Metal Coating Patents (Class 427/123)
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Patent number: 8012378Abstract: Disclosed is a nickel ink comprising a dispersion medium and nickel particles dispersed in the medium and containing a methyldimethoxysilane coupling agent. The dispersion medium comprises a glycol having a boiling point of 300° C. or lower at ambient temperature, an alkoxyethanol having 3 to 10 carbon atoms, and an ether having 2 to 8 carbon atoms. The ink preferably has a surface tension adjusted to 15 to 50 mN/m and a viscosity at 25° C. adjusted to 0.6 to 60 mPa·sec. The ink is preferably used in inkjet printing.Type: GrantFiled: March 23, 2007Date of Patent: September 6, 2011Assignee: Mitsui Minning & Smelting Co., LtdInventors: Yoichi Kamikoriyama, Hiroki Sawamoto, Mikimasa Horiuchi
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Publication number: 20110209992Abstract: The invention relates to an electrode formulation comprising a catalytic layer containing tin, ruthenium, iridium, palladium and niobium oxides applied to a titanium or other valve metal substrate. A protective layer based on titanium oxide modified with oxides of other elements such as tantalum, niobium or bismuth may be interposed between the substrate and the catalytic layer. The thus obtained electrode is suitable for use as an anode in electrolysis cells for chlorine production.Type: ApplicationFiled: May 12, 2011Publication date: September 1, 2011Applicant: Industrie De Nora S.p.A.Inventors: Christian Urgeghe, Alexander Morozov, Alice Calderara, Dino Floriano Di Franco, Antonio Lorenzo Antozzi
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Publication number: 20110212313Abstract: Metal nanoparticles are assembled in interrupted metal strands or other structures of characteristic dimensions and orientation to generate a giant dielectric response through a modified GE effect. Careful selection and modification of the host material and synthesis also leads to low dielectric breakdown voltages. In addition, the high dielectric composite material is employed in material configurations that are more scalable for industrial and consumer applications.Type: ApplicationFiled: February 27, 2010Publication date: September 1, 2011Applicant: EMPIRE TECHNOLOGY DEVELOPMENT LLCInventor: Sung-Wei CHEN
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Publication number: 20110210259Abstract: A method and system for providing a micro-channel plate detector. An anodized aluminum oxide membrane is provided and includes a plurality of nanopores which have an Al coating and a thin layer of an emissive oxide material responsive to incident radiation, thereby providing a plurality of radiation sensitive channels for the micro-channel plate detector.Type: ApplicationFiled: February 22, 2011Publication date: September 1, 2011Inventors: Jeffrey W. Elam, Hsien-Hau Wang, Michael J. Pellin, Karen Byrum, Henry J. Frisch, Seon W. Lee
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Patent number: 8007692Abstract: It is aimed at providing: a coating liquid for nickel film formation suitable for forming a nickel film combinedly possessing an excellent electroconductivity and an excellent film-forming ability (surface flatness), by a coating method, particularly inkjet printing; a nickel film obtained by using the nickel film formation coating liquid; and a production method of such a nickel film. A coating liquid for nickel film formation comprises: nickel formate; and an amine based solvent having a boiling point within a range between 180° C. inclusive and 300° C. exclusive, as a main solvent, thereby allowing obtainment of a coating liquid for nickel film formation suitable for inkjet printing; and there can be obtained a uniform and flat nickel film having a low resistance and being excellent in film strength (adhesion force), by coating the nickel film formation coating liquid onto a substrate; drying the coated coating liquid; and subsequently calcining the dried coating liquid at a temperature of 200° C.Type: GrantFiled: June 16, 2006Date of Patent: August 30, 2011Assignee: Sumitomo Metal Mining Co., Ltd.Inventors: Yoshihiro Otsuka, Masaya Yukinobu
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Patent number: 8003160Abstract: A substrate is provided on which wires can be formed satisfactorily using a dispersion liquid of metal microparticles without causing disconnection or short circuit. The wiring substrate comprises a substrate, an organic membrane formed on the substrate, and a metal wire formed on the organic membrane. An arithmetic mean deviation Ra of the profile of the surface of the organic membrane where the metal wire is formed is not less than 60 nm and not more than 5×10?2D, where D is the width of the metal wire. The contact angle with respect to water on the surface of the organic membrane where the metal wire is formed is not less than 110°.Type: GrantFiled: February 16, 2007Date of Patent: August 23, 2011Assignee: Ricoh Printing Systems, Ltd.Inventors: Hiroshi Sasaki, Makoto Kurosawa, Kazuo Shimizu
