Abstract: Linear means, particularly for producing a mirror having a discrete transparent portion of a desired shape, configuration or ornamentation and having a backing which may have a discrete image of corresponding shape, configuration or ornamentation affixed in juxtaposition thereto, is set forth. The means of production of said mirror include providing, upon a glass surface, a layer of reflective substance, applying over said reflective substance, a layer of protective resist material which delineates, outlines and profiles said desired shape, configuration or ornamentation, then treating said coated glass surface to set said resist and washing the same to remove unprotected reflective portions delineated by said protective layer and exposed to said wash.

Abstract: A process for fabricating polyimide membrane x-ray lithography masks is described. Thin membrane of polyimide is formed by spinning polyamic acid on a glass substrate and polymerizing in situ. The glass substrate acts as a holder and efficient heat sink during formation of gold absorber patterns on top of the polyimide. A support ring is then bonded to the polyimide, and the glass etched in dilute HF. Optically smooth polyimide membranes with thickness from 0.5 to 5 .mu.m are readily achieved. The method and resulting product is not limited to the above materials or to masks.

Abstract: A bubble memory chip is manufactured using the following processing steps:a first dielectric insulation layer is deposited on the epitaxial garnet substrate, next,a comparatively thicker layer of a second dielectric insulator is deposited on the surface of the first layer of dielectric insulation, next,the reverse of the desired conductor image is printed on the surface of the second layer of dielectric insulator using a resist material such as a photoresist, next,a straight wall etching process is used to achieve a straight wall etching of the second layer of dielectric insulation but not affecting the first layer of dielectric insulation, next,the selected conductor material is deposited into the exposed groove from the previous etching process and over any remaining resist material such as a photoresist, next,a resist material is applied over the resulting conducting surface from the previous step, next,a course featured pattern is printed over the desired conductor regions leaving exposed the extensive su

Abstract: A screenable and strippable solder mask composition which contains a polyepoxide or polyimide/amide; a detackifier and a high-temperature resistant filler; and use thereof for protecting predetermined areas on a substrate from the solder deposition.

Abstract: A method of rendering an ink, selected from the group consisting of an oil-modified alkyd ink and a drying oil ink, strippable from a surface, upon which it is applied and dried, is disclosed. The method comprises applying to the printed ink, prior to the drying thereof, a modifying powder comprising a petroleum resin.

Abstract: An oblique shadow deposition technique for altering the profile of grating relief patterns on surfaces is described. In one aspect the technique essentially represents a method whereby a series of grating masks may be superimposed in precise registration with each other. By appropriate choice of deposition angle, deep grooves may be generated from shallow profiles, rounded or sinusoidal profiles may be transformed to structures with planar vertical walls, and symmetric profiles may be made asymmetric.

Abstract: A process is disclosed for delineating a patterned electroconductive coating on a substantially nonconductive substrate. The process can be used on substrates having a thickness in excess of 50 microinches. The process involves forming a substantially continuous electroconductive film on a substrate. An air abrasive resistant continuous mask film of metallic material is applied to the electroconductive film and etched to form masked and unmasked portions of the electroconductive film corresponding to the desired patterned coating. The unmasked portions of the electroconductive film are removed to leave the masked portions of the electroconductive film remaining on the substrate. The mask film can then be removed from the electroconductive film resulting in the desired pattern delineated in the electroconductive film on the substrate or the mask can remain in place and be used to form an integral part of the device formed with the substrate.

Abstract: Disclosed is a process for fabricating magnetic bubble memory chips from a magnetic film having an insulating layer on one surface thereof. The process involves forming an aluminous layer of a first substantially uniform thickness on the insulating layer. Subsequently, a layer of water insoluble material is formed on the aluminous layer, and a mask for patterning control conductors for the memory is formed on the water insoluble layer. Later, all regions of the water insoluble layer that are not covered by the mask are removed, and all regions of the aluminous layer that are not covered by the mask are thinned to a second substantially uniform thickness. The thinned aluminous regions are converted to Al.sub.2 O.sub.3 by a chemical reaction with water; while the remaining regions of the aluminous layer remains unchanged. This reaction forms a plurality of patterned control conductors of the first thickness with Al.sub.2 O.sub.3 regions also being of the first thickness lying therebetween.

