Abstract: In a method of making decorative panels, a liquid masking material is applied to a surface of a panel, and is cured to form a substantially solid masking layer on the surface. A pattern comprising at least one unmasked area and at least one masked area is formed in the masking layer either simultaneously with the application of the liquid masking material or subsequent to the curing step. The surface of the panel is then treated to render the unmasked areas of the surface of the panel visually distinguishable from the masked areas. In one embodiment of the invention the masking layer is elastomeric and the surface of the panel is treated by sandblasting, after which the masking layer is removed. The entire process may then be repeated to provide a dual density effect. In another embodiment of the invention an asphaltum masking layer is applied to a mirror forming layer on a panel, after which the portions of the mirror forming layer corresponding to the unmasked areas are chemically removed.

Abstract: There is disclosed a method for producing an electrical circuit board comprising the steps of selectively treating a portion of a conductive metal sheet in a pattern substantially corresponding to a predetermined printed circuit configuration and in a manner which renders the pattern portion of the sheet essentially adherent to a resin, placing the treated pattern portion of the sheet in direct contact with a layer of resin on the surface of an insulating substrate to form an assembly, uniformily heating the assembly to an elevated temperature to selectively bond the substrate to the treated pattern portion of the sheet, cutting the sheet along the perimeter of the pattern portions and stripping the non-pattern portions of the sheet from the substrate to form a circuit board.

Abstract: A method of depositing a metal on a surface of a substrate is disclosed. The method comprises selectively treating the surface with a photopolymerizable composition, comprising an addition polymer containing a plurality of units of the formulae ##STR1## WHERE R and R.sub.1 are each a member taken from the group consisting of ##STR2## and pyrrolidone, R.sub.3 is an alkyl group of 1 to 18 carbons, R.sub.2 is a member selected from the group consisting of H and CH.sub.3 and x is a positive integer of 10 to 1000, to form a polymerized coating thereof on the surface to delineate an exposed surface pattern conforming to a desired metal pattern. The exposed surface pattern is capable of retaining a noble metal ion thereon. The treated surface is then exposed to a noble metal ion to selectively deposit the metal ion on the exposed pattern.

Abstract: The process by which this device is made comprises the implantation of ions into an insulator. Surface charge on the insulator is discharged during implantation by an electron beam or by a thin conductive surface layer previously deposited on the insulator. Ion energy and dose are selected to embed ions into the insulating lattice to a sufficiently high local concentration to produce a zone of lower resistance which is the implanted zone. The dosage which presently appears to be a minimum dosage for providing a conductive zone in the insulative body is the order of 10.sup.18 ions per square centimeter. Beam currents upward from 10 microampers per centimeter square implanted areas are satisfactory.

Abstract: This single level masking process includes the use of two layers of a positive photoresist. A pattern is formed in the first layer of photoresist. This photoresist pattern is heated and polymerized to a degree which permits it to be resistant to attack when covered with a second layer of the same positive photoresist, that is, the first photoresist pattern will maintain its integrity. After the heat treatment, the first layer pattern is substantially insensitive to actinic radiation and is easily stripped with conventional solvents. A pattern is formed in a second layer of photoresist that is different from the pattern formed in the first layer. After a first metal is deposited on portions of the substrates exposed in the second layer pattern, the second layer pattern is removed. A second metal is deposited on the portions of the substrate exposed in the first layer pattern and then that pattern is removed.

Abstract: A method for tin plating printed boards is disclosed wherein faulty bonding is prevented by masking the printed boards with a heat and solder resistant coating material. This coating material is selectively applied to the printed boards in those areas where misbonding due to gap bridging and bubble formation is most likely to occur. For example, a small amount of coating material may be applied across conductor paths between two adjacent areas. In addition, the coating material may be evenly distributed in a grid like fashion throughout the area of the printed boards. Where the tin plating process is a wave soldering process, the coating material may be applied in the direction of conveyance of the printed board in order to avoid interference with the discharge of the tin.

