Abstract: A honeycomb structure includes a substantially pillar-shaped honeycomb unit having cells defined by cell walls. The cell walls include silicon carbide particles having a nitrogen-containing layer provided on surfaces of the silicon carbide particles. A method of manufacturing a honeycomb structure includes preparing paste containing silicon carbide particles. The paste is molded to form a honeycomb molded body. The honeycomb molded body is fired in an inert atmosphere containing no nitrogen to obtain a substantially pillar-shaped honeycomb unit having cells defined by cell walls. The honeycomb unit is heated in an environment containing nitrogen to provide a nitrogen-containing layer on surfaces of the silicon carbide particles forming the cell walls.

Abstract: The invention relates to the preparation of multilayer microcomponents which comprise one or more films, each consisting of a material M selected from metals, metal alloys, glasses, ceramics and glass-ceramics. The method consists in depositing on a substrate one or more films of an ink P, and one or more films of an ink M, each film being deposited in a predefined pattern selected according to the structure of the microcomponent, each film of ink P and each film of ink M being at least partially consolidated before deposition of the next film; effecting a total consolidation of the films of ink M partially consolidated after their deposition, to convert them to films of material M; totally or partially removing the material of each of the films of ink P. An ink P consists of a thermoset resin containing a mineral filler or a mixture comprising a mineral filler and an organic binder. An ink M consists of a mineral material precursor of the material M and an organic binder.

Abstract: An anode active material. The anode active material includes a core including SiOx (0.5?x?1.7), and a coating layer formed on the core at least partially. The coating layer includes metal unreactive toward lithium.

Abstract: A nanofabrication device in an example includes a conducting nanotip and a gas microchannel adjacent to the nanotip and configured to deliver a gas to the nanotip. The nanofabrication device can be used for controlled and localized etching and/or deposition of material from a substrate.

Abstract: Disclosed is an electrode, including a conductive layer containing a conductive component selected from the group consisting of copper, nickel, iron, cobalt, titanium, lead, aluminum, tin, and alloys comprising one of these metals as the principal ingredient thereof, and an oxidation protection layer containing boron oxide, said oxidation protection layer covering the top surface of the conductive layer, or covering both the top surface and the sides of the conductive layer, or covering all locations where the conductive layer has been formed; the electrode being formed by air firing the conductive layer and the oxidation protection layer simultaneously.

Abstract: An anode composite material includes an anode active material particle having a surface and a continuous aluminum phosphate layer. The continuous aluminum phosphate layer is coated on the surface of the anode active material particle. The present disclosure also relates to a lithium ion battery that includes the cathode composite material.

Abstract: The present invention provides anode materials, methods of producing them, electrochemical cells, and lithium-ion batteries, where the anode material comprises mesoporous silicon and carboxymethyl cellulose. In certain embodiments, the mesoporous silica additionally comprises other materials within its pores, such as lithium.

Abstract: A negative electrode for a rechargeable lithium battery, including a negative active material layer including a polymer binder including a repeating unit represented by the following Chemical Formula 1 or the following Chemical Formula 2 and a Si-based negative active material; and a current collector supporting the negative active material layer, is provided: wherein in Chemical Formulae 1 and 2, R1 and R2 are the same or different and hydrogen, OH or OOH.

Abstract: A rotating mass component with high balancing quality is provided. The balancing is performed in a substantially automated manner and without chip formation. A method for balancing a rotating mass component, such as a rotor is achieved by deposition welding of welding points on the mass component. The mass symmetry respective to the rotation axis is improved. The deposition welding takes place through cold metal transfer welding, in particular of a plurality of individual mass points.

Abstract: A bipolar battery may include a substrate having a matrix made of a thermoset polymer formed from a liquid precursor. One or more conductive pellets can be disposed in the matrix to provide electrical connection between opposite sides of the matrix. Each conductive pellet has a characteristic thickness that is greater than a thickness of the matrix. Each of the one or more conductive pellets protrudes beyond first and second surfaces of the matrix.

Abstract: A porous metal body includes a porous skeleton that forms a three-dimensional network structure and includes an aluminum layer having a thickness of 1 to 100 ?m, and tin layers disposed on an internal surface and an external surface of the aluminum layer. Such a porous metal body can be produced by an internal-tin-layer formation step of forming a tin layer on a surface of a resin molded body having a three-dimensional network structure; an aluminum-skeleton formation step of forming an aluminum layer serving as an aluminum skeleton on a surface of the internal tin layer; an external-tin-layer formation step of forming a tin layer on a surface of the aluminum skeleton; and a resin removal step of removing the resin molded body, the resin removal step being performed after the aluminum-skeleton formation step or after the external-tin-layer formation step.

