Including A Masking Coating Patents (Class 427/259)
  • Patent number: 5254421
    Abstract: Electrophotographic method of obtaining lithographic printing plates comprising the following steps: (i) uniformly electrostatically charging a photoconductor element, (ii) image-wise discharging said photoconductor element, (iii) developing the resulting electrostatic charge pattern with dry toner particles of which more than 90% by volume have an equivalent particle size diameter less than 10 microns and more than 50% by volume have an equivalent particle size diameter less than 7 microns, (iv) electrostatically transferring the developed image to a toner receiving plate, said toner receiving plate comprising a plastic film support that is thermostable to a temperature of at least 140.degree. C. and a crosslinked hydrophilic layer thereon, said layer containing infrared absorbing substances in such an amount that the reflection density of said layer in the visible spectrum is between 0.4 and 1.4, and (v) fixing the transferred toner to said toner receiving plate by infrared radiation fusing.
    Type: Grant
    Filed: June 27, 1990
    Date of Patent: October 19, 1993
    Assignee: AGFA-Gevaert, N.V.
    Inventors: Paul J. Coppens, Serge M. Tavernier, Robert F. Janssens, Paul Marksch, Marc P. Stevens, Mikolaas C. de Jaeger
  • Patent number: 5254373
    Abstract: The second pole layer P2 of a thin film transducer structure is fabricated by using two levels of photoresist to define the pattern of the P2 pole layer. The first photoresist layer is deposited as a thin film and is used to focus an optical projection device that projects the mask pattern onto the photoresist. After etching and curing of the first photoresist, which is disposed above a portion of the first pole piece at the apex of the transducer, a second photoresist layer is deposited over the first photoresist layer and above the insulation deposited over the electrical coil structure. The second photoresist layer is relatively thick and serves to define the frame for printing the P2 pole piece pattern a second time. The data track width defined by the P2 pole piece is more uniform as a result of the improved definition of the frame used for registering the P2 pattern.
    Type: Grant
    Filed: April 19, 1993
    Date of Patent: October 19, 1993
    Assignee: Read-Rite Corp.
    Inventor: Ronald A. Barr
  • Patent number: 5246750
    Abstract: A method for making a fabric coated with acrylic resin and adaptable to use as a wrap for food products such as cheese or sausage, which comprises embedding a textile material of relatively low strength, such as a knitted fabric, scrim, or lightweight nonwoven fabric, in a coating layer of acrylic resin having thermoplastic properties, and for making a food wrap by cutting a blank therefor from such coated fabric, which blank is shaped into a wrap by heat sealing; fabrics and wraps made by such a method.
    Type: Grant
    Filed: March 9, 1992
    Date of Patent: September 21, 1993
    Assignee: Rohm GmbH
    Inventors: Horst Dinklage, Hans-Peter Wolf
  • Patent number: 5240740
    Abstract: A two-pole inductive magnetic head for a computer disk drive assembly. The head generates a stream of main pulses and secondary pulses in a readback waveform when reading data from a magnetic medium, each bit of read data represented by a respective main pulse. The head includes an integrating feature which reduces the amplitude and high frequency content of the secondary pulses in the readback waveform so as to ease the task of electronically isolating the main pulses for downstream processing of the read data.
    Type: Grant
    Filed: December 9, 1992
    Date of Patent: August 31, 1993
    Assignee: Digital Equipment Corporation
    Inventors: Karl A. Frey, Michael Mallary
  • Patent number: 5229167
    Abstract: A film pattern of a desired material is formed on a substrate by forming a pattern of powder of inorganic material on the substrate, forming at least a single layer of film of desired material on the substrate on which the pattern of the powder of inorganic material is formed so that a part of the film of the desired material is formed on at least a part of the pattern of the powder of inorganic material, and mechanically removing the pattern film of the powder of inorganic material together with a part of the film of the desired material formed thereon.
    Type: Grant
    Filed: March 27, 1990
    Date of Patent: July 20, 1993
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Masahide Tsukamoto
  • Patent number: 5197655
    Abstract: Methods and apparatus are provided for applying solder in precise amounts to fine pitch leads such as those suitable for direct chip attachment (DCA) or flip-chip applications by using a heated platen to apply pressure to solder overlaying a plurality of lands on circuitized substrate. In one embodiment paste solder screened through a mask having apertures each corresponding to a plurality of land locations. In another embodiment, a web of solder foil is accurately positioned over a plurality of fine pitch lands. In each embodiment, a heated platen includes at least one active element corresponding in size and shape to the area having a plurality of fine pitch lands. A third embodiment includes individual platens for lands to which solder is to be applied.
