Abstract: An electrical device (1) in which an element (7) composed of a conductive polymer is positioned in contact with the surface layer of one or more metal electrodes (3,5). The metal electrode contains a base layer (9) which comprises a first metal, an intermediate metal layer (15) which comprises a metal that is different from the first metal, and a surface layer (17) which (i) comprises a second metal, (ii) has a center line average roughness R.sub.a of at least 1.3, and (iii) has a reflection density R.sub.d of at least 0.60. The conductive polymer composition preferably exhibits PTC behavior. The electrical devices, which may be, for example, circuit protection devices or heaters, have improved thermal and electrical performance over devices prepared with electrodes which do not meet the center line average roughness and reflection density requirements.

Abstract: The electronic component of the present invention includes: an element having an internal electrode therein; an external electrode formed on an end portion of the element where an end face of the internal electrode is exposed; and a protection layer formed on the entire surface of the element except for the end portion of the element, wherein the protection layer is made of a metal oxide.

Abstract: A method for use in making multilayered varistors including the steps of forming a plurality of interleaved layers of ceramic material and conductive material, confining the conductive material to spaced areas arranged in rows and columns, displacing the spaced areas of adjacent layers of conductive material from each other, and cutting perpendicularly through the layers. The layers are formed by screen printing.

Abstract: A chip resistor comprising an insulated substrate, a pair of top electrodes disposed on top of said insulated substrate, a resistor film bridging said pair of top electrodes, a protective film coating said resistor film, and an end electrode and a plated electrode film which are formed on each of said pair of top electrodes, wherein each of said top electrodes includes:a first electrode section connected to said resistor film; anda second electrode section not in direct contact with said resistor film and arranged in connection to and along said first electrode section so as to extend in parallel with a portion of said first electrode section between said resistor film and said end electrode, said second electrode section having a sheet resistivity lower than that of said first electrode section.

Abstract: The present invention provides a new and improved thick film paste for use as an acid resistant overglaze. In one preferred embodiment such paste includes a glass composition comprising in weight percent from about 30% to about 60% PbO, from about 5% to about 20% ZnO, from about 2% to about 20% B.sub.2 O.sub.3, from about 4% to about 12% Al.sub.2 O.sub.3, from about 5% to about 18% SiO.sub.2, up to about 8% ZrO.sub.2, up to about 8% TiO.sub.2 and from about 9% to about 21% Nb.sub.2 O.sub.5.

Abstract: Air pollution gas sensor which efficiently detects smell from smoking, ordinary stinks such as TMA and CH3SH, smell of Kimchi, acetaldehyde, and etc. and also a method for fabricating the same is revealed and described including a substrate, a heater formed on said substrate, electrodes each formed on said substrate insulated from the heater, and a sensing layer formed of SnO.sub.2, including WO.sub.3 on said substrate including said electrodes, with the method for fabricating the gas sensor including the steps of forming the heater on the substrate, forming the electrodes on the substrate insulated from the heater, and forming a sensing layer of SnO.sub.2 including WO.sub.3 on the substrate including the electrodes.

Abstract: An oxidation protection coating for metal substrate surfaces. The coating, according to a preferred embodiment, comprises an initial or first layer of a glass-ceramic, such as a barium aluminosilicate composed chiefly of baria, silica and alumina; or mullite, composed of silica-alumina or, alternatively, baria-silica. Titanium dioxide, nickel oxide or SnO.sub.2 can be added. The next layer of the coating is comprised of alumina or silicon carbide. The third or final layer is comprised of a thin layer of silica or a high-silica material, e.g., a silica containing 4% B.sub.2 O.sub.3. For a thicker third layer, particles of a dark solid, such as boron silicide, ferrous oxide, ferric oxide, nickel oxide, manganese dioxide, carbon or silicon carbide, can be incorporated. The three-layer coating provides high emittance and low catalytic activity for the recombination of oxygen and nitrogen, as well as being a hydrogen diffusion barrier.

Abstract: Planarization of geometrically difficult semiconductor device surfaces is accomplished utilizing a coating technique in which on an object with a flat surface is used to planarize the coating material. In particular, device processing is accomplished by including a step that produces a planar surface by coating a nonplanar surface with a material that has a viscosity of less than 1000 cp. An object with a flat surface is placed into contact with the material in such a manner that the material is planarized to a desired degree. The material is cured while in contact with the object's flat surface. The object is then separated from the material. The planarity of the planarizing material is then transferred into the underlying layer using conventional techniques.

