Resistor For Current Control (excludes Heating Element) Patents (Class 427/101)
  • Patent number: 10690622
    Abstract: A portable electrochemical or combustible lower explosive limit gas sensing apparatus includes a housing comprising at least one exterior surface and an interior space. At least one depression is formed in the at least one exterior surface and is adapted to accommodate, at least in part, components of an electrochemical gas sensor or a combustible LEL gas sensor. A processing unit is disposed in the interior space of the housing and is in electrical communication with the electrochemical gas sensor or the combustible LEL gas sensor.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: June 23, 2020
    Assignee: Industrial Scientific Corporation
    Inventors: Chuan-Bao Wang, Kathryn Salvetti, Yong Wang
  • Patent number: 10533965
    Abstract: A catalytically activated combustible gas sensing element includes a filament of resistance wire forming a coil, wherein a first end of the resistance wire is attached to a first support post and a second end of the resistance wire is attached to a second support post, a cantilever support supporting the coil, wherein the cantilever support is attached to a third support post, and a catalytic bead substantially surrounding the coil and cantilever.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: January 14, 2020
    Assignee: Industrial Scientific Corporation
    Inventors: Chuan-Bao Wang, Kathryn Salvetti, Yong Wang
  • Patent number: 10410792
    Abstract: The instant disclosure provides a thin film capacitor and a method of manufacturing the same. The method includes the following steps: placing a carrier substrate on a processing machine including at least one processing unit, and the at least one processing unit having a metal-layer forming module and an insulation-layer forming module that are arranged along a planar production line; forming a plurality of metal layers by the metal-layer forming module of the at least one processing unit, forming a plurality of insulation layers by the insulation-layer forming module of the at least one processing unit, and the metal layers and the insulation layers being alternately stacked on the carrier substrate to form a multilayer stacked structure; and then forming two terminal electrode structures to respectively enclose two opposite side end portions of the multilayer stacked structure.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: September 10, 2019
    Assignee: APAQ TECHNOLOGY CO., LTD.
    Inventor: Ming-Goo Chien
  • Patent number: 10359325
    Abstract: A strain gauge includes: a substrate; a dielectric layer on the substrate; a thin film electrical circuit on the dielectric layer and having input/output terminals; other layers disposed on the electrical circuit; the dielectric layer forming a first seal on one side of the electrical circuit, the other layers forming a second seal on a second side of the electrical circuit, the first and second seals having structure such that: in a first instance prior to exposure of the strain gauge to an autoclave cycle, the electrical circuit is productive of a first output voltage in response to a first input voltage; and in a second instance subsequent to exposure of the strain gauge to at least 25 autoclave cycles, the electrical circuit is productive of a second output voltage in response to a second input voltage, the first and second input voltages being equal, and the first and second output voltages being equal.
    Type: Grant
    Filed: May 15, 2017
    Date of Patent: July 23, 2019
    Assignee: STRAIN MEASUREMENT DEVICES, INC.
    Inventor: Daniel E. Shapiro
  • Patent number: 9335231
    Abstract: Micro-Pirani gauge vacuum gauges are described that use low-thermal conductivity support elements. A micro-Pirani gauge or vacuum sensor can include a heating element operative to heat a gas and to produce a signal corresponding to the pressure of the gas; a platform configured to receive the heating element, with the platform having a first coefficient of thermal conductivity; and a support element connected to a substrate and configured to support the platform with the heating element within an aperture disposed in the substrate, with the support element having a second coefficient of thermal conductivity, where the second coefficient of thermal conductivity is less than the first coefficient of thermal conductivity. Multimode pressure sensing including a micro-Pirani gauge are also described.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: May 10, 2016
    Assignee: MKS Instruments, Inc.
    Inventors: Lei Gu, Stephen F. Bart, Ole Wenzel
  • Publication number: 20150102897
    Abstract: The invention relates to a resistor, in particular a low-resistance current-measuring resistor, comprising a first connection part (1) that consists of a conductor material for introducing an electrical current (I), a second connection part (2) that consists of a conductor material for discharging said electrical current (I), and a resistor element (3) that consists of a resistor material and is arranged between the two connection parts (1, 2) in the direction of the current, also comprising a resistor coating (7) that consists of a metallic material for the purpose of achieving protection from corrosion, and/or improving solderability. According to the invention, the metallic coating (7) is applied directly to the entire free surface of the resistor element (3) without any insulation layer.