    Type: Grant
    Filed: June 5, 1992
    Date of Patent: March 30, 1993
    Assignee: International Business Machines Corporation
    Inventors: Arthur L. Leerssen, Everitt W. Mace, Issa S. Mahmoud, Charles T. Randolph, John Reece, Gaston G. Settle, Phong T. Truong, Srini V. Vasan
  • Patent number: 5185055
    Abstract: The method of forming a pattern on a substrate is described which includes first applying a film of thermo plastic material under pressure to a substrate. Energy is then supplied to dissipate heat at the surface of the film facing the substrate thereby to bond the film to the substrate. Next, areas of the film are selectively dry etched to form a predetermined pattern on the substrate and this is followed by depositing on the substrate in the areas where the film has been dry etched, a layer of patterning material. Finally, dry removal from the substrate is effected of the film remaining thereon. There is also described the application of this method to the manufacture of an array, drop-on-demand ink jet printer.
    Type: Grant
    Filed: May 11, 1990
    Date of Patent: February 9, 1993
    Assignee: Xaar Limited
    Inventors: Stephen Temple, Stuart Speakman
  • Patent number: 5178913
    Abstract: A mask for covering part of the surface of the material to be coated comprises an aluminum foil, and a film of a resin provided on one surface of the foil and having a high power of adhering to the foil and any film of paint formed on the resin film. The film of paint which is formed on the resin film when the paint applied to the material to be coated is baked in an oven does not peel off and contaminate the interior of the oven. No such paint film peels off and adheres to the coated surface of the coated product, either, but the mask ensures the improved quality of the coated surface.
    Type: Grant
    Filed: August 3, 1990
    Date of Patent: January 12, 1993
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Gen Kusunoki, Toshio Kai, Ikuo Watanabe
  • Patent number: 5165962
    Abstract: A masking film composition and method of masking a surface of an article to be coated with a protective coating, wherein a selected surface first is coated with a masking film consisting essentially of from over an approximate volume ratio of about 1:12, preferably about 1:4 of a fumed, colloidal silica, balance petrolatum, then applying and drying the protective coating, and then removing the masking film with a mild solvent naphtha.
    Type: Grant
    Filed: May 31, 1991
    Date of Patent: November 24, 1992
    Assignee: Westinghouse Air Brake Company
    Inventor: Richard K. Daly
  • Patent number: 5165959
    Abstract: An optical waveguide (11) is composed substantially entirely of triazine. Various methods for making desired triazine waveguide patterns are described.
    Type: Grant
    Filed: November 25, 1991
    Date of Patent: November 24, 1992
    Assignee: AT&T Bell Laboratories
    Inventors: John J. Burack, Treliant Fang, Jane D. LeGrange, Jose A. Ors
  • Patent number: 5130163
    Abstract: A method of applying a thermal barrier coat on an exposed side of a porous metal laminate which method includes the steps of spreading on the laminate an air-curable maskant to force maskant into the perforations in the exposed side, removing excess maskant from the exposed side so that maskant plugs remain in the perforations with tops generally coplanar with the exposed side, allowing the maskant to cure, directing sprays of bond coat and top coat incompatible with the maskant at the exposed side of the porous laminate to deposit a thermal barrier coat thereon but not on the maskant plugs, and removing the maskant plugs by thermal and chemical treatment or by chemical treatment alone.
    Type: Grant
    Filed: April 26, 1991
    Date of Patent: July 14, 1992
    Assignee: General Motors Corporation
    Inventors: David L. Clingman, Berton Schechter, John R. Cavanagh
  • Patent number: 5125153
    Abstract: A method and apparatus for producing a highly packed hybrid array. The packing density of the hybrid array is increased by providing a barrier between closely adjoining strip conductors on a substrate. The barrier reduces the occurrence of short circuits between adjacent strip conductors when an adhesive that is used to glue a chip to the substrate is pushed out from under the chip.
