insert around the nose portion of the nozzle. Thus the melt from the outer melt passage is evenly distributed around the melt from the inner melt passage when they join just before entering the gate.
    Type: Grant
    Filed: March 18, 1991
    Date of Patent: March 10, 1992
    Inventor: Jobst U. Gellert
  • Patent number: 5090886
    Abstract: A device for producing moldings of plastic material having a cavity therein filled with a fluid comprises a mold cavity, an injector for injecting flowable plastic into the mold cavity, an injector for injecting a pressurized fluid into an interior portion of the plastic, and a side cavity connected to the mold to receive flowable plastic melt expelled by the injected pressurized fluid. The side cavity may be randomly lockable and may comprise a closing stuffer which rests flush with respect to the mold cavity interior walls.
    Type: Grant
    Filed: September 21, 1990
    Date of Patent: February 25, 1992
    Assignee: Klockner Ferromatik Desma GmbH
    Inventor: Christoph Jaroschek
  • Patent number: 5087190
    Abstract: A multi-plunger molding machine having a dedicated injection circuit provided for each cavity of a plurality of cavities. Each injection circuit includes a nozzle, an injection plunger, an adjustable control cylinder dedicated to each injection plunger, a pressure control valve and a flow control valve. In this way, the quality of shot introduced into each cavity is independently controllable. A process computer and timers are used to open and close various mechanical valves in accordance with a predetermined sequence. A first timer insures that each shot undergoes a complete thermal expansion before curing begins. A second timer insures that each product is fully cured and that no product is discharged from a cavity prematurely. A flexible conduit is provided between each injection circuit and its associated nozzle so that the machine is free of runners and the concomitant waste of components is eliminated.
    Type: Grant
    Filed: December 21, 1990
    Date of Patent: February 11, 1992
    Inventor: Aldo A. Laghi
  • Patent number: 5085059
    Abstract: The machine comprises a plurality of mold plates moving along two superposed pairs of guides. Arranged in sequence along the upper guides are a mold filling device, a freezing tank, a stick inserting device, means for removing the freezed product. Arranged at the two ends of the machine are means capable of receiving a mold plate at its exit from the upper guides to bring it to the lower guides, and conversely, without the mold plates being overturned. The mold plates on the lower guides are moved at higher speed than the mold plates on the upper guides.
    Type: Grant
    Filed: August 1, 1990
    Date of Patent: February 4, 1992
    Assignee: Sidam S.r.l.
    Inventors: Franco Grigoli, Franco Trabacchi
  • Patent number: 5078589
    Abstract: An arrangement is disclosed for independently controlling shutoff and flow to a cavity gate in a multicavity injection mold apparatus, in which a plurality of valve pins are mounted to a movable holder plate, each aligned with a cavity gate and movable thereinto to control shutoff and a plurality of fixed position plunger sleeves are each mounted over a respective valve pin and adjustably positioned with respect to a restriction feature in the supply passage upstream of the associated gate.
    Type: Grant
    Filed: June 15, 1990
    Date of Patent: January 7, 1992
    Inventor: J. M. Osuna-Diaz
  • Patent number: 5075051
    Abstract: A molding apparatus transfers plural molds in succession through a temperature elevating step, an injection molding step, pressurized cooling step and a molded article removing step. The apparatus is provided with plural cooling presses for the pressurized cooling step and so constructed as to prevent the stagnation in the transfer of the molds according to the molding conditions and the number of molds.
    Type: Grant
    Filed: July 27, 1989
    Date of Patent: December 24, 1991
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kazuhiko Ito, Eiichi Yamazaki, Kunio Ohtaki, Fumio Korayashi, Yoshihisa Masuda, Hiroshi Nakanishi, Kiyozo Suzuki, Yuichi Miyoshi
  • Patent number: 5073328
    Abstract: An injection molding machine and method of operation having a plurality of accessory arrangements for molding a plurality of piece parts in efficient overlapping time cycle using primary and secondary molten plastic injection units, primary and secondary clamping units, a plurality of injection units in various arrays including molding piece parts in reverse or uniform orientation.