    Type: Application
    Filed: June 5, 2013
    Publication date: April 16, 2015
    Inventor: Ullrich Hetzler
  • Publication number: 20150060408
    Abstract: The present invention includes a wear-resistant material including: a base material formed of pure aluminum or an aluminum alloy having a projection, and a depression in a pit-like shape on a surface thereof; and a coat including a dehydrate of a hydrated oxide of aluminum, the coat being formed on a surface of the base material. Further, the present invention including a method for producing a wear-resistant material including the steps of: forming a hydrated oxide coat of aluminum on a surface of the base material by a chemical conversion coating; and heating the hydrated oxide coat. Further, the present invention also includes a puffer cylinder and a puffer-type gas circuit breaker applied to the above wear-resistant material.
    Type: Application
    Filed: July 18, 2014
    Publication date: March 5, 2015
    Inventors: Masahiko ONO, Makoto HIROSE, Daisuke EBISAWA, Hisashi URASAKI
  • Publication number: 20140342082
    Abstract: Method and apparatus for direct writing of passive structures having a tolerance of 5% or less in one or more physical, electrical, chemical, or optical properties. The present apparatus is capable of extended deposition times. The apparatus may be configured for unassisted operation and uses sensors and feedback loops to detect physical characteristics of the system to identify and maintain optimum process parameters.
    Type: Application
    Filed: August 1, 2014
    Publication date: November 20, 2014
    Inventors: Michael J. Renn, Bruce H. King, Jason A. Paulsen
  • Publication number: 20140191841
    Abstract: A corrosion-resistant apparatus may contain an electronic component having a first metal and a polymer coating covering the electronic component. The polymer coating includes polymer chains with unsaturated groups to scavenge sulfur and an anionic initiator dispersed in the polymer coating to convert cyclic elemental sulfur to linear polysulfide.
    Type: Application
    Filed: January 4, 2013
    Publication date: July 10, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Dylan J. Boday, Joseph Kuczynski, Jason T. Wertz, Jing Zhang
  • Patent number: 8628695
    Abstract: The invention relates to a surface-modified RuO2 conductive and a lead-free powdered glass material formulated to make a paste suitable for application to the manufacture of a thick film resistor material. The resistance range that is most suitable to this invention is a resistor having 10 kilo-ohms to 10 mega-ohms per square of sheet resistance. The resulting resistors have ±100 ppm/° C. TCRs.
    Type: Grant
    Filed: April 16, 2009
    Date of Patent: January 14, 2014
    Assignee: E I du Pont de Nemours and Company
    Inventors: Kenneth Warren Hang, Marc H. Labranche, Barry Edward Taylor, Paul Douglas Vernooy
  • Publication number: 20140000955
    Abstract: A corrosion-resistant apparatus may contain an electronic component having a metal covered by a conformal coating. The conformal coating may contain polymer chains with unsaturated groups capable of scavenging a corrosive agent. The conformal coating may contain an accelerator or activator so that the unsaturated groups more readily scavenge the corrosive agent. In an embodiment, the conformal coating is a silicone coating with unsaturated pendant groups which scavenge a sulfur containing agent.
    Type: Application
    Filed: June 28, 2012
    Publication date: January 2, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Dylan J. Boday, Joseph Kuczynski, Jason T. Wertz, Jing Zhang
  • Publication number: 20130344342
    Abstract: A method of manufacturing a resistor paste comprising steps of: (a) preparing a basic resistor paste comprising, (i) a conductive powder, (ii) a first glass frit, and (iii) a first organic medium; and (b) preparing a glass paste as a TCR driver comprising, (iv) a second glass frit comprising manganese oxide, and (v) a second organic medium, (c) adding the glass paste to the basic resistor paste to obtain a resistor paste with a desired TCR.
    Type: Application
    Filed: June 20, 2012
    Publication date: December 26, 2013
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventor: YUKO OGATA
  • Publication number: 20120164314
    Abstract: Thick film resistor paste compositions, and methods for making the thick film compositions are disclosed. The compositions include a resistor composition dispersed in an organic vehicle. The resistor composition has 3 to 60% by weight RuO2 conductive material, 5 to 75% by weight Ag conductive material, 15 to 60% by weight glass frit and optionally up to 10% by weight copper oxide or precursor thereof, and up to 20% by weight bismuth oxide or precursor thereof. The resistor composition when printed to a dry thickness and fired at a temperature between 750° C. and 950° C. achieves a sheet resistivity between 10 and 10,000 milliohms/square and a hot temperature coefficient of resistivity of 1000 ppm/C or higher. The fired resistor composition may achieve a resistance thickness ratio (Rtr) value between 0.75 and 1.50.