    Type: Grant
    Filed: November 9, 1990
    Date of Patent: June 30, 1992
    Assignee: Oerlikon-Contraves AG
    Inventors: Raymond Frey, Fredy Glaus, Fredy Heusler, Jurg Steinmann
  • Patent number: 5121134
    Abstract: A method of providing the surface area of a substrate with a first zone which is solvent-wettable and a second zone which is solvent-non-wettable, and which is particularly suitable for application to the printheads and nozzle plates of drop-on-demand ink jet printers or like products where the spacing between zones of the same kind can be as little as just tens of microns, and wherein the solvent-non-wettable zone displays excellent abrasion resistance and resistance to solvents, is virtually non-wettable by a wide range of solvents and bonds well even to plastics substrates, comprises:(i) providing a surface having good solvent wettability at least over that part of the area of the substrate which is to form said first zone;(ii) providing said area with a first layer which comprises siloxic material which bonds to the substrate and which is in contact with the substrate over at least that part of the area which is to form said second zone;(iii) providing said area with an overlayer comprising organic fluoro
    Type: Grant
    Filed: March 19, 1990
    Date of Patent: June 9, 1992
    Assignee: XAAR Limited
    Inventors: Rosemary B. Albinson, Mark R. Shepherd
  • Patent number: 5118029
    Abstract: A paste-like composition containing a lead salt of an organic acid and tin powder is applied on a pad array portion of a circuit board. Then, the paste-like compsition is heated so as to cause precipitation, thereby forming a solder layer formed of a Sn-Pb alloy substantially only on the pads. This precipitation is performed in a state that a liquid pool is formed on the pad array portion when the paste-like composition is liquefied by heating, and the tin powder is settled in the liquid pool. When an electronic part is mounted on the pads, first, preparatory solder layers are formed on the pads by the above-mentioned precipitation process. After a paste-like composition is applied on the preparatory solder layers, the electronic part is put on the paste-like composition. Then, the paste-like composition is heated, thereby soldering leads of the electronic part to the pads.
    Type: Grant
    Filed: November 26, 1990
    Date of Patent: June 2, 1992
    Assignees: The Furukawa Electric Co., Ltd., Harima Chemicals, Inc.
    Inventors: Kenichi Fuse, Takao Fukunaga, Masanao Kohno, Hisao Irie
  • Patent number: 5118584
    Abstract: In a microbump flip-chip mounting method, microcircuit features such as conductors and microbumps are formed by a lift off process. A first refractory metal is employed to promote adhesion between a layer of aluminum deposited by physical vapor deposition and a second refractory metal is employed to promote adhesion between the aluminum and an overlying layer of gold.
    Type: Grant
    Filed: June 1, 1990
    Date of Patent: June 2, 1992
    Assignee: Eastman Kodak Company
    Inventors: Mark D. Evans, John R. Debesis, Wesley H. Bacon
  • Patent number: 5104711
    Abstract: Method of restricting a coating to a first area having an adjacent second area which is to be covered by a mask before the coating is applied, including the steps of separating the areas with a barrier strip of masking paper, applying a masking composition to the second area pressing the paper against the composition to produce a guarding edge between the first and second areas, and applying coating material to the first area, the masking composition inhibiting dust on the second area from marring the coating, and protecting the second area from coating overspray. Also disclosed is a masking system including the barrier strip of masking paper pressed against the film of the masking composition applied to the painted portion of an automobile. The masking composition is easily removable by a water wash after coating of the unmasked area of the automobile.
    Type: Grant
    Filed: March 16, 1990
    Date of Patent: April 14, 1992
    Inventor: Patrick W. Marsek
  • Patent number: 5102688
    Abstract: A positive type fine resist pattern can be formed at a high sensitivity at a high precision by using, as a resist film for a di-layer resist, a mixture or alternating copolymer of a silicon-containing resin and a polysulfone.
    Type: Grant
    Filed: May 3, 1991
    Date of Patent: April 7, 1992
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazuhiko Hashimoto, Noboru Nomura
  • Patent number: 5100691
    Abstract: A process for selective formation of a II-VI group compound film comprises applying a compound film forming treatment, in a gas phase including a starting material for supplying the group II atoms of periodic table and a starting material for supplying the group VI atoms of periodic table, on a substrate having a non-nucleation surface (S.sub.NDS) with small nucleation density and a nucleation surface (S.sub.NDL) with larger nucleation density (ND.sub.L) than the nucleation density (ND.sub.S) of said non-nucleation surface (S.sub.NDS) and a large area sufficient for a number of nuclei to be formed and forming selectively a II-VI group compound film only on said nucleation surface (S.sub.NDL).
    Type: Grant
    Filed: April 16, 1991
    Date of Patent: March 31, 1992
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hiroyuki Tokunaga, Takao Yonehara
  • Patent number: 5090120
    Abstract: A process of forming solder lands in a printed wiring board manufacturing method is disclosed. The process comprises a step of forming a wiring circuit of a required pattern by a copper foil provided on an electrical insulating sheet, a step of forming required solder resists on the wiring circuit, a preprinting step for leveling the surface of the wiring circuit and a step of printing required solder resist on the wiring circuit.
    Type: Grant
    Filed: March 5, 1990
    Date of Patent: February 25, 1992
    Assignee: Nippon CMK Corp.
    Inventor: Masuo Matsumoto
  • Patent number: 5089293
    Abstract: A platinum resistance thermometer is formed in a process which includes the defining of a path for the resistance thermometer in an inert material deposited in a layer on the substrate. The substrate surface is exposed in the path, and the inert material forms a negative pattern for the path. The resistive material for the thermometer is then deposited on both the substrate surface exposed in the path and on the surfaces of the inert material remaining on the substrate. After this, the inert material is etched away, and the resistive material deposited on top of the inert material is then loose and can be removed leaving a strip of resistive material in the desired path for forming the resistive thermometer. The strip has low contamination and impurities to more easily reach the desired temperature coefficient of resistance of the strip forming the thermometer.