Abstract: Organic polymer resist layers are stripped from substrates by treating the layers with a mixture of an aldehyde or a ketone and an alcoholic solution of a compound selected from the group consisting of ammonium, alkali metal, and alkaline earth metal hydroxides and carbonates.

Abstract: A method of forming electrode wirings for semiconductors devices. A first photoresist pattern is formed on the surface to be provided with electrode wirings in the configuration of an inverse pattern to the electrode wirings, and on the top of this pattern-containing surface is vapor deposited, a conductor of electrode material. On the conductor layer, a second photoresist layer is applied. This photoresist layer is etched until only the upper surface of the part of the conductor layer located above the first photoresist pattern, is exposed, thereby forming a second photoresist pattern. Then, by etching the aforementioned conductor layer with this second photoresist patterns as the etching mask, only the part of the conductor layer which is not to constitute the electrode wirings is removed. By this method, thicker electrode wirings than those formed by the conventional lift-off method may readily be formed.

Abstract: In integrated circuit fabrication, a method is provided for forming metallic connectors through a layer of electrically insulative material. The method comprises forming a layer of electrically insulative material on a substrate and then forming a mask of photoresist material having a plurality of openings through which said insulative layer is exposed on said insulative layer. Then, the exposed portions of said insulative layer are removed by etching to form openings through which the underlying substrate is exposed, after which a first metal layer is deposited over the masked substrate. This metal layer is thinner than the insulative layer so that the openings in the insulative layer are only filled part way up with metal. Then, the photoresist mask is removed thereby removing the metal layer deposited on it to leave only the metal in the insulative layer openings.

Abstract: A method of fabricating a photoconductive detector of increased responsivity, such as an infrared detector, from a slab of N-type, intrinsic bulk semiconductor material comprises shielding part of the detector active area between the positive and negative contacts with a material limiting photon exposure of the active area to retain a reduced detector active area sufficiently spaced from the negative contact to permit negligible loss in responsivity due to recombination of the photogenerated hole carriers at the negative contact.

Abstract: A method is disclosed for selectively depositing a metal on a surface of a substrate capable of retaining thereon a colloidal activating metal for electroless metal deposition. The method comprises coating a portion of the surface with a copolymer of maleic anhydride and a vinyl monomer, wherein the copolymer coat is selectively incapable of retaining thereon the colloidal activating metal species, to delineate an uncoated surface pattern which is capable of retaining the colloidal activating metal species thereon. The selectively coated surface is treated with a sol comprising the colloidal activating metal species to deposit the metal species only on the uncoated surface pattern. Subsequently, the colloidal species deposited pattern may be exposed to an electroless metal deposition solution to deposit a metal thereon.

Abstract: A method is disclosed for making patterned gold films in the manufacture of integrated circuit devices. The method calls for the deposition of a film of a gold compound whose heat of formation is in the range of from -20 to +10 Kcal/mole, selectively reducing the gold compound to elemental gold by irradiation, and chemically removing the unreduced portions of the gold compound.

Abstract: A method for applying a contained pattern to prevent solder overrun by applying a composition which can be applied in liquid form to a work surface where it dries, and subsequent soldering on said work surface will be substantially limited to the pattern laid down by the composition so that there is no solder overrun. The composition also has useful fire retardant properties which protects the underlying work surface. Such composition is a mixture of magnesium hydroxide, water and mica in the laminated silica mineral form.

Abstract: A phosphor screen for converting x-rays to light includes a large number of discrete columns of the phosphor material, say doped CsI, with the spaces therebetween preferably filled with a reflective substance, which itself may be phosphor (e.g., Gd.sub.2 O.sub.2 S or La.sub.2 O.sub.2 S). Because of the resulting inhibition of lateral spread of light within the phosphor screen, it may be made thicker than conventional screens while achieving at least as high resolution and contrast, thereby increasing brightness (and thus requiring lower x-ray "doses"). A method for making the screen includes using a patterned substrate and wide-angle vapor deposition (as in a hot-wall evaporator) so as to deposit the phosphor only on the raised portions of the substrate.