    Type: Application
    Filed: November 9, 2011
    Publication date: June 28, 2012
    Applicant: E.I. DU PONT DE NEMOURS AND COMPANY
    Inventors: Marc H. LaBranche, Kenneth Warren Hang
  • Publication number: 20120025380
    Abstract: There is provided a manganese oxide film forming method capable of forming a manganese oxide film having high adhesivity to Cu. In the manganese oxide film forming method, a manganese oxide film is formed on an oxide by supplying a manganese-containing gas onto the oxide. A film forming temperature for forming the manganese oxide film is set to be equal to or higher than about 100° C. and lower than about 400° C.
    Type: Application
    Filed: October 6, 2011
    Publication date: February 2, 2012
    Applicants: TOHOKU UNIVERSITY, TOKYO ELECTRON LIMITED
    Inventors: Koji Neishi, Junichi Koike, Kenji Matsumoto
  • Patent number: 8048474
    Abstract: A method of making a nonvolatile memory cell includes forming a steering element and forming a carbon resistivity switching material storage element by coating a carbon containing colloid.
    Type: Grant
    Filed: August 7, 2008
    Date of Patent: November 1, 2011
    Assignee: SanDisk 3D LLC
    Inventors: Tanmay Kumar, Er-Xuan Ping, Alper Ilkbahar
  • Patent number: 8039043
    Abstract: The invention provides a method of forming a resistance film with even thickness and at high speed even in a substrate having micro depressions and projections in its surface. A fine particle dispersion solution is prepared by adding a solution which decreases the absolute value of a ? potential at the fine particles and a solution which decreases dispersion stability of the fine particles into a solution in which metal oxide fine particles are stably dispersed, a substrate having an insulating surface is immersed in the fine particle dispersion solution to deposit a fine particle aggregation film, and then a resistance film is obtained by performing heat treatment.
    Type: Grant
    Filed: April 30, 2007
    Date of Patent: October 18, 2011
    Assignee: Canon Kabushiki Kaisha
    Inventor: Yoshio Suzuki
  • Publication number: 20110200742
    Abstract: A drying method in which a substrate on which a coating liquid such as a resist liquid containing a volatile solvent is applied is dried under a reduced pressure in an airtight container, and an inert gas is then supplied in the container, so that flows do not concentrate and accumulate in the center portion includes placing the substrate in the container, reducing pressure in the container by exhausting air through an exhaust channel using an exhaust mechanism and volatizing the solvent, and returning the container to atmospheric pressure by supplying an inert gas through a supply channel using a supply mechanism after the reducing step. The supply mechanism includes long purge nozzles ejecting the gas inside the container and spaced from and parallel to two opposed substrate edges. The returning step is performed by the nozzles ejecting the gas toward inside walls of the container opposite to the substrate.
    Type: Application
    Filed: August 17, 2009
    Publication date: August 18, 2011
    Applicant: SHARP KABUSHIKI KAISHA
    Inventor: Masataka Ikeda
  • Patent number: 7968010
    Abstract: One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.
    Type: Grant
    Filed: February 10, 2010
    Date of Patent: June 28, 2011
    Assignee: Shocking Technologies, Inc.
    Inventors: Lex Kosowsky, Robert Fleming
  • Publication number: 20110109998
    Abstract: In one embodiment, a read sensor for a recording head for a magnetic media storage system, has first and second shields, and a magneto-resistive sensor disposed between and shielded by the first and second shields in which the sensing axis of the sensor is tilted with respect to the recording surface of the head. In one embodiment, the sensing axis is oriented at an angle between 10 and 60 degrees with respect to the normal of the recording surface. Other embodiments are described and claimed.
    Type: Application
    Filed: November 6, 2009
    Publication date: May 12, 2011
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: David Berman, Robert G. Biskeborn, Michel Despont, Philipp Herget, Wayne Isami Imaino, Pierre-Olivier Jubert, Peter V. Koeppe, Chandrasekhar Narayan
  • Publication number: 20110102127
    Abstract: The invention relates to a film resistor (1) comprising a carbon-containing material (3) into which clusters (4) of conductive cluster material are introduced, wherein the conductive cluster material has a positive temperature coefficient. The clusters (4) are surrounded by a graphite casing and embedded in the carbon-containing material (3). Furthermore, the cluster material is present in a thermodynamically stable phase.