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Patent number: 8003162Abstract: A method of forming a phase change layer using a Ge compound and a method of manufacturing a phase change memory device using the same are provided. The method of manufacturing a phase change memory device included supplying a first precursor on a lower layer on which the phase change layer is to be formed, wherein the first precursor is a bivalent precursor including germanium (Ge) and having a cyclic structure. The first precursor may be a cyclic germylenes Ge-based compound or a macrocyclic germylenes Ge-based, having a Ge—N bond. The phase change layer may be formed using a MOCVD method, cyclic-CVD method or an ALD method. The composition of the phase change layer may be controlled by a deposition pressure in a range of 0.001 torr-10 torr, a deposition temperature in a range of 150° C. to 350° C. and/or a flow rate of a reaction gas in the range of 0-1 slm.Type: GrantFiled: November 8, 2007Date of Patent: August 23, 2011Assignee: Samsung Electronics Co., Ltd.Inventors: Woong-chul Shin, Jae-ho Lee, Youn-seon Kang
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Publication number: 20110193448Abstract: A method for manufacturing a laminated electronic component in which, when first plating layers that respectively connect a plurality of internal electrodes to each other and second plating layers that improves the mountability of a laminated electronic component are formed as external terminal electrodes, the entire component main body is treated with a water repellent agent after the formation of the first plating layers, and the water repellent agent on the first plating layers is then removed before the formation of the second plating layers. The gaps between the end edges of the first plating films on the outer surface of the component main body and the outer surface of the component main body are filled with the water repellent agent.Type: ApplicationFiled: February 4, 2011Publication date: August 11, 2011Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Masahito SARUBAN, Makoto OGAWA, Akihiro MOTOKI, Syunsuke TAKEUCHI, Kiyoyasu SAKURADA
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Publication number: 20110187395Abstract: A corrosion sensor includes an insulating substrate, a thin film of a first metallic material formed on the substrate; and an array of areas what includes a second metallic material provided at the surface of the thin film. A method for manufacturing such a sensor is also disclosed. An exemplary embodiment is disclosed in which the thin film is patterned to define a number of tracks, the resistance of which can be monitored in order to determine the degree to which the thin film has corroded.Type: ApplicationFiled: May 11, 2009Publication date: August 4, 2011Applicant: BAE SYSTEMS PLCInventors: Peter Charles Morgan, Hebron Michael Christopher
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Publication number: 20110183068Abstract: To provide a composition with which a metal film can be directly produced from a high-valent metal compound, a method for producing a metal film, and a method for producing a metal powder. Using a composition for production of a metal film of copper, silver or indium, which comprises a high-valent compound of copper, silver or indium, a linear, branched or cyclic C1-18 alcohol and a Group VIII metal catalyst, a coating film is formed, followed by reduction by heating to produce a metal film of copper, silver or indium. Further, using metal particles of silver, copper of indium having a surface layer comprising a high-valent compound of copper, silver or indium, instead of the high-valent compound of copper, silver or indium, a metal film of copper, silver or indium is produced in the same manner as above.Type: ApplicationFiled: October 21, 2009Publication date: July 28, 2011Applicants: TOSOH CORPORATION, SAGAMI CHEMICAL RESEARCH INSTITUTEInventors: Tetsu Yamakawa, Noriaki Oshima, Takahiro Kawabata, Tomoyuki Kinoshita, Toshio Inase
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Publication number: 20110177236Abstract: Methods for sealing a porous dielectric are presented including: receiving a substrate, the substrate including the porous dielectric; exposing the substrate to an organosilane, where the organosilane includes a hydrolysable group for facilitating attachment with the porous dielectric, and where the organosilane does not include an alkyl group; and forming a layer as a result of the exposing to seal the porous dielectric. In some embodiments, methods are presented where the organosilane includes: alkynyl groups, aryl groups, flouroalkyl groups, heteroarlyl groups, alcohol groups, thiol groups, amine groups, thiocarbamate groups, ester groups, ether groups, sulfide groups, and nitrile groups. In some embodiments, method further include: removing contamination from the porous dielectric and a conductive region of the substrate prior to the exposing; and removing contamination from the conductive region after the forming.Type: ApplicationFiled: March 29, 2011Publication date: July 21, 2011Applicant: INTERMOLECULAR, INC.Inventors: David E. Lazovsky, Tony P. Chiang, Majid Keshavarz