Abstract: Highly durable coatings are formed by the photopolymerization of screen printing inks containing aryloxyalkyl acrylate monomers or prepolymers, a polymerizable diluent and a free-radical initiating system, such inks having a viscosity of 5,000 to 200,000 centipoises and a thixotropic index of from 1 to 6. The photopolymerizable inks are useful for coating substrates, such as printed circuits, and serve as solder masks and resists for electroless plating, electroplating and etching.

Abstract: A system is disclosed for coating the interior surfaces of plated through holes in printed circuit boards by flowing a minimal volume of a low viscosity fluid carrying resist solids through holes in a board. After coating, the liquid phase of the fluid is evaporated, leaving a protective solid coating adhered to the walls of the plated through holes. The system enables positive imaging of the printed circuit boards preparatory to etching.

Abstract: Disclosed is a method for encapsulating selected areas of solid state integrated circuits. The areas which are to remain uncoated are covered with a water and/or alcohol soluble polymer of sufficient viscosity to form stable droplets. The encapsulant is then applied, usually by flow coating, and cured. The polymer mask is removed by applying a material such as water or alcohol which does not affect the encapsulant. The method thus allows relatively small areas to be masked without any significant residue left on the circuit.

Abstract: Aluminum or other coating material is deposited on the surface of one side of a strip after which ink is deposited on preselected areas of the coated strip. The ink is then cured and the aluminum removed from the uncovered areas after which the ink is removed from the covered area of the aluminum.

Abstract: A semiconductor body having metal contacts is coated, except for the metal contacts, with a masking layer composed of a heat-resistant photo-lacquer or a polyimide resin which remains on the semi-conductor body as a protective layer on the finished semiconductor device. An intermediate metal coating consisting of at least two layers of different metals is vapor-deposited over the entire semiconductor body surface. The outer layer of metal is a soft-solderable metal, such as Cu, and is applied substantially thicker in relation to the underlying intermediate metal layers. Thereafter, any excess metal on the masking layer is removed therefrom by conventional etching techniques.

Abstract: A thin coating of carbon is used as a mask to define regions of a crystalline material of the group III-V compounds. A carbon mask is coated on portions of a surface of a substrate and the masked substrate contacted with the group III-V material to deposit the crystalline material only on the portions of the surface of the substrate not covered with the masking coating. The group III-V material will not be deposited on the carbon coating, since it is incapable of nucleating the growth of the crystalline material. Accordingly, a defined region of the crystalline material is formed. The carbon masking coating can also be used as a mask for etching cavities or recesses in a substrate of the group III-V material.

Abstract: A method using a chemically vapor deposited (CVD) insulator to form a substantially planar layer of insulative material atop a conductive pattern on the surface of a substrate. The invention also features the use of a photoresist both as a mask for forming apertures in an underlying insulating layer as well as a lift-off material for a subsequently deposited conductive layer.In the method, a first insulating layer is deposited atop the substrate. Photoresist is then deposited; the resist pattern is exposed and developed; and the insulator is etched to expose selected areas of the substrate. A conductive film, preferably metal, is then deposited in blanket fashion in such quantity as to achieve the same height as the first insulator within the exposed apertures. The resist is lifted off, thereby leaving metal in the exposed apertures only. The pattern at this point consists of a single level of a conductive pattern and the insulator pattern with gaps between the conductors and the insulator.

Abstract: Novel benzophenone derivatives represented by the general formula R.sub.m.sup.1 --C.sub.6 H.sub.5-m --CO--C.sub.6 H.sub.5-n --R.sub.n.sup.2 where R.sup.1 is a halogen atom, a monovalent C.sub.1-10 hydrocarbon, alkoxy, thioalkoxy, amino, or dialkylamino group, R.sup.2 is an unsubstituted or organosiloxy-substituted organosilyl group, and m and n are each integers from 1 to 5. The benzophenone derivatives are useful as photosensitizers for making photo-curable compositions by blending with photo polymerizable resins, especially photopolymerizable organosilicon resins. Such photo-curable organosilicon resin compositions are further useful for making dry-planographic printing plates comprising non-image areas formed from the polymerized and cured layers of the composition.