    Type: Grant
    Filed: August 24, 1989
    Date of Patent: December 17, 1991
    Assignee: Husky Injection Molding Systems Ltd.
    Inventors: Robert D. Schad, Paul Brown
  • Patent number: 5071339
    Abstract: A compression molding apparatus includes a rotatable supporting member and circumferentially spaced molds mounted on the rotatable supporting member. The molds are conveyed successively through a plastic material feed zone, a compression molding zone and a discharge zone by the rotation of the rotatable supporting member. A plastic material in a heat softened state is fed into the molds which are disposed within the plastic material feed zone. Each of the molds include a first mold portion and a second mold portion which defines a mold cavity. The mold is opened and closed by moving the mold portions relative to each other in a predetermined direction. A conduit hole extending from the mold cavity is formed in the second mold portion. Each mold includes a compression rod which slides in the conduit hole. The conduit hole has a plastic receiving portion opened frontwardly in the rotating direction of the rotatable supporting member.
    Type: Grant
    Filed: October 31, 1989
    Date of Patent: December 10, 1991
    Assignee: Toyo Seikan Kaisha, Ltd.
    Inventors: Kashiwa Murayama, Masakazu Tatsuta
  • Patent number: 5071334
    Abstract: A multiple transfer molding die for molding a plurality of semiconductor devices includes a plurality of resin paths between a pot and a plurality of cavities. Each resin path includes a first runner portion whose cross sectional area is determined according to the length between the center of the pot and the end of the first runner portion.
    Type: Grant
    Filed: December 28, 1990
    Date of Patent: December 10, 1991
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Shoji Obara
  • Patent number: 5061164
    Abstract: Transfer molding equipment, used to encapsulate semiconductor die, is provided with clamps mounted to the mold base to position and align mold chases. Previous designs position and align the top and bottom mold chases using dowels on the mold base received in holes in the chases. The invention reduces the downtime of the mold equipment, and decreases the time required to replace the chases when a different package is to be produced.
    Type: Grant
    Filed: April 1, 1991
    Date of Patent: October 29, 1991
    Assignee: Micron Technology, Inc.
    Inventors: Gregorio T. Sabado, Morley J. Weyerman
  • Patent number: 5056999
    Abstract: An apparatus for forming objects from a moldable material such as wax. The apparatus includes upper and lower mold pieces having upper and lower mold cavity halves attached thereto. A lever arm extends from the upper mold piece and is pivotally attached to a linear actuator. The upper and lower mold pieces are pivotably connected to one another. Movement of the linear actuator results in opening and closing of the upper and lower mold cavity halves about the pivotable connection of the upper and lower mold pieces.
    Type: Grant
    Filed: May 24, 1989
    Date of Patent: October 15, 1991
    Assignee: Howmet Corporation
    Inventors: Larry A. Lewis, David L. Kring, Otto F. Ernst
  • Patent number: 5055250
    Abstract: An injection molding machine and method of operation including a plurality of accessory arrangements for molding a plurality of piece parts in efficient overlapping time cycle using primary and secondary molten plastic injection units, primary and secondary clamping units, a plurality of injection units in various arrays including molding piece parts in reverse or uniform orientation.
    Type: Grant
    Filed: August 24, 1989
    Date of Patent: October 8, 1991
    Assignee: Husky Injection Molding Systems Ltd.
    Inventors: Robert D. Schad, Paul Brown
  • Patent number: 5052907
    Abstract: A resin sealing apparatus that has separable molds having a pot in which resin is injected. The pot communicates with cavities, in which semiconductor chips are set, by runners. The runners lead the resin injected in the pot to the cavities. A recess is provided at the distal end of each runner to hold the resin and air pressed out from the runner.
    Type: Grant
    Filed: July 3, 1990
    Date of Patent: October 1, 1991
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshihiko Matumoto, Hisanobu Takahama