Abstract: An electrostatic chuck 10 includes an electrostatic electrode 14 embedded in a ceramic base 12 having a wafer-supporting surface 12a capable of holding a wafer W, the electrostatic electrode 14 being parallel to the wafer-supporting surface 12a. The ceramic base 12 is composed of a dense ceramic having a MgO content of 99% by weight or more. The electrostatic electrode 14 is a disc-like electrode composed of, for example, at least one metal selected from the group consisting of Ni, Co, and Fe. The electrostatic electrode 14 includes a conductive tablet 16 connected to the center thereof. The tablet 16 is exposed at the bottom of a counter-bored hole 18 formed so as to reach the tablet 16 from a back surface 12b of the ceramic base 12, and is connected to a feeding terminal 20, composed of Ni, inserted into the counter-bored hole 18.

Abstract: A process for preparing stabilized metal nanoparticles, the process comprising reacting a metal compound with a reducing agent in the presence of a stabilizer in a reaction mixture comprising the metal compound, the reducing agent, and the stabilizer, wherein the reaction mixture is substantially free of solvent, to form a plurality of metal-containing nanoparticles during the solvent-free reduction process with molecules of the stabilizer on the surface of the metal-containing nanoparticles.

Abstract: Disclosed is a metal pattern composition including a conductive metal or a conductive metal precursor compound, and a carboxylic acid-amine base ion pair salt.

Abstract: A flexible display comprises a flexible substrate made of plastic material, a display element on a first surface of the flexible substrate, and a surface residual film containing at least one of a metal material or a metal oxide material. The surface residual film is bonded to at least a part of a second surface of the flexible substrate. The second surface is opposed to the first surface. A method for manufacturing a flexible display comprises preparing a glass substrate, forming adhesive material film on the glass substrate, the adhesive material film being made of at least one of a metal material or a metal oxide material, and forming a flexible substrate from plastic material on the adhesive material film.

Abstract: Surface metallization technology for ceramic substrates is disclosed herein. It makes use of a known phenomenon that many metal-metal oxide alloys in liquid state readily wet an oxide ceramic surface and strongly bond to it upon solidification. To achieve high adhesion strength of a metallization to ceramic, a discrete metallization layer consisting of metal droplets bonded to ceramic surface using metal-metal oxide bonding process is produced first. Next, a continuous metal layer is deposited on top of the discrete layer and bonded to it using a sintering process. As a result a strongly adhering, glass-free metallization layer directly bonded to ceramic surface is produced. In particular, the process can be successfully used to metallize aluminum nitride ceramic with high thermal and electrical conductivity copper metal.

Abstract: Under one aspect, a method of making a superconductor wire includes providing an oxide superconductor layer overlaying a substrate; forming a substantially continuous barrier layer over the oxide superconductor layer, the barrier layer including metal; depositing a layer of metal particles over the barrier layer, said depositing including applying a liquid including metal particles over the barrier layer; and sintering the layer of metal particles to form a substantially continuous metal layer over the barrier layer. In one or more embodiments, the oxide superconductor layer is oxygen-deficient, and the method may include oxidizing the oxygen-deficient oxide superconductor layer. At least a portion of the sintering and the oxidizing may occur simultaneously, for example by performing them at an oxygen partial pressure and a temperature sufficient to both sinter the metal particles and to oxidize the oxygen-deficient oxide superconductor layer.

Abstract: A metal material (10), having an electrical conductive substrate 1; a surface layer 2 having tin or tin alloy formed on the electrical conductive substrate 1; and an organic coating 3 formed on the surface layer 2, organic coating 3 being formed with an organic compound including an ether linking group.

Abstract: An electrically conductive article including a substrate and at least one electrically conductive layer disposed on the substrate. The conductive layer may include a thermoplastic resin and from about 1 to 30 weight percent of at least one conductive additive based on a total weight of the thermoplastic resin and the at least one conductive additive. The conductive article may have a surface resistance between 0.001 to 20? at a test distance of 2.54 cm (1 inch).