Abstract: Apparatus for the vacuum deposition of a plurality of successive layers on each of a plurality of substrates, comprises a vacuum chamber having selectively shieldable cups for heating and evaporating the material to be deposited, and a pair of relatively rotatable plates suspended in the vacuum chamber, the one plate to carry at least one circular series of substrates, and the other plate to carry at least one circular series of masks selectively and sequentially registrable with the substrates and through which the successive layers are applied. Means are provided for moving the plates toward and away from each other, for rotating them continuously conjointly, and for rotating them selectively relatively stepwise.

Abstract: The present invention relates to a novel immersion tin bath composition and a novel and improved method of depositing a smooth, even, metallic tin coating over metallic surfaces, providing improved solderability.

Abstract: A method for making beam leads for use in the interconnecting of electronic evices and packages. A first metal is deposited onto a substrate which has poor adhesion with the substrate. A portion of the deposited metal is then etched away leaving on said substrate deposited metal at locations where a second metal is not to adhere to the substrate. Then depositing onto said substrate and over said first deposited metal a plurality of beam leads of a second metal. Then lifting said portions of said first metal from said substrate and then etching away said first metal to provide beam leads partially attached to said substrate.

Abstract: A coating of a perfluoropolyether compound is applied to surfaces for inhibiting the deposition of a source material by evaporating or sputtering within a vacuum, and for the deposition of such material onto irregular surfaces, voids, or holes of an object. The coating can be applied by evaporating and then condensing the compound within a vacuum, or it can be applied as a fluid or thixotropic paste through direct contact by means such as a printing process. The coating can further be applied by spraying, or by spinning the surfaces about an axis with the fluid forming a thin coating through the action of centrifugal force. Selected portions of the coating can be removed so that the material is deposited in predetermined patterns. One method of removal is by dissolving the compound in a solvent. The coating can also be removed by selective evaporation in which a laser beam or an electron beam is directed across the surface.

Abstract: The method for making patterned resist masks having minimum opening dimensions. The mask is prepared initially using standard photo or electron beam lithography techniques to yield the smallest aperture dimensions consistent with the state-of-the-art. Then, the resulting mask is placed within a chamber containing an atmosphere of resist solvent vapor. The vapor is absorbed by the patterned resist mask causing controlled resist reflow which uniformly reduces the dimensions of the resist openings by an amount determined by time, temperature, resist thickness, resist type and solvent used.

Abstract: An electric heater plate is disclosed comprising a sheet of tempered glass with a metallized aluminum circuit extending over the face thereof for carrying an electrical heating current. At the terminals of the metallized aluminum circuit there is provided a terminal area of silver between the glass and the metallized aluminum coating, which silver terminals are each exposed through a small opening in the metallized aluminum coating such that lead wires may be soldered to the silver through said openings.

Abstract: A method is disclosed for providing protective overcoatings to the surface of labels which are spaced apart and removably adhered to the release surface of a carrier web, the method comprising applying to the surface of the labels and to the surface of the carrier web exposed between labels a radiation-curable liquid composition, the composition wetting the surface of the labels to form a continuous film thereover, but not wetting the exposed release surface of the carrier web and forming thereover beads of liquid substantially unconnected to the continuous film over the labels, and thereafter exposing the films to a source of radiation sufficient to cure them to solvent resistant and abrasion resistant layers.

Abstract: A method for the metallization of a nonconductive surface with gold, nickel or copper whereby on a nonconductive, relatively low temperature surface (such as a polyester or a polyolefin) a thermosensitive coordination complex of palladium (or platinum) is deposited from a solvent; the complex has the general formula LmPdXn wherein L is a ligand or unsaturated organic radical, X is a halide, alkyl group or a bidentate ligand and m is an integer from 1 to 4 and n is from 0 to 3; bis-benzonitrile palladium dichloride complex is an appropriate illustration; the palladium complex is applied in a thin film from a suitable nonaqueous solution solvent such as xylene, toluene or a chlorobenzene onto the surface of the nonconductive material and that thin film is thermally decomposed, such as by an infrared irradiation; the method in the preferred embodiment can be practiced without the necessity of surface etching or similar chemical conditioning of the polyester, polyamide, polyvinyl chloride, or polyolefin substrate