    Type: Application
    Filed: April 6, 2009
    Publication date: May 5, 2011
    Inventors: Günther Schultes, Dirk Göttel, Ralf Koppert, Olivia Freitag-Weber, Ulf Werner, Wolfgang Brode
  • Publication number: 20100237981
    Abstract: There are provided a process for manufacturing a PTC device as well as a PTC device manufactured by such process wherein a resin coating for preventing the oxidation can be easily formed. The PTC device includes (A) a polymer PTC component (14) comprising: (a1) an electrically conductive filler, and (a2) a polymer material wherein the polymer PTC component is defined by opposite main surfaces and a side surface connecting outer peripheries of these main surfaces, and (B) layered metal electrodes (12, 22) placed on the main surfaces on both sides of the polymer PTC component. The PTC device has a support member (20) extending outward from a periphery of at least one of the main surfaces, and the side surface of the polymer PTC component is sealed from an ambient environment around the PTC device by a cured curable resin (24) disposed and supported on the support member.
    Type: Application
    Filed: August 8, 2008
    Publication date: September 23, 2010
    Inventor: Hiroyuki Koyama
  • Publication number: 20100233360
    Abstract: A method of transferring an electronic material and a method of manufacturing an electronic device using the method of transferring the electronic material. The method of transferring the electronic material includes dipping a template, on which an electronic material layer is formed, into a liquid medium, separating the electronic material layer from the template, and floating the electronic material layer on a surface of the liquid medium; raising up the electronic material layer floated on the surface of the liquid medium by using a target substrate and transferring the electronic material layer on the target substrate; and fixing the electronic material layer to the target substrate.
    Type: Application
    Filed: February 4, 2010
    Publication date: September 16, 2010
    Applicant: Korea University Research and Business Foundation
    Inventors: Cheol Jin LEE, Sun Kug KIM
  • Publication number: 20100187105
    Abstract: A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.
    Type: Application
    Filed: September 9, 2009
    Publication date: July 29, 2010
    Applicant: California Institute of Technology
    Inventors: Marc A. Unger, Hou-Pu Chou, Todd A. Thorsen, Axel Scherer, Stephen R. Quake
  • Publication number: 20100136313
    Abstract: A process for forming metallic nitride film by atomic layer deposition (ALD), which comprises steps for feeding into a reaction space vapor phase alternated pulses of metal source material and silicon source material in a plurality of cycles, and feeding into the reaction space vapor phase pulses of nitrogen source material. wherein a nitrogen source pulse is fed intermittently in selected cycles such that a ratio of nitrogen source pulses to silicon source pulses is less than 1:1 and a ratio of nitrogen source pulses to metal source pulses is less than 1:1, the ratio selected to produce the thin film with a resistivity between 1,000 ??cm and 15,000 ??cm.
    Type: Application
    Filed: December 1, 2008
    Publication date: June 3, 2010
    Applicant: ASM JAPAN K.K.
    Inventors: Akira Shimizu, Akiko Kobayashi, Suvi Haukka
  • Publication number: 20100039211
    Abstract: A resistive component suitable for detecting electric current in a circuit and a method of manufacturing the resistive component are provided. The resistive component includes a carrier, a resistive layer, an electrode unit, an upper oxide layer and a protective layer. The resistive layer comprises copper alloy and is disposed on the carrier. The electrode unit is electrically connected to the resistive layer. The upper oxide layer is disposed on a part of a surface of the resistive layer and includes oxides of the resistive layer. The protective layer covers at least a part of the upper oxide layer.
    Type: Application
    Filed: June 11, 2009
    Publication date: February 18, 2010
    Inventors: Chung-Hsiung Wang, Hideo Ikuta, Wu-Liang Chu, Yen-Ting Lin, Chih-Sheng Kuo, Wen-Hsiung Liao
  • Publication number: 20090311418
    Abstract: Electrical separators for batteries, especially lithium batteries, having a shutdown mechanism. A process for their production. An electrical separator is used in batteries and other systems in which electrodes have to be separated from each other while maintaining ion conductivity. Safety is very important in lithium batteries, since in contrast to other types of battery (Pb, NiCd, NiMeH) the solvent for the electrolyte is not water but a combustible solvent. A separator for lithium cells must possess a shutdown mechanism while not being able to melt down. This is achieved by an electrical separator having a shutdown layer which comprises particles which melt at a desired temperature, close the pores of the separator, and so stop ion flow. Since the separator also comprises a porous inorganic (ceramic) layer on a carrier, the cells cannot melt down as a result of a completely melted separator.