Abstract: Provided is a method of forming a metal oxide film. In the method, a metal oxide film is formed on a substrate using a coating solution including a metal precursor, and electrical conductivity of the metal oxide film is controlled.

Abstract: A method applies layers to channels of a resistance heating element, where the channels are arranged in a honeycomb structure and receive a medium to be heated. Adjacent layers communicate with electrically conducting end-face metallizations of the resistance heating element and have, at an opposite end, an insulation region in relation to another respective end-face metallization. To apply the layers, a miniature lance is immersed into the channel to be coated. The miniature lance is hollow, closed at a lower end, has an upper end communicating with a reservoir of metal paste, and includes outlets in a lower region that are directed to inner walls. Metal paste is uniformly applied to the inner walls of the channel by pressure while simultaneously moving the miniature lance. The miniature lance is inserted into an adjacent channel for coating inner walls of the adjacent channel from the other end-face metallization side.

Abstract: An alloy comprising at least two refractory metals and a method for forming such alloy are proposed. In the alloy, a first refractory metal such as tantalum forming a minor portion of the alloy is completely dissolved in a second refractory metal such as tungsten forming a major portion of the alloy. The alloy may be formed by providing the two refractory metals in a common crucible (step S1), melting both refractory metals by application of an electron beam (step S2), mixing the molten refractory metals (step S3) and solidifying the melt (step S4). Due to the possible complete mixing of the refractory metal components in a molten state, improved material properties of the solidified alloy may be achieved. Furthermore, due to the use of tantalum instead of rhenium together with tungsten, a cheap and resistant refractory metal alloy may be produced, which alloy may be used for example for forming a focal track region of an X-ray anode.

Abstract: Disclosed is a method for forming a metal line. The method includes preparing a semiconductor substrate having a first metal line, performing an oxidation process with respect to the first metal line, performing an oxide removal process to remove an oxide generated in the oxidation process, forming an etch stop layer on the metal line, forming an interlayer dielectric layer on the first metal line, and forming a damascene pattern on the interlayer dielectric layer, and forming a second metal line, which is connected with the first metal line, in the damascene pattern. The oxidation process for the first metal line can include a hydrogen peroxide treatment process using a solution including oxygen. The oxide removal process can be performed by using an oxalic acid (HOOC—COOH) solution.

Abstract: Disclosed are an organometallic precursor that may be used in manufacturing a semiconductor device, a thin film having the same, a metal wiring including the thin film, a method of forming a thin film and a method of manufacturing a metal wiring. An organometallic precursor including a central metal, a borohydride ligand and an amine ligand for reducing a polarity of the organometallic precursor may be provided onto a substrate, and may be thermally decomposed to form a thin film on the substrate. The organometallic precursor having a reduced polarity may be provided to a chamber with a constant flow rate, and thus stability and/or efficiency of a semiconductor manufacturing process may be improved.

Abstract: The present invention relates to a multilayered structure including at least one diamond layer and methods of making the multilayered structures. The multilayered structure includes a diamond layer having a top surface and a bottom surface, and when desired at least one metal filled via in the diamond layer, a first thin adhesion layer on the top surface, a second thin adhesion layer on the bottom surface, a first metal layer having a thermal conductivity greater than 200 W/m-K and a coefficient of thermal expansion greater than 12 ppm/K, wherein the first metal layer is deposited on the first thin adhesion layer, and a second metal layer having a thermal conductivity greater than 200 W/m-K and a coefficient of thermal expansion greater than 12 ppm/K, wherein the second metal layer is deposited on the second thin adhesion layer.

Abstract: The present disclosure relates to methods for tuning the work function of a metal nanostructure-based conductive film by forming a dipole surface layer on individual metal nanostructures.

Abstract: The present invention relates to a conductive metal ink composition which is properly applied for roll-printing process to form conductive pattern with improved conductivity, and the method of preparing a conductive pattern using the same. The conductive metal ink composition comprises a conductive metal powder; an organic silver complex where an organic ligand including amine group and hydroxyl group binds with a silver (Ag) salt of aliphatic carboxylic acid; a non-aqueous solvent comprising a first non-aqueous solvent having a vapor pressure of 3 torr or lower at 25° C. and a second non-aqueous solvent having a vapor pressure of higher than 3 torr at 25° C.; and a coatability improving polymer.