    Type: Grant
    Filed: July 13, 1989
    Date of Patent: February 18, 1992
    Assignee: Rosemount Inc.
    Inventors: Robert C. Bohara, James A. Ruf
  • Patent number: 5059454
    Abstract: Method for providing a patterned thin film on a flexible web-like substrate having at least one surface. A patterned release coating which carries the desired pattern is deposited on the surface and has openings therein through which the surface of the substrate is exposed. A thin film is deposited over the patterned release coat and onto the portions of the surface exposed through the openings. The patterned release coating is then removed mechanically along with the thin film portions carried thereby to provide a patterned thin film on the substrate. The mechanical removal may be accomplished by advancing the coated substrate through a solvent while brushing the substrate, subjecting the substrate to high velocity air, or contacting the substrate with the adhesive layer of a web.
    Type: Grant
    Filed: April 26, 1989
    Date of Patent: October 22, 1991
    Assignee: Flex Products, Inc.
    Inventors: David W. Todd, Lindsey Brown, Roger W. Phillips, Elliot E. Overshiner
  • Patent number: 5047116
    Abstract: The invention relates to a method for producing a liquid transfer article for use in transferring the liquid to another surface comprising the steps of:(a) coating an article with at least one layer of a coating material selected from the group consisting of ceramic and metallic carbides;(b) superimposing over the coated surface a removable mask material of discontinuous material opaque to a beam of radiation of a selected energy level;(c) directing a laser having a beam of radiation of said selected energy level onto the coated surface of the article so as to produce in the area of the coated surface not covered by the discontinuous material a pattern of wells adapted for receiving liquid and wherein said pattern of wells is defined by the area of the coated surface which is not covered by the discontinuous material; and(d) removing the mask material from the coated article.
    Type: Grant
    Filed: May 31, 1989
    Date of Patent: September 10, 1991
    Assignee: Union Carbide Coatings Service Technology Corporation
    Inventors: Pierre Luthi, Christian Hidber
  • Patent number: 5039364
    Abstract: A method is described for achieving selective generation of thermal energy from a thin metal film upon exposure to microwave energy. A deactivating material is first applied to a substrate from the thin metal film in a pattern corresponding to the region from which heat is not to be generated. The metal then is applied over the substrate and the pattern in a thickness which normally generates thermal energy upon exposure to microwave energy. Such thermal energy is produced only from those regions where the metal is adhered directly to the substrate.
    Type: Grant
    Filed: November 28, 1989
    Date of Patent: August 13, 1991
    Assignee: Beckett Industries Inc.
    Inventors: D. Gregory Beckett, Robert Watts
  • Patent number: 4980197
    Abstract: A method for manufacturing metallic structures on inorganic non-conductive substrates, in which desired structures to be produced on the upper faces of the substrates are covered with screen means and the objects are then subjected to the action of reactive halogen-containing gases in a glow-discharge zone. Then the screen means are removed from the objects and they are metallized by known physical methods.
    Type: Grant
    Filed: April 16, 1986
    Date of Patent: December 25, 1990
    Assignee: Schering Aktiengesellschaft
    Inventors: Harald Suhr, Ernst Feurer, Christian Oehr
  • Patent number: 4978558
    Abstract: Methods for selectively applying a diffusion aluminide coating to the surface of a metal article while keeping other article surfaces free of the coating are described. The method includes the steps of injection molding a mixture of materials onto the surfaces which are to be kept free of coating; the material comprises solid particles effective in preventing deposition of the coating onto the surfaces and a moldable amorphous thermoplastic resin; it contains no volatilizable solvents. The mixture is applied to the article surface to a thickness of about 5 millimeters. It is useful in pack diffusion as well as vapor phase diffusion aluminide coating operations.
    Type: Grant
    Filed: June 10, 1988
    Date of Patent: December 18, 1990
    Assignee: United Technologies Corporation
    Inventor: Foster P. Lamm
  • Patent number: 4976813
    Abstract: This invention relates to a solder mask composition for thermoplastic substrates. The solder mask has critical components which include a polyhydroxyether and melamine formaldehyde. Other components include a solvent, filler and flow control agent. Optional ingredients include a colorant, epoxy resin and acid to promote the reaction of the composition. A surfactant can also be included. The solder mask provides the necessary flexibility and adhesion required for thermoplastic circuit boards. The mask can be applied directly to a circuit board or to a transfer medium for subsequent covering of a substrate. It relates to an article which can be a circuit board. It also relates to a process for making such composites which includes processing the solder mask.