Abstract: The present invention relates to a method for making a thermoacoustic device. The method includes the following steps. A substrate with a surface is provided. A plurality of microspaces is formed on the surface of the substrate. A sacrifice layer is fabricated to fill the microspaces. A metal film is deposited on the sacrifice layer, and the sacrifice layer is removed. A signal input device is provided to electrically connect with the metal film.

Abstract: A transfer medium manufacturing method for manufacturing a transfer medium in which a foil forming recording material containing metallic particles capable of being transferred onto a target has been applied to a base material includes: applying the foil forming recording material to the base material; and smoothing the surface of the foil forming recording material applied to the base material in the applying, the foil forming recording material being in a partially-melted state.

Abstract: The present invention discloses a plastic potentiometric ion-selective sensor based on field-effect transistors which can be fabricated to form the miniaturized component via sputtering and/or printing method. A plastic potentiometric ion-selective sensor doesn't need an additional bias voltage to convert the signals. The disclosed plastic sensor comprises a plastic substrate, at least one working electrode formed on the plastic substrate, a reference electrode printed on the substrate, and a golden finger printed on the plastic substrate. The golden finger is for electrically coupling with the external world and for outward transmission of signals detected at the working electrode and the reference electrode. The disclosed plastic potentiometric ion-selective sensor is replaceable.

Abstract: The present invention provides an improved electrostatic chuck for a substrate processing system. The electrostatic chuck comprising a main body having a top surface configured to support the substrate, a power supply to apply a voltage to the main body and a sealing ring disposed between the main body and the substrate wherein the sealing ring has a conductive layer.

Abstract: A method is provided which includes forming a metal layer and converting at least a portion of the metal layer to a hydrated metal oxide layer. Another method is provided which includes selectively depositing a dielectric layer upon another dielectric layer and selectively depositing a metal layer adjacent to the dielectric layer. Consequently, a microelectronic topography is formed which includes a metal feature and an adjacent dielectric portion comprising lower and upper layers of hydrophilic and hydrophobic material, respectively. A topography including a metal feature having a single layer with at least four elements lining a lower surface and sidewalls of the metal feature is also provided herein. The fluid/s used to form such a single layer may be analyzed by test equipment configured to measure the concentration of all four elements. In some cases, the composition of the fluid/s may be adjusted based upon the analysis.

Abstract: The present invention relates to an enhanced sequential atomic layer deposition (ALD) technique suitable for deposition of barrier layers, adhesion layers, seed layers, low dielectric constant (low-k) films, high dielectric constant (high-k) films, and other conductive, semi-conductive, and non-conductive films. This is accomplished by 1) providing a non-thermal or non-pyrolytic means of triggering the deposition reaction; 2) providing a means of depositing a purer film of higher density at lower temperatures; and, 3) providing a faster and more efficient means of modulating the deposition sequence and hence the overall process rate resulting in an improved deposition method.

Abstract: The present invention relates to electrodes for a lithium secondary battery with a high energy density and a secondary battery with a high energy density using the same. A negative electrode includes a material which can be alloyed with lithium alloy. A positive electrode is made of a transition metal oxide which can reversibly intercalate or deintercalate lithium. Here, the entire reversible lithium storage capacity of the positive electrode is greater than the capacity of lithium dischargeable from the positive electrode. Further, the present invention relates to electrodes for a lithium secondary battery in which metal lithium is coated on a negative electrode, a positive electrode, or both, a method of manufacturing the electrodes, and a lithium secondary battery including the electrodes. The lithium secondary battery of the present invention is excellent in safety because metal lithium does not remain after being activated and excellent in a capacity per unit weight.

Abstract: A composite includes a thermally conductive metal matrix and silicone particles dispersed therein. The composite can be used to form a thermal interface material in an electronic device. The composite can be used for both TIM1 and TIM2 applications.

