Piezoelectric Properties Patents (Class 427/100)
  • Patent number: 6651335
    Abstract: A processing method of electroless plating in which a catalyst layer is absorbed on a surface of a substrate, a laser beam is selectively applied to the catalyst layer, processing of electroless plating is applied to the substrate, thereby a plating layer is not formed on a part to which the laser beam has been applied, and a plating layer is formed on a part to which laser beam has not been applied.
    Type: Grant
    Filed: September 27, 2001
    Date of Patent: November 25, 2003
    Assignee: Konica Corporation
    Inventors: Yuichi Akanabe, Shozo Kikugawa, Tetsuo Okuno, Minoru Yamada
  • Patent number: 6652905
    Abstract: A piezoelectric element includes a ceramic substrate, a piezoelectric ceramic composition composed mainly of a PbMg1/3Nb2/3O3—PbZrO3—PbTiO3 ternary system solid solution composition containing 0.05 to 10.0% by weight NiO, based on the ceramic composition. Electrodes are electrically connected to the piezoelectric. The piezoelectric is solidly attached to the ceramic substrate directly or via part of or all of the electrodes. The piezoelectric ceramic composition is represented by the following general formula: Pbx(Mgy/3Nb2/3)aTibZrcO3, wherein 0.95≦x≦1.05; 0.8≦y≦1.0; a, b and c are decimals falling in a range surrounded by (a,b,c)=(0.550, 0.425, 0.025), (0.550, 0.325, 0.125), (0.375, 0.325, 0.300), (0.100, 0.425, 0.475), (0.100, 0.475, 0.425) and (0.375, 0.425, 0.200), and a+b+c=1.000.
    Type: Grant
    Filed: January 30, 2003
    Date of Patent: November 25, 2003
    Assignee: NGK Insulators, Ltd.
    Inventor: Toshikatsu Kashiwaya
  • Patent number: 6652968
    Abstract: A pressure activated electrically conductive polymeric matrix material that is doped with particulate filler material. Electrical conductivity is pressure activated with a change in electrical resistance; specifically, with no pressure applied, the material is at a high resistance and with pressure the resistance is materially lower. Conductive fillers may be spherical or powder substrate, such as glass, graphite, etc., having plated thereon a metal coating which is electrically conductive and which is more thermally conductive than the substrate. The polymeric matrix materials may include polyurethane, silicone, and many other synthetic or natural rubbers.
    Type: Grant
    Filed: March 22, 2001
    Date of Patent: November 25, 2003
    Inventors: Dorothy H. J. Miller, Brian L. Miller
  • Patent number: 6625855
    Abstract: A method for producing a surface acoustic wave device, includes the steps of preparing a piezoelectric substrate, forming a thin film electrode on the piezoelectric substrate, etching the thin film electrode for forming an IDT, trimming at least one of the piezoelectric substrate and the IDT to adjust an operation frequency of the surface acoustic wave device, and rapidly altering the surface of the IDT for stabilizing the surface of the IDT.
    Type: Grant
    Filed: October 4, 2000
    Date of Patent: September 30, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Eiichi Takata, Yasuji Yamamoto, Toshimaro Yoneda, Michio Kadota
  • Patent number: 6618943
    Abstract: A drop-on-demand piezo-electric printhead has channel walls defined by piezo-electric material (10) with electrodes (26) along the length thereof. In portions of the channels which are open to an ink supply conduit, the piezo material is locally disabled, e.g. by reducing the width of the electrode or by interposing a material (40) of lower dielectric constant between the electrode and the piezo material. A lower capacitive load results.
    Type: Grant
    Filed: September 7, 2001
    Date of Patent: September 16, 2003
    Assignee: Xaar Technology Limited
    Inventors: James Ashe, Christopher David Phillips, Stephen Temple
  • Publication number: 20030170381
    Abstract: A piezoelectric element includes a ceramic substrate, a piezoelectric ceramic composition composed mainly of a PbMg1/3Nb2/3O3—PbZrO3—PbTiO3 ternary system solid solution composition containing 0.05 to 10.0% by weight NiO, based on the ceramic composition. Electrodes are electrically connected to the piezoelectric. The piezoelectric is solidly attached to the ceramic substrate directly or via part of or all of the electrodes. The piezoelectric ceramic composition is represented by the following general formula: Pbx(Mgy/3Nb2/3)aTibZrcO3, wherein 0.95≦x≦1.05; 0.8≦y≦1.0; a, b and c are decimals falling in a range surrounded by (a,b,c)=(0.550, 0.425, 0.025), (0.550, 0.325, 0.125), (0.375, 0.325, 0.300), (0.100, 0.425, 0.475), (0.100, 0.475, 0.425) and (0.375, 0.425, 0.200), and a+b+c=1.000.
    Type: Application
    Filed: January 30, 2003
    Publication date: September 11, 2003
    Applicant: NGK Insulators, Ltd.