    Type: Grant
    Filed: April 27, 1989
    Date of Patent: December 11, 1990
    Assignee: Amoco Corporation
    Inventors: George A. Salensky, Thomas S. Thoman
  • Patent number: 4948624
    Abstract: A method of forming oxide masks in silicon in which oxygen ions are implanted into the silicon.
    Type: Grant
    Filed: April 12, 1989
    Date of Patent: August 14, 1990
    Assignee: Eastman Kodak Company
    Inventors: Lydia Rivaud, Gilbert Hawkins
  • Patent number: 4946711
    Abstract: A method, and aqueous emulsion, for coating a metal part with a peelable mask that is resistant to attack by the strong acid and strong base etchants used in chemical milling are disclosed. The method comprises contacting a polyvalent metal cation salt-surfaced part with an anionic emulsion for a time period effective to coat the part. The anionic emulsion includes coalescent rubbery particles and pigment and has a total solids content of at least about 10 weight percent. The weight ratio of pigment to rubbery particles is about 0.1:1 to about 2:1, respectively.
    Type: Grant
    Filed: December 16, 1988
    Date of Patent: August 7, 1990
    Assignee: DeSoto, Inc.
    Inventors: Fred D. Hawker, Victor E. Pietryga, Robert W. Byrd, James Wichmann, Patricia A. Nicpon
  • Patent number: 4940608
    Abstract: A local electroless plating process for plastics comprising the steps of: coating the nonplating surface portion of a shaped plastic product with a pasty masking composition comprising a polymer and at least one compound selected from the group consisting of a sulfur compound, nitrogen compound and silicon compound; roughening the surface portion of the plastics product to be plated and applying a catalyst to the rough-surfaced portion; electrolessly plating the plastics product; and removing the polymer coating from the nonplating surface portion of the plastics product.
    Type: Grant
    Filed: November 7, 1988
    Date of Patent: July 10, 1990
    Assignee: Okuno Chemical Industry Co., Ltd.
    Inventors: Shigemitsu Kawagishi, Toshiyuki Kita
  • Patent number: 4927663
    Abstract: A method of silk screen printing on a piece of paper, such as poster paper, in which a first silk screen printing is effected onto the sheet utilizing a printing ink that produces minimal curl in the edge of the sheet, and at least one subsequent silk screen printing is effected onto the sheet utilizing a water-based printing ink. The resulting curl is less than that which would be obtained if the first screen printing were made with the water-based ink.
    Type: Grant
    Filed: September 30, 1988
    Date of Patent: May 22, 1990
    Assignee: Small Products Limited
    Inventors: Richard F. Small, Dakshesh S. Patel, Lascelle A. Barrow, Barry M. Dix
  • Patent number: 4925705
    Abstract: A method of printing a number of superimposed or otherwise geometrically related layers on a substrate with exact registration which comprises printing said layers over one or more areas on said substrate so as to overlap the boundary of said one or more areas and then removing the layers outside said areas. The product produced by the method and the intermediate product prior to removal of layers outside the areas can be used for security purposes.
    Type: Grant
    Filed: December 23, 1986
    Date of Patent: May 15, 1990
    Assignee: Contra Vision Limited
    Inventor: George R. Hill
  • Patent number: 4906326
    Abstract: A method and apparatus for inspecting and repairing a mask usable in the manufacture of semiconductor microcircuits, by using an electron beam is disclosed. The inspection and repair of a mask pattern are made in a single apparatus, by using a controlled current of an electron beam. For inspection, the surface of a mask having a mask pattern and a radiation-sensitive layer, covering it, is scanned with an electron beam and, by detecting secondary electrons or reflected electrons caused at that time, the state of the pattern is inspected. If any defect is detected, the portion of the radiation-sensitive layer on the detected defect is irradiated with an electron beam of greater magnitude than that for the inspection and, thereafter, the exposed portion of the radiation-sensitive layer is removed. Then, etching or plating is made to the thus uncovered portion, whereby repair of the mask pattern is made.
    Type: Grant
    Filed: March 24, 1989
    Date of Patent: March 6, 1990
    Assignee: Canon Kabushiki Kaisha
    Inventors: Mitsuaki Amemiya, Shunichi Uzawa
  • Patent number: 4897288
    Abstract: A magnetic solid state device, such as a magnetoresistive memory cell, includes first and second layers of magnetoresistive material. The first and second layers are separated by a third layer which prevents exchange coupling between the magnetic dipoles of the first and second layers. The first, second and third layers are formed as a strip. A fourth layer of a resistive material, such as nitrogen doped tantalum, overlies the first layer. The fourth layer includes spaced, raised portions over which electrically conductive material, such as TiW, may be formed on top of the raised portions.