Abstract: An electrical device comprising a resistive element having a first electrode in electrical contact with the top surface of the resistive element and a second electrode in electrical contact with the bottom surface of the resistive element. An insulating layer is formed on the first and second electrodes. A portion of the insulating layer is removed from the first and second electrodes to form first and second contact points. A conductive layer is formed on the insulating layer and makes electrical contact with the first and second electrodes at the contact points. The conductive layer has portions removed to form first and second end terminations separated by electrically non-conductive gaps. The wrap-around configuration of the device allows for an electrical connection to be made to both electrodes from the same side of the electrical device.

Abstract: A resistor of SMD (Surface Mounted Device) construction includes a film of a resistive alloy as a resistive track on two electrically separated carrier plate elements of copper, which are constructed as contact elements solderable to the terminals of a printed circuit board to thereby ensure good heat dissipation into a printed circuit board. In order to manufacture such resistors, a resistive film sufficient for a plurality of individual resistors is adhered to but electrically isolated from a large copper plate and the laminate formed thereby is split into the individual resistors after producing the individual resistive tracks and their electrical connections to the copper plate and after producing gaps between the plate elements for each track.

Abstract: A process for making an infra-red detector array wherein an array of m * n first electrodes is formed on a substrate and a layer of plastic material having a polarization sensitive to infra-red radiation is deposited over the electrodes. The layer is partitioned into individual films each over an associated first electrode and second electrodes are positioned on the films on the side opposite to the associated first electrodes.

Abstract: A method of providing a semiconductor device with an inorganic electrically insulative layer, the device having exposed semiconductor surfaces and electrically conductive metal end terminations, in which the device is reacted with phosphoric acid to form a phosphate on the exposed surfaces of the semiconductor but not on the metal end terminations, and in which the device is thereafter barrel plated in a conventional electrical barrel plating process and the plating is provided only on the end terminations because the phosphate is not electrically conductive.

Abstract: A heater array for an ink jet printhead includes an insulating substrate, which can be a layer of ceramic, flexible plastic, insulated flexible metal, polysilicon, or single crystalline silicon. A first material layer is deposited atop the insulating substrate and patterned in parallel stripes. A first insulating layer is deposited atop the first material layer and patterned with contact windows above the first material layer in corresponding desired heating locations, usually in a symmetrical grid. A second material layer is deposited atop the first insulating layer and pattern in parallel stripes orthogonal to those in the first material layer. The first and second material layers are in physical and electrical contact with each other through the contact windows in the first insulating layer to form a resistive diode junction at each desired heating location. The entire surface of the heating array is covered with a second insulating layer, with contacts provided to the first and second material layers.

Abstract: An oxygen concentration detector includes a one-end closed cylindrical oxygen sensing element having an inside electrode, outside electrode provided on the inner side and outer side respectively, an electrode protecting layer made up of ceramics porous member provided further outside the outside electrode, and a trap layer 1 of ceramics porous member having a surface roughness of 20 to 100 .mu.m measured according to a 10 point mean roughness measurement and provided outside the electrode protecting layer is employed. By dipping the to-be-detected gas side surface of an oxygen sensing element into a slurry with coarse heat-resisting metal oxide particles, 2 to 50 .mu.m in average grain size, dispersed, depositing the slurry on the surface of a protective layer of an oxygen sensor element, thereafter drying and baking the deposit, a porous poisonous substance trap layer, 10 to 500 .mu.m thick, is formed.

Abstract: A method is provided for easily producing thick multi-layer substrates maintaining highly accurate resistances with little variation. A thick-film resistor 6 on a ceramic substrate 1 is fired at a temperature higher than the temperature of firing a glass insulating layer 2 that is formed thereon in contact therewith. This makes it possible to decrease the change in the resistance in a subsequent high-temperature step of firing the glass insulating layers 2 to 4. Moreover, after the glass insulating layer 2 is formed on the thick-film resistor 6 on the ceramic substrate 1, laser trimming is effected through a window or the glass insulating layer 2 and, thereafter, the glass insulating layers 3 and 4 are formed. This makes it possible to decrease the change in the resistance of the thick-film resistor 6 after laser trimming and to reduce the laser output.

Abstract: Electrification is suppressed with a water-soluble electrification-suppressing film having an electron conductivity and comprising a polymer resin. A high electrification-suppressing effect which is also high in vacuum can be easily obtained by using the electrification-suppressing film with less contamination.