Abstract: A layer of resist is applied to a metal substrate, and a matrix is formed in the resist. A metal or dielectric mask having overhanging upper edges is formed by electroplating metal into the resist matrix which has preformed openings for defining the mask. The resist matrix is then removed from the substrate. A film is then deposited upon the substrate, where it is exposed, and the mask with the overhanging upper edges protecting the side walls of the mask from being covered. Then a chemical, such as an etchant, is applied to the side walls of the mask to remove it, lifting off the material deposited upon it. The mask is made by plating metal through apertures or coating of tapered holes.

Abstract: A method is disclosed for producing a decorative and artistic effect on a flat surface, preferably a clear, flat surface, by brushing or spraying a colored coating material, such as paint thereon, placing a sheet of flexible film on the coated surface, pressing in place until the coating dries, and then removing the film to leave a decorative patterned coating. The resultant monoprint can be used as a room divider, lamp shade, window presenting the effect of stained glass, or for other purposes. When a clear, flat surface is used, the monoprint formed can be sprayed with a contrasting color and arranged to present the uncoated side for viewing in use. The flexible film can optionally be initially distorted by application of heat, creasing, or otherwise to produce variations in the decorative or artistic effect.

Abstract: A silicon semiconductor device having contacts which include tantalum. The tantalum is useful in particular for fabricating Schottky barrier diodes having a low barrier height. The method includes: precleaning the silicon substrate prior to depositing the tantalum; depositing the tantalum at low pressure and low substrate temperature to avoid oxidation of the tantalum; and sintering the contact to reduce any interfacial charges and films remaining between the silicon and tantalum. When a metal which reacts with silicon during processing, such as aluminum, is used as interconnection metallurgy, a layer of chrome must be deposited between the tantalum and aluminum.

Abstract: A method for producing rotary or flat screens having large amounts of open space per unit area comprises plating a master roll or plate having a pattern of conductive metal and non-conductive areas on its surface with a plurality of separate coats of metal coating on the conductive areas to build up a plurality of spaced projecting metal parts having a required thickness, applying a non-electrically-conductive resin onto the entire surface of the metal coating between each plating step, and removing in each step only the portions of the applied resin on the top of each projecting metal part. This is accomplished while the resin is in an undried state with a non-metallic roll or flat plate having a receptivity to the resin to expose the surface of the metal coating formed by plating.

Abstract: A liftoff process for selectively depositing additional metal layers on an existing metallurgy pattern supported on a dielectric substrate which includes the steps of (1) depositing a melt material on the dielectric substrate which material, after melting, has the characteristic of wetting the substrate surface, but not the existing metallurgy pattern, (2) heating the melt material to convert it to a liquid wherein the material is distributed to cover the dielectric substrate surface, but not the metallurgy pattern, (3) cooling the liquid material to solidify it, (4) depositing a blanket layer of metal over the solidified material and the metallurgy pattern, and (5) dissolving the solidified material in a suitable solvent thereby removing the material and the overlying metal layer portions.

Abstract: The self-aligning characteristics of surface-active molecules are used to provide a multiply-coupled thin film surface coating on a substrate, comprising an outermost layer of normally fluid, flexible backbone chain polymer units of at least about 30 atoms in length, the ends of which are attached by chemical bonds to a relatively highly polar second layer of atoms serving to anchor the relatively fluid outer surface layer polymer chains to the surface of the substrate.

Abstract: In a method of making decorative panels, a liquid masking material is applied to a surface of a panel, and is cured to form a substantially solid masking layer on the surface. A pattern comprising at least one unmasked area and at least one masked area is formed in the masking layer either simultaneously with the application of the liquid masking material or subsequent to the curing step. The surface of the panel is then treated to render the unmasked areas of the surface of the panel visually distinguishable from the masked areas. In one embodiment of the invention the masking layer is elastomeric and the surface of the panel is treated by sandblasting, after which the masking layer is removed. The entire process may then be repeated to provide a dual density effect. In another embodiment of the invention an asphaltum masking layer is applied to a mirror forming layer on a panel, after which the portions of the mirror forming layer corresponding to the unmasked areas are chemically removed.

Abstract: An improved electrical resistor device is made by molding a body of ceramic material of positive temperature coefficient of resistivity so that a plurality of passages extend in a pattern in spaced side-by-side relation to each other between opposite ends of the body. In molding the body, lands or abutments of resistor material are formed around the ends of alternate body passages at one end of the body and similar lands or abutments are formed around the ends of the other passages at the opposite end of the body. A band of masking material is applied to the sides of the body extending around the body leaving the ends of the body, and bands of the body side surface adjacent each end of the body, free of masking material. The masked body is then immersed in a coating bath for simultaneously coating the inner walls of the body passages, the ends of the body, and the unmasked bands of the body side surface with an electrically conductive ohmic contact material.