Abstract: Embodiments of the invention relate to payment cards and methods for making payment cards. In one embodiment, a card comprises a first layer and a second layer adjacent to the first layer. The second layer comprises a plurality of particles comprising metal, and the plurality of particles comprise at least about 15 volume % of the second layer. In another embodiment, a mixture is prepared comprising polymer and a plurality of particles comprising metal. The plurality of particles comprise at least about 15 volume % of the mixture. The mixture is pressed and an outer layer is applied. The mixture and outer layer are then cut to form the card.

Abstract: Provided is a copper nano paste that can be calcined at a relatively low temperature. The copper nano paste includes: a binder added in an amount of 0.1 to 30 parts by weight; an additive added in an amount of not more than 10 parts by weight; and copper particles added in an amount of 1 to 95 parts by weight, wherein the copper particles have a particle size of 150 nm or less, and the surfaces of the copper particles are coated with a capping material.

Abstract: An apparatus according to one embodiment includes a near field transducer comprising a conductive metal film; and an optical waveguide for illumination of the near field transducer, a light guiding core layer of the optical waveguide being spaced from the near field transducer by less than about 100 nanometers and greater than 0 nanometers, wherein a longitudinal axis of the optical waveguide is substantially perpendicular to an air bearing surface.

Abstract: The present invention relates to a method for manufacturing a conductive metal thin film, including: preparing a conductive metal coating solution by adding carboxylic acid to a dispersion including a conductive metal particle having a core/shell structure; coating the conductive metal coating solution on a top portion of a substrate, heat-treating it, and removing an metal oxide layer of the surface of the conductive metal particle having the core/shell structure; and forming a thin film of the conductive metal particle from which the metal oxide layer is removed.

Abstract: An object of the present invention is to provide an electrode sintered body wherein shrinkage is prohibited and conductivity is good. An electrode sintered body including intermetallic compound comprising nickel and aluminum is provided. And then an internal electrode paste, which can inhibit shrinkage of an internal electrode layer, is manufactured by raising sintering temperature of conducting particle materials constituting internal electrode sheet to be internal electrode layers after firing. Further, a high-function multilayer electronic device using electrode paste for internal electrodes is manufactured.

Abstract: A base layer is formed on the surface of metal plate, metal pipe, unbaked ceramic sheet, laminated ceramic green sheet, etc., the base layer causing a gelling reaction with inkjet-ink. The base layer improves ink acceptability for low viscosity inks such as inkjet-ink, and prevents oozing, draining, uneven thickness of an ink pattern and a resist pattern. Thus, the present invention enables to use an ink jet process for providing resist patterns for etching, etc., which has to fulfill stringent high precision requirements.

Abstract: The present invention relates to a conductive metal ink composition which is properly applied for roll-printing process to form conductive pattern, and the method of preparing a conductive pattern using the same. The conductive metal ink composition comprises a conductive metal powder; a non-aqueous solvent comprising a first non-aqueous solvent having a vapor pressure of 3 torr or lower at 25° C. and a second non-aqueous solvent having a vapor pressure of higher than 3 torr at 25° C.; and a coatability improving polymer and is coated for forming the conductive pattern by the roll printing method.

Abstract: The present invention relates to a method for coating a carrier during the production of an electrode for electrical energy stores, in particular for lithium ion cells, using a specific solvent and/or dispersant, characterized in that the solvent and/or dispersant is or comprises N-ethylpyrrolidone.

Abstract: A plate member for touch panel and a method of manufacturing the same, and a touch panel are provided. The plate member for touch panel includes: a base substrate; an intermediate layer disposed on a first side of the base substrate; and a transparent conductive layer disposed on the intermediate layer.

Abstract: A separator carries lithium particles on its surface. Using the separator, a non-aqueous electrolyte secondary battery having a high initial efficiency and improved cycle retentivity is available.

Abstract: An electrode substrate for a battery has nickel applied as a coat on the surface of a base constituted of crossing of a plurality of fibers including a core formed of synthetic resin and a coating of synthetic resin having a softening temperature lower than the softening temperature of the synthetic resin forming the core. The electrode substrate has the fibers of the base fusion-bonded at a cross point by heat treatment. The ratio of the coating occupying a II-II cross section of the fiber cross point is larger than the ratio of the coating occupying a fiber cross section (III-III cross section) at a site other than at the cross point.