Abstract: A hybrid resistance card (R-Card) is manufactured using a two-step process wherein an electrically conductive ink layer and an electrically resistive ink layer are printed onto a surface, which may be either a substrate or the part on which the R-Card is to be used. The conductive ink layer is selectively applied in a pattern of shapes to electrically short out portions of the resistive ink layer, thereby permitting the R-Card to have a predetermined resistive taper across its width according to a desired resistivity curve. The resistive ink layer comprises grid-like lines bordering and separating the conductive shapes. The resistive taper is substantially continuous along the length of the R-Card, at least linearly, though if the card is designed to cover an entire part, it is substantially continuous along a plurality of directions on the card, with the tapers being designed to round into one another.

Abstract: A rapid temperature sensor formed of a metal from the platinum group is provided. The rapid temperature sensor includes a substrate over which a platinum resistive layer is provided. A double layer, forming a passivation layer, is provided over the platinum resistive layer to prevent oxidation. The double layer includes a ceramic layer and a glass layer. The double layer prevents oxygen from reaching the platinum resistive layer even at temperatures up to 1,000.degree. C.

Abstract: A multilayer substrate is constituted by laminating a plurality of sheet substrates, the respective sheet substrates are constituted by forming conductive layers of a refractory metal such as tungsten (W) on ceramic green sheets composed mainly of an alumina ceramic, and the ceramic green sheets are laminated and sintered to constitute the multilayer substrate. Conductive material layers are formed on the surface of the multilayer substrate so as to be selectively connected to the conductive layers, and copper-plated layers are formed on the conductive material layers. Thick film conductor layers are formed on the copper-plated layers, to constitute terminal conductors, and, a thick film resistor layer for example is connected to the terminal conductors.

Abstract: A hybrid resistance card (R-Card) is manufactured using a two-step process wherein an electrically conductive ink layer and an electrically resistive ink layer are printed onto a surface, which may be either a substrate or the part on which the R-Card is to be used. The conductive ink layer is selectively applied in a pattern of shapes to electrically short out portions of the resistive ink layer, thereby permitting the R-Card to have a predetermined resistive taper across its width according to a desired resistivity curve. The resistive ink layer comprises grid-like lines bordering and separating the conductive shapes. The resistive taper is substantially continuous along the length of the R-Card, at least linearly, though if the card is designed to cover an entire part, it is substantially continuous along a plurality of directions on the card, with the tapers being designed to round into one another.

Abstract: A process and a device are proposed for manufacturing sensors, particularly those intended for the determination of pressure forces. In thick-film technology, initially at least one insulating layer (14) is produced on a pressure support (10), whereupon a pressure-sensitive resistance layer (12) and finally conductor paths (13) are applied. In a pressing tool (20-22), the layer arrangement (11-14) is then compressed together with a plastic pressure substance (15). Finally, the pressure support (10) is removed from the pressed article.

Abstract: The present invention provides an improved method for firing thick film inks in hybrid circuits which comprises firing different copper compatible thick film materials in a single firing atmosphere. The method comprises the steps of providing a paste suitable for application to a ceramic substrate, applying the paste to the substrate by a conventional technique such as screen printing, drying the substrate, and firing the substrate at an elevated temperature in an ambient comprising an inert gas and carbon dioxide to form the electrical component. In another embodiment, the substrate is fired in an ambient comprising only carbon dioxide.

Abstract: Soluble conducting polymers from substituted polyanilines and large organic counterions are disclosed and used directly from solution in the manufacture of electronic devices.

Abstract: A printed circuit board includes both high and low resistive value thick film resistors interconnected by a copper film. To lower the contact resistance to the thick film resistors of high value, each is provided at its ends with a termination of a composition similar to that used for the low value resistors. This provides a relatively low resistance contact region which overcomes the difficulty that a copper thick film conductor has in making electrical connections to compositions generally used for making high value thick film resistors. The composition of high and low resistivities are adapted to permit firing of both compositions in a single firing step.

Abstract: A platinum resistance thermometer is formed in a process which includes the defining of a path for the resistance thermometer in an inert material deposited in a layer on the substrate. The substrate surface is exposed in the path, and the inert material forms a negative pattern for the path. The resistive material for the thermometer is then deposited on both the substrate surface exposed in the path and on the surfaces of the inert material remaining on the substrate. After this, the inert material is etched away, and the resistive material deposited on top of the inert material is then loose and can be removed leaving a strip of resistive material in the desired path for forming the resistive thermometer. The strip has low contamination and impurities to more easily reach the desired temperature coefficient of resistance of the strip forming the thermometer.