Abstract: This disclosure provides (a) methods of making an oxide layer (e.g., a dielectric layer) based on titanium oxide, to suppress the formation of anatase-phase titanium oxide and (b) related devices and structures. A metal-insulator-metal (“MIM”) stack is formed using an ozone pretreatment process of a bottom electrode (or other substrate) followed by an ALD process to form a TiO2 dielectric, rooted in the use of an amide-containing precursor. Following the ALD process, an oxidizing anneal process is applied in a manner is hot enough to heal defects in the TiO2 dielectric and reduce interface states between TiO2 and electrode; the anneal temperature is selected so as to not be so hot as to disrupt BEL surface roughness. Further process variants may include doping the titanium oxide, pedestal heating during the ALD process to 275-300 degrees Celsius, use of platinum or ruthenium for the BEL, and plural reagent pulses of ozone for each ALD process cycle.

Abstract: A near-field light generating device includes: a waveguide; a buffer layer disposed on the top surface of the waveguide; an adhesion layer that is formed by incompletely oxidizing a metal layer and disposed on the buffer layer; and a near-field light generating element disposed on the adhesion layer. The adhesion layer has a resistance-area product higher than that of the metal layer unoxidized and lower than that of a layer that is formed by completely oxidizing the metal layer. A layered structure consisting of the buffer layer, the adhesion layer and the near-field light generating element has a peel-test adhesive strength higher than that of a layered structure consisting of the buffer layer and the near-field light generating element.

Abstract: A sensor includes a first support having at least one opening; a metal-containing nanomembrane associated with the at least one opening and configured to interact with at least one molecular species; and at least one electrode configured to sense one or more interactions of the at least one molecular species with the metal-containing nanomembrane.

Abstract: A method of manufacturing a solenoidal magnet structure, includes the step of providing a collapsible accurate mold in which to wind the coils winding wire into defined positions in the mold, placing a mechanical support structure over the coils so wound, impregnating the coils and the mechanical support structure with a thermosetting resin, allowing the thermosetting resin to harden, and collapsing the mold and removing the resultant solenoidal magnet structure formed by the resin impregnated coils and the mechanical support structure from the mold as a single solid piece.

Abstract: A method of forming a diffusion barrier for use in semiconductor device manufacturing includes depositing, by a physical vapor deposition (PVD) process, an iridium doped, tantalum based barrier layer over a patterned interlevel dielectric (ILD) layer, wherein the barrier layer is deposited with an iridium concentration of at least 60% by atomic weight such that the barrier layer has a resulting amorphous structure.

Abstract: The present invention relates to a method of producing a electrical contact element, in which a multilayer structure is formed by applying a diffusion barrier layer to a base material and at least one metallic layer made of a metal to the diffusion barrier layer, at least one layer formed of tin being applied as the metallic layer. The present invention further relates to an electrical contact element with an electrically conductive base material and a coating which is formed on at least one portion of the electrically conductive base material, the coating having a diffusion barrier layer formed on the base material and the outer layer containing tin.

Abstract: The invention relates to a method for the production of a sealing region of a discharge lamp, wherein the sealing region comprises a first (12) and a second (14) sealing region section and between the production of the first and the second sealing regions a shell (30) made of a material is applied to the sealed element.

Abstract: A methanol oxidation catalyst is provided, which includes nanoparticles having a composition represented by the following formula 1: PtxRuyTzQu ??formula 1 In the formula 1, the T-element is at least one selected from a group consisting of Mo, W and V and the Q-element is at least one selected from a group consisting of Nb, Cr, Zr and Ti, x is 40 to 90 at. %, y is 0 to 9.9 at. %, z is 3 to 70 at. % and u is 0.5 to 40 at. %. The area of the peak derived from oxygen bond of T-element is 80% or less of the area of the peak derived from metal bond of T-element in a spectrum measured by an X-ray photoelectron spectral method.