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Patent number: 7981464Abstract: Electronic devices prepared from nanoscale powders are described. Methods for utilizing nanoscale powders and related nanotechnology to prepare capacitors, inductors, resistors, thermistors, varistors, filters, arrays, interconnects, optical components, batteries, fuel cells, sensors and other products are discussed.Type: GrantFiled: December 11, 2007Date of Patent: July 19, 2011Assignee: PPG Industries Ohio, Inc.Inventors: Tapesh Yadav, Hongxing Hu
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Publication number: 20110168434Abstract: Vertical stacks of a metal portion and a semiconductor portion formed on a first substrate are brought into physical contact with vertical stacks of a metal portion and a semiconductor portion formed on a second substrate. Alternately, vertical stacks of a metal portion and a semiconductor portion formed on a first substrate are brought into physical contact with metal portions formed on a second substrate. The assembly of the first and second substrates is subjected to an anneal at a temperature that induces formation of a metal semiconductor alloy derived from the semiconductor portions and the metal portions. The first substrate and the second substrate are bonded through metal semiconductor alloy portions that adhere to the first and second substrates.Type: ApplicationFiled: January 12, 2010Publication date: July 14, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Mukta G. Farooq, Zhengwen Li, Zhijiong Luo, Huilong Zhu
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Publication number: 20110171372Abstract: The present invention provides conductive metal compositions for electronic applications, and methods of preparation and uses thereof. More specifically, the present invention provides metallic particle transient liquid phase sintering compositions containing blended formulations of metal and metal alloy components that form interconnected conductive metallurgical networks with increased stability, resistance to thermal stress and ability to mitigate CTE mismatch between materials.Type: ApplicationFiled: November 5, 2010Publication date: July 14, 2011Applicant: ORMET CIRCUITS, INC.Inventors: Catherine Shearer, Kenneth C. Holcomb, G. Delbert Friesen, Michael C. Matthews
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Publication number: 20110168327Abstract: A method for making ion conducting films includes the use of primary inorganic chemicals, which are preferably water soluble; formulating the solution with appropriate solvent, preferably deionized water; and spray depositing the solid electrolyte matrix on a heated substrate, preferably at 100 to 400° C. using a spray deposition system. In the case of lithium, the deposition step is then followed by lithiation or addition of lithium, then thermal processing, at temperatures preferably ranging between 100 and 500° C., to obtain a high lithium ion conducting inorganic solid state electrolyte. The method may be used for other ionic conductors to make electrolytes for various applications. The electrolyte may be incorporated into a lithium ion battery.Type: ApplicationFiled: April 6, 2010Publication date: July 14, 2011Inventor: Isaiah O. Oladeji
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Patent number: 7976733Abstract: Low-cost copper nanoparticle inks that can be annealed onto paper substrate for RFID antenna applications, using substituted dithiocarbonates as stabilizers during copper nanoparticle ink production.Type: GrantFiled: November 30, 2007Date of Patent: July 12, 2011Assignee: Xerox CorporationInventors: Naveen Chopra, Matthew Worden, Peter M. Kazmaier
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Patent number: 7976732Abstract: An electroconductive composition including a mixture of a copper powder having an averaged particle size between 0.3 and 20 ?m and a copper fine powder having an averaged particle size between 1 and 50 nm; a solvent comprising a multivalent alcohol, such as ethylene glycol or diethylene glycol, having two or more OH groups; and an additive comprising a compound such as malic acid or citric acid having two or more COOH groups and one or more OH groups where the number of COOH groups is equal to or greater than the number of OH groups.Type: GrantFiled: March 26, 2007Date of Patent: July 12, 2011Assignee: Sumitomo Metal Mining Co., Ltd.Inventors: Keiji Kamada, Kensaku Mori
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Patent number: 7976895Abstract: To prevent the liquid electrolyte from penetrating into the porous support while at the same time preserving or increasing the power density of the fuel cell, before the liquid electrolyte is deposited, at least a part of the walls delineating the pores of said support is covered by a film formed by a material presenting a contact angle of more than 90° with a drop of said liquid electrolyte. Said film further presents a thickness enabling passage of the reactive fluid in the pores of the support.Type: GrantFiled: July 7, 2008Date of Patent: July 12, 2011Assignee: Commissariat a l 'Energie AtomiqueInventors: Vincent Faucheux, Christelle Laugier, Jean-Yves Laurent, Steve Martin