Abstract: A lift-off method for use in depositing thin films in the fabrication of integrated circuits which avoids edge tearing of the films. The method involves depositing an organic polymeric first masking material on a substrate, and forming on said material a layer of a polydimethylsiloxane resin material. The material, in turn, is covered by a second masking layer, preferably an organic polymeric resist material into which openings are placed in a selected pattern utilizing lithographic techniques. Then, conforming openings are placed in the underlying polydimethylsiloxane resin material and the openings are extended through the underlying resist material by successive reactive sputter etching steps to expose the substrate surface in the aforesaid selected pattern. The thin film to be deposited is then applied over the resulting structure; it is, thereby, deposited on the substrate in said openings.

Abstract: A fabrication process for fabricating multiple layer magnetic bubble domain devices using only a single masking step. As a specific example, a thin conductor film (which could be a magnetic material, such as NiFe) is deposited on a substrate comprising a magnetic bubble domain material. This conductor film is coated with a resist which is exposed with an electron beam or an X-ray beam. The exposure density in a first area of the resist is different than that in a second area of the resist. Subsequent development of the resist will uncover the thin film only in the area which has received the greater exposure density. This area can then be used as a plating base for electro-plating another conductive layer, such as a thick gold film. Further development of the resist is used to uncover the second area (which initially received a lower exposure density).

Abstract: A method of manufacturing a thin-film field-emission electron source which is of a sandwich structure of a substrate - metallic film-insulating film - metallic film and which has at least one minute cavity and a field-emitter of, for example, a conical shape within the cavity, comprises the steps of (i) forming on a substrate a first layer of metallic film pattern for current supply, (ii) depositing a second layer film made of an electron emissive material onto the entire area of the substrate provided with the first layer, and thereafter subjecting the second layer film to a mesa etch by a photoetching process, to form a conical emitter on the first layer film, (iii) forming a third layer made of an insulating material, the third layer having a height substantially equal to the level of a tip portion of the emitter, (iv) forming a fourth layer of metallic film pattern as an accelerating electrode, and (v) etching the third layer, so as to expose the extremity of the emitter.

Abstract: In the manufacture of a semiconductor device, when an epitaxially-grown layer is formed on a semiconductor substrate partially formed with an oxide, a polycrystalline layer is formed on the oxide; the polycrystalline part is used as an isolation region for elements to be formed in the epitaxially-grown layer. The oxide for growing the polycrystalline layer is buried and formed in the semiconductor substrate at a depth at which a breakdown voltage between the elements is attained, whereby the width of the isolation region can be made small, so as to increase the density of integration of the semiconductor device.

Abstract: A D.C. glow discharge is applied to a heated glass substrate coated with a conductive layer in the form of a pattern in an evacuated chamber, to which chamber certain amounts of oxygen and a volatile tin composition have been added. A glass substrate is produced which is coated with a patterned, transparent, conductive coating of tin oxide, wherein the surface region of the glass has been depleted of alkali metal ions.

Abstract: A striped dichroic filter having a substrate with a surface. A first set of spaced parallel stripes capable of reflecting at least one color are carried by the surface. A second set of spaced parallel stripes capable of reflecting at least one different color different from said one color reflected by the first set of stripes is also carried by the surface. The first and second sets of stripes are disposed so that they are substantially parallel to each other and so that they are in abutting relationship with substantially no space or overlap between adjacent stripes. Third and additional sets of stripes for reflecting other colors may be provided.In the method for making the striped dichroic filter, a dual lift-off is used which utilizes both metal and resist lift-off techniques that are mutually exclusive.