    Inventor: Toshikatsu Kashiwaya
  • Patent number: 6617042
    Abstract: A degassed polyester varnish is applied to the transduction driver to increase surface dielectric strength (insulation resistance), driver voltage breakdown, physical protection, and heat and water resistance. A vacuum chamber application process is used to apply the polyester varnish. The disclosed coating technique is applicable to all transducer drive materials and all transducer types.
    Type: Grant
    Filed: December 3, 2002
    Date of Patent: September 9, 2003
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventor: Matthew M. DeAngelis
  • Patent number: 6617751
    Abstract: The present invention provides a robust FBAR device and a simplified method of fabricating a FBAR device. FBAR device according to the present invention includes a membrane supporting layer between a substrate and a membrane layer, surrounding an air gap region. The membrane supporting layer supports the membrane layer to obtain a robust structure. Firstly, the method forms a sacrificial layer on the substrate, then a photoresist pattern is formed on air gap forming region at a top surface of the sacrificial layer, the method removes the sacrificial layer to form a sacrificial pattern by using the photoresist pattern as an etching mask. An insulating material then deposits on the substrate, the photoresist pattern is remove, and a membrane layer is formed on a top surface of the sacrificial layer and the insulating material layer. Finally, the method removes the sacrificial pattern to form an air gap.
    Type: Grant
    Filed: April 19, 2001
    Date of Patent: September 9, 2003
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kuk Hyun Sunwoo, Hyoung Jun Kim, Jae Wook Jang
  • Patent number: 6601276
    Abstract: The invention relates to manufacturing electromechanical resonators for use in electromechanical filters. Such filters require resonators having different resonant frequencies. Typically all resonators are manufactured having the same resonant frequency and the resonant frequency of selected resonators is altered by the deposition of additional material on selected resonators in the form of additional layers. According to this invention, these layers are formed coextensive with the underlying layers of the resonator by first patterning larger areas of the added material, then masking the patterned areas with masks smaller than the patterned areas and etching both the underlying layer and the patterned area without moving the mask.
    Type: Grant
    Filed: May 11, 2001
    Date of Patent: August 5, 2003
    Assignee: Agere Systems Inc.
    Inventor: Bradley Paul Barber
  • Publication number: 20030129307
    Abstract: The present invention provides magnesium zinc oxide (MgxZn1-xO) as a new piezoelectric material, which is formed by alloying ZnO and MgO. MgxZn1-xO allows for flexibility in thin film SAW and BAW device design, as its piezoelectric properties can be tailored by controlling the Mg content, as well as by using MgxZn1-xO/ZnO multilayer structures. To experimentally prove it, the MgxZn1-xO (x≦0.35) thin films are grown on r-plane sapphire substrates at a temperature in the range of 400° C.-500° C. by metalorganic chemical vapor deposition. MgxZn1-xO films with Mg mole percent up to 0.35 have epitaxial quality and wurtzite crystal structure. The SAW properties, including velocity dispersion and piezoelectric coupling, are characterized and concluded that the acoustic velocity increases, whereas the piezoelectric coupling decreases with increasing Mg mole percent in piezoelectric MgxZn1-xO films.
    Type: Application
    Filed: October 7, 2002
    Publication date: July 10, 2003
    Applicant: Rutgers, The State University of New Jersey
    Inventors: Yicheng Lu, Nuri William Emanetoglu
  • Patent number: 6583690
    Abstract: A SAW (surface acoustic wave) filter manufactured by using a GaN piezoelectric thin film, and a manufacturing method therefor, are disclosed. The SAW filter of a high frequency band includes an &agr;-Al2O3 single crystal substrate. A GaN piezoelectric single crystal thin film of [0001] direction is formed to a thickness of 0.3-300 &mgr;m on the substrate, and an IDT electrode pattern is formed on the GaN piezoelectric single crystal thin film. The method for manufacturing a SAW filter of a high frequency band includes the following steps. An &agr;-Al2O3 single crystal substrate is prepared, and then, a GaN piezoelectric single crystal thin film of [0001] direction is epitaxially grown to a thickness of 0.3-300 &mgr;m on the substrate. Then an IDT electrode pattern is formed on the GaN piezoelectric single crystal thin film.
    Type: Grant
    Filed: November 29, 2000
    Date of Patent: June 24, 2003
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yong Hyun Lee, Jung Hee Lee, Suk Hun Lee, Young Sik Choi
  • Patent number: 6578245
    Abstract: A method of making a print head (100) includes forming a body (110) having a closed base (120) and independent fluid containment compartments (220) formed about the closed base (120). A substantially planar piezoelectric transducer (80) comprising a slab (60) of piezoelectric material provides a means of enclosing each of the independent fluid containment compartments (220). Each of the independent compartments has operably associated therewith one of a plurality of first electrodes (20) arranged on a first surface (62) of the slab (60) of piezoelectric material and a portion of a second electrode (22) arranged on an opposite second surface (64). By applying a voltage to the first and second surface electrodes (20, 22) in a predetermined manner induces an electric field in a portion of the slab (60) of piezoelectric material and thereby forces fluid composition through the independent fluid containment compartment (220).