    Type: Application
    Filed: August 24, 2009
    Publication date: December 17, 2009
    Applicant: EVONIK DEGUSSA GmbH
    Inventors: Volker HENNIGE, Christian HYING, Gerhard HÖRPEL
  • Patent number: 7632537
    Abstract: A process is disclosed for manufacturing a thick-film circuit such as a hybrid circuit on a titanium or titanium-alloy substrate. The process includes firing a glassy dielectric layer upon at least one surface of the substrate. A thick-film circuit including a titanium or titanium-alloy substrate is also disclosed.
    Type: Grant
    Filed: October 29, 2003
    Date of Patent: December 15, 2009
    Assignee: Hybird Electronics Australia Pty Ltd.
    Inventor: Walter Henry Berryman
  • Patent number: 7575778
    Abstract: The present invention teaches formulations, apparatus and a method of applying high thixotropic index polymer thick-film resistive pastes for making polymer thick-film resistors with improved tolerances by providing a squeegee with a blade tilted at an angle of 10° to 85° to the surface of the printed circuit board thus causing a fluid rotational motion within the bead of the polymer thick-film resistive paste as the squeegee blade moves relative to the printed circuit board. This rotational motion increases the shear strain rate experienced by the paste within the bead and results in a more effective filling of the resistor-shaped cavity without including air bubbles, experiencing elastic recovery of the paste and, without surface fractures of the paste.
    Type: Grant
    Filed: August 7, 2004
    Date of Patent: August 18, 2009
    Assignee: Embed Technology Co., Ltd.
    Inventors: Te-Yeu Su, Hsin-Herng Wang, Ying-Ti Chu, Chin-Ming Chu, Li-Chung Ping
  • Patent number: 7553512
    Abstract: Precursor compositions for the fabrication of electronic features such as resistors and capacitors. The precursor compositions are formulated to have a low conversion temperature, such as not greater than about 350° C., thereby enabling the fabrication of such electronic features on a variety of substrates, including organic substrates such as polymer substrates.
    Type: Grant
    Filed: November 1, 2002
    Date of Patent: June 30, 2009
    Assignee: Cabot Corporation
    Inventors: Toivo T. Kodas, Mark J. Hampden-Smith, Karel Vanheusden, Hugh Denham, Aaron D. Stump, Allen B. Schult, Paolina Atanassova, Klaus Kunze
  • Patent number: 7524528
    Abstract: Precursor compositions for the deposition of electronic features such as resistors and dielectric components and methods for the deposition of the precursor compositions. The precursor compositions have a low viscosity, such as not greater than about 1000 centipoise and can be deposited using a direct-write tool. The precursors also have a low conversion temperature, enabling the formation of electronic features on a wide variety of substrates, including low temperature substrates.
    Type: Grant
    Filed: October 4, 2002
    Date of Patent: April 28, 2009
    Assignee: Cabot Corporation
    Inventors: Toivo T. Kodas, Mark J. Hampden-Smith, Karel Vanheusden, Hugh Denham, Aaron D. Stump, Allen B. Schult, Paolina Atanassova, Klaus Kunze
  • Patent number: 7485345
    Abstract: Apparatuses and processes for maskless deposition of electronic and biological materials. The process is capable of direct deposition of features with linewidths varying from the micron range up to a fraction of a millimeter, and may be used to deposit features on substrates with damage thresholds near 100° C. Deposition and subsequent processing may be carried out under ambient conditions, eliminating the need for a vacuum atmosphere. The process may also be performed in an inert gas environment. Deposition of and subsequent laser post processing produces linewidths as low as 1 micron, with sub-micron edge definition. The apparatus nozzle has a large working distance—the orifice to substrate distance may be several millimeters—and direct write onto non-planar surfaces is possible.
    Type: Grant
    Filed: December 22, 2005
    Date of Patent: February 3, 2009
    Assignee: Optomec Design Company
    Inventors: Michael J. Renn, Bruce H. King, Marcelino Essien, Gregory J. Marquez, Manampathy G. Giridharan, Jyh-Cherng Sheu
  • Publication number: 20080136579
    Abstract: A thin film composition is made from silicon, an insulator such as alumina or silicon dioxide, and at least one additional material such as chromium, nickel, boron and/or carbon. These materials are combined to provide a thin film having a ? of at least 0.02 ?-cm (typically 0.02-1.0 ?-cm), and a TCR of less than ±1000 ppm/° C. (typically less than ±300 ppm/° C.). A sheet resistance of at least 20 k?/? may also be obtained. The resulting thin film is preferably at least 200 ? thick, to reduce surface scattering conduction currents.