Abstract: A highly reliable electronic device that prevents entry of a plating solution via an external electrode and entry of moisture of external environment inside thereof, and generates no soldering defects or solder popping defects which are caused by precipitation of a glass component on a surface of the external electrode. The electrode structure of the electronic device is formed of Cu-baked electrode layers primarily composed of Cu, Cu plating layers formed on the Cu-baked electrode layers and which are processed by a recrystallization treatment, and upper-side plating layers formed on the Cu plating layers. After the Cu plating layers are formed, a heat treatment is performed at a temperature in the range of a temperature at which the Cu plating layers are recrystallized to a temperature at which glass contained in a conductive paste is not softened, so that the Cu plating layers are recrystallized.

Abstract: A method for depositing a powder metal onto a surface of the substrate and a substrate with conductive elements provided on a surface of the substrate are disclosed. The conductive elements are formed by cold spray depositing at least one layer of powder metal onto the surface of the substrate to form at least one conductive element on the surface of the article.

Abstract: To obtain low resistance and high adhesion at the same time in a solar cell electrode, a conductive paste is offered. A conductive paste for solar cell electrode contains conductive powder, organic medium and glass frit which is mixture of more than one kind of glass frit such as a mixture of glass frit containing at least PbO and glass frit containing at least Bi2O3.

Abstract: An integrated device includes at least one heat generating component which generates heat when operated, at least one temperature-sensitive component, and one or more hollow insulation regions arranged between the at least one heat generating component and the at least one temperature-sensitive component. The hollow insulation region may be provided as a vacuum gap.

Abstract: The invention relates to a method for preparing an aqueous-based dispersion of metal nanoparticles comprising: (a) providing an aqueous suspension of a metal salt; (b) pre-reducing the metal salt suspension by a water soluble polymer capable of metal reduction to form a metal nuclei; and (c) adding a chemical reducer to form metal nanoparticles in dispersion. The invention further relates to aqueous-based dispersions of metal nanoparticles, and to compositions such as ink comprising such dispersions.

Abstract: After a copper interconnection is formed above a substrate, a surface of the copper interconnection is activated by performing acid cleaning. Thereafter, the substrate is immersed in a BTA (Benzo triazole) aqueous solution to form a protection film covering the surface of the copper interconnection. At this time, Cu—N—R bonds (R is an organic group) are formed in grain boundary portions in the surface of the copper interconnection. Thereafter, the protection film is removed by performing alkaline cleaning. The Cu—N—R bonds remain in the grain boundary portions in the surface of the copper interconnection even after the protection film is removed. Subsequently, the surface of the copper interconnection is subjected to an activation process, and a barrier layer is formed thereafter by electroless-plating the surface of the copper interconnection with NiP or CoWP.

Abstract: A method for producing a conductive film, having the steps: forming, on a support, a conductive metal portion containing a conductive material and a binder; bringing the conductive metal portion into contact with vapor or a hot water; and immersing the conductive metal portion into hot water having a temperature of 40° C. or higher.

Abstract: This invention provides an aqueous primer composition which comprises (A) an aqueous dispersion of modified polyolefin which comprises an unsaturated carboxylic acid- or acid anhydride-modified polyolefin (a) having a melting point of 120° C. or lower and a weight average molecular weight of 30,000 to 180,000, dispersed in an aqueous medium, (B) an ionic functional group-containing acrylic resin, and (C) a conductive carbon-containing pigment, and which forms a coating film with an L value of 35 or more and a surface resistivity of 1×108?/? or less.

Abstract: There are provided a method of fabricating a thin metal film electrode and a thin metal film electrode fabricated by the same. The method of fabricating a thin metal film electrode according to an embodiment of the present invention includes applying a metal paste including a metal powder and a dispersant to a substrate to form a thin metal film; and subjecting the thin metal film to reduction firing in an atmosphere containing an organic acid and an aqueous solution in a ratio ranging from 10:90 to 90:10.

Abstract: There are disclosed a nanocomposite powder for an inner electrode of a multilayer ceramic electronic device and a manufacturing method thereof. The nanocomposite powder for an inner electrode of a multilayer ceramic electronic device includes a first metal particle having electrical conductivity, and a second metal coating layer formed on a top surface or a bottom surface of the first metal particle and having a higher melting point than that of the first metal particle.

Abstract: Provided is a substrate structure including: a base substrate on which a conductive pattern is formed; a first plating layer covering the conductive pattern; and a second plating layer covering the first plating layer, wherein the first plating layer includes an electroless reduction plating layer.