Abstract: A method of applying a dielectric layer to a substrate, comprises applying a metallic suspension, for example, a layer of so-called "conducting silver" which is a suspension of silver particles in an organic binder or solvent to the substrate surface in an area which is not to receive the dielectric layer so as to form a mask. The organic binder or solvent is advantageously decomposed by heating so as to leave the metallic deposit mask. Thereafter, a layer of dielectric material is applied over the substrate in the areas which are not covered by the mask and, subsequently, the mask is removed, such as by dissolving it. A mask-forming coating for the application of the dielectric layers on the substrate comprises a metallic suspension which may be in the form of a lacquer-type liquid or paste which contain noble metals, for example, in the form of tinsels as the conducting constituent and also include organic binders or solvents of various kinds.

Abstract: A paste comprising particles of an inorganic oxide and a vehicle is printed on portions of a substrate which are not to be coated with a transparent electro-conductive film. A low valence oxide film of an electro-conductive metal oxide is deposited on the printed substrate by a vacuum deposition process. The resulting substrate is heated in an atmosphere containing oxygen, whereby the film is oxidized to form a transparent, highly electro-conductive film and the vehicle present in the paste is decomposed to yield a patterned, transparent electro-conductive film on the substrate.

Abstract: Elevated metal contact bumps are provided on a microelectronic semiconductor circuit, with the use of aluminum-palladium metallization as a base for selective electroless plating. The aluminum and palladium are preferably deposited sequentially in a single operation, i.e., without exposing the aluminum surface to the atmosphere. The aluminum-palladium film is then patterned in a single step, using an etchant which attacks both metals at substantially the same rate. The metal pattern is then covered with an insulation layer wherein apertures are opened to expose palladium at selected sites for immersion in an electroless plating bath of ionic Cu or Ni for bump formation.

Abstract: A method of pattern generating a circuit film and adjacent barrier film on a substrate. A continuous layer of circuit film is applied to the substrate surface, and a photoresist pattern is delineated on the circuit film such that the photoresist remains on the circuit film pattern area. The area of circuit film not covered by photoresist is then removed, exposing the substrate surface. While retaining the photoresist which covers the circuit film pattern, the entire substrate surface is coated with the barrier film. The remaining photoresist is then removed, causing the barrier film which covers it to lift off, thereby exposing the circuit film pattern.

Abstract: A method of preventing the deposition of an aluminum-based pack coating on a predetermined portion of a substrate is provided, said method including the principal step of applying a maskant composition to said predetermined portion prior to coating. The composition includes a reduceable metal oxide capable of reacting with and being reduced by said coating; an inhibitor for controlling the rate of reaction between the coating and the reduceable material; and a resinous binder vehicle in which the reduceable material and the inhibitor are suspended.

Abstract: The mask blank is provided with a transparent coating layer interposed between a transparent substrate and a mask metal layer. The transparent coating layer is made of material which is resistant to an etching solution.

Abstract: In a method of galvanizing a portion only of a ferrous metal article, in particular for galvanizing one side only of a thin flat ferrous metal strip, the material used for forming a protective coating on the part of the article not to be galvanized is a suspension comprising a liquid suspending vehicle consisting of water and from 5 to 20% by weight, preferably from 6 to 16%, of the powdered hydrated form of magnesium silicate known as talc. The suspension preferably also includes a bonding or etching agent to increase the adherence of the coating to the article, a wetting agent to facilitate spreading of the coating, a thickener to facilitate the suspension of the powdered material and a defoamer if necessary.

Abstract: A negative exposure mask is prepared by forming a positive mask image of a first metal layer on a transparent substrate and applying a layer of resist which is exposed through the back of the substrate and developed to form a lift-off mask. The lift-off mask is used to form a negative mask image of a second layer of metal on the substrate in the areas not covered by the first metal layer. The first metal layer is then etched away to leave the negative mask image on the substrate.

