Abstract: A composite particle for a lithium secondary battery positive electrode including a coated active material particle and a binder, wherein the coated active material particle includes a positive electrode active material particle and a coating material that coats a surface of the positive electrode active material particle, and the coating material contains a coating polymer having a specific SP value and optionally a conducting agent; and constituents of the secondary battery and a secondary battery using the same, and methods for producing the same.

Abstract: An electronic component for high-temperature applications includes a ceramic carrier and a semiconductor element. The ceramic carrier comprises a ceramic substrate having a content of alkali metal compounds of ?0.5%, more particularly ?0.05%, and the ceramic substrate is selected from the group consisting of: a ceramic substrate comprising aluminium oxide, anorthite, a filler having a coefficient of thermal expansion of ?4.0*10?6K?1 and glass; a ceramic substrate comprising aluminium oxide, celsian, a filler having a coefficient of thermal expansion of ?4.0*10?6K?1 and glass; and a ceramic substrate comprising an alkaline earth metal silicate glass having a silicon dioxide content of >50 mol %, boron oxide, and a filler having a coefficient of thermal expansion of <4.0*10?6K?1. The component prevents temperature damage at high temperatures and has constant properties, such as electrical insulation properties, up to 500° C.

Abstract: A metal seed composition useful in seeding a metal diffusion barrier or conductive metal layer on a semiconductor or dielectric substrate, the composition comprising: a nanoscopic metal component that includes a metal useful as a metal diffusion barrier or conductive metal; an adhesive component for attaching said nanoscopic metal component on said semiconductor or dielectric substrate; and a linker component that links said nanoscopic metal component with said adhesive component. Semiconductor and dielectric substrates coated with the seed compositions, as well as methods for depositing the seed compositions, are also described.

Abstract: A method of preparing a fiber including electro-spinning onto a substrate polymer solutions from a plurality of jets to form a network of filaments, wherein at least one jet sprays onto the substrate a first chemical mixture including a carbon fiber precursor compound, and at least one other jet sprays onto the substrate a second chemical mixture comprising a sacrificial polymer and a precursor compound of a functional material; and processing the filaments on the substrate, thereby forming an arrangement of carbon fibers having the functional material deposited thereon.

Abstract: In applications such as manufacture of shielded radio-frequency modules where costly metallic paint is sprayed to form a conductive layer, it is desirable to reduce the amount of paint being utilized, and to maintain an acceptable level of suspension of paint particles in solution. A closed recirculation system can be configured to provide such desirable features, and can include a reservoir for holding a volume of metallic paint, a spray apparatus for spraying metallic paint received from the reservoir, and a recirculator for recirculating the metallic paint that is not sprayed back to the reservoir. In some embodiments, the recirculator can include a compact peristaltic pump that allows use of shorter fluid paths in the closed recirculation system, as well as a desired level of agitation to quickly achieve the acceptable level of suspension and maintain the suspension for an extended period of time.

Abstract: A lamination includes: a substrate formed of aluminum or aluminum alloy; an intermediate layer formed of any one metal or nonmetal selected from the group consisting of silver, gold, chromium, iron, germanium, manganese, nickel, silicon, and zinc, or an alloy containing the any one metal, on a surface of the substrate; and a film layer formed by accelerating powder material of copper or copper alloy together with gas heated to a temperature lower than a melting point of the powder material and spraying and depositing a solid-phase powder material onto a surface of the intermediate layer.

Abstract: Embodiments of the invention provide a touch sensor, a manufacturing method thereof and a liquid crystal display having touch panel. The touch sensor comprises a substrate, a touch sensing layer in a first direction, a touch sensing layer in a second direction perpendicular to the first direction, an insulation layer and a metal bridge. The touch sensing layers in the first and second directions are provided on a surface of the substrate, the touch sensing layer in the first direction is discontinuous, and the touching sensing layer in the second direction is continuous. The insulation layer is provided on the substrate, the touch sensing layer in the first direction and the touch sensing layer in the second direction. The metal bridge is provided on the insulation layer and connects with the touch sensing layer in the first direction.

