Abstract: A process for preparing an X-ray mask structure comprises an X-ray transmissive film, an X-ray absorptive member held on the X-ray transmissive film and supporting frame for supporting the X-ray transmissive film. The X-ray absorptive member is constituted of crystalline grains having a grain boundary size of 1 .mu.m or larger, or has a density of 90% or more relative to the density of the bulk material.

Abstract: The invention provides a method for making an electrical circuit device as well as a resulting device itself. The method includes the steps of forming a base or substrate of conductive metal and then securing an electrically conductive masking element to the substrate. The resulting product is coated with a layer of fusible particles of a dielectric or resistive material that is repelled by the surface of the masking element. The coated product is then heated to fuse the particles and provide a hard dielectric or resistive layer over surface portions of the base. The masking element provides an exposed conductive path to the base metal or substrate. A section of conductive metal foil may be bonded to the masking element to provide a continuous conductive bus on the substrate.

Abstract: A method is provided for fabricating a display cathode which includes forming a conductive line adjacent a face of a substrate. A region of amorphic diamond is formed adjacent a selected portion of the conductive line.

Abstract: A microminiature combustible gas sensor and a method of fabricating a microminiature combustible gas sensor are provided in which the catalytically active detector comprises a high surface area refractory catalyst support. A microminiature combustible gas sensor is also provided which comprises a catalytically active detector and a diffusion/flow restrictor for limiting the amount of combustion fuel reaching the catalytically active detector. The restrictor causes the catalytic reaction occurring in the vicinity of the catalytically active detector element to become substantially diffusion limited and reduces the power requirements of the sensor. The restrictor also reduces convective heat losses which may arise because of the large temperature gradient surrounding the catalytically active detector element. Finally, a microminiature combustible gas sensor comprising a flashback arrestor with one or more generally linear capillaries for preventing flashback is provided.

Abstract: A positive metallization process for metallizing a plastic composite piece containing a polymer and grains of one or more oxides, includes three successive steps. The first step consists of irradiating the plastic piece surface to be metallized with a light beam emitted by an excimer laser. The second step consists of immersing the irradiated piece into at least one autocatalytic bath containing metal ions and without palladium. This immersion induces the deposit of the metal ions onto the irradiated surface to form a metal film onto the surface. The third step consists of thermally processing the metallized plastic piece to induce the diffusion of the deposited metal into the plastic piece.

Abstract: An effective non-specular reflector, for use in a Liquid Crystal Display, is formed by first coating a substrate with a two component solution. One component hardens when heated or when exposed to ultraviolet light (optionally through a mask) while the other component remains liquid. The result is a solid layer in which are dispersed multiple liquid regions, some of which break the surface where they are easily removed, leaving behind a roughened surface. Once a high reflectance metal has been deposited onto this surface it becomes an effective nonspecular reflector. Examples of materials for use as the two components are given.

Abstract: One method for fabricating solderable pads (406) onto a substrate (220) for direct chip attachment uses a multilayer metallization coating (500). The coating has a bottom layer (202) of indium-tin oxide, with an intermediate layer (204) of copper and a top layer (206) of indium-tin oxide. A masking layer (208) is deposited on the active display area (402) of the substrate, leaving the bonding pads uncovered. The revealed bonding pads are then plasma etched, using the polyimide as an etch resist, and the top layer of ITO is selectively removed to reveal the underlying copper layer. The exposed copper layer (204) is then plated with a solderable metal to the desired thickness to form bonding pads that may be used with direct chip attachment schemes.

Abstract: Electrification is suppressed with a water-soluble electrification-suppressing film having an electron conductivity and comprising a polymer resin. A high electrification-suppressing effect which is also high in vacuum can be easily obtained by using the electrification-suppressing film with less contamination.

Abstract: A process for forming a permanently elastic adhesive connection, easily detachable in the case of disassembly, especially adhesive connections made of temperature-stable silicone compounds, between a plate made of glass, glass ceramic or a similar material, from a holding frame on which the plate rests. In particular, the process can be used to provide such an adhesive connection between a cooking surface in a recess of a working surface, wherein a sealing frame, supported by its edge, is arranged in the recess, and a holding frame connected with the sealing frame, on which the plate rests. The adhesive strength between the permanently elastic adhesive connection and the parts of the plate in contact therewith is adjusted by the use of separating agents.

Abstract: A method of manufacturing a hot-stamped decal includes step A: preparing a metalized polyester film including a metalized layer disposed on a top surface thereof, a clear polyester sheet disposed to an under side of the metalized layer, an adhesive layer disposed to an under side of the clear polyester sheet and a release sheet disposed to an under side of the adhesive layer, step B: applying a printing process on the metalized layer to form a mark thereon composed of a printed ink layer, step C: preparing an alkaline corrosive solution, step D: flushing the top surface of the metalized layer with the alkaline solution composed of water and NaOH to the top surface of the metalized layer to corrode the metalized layer not covered by the printing ink layer, step E: flushing the top surface of the metalized layer with water and step F: drying the hot-stamped decal.