    Type: Grant
    Filed: May 18, 2000
    Date of Patent: June 17, 2003
    Assignee: Eastman Kodak Company
    Inventors: Dilip K. Chatterjee, Edward P. Furlani, Syamal K. Ghosh
  • Publication number: 20030104136
    Abstract: A surface acoustic wave device used as a branching filter and the like in, for example, a mobile communications field to handle high frequencies of about several GHz is manufacturable by forming a metal film on a wafer-like piezoelectric substrate and selectively removing the metal film to form comb-teeth-shaped metal electrodes. The metal film is partly formed in two or more film-forming modes involving different in-wafer-plane film-forming-velocity distributions, and the remaining part thereof is formed in a fixed film-forming mode. An in-wafer-plane film-thickness distribution of a part of the metal film is precisely controllable. Forming the remaining part of the metal film precisely controls the final thickness of the metal film.
    Type: Application
    Filed: December 26, 2002
    Publication date: June 5, 2003
    Inventor: Toshiyuki Takagi
  • Publication number: 20030104122
    Abstract: A system and method for treating, such as insulating, piezoelectric components, such as piezoelectric micro-actuators for use in magnetic hard disk drives is disclosed, different embodiments involving material dipping, spraying, pin application, and chemical vapor deposition.
    Type: Application
    Filed: March 13, 2002
    Publication date: June 5, 2003
    Inventors: Masashi Shiraishi, Ming Gao Yao, Tamon Kasajima
  • Patent number: 6571446
    Abstract: A method for manufacturing a piezoelectric element is disclosed. The method includes the steps of forming a lower electrode over a substrate, forming a piezoelectric luminous film over the lower electrode, forming an upper electrode over the piezoelectric film, forming a pressure luminous layer for emitting light upon application of pressure on the upper electrode, and attaching a substrate to the pressure luminous layer—has been inserted as a new abstract.
    Type: Grant
    Filed: July 30, 2001
    Date of Patent: June 3, 2003
    Assignee: Seiko Epson Corporation
    Inventors: Hong Qiu, Koji Sumi, Tsutomu Nishiwaki
  • Patent number: 6551652
    Abstract: A piezoelectric element having a piezoelectric film where the difference in the quantity of lead along the thickness of the film is minimized. The film is obtained by first applying, at least once, a first sol for use in forming a PZT film on a substrate having a lower electrode formed thereon. Second, applying a second sol having the greater lead content than the first sol. Third, subjecting these films to heat treatment at a predetermined temperature at least once. The second sol has a composition capable of forming a piezoelectric film having a Perovskite structure expressed generally by AxByO3, and the content of material constituting the A site of the first sol is greater than what constitutes the A site of the second sol.
    Type: Grant
    Filed: November 30, 1999
    Date of Patent: April 22, 2003
    Assignee: Seiko Epson Corporation
    Inventors: Hong Qiu, Soichi Moriya, Hiroyuki Kamei, Koji Sumi, Masami Murai, Tsutomu Nishiwaki
  • Patent number: 6543107
    Abstract: A method for producing the piezoelectric thin film is based on a sol-gel process and comprises the steps of: coating a substrate with a sol composition comprising a sol, of a metal component for constituting a piezoelectric film, and a polymer compound and then drying the coating to form a film; pre-sintering the film to form a porous thin film of gel comprising an amorphous metal oxide; pre-annealing the porous thin film of gel to convert the film to a film of a crystalline metal oxide; repeating the steps at least once to form laminated films of a crystalline metal oxide; and annealing the films thus prepared to grow crystal grains of perovskite type in the film into a larger size.
    Type: Grant
    Filed: February 28, 1997
    Date of Patent: April 8, 2003
    Assignee: Seiko Epson Corporation
    Inventors: Satoru Miyashita, Masakazu Shinozuka, Tetsushi Takahashi
  • Patent number: 6527961
    Abstract: A method for the formation of a region of silicon dioxide on a substrate of monocrystalline silicon. The epitaxial growth of a silicon layer, the opening of holes in the silicon layer above the silicon dioxide region, and the removal of the silicon dioxide which constitutes the region by means of chemical attack through the holes until a silicon diaphragm, attached to the substrate along the edges and separated therefrom by a space, is produced. In order to form an absolute pressure microsensor, the space has to be sealed. To do this, the method provides for the holes to have diameters smaller than the thickness of the diaphragm and to be closed by the formation of a silicon dioxide layer by vapor-phase deposition at atmospheric pressure.
    Type: Grant
    Filed: March 2, 1998
    Date of Patent: March 4, 2003
    Assignee: SGS-Thomson Microelectronics, S.r.l.
    Inventors: Benedetto Vigna, Paolo Ferrari, Pietro Montanini, Marco Ferrera
  • Publication number: 20030035031
    Abstract: An ink-jet head, comprises an ink chamber in which ink is stored; a piezoelectric element to jet the ink from the ink chamber; an electrode to apply an electric voltage onto the piezoelectric element; and a layer provided on the electrode by an electrodeposition method. The layer is subjected to a process to change a surface energy.