Abstract: A current source and method of producing the current source are provided. The current source includes a metal source, a buffer layer, a filter and a collector. An electrical connection is provided to the metal layer and semiconductor layer and a magnetic field applier may be also provided. The source metal has localized states at a bottom of the conduction band and probability amplification. The interaction of the various layers produces a spontaneous current. The movement of charge across the current source produces a voltage, which rises until a balancing reverse current appears. If a load is connected to the current source, current flows through the load and power is dissipated. The energy for this comes from the thermal energy in the current source, and the device gets cooler.

Abstract: The invention relates to microscopic structures and methods of making and using the structures. A method of forming a microscopic structure of a material includes obtaining a solution (310) containing the material, establishing a flowing stream of the solution (310) in a capillary (104), wherein the capillary (104) has an inner dimension that is smaller than about 300 micrometers, and maintaining the stream until a layer is built up along an inner wall of the capillary (104) from material deposited from the flowing stream, thereby forming a microscopic structure.

Abstract: The present invention relates to an electrostatic discharge protection device. The electrostatic discharge protection device in accordance with an embodiment of the present invention includes a substrate, an electrostatic discharge absorbing layer having a plating film formed on the substrate, electrodes disposed on the substrate to be spaced apart from each other by a predetermined interval with the electrostatic discharge absorbing layer interposed therebetween, and an insulating layer for covering the substrate and the electrodes.

Abstract: A conductive member containing a base material and a conductive layer provided on the base material, wherein the conductive layer includes (i) a metallic nanowire having an average short-axis length of 150 nm or less and (ii) a binder, the binder including a three-dimensional crosslinked structure that includes a partial structure represented by the following Formula (Ia) and a partial structure represented by the following Formula (IIa) or Formula (IIb). In the Formulae, each of M1 and M2 independently represents an element selected from the group consisting of Si, Ti and Zr. Each R3 independently represents a hydrogen or a hydrocarbon group.

Abstract: A method for manufacturing a touch screen panel includes forming a basic pattern of patterning first electrodes along a first direction on a substrate, second electrodes along a second direction crossing the first direction, and a first connecting pattern connecting the first electrodes, forming insulating layers of patterning insulating layers over the first connecting pattern, and forming a second connecting pattern of patterning a second connecting pattern in an electrohydrodynamic (EHD) ink jetting type such that the second connecting pattern connecting the second electrodes pass over the insulating layers.

Abstract: A method includes forming a master embossing roller to have a predetermined pattern, coating a flexible unpatterned substrate with a catalyst coating layer and forming a corresponding pattern in the coated substrate using the master embossing roller to thereby form a patterned substrate. The method may also include electrolessly plating the patterned substrate.

Abstract: A method of printing articles having variable conductivities, including those having conductivity gradients.

Abstract: A method of forming a colored appearance suitable for forming a colored appearance for a conductive casing of a connector is provided. The conductive casing has a body and at least one lead. The lead extends from the body. The method of forming a colored appearance includes the following steps. A surface of the conductive casing is roughened. A conductive metal layer is formed on the roughened surface of the conductive casing. A shielding layer is formed on a part of the conductive metal layer located on the lead. A colorful conductive layer is formed on the conductive casing. The shielding layer and a part of the colorful conductive layer located on the shielding layer are removed to expose the part of the conductive metal layer on the lead. Therefore, the conductive casing has a colored appearance.

Abstract: This disclosure generally relates to a device with a monolayer of metal nanoparticles and a method for making the same. The nanoparticles of the monolayer of metal nanoparticles are grouped in an ultrahigh density with an average distance between each neighboring metal nanoparticle less than or equal to about 3 nanometers. The monolayer can be self-assembled on a substrate to facilitate controllable voltage shifts within the device.

Abstract: A method is provided which includes forming a metal layer and converting at least a portion of the metal layer to a hydrated metal oxide layer. Another method is provided which includes selectively depositing a dielectric layer upon another dielectric layer and selectively depositing a metal layer adjacent to the dielectric layer. Consequently, a microelectronic topography is formed which includes a metal feature and an adjacent dielectric portion comprising lower and upper layers of hydrophilic and hydrophobic material, respectively. A topography including a metal feature having a single layer with at least four elements lining a lower surface and sidewalls of the metal feature is also provided herein. The fluid/s used to form such a single layer may be analyzed by test equipment configured to measure the concentration of all four elements. In some cases, the composition of the fluid/s may be adjusted based upon the analysis.