Abstract: A method is disclosed for producing intricate metal designs bonded to glass such as required in electrical resistance heating circuits, microwave oven panel shields and the like. The method includes the application to a sheet of glass of the negative of the desired design by silk screening or other screening techniques utilizing a screenable pasting agent which screens through the negative pattern and adheres temporarily to the glass. The entire sheet of glass is then coated with the desired metal, usually aluminum, according to known metallizing techniques in which flame-atomized metal is applied to the heated glass sheet and thus bonds thereto. The metallized surface is then brushed with wire rotary brushes which remove the metal from those areas where the screenable pasting agent has been applied. After washing, further wet brushing, rinsing and drying, the positive desired design in metal remains securely bonded to the glass.

Abstract: An integrated circuit substrate surface, particularly a surface of electrically insulative material, having a pattern of elevated areas and a complementary pattern of unelevated areas is planarized by forming the photoresist pattern in registration with the pattern of unelevated areas, the photoresist pattern having narrower lateral dimensions than said elevated pattern whereby registration is facilitated, flowing the photoresist pattern to laterally expand the photoresist to cover and thereby mask the unelevated areas, and etching to lower the elevated areas which remain uncovered by the photoresist.

Abstract: A method for making a high density magnetic bubble domain system including the functions of read, write, storage, transfer, and annihilation. Only three masking steps are required, of which only one requires critical alignment. The proces makes use of the fact that magnetic disks can be placed on non ion implanted regions without adversely affecting the propagation properties of the implanted regions. Thus, the magnetic disks can be used to define ion implantation masks as well as for providing functions such as generation, propagation, reading, and annihilation. Magnetic elements for generation, storage and propagation, reading and annihilation are deposited in the same non-critical masking step, while all condutors used for writing, reading, and transfer are deposited by a single masking step requiring critical alignment.

Abstract: A protective layer containing polytetrafluoroethylene (PTFE) is provided over the riser of an anode having a porous film-forming metal anode body to render the riser non-wetting to a solution of manganese nitrate and thereby help prevent the formation of MnO.sub.2 on the riser during the subsequent pyrolysis step in the process of making a capacitor. The protective layer also helps to prevent mechanical damage to the anode during assembly of the capacitor. The protective layer over the anode riser may be applied by means such as dipping a wetted anode in a suspension containing particulate PTFE or by masking the anode body with a liquid and then spraying the riser with binderless material containing PTFE. The preferred embodiment employs high pressure spraying of the material containing PTFE over the anode riser.

Abstract: An improved method of defining a pattern in a layer of organic material includes depositing a relatively thin layer of silicon dioxide on the layer of organic material, applying to the silicon dioxide layer a film of primer solution comprising a silane derivative, and then forming a photoresist etch mask on the film. By utilizing an ultrasonic etch bath, a uniform and well-defined pattern is etched in the layer of organic material.

Abstract: A method of making an ironer roll cover which comprises impregnating a less than full-width longitudinal portion of a sheet of fabric with a liquid thermosetting resin and curing the resin. The unimpregnated portion of the fabric acts as a liner or padding for the impregnated portion, while the impregnated portion serves as the work-contacting surface. Because the liner portion and the work-engaging portion of the cover are integrally formed from a single sheet of fabric, no seam or stitching is required for joining the two portions. Thus, the unevenness caused by a seam is eliminated and manufacturing costs are reduced. In a preferred embodiment, liquid water is applied in a narrow band between the impregnated and unimpregnated sections of the fabric to achieve a less than full impregnation, thereby providing a transitional zone between the liner and the work-contacting portion of the cover.

Abstract: A method of producing a hard wearing bearing surface on a component such as a cylinder or cylinder liner, by pressing an accurately screened hard powder in liquid medium into engagement with the surface and on a helical path, the pressure and powder size being such that oil retaining micro-grooves are formed and also that a great number of powder particles, which particles virtually constitute the bearing surface, are embedded.

Abstract: Costume jewelry is manufactured through photofabrication processes from flat metal sheets to form items such as earrings and small pendants. A standard photo-fabrication operation includes covering a metal sheet with a layer of photosensitive, chemically resistive material commonly referred to as a photoresist. Portions of the covered sheet are exposed to light to outline the earrings and pendants on the sheet. The sheet is then developed and the exosed metal surface portions are chemically etched to remove excess metal and form the earrings and pendants. Thereafter, surface treatments involve supplementary photofabrication operations to provide different colors and finishes on the earrings and pendants by etching, plating and staining the exposed metal surfaces, all of which are supplemented by the retention of portons of photoresist layers of selected colors.