    Type: Grant
    Filed: March 15, 1988
    Date of Patent: January 30, 1990
    Assignee: Honeywell Inc.
    Inventor: Mark L. Jenson
  • Patent number: 4886704
    Abstract: This invention relates to a strippable coating film for use as a masking material serving to create attractively finished boundaries, for example, in multi-color painting of automobiles and the like, as well as a coating method using such a coating film.A coating film containing 1 to 20 parts by weight of carbon black per 100 parts by weight of the resin component present therein is suitable. Especially preferred is a coating film formed of an acrylic emulsion paint and having an adhesion to the substrate of 20 to 1000 g/inch as expressed in terms of 180.degree. peeling strength. It is disclosed that, by equipping a YAG laser with a Q-switching oscillator unit and operating the Q-switch at a pulse repetition frequency of 0.5 to 30 kHz, the coating film can be cleanly cut to achieve an attractive finish in multi-color painting.
    Type: Grant
    Filed: June 26, 1987
    Date of Patent: December 12, 1989
    Assignee: Mitsui Toatsu Chemicals, Incorporated
    Inventors: Keiichi Kamada, Motoyuki Torikai, Yasuo Ohkita
  • Patent number: 4882839
    Abstract: According to a method of manufacturing a multi-layered wiring substrate, a palladium thin film is formed on an entire surface of a substrate including a conductor wiring layer. A portion except for a predetermined via formation portion on the palladium thin film is masked by a first photoresist. A polyimide-based conductive resin is embedded in the via formation portion through the first photoresist. The first photoresist is removed. The conductor wiring layer and the via formation portion are masked by a second photoresist. The exposed palladium thin film is etched. The second photoresist is removed. The conductive resin is cured. A photosensitive polyimide resin is applied to an entire surface of the substrate, a via-hole is formed in the via formation portion, and the photosensitive polyimide resin is cured.
    Type: Grant
    Filed: April 18, 1989
    Date of Patent: November 28, 1989
    Assignee: NEC Corporation
    Inventor: Yoshitsugu Okada
  • Patent number: 4875958
    Abstract: A method of making a sanitaryware article with a light transmitting panel. A sheet of light-transmitting plastic is formed into the shape of a article of sanitaryware which has a sump. A mask is applied to a portion of the plastic sheet and the remaining portions are covered with a coating which makes the areas opaque. The mask is removed and a rigid panel of a light transmitting plastic is bonded to the light transmitting area of the shell.
    Type: Grant
    Filed: February 12, 1988
    Date of Patent: October 24, 1989
    Assignee: American Standard Inc.
    Inventor: Masayuki Kurokawa
  • Patent number: 4872707
    Abstract: Label assemblies for redeemable coupons, pressure-sensitive labels, lottery tickets and the like. A strip of redeemable coupons comprises an indefinite length web coated with a release coating, at least one coupon on the web comprising a sheet of stock material, a first dry coating layer covering the surface of the stock material, a second dry coating covering the first dry coating and a pressure-sensitive adhesive layer over the second dry coating and adhesively securing the coupons to the web. The first and second dry coating layers are substantially incompatible so that they separate from one another when the coupon, applied to an uncoated surface, is pulled therefrom.
    Type: Grant
    Filed: November 17, 1987
    Date of Patent: October 10, 1989
    Assignee: Grand Rapids Label Company
    Inventor: Frank G. deBruin
  • Patent number: 4853080
    Abstract: A lift-off process for patterning bottom shields used in thin film magnetic recording heads. The lift-off process comprises the steps of depositing a first layer of resist material (22) on a substrate (20) and hard baking the resist material (22). A transfer layer (24) is deposited over the first layer of resist material (22) and a second layer of resist material (26) is deposited on top of the transfer layer (24). The second layer of resist material (24) is then patterned and developed. The patterned structure is then etched to form a mask structure wherein the transfer layer (24) overhangs the first layer of resist material (22). An adhesion layer (30) and an amorphous magnetic alloy material (32) are then sequentially deposited on the exposed surface of the substrate (20). The amorphous magnetic alloy material (32) is sputter deposited at a pressure of about 3.4 mT, a condition that resists the stress in the amorphous alloy material to less than 10.sup.9 dynes per square centimeter.
    Type: Grant
    Filed: December 14, 1988
    Date of Patent: August 1, 1989
    Assignee: Hewlett-Packard
    Inventor: Thomas C. Anthony
  • Patent number: 4851257
    Abstract: A process for the formation of a compact vertical contact having reduced lateral space requirements yet compatible with highly planarized semiconductor manufacturing processes. The contact is made from a foundation region having a top surface to an overlying layer separated from the foundation region by a dielectric. The overlying layer can be contacted on its edge rather than on its top surface in order to reduce the lateral expanse of the contact.