Abstract: An improvement in apparatus and methods of making electrical machines, utilizing a combination of additive manufacturing techniques to create, in particular, small, high efficiency stators, but also useful for making complex rotor structures.

Abstract: A liquid composition for forming an activator-containing layer on a substrate, for activating a chemical reaction to produce a solid layer on the substrate, comprises activator, surfactant and solvent and/or binder. The liquid composition is deposited on a surface of a substrate, desirably by inkjet printing. The layer is used to activate a chemical reaction to produce a solid layer on the substrate surface, e.g. a layer of conductive metal. The surfactant in the liquid composition has beneficial effects on the behavior of the liquid composition when applied to certain substrates.

Abstract: Provided is a technique for electroless deposition (ELD) for forming metal conductive layer on an insulating substrate made of glass, polymer, etc. According to an aspect, an adhesive layer and a catalyst layer are formed on a substrate using a dry deposition method, such as are plasma deposition (APD) or sputtering, etc., and electroless deposition is performed thereon, thereby forming a metal thin, film. Therefore, it is possible to significantly simplify a complicated pretreatment process required for electroless depositions and increase adhesive strength of a deposited metal thin film.

Abstract: This disclosure provides systems, methods and apparatus for vias in an integrated circuit structure such as a passive device. In one aspect, an integrated passive device includes a first conductive trace and a second conductive trace over the first conductive trace with an interlayer dielectric between a portion of the first conductive trace and the second conductive trace. One or more vias are provided within the interlayer dielectric to provide electrical connection between the first conductive trace and the second conductive trace. A width of the vias is greater than a width of at least one of the conductive traces.

Abstract: A method for manufacturing an electrode comprising the steps of: applying onto a substrate a conductive paste to form a conductive paste layer comprising; (i) 100 parts by weight of a copper powder coated with a metal oxide selected from the group consisting of silicon oxide (SiO2), zinc oxide (ZnO), aluminum oxide (Al2O3), titanium oxide (TiO2), magnesium oxide (MgO) and a mixture thereof; (ii) 5 to 30 parts by weight of a boron powder; and (iii) 0.1 to 10 parts by weight of a glass frit; dispersed in (iv) an organic vehicle; and firing the conductive paste in air.

Abstract: A method for manufacturing a conductive fiber and/or fabric, a conductive fiber and/or fabric, and a method for manufacturing a circuit board are provided, the method for manufacturing a conductive fiber and/or fabric including: preparing a composition including a solvent and a metal precursor; impregnating a fiber and/or fabric with the composition; and reducing the metal precursor in the fiber and/or fabric impregnated with the composition into a metal to obtain a conductive fiber and/or fabric, wherein the composition includes 50 to 99 wt % of the solvent and 1 to 50 wt % of the metal precursor.

Abstract: A catalyst precursor resin composition includes an organic polymer resin; a fluorinated-organic complex of silver ion; a monomer having multifunctional ethylene-unsaturated bonds; a photoinitiator; and an organic solvent. The metallic pattern is formed by forming catalyst pattern on a base using the catalyst precursor resin composition reducing the formed catalyst pattern, and electroless plating the reduced catalyst pattern. In the case of forming metallic pattern using the catalyst precursor resin composition, a compatibility of catalyst is good enough not to make precipitation, chemical resistance and adhesive force of the formed catalyst layer are good, catalyst loss is reduced during wet process such as development or plating process, depositing speed is improved, and thus a metallic pattern having good homogeneous and micro pattern property may be formed after electroless plating.

Abstract: A method of manufacturing a liquid ejection head includes forming, on the substrate, a metal layer formed of a first metal, forming a liquid flow path pattern formed of a second metal that is a metal of a different kind from that of the first metal and that is dissolvable in a solution that does not dissolve the first metal, the liquid flow path pattern being formed on at least a part of a surface of the metal layer, covering the metal layer and the pattern with an inorganic material layer to be formed as the nozzle layer, forming the ejection orifices in the inorganic material layer, and removing the pattern by the solution. A standard electrode potential E1 of the first metal and a standard electrode potential E2 of the second metal have a relationship of E1>E2.