    Type: Application
    Filed: October 4, 2002
    Publication date: February 20, 2003
    Inventors: Takeshi Ito, Hideo Watanabe, Hiroyuki Nomori
  • Patent number: 6507983
    Abstract: An acoustical resonator comprising top and bottom electrodes that sandwich a PZ layer. The resonance frequency of the acoustical resonator may be adjusted after fabrication by utilizing heating elements included in the acoustical resonator and/or by adjusting the thickness of a tuning layer. In the preferred embodiment of the present invention, the electrodes comprise Mo layers. One embodiment of the present invention is constructed on a Si3N4 membrane. A second embodiment of the present invention is constructed such that it is suspended over a substrate on metallic columns. In the preferred embodiment, the electrodes are deposited by a method that minimizes the stress in the electrodes.
    Type: Grant
    Filed: November 13, 1998
    Date of Patent: January 21, 2003
    Assignee: Agilent Technologies, Inc.
    Inventors: Richard C. Ruby, Paul Philip Merchant
  • Patent number: 6504287
    Abstract: The present invention relates a manufacturing method for a multilayered piezoelectric/electrostrictive ceramic actuator by a sintering process at low temperature. The present invention makes feasible a high quality image and high speed printing, as large displacement and high speed actuation are feasible because it can get greater displacement and driving speed, even with small variation in driving voltage, because of piezoelectric/electrostrictive layer and upper electrode being alternately heaped to produce a multilayer structure.
    Type: Grant
    Filed: December 12, 2001
    Date of Patent: January 7, 2003
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Kyeong Yun, Dong Hoon Kim, Jong-Myeon Lee
  • Patent number: 6485779
    Abstract: Acetylacetone and an aqueous nitric acid are included in a solution in which organic metal compounds of metals constituting a ferroelectric in an organic solvent thereby forming a ferroelectric film formation solution. The solution is applied to a substrate, followed by drying and baking to obtain a ferroelectric film. As a consequence, even when forming a ferroelectric film such as a PZT or PLZT film containing a II group element in the periodic table, a stable ferroelectric film formation solution which prevents neither crystallization nor gelation and is reduced in a change with time in the viscosity thereof can be obtained. A ferroelectric film which contains a II group element and has excellent ferroelectric properties can be thus produced with ease.
    Type: Grant
    Filed: May 22, 2000
    Date of Patent: November 26, 2002
    Assignees: Rohm Co., Ltd, Kanto Kagaku Kabushiki Kaisha
    Inventors: Akira Kamisawa, Hayato Katsuragi, Taku Yamate, Kiyoto Mori
  • Publication number: 20020172757
    Abstract: An automated system for dip coating a superconducting material on a substrate is disclosed. The system includes an actuator, a pick up station, a dip coating station that comprises a reservoir of a dip coating formulation, a drying station that includes a source of heated air and a conveyor for moving the actuator from the pick up station to the dip coating station and from the dip coating station to the drying station. The actuator includes an arm for carrying a substrate. The arm is capable of being moved vertically downward to submerse the substrate in the dip coating reservoir and the arm is also capable of being moved vertically upward to lift the substrate out of the dip coating reservoir. A method for automatically dip coating a substrate with a superconducting material is also disclosed.
    Type: Application
    Filed: March 6, 2001
    Publication date: November 21, 2002
    Inventors: Christine L. Vrtis, James Sharp
  • Patent number: 6481074
    Abstract: A method for producing an apparatus for ejecting liquid droplets includes the steps of providing a porous medium having a plurality of pores therein, forming a plurality of holes through the porous medium and assembling with the porous medium a plurality of transducers and nozzles. At least some of the plurality of pores are in the porous medium, and enable a liquid to flow into a liquid cavity prior to the liquid droplet ejection. Each transducer corresponds to a corresponding liquid cavity, a corresponding nozzle and a corresponding hole, generally disposed along the same axis. Each transducer is operative to eject liquid droplets through the corresponding nozzle via the corresponding hole.
    Type: Grant
    Filed: June 11, 1999
    Date of Patent: November 19, 2002
    Assignee: Aprion Digital Ltd.
    Inventor: Haggai Karlinski
  • Patent number: 6480074
    Abstract: A method and system for tuning a bulk acoustic wave device at wafer level by reducing the thickness non-uniformity of the topmost surface of the device using a chemical vapor deposition process. A light beam is used to enhance the deposition of material on the topmost surface at one local location at a time. Alternatively, an electrode is used to produce plasma for locally enhancing the vapor deposition process. A moving mechanism is used to move the light beam or the electrode to different locations for reducing the thickness non-uniformity until the resonance frequency of the device falls within specification.
    Type: Grant
    Filed: April 27, 2001
    Date of Patent: November 12, 2002
    Assignee: Nokia Mobile Phones Ltd.