Abstract: There is provided a conductive material comprising a base material made up of a Cu strip, a Cu—Sn alloy covering layer formed over a surface of the base material, containing Cu in a range of 20 to 70 at. %, and having an average thickness in a range of 0.1 to 3.0 ?m, and an Sn covering layer formed over the Cu—Sn alloy covering layer having an average thickness in a range of 0.2 to 5.0 ?m, disposed in that order, such that portions of the Cu—Sn alloy covering layer are exposed the surface of the Sn covering layer, and a ratio of an exposed area of the Cu—Sn alloy covering layer to the surface of the Sn covering layer is in a range of 3 to 75%. The surface of the conductive material is subjected to a reflow process, and preferably, an arithmetic mean roughness Ra of the surface of the material, in at least one direction, is not less than 0.15 ?m while the arithmetic mean roughness Ra thereof, in all directions, is not more than 3.

Abstract: A pillar for flip chip interconnect in an electronic package. The pillar includes an electrically conductive material and a solder wicking inhibitor deposited on the sides of the pillar. The pillar also includes an exposed face for contacting the electrically conductive material and solder material on the substrate. In another embodiment, a method of forming a pillar composed of an electrically conductive material which inhibits solder wicking is provided. The method includes coating the pillar with a solder wicking inhibitor and polishing a face of the pillar to expose the underlying electrically conductive material.

Abstract: An electronic device bond pad includes an Al layer located over an electronic device substrate. The Al layer includes an intrinsic group 10 metal located therein.

Abstract: It is an object of the present invention to provide a conductive particle which has low initial connection resistance and which is hard to increase in connection resistance even when stored for a long period. The present invention is a conductive particle comprising a copper layer formed on a surface of a resin particle, wherein in the copper layer, an area ratio of an area corresponding to voids in a cross-section in a thickness direction is 5% or less, and copper composing the copper layer has an average crystallite diameter of 40 nm or more.

Abstract: A method of producing a ultrahydrophobic substrate provided on its surface with metallic nanoparticles comprising the steps of furnishing a ultrahydrophobic substrate, applying a precursor layer on said substrate with deposition of metallic nanoparticles from the precursor layer on the substrate. The precursor layer is preferably free of electronic conductive particles and the particles are preferably deposited electrochemically from the precursor layer.

Abstract: Disclosed is a method for preparing an electrode having an electrochemical catalyst layer, comprising the steps of: providing a substrate having a conductive layer thereon, immersing the substrate in a first solution having a conditioner to form a conditioner layer on the surface of the conductive layer, and immersing the substrate in a second solution having polymer-capped noble metal nanoclusters to form an electrochemical catalyst layer on the conditioner layer of the substrate. This method can reduce the amount of noble metal used in the electrochemical catalyst layer and is suitable for mass production.

Abstract: Provided is a transparent conductive film exhibiting high conductivity together with excellent transparency, and also exhibiting film strength tolerant to a washing treatment and a pattern forming treatment while maintaining conduction to an electronic device layer formed on an transparent conductive layer. Also disclosed is a method of manufacturing a transparent conductive film possessing a transparent substrate and provided thereon, a transparent conductive layer containing a metal nanowire, possessing the steps of forming a layer containing a crosslinking agent on the substrate, coating a coating solution containing a metal nanowire onto the layer containing the crosslinking agent, drying the coating solution, and conducting a treatment by which the crosslinking agent is reacted.

Abstract: A flexible substrate layer having metallic bus-lines and connecting stitches is formed. A trace layer having electrical traces and thermal vias is also formed. The substrate layer and the trace layer are bonded together by way of respective thermal pathways and electrically interconnected. The resulting layer-wise assembly is configured to support and electrically interconnect an array of photovoltaic cells and to channel away heat during operation.

Abstract: A lithium metal thin-film battery composite structure is provided that includes a combination of a thin, stable, solid electrolyte layer [18] such as Lipon, designed in use to be in contact with a lithium metal anode layer; and a rapid-deposit solid electrolyte layer [16] such as LiAlF4 in contact with the thin, stable, solid electrolyte layer [18]. Batteries made up of or containing these structures are more efficient to produce than other lithium metal batteries that use only a single solid electrolyte. They are also more resistant to stress and strain than batteries made using layers of only the stable, solid electrolyte materials. Furthermore, lithium anode batteries as disclosed herein are useful as rechargeable batteries.