Abstract: A first paste film containing a metal powder and non-vitreous inorganic oxide is formed on a glass ceramic green sheet, and a second paste film containing a metal powder is formed on the first paste film to cover at least the edge portion of the first paste film. Then the glass ceramic green sheet and the first and second paste films are fired. As a result, a surface electrode is obtained, and then a plating layer is formed on the surface electrode. The second paste film contains less non-vitreous inorganic oxide than the first paste film and the abundance ratio of the non-vitreous inorganic oxide in the surface electrode is lower in a region bordering the plating layer than in a region bordering the glass ceramic layer at least in an edge portion of the surface electrode.

Abstract: The present invention provides an electrode comprising a current collector; an electrode active material layer formed on at least one surface of the current collector and comprising a mixture of electrode active material particles and a first binder polymer; and a porous coating layer formed on the surface of the electrode active material layer, comprising a mixture of inorganic particles and a second binder polymer and having a thickness deviation defined by the following Formula (1), and a manufacturing method thereof: (Tmax?Tmin)/Tavg?0.35??(1) wherein Tmax is a maximum thickness of the porous coating layer formed on the surface of the electrode active material layer, Tmin is a minimum thickness of the porous coating layer and Tavg is an average thickness of the porous coating layer.

Abstract: A silicon dioxide sol includes tetraethyl silicate, sodium silicate, dimethylformamide, absolute ethanol, hydrochloric acid and water. A surface treatment method for metal substrate using the silicon dioxide sol and articles manufactured by the method is also provided, the surface treatment providing significantly better ant-corrosion and anti-wear properties for the metal substrate.

Abstract: A multilayer electronic support structure comprising at least one pair of adjacent feature layers extending in an X-Y plane that are separated by a via layer; said via layer comprising a dielectric material that is sandwiched between the two adjacent feature layers and at least one constructional element through the dielectric material spanning between said pair of adjacent feature layers in a Z direction perpendicular to the X-Y plane; wherein said at least one constructional element is characterized by having a long dimension in the X-Y plane that is at least 3 times as long as a short dimension in the X-Y plane and wherein the at least one constructional element is fully encapsulated within the dielectric material and is electrically isolated from its surrounding.

Abstract: According to various embodiments, a method for forming a direct data connector for a sealed device may be provided. The method may include: providing a substrate with a hole; and filling the hole with a filling material using a plating process.

Abstract: A conductive film producing method according to the present invention contains a conductive metal portion forming step of forming a conductive metal portion containing a conductive substance and a binder on a support, and a vapor contact step of bringing the conductive metal portion into contact with a superheated vapor. This method may further contain a smoothing treatment step of smoothing the conductive metal portion, such that the smoothed conductive metal portion is brought into contact with the superheated vapor in the vapor contact step.

Abstract: A system and method for forming conductive lines on a substrate comprising depositing a precursor onto at least a portion of the substrate, depositing a thin layer of conductive material over the precursor, forming a negative-patterned mask over a portion of the thin layer of conductive material to form an exposed pattern, forming conductive lines in the exposed pattern, removing the patterned mask thereby uncovering an exposed portion of the conductive layer that substantially corresponds to the negative pattern portion, and removing the exposed portion of the conductive layer so as to uncover substrate that substantially corresponds to the exposed portion.

Abstract: The present disclosure relates to a lithium-ion solid battery, and a synthesis method and a synthesis device thereof. The synthesis method comprises a synthesis step for a current collector, a synthesis step for a cathode, a synthesis step for a diaphragm and a synthesis step for an anodee, wherein at least one of the steps is accomplished through on-site spray synthesis, and the on-site spray synthesis comprises a process of spraying a molten lithium metal. In the aforesaid way, the manufacturing process flow of the lithium-ion solid battery can be simplified.

Abstract: Provided is a thermoplastic resin molded article excellent in bending strength, flexural modulus and Charpy impact strength, on which the plated layer may be formed in a successful manner. The thermoplastic resin composition for laser direct structuring comprising, per 100 parts by weight of the thermoplastic resin, 10 to 150 parts by weight of an inorganic fiber and 1 to 30 parts by weight of a laser direct structuring additive, the laser direct structuring additive containing at least one of copper, antimony and tin, and having a Mohs hardness 1.5 or more smaller than the Mohs hardness of the inorganic fiber.