    Type: Application
    Filed: December 8, 2006
    Publication date: June 12, 2008
    Inventors: Michael Lee, Steven Wright, Philip Judge, Craig Wilson, Gregory Cestra, Derek Bowers
  • Publication number: 20080118633
    Abstract: The invention relates generally to methods for creating circuitry components from binder materials having a hydrophobic phenolic component and a hydrophobic epoxy component. The phenolic/epoxy based liquids, solutions, suspensions and/or pastes can generally be screen printed or otherwise formed on an electronic substrate, pattern or device, to provide an electronic component having low water sorption properties.
    Type: Application
    Filed: November 5, 2007
    Publication date: May 22, 2008
    Inventors: Cheng-Chung Chen, Thomas Eugene Dueber, Shane Fang, John D. Summers
  • Patent number: 7300683
    Abstract: The invention provides a method of forming a resistance film with even thickness and at high speed even in a substrate having micro depressions and projections in its surface. A fine particle dispersion solution is prepared by adding a solution which decreases the absolute value of a ? potential at the fine particles and a solution which decreases dispersion stability of the fine particles into a solution in which metal oxide fine particles are stably dispersed, a substrate having an insulating surface is immersed in the fine particle dispersion solution to deposit a fine particle aggregation film, and then a resistance film is obtained by performing heat treatment.
    Type: Grant
    Filed: December 20, 2004
    Date of Patent: November 27, 2007
    Assignee: Canon Kabushiki Kaisha
    Inventor: Yoshio Suzuki
  • Patent number: 7270844
    Abstract: Methods and apparatus for the deposition of a source material (10) are disclosed. An atomizer (12) renders a supply of source material (10) into many discrete particles. A force applicator (14) propels the particles in continuous, parallel streams of discrete particles. A collimator (16) controls the direction of flight of the particles in the stream prior to their deposition on a substrate (18). In an alternative embodiment of the invention, the viscosity of the particles may be controlled to enable complex depositions of non-conformal or three-dimensional surfaces. The invention also includes a wide variety of substrate treatments which may occur before, during or after deposition. In yet another embodiment of the invention, a virtual or cascade impactor may be employed to remove selected particles from the deposition stream.
    Type: Grant
    Filed: September 20, 2004
    Date of Patent: September 18, 2007
    Assignee: Optomec Design Company
    Inventor: Michael J. Renn
  • Patent number: 7214295
    Abstract: The present invention discloses a method of manufacturing a thin film resistor with a moisture barrier by depositing a metal film layer on a substrate and depositing a layer of tantalum pentoxide film overlaying the metal film layer. The present invention also includes a thin film resistor having a substrate; a metal film layer attached to the substrate; and a tantalum pentoxide layer overlaying the metal film layer, the tantalum pentoxide layer providing a barrier to moisture, the tantalum pentoxide layer not overlaid by an oxidation process.
    Type: Grant
    Filed: April 9, 2001
    Date of Patent: May 8, 2007
    Assignee: Vishay Dale Electronics, Inc.
    Inventor: Stephen C. Vincent
  • Patent number: 7011890
    Abstract: A method for depositing a low dielectric constant film is provided. The low dielectric constant film includes alternating sublayers, which include at least one carbon-doped silicon oxide sublayer. The sublayers are deposited by a plasma process than includes pulses of RF power. The alternating sublayers are deposited from two or more compounds that include at least one organosilicon compound. The two or more compounds and processing conditions are selected such that adjacent sublayers have different and improved mechanical properties.
    Type: Grant
    Filed: March 3, 2003
    Date of Patent: March 14, 2006
    Assignee: Applied Materials Inc.
    Inventors: Son Van Nguyen, Yi Zheng
  • Patent number: 6994757
    Abstract: Electrically resistive material including platinum and from about 5 and about 70 molar percent of iridium, ruthenium or mixtures thereof, calculated based on platinum as 100%, are disclosed.
    Type: Grant
    Filed: June 21, 2004
    Date of Patent: February 7, 2006
    Assignee: Shipley Company, L.L.C.
    Inventors: Craig S. Allen, John Schemenaur, David D. Senk, Marc Langlois, Xiaodong Hu, Jan Tzyy-Jiuan Hwang, Jud Ready, Trifon Tomov
  • Patent number: 6936192
    Abstract: A resistive paste is made by a mixture of a conductive metal powder which is made by mixing 85 to 94 percent by weight of copper powder, 5 to 10 percent by weight of manganese powder, and 1 to 5 percent by weight of tin powder; a mixture of 3 to 7 percent by weight of glass powder and 3 to 7 percent by weight of copper-oxide powder relative to the entire amount of said conductive metal powder; and 7 to 15 percent by weight of vehicle relative to the entire amount of the conductive metal powder and the mixture. The resistive paste is then sintered, and the resistive composition having the low resistance value and low TCR may be obtained. In addition, a resistor is made by forming the resistive element upon a substrate.