Abstract: A printing head which comprises an insulating substrate and a plurality of printing electrodes for a resistive ribbon type printing apparatus, in which a ribbon composed of a layer of thermal transferable ink and an electrical resistive layer is supplied with an electric current through selected printing electrodes so that the current passes through a portion of the resistive layer to generate Joule heat and melt a portion of the ink layer, and the molten ink is transferred to a paper. The ceramic substrate is provided with a plurality of U-shaped grooves, and each of the printing electrodes is formed in each of the grooves and has a thickness smaller than the depth of the grooves.

Abstract: This is a structure of, and method for preparation of, molybdenum resistors in a superconductor integrated circuit. It utilizes a pattern superconductor film; applying a titanium film on the patterned superconductor film; and then applying a molybdenum film on the titanium film to provide a titanium-molybdenum, etch-stop interface; applying a patterned resist film on the molybdenum film; etching the exposed molybdenum film to expose a portion of the titanium-molybdenum, etch-stop interface; and oxidizing the exposed titanium-molybdenum, etch-stop interface. The titanium-molybdenum etch stop interface protects the patterned superconductor film and the support (including any other underlayers) and increases processing margins for the etch time.

Abstract: A resistor device includes a thick-film resistor which includes a mixture of electrical conductive material and glass, and which has the electrical conductive material at a surface portion exposed; and electrodes which are deposited on the thick-film resistor to be connected to the exposed electrical conductive material.

Abstract: A thin film resistor and method of making employs tungsten or tungsten titanium alloy as an alectrically conductive diffusion barrier between the nickel chromium resistor and the gold conductor. A solution of cupric sulfate, ammonium hydroxide, glycerol and deionized water is used to remove the unwanted diffusion barrier without damaging the thin film resistor materials, thereby preserving precision resistance values.

Abstract: A method for manufacturing a film resistor for use as a thermal conductivity detector, particularly for gas analyzers. The film resistor is composed of a carrier of insulating material and of a thin resistance layer, preferably composed of platinum, that is applied to the carrier by cathode sputtering in an atmosphere inert gas. The resistant layer and the carrier are cleaned proceeding from the metallized side using an argon sputtering process. The film resistor is then coated with at least one plasma-enhanced CVD layer for the purpose of protection against aggressive gases.

Abstract: A method for producing a high density hybrid integrated circuit substrate capable of forming a very fine pattern of a conductor by means of the chemical plating and at the same time capable of applying the chemical plating, while protecting the resistor formed on the substrate in advance of the chemical plating step, the production method comprising steps of: forming a resistor on an electrically insulating substrate; forming an activating layer for depositing a chemical plating on the electrically insulating substrate in contact with the resistor; forming a stable resin layer, during the chemical plating step, by the photolithography process in a manner to cover the resistor, except for the portion of the activating layer where an electrically conductive layer is to be formed; and forming the electrically conductive layer by the chemical plating on the exposed portion of the activating layer.

Abstract: A patterned crystalline superconducting layer is formed by first providing a copper oxide lift-off layer under an amorphous metal oxide superconducing precursor layer and then photolithographically forming a pattern in the layers. The patterned layers are then heat treated to form the final crystalline superconducting layer.

Abstract: The marginal adhesion of platinum to silicon nitride is a serious issue in the fabrication of microbridge mass air flow sensors. High temperature stabilization anneals (500.degree.-1000.degree. C.) are necessary to develop the properties and stability necessary for effective device operation. However, the annealing process results in a significant reduction in the already poor platinum/silicon nitride adhesion. Annealing at relatively high temperatures leads to the development of numerous structural defects and the production of non-uniform and variable sensor resistance values. The use of a thin metal oxide adhesion Layvr, approximately 20 To 100 angstromw in thickness is very effective in maintaining platinum adhesion to silicon nitride, and through the high temperature anneal sequence.

Abstract: A method of making injection molding nozzles of predetermined desired lengths and capacity which combines the advantages of large scale manufacturing with the flexability of individual assembly. Individual steel components such as a rear portion, an elongated forward portion, and a connector member are manufactured in volume, with the forward portion being made in different predetermined sizes. A forward portion having a particular length and melt bore diameter is then selected, and assembled together with a rear portion and a connector member. If necessary, the melt channel through the rear portion and connector member are enlarged to match the bore of the forward portion. The assembled components are then integrally brazed together to form a nozzle having a particular predetermined length and melt channel diameter.