Abstract: The fabrication and use of a multifunctional micropipette biological sensor for in-situ detection of temperature changes, ion conductivity, and light is described herein.

Abstract: A method for producing a solid electrolyte material region for a memory element of a solid electrolyte memory cell. A first material is formed in substantially pure form. A thermal treatment is carried out in the presence of at least one second material, and the chalcogenide material of the solid electrolyte material region thereby being produced.

Abstract: A radiation detector (100) includes an array of scintillator pixels (102) in optical communication with a photosensor. The scintillator pixels (102) include a hygroscopic scintillator (104) and one or more hermetic covers (106a, 106b). A desiccant (124) may be disposed between a hermetic cover (106a) and the scintillator (104) or between the hermetic covers (106a, 106b).

Abstract: The invention provides a film comprising a polymer dispersed liquid crystal (PDLC) which exists independently from a substrate, i.e. a substrate-free PDLC; a fiber, a fabric, and a device thereof; and methods thereof. In an embodiment, a mixture comprising liquid crystal and monomers floats and is spread over a liquid base, before polymerization the mixture into a layer of polymer matrix dispersed with liquid crystal domains. The invention exhibits numerous technical merits such as improved transmittance, enhanced brightness, easier manufacturability, more flexible manufacturability, better cost-effectiveness, enhanced electro-optical performance, and improved device uniformity, among others.

Abstract: A method for producing an electrically conductive connection between a first surface of a semiconductor substrate and a second surface of the semiconductor substrate includes producing a hole, forming an electrically conductive layer that includes tungsten, removing the electrically conductive layer from the first surface of the semiconductor substrate, filling the hole with copper and thinning the semiconductor substrate. The hole is produced from the first surface of the semiconductor substrate into the semiconductor substrate. The electrically conductive layer is removed from the first surface of the semiconductor substrate, wherein the electrically conductive layer remains at least with reduced thickness in the hole. The semiconductor substrate is thinned starting from a surface, which is an opposite surface of the first surface of the semiconductor substrate, to obtain the second surface of the semiconductor substrate with the hole being uncovered at the second surface of the semiconductor substrate.

Abstract: The nanoscale architecture of anode materials and the process for forming an anode for a lithium ion battery is provided along with an apparatus. The anodes comprise aligned nanorods of metals which are formed on metallic substrates. When used as the anodes in a lithium-ion battery, the resulting battery demonstrates higher energy storage capacity and has greater capability to accommodate the volume expansion and contraction during repeated charging and discharging.

Abstract: A plated material 5, containing: on a conductive substrate 1, an underlayer 2 composed of nickel and the like; an intermediate layer 3 composed of Cu or a Cu alloy being provided thereon; and an outermost layer 4 composed of a Cu—Sn intermetallic compound being provided thereon; and an electric or electronic part using the same.

Abstract: A nickel thin film is formed, for example, to a thickness of 2 nm or more on a polyethylene naphthalate substrate by a vacuum evaporation method. A magnetoresistance effect element using ferromagnetic nano-junction is comprised by using two laminates each comprising a nickel thin film formed on a polyethylene naphthalate substrate, and joining these two laminates so that the nickel thin films cross to each other in such a manner that edges of the nickel thin films face each other.

Abstract: An effective sensor for indicating exposure to a toxic gas includes a non-conductive, inert substrate such as glass or polyethylene, a two-dimensional film of nanoparticles of a conductive metal such as silver or copper on the substrate and an electrode connected to each end of the film. When an electrical current passes through the film and the sensor is exposed to a toxic gas, changes in the electrical resistance of the film provides an indication of the presence of the toxic gas.

Abstract: A thermoelectric device may include a thermoelectric element including a layer of a thermoelectric material and having opposing first and second surfaces. A first metal pad may be provided on the first surface of the thermoelectric element, and a second metal pad may be provided on the second surface of the thermoelectric element. In addition, the first and second metal pads may be off-set in a direction parallel with respect to the first and second surfaces of the thermoelectric element. Related methods are also discussed.