    Inventors: Jyrki Kaitila, Pasi Tikka, Juha Ellä
  • Patent number: 6469189
    Abstract: A novel compound shown by M[N(OC2H5)5(OC2H4OCH3)]2, wherein M represents Sr or Ba, N represents Nb or Ta, which is a liquid at room temperature, is hard to be thermally dissociated, and has a vapor pressure of about 0.2 Torr at 190° C. The compound is produced by reacting 2 moles of N(OC2H5)5 and from 1 to 1.1 moles of M(OC2H4OCH3)2 and then recovering the product by distillation. By using the compounds as raw materials for a CVD method, an SrBi2Ta2O9 thin film or a (Sr0.75Ba0.25)Nb2O6 thin film for semiconductor devices can be produced.
    Type: Grant
    Filed: February 17, 2000
    Date of Patent: October 22, 2002
    Assignee: Kabushikikaisha Kojundokagaku Kenkyusho
    Inventors: Hidekimi Kadokura, Yumie Okuhara
  • Patent number: 6456173
    Abstract: A method and system for tuning a bulk acoustic wave device at the wafer level by adjusting the device thickness. In particular, the device thickness has a non-uniformity profile across the device surface. A mask with an aperture is placed over the device surface and a particle beam is applied over the mask to allow part of the particle beam to make contact with the device surface at a localized area beneath the aperture. The particles that pass through the aperture are deposited on the device surface to add material on the device surface, thereby increasing the surface thickness to correct for thickness non-uniformity. Alternatively, the particles that pass through the aperture remove part of the device surface in an etching process, thereby reducing the surface thickness. Prior to thickness adjustment, a frequency measurement device or thickness measurement device is used to map the device surface for obtaining the non-uniformity profile.
    Type: Grant
    Filed: February 15, 2001
    Date of Patent: September 24, 2002
    Assignee: Nokia Mobile Phones Ltd.
    Inventors: Juha Ellä, Pasi Tikka, Jyrki Kaitila
  • Publication number: 20020129478
    Abstract: A method for splitting a piezoelectric device used in substitution for dicing for shortening the processing time as compared to a case of using the dicing to improve productivity to enable the shape of the piezoelectric device more suited to the emission shape of a solution to be achieved, and a method for manufacturing a printer device whereby a narrower nozzle pitch may be achieved. A resist 201 is formed at a pre-set position on a major surface of the piezoelectric device 43 bonded to a vibrating plate. Using this resist 201 as a mask, powders or particles are sprayed onto the piezoelectric device 43 for removing the portion of the piezoelectric device 43 not carrying the resist 201 to form the piezoelectric device 35 of a desired shape at a pre-set position.
    Type: Application
    Filed: May 8, 2002
    Publication date: September 19, 2002
    Applicant: SONY CORPORATION
    Inventor: Koichiro Kishima
  • Patent number: 6449828
    Abstract: A method of making a SAW component has electrically conductive structures on a substrate. A cap cover encapsulates and seals the structures against environmental influences. An RF shield is placed on the cap cover. The RF shield is a metallization formed of a material layer sequence of TiW, Cu or Ni and Au which is then reinforced with current-less or galvanic deposition.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: September 17, 2002
    Assignee: Siemens Matsushita Components GmbH & Co. KG
    Inventors: Wolfgang Pahl, Alois Stelzl, Hans Krüger
  • Patent number: 6440501
    Abstract: An apparatus for curing silicone rubber is constructed so as to perform a heating process and a curing process in a very short time without degradation of characteristics in piezoelectric elements so as to improve productivity. A piezoelectric component having uncured silicone rubber coated on the external peripheral surface thereof is held in a jig having a property of reflecting far infrared rays. The uncured silicone rubber coated on the external peripheral surface of the piezoelectric component is irradiated with far infrared rays by a far infrared panel heater so as to cure the silicone rubber.
    Type: Grant
    Filed: December 28, 2000
    Date of Patent: August 27, 2002
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Masanobu Sugimori
  • Patent number: 6432473
    Abstract: The invention described is a method of forming an improved dielectric material by adding lead to an original perovskite material having an original critical grain size to form a lead enhanced perovskite material, then forming a layer of the lead enhanced perovskite material having an average grain size less than the original critical grain size whereby the dielectric constant of the layer is substantially greater than the dielectric constant of the original perovskite material with an average grain size similar to the average grain size of the layer. The critical grain size, as used herein, means the largest grain size such that the dielectric constant starts to rapidly decrease with decreasing grain sizes. Preferably, the lead enhanced perovskite material is further doped with one or more acceptor dopants whereby the resistivity is substantially increased and/or the loss tangent is substantially decreased.