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Publication number: 20110165447Abstract: The printed battery has cathode and anode electrodes with terminals to connect to an external circuit, separator therebetween and electrolyte. An anode electrode material is applied on one side of the separator and a cathode electrode material on the opposite side. The anode material is dry and hydrophobic and is prepared by providing an anode active material, conductive material, solvent and a binder that are mixed to form an anode ink. The anode ink is applied on a substrate and then dried. In response to the drying, the solvent evaporates and the anode ink forms a film on the substrate. The prepared anode material is applied on the separator. An electrolyte solution is printed on the separator that has the anode material thereon. A cathode material is applied between a collector material and separator.Type: ApplicationFiled: September 4, 2009Publication date: July 7, 2011Inventors: Xiachang Zhang, Li Shoujun
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Publication number: 20110162870Abstract: A conductive nanowire film based on a high aspect-ratio metal is disclosed. The nanowire film is produced by inducing metal reduction in a concentrated surfactant solution containing metal precursor ions, a surfactant and a reducing agent. The metal nanostructures demonstrate utility in a great variety of applications.Type: ApplicationFiled: September 1, 2009Publication date: July 7, 2011Applicant: RAMOT AT TEL-AVIV UNIVERSITY LTDInventors: Gil Markovich, Daniel Azulai, Olga Krichevski
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Publication number: 20110162971Abstract: A sputtering target with low generation of particles in which oxides, carbides, nitrides, borides, intermetallic compounds, carbonitrides, and other substances without ductility exist in a matrix phase made of a highly ductile substance at a volume ratio of 1 to 50%, wherein a highly ductile and conductive metal coating layer is formed on an outermost surface of the target.Type: ApplicationFiled: February 24, 2010Publication date: July 7, 2011Applicant: JX NIPPON MINING & METALS CORPORATIONInventors: Yuichiro Nakamura, Akira Hisano, Junnosuke Sekiguchi
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Publication number: 20110154558Abstract: The invention relates to method for manufacturing a thermoelectric generator, comprising the steps of replicating a structure into a flexible substrate (4) for providing a set of cavities (4a); providing an initiator (2a) in the cavities for growing respective piles (6, 7) of thermoelectric materials; growing the respective piles of thermoelectric materials from said initiator; providing electrical connection between the respective piles of thermoelectric materials for forming thermocouples of the thermoelectric generator. The invention further relates to a wearable thermoelectric generator and a garment comprising the same.Type: ApplicationFiled: June 2, 2009Publication date: June 30, 2011Applicants: Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO, Stichting IMEC NederlandInventors: Maria Peter, Erwin Rinaldo Meinders, Ruud Vullers
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Patent number: 7968452Abstract: This disclosure provides (a) methods of making an oxide layer (e.g., a dielectric layer) based on titanium oxide, to suppress the formation of anatase-phase titanium oxide and (b) related devices and structures. A metal-insulator-metal (“MIM”) stack is formed using an ozone pretreatment process of a bottom electrode (or other substrate) followed by an ALD process to form a TiO2 dielectric, rooted in the use of an amide-containing precursor. Following the ALD process, an oxidizing anneal process is applied in a manner is hot enough to heal defects in the TiO2 dielectric and reduce interface states between TiO2 and electrode; the anneal temperature is selected so as to not be so hot as to disrupt BEL surface roughness. Further process variants may include doping the titanium oxide, pedestal heating during the ALD process to 275-300 degrees Celsius, use of platinum or ruthenium for the BEL, and plural reagent pulses of ozone for each ALD process cycle.Type: GrantFiled: June 30, 2009Date of Patent: June 28, 2011Assignee: Intermolecular, Inc.Inventors: Hanhong Chen, Pragati Kumar, Sunil Shanker, Edward Haywood, Sandra Malhotra, Imran Hashim, Nobi Fuchigami, Prashant Phatak, Monica Mathur
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Publication number: 20110151209Abstract: A shell for an electronic device is provided. The shell includes a transparent shell body, a pattern layer formed on an inner surface of the shell body, and a metal coating formed on an outer surface of the shell body which is light transmitting.Type: ApplicationFiled: August 28, 2009Publication date: June 23, 2011Inventors: Huating Li, Mintao Chen, Lei Zhong, Jiaxin Zhang
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Publication number: 20110151268Abstract: A material is provided containing a metal and a lactic acid condensate, wherein the metal is selected from the group of copper, silver, and gold. An electronic component having a surface made of metal, ceramic, or oxide may be coated with the material. A method for the production of metallic surfaces on an electronic component is also provided.Type: ApplicationFiled: August 19, 2009Publication date: June 23, 2011Applicant: W.C. HERAEUS GMBHInventors: Wolfgang Schmitt, Michael Schaefer, Ferdinand Bartels