Abstract: The present invention relates to a method of manufacturing a transparent conductive layer and a transparent conductive layer manufactured by the method. The method of manufacturing the transparent conductive layer includes: a) a step of forming a conductive nanowire layer on a base material; b) a step of thermally treating the conductive nanowire layer; c) a step of applying a conductive metal ink on the conductive nanowire layer; and d) a step of thermally treating the base material coated with the conductive metal ink to electrically bridge the conductive nanowires with each other by conductive metal particles of the conductive metal ink.

Abstract: Tin-plated copper-alloy material for terminal in which: a CuSn alloy layer/a NiSn alloy layer/a Ni or Ni alloy layer are formed between a Sn-based surface layer and a substrate made of Cu or Cu alloy; the CuSn alloy layer is a compound-alloy layer containing Cu6Sn5 as a major proportion and a part of Cu in the Cu6Sn5 is displaced by Ni; the NiSn alloy layer is a compound-alloy layer containing Ni3Sn4 as a major proportion and a part of Ni in the Ni3Sn4 is displaced by Cu; an average interval S of point peaks of the CuSn alloy layer is not less than 0.8 ?m and not more than 2.0 ?m; an average thickness of the Sn-based surface layer is not less than 0.2 ?m and not more than 0.6 ?m; an exposed-area rate of the CuSn alloy layer exposed at a surface of the Sn-based surface layer is not less than 1% and not more than 40%; an average of equivalent-circle diameter of the exposed portions of the CuSn alloy layer exposed at the surface of the Sn-based surface layer is not less than 0.1 ?m and not more than 1.

Abstract: Some embodiments include methods of forming charge-trapping zones. The methods may include forming nanoparticles, transferring the nanoparticles to a liquid to form a dispersion, forming an aerosol from the dispersion, and then directing the aerosol onto a substrate to form charge-trapping centers comprising the nanoparticles. The charge-trapping zones may be incorporated into flash memory cells.

Abstract: Compositions and methods for depositing elemental metal M(0) films on semiconductor substrates are disclosed. One of the disclosed methods comprises: heating the semiconductor substrate to obtain a heated semiconductor substrate; exposing the heated semiconductor substrate to a composition containing a metal precursor, an excess amount of neutral labile ligands, and a supercritical solvent; exposing the metal precursor to a reducing agent and/or thermal energy at or near the heated semiconductor substrate; reducing the metal precursor to the elemental metal M(0) by using the reducing agent and/or the thermal energy; and depositing the elemental metal M(0) film while minimizing formation of metal oxides.

Abstract: A coating process comprising applying to a surface a coating composition consisting essentially of an alkali metal silicate and an aqueous liquid phase having dispersed therein solid aluminum particles to form on the surface a wet coating; and drying said wet coating: under conditions which convert said wet coating to an electrically conductive, corrosion-resistant, solid coating; or under conditions which form a solid coating which is not electrically conductive (non-conductive) and thereafter treating said non-conductive coating under conditions which convert said non-conductive coating to an electrically conductive, corrosion-resistant coating.

Abstract: A current-source contacting device, a current source and a current-source contacting system are described. To increase the mechanical stability, corrosion resistance and temperature stability of current-transferring members of the current-source contacting device, the current source and the current-source contacting system, these current-transferring members are made of a metal-infiltrated ceramic. A method for producing metal-infiltrated ceramic bodies, metal-infiltrated ceramic bodies produced in this manner, as well as their use, are also described.

Abstract: Metal nanowires, such as silver nanowires coated on a substrate were sintered together to form fused metal nanowire networks that have greatly improved conductivity while maintaining good transparency and low haze. The method of forming such a fused metal nanowire networks are disclosed that involves exposure of metal nanowires to various fusing agents on a short timescale. The resulting sintered network can have a core-shell structure in which metal halide forms the shell. Additionally, effective methods are described for forming patterned structure with areas of sintered metal nanowire network with high conductivity and areas of un-sintered metal nanowires with low conductivity. The corresponding patterned films are also described.