    Type: Grant
    Filed: June 1, 1995
    Date of Patent: August 13, 2002
    Assignee: Texas Instruments Incorporated
    Inventors: Scott R. Summerfelt, Howard R. Beratan, Bernard M. Kulwicki
  • Patent number: 6432238
    Abstract: Disclosed is a method for fabricating a piezoelectric/electrostrictive thick film, using a seeding layer. On a substrate is formed the seeding layer which is prepared from a ceramic sol solution or a ceramic paste, both identical or similar in composition to the piezoelectric/electrostrictive film. The ceramic paste is prepared from a mixture of a ceramic oxide powder, which has a particle size of 5 &mgr;m or less and is prepared from Pb and Ti-based piezoelectric/electrostrictive elements by a non-explosive oxidation-reduction combustion reaction at 100-500° C., and a ceramic sol solution in water or an organic solvent, identical or similar in composition to the ceramic oxide powder. Then, the seeding layer is subjected to an after-treatment. A piezoelectric/electrostrictive film is directly formed on the seeding layer. Alternatively, a piezoelectric/electrostrictive film, separately formed and sintered, is attached on the seeding layer.
    Type: Grant
    Filed: June 11, 1999
    Date of Patent: August 13, 2002
    Assignee: Samsung Electro-Mechanicals Co., Ltd.
    Inventors: Sang Kyeong Yun, Dong-Hoon Kim
  • Publication number: 20020094372
    Abstract: A piezoelectric element having a piezoelectric film where the difference in the quantity of lead along the thickness of the film is minimized. The film is obtained by first applying, at least once, a first sol for use in forming a PZT film on a substrate having a lower electrode formed thereon. Second, applying a second sol having the greater lead content than the first sol. Third, subjecting these films to heat treatment at a predetermined temperature at least once. The second sol has a composition capable of forming a piezoelectric film having a Perovskite structure expressed generally by AxByO3, and the content of material constituting the A site of the first sol is greater than what constitutes the A site of the second sol.
    Type: Application
    Filed: November 30, 1999
    Publication date: July 18, 2002
    Inventors: HONG QIU, SOICHI MORIYA, HIROYUKI KAMEI, KOJI SUMI, MASAMI MURAI, TSUTOMU NISHIWAKI
  • Patent number: 6419848
    Abstract: A piezoelectric actuator, comprising a stacked structure consisting of a top electrode 5, a piezoelectric film 4, and a bottom electrode 3, wherein the piezoelectric film comprises a first group 42 of piezoelectric ceramic particles and a second group 43 of piezoelectric ceramic particles. A distinctive feature is that the particles constituting the first group of piezoelectric ceramic particles are larger than the jingo particles constituting the second group of piezoelectric ceramic particles, and the first group of piezoelectric ceramic particles and the second group of piezoelectric ceramic particles have mutually different compositions. The piezoelectric actuator can thus be manufactured by an application method in a low-temperature environment, and a thicker piezoelectric film can be obtained. In addition, a highly practical piezoelectric film can be provided by combining the advantages of a plurality of material types.
    Type: Grant
    Filed: March 2, 2000
    Date of Patent: July 16, 2002
    Assignee: Seiko Epson Corporation
    Inventors: Hong Qiu, Koji Sumi, Tsutomu Nishiwaki, Haruo Nakamura
  • Patent number: 6416934
    Abstract: An interdigital electrode of a SAW device is protected by a protective layer during a photo-lithography etching process which is used to apply a bonding pad. As the bonding pad can be formed by the photo-lithography etching process, it is possible to obtain regularly shaped bonding pads without damaging the characteristics of the SAW device.
    Type: Grant
    Filed: June 28, 2000
    Date of Patent: July 9, 2002
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Masao Yamagishi
  • Patent number: 6413575
    Abstract: A method of applying a matching layer to a transducer includes placing the transducer on a fixture and covering the transducer with a stencil so that an opening in the stencil allows access to a metal-coated, piezoelectric surface of the transducer, and so that the stencil is affixed to the transducer surface. A roughly cylindrically shaped bead of epoxy is extruded onto the stencil at a predetermined distance from the opening, and a blade is positioned upstanding relative to the transducer surface and located so that the bead lies between the blade and the opening. The fixture is moved laterally so that the blade rolls the bead across the exposed transducer surface to form a layer of epoxy thereon. The fixture can then be moved back in the opposite direction to its initial position if desired. The assembly can also be subjected to a vacuum before the fixture is returned to its initial position. If desired, the fixture can be designed to vibrate during movement.
    Type: Grant
    Filed: June 13, 2001
    Date of Patent: July 2, 2002
    Assignee: Scimed Life Systems, Inc.
    Inventors: Don S. Mamayek, Veijo Suorsa
  • Publication number: 20020081374
    Abstract: The present invention relates to a method of vapor phase epitaxial deposition of silicon on a silicon substrate including areas containing dopants at high concentration among which is arsenic, while avoiding an autodoping of the epitaxial layer by arsenic, including the steps of performing a first thin epitaxial deposition, then an anneal; the conditions and the duration of the first epitaxial deposition and of the anneal being such that the arsenic diffusion length is much lower than the thickness of the layer formed in the first deposition; and performing a second epitaxial deposition for a chosen duration to obtain a desired total thickness.
    Type: Application
    Filed: January 15, 2002
    Publication date: June 27, 2002
    Applicant: STMicroelectronics S.A.