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Publication number: 20110140580Abstract: Metal nanoparticle-polymer composites, a method of manufacturing the same, and a polymer actuator using the same are provided. The method includes synthesizing an organometallic compound as a precursor of metal nanoparticles, preparing a solution mixture containing the organometallic compound and a polymer, and drying and annealing the solution mixture to generate the metal nanoparticle-polymer composite including metal nanoparticles. Thus, highly efficient metal nanoparticle-polymer composite materials may be manufactured with a uniform distribution without synthesizing nanoparticles.Type: ApplicationFiled: October 20, 2010Publication date: June 16, 2011Applicant: Electronics and Telecommunications Research InstituteInventors: Kwang Suk YANG, Nak Jin Choi, Hyung Kun Lee, Sun Kyung Jung, Kang Ho Park, Jong Dae Kim
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Publication number: 20110139330Abstract: A method for manufacturing a discharge port member used in a liquid discharge head, comprising in the following order, preparing a substrate at least whose surface is conductive, the substrate having, formed on said surface, a first insulating resist for forming a discharge port and a second insulating resist for forming a recessed portion of a wall of a flow path, forming on surface a first plating layer by plating using said first resist and said second resist as a mask, removing said second resist, forming a second plating layer on an exposed portion of said substrate from which said second resist has been removed, said second plating layer being formed by plating using said first resist as a mask, said second plating layer forming said recessed portion of said wall, and removing said first resist to form said discharge port and removing said substrate.Type: ApplicationFiled: November 10, 2010Publication date: June 16, 2011Applicant: CANON KABUSHIKI KAISHAInventors: Ken Ikegame, Hiroaki Mihara
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Publication number: 20110143051Abstract: An electrically conductive emulsion ink is provided, which can form an electrically conductive thin film from metal nanoparticles on various substrates at a relatively low temperature in short time with simple procedures. The emulsion ink comprises an oil phase containing metal nanoparticles and a water phase containing a reducing agent for the metal nanoparticles and/or a photocatalyst. An electrically conductive film can be formed by coating or patterning the emulsion ink on a substrate surface, and then subjecting the coated ink to heat treatment and/or ultraviolet irradiation so as to reduce the metal nanoparticles. Heat treatment is preferably conducted at 40-100° C. Ultraviolet irradiation can be performed at room temperature.Type: ApplicationFiled: December 7, 2010Publication date: June 16, 2011Applicant: RISO KAGAKU CORPORATIONInventors: Kazunori Ohashi, Hiroyuki Ogawa
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Publication number: 20110139486Abstract: A thin electrical insulating coating and method for application is provided for a copper surface. The electrical insulating coating includes a bond coat layer of titanium, nickel, or NiCrAlY forming a metallurgical bond with the copper surface and an insulating layer of alumina or tantala applied to the bond coat layer. An insulating layer does not firmly adhere to copper under harsh environmental conditions such as an electroslag refining process when applied directly to the copper. However, when bond coat layer is applied between the copper and the insulating layer, it forms a strong bond adhering bond for the harsh environment.Type: ApplicationFiled: December 16, 2009Publication date: June 16, 2011Inventors: William T. Carter, Scott A. Weaver, Russell S. Miller
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Publication number: 20110135814Abstract: A functioning substrate with a group of columnar micro pillars characterized in that a first matrix of organic polymer and a group of columnar micro pillars of organic polymer extending from this matrix are provided. This group of columnar micro pillars has an equivalent diameter of 10 nm through 500 ?m and a height of 50 nm through 5000 ?m; and the ratio (H/D) of the equivalent diameter (D) to the height (H) of the group of columnar micro pillars is 4 or more.Type: ApplicationFiled: February 16, 2011Publication date: June 9, 2011Inventors: Akihiro MIYAUCHI, Kosuke Kuwabara, Masahiko Ogino, Hiroshi Yoshida, Takashi Ando
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Patent number: 7955754Abstract: An enhanced stability and inexpensive bipolar plate for a fuel cell is disclosed. The enhanced stability bipolar plate includes a bipolar plate substrate and a corrosion-resistant coating provided on the bipolar plate substrate. A method for enhancing corrosion resistance of a bipolar plate is also disclosed.Type: GrantFiled: July 20, 2004Date of Patent: June 7, 2011Assignee: GM Global Technology Operations LLCInventors: Mahmoud H. Abd Elhamid, Richard H. Blunk, Gayatri Vyas