Abstract: An integral sprue gated injection molding nozzle and method having a melt bore extending centrally therethrough wherein a circular forward end portion of the electrical heating element encircles the melt bore in the nose portion to provide additional heat adjacent the gate. The method includes locating the circular portion of the heating element in a circumferential space between a hub member and a funnel member and integrally brazing them together in a vacuum furnace to form the nose portion of the nozzle. The nose portion is drilled and machined to provide the desired gate and configuration depending upon the particular application.

Abstract: An improved process for fabricating thick film hybrid microcircuits that produces thick film resistors having electrical characteristics consistent with the microcircuit design tolerances, in areas proximate a dielectric build-up. The process includes, establishing by printing and firing a plurality of first conductor traces including the cross-under conductors to a substrate. Next, the resistive elements are printed and fired on the substrate and a dielectric glaze printed and fired over the resistive elements. At least one dielectric layer is then printed and fired over the cross-under conductors. A plurality of second conductor traces are next printed and fired on the substrate, including the cross-over conductors which are printed over the dielectric layer. Finally, a dielectric glaze is printed and fired over the cross-over conductors.

Abstract: This is a structure of, and method for preparation of, molybdenum resistors in a superconductor integrated circuit. It utilizes a pattern superconductor film; applying an aluminum film on the patterned superconductor film; and then applying a molybdenum film on the aluminum film to provide an aluminum-molybdenum, etch-stop interface; applying a patterned resist film on the molybdenum film; etching the exposed molybdenum film to expose a portion of the aluminum-molybdenum, etch-stop interface; and oxidizing the exposed aluminum-molybdenum, etch-stop interface. The aluminum-molybdenum etch stop interface protects the patterned superconductor film and the support (including any other underlayers) and increases processing margins for the etch time.

Abstract: Thick film resistors are fabricated for use in hybrid microcircuits by a sequence of steps beginning with the formation of a dielectric substrate on a carrier substrate. The dielectric layer is then baked to provide an appropriate rigidity after which a resistance element is deposited thereon as well as conductive terminals, the subsequent firing of both materials followed by heating of the entire assembly to a point where the adhesive characteristics of the dielectric layer are substantially reduced and the resultant film resistors become separated from the carrier substrate.

Abstract: A method is described for providing electrically resistive elements for mounting in an electrical resistor device for engagement with a relatively movable contact member, as in a potentiometer. A pair of termination openings are formed through a substrate of insulating material such as plastic film. A release liner is applied to the undersurface of the substrate to cover the openings. An electrically conductive medium is applied in fluid (paste) form to the top surface of the substrate and is caused to fill the termination openings, as by applying pressure. The conductive medium is solidified and the release liner is removed. A resistive medium for ultimate engagement with the movable contact is applied to the top surface of the substrate in engagement with the termination openings. The resistive track is shaped as desired, either linear or an annular segment, preferably as part of final shaping steps which also remove the resistive element from a continuous strip of the substrate material.

Abstract: A thermal head for a printer in accordance with the present invention comprises: a substrate (11); a heater layer (12) on the substrate; lead wires (13a and 13b) formed on the heater layer for supplying electric power to the heater layer; and a single protective layer (20) for protecting the heater layer and the lead wires by covering them, the protective layer including an oxide or a nitride.

Abstract: An orifice plate assembly for use in continuous ink jet printers includes a linear orifice plate having formed therein at least one linear array of orifices extending from a first end region to a second end region. The orifice plate has a main body portion which tapers gradually in thickness (t) along the length of the plate from the first end region to the second end region. The orifice plate is mounted so as to have an effective width (w) which tapers from the first to second end region. The relation t.div.w remains approximately constant along its length dimension.

Abstract: An improved resistive element comprises a film-type resistive layer applied to an insulative substrate and then fired. An array of discrete, spaced apart islands of predominantly conductive material is then applied to the resistive layer in a repetitive pattern having predetermined inter-island spacing. The islands have a conductivity that is substantially greater than the conductivity of the resistive layer. Preferably, the islands are of substantially uniform shape and size. In one preferred embodiment, the islands are formed of a conductive thick film ink that is screen-printed onto a cermet resistive layer through an appropriate mask, and then fired. In another preferred embodiment, the islands are formed of a conductive metal that is applied to the resistive layer by vapor deposition, sputtering, or ion implantation through a suitable mask.

Abstract: A method of manufacturing a resistance thermometer which includes the steps of preparing a support substrate and forming a platinum film, which serves as a temperature measuring element, on the support substrate by a sputtering process employing a sputtering gas which contains a predetermined amount of oxygen gas, and a resistance thermometer produced by the method. The method which optionally includes forming an aluminum oxide film, the substrate and the platinum film.