Abstract: Embodiments relate to printing features from an ink containing a material precursor. In some embodiments, the material includes an electrically active material, such as a semiconductor, a metal, or a combination thereof. In another embodiment, the material includes a dielectric. The embodiments provide improved printing process conditions that allow for more precise control of the shape, profile and dimensions of a printed line or other feature. The composition(s) and/or method(s) improve control of pinning by increasing the viscosity and mass loading of components in the ink. An exemplary method thus includes printing an ink comprising a material precursor and a solvent in a pattern on the substrate; precipitating the precursor in the pattern to form a pinning line; substantially evaporating the solvent to form a feature of the material precursor defined by the pinning line; and converting the material precursor to the patterned material.

Abstract: The present invention relates to a method for synthesizing metal or metal oxide nanoparticles by liquid-phase deposition on a surface layer of a substrate, comprising the following successive steps:—a step of thermally pretreating the conductor or semiconductor surface layer of a substrate, comprising the application of a specified temperature;—a step of impregnating the pretreated surface layer of the substrate with an organometallic complex in solution in an aprotic solvent;—a step of annealing under controlled atmosphere, and wherein the specified temperature is selected to obtain a predefined size of nanoparticles between 4 and 60 nm with a dispersion less than or equal to 30%. The invention is adapted to applications of nanoparticles in the field of microelectronics, optics or catalysis.

Abstract: The synthesis of single graphene sheets decorated with metal or metal oxide nanoparticles, and their uses.

Abstract: A process to form devices may include forming a seed layer on and/or over a substrate, modifying a seed layer selectively, forming an image-wise mold layer on and/or over a substrate and/or electrodepositing a first material on and/or over an exposed conductive area. A process may include selectively applying a temporary patterned passivation layer on a conductive substrate, selectively forming an image-wise mold layer on and/or over a substrate, forming a first material on and/or over at least one of the exposed conductive areas and/or removing a temporary patterned passivation layer. A process may include forming a sacrificial image-wise mold layer on a substrate layer, selectively placing one or more first materials in one or more exposed portions of a substrate layer, forming one or more second materials on and/or over a substrate layer and/or removing a portion of a sacrificial image-wise mold layer.

Abstract: A layer or layers for use in package substrates and die spacers are described. The layer or layers include a plurality of ceramic wells lying within a plane and separated by metallic vias. Recesses within the ceramic wells are occupied by a dielectric filler material.

Abstract: A method of forming low dielectric contrast structures by imprinting a silsesquioxane based polymerizable composition. The imprinting composition including: one or more polyhedral silsesquioxane oligomers each having one or more polymerizable groups, wherein each of the one or more polymerizable group is bound to a different silicon atom of the one or more polyhedral silsesquioxane oligomers; and one or more polymerizable diluents, the diluents constituting at least 50% by weight of the composition.

Abstract: Disclosed are apparatus and methods related to junction ferrite devices having improved insertion loss performance. In some implementations, a ferrite disk assembly can be configured for a radio-frequency (RF) circulator. The disk assembly can include a ferrite-based disk having a ferrite portion and a metalized layer formed on a grounding surface of the disk to improve electrical contact between the grounding surface of the disk with an external grounding surface. The ferrite-based disk can further include a dielectric portion disposed around the periphery of the ferrite center portion. In some embodiments, the metalized layer can be a silver layer formed on the grounding surface of the disk and having a desired thickness.

Abstract: The porous metal foil of the present invention comprises a two-dimensional network structure composed of a metal fiber. This porous metal foil has a first side having a higher glossiness; and a second side having a lower glossiness located on the opposite side of the first side. The ratio of glossiness GS of the first side to glossiness GM of the second side, GS/GM, as measured at incident and reflection angles of 60 degrees in accordance with JIS Z 8741 (1997) is from 1 to 15. According to the present invention, it is possible to obtain a highly useful porous metal foil which has a reduced difference in properties between the both sides in addition to superior properties derived from a porous metal foil, in a highly productive and cost effective manner that is suited for continuous production.

Abstract: The present invention is to provide a touch screen having a bacteria inhibition layer for prohibiting bacteria from growing thereon and a method for manufacturing the same comprising uniformly dispersing particles of nano metal material in a solution to be applied to a surface treatment so that the solution can have a concentration of 20 ppm to 500 ppm; evenly spray coating the solution on a screen of the touch screen; and subjecting the solution coated on the screen of the touch screen to a heat treatment until solvent in the solution is completely evaporated so that the particles of the nano metal material are densely adhered to the screen of the touch screen to form a bacteria inhibition layer thereon.