Abstract: A process of making a decorative surface covering by preparing a granular resinous dryblend containing a polymerizable monomer compatible with the resin and having at least two olefinically unsaturated sites, depositing a layer of the monomer-containing dryblend on a backing, heating the granules to form a porous, cohesive layer therefrom, cooling the layer, and printing a decorative design on the porous layer with a first printing composition containing a polymerization inhibitor which will penetrate into the porous composition. A second printing composition containing a polymerization catalyst for the monomer is then applied over the entire surface of the printed layer, and heat and/or heat and pressure is applied to fuse the resinous granules and polymerize the monomer throughout those areas not printed with the inhibitor composition.

Abstract: A process of making a decorative surface covering by preparing a granular resinous dryblend containing a vinyl resin and a plasticizer for the vinyl resin, depositing a layer of the dryblend on a backing, heating the granules to form a porous, cohesive layer therefrom, cooling the layer, and printing a decorative design on the porous layer with a first printing composition containing a polymerization inhibitor which will penetrate into the porous composition. A second printing composition containing both a polymerizable monomer, compatible with the plasticized vinyl resin, and having at least two olefinically unsaturated sites, and, a polymerization catalyst for the monomer is then applied over the entire surface of the printed layer, and heat and/or heat and pressure is applied to fuse the resinous granules and polymerize the monomer throughout those areas not printed with the polymerization inhibitor composition.

Abstract: A method for making multilayer devices, such as magnetic bubble domain devices, which are comprised of a plurality of layers that are deposited using only a single critical masking step. A first metallic layer is deposited on a substrate including a magnetic bubble domain film, which may or may not have a nonmagnetic material thereon. A first resist layer is then applied, selectively exposed, and developed to expose at least two areas of the first metallic film. A thicker metallic layer is then deposited in the exposed areas, or is electroplated. After this, another resist layer is applied without deforming the pattern in the first layer, selectively exposed, and developed to protect certain areas of the thick metallic layer from subsequent formation of another metallic layer. During this subsequent formation, a second metallic film is formed using the first resist layer as a mask. After this, the resists are removed and the now uncovered portions of the original thin metallic layer are etched away.

Abstract: A process of making a decorative surface covering by preparing a granular resinous dryblend containing both a polymerizable monomer, compatible with the resin, and having at least two olefinically unsaturated sites, and, a polymerization catalyst for the monomer, depositing a layer of the dryblend on a backing, heating the granules to form a porous, cohesive layer therefrom, cooling the layer, and printing a decorative design on the porous layer with a printing composition containing a polymerization inhibitor which will penetrate into the porous composition. Heat and/or heat and pressure is applied to fuse the resinous granules and polymerize the monomer throughout those areas not printed with the inhibitor composition.

Abstract: A method for preparing coatings, particularly imaged surfaces such as photoresists, printing plates, etc. which includes coating the surface of a substrate with a solid curable composition containing liquid polyene and solid styrene-allyl alcohol copolymer based polythiol components, curing the composition by exposing selected areas thereof to a free radical generating source, e.g. actinic radiation and removing, e.g., by dissolving, the uncured, unexposed areas of the curable composition to bare the underlying substrate. The solid polythiol is a reaction product of a copolymer of styrene-allyl alcohol and a mercaptocarboxylic acid, e.g. .beta.-mercaptopropionic acid.

Abstract: Electronic interconnections are formed between a plurality of layers of multilayer board by first applying a removable and reuseable dielectric mask over the surface of a circuit pattern formed on an insulating layer. The mask includes a pattern of openings which define locations for forming interconnecting members between portions of said circuit pattern and a subsequently formed circuit pattern. After the openings have been filled, the removable mask is replaced by a permanent insulating layer. The process of applying the mask and filling the openings is repeated to produce a multilayer board having a plurality of layers.