    Type: Grant
    Filed: September 17, 2003
    Date of Patent: August 30, 2005
    Assignee: Koa Kabushiki Kaisha
    Inventor: Kouichi Urano
  • Patent number: 6846370
    Abstract: Electrically resistive material including platinum and from about 5 and about 70 molar percent or iridium, ruthenium or mixtures thereof, calculated based on platinum as 100%, are disclosed.
    Type: Grant
    Filed: July 3, 2002
    Date of Patent: January 25, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Craig S. Allen, John Schemenaur, David D. Senk, Marc Langlois, Xiaodong Hu, Jan Tzyy-Jiuan Hwang, Jud Ready, Trifon Tomov
  • Patent number: 6835412
    Abstract: A metallized substrate, such as used to make a resonant circuit tag with inductive and capacitive elements in series, has a thin inorganic or polymeric dielectric layer formed on a metal layer. The inorganic layer may be formed by anodizing a surface of the metal layer. The organic layer may be formed by flexographic printing. In both cases, a via hole is formed through the dielectric layer. A second layer of very thin conductive metal is deposited on the dielectric layer and in the via hole. The substrate is subsequently patterned with an etch resist and then etched to form the inductor coil and the capacitor plates, which are interconnected via the metallized via hole.
    Type: Grant
    Filed: May 2, 2002
    Date of Patent: December 28, 2004
    Assignee: Micrometal Technologies, Inc.
    Inventor: Thomas F. Burke
  • Patent number: 6824814
    Abstract: A method of forming a perovskite thin film includes preparing a perovskite precursor solution; preparing a silicon substrate for deposition of a perovskite thin film, including forming a bottom electrode on the substrate; securing the substrate in a spin-coating apparatus and spinning the substrate at a predetermined spin rate; injecting a perovskite precursor solution into the spin-coating apparatus thereby coating the substrate with the perovskite precursor solution to form a coated substrate; baking the coated substrate at temperatures which increase incrementally from about 90° C. to 300° C.; and annealing the coated substrate at a temperature of between about 500° C. to 800° C. for between five minutes to fifteen minutes.
    Type: Grant
    Filed: May 21, 2002
    Date of Patent: November 30, 2004
    Assignee: Sharp Laboratories of America, Inc.
    Inventors: Wei-Wei Zhuang, Sheng Teng Hsu, Wei Pan, Masayuki Tajiri
  • Patent number: 6787182
    Abstract: A method for producing a resistor. The method includes a process for printing, in a prescribed pattern, a mixed solution containing a good solvent having solubility to a binder good solvent, a thermosetting binder resin, and a conductive filler. The method further includes a process for driving the mixed solution: and a process for curing the binder resin by baking. The good solvent is at least one selected from dipropylene glycol monomethyl ether, diethylene glycol monomethyl ether, and dipropylene glycol monoethyl ether. The poor solvent is at least one selected from terpineol eat 2-phenoxy ethanol and 2-benzyloxy ethanol.
    Type: Grant
    Filed: April 11, 2003
    Date of Patent: September 7, 2004
    Assignee: Alps Electrics, Co., Ltd.
    Inventors: Yoshihiro Taguchi, Shunetsu Satou
  • Patent number: 6749891
    Abstract: A precipitate film having plating resistance may be formed on the surface of a varistor element during sintering process. Accordingly, the manufacturing process can be shortened, thereby improving the productivity. The manufacturing method comprises (a) a first process of forming the varistor element whose main component is zinc oxide; (b) a second process of sintering the varistor element and precipitating zinc compound having at least one of acid resistance and alkali resistance on the surface of the varistor. Preferably, the manufacturing method further comprises (c) a process of attaching an external electrode to the varistor element, and the external electrode attaching process is executed after finishing the varistor element sintering process.
    Type: Grant
    Filed: July 18, 2002
    Date of Patent: June 15, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kaori Shiraishi, Tatsuya Inoue, Riho Sasaki, Keiichi Noi, Hideaki Tokunaga
  • Patent number: 6725514
    Abstract: A method of making a low-cost metal diaphragm sensor that integrates both pressure and temperature sensing in a single sensor assembly utilizes thick-film processing to form a circuit including stress and temperature sensitive elements on the outboard or exposed surface of a thin metal diaphragm separating the circuit from a pressurized fluid. Only a thin layer of dielectric separates the stress and temperature sensitive elements from the diaphragm surface. The stress sensitive elements respond to mechanical stressing of the diaphragm due to the presence of the pressurized fluid, while the temperature sensitive element responds to the temperature of the pressurized fluid. The thermal capacity of the fluid greatly exceeds that of the diaphragm, so that the temperature responsive characteristic of the temperature sensitive element accurately reflects the temperature of the pressurized fluid.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: April 27, 2004
    Assignee: Delphi Technologies, Inc.