Abstract: A soft adjacent layer biased magnetoresistive ("MR") device, and a method for producing the same, which incorporates a natural flux closure design utilizing coplanar thin film permanent magnets to stabilize the device while obviating induced domain walls in the magnetoresistive and soft adjacent layers ("SAL"). The device structure includes an SAL film and overlying magnetic spacer layer ("MSL") in conjunction with an MR film to produce an SAL biased magnetoresistive structure ("MRS") with the MR layer patterned to a shortened length with respect to the SAL and MSL layers. A non-magnetic metal or dielectric separation layer of on the order of 20-300 angstroms (".ANG.") is then deposited over the MSL layer and the sides of the MR layer followed by the deposition of permanent magnet layer portions substantially coplanar with the MR layer to produce a low energy equilibria device with high sensitivity and superior signal output.

Abstract: A process for simultaneously selectively depositing a high purity nickel containing alloy (i.e. a nickel-boron alloy having a nickel content in excess of 99.5 percent) over a preformed metallurgy pattern (including the individual, electrically isolated contact pads and the seal band area thereon) on the top-side dielectric surface of a multi-layer ceramic module. The metallurgy pattern on such top-side surface of such module is appropriately catalyzed and then immersed in a bath which is essentially lead-free and which includes a source of nickel ions, a borane reducing agent, and an effective amount of an organic divalent sulfur compound, preferably thiodiglycollic acid.

Abstract: A process for providing indicia to the surface of an article. The process comprising the steps of: providing an article having material initially forming at least a portion of its exterior surface; coating at least part of the material whereat indicia is to be provided to thereby form a film; contacting, with radiation from a radiation beam, indicia areas of the film intended to be provided with indicia, the radiation thereby removing the film and modifying the surface of the material of the indicia areas and also forming a mask in the non-indicia areas of the film; applying an ink to the indicia areas thereby forming the indicia on the surface; drying the ink; and removing the film.

Abstract: A molecular self-assembly process based on the alternating deposition of a p-type doped electrically conductive polycationic polymer and a conjugated or nonconjugated polyanion has been developed. In this process, monolayers of electrically conductive polymers are spontaneously adsorbed onto a substrate from dilute solutions and subsequently built-up into multilayer thin films by alternating deposition with a soluble polyanion. In contrast to a deposition process involving the alternate self-assembly of polycations and polyanions, this process is driven by the electrostatic attractions developed between the p-type doped conducting polymer and the polyanion. The net positive charge of the conducting polymer can be systematically adjusted by simply varying its doping level.

Abstract: Sacrificial coatings are applied to the rounded ends of the flattened spiral laminates for wound film capacitors. The coated laminates are positioned between tapes masking their flat surfaces. The end faces of those laminates are then sprayed with the schoopage metal and the laminates are subsequently tumbled to remove the coatings and any overspray appearing on their rounded surfaces.

Abstract: A method for forming sub-micron sized bumps on the bottom surface of a suspended microstructure or the top surface of the underlying layer in order to reduce contact area and sticking between the two layers without the need for sub-micron standard photolithography capabilities and the thus-formed microstructure. The process involves the deposition of latex spheres on the sacrificial layer which will later temporarily support the microstructure, shrinking the spheres, depositing aluminum over the spheres, dissolving the spheres to leave openings in the metal layer, etching the sacrificial layer through the openings, removing the remaining metal and depositing the microstructure material over the now textured top surface of the sacrificial layer.

Abstract: A method of preparing a patterned thin film resistor that is appropriately used in combination with semiconductor devices. The method comprises a thin film forming step comprising forming a thin film of a compound comprising at least one metal on an oxide film such as a silicon oxide film; a masking step comprising covering a desired area of the thin film by an organic material; a patterning step comprising converting to plasma a gas mixture comprising a fluorine compound gas and oxygen, and removing an area of the thin film, that is not covered by the organic material by exposing it to a gas containing activated fluorine by the plasma conversion; and a removing step comprising removing the organic material remaining on the desired area of the thin film.

Abstract: A method for creating a patterned thin film of a high surface energy material on a substrate comprising the steps of creating a photomask pattern on the substrate using photolithography, providing an oppositely charged surface on the substrate and photomask, if such does not exist, from that of particles of the high surface energy material, removing the photomask and exposing the substrate to an aqueous colloidal suspension of particles composed of the high surface energy material to adsorb seed particles onto the surface of the substrate, or removing the photomask after adsorbing seed particles to the surface, and then depositing a uniform thin film of the high surface energy material by chemical vapor deposition onto the seeded substrate.