    Inventors: Didier Dutartre, Patrick Jerier
  • Publication number: 20020071969
    Abstract: When a piezoelectric material is manufactured by hydrothermal method, the proper amount of lead contained in the piezoelectric film can be ensured and decreases in piezoelectric characteristics can be prevented. A method for manufacturing a piezoelectric material expressed by the formula ABO3, containing an element “a” as the element expressed by A above, and having a perovskite crystal structure, comprises a first step of producing an oxide containing an element “a′”, and a second step of producing a piezoelectric material by subjecting the oxide produced in the first step to a hydrothermal processing using an aqueous solution containing the element “a”, wherein the amount of the element “a”, contained in the piezoelectric material produced in the second step is increased over the amount of the element “a” contained in the oxide produced in the first step.
    Type: Application
    Filed: January 18, 2002
    Publication date: June 13, 2002
    Inventors: Hong Qiu, Koji Sumi, Tsutomu Nishiwaki, Masanori Okuyama, Zhiqiang Wei
  • Patent number: 6387012
    Abstract: A metal complex solution comprising an organic solvent, and a complex composed of an organic acid salt of at least one metal and an organic amine or organic ketone compound, dissolved in the organic solvent; a photosensitive metal complex solution comprising the metal complex solution, and a photosensitive resin added to the solution; and a method for forming metallic oxide films, using these solutions.
    Type: Grant
    Filed: March 24, 1999
    Date of Patent: May 14, 2002
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventor: Satoshi Mitamura
  • Patent number: 6379510
    Abstract: A method of making a micro-mirror light beam switch having a thin flexible movable support member for supporting a thin central reflective mirror surface thereon and for supporting a plurality of thin unimorph piezoelectric cantilevered mirror actuators mechanically coupled between a fixed substrate and movable hinging portions of the thin movable support member. The method employs thin film deposition techniques and photolithography for readily forming the extremely thin switch, whereby the components thereof are substantially co-planar for precisely controlled, multi-axial micro-mirror motion and low voltage operation necessary for the rapid switching of optical traffic from fiber to fiber in the next-generation optical networks.
    Type: Grant
    Filed: November 16, 2000
    Date of Patent: April 30, 2002
    Inventors: Jonathan S. Kane, Gareth A. Hughes
  • Patent number: 6367132
    Abstract: A method of making a print head (100) includes forming a body (110) having a closed base (120) and independent fluid containment compartments (220) formed about the closed base (120). A substantially planar piezoelectric transducer (80) comprising a slab (60) of piezoelectric material provides a means of enclosing each of the independent fluid containment compartments (220). Each of the independent compartments has operably associated therewith one of a plurality of first electrodes (20) arranged on a first surface (62) of the slab (60) of piezoelectric material and a portion of a second electrode (22) arranged on an opposite second surface (64). By applying a voltage to the first and second surface electrodes (20, 22) in a predetermined manner induces an electric field in a portion of the slab (60) of piezoelectric material and thereby forces fluid composition through the independent fluid containment compartment (220).
    Type: Grant
    Filed: August 31, 1998
    Date of Patent: April 9, 2002
    Assignee: Eastman Kodak Company
    Inventors: Dilip K. Chatterjee, Edward P. Furlani, Syamal K. Ghosh
  • Patent number: 6367133
    Abstract: A method of manufacturing a surface acoustic wave apparatus including the steps of forming a first conductive film, depositing a first resist on the first conductive film and patterning the first resist, dry-etching the first conductive film using the patterned first resist to form IDT electrodes, a short-circuit wiring electrode for establishing electrical connection between IDT electrodes, and a second conductive film provided where the second surface acoustic wave device is constructed, removing the second conductive film, depositing a second resist and heating the second resist, patterning the second resist on the electrodes, forming a second conductive film having a thickness which is different from the first conductive film, removing the second resist to form the electrodes of the second surface acoustic wave device and to expose the electrodes of the first surface acoustic wave device, and disconnecting the short-circuit wiring electrode.
    Type: Grant
    Filed: March 5, 2001
    Date of Patent: April 9, 2002
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Katsuhiro Ikada, Kenji Sakaguchi, Miki Takamiya
  • Patent number: 6355185
    Abstract: A piezoelectric paste which is used for forming a piezoelectric thick film by the thick film forming technique, which can be burned at a relative low temperature and which can form a piezoelectric film having good polarizability and high piezoelectricity while maintaining the ferroelectricity possessed by a piezoelectric crystal powder contained in the piezoelectric paste contains the piezoelectric crystal powder containing a Pb(Zr, Ti)O3 system ceramic, a crystallized glass powder and an organic vehicle, wherein the crystallized glass powder used precipitates a Pb(Zr, Ti)O3 system solid solution phase by heat treatment.
    Type: Grant
    Filed: April 19, 2000
    Date of Patent: March 12, 2002
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Teppei Kubota
  • Patent number: 6351879
    Abstract: A method of making a printing apparatus configured for drawing fluid from a fluid reservoir and then ejecting droplets of fluid onto a receiver to form an image include the steps of providing an orifice manifold having a plurality of orifices each one of which in fluid communications with one of a plurality of piezoelectric pumps.
    Type: Grant
    Filed: August 31, 1998
    Date of Patent: March 5, 2002
    Assignee: Eastman Kodak Company
    Inventors: Edward P. Furlani, Syamal K. Ghosh, Dilip K. Chatterjee
  • Patent number: 6349454
    Abstract: A thin film resonator (TFR) is produced with an improved piezoelectric film which is epitaxially grown on a growing surface, resulting in a piezoelectric film with less grain boundaries. Epitaxial growth refers to the piezoelectric film having a crystallographic orientation take from or emulating the crystallographic orientation of a single crystal substrate or growing surface. For example, by epitaxially growing a piezoelectric film on a single crystal silicon substrate as the growing surface, an improved piezoelectric film is produced with little or no grain boundaries. Also provided is a method of making a TFR in which the piezoelectric film is grown on a substrate. Subsequently, a portion of the substrate is removed, and the electrodes are deposited on either side of the piezoelectric film.
    Type: Grant
    Filed: July 29, 1999
    Date of Patent: February 26, 2002
    Assignee: Agere Systems Guardian Corp.
    Inventors: Michael James Manfra, Loren Neil Pfeiffer, Kenneth William West, Yiu-Huen Wong
  • Patent number: 6350486
    Abstract: A ferroelectric element comprising a ferroelectric material containing at least two metals, the ferroelectric element having been produced by a process including a sol-gel process in the presence of a thickener and/or an association preventive from aqueous solutions of respective salts of the metals. The ferroelectric element is advantageous in that the handling of starting compounds and the production of the ferroelectric element are easy, the storage stability of the starting compound solution is good, the cost is low, the ferroelectric element can be formed as a thin layer, particles on the surface of the thin layer are fine and dense, and, hence, the surface smoothness is good. The ferroelectric element is excellent also in piezoelectric properties and therefore can be advantageously used as a piezoelectric element in a piezoelectric ink jet head.
    Type: Grant
    Filed: November 3, 1999
    Date of Patent: February 26, 2002
    Assignee: Citizen Watch Co., Ltd.
    Inventors: Shinichi Sakamaki, Yukimi Takahashi, Yorinobu Yamada, Motoyuki Toki, Mamoru Aizawa
  • Patent number: 6347441
    Abstract: A manufacturing method for a multilayered piezoelectric/electrostrictive ceramic actuator by sintering process at low temperature, making feasible a high quality image and high speed printing, as large displacement and high speed actuation are feasible because it can get greater displacement and driving speed, even with small variation in driving voltage, because of piezoelectric/electrostrictive layer and upper electrode being alternately heaped to produce a multilayer structure.
    Type: Grant
    Filed: October 29, 1999
    Date of Patent: February 19, 2002
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Kyeong Yun, Dong Hoon Kim, Jong-Myeon Lee
  • Patent number: 6337032
    Abstract: A sol-gel precursor mixture for forming a perovskite ferroelectric material and a method for forming a ferroelectric material are provided. The precursor solution comprises a sol-gel formulation of a mixture of an inorganic salt of at least one metal, and metal-organic compounds of other constituent metals in a suitable pH controlled aqueous solvent mixture to form a stable, clear sol-gel mixture. The precursor solution and method provides for formation of thin layers of other ferroelectric dielectrics and piezoelectric materials, particularly lead containing materials, for application including non-volatile DRAMs, optoelectronic devices relying on non-linear optical properties, and piezoelectric devices, and is compatible with processing for submicron device structures for bipolar, CMOS or bipolar CMOS circuits.
    Type: Grant
    Filed: February 16, 2000
    Date of Patent: January 8, 2002
    Assignees: Nortel Networks Limited, Queen's University
    Inventors: Vasanta Chivukula, Michael Sayer, David R. McDonald, Ismail T. Emesh
  • Patent number: 6333066
    Abstract: A method for forming a PZT (lead zirconate titanate: Pb(ZrxTi1−x)O3) thin film using a seed layer is provided. In the method for forming a PZT thin film, PZT is grown on a PbO seed layer or a PZT seed layer of a perovskite phase formed by injecting excess Pb. The PbO seed layer or the PZT seed layer of a perovskite phase facilitates creation of perovskite PZT nuclei, thereby growing small and uniform PZT grains consisting of a perovskite phase.
    Type: Grant
    Filed: November 20, 1998
    Date of Patent: December 25, 2001
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Dae-sig Kim
  • Patent number: 6332254
    Abstract: A process for producing a laminated ink-jet recording head including the steps of forming a titanium layer across a surface of a diaphragm, and forming a layer of a piezoelectric material on the titanium layer by a hydrothermal method.
    Type: Grant
    Filed: April 6, 1999
    Date of Patent: December 25, 2001
    Assignee: Seiko Epson Corporation
    Inventors: Minoru Usui, Masato Shimada, Masami Murai, Kouji Sumi, Tsutomu Nishiwaki