    Inventors: James I. Moyer, Joseph M. Ratell
  • Patent number: 6704997
    Abstract: Organic thermistor devices are produced by a first step of molding an organic thermistor material by covering a plurality of electrically conductive members to form a conductor-containing member, which is elongated in a longitudinal direction, has a pair of mutually oppositely facing side surfaces, having the conductive plates buried parallel to one another inside the organic thermistor material, each mutually adjacent pair of these conductive members being externally exposed on different ones of the side surfaces, a second step of forming a pair of electrodes elongated in the longitudinal direction on the side surfaces of the conductor-containing member, and a third step of thereafter cutting this conductor-containing member transversely at specified positions so as to divide into individual units.
    Type: Grant
    Filed: April 27, 2000
    Date of Patent: March 16, 2004
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shinichi Osada, Tomozo Yamanouchi, Yuichi Takaoka, Takashi Shikama
  • Patent number: 6673390
    Abstract: A method for manufacturing a touch screen linearization pattern which is necessary for a five wire resistive type or current sensing type touch screen, and directly affects the accuracy, production price, and border area size of the touch screen, includes the steps of printing a linearization pattern on the border area of a conductive glass surface with a selected ink. The ink is made by blending highly conductive silver powder between about 59% to 62% in weight and carbon powder between about 14% to 16% in a contact agent solvent between about 24% to 25% in weight. The touch screen thus formed has a resistance value ratio of about ten between the square surface of the glass layer and the two ends of the linearization pattern.
    Type: Grant
    Filed: March 23, 2001
    Date of Patent: January 6, 2004
    Assignee: Eturbotouch Technology Inc.
    Inventor: Chi-Ruey Chen
  • Patent number: 6663914
    Abstract: A method for adhering a resistive coating to a substrate for use in process fluids employed in the semiconductor processing industry in clean, particle-free, nonreactive, non-trapping, ultra-pure, thermally tolerant, sealed systems. In one arrangement, the method may include the steps of selecting a substrate having a wall, modifying a surface of the wall to provide a roughened texture suitable for mechanically securing a coating thereto, and applying a conductive coating that is configured to be electrically resistive, to extend over at least a portion of the roughened texture, and to adhere thereto throughout variations in operational temperatures thereof.
    Type: Grant
    Filed: December 15, 2000
    Date of Patent: December 16, 2003
    Assignee: Trebor International
    Inventor: Steven A. Black
  • Patent number: 6638378
    Abstract: A passive electrical article comprising (a) a first self-supporting substrate having two opposing major surfaces, (b) a second self-supporting substrate having two opposing major surfaces, and (c) an electrically insulating or electrically conducting layer comprising a polymer and having a thickness ranging from about 0.5 to about 10 &mgr;m between the first and second substrate, wherein a major surface of the first substrate in contact with the layer and a major surface of the second substrate in contact with the layer have an average surface roughness ranging from about 10 to about 300 nm and wherein a force required to separate the first and second substrates of the passive electrical article at a 90 degree peel angle is greater than about 3 pounds/inch (about 0.
    Type: Grant
    Filed: July 3, 2001
    Date of Patent: October 28, 2003
    Assignee: 3M Innovative Properties Company
    Inventors: Nelson B. O'Bryan, Robert R. Kieschke, Joel S. Peiffer
  • Patent number: 6622374
    Abstract: A method of manufacturing a resistor foil, comprised of a copper layer having a first side and a second side. A tiecoat metal layer having a thickness of between 5 Å and 70 Å is disposed on the first side of the copper layer. A first layer of a first resistor metal having a thickness of between 100 Å and 500 Å is disposed on the tiecoat metal layer, and a second layer of a second resistor metal having a thickness of between 100 Å and 500 Å is disposed on the first layer of the first resistor metal. The first resistor metal has a resistance different from the second resistor metal.
    Type: Grant
    Filed: September 22, 2000
    Date of Patent: September 23, 2003
    Assignee: Gould Electronics Inc.
    Inventors: Jiangtao Wang, Michael A. Centanni, Sidney J. Clouser