    Type: Grant
    Filed: March 13, 1987
    Date of Patent: July 25, 1989
    Assignee: Harris Corporation
    Inventors: William R. Young, Anthony L. Rivoli
  • Patent number: 4826705
    Abstract: A composition and method for providing temporary masking of electrical and electronic components compatible with a high speed production operation. The composition is a radiation curable viscous liquid composition which provides minimal adhesion properties and substantial cohesive properties so that when cured, it can be readily removed in the manner of an adhesive tape. In particular, the radiation curable composition is characterized by cured properties a) of positive adhesion to the substrate to which the composition is applied, but insufficient adhesion to resist peeling forces applied by hand; and b) of sufficient cohesive strength to allow substantially all of the cured composition to be stripped mechanically or by hand in a single piece. Suitably the adhesion of the cured composition (22) to the substrate (16) as measured in the tensile shear mode, is between about 5 and 55 psi.
    Type: Grant
    Filed: June 15, 1987
    Date of Patent: May 2, 1989
    Assignee: Loctite Corporation
    Inventors: Kieran F. Drain, Robert Summers, Larry A. Nativi
  • Patent number: 4806390
    Abstract: A method of coating a metal part with a peelable mask which is resistant to attack by the strong acid and strong base etchants used in chemical milling is disclosed in which the metal part is surfaced with a layer of polyvalent metal salt, such as calcium nitrate, and then immersed in a high solids content anionic emulsion of coalescent rubbery particles heavily pigmented to contain at least about 45% total solids content and at least 20% pigment, the pigment to binder ratio being from 0.75:1 to 1:0.51. The salt-surfaced metal part is held in the anionic emulsion until the desired coating thickness has been anodically deposited thereon, and then the coated part is removed and baked to complete the formation of the mask. The rubbery particles are preferably constituted by an anionic polychloroprene homopolymer emulsion which is used in admixture with a curing agent for the homopolymer, like zinc oxide, and a polyvinylidene chloride latex.
    Type: Grant
    Filed: October 14, 1987
    Date of Patent: February 21, 1989
    Assignee: DeSoto, Inc.
    Inventors: Fred D. Hawker, Victor E. Pietryga, Robert W. Byrd
  • Patent number: 4801473
    Abstract: A transparency includes a transparent substrate such as a polyester material, an ink pattern disposed on one surface of the transparent sheet in the form of three-dimensional ink spots having curved surfaces and a transparent layer covering the ink spots which has an index of refraction approximately the same as that of the ink spots. The transparent layer is applied to the substrate and the ink spots in the form of a liquid coating which wets the surfaces of the substrate and ink spots and spreads over them to produce a transparent layer having a maximum deviation of about 20 degrees from a plane parallel to the substrate.
    Type: Grant
    Filed: May 14, 1987
    Date of Patent: January 31, 1989
    Assignee: Spectra, Inc.
    Inventors: Linda T. Creagh, Steven F. Fulton, Paul A. Hoisington, Bruce A. Paulson, Robert R. Schaffer, Charles W. Spehrley, Jr.
  • Patent number: 4766268
    Abstract: A printed circuit board, in which the substrate (1) and interconnections (2) are masked by a solder-resistant lacquer mask consisting of two layers of lacquer (4,5), the lands (3) being left unmasked, one layer of lacquer (4), which extends to the edges of the lands (3) and directly masks the substrate (1), is provided at least in the region of the lands (3), and the other layer of lacquer (5) masks the interconnections (2), while leaving the lands (3) unmasked, and extends to the region occupied by the layer of lacquer (4) extending to the edges of the lands (3) the two layers overlapping.
    Type: Grant
    Filed: March 19, 1987
    Date of Patent: August 23, 1988
    Assignee: U.S. Philips Corporation
    Inventor: Werner Uggowitzer
  • Patent number: 4753901
    Abstract: A two mask process for forming dielectrically filled planarized trenches of arbitrary width in a semiconductor substrate, the masks being of such character that they are amenable to computerized generation. The first mask defines the active regions and subdivides the trench isolation regions into a succession of trench and plateau regions, where the widths of the trench and plateau regions fall within in a dimensional range constrained by photolithographic precision of the masks and the ability to conformally deposit dielectric material into the trenches. With the first etch mask in place, the semiconductor is anisotropically etched to formed the first trench regions. A conformal deposition of dielectric follows, and by virtue of the dimensional constraints ensures substantially void free trench dielectric and a concluding substantially planar topology of the dielectric on the substrate surface.