Abstract: A conductor composition being able to easily secure the conductivity at the same level as an Ag bulk at low temperature process, a mounting substrate utilizing the conductor composition and a mounting structure utilizing the conductor composition are provided. In a mounting structure, wherein one or more electrodes (11) of a mounting substrate (10) and one or more surface mounting components (20) are connected through a conductor composition (30), and one or more surface wirings (14) of the mounting substrate (10), one or more inner-layer wirings (13) and one or more via conductors (12) are formed with the conductor composition, the conductor composition contains conductive particles with electrical conductivity, and the conductive particles are composed of low crystallized Ag fillers with the crystal size of 10 ?m or less.

Abstract: Prior electrochromic devices frequently suffer from poor reliability and poor performance. Some of the difficulties result from inappropriate design and construction of the devices. In order to improve device reliability two layers of an electrochromic device, the counter electrode layer and the electrochromic layer, can each be fabricated to include defined amounts of lithium. Further, the electrochromic device may be subjected to a multistep thermochemical conditioning operation to improve performance. Additionally, careful choice of the materials and morphology of some components of the electrochromic device provides improvements in performance and reliability. In some devices, all layers of the device are entirely solid and inorganic.

Abstract: A composition that may be used to form an electronic circuit element includes metal nanoparticles in a metal nanoparticle solution, at least a low-polarity additive and a solvent. The low-polarity additive is either a styrenated terpene resin or a polyterpene resin. The composition may be used to form conductive features on a substrate by depositing the composition onto a substrate, and heating the deposited composition on the substrate to a temperature from about 80° C. to about 200° C. to form conductive features on the substrate.

Abstract: The present invention discloses a thin film multi-band antenna, which is formed by PVD-Roll to Roll process and is formed of metal-oxide, conductive polymer, conductive glue or CNT. In another aspect, the present invention discloses a manufacturing method of thin film antenna, comprising preparing gel, followed by coating the gel on a substrate to form a transparent thin film. Thermal process is performed to heat the thin film. The gel includes vinyl oxide and metal compounds, wherein the vinyl oxide includes PEO having In(NO)3.3H2O, In(Ac)3, SnCl2.2H2O, or Sn(C2O4) contained thereof.

Abstract: A method for manufacturing a carbon nanotube field emission cathode includes the steps of: providing a substrate (110) with a metallic layer (130) thereon; defining holes (131) in the metallic layer; oxidizing the metallic layer to form a metallic oxide layer (132) thereon; removing portions of the metallic oxide layer in the holes so as to expose corresponding portions of the metallic layer; forming a metal-salt catalyst layer (580) on the exposed portions of the metallic layer in the holes; and growing carbon nanotubes (690) on the substrate in the holes.

Abstract: The process of the present invention for producing a metal film includes: forming an organic film using a primer composition containing an addition polymerizable compound including three or more reactive groups, an acid group-including addition polymerizable compound, and a hydrophilic functional group-including addition polymerizable compound; forming a metal (M1) salt from the acid group; substituting the metal (M1) salt of the acid group with a metal (M2) salt by processing the organic film with a metal (M2) ion aqueous solution containing a metal (M2) ion having less ionization tendency than the metal (M1) ion; reducing the metal (M2) ion so that a metal film is formed on a surface of the organic film; and oxidizing the metal film. This provides (i) a process for producing a metal film and a metal pattern, at low cost, on an arbitrary substrate, (ii) a metal film, and (iii) use of the meta film.

Abstract: A composition that may be as an electronic circuit element includes a metal nanoparticle, an adhesion promoter compound and a solvent. The adhesion promoter compound may be a hydrolytic silane with at least one organic functional moiety. A method of forming conductive features on a substrate includes depositing a composition containing metal nanoparticles, an adhesion promoter compound and a solvent onto a substrate, and heating the deposited composition to a temperature from about 100° C. to about 200° C.