Abstract: A semiconductor structure from which various types of active semiconductor devices can be formed is made of a semiconductor island on a transparent substrate, having thereon an electrically insulating layer of a protective material, such as silicon dioxide, which extends onto and covers the sides of the semiconductor island. The protective layer can either cover only the sides of the semiconductor island or extend over the top edge of the island. The protective layer is made by etching through a photoresist mask made of a negatively reacting photoresist which is formed by exposure to irradiation from beneath the uncovered surface of the substrate, whereby the thickness of the silicon island and the flux density of the irradiation are selected so that for a particular duration, the irradiation is completely attenuated by the semiconductor island.

Abstract: Method for pretreating a plastic substrate prior to metallization thereof by electroless metal deposition by applying a brush discharge thereto, the current density of which is higher than 0.5 mA/cm.sup.2, the tension of which being less than the breakdown tension of the substrate and the total charge of energy applied being no higher than 20mC/cm.sup.2 ; the treatment comprising plural short spaced exposures of said substrate to said discharge. Various masking means are employed to provide selectively treated and untreated portions on the substrate.

Abstract: A high aspect ratio structure (with a large height-to-linewidth ratio) is formed on a substrate by means of two resist layers with different kinds of radiation to which they are sensitive, respectively, with an actinic radiation sensitive resist below and an electron sensitive resist above. In addition, a metallic film is shaped by means of exposure of the upper layer of resist to form a metallic mask through which the lower layer of resist is exposed. Exposure may be performed by a "subtractive" technique or an "additive" technique. In the case of the subtractive technique, the substrate is coated by a first actinic resist above which are deposited first a metallic film and then a top layer of electron resist. The top resist layer is exposed and developed and the metal layer is etched so the lower resist can be exposed and developed with the pattern formed in the metal, with the pattern shape originally exposed in the top layer of resist extending down to the substrate.

Abstract: A method of manufacturing a metallic die intended for the duplication of a video frequency signal recording. A master impression is engraved in a positive photosensitive resin layer having a thickness on the order of 3000 to 4000 A and covering a metallic substrate, by exposing the layer to a laser beam modulated by the signal which is to be recorded and removing the exposed portions of the layer to bare the underlying substrate. A metal layer substantially equal to the thickness of the initial photosensitive layer is deposited on the non-exposed photosensitive layer and the bared portions of the substrate. Thereafter, the non-exposed photosensitive material and overlying portions of the metal layer are eliminated by a solvent for the non-exposed photosensitive material to form the metal projections of the die.

Abstract: A method of rendering an ink, selected from the group consisting of an oil-modified alkyd ink and a drying oil ink, strippable from a surface, upon which it is applied and dried, is disclosed. The method comprises applying to the printed ink, prior to the drying thereof, a modifying powder comprising a petroleum resin.

Abstract: A technique for providing interconnections between pairs of contact points associated with a conductive line pattern by the use of an interconnection defining tool which is selectively alignable with respect to the conductive line. The conductive line pattern comprises at least one conductive line which is either continuous or shows interruptions, and from which lines branch off to the contact points. The tool is adapted to the conductive line and consists of a row of elements, the distance between which is dimensionally related to the distance between the branch-offs. After the tool has been adjusted to the conductive line in accordance with the respective connections, the elements of the tool are used for interrupting or connecting the conductive line at predetermined positions.

Abstract: This invention relates to a fiber product formed by flexible coating, the fiber product being made of a cloth knitted or woven by fiber yarns. Each space between the fiber yarns facing to each other is formed 1.5 to 4 times as large as the thickness of each fiber yarn, and a repelling layer of a preferred resin is coated on the outer overall surface of the fiber yarns, subsequently a thin, expansible and flexible layer of polyvinyl chloride resin being, under no pressure, coated on one outer portion of the fiber yarns by the polyvinyl chloride resin paste. As a result, the repelling layer can prevent the polyvinyl chloride resin paste from penetrating into the space between the facing fiber yarns.

Abstract: A method for making a finish-effect film which possesses pores in a predetermined design pattern by printing an absorbent water-swellable supporting web in a predetermined design pattern with a substance that retards penetration of water, coating the web with an aqueous resin preparation, and then curing the resin. Three-dimensional pores are produced in the web in a pattern corresponding to the predetermined design due to greater swelling of the unprinted areas of the web by impregnation of the water from the aqueous resin preparation as compared to the printed areas. The thus produced finish-effect film can be used for decorative purposes in a manner similar to wood veneers.