Abstract: A standard thin film circuit containing Ta.sub.2 N (100 ohms/square) resirs is fabricated by depositing on a dielectric substrate successive layers of Ta.sub.2 N, Ti and Pd, with a gold layer to provide conductors. The addition of a few simple photoprocessing steps to the standeard TFN manufacturing process enables the formation of Ta.sub.2 N+Ti (10 ohms/square) and Ta.sub.2 N+Ti+Pd (1 ohm/square) resistors in the same otherwise standard thin film circuit structure.

Abstract: A process for manufacturing close tolerance thick film resistors on a ceramic dielectric substrate is disclosed. The process includes the steps of printing resistor terminations to the dielectric substrate using a precious conductor material and fixing the resistor terminations by drying and firing in air. A resistive material is next printed to portions of the resistor terminations and to the dielectric substrate intermediate the resistor terminations. The resistive material is fixed by drying and firing in air. Terminal pads, conductor traces and resistor interconnections are printed on the dielectric substrate using a base conductor material. The resistor interconnections are also printed to the resistor terminations and to portions of the resistive material. The terminal pads, conductor traces and resistor interconnections are then air dried and fired in nitrogen.

Abstract: A thermal head in which a glazed layer, an improved undercoat layer, a heat generating resistor layer, an electrical power supply conductor layer and a protection layer are successively laminated to the surface of an insulating substrate, in which the undercoat layer is composed of an aluminum nitride (AlN) film. The method of manufacturing the thermal head comprises forming the aluminum nitride (AlN) film by sputtering an Al target in a gas mixture of argon and nitrogen and forming the heat generating resistor layer and the electrical power supply conductor layer, that is, three layers in total successively formed by sputtering. Because of the good heat conductivity of aluminum nitride film, the temperature distribution in the heat generating portion is made uniform and localized heat generation can be avoided, as it also prevents the destruction of the heat generating resistor layer or the protection layer due to the temperature difference upon heat generation.

Abstract: A probe for measuring the level of a liquid and its method of manufacture are disclosed. A conducting circuit whose resistivity depends on temperature comprises a track applied to a substrate in which is formed a window which leaves free an appreciable length of track, so that its behavior is not disturbed by the presence of the substrate. The conducting circuit is partially immersed in the liquid and the voltage at its terminals is measured when a constant current flows therethrough. The voltage measurement is representative of the level of the liquid.

Abstract: This invention relates to an improved method of making an improved injection molding nozzle having an integral electrical heating element which is grounded adjacent the corrosion and wear resistant pointed tip. A main body is made of steel with a cylindrical central portion and a tapered portion adjacent a forward recessed end. The heating element is inserted through a heating element bore drilled diagonally through the tapered portion and wound in a spiral channel machined in the surface of the central portion. A high speed steel tapered tip portion is mounted on the forward end of the main body with the exposed forward end of the heating element extending into a central heating element bore therethrough. The surfaces of the assembly are sprayed with sticky acrylic lacquer and it is then dipped in a nickel powder bath. Beads of nickel brazing paste are applied to the joints. A high speed steel insert portion is dropped into the mouth of the bore, followed by a quantity of nickel brazing powder.

Abstract: This invention relates to an improved injection molding nozzle and method of making it. The components are assembled and dipped in lacquer and powdered nickel prior to brazing in a vacuum furnace. This integrally brazes the components together, embeds an electrical heating element in a spiral channel, and provides the surfaces with a protective nickel coating. In one embodiment, the forward end has an integral high speed steel insert and the remote end of the heating element extends into the forward end of the nozzle. In addition to providing the protective coating, carrying out the method with a single vacuum brazing step considerably reduces manufacturing costs.

Abstract: A ceramic composition for dielectrics, consisting essentially of an inorganic dielectric material including at least one electrically insulating glass and at least one organic binder, and further comprising at least one inorganic peroxide. The inorganic peroxide serves to facilitate burnout or removal of the organic binder during firing of the ceramic composition and minimizes the content of residual carbon in the fired ceramic composition. The inorganic peroxide is preferably selected from the group consisting of calcium peroxide, strontium peroxide, barium peroxide, zinc peroxide and cadmium peroxide, and present preferably in an amount of 0.1-40% by weight. Also disclosed is a process of manufacturing a ceramic circuit board using the ceramic composition stated above.