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Patent number: 7955528Abstract: The present invention relates to a variety of conductive ink compositions comprising a metal complex compound having a special structure and an additive and a method for preparing the same, more particularly to conductive ink compositions comprising a metal complex compound obtained by reacting a metal or metal compound with an ammonium carbamate- or ammonium carbonate-based compound and an additive and a method for preparing the same.Type: GrantFiled: March 12, 2010Date of Patent: June 7, 2011Assignee: Inktec Co., LtdInventors: Kwang-Choon Chung, Hyun-Nam Cho, Myoung-Seon Gong, Yi-Sup Han, Jeong-Bin Park, Dong-Hun Nam, Seong-Yong Uhm, Young-Kwan Seo, Nam-Boo Cho
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Publication number: 20110129733Abstract: A negative electrode for a lithium battery and a lithium battery including the negative electrode, the negative electrode including: a matrix of a Sn grain and a metal M grain; and a carbon-based material grown on the matrix.Type: ApplicationFiled: November 22, 2010Publication date: June 2, 2011Applicant: Samsung SDI Co., LtdInventors: Beom-Kwon Kim, Jae-Myung Kim, Kyu-Nam Joo, Jong-Hee Lee, So-Ra Lee, Young-Su Kim, Deok-Hyun Kim, Gu-Hyun Chung
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Patent number: 7951438Abstract: A metallized laminate film exhibiting improved moisture barrier property as well as maintaining a high bio-polymer content and degradability property is disclosed. The laminate film includes a first core layer of polylactic acid polymer and a second skin layer comprising a polyolefin metal receiving layer. The metal receiving layer or the core layer, or both, may be blended with an amount of polar-modified tie-resin to improve bonding. Alternatively, a discrete tie-resin layer may be interposed between the polyolefin metal receiving layer and the crystalline polylactic acid polymer core layer. The polyolefin metal receiving layer may be discharge-treated on the side opposite the core layer and metallized.Type: GrantFiled: December 10, 2008Date of Patent: May 31, 2011Assignee: Toray Plastics (America), Inc.Inventors: Mark S. Lee, Keunsuk P. Chang
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Publication number: 20110116168Abstract: This invention provides application of noble metal nanoparticles for devices with controlled light transmission, absorption and detection. Particularly described is the use of noble metal nanoparticles in photoconductive detectors, optical filters, optical switches, pixel arrays, and electrochromic windows for controlling the transmission and absorption of incident and transmitted light. In addition, the use of noble metal nanoparticles in an electrochromic display is described in which color of the transmitted light from a nanoparticle-based pixel is adjusted and controlled.Type: ApplicationFiled: November 10, 2010Publication date: May 19, 2011Inventor: Babak Nikoobakht
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Publication number: 20110108307Abstract: A non-oriented electrical steel sheet is provided with a base material and an Fe—Ni alloy film formed on at least one surface of the base material. The Fe—Ni alloy film contains, by mass %, Fe: 10% to 40% and Ni: 60% to 90%, and has a thickness of 0.1 ?m or more are provided.Type: ApplicationFiled: July 15, 2009Publication date: May 12, 2011Inventors: Yoshihiro Arita, Yoshiyuki Ushigami, Shigeru Hirano, Hiroyasu Fujii, Toshinao Yamaguchi, Isoa Koike
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Publication number: 20110111138Abstract: Metal complexes adapted to form conductive metal films and lines upon deposition and treatment. The metal complex can be a covalent complex and can comprise a first and second ligand. Low temperature treatment can be used to convert the complex to a metal. The metal films and lines can have low resistivity and work function similar to pure metal. Coinage metals can be used (e.g., Ag, Au, Cu). The ligands can be dative bonding ligands including amines, unsymmetrical amines, and carboxylate ligands. Sulfur complexes can be used. Carboxylate ligands can be used. The complexes can have a high concentration of metal and can be soluble in aromatic hydrocarbon solvent. The ligands can be adapted to volatilize well. Inkjet printing can be carried out. High yields of metal can be achieve with high conductivity.Type: ApplicationFiled: November 8, 2010Publication date: May 12, 2011Inventors: Richard D. McCullough, John A. Belot, Anna Javier, Rebecca Potash