    Type: Grant
    Filed: November 15, 1985
    Date of Patent: June 28, 1988
    Assignee: NCR Corporation
    Inventors: Daniel L. Ellsworth, Scott H. Cravens, Maurice M. Moll
  • Patent number: 4748054
    Abstract: A method of providing different colored layers of paint on glass, which method comprises roughening a surface of the glass, applying a first lot of soluble resist to predetermined areas of the roughened glass, then applying a first color paint to the glass, drying the paint, washing off the first lot of soluble resist to expose unpainted roughened glass, drying the glass, applying a second lot of soluble resist on top of some of the first colored paint and on top of some of the exposed unpainted roughened glass, applying a second color paint to the glass, and washing off the second lot of soluble resist to leave the glass with at least one area where the first and the second colors are overlaid, at least one area where the roughened glass only has the first color, and at least one area where the roughened glass only has the second color.
    Type: Grant
    Filed: January 13, 1987
    Date of Patent: May 31, 1988
    Inventor: Penelope J. Wurr
  • Patent number: 4746580
    Abstract: A method of making read-only magnetic recording media by the use of photolithographic/photoresist techniques, and the vacuum deposition of discrete bits of a high coercivity metal, followed by magnetization of said metal. A nonmagnetic substrate is covered by a layer of photoresist and a layer of high coercivity magnetic material. Selective light-pattern exposure of the resist, followed by layer-removal-procedures, cause the substrate to be covered by islands of hard magnetic material, in the pattern of a desired data track. The substrate is then subjected to the influence of a steady-state magnetic field in order to convert the metal islands into a read-only data pattern which can be read by a magnetic head. A floppy disk of this type is used to stress-test the head placement of floppy disk drives.
    Type: Grant
    Filed: March 6, 1986
    Date of Patent: May 24, 1988
    Assignee: International Business Machines Corporation
    Inventors: Ross W. Bishop, Arthur E. Moxley
  • Patent number: 4740015
    Abstract: A security document having first and second areas on one side coated or treated with complementary compositions of the types that will leave a mark when pressed together, with some areas of one composition desensitized, so that the authenticity of the document may be tested by folding the document to place the areas together and then exerting pressure thereon.
    Type: Grant
    Filed: July 1, 1986
    Date of Patent: April 26, 1988
    Assignee: Moore Business Forms, Inc.
    Inventors: Richard D. Caprio, Roland L. Engle
  • Patent number: 4728519
    Abstract: In order to provide a structure which is not susceptible to the so called "peel-off" phenomenon which tends to occur with arrangements wherein electroluminescent layers are arranged one over the top of each other in discrete overlapping layers, and to avoid the use of yeild reducing etchants which readily attack the electroluminescent material through the inevitable pin holes and cracks which appear in the insulating layers covering the elements during the production of the panel, the light emitting elements are formed in side by side or non-overlapping relationships via a lift off technique. This obviates both the peel-off phenomenon and use of corrosive etchants.
    Type: Grant
    Filed: November 16, 1984
    Date of Patent: March 1, 1988
    Assignee: Nissan Motor Co., Ltd.
    Inventor: Satoshi Tanimoto
  • Patent number: 4725566
    Abstract: A method is provided for forming metallizations on a semiconductor component, which are closer together than is possible with the present day masking technology.In accordance with the invention, a pattern of minimum dimensions is defined in a mask by means of two openings. This pattern is underetched, either by light over-exposure, or by particle back-scattering. Two metallizations are deposited, directionally in the bottom of the openings then a dielectric layer is deposited, non directionally, on the metallizations, the mask is removed by dissolution.
    Type: Grant
    Filed: June 9, 1986
    Date of Patent: February 16, 1988
    Assignee: Thomson-CSF
    Inventors: Tung Pham Ngu, Jean Chevrier
  • Patent number: 4717639
    Abstract: Process for formation of a hardened, insoluble or crosslinked stencil or resist image on a substrate, e.g., having a metal surface such as copper, and modifying the substrate or image surface comprising:A. forming an image on the substrate by applying a solvent-soluble thermoplastic copolymer of ethylene and .alpha.,.beta.-ethylenically unsaturated acid having an acid number of at least about 30, the copolymer reacting thermochemically with the substrate;B. fusing at a temperature and for a duration to induce the thermochemical reaction at a rate sufficient to partially insolubilize, harden or crosslink the polymeric image and adhere the polymeric image to the substrate surface to facilitate subsequent removal therefrom;C. modifying the uncovered substrate surface or the polymeric image surface, e.g., etching, plating, depositing, soldering; andD. removing the polymeric image.The image can be formed on the substrate by printing, electrostatic means, etc.
    Type: Grant
    Filed: December 6, 1985
    Date of Patent: January 5, 1988
    Assignee: E. I. Du Pont De Nemours and Company
    Inventors: Alan S. Dubin, Robert A. McMillen, R. David Mitchell