Abstract: Costume jewelry is manufactured through photofabrication processes from flat metal sheets to form items such as earrings and small pendants. A standard photo-fabrication operation includes covering a metal sheet with a layer of photosensitive, chemically resistive material commonly referred to as a photoresist. Portions of the covered sheet are exposed to light to outline the earrings and pendants on the sheet. The sheet is then developed and the exposed metal surface portions are chemically etched to remove excess metal and form the earrings and pendants. Thereafter, surface treatments involve supplementary photofabrication operations to provide different colors and finishes on the earrings and pendants by etching, plating and staining the exposed metal surfaces, all of which are supplemented by the retention of portions of photoresist layers of selected colors.

Abstract: Printed circuits are produced on an insulating substrate by electroless metal plating according to a method comprising steps of:(I) forming a plating resist on a negative pattern of circuit with a masking material having an effect upon reducing the deposition of an initiator for electroless metal plating, and depositing the initiator onto the entire surface of the insulating substrate,(II) removing the initiator from the surface of said resist, and(III) dipping the insulating substrate in an electroless metal plating solution, thereby forming an electroless metal plating on a positive pattern of circuit, wherein a thermosetting resin containing a rutile type solid solution of metal oxides of titanium, nickel and antimony is employed as the masking material in said step (I), and the initiator is removed from the surface of the resist through contact with a hydrochloric acid solution of ammonium persulfate in said step (II).

Abstract: A method of selectively nickeling a layer of polymerized polyester resin is described. Patterns of electrically conducting nickel are produced on the resin surface by etching the surface of the resin prior to covering the etched surface with a patterned layer of unetched resin which exposes the etched resin in the regions in which metallization is to occur. A palladium plating solution followed by an immersion boron-nickel bath provide the metalization on the etched regions of the resin.

Abstract: A method of fabricating a printed circuit board is disclosed. The method comprises forming a patterned etch resist layer on a metal substrate and selectively etching the substrate to form a through hole with non-linear undercut walls. The etched metal substrate having the resist layer thereon is then coated with a dielectric powder to form a dielectric coat on the substrate having a sufficient through hole edge coverage.

Abstract: A short gate field effect transistor having a gate on the bottom of a recess in a body of semiconductor material with the source and drain being on the surface of the semiconductor body at opposite sides of the recess is made by providing a metal film on the surface of the semiconductor body with the metal film having an opening therein. A recess is formed in the portion of the semiconductor body in the opening in the metal film. While protecting the bottom portion of the recess, metal films are plated up on each side of the recess until the spacing between the metal films across the recess is equal to the desired length of the gate. The gate is then deposited on the bottom of the recess using the plated metal films as a mask to control the length of the gate.

Abstract: Steel strip is first heated to a predetermined temperature suitable for imparting desired properties to the strip and is then immersed in an aqueous bath maintained at substantially its boiling temperature. The composition of the aqueous bath is preferably adjusted to ensure the formation of an oxide film on the entire surface of the strip. After the strip has been withdrawn from the bath, oxide is eliminated from at least part of the surface of the strip, e.g., from one or both faces, by removal of the oxide or by reduction of the oxide. Simultaneously or subsequently, the strip is heated to a given temperature, e.g., 420.degree.-550.degree. C., maintained at this temperature, and immersed at this temperature in molten zinc.

Abstract: A large area integrated solid-state flat panel display is detailed in which thin film transistor addressing and drive circuitry is provided at each individual picture point with a display medium. The preferred display medium is an electroluminescent phosphor layer. An insulating layer of laminated photoresist is disposed over all electrical circuit elements except the electroluminescent drive electrodes.

Abstract: In a method of making decorative panels, a liquid masking material is applied to a surface of a panel, and is cured to form a substantially solid masking layer on the surface. A pattern comprising at least one unmasked area and at least one masked area is formed in the masking layer either simultaneously with the application of the liquid masking material or subsequent to the curing step. The surface of the panel is then treated to render the unmasked areas of the surface of the panel visually distinguishable from the masked areas. In one embodiment of the invention the masking layer is elastomeric and the surface of the panel is treated by sandblasting, after which the masking layer is removed. The entire process may then be repeated to provide a dual density effect. In another embodiment of the invention an asphaltum masking layer is applied to a mirror forming layer on a panel, after which the portions of the mirror forming layer corresponding to the unmasked areas are chemically removed.

Abstract: A method of and composition for preventing the deposition of a coating on a predetermined portion of a substrate is provided, said method including the principle step of applying a maskant composition to said predetermined portion prior to coating. The composition includes a reduceable material capable of reacting with and being reduced by said coating; an inhibitor for controlling the reaction between the coating and the reduceable material; and a resinous binder vehicle in which the reduceable material and the inhibitor are suspended.