Abstract: A method for producing electrical components for electrical contacts, and such a component are provided. To achieve simpler production of a partial surface treatment, which likewise exhibits optimal current carrying capacity, with minimum material use of noble metals, the entirety of the components are provided with an electrically insulating passivation layer, and the passivation is then removed chemically or mechanically at the contact points of the components. The entire components are put into an electrolytic bath, and a noble metal is deposited only on the parts of the components from which the passivation layer has been removed.

Abstract: Disclosed herein is a method for forming a metal wiring and an electrode using a metal nano paste, including a sintering process, wherein the sintering includes: placing a substrate on which a metal nano paste is printed in a furnace and raising a temperature of the furnace to 220 to 240° C. under a nitrogen atmosphere; heating the substrate under a mixed atmosphere of carboxylic acid and air while the temperature of the furnace is maintained at the temperature range; dropping the temperature of the furnace to 100 to 150° C. under the mixed atmosphere of carboxylic acid and air; and dropping the temperature of the furnace to room temperature under a nitrogen atmosphere. According to the present invention, a metal film having high density and a minimized amount of residual metal particles can be formed despite a low-temperature sintering process, like a case where a high-temperature sintering process is employed.

Abstract: A separator substrate include a substrate having a bulk portion and a surface portion, the surface portion having at least one porous area with a net charge; and ionic particles coupling to at least a part of the at least one porous area. The ionic particles have a net charge of an opposite sign to the net charge of the at least one porous area. The coupling between the part of the at least one porous area and the ionic particles may result in at least one of a good electrochemical performance, chemical stability, thermal stability, wettability, and mechanical strength of the separator substrate.

Abstract: There are provided a conductive paste composition for an internal electrode, and a multilayer ceramic capacitor comprising the same and a manufacturing method thereof. The conductive paste composition includes a metal powder, a dispersant made of an acrylic polymer having a weight average molecular weight of 500 to 5,000, and at least one organic binder selected from a group consisting of a polyvinylbutyral resin and a cellulose resin. The conductive paste composition for an internal electrode has superior dispersibility of the metal powder in the paste.

Abstract: A cap metal forming method capable of obtaining a uniform film thickness on the entire surface of a substrate is provided. The method for forming a cap metal on a copper wiring formed on a processing target surface of a substrate includes: holding the substrate so as to be rotatable; rotating the substrate in a processing target surface direction of the substrate; locating an end portion of an agitation member so as to face the processing target surface of a periphery portion of the substrate with a preset gap maintained therebetween; supplying a plating processing solution onto the processing target surface; and stopping the supply of the plating processing solution and moving the agitation member such that the end portion of the agitation member is separated away from the processing target surface of the substrate.

Abstract: A method and system for providing a magnetic element and a magnetic memory utilizing the magnetic element are described. The magnetic element is used in a magnetic device that includes a contact electrically coupled to the magnetic element. The method and system include providing pinned, nonmagnetic spacer, and free layers. The free layer has an out-of-plane demagnetization energy and a perpendicular magnetic anisotropy corresponding to a perpendicular anisotropy energy that is less than the out-of-plane demagnetization energy. The nonmagnetic spacer layer is between the pinned and free layers. The method and system also include providing a perpendicular capping layer adjoining the free layer and the contact. The perpendicular capping layer induces at least part of the perpendicular magnetic anisotropy in the free layer. The magnetic element is configured to allow the free layer to be switched between magnetic states when a write current is passed through the magnetic element.

Abstract: The present invention relates to a solution and a process for activating the surface of a substrate comprising at least one area formed from a polymer, for the purpose of subsequently covering it with a metallic layer deposited via an electroless process. According to the invention, this composition contains: A) an activator formed from one or more palladium complexes; B) a binder formed from one or more organic compounds chosen from compounds comprising at least two glycidyl functions and at least two isocyanate functions; C) a solvent system formed from one or more solvents capable of dissolving said activator and said binder. Application: Manufacture of electronic devices such as, in particular, integrated circuits, especially in three dimensions.

Abstract: Particulated structures and their method of manufacture for use in an electrical generator employing gas-mediated charge transfer are disclosed. The structures comprise a multiplicity of particles which contain voids between first and second opposing surfaces of said particles. At least a portion of said opposing surfaces are modified such that the charge transferability of said first opposing surfaces differs from the charge transferability of said second opposing surfaces.

Abstract: A layer or layers for use in package substrates and die spacers are described. The layer or layers include a plurality of ceramic wells lying within a plane and separated by metallic vias. Recesses within the ceramic wells are occupied by a dielectric filler material.