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Publication number: 20110104474Abstract: A solid polymer electrolyte composite membrane and method of manufacturing the same. According to one embodiment, the composite membrane comprises a thin, rigid, dimensionally-stable, non-electrically-conducting support, the support having a plurality of cylindrical, straight-through pores extending perpendicularly between opposing top and bottom surfaces of the support. The pores are unevenly distributed, with some or no pores located along the periphery and more pores located centrally. The pores are completely filled with a solid polymer electrolyte, the solid polymer electrolyte including a dispersed reduced noble metal or noble metal oxide. The solid polymer electrolyte may also be deposited over the top and/or bottom surfaces of the support.Type: ApplicationFiled: October 4, 2010Publication date: May 5, 2011Inventors: Han Liu, Cortney K. Mittelsteadt, Timothy J. Norman, Arthur E. Griffith, Anthony B. LaConti
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Publication number: 20110091697Abstract: A method for fabricating a solder pad structure. A circuit board having thereon at least one copper pad is provided. A solder resist is formed on the circuit board and covers the copper pad. A solder resist opening, which exposes a portion of the copper pad, is formed in the solder resist by laser. The laser also creates a laser activated layer on sidewalls of the solder resist opening. A chemical copper layer is then grown from the exposed copper pad and concurrently from the laser activated layer.Type: ApplicationFiled: October 16, 2009Publication date: April 21, 2011Inventors: Tzyy-Jang Tseng, Shu-Sheng Chiang
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Publication number: 20110092006Abstract: Disclosed is a method of fabricating a display device that includes: forming an adhesive layer of an inorganic material on a carrier substrate having a display area and a non-display area surrounding the display area; forming a plurality of adhesive patterns of a metallic material on the adhesive layer, each of the plurality of adhesive patterns having a width and a height; forming a plastic substrate on the adhesive layer and the plurality of adhesive patterns; forming a plurality of elements for displaying images on the plastic substrate; cutting the carrier substrate and the plastic substrate to divide the display area and the non-display area; and detaching the carrier substrate from the plastic substrate.Type: ApplicationFiled: July 14, 2010Publication date: April 21, 2011Inventors: Hyun-Jin An, Kyoung-Mook Lee
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Publication number: 20110088771Abstract: A new process of manufacturing a transparent conductive oxide (TCO) substrate with light trapping feature and the device thereof is described. The process comprises: forming a metal layer on a substrate, annealing the metal layer so that metal elements are self-aggregated, thereby forming a plurality of island-structure metal protrusions; and forming a transparent conductive oxide layer on the island-structure metal protrusions and the substrate.Type: ApplicationFiled: October 18, 2010Publication date: April 21, 2011Applicant: DU PONT APOLLO LTD.Inventors: Yuting LIN, Shihche HUANG, Wenkai HSU
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Patent number: 7927652Abstract: A method for manufacturing a field emission electron source, the method comprising the steps of: preparing a substrate, a carbon nanotubes slurry, and a conductive slurry; applying a conductive slurry layer onto the substrate; applying a layer of carbon nanotubes slurry onto the conductive slurry layer; and solidifying the substrate under a temperature of 300 to 600 degrees centigrade so as to form the field emission electron source.Type: GrantFiled: October 5, 2007Date of Patent: April 19, 2011Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.Inventors: Yang Wei, Lin Xiao, Feng Zhu, Jie Tang, Liang Liu, Shou-Shan Fan
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Patent number: 7928419Abstract: The present disclosure relates to a solid electrolyte device comprising an amorphous chalcogenide solid active electrolytic layer; first and second metallic layers. The amorphous chalcogenide solid active electrolytic layer is located between the first and second metallic layers. The amorphous chalcogenide solid active electrolytic layer is prepared by obtaining a solution of a hydrazine-based precursor to a metal chalcogenide; applying the solution onto a substrate; and thereafter annealing the precursor to convert the precursor to the amorphous metal chalcogenide. The present disclosure also relates to processes for fabricating the solid electrolyte device.Type: GrantFiled: July 30, 2007Date of Patent: April 19, 2011Assignee: International Business Machines CorporationInventors: Kailash Gopalakrishnan, David B. Mitzi, Rohit S. Shenoy
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Publication number: 20110086231Abstract: The present invention relates to a dispersion for the application of a metal layer on a non-electrically-conductive substrate comprising an organic binder component, a metal component, and also a solvent component. The invention further relates to processes for the production of the dispersion, processes for the production of a non-structured or structured metal layer with the aid of the dispersion, and also to the resultant substrate surfaces and their use.Type: ApplicationFiled: June 8, 2009Publication date: April 14, 2011Inventors: Rene Lochtman, Norbert Wagner, Jürgen Kaczun, Jürgen Pfister
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Publication number: 20110086558Abstract: An electrical contact material includes a base material, a first number of plating layers forming a contact section and a second number of plating layers forming a soldering section, respectively. The second number of plating layers is provided on the base material and includes a Ni-plating layer directly on the base material and an organic antioxidant-plating layer on said Ni-plating layer.Type: ApplicationFiled: October 14, 2010Publication date: April 14, 2011Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Chih-Pi Cheng, Cheng-Ching Chien, Jia-Hau Liu, Been-Yang Liaw
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Patent number: 7921799Abstract: A pattern forming apparatus comprises a surface treatment system and an ink jet system 14, where a solvent is sprayed from a solvent spray nozzle of the surface treatment system to surface of a glass substrate where a bus line pattern groove is formed. The ink is discharged from an ink discharge nozzle of the ink jet system into the groove of bus line pattern on a glass substrate, and a bus line pattern is formed.Type: GrantFiled: May 31, 2006Date of Patent: April 12, 2011Assignee: Future Vision Inc.Inventors: Fumitaka Takemura, Tomoe Yamazaki, Yosuke Kobayashi, Tsutomu Tanaka
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Publication number: 20110082042Abstract: Operational characteristics of an extremely low resistance (“ELR”) film comprised of an ELR material may be improved by depositing a modifying material onto appropriate surfaces of the ELR film to create a modified ELR film. In some implementations of the invention, the ELR film may be in the form of a “c-film.” In some implementations of the invention, the ELR film may be in the form of an “a-b film,” an “a-film” or a “b-film.” The modified ELR film has improved operational characteristics over the ELR film alone or without the modifying material. Such operational characteristics may include operating in an ELR state at increased temperatures, carrying additional electrical charge, operating with improved magnetic properties, operating with improved mechanic properties or other improved operational characteristics. In some implementations of the invention, the ELR material is a mixed-valence copper-oxide perovskite, such as, but not limited to YBCO.Type: ApplicationFiled: October 2, 2010Publication date: April 7, 2011Inventors: Douglas J. GILBERT, Timothy S. Cale
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Publication number: 20110079425Abstract: A treatment method for a getter material, comprising at least one oxidation and/or nitriding step of getter material conducted under dry atmosphere of dioxygen and/or dinitrogen at pressure greater than approximately 10?2 mbar and at a temperature between approximately 50° C. and 120° C. and over a period between approximately 1 minute and 10 minutes, forming a protective layer composed of oxide and/or nitride of getter material.Type: ApplicationFiled: October 5, 2010Publication date: April 7, 2011Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.Inventors: Xavier BAILLIN, Emmanuelle Lagoutte, Guillaume Rodriguez
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Publication number: 20110073473Abstract: A three-dimensionally ordered macroporous sensor apparatus and method of forming the same. A direct opal film associated with a number of pores can be formed by vertical deposition of one or more nanospheres on a glass substrate. The thickness of the direct opal film can be controlled by concentration of the nanospheres. A mixture of a precursor/monomer of a sensing material and a complexing agent can be filled into the pores associated with the direct opal film, such that the mixture permeates the interstitial spaces between the pores. The nanospheres may then be removed in order to form a three dimensionally-ordered macroporous electrode with an inverse opal structure. Optionally, the sensing material can be coated on an inverse opal backbone structure formed from an external inactive material and utilizing a coating operation.Type: ApplicationFiled: September 30, 2009Publication date: March 31, 2011Inventors: Zhi Zheng, Linan Zhao, Marilyn Wang
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Publication number: 20110070362Abstract: An electrode substrate for a battery has nickel applied as a coat on the surface of a base constituted of crossing of a plurality of fibers including a core formed of synthetic resin and a coating of synthetic resin having a softening temperature lower than the softening temperature of the synthetic resin forming the core. The electrode substrate has the fibers of the base fusion-bonded at a cross point by heat treatment. The ratio of the coating occupying a II-II cross section of the fiber cross point is larger than the ratio of the coating occupying a fiber cross section (III-III cross section) at a site other than at the cross point.Type: ApplicationFiled: November 30, 2010Publication date: March 24, 2011Applicants: SUMITOMO ELECTRIC INDUSTRIES, LTD., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Kazuki Okuno, Jin-Joo Park, Masahiro Kato, Masaru Yao, Tsutomu Iwaki, Tetsuo Sakai