Abstract: Formed porous tantalum pellets each having an extending anode wire are lowered part way into a molten compound such as napthalene. The napthalene wicks its way into substantially all of the pellet pores. Upon removal from the bath the napthalene freezes within each pellet. A liquid insulating material is applied to the anode wire while being masked from entering the porous pellet by the napthalene. The napthalene is subsequently vaporized from the pores and thereafter manganous nitrate is introduced into the pellet and is pyrolyzed to form MnO.sub.2.

Abstract: A desensitizing composition used for a recording material capable of forming a color image by the reaction of a colorless color former and an adsorbent, which contains at least one compound obtained by the addition reaction of an .alpha.,.beta.-unsaturated carboxylic acid derivative or an .alpha.,.beta.-unsaturated ketone with an amine, is disclosed. A method of desensitizing an adsorbent contained in a recording material which comprises using such composition is also disclosed.

Abstract: A method of producing a semiconductor device comprises removing all of the masking films used for forming desired semiconductor regions in the substrate, newly forming a first insulation film and selectively forming a second insulation film on predetermined portions of the first insulation film by the use of a polycrystalline silicon film as the mask.

Abstract: A polysulfone base stop resist material to protect gold thermocompression bonding sites on a circuit module during a solder dipping operation. Along with the thermoplastic, thermostable strippable base of polysulfone, the resist includes a solvent for the polysulfone and a filler which holds the melted polysulfone in place during the solder dipping operation.

Abstract: Disclosed is a method of preparing a cathode for use in the electrodeposition of metallic structures in a predetermined pattern. A porous planar member is provided with a masked region of its porous surface corresponding to the desired pattern of the metallic filaments. A mating planar surface of a cathode base is cleaned, preferably leaving a tightly adhering intermediate coating on the planar surface, and then a non-conductive material, preferably an epoxy based resin ink, is forced through the porous planar member and printed onto the planar surface of the cathode base. The masked region of the porous member will prevent the printing in a region corresponding to the desired pattern on the cathode surface.

Abstract: A process for producing fine structures having an order of magnitude of 1 .mu.m without a loss of dimension relative to a mask on a base such as a semiconductor device having electrode structures characterized by providing a base having a surface which is either etchable or is provided with an auxiliary etchable layer, providing a mask on the surface, which mask has openings corresponding to the fine structure of material to be applied on the surface, providing an etching agent which attacks the surfaces of the base without attacking the mask, etching the uncovered portions of the base until an under-etching of predetermined width exists beneath the edges of the mask, depositing the layer of material on the entire surface, controlling the amount of depositing so the layer of material being deposited on the mask and on the etched surfaces of the base are not in contact with each other, and subsequently removing the mask with the layer of material deposited thereon.

Abstract: Articles exhibiting a micropattern carried by a surface of a support, typically microdevices comprising a micropattern of a functional material on or in a substrate of a dissimilar material, are produced by a method employing a microsubstrate comprising a substrate base, a protein layer which comprises at least a compressed monolayer of a denatured non-fibrous protein on the base, and a masking film overlying the protein layer, the material of the masking film being such as to be modified by radiant energy so as to be removable from the protein layer where irradiated. The method is flexible in the sense that it is possible to proceed via either a positive or a negative of the desired micropattern and to build a more extensive, or more complex, micropattern from an initial relatively simple micropattern.

Abstract: Micropattern devices, such as electronic microcircuits, are produced by establishing on a substrate base a film of resist material, such as a polymeric film, containing dispersed therethrough a substantial proportion of an enzyme and then producing a pattern of a metal by reactions depending upon presence of the enzyme.

Abstract: Disclosed is a process for forming resist patterns on selected substrates and includes the steps of forming an ion absorption mask on the surface of a thin supporting membrane and thereafter aligning the mask with a substrate having a layer of resist thereon. Next, the ion absorption mask is exposed to a beam of ions which pass through certain areas of the absorption mask and into the resist layer to thereby expose selected regions in the resist layer (i.e., to increase or decrease the solubility of the resist to a chosen developer). In a specific embodiment of the invention, the ion absorption mask is formed by initially anodizing an aluminum substrate to form a thin coating of aluminum oxide thereon, and thereafter depositing a gold mask on one surface of the aluminum oxide coating.