Abstract: An automobile grille which is selectively chromium plated so as to promote the flexural properties of the grille. By optimizing the flexural properties of the grille, the grille is more readily capable of withstanding a frontal impact without sustaining permanent damage. Preferably, the chromium plating is selectively deposited on exposed surfaces of the grille so as to minimize the detrimental effect which a hard and brittle chromium plating has on the flexural modulus of the grille. As a result, the grille is more readily able to flex under the load of an impact directed into the grille from the front of the automobile. In addition, chromium plating is deposited on surfaces of the grille which predominantly see compressive loading, so as to reduce the likelihood that the chromium plating will crack in tension. The grille is particularly suitable for mounting flush with an impact-absorbing bumper, such that the grille is capable of resiliently deflecting with the stroke of the bumper.

Abstract: A method and apparatus for applying flux to a series of metallization contacts or plated contact pad a substrate exposed by an apertured solder mask, employs a compressible transfer pad. A central flux pick-up area is formed on the transfer pad bottom surface. The bottom surface may be spherical and may include a cylindrical post onto which a predetermined amount of flux is transferred, such as by dipping the pick-up area into a reservoir of semi-liquid paste flux. The transfer pad is then positioned over and compressed on the solder mask such that the picked up flux on the flux pick-up area of the transfer pad is pressure forced by compression of the transfer pad through apertures in the solder mask directly and successively into all the series of depressions formed on the substrate until all the depressions are substantially filled with flux.

Abstract: A method of applying bonding agents, such as solder pastes and conductive adhesives, to pad sites in the manufacture of electronic circuits uses a bonding agent injection head which includes a wiping guide, a blade which cooperates with the wiping guide to form an elongate nozzle slit, and an evacuation path ahead of the nozzle slit in a direction of movement of the injection head. A permanent mask with cavity openings is applied around conductive pads on a carrier. The conductive pads correspond to chip attachment sites. The injection head is brought into contact with a surface of the mask, and pressure is applied to a bonding agent in the injection head. The injection head is then moved over the surface of the mask, filling cavity openings with the bonding agent. The evacuation path ahead of the nozzle slit lets air out of the cavity openings as the cavity openings are filled with bonding agent. The injection head is then removed from the surface of the mask.

Abstract: Disclosed is a process for preparing a printed circuit board, which comprises the steps of:(1) forming, on the surface of an insulating substrate on a necessitate portion of which electrolessly plated copper is to be precipitated, a layer of a light-sensitive resin composition comprising (a) 40 to 80 parts by weight of a vinyl-polymerized high molecular weight binder having an acid value of 10 to 46 mgKOH/g, (b) 20 to 60 parts by weight of a compound having at least two polymerizable unsaturated double bonds in a molecule, with the total amount of Components (a) and (b) being 100 parts by weight, and (c) a photopolymerization initiator generating free radicals by irradiation of active light in an amount of 0.

Abstract: A low temperature batch method for forming and positioning permanent magnets on electromagnetically actuated micro-fabricated components, such as electrical switches employs a first adhesive, such as a Siltem/epoxy blend of an epoxy resin and a siloxane polyimide polymer, to releasably attach a mold layer of Kapton polyimide to a substrate, which may be the movable portion of a micromechanical structure, or a precursor to such movable portion. A well-shape cavity is formed in the mold layer, and filled with a slurry of rare earth NdFeB magnetic particles suspended in a second adhesive, which is cured to form the body of a magnet. The second adhesive is an SPI/epoxy blend, also of an epoxy resin and a siloxane polyimide polymer, but with a greater adhesion strength and a higher temperature softening point compared to the Siltem/epoxy blend. The entire structure is heated, and the mold layer is pulled off the substrate, while the body of magnetic material remains firmly attached.

Abstract: Three-dimensional RF coils suitable for use in NMR spectroscopy or imaging are described, as well as methods for making such coils. The coil is made from a thin-walled, non-magnetic, electrically insulating tube. The tube is then masked and a first conducting layer is applied, e.g., by evaporation. An additional insulating layer is provided on top of the first conducting layer, and then a second conducting layer is applied. An optional additional insulating layer may then be applied over the second conducting layer. The first and second conducting layer, in combination, are electrically connected to form a self-resonant structure at the selected frequency of the NMR apparatus. The coil may be fine-tuned conventionally by means of a series or parallel capacitor, or by changing the position of a conductive ring around the outside of the coil. Alternately, two tubes may be used, with only one conducting layer deposited on each.

Abstract: A fabrication method of a printed wiring board in which the halation effect of light irradiated to a solder resist film is utilized in a process of selectively removing the solder resist film. After a conductive layer is patterned to a given circuit pattern including soldering pads, the solder resist film is formed on the base material to cover the patterned conductive layer. The solder resist film is selectively exposed to light utilizing reflection of the irradiated light from the insulating base material and developed so that the solder resist film is selectively left in areas adjacent to the respective soldering pads. Then, an etching resist film is formed to cover the patterned conductive layer except for the soldering pads, and surface areas of the respective soldering pads are selectively etched using the etching resist film as a mask to produce solder resist dams made of the solder resist film left on the base material. Solder films are formed on the respective soldering pads thus selectively etched.

Abstract: A method of forming electrode patterns on a substrate. A substrate (30) is patterned with a photoresist layer (14) on the front side so that portions (18) of the substrate are revealed. A metal oxide layer (32) is deposited on the patterned photoresist layer and the revealed portions of the substrate. The patterned photoresist layer is then flood exposed to actinic radiation (19). The photoresist pattern (20) is removed, carrying with it those portions of the metal oxide layer deposited on the photoresist layer, forming an electrode pattern (22) by a lift-off technique.

Abstract: To allow a highly accurate superimposition printing to be accomplished in a simple manner without requiring any complicated positioning work, a plurality of stencil master plates A, B and C are formed in different parts of a single stencil master plate sheet S with a pre-defined positional relationship, and the printed images by the different stencil master plates A, B and C formed on the common stencil master plate sheet S are superimposed on a same region of printing paper P by causing a relative displacement between the stencil master plate sheet S and the printing paper P. The present invention is particularly suitable for achieving a color printing by superimposing stencil prints made by ink of different colors.

Abstract: Electrification is suppressed with a water-soluble electrification-suppressing film having an electron conductivity and comprising a polymer resin. A high electrification-suppressing effect which is also high in vacuum can be easily obtained by using the electrification-suppressing film with less contamination.

Abstract: A method and apparatus for applying a coating design to selected portions of a surface (13) of a structure (14) including the steps of applying a maskant (18) to the surface (13), positioning a plurality of sensors (20) on the structure (14) around the surface (13), positioning a laser (22) at a distance from the surface (13), directing a laser beam (32) from the laser (22) to each of the sensors (20) as input to the sensors, and using output from the sensors (20) based on the input to determine the position of the laser (22) relative to the surface (13), scanning the perimeter of the selected portions (36) with a laser beam (34), including using the determined relative positions of the laser and the surface to guide the laser beam, to cut into the maskant (18) around the perimeter, peeling the maskant (18) away from the selected portions (36), and applying the coating to the selected portions.

Abstract: Printing is conducted at the transparent conducting film unnecessary portion on a substrate 1 with a masking ink having a higher thermal decomposition temperature than that of the transparent conducting film forming composition, and the ink is dried and cured by heat or light to form a masking pattern 2. The portion where a transparent conducting film is to be formed is preferably subjected to ozone cleaning and then coated with a transparent conducting film forming composition comprising an indium compound and/or a tin compound and a solvent to form a transparent conducting film forming composition layer 3. The thus worked substrate is subjected to a heat treatment, causing thermal decomposition of the masking pattern 2 after formation of a transparent conducting film. Then the residues of the masking ink and the transparent conducting film are removed to finally obtain a desired patterned transparent conducting film 4.

Abstract: A method of forming electrode patterns on a substrate. A transparent substrate (10) is patterned with a photoresist layer (14) on the front side so that portions (18) of the substrate are revealed. A metal oxide layer (12) is deposited on the patterned photoresist layer and the revealed portions of the substrate. The patterned photoresist layer is then exposed to actinic radiation (19) through the back side (25) of the transparent substrate. The photoresist pattern (20) is removed, carrying with it those portions of the metal oxide layer deposited on the photoresist layer, forming an electrode pattern (22) by a lift-off technique.

Abstract: A rugged shaped sheet capable of exhibiting improved non-slip properties and aesthetic properties and a process for manufacturing the same. The rugged shaped sheet includes a base sheet member and a rugged pattern of a predetermined shape adhered to the base sheet member. The rugged pattern is formed of a plurality of pattern elements different in size, configuration and/or properties into a multi-layer structure. The rugged shaped sheet is manufactured by pouring an elastomer liquid material into each of perforated plates, semicuring the elastomer and laminating the perforated plates on each other, resulting in forming the rugged pattern of a predetermined shape on the base sheet member.

Abstract: A method of manufacturing a stamper includes the steps of coating a flat surface of a substrate with photosensitive material; directing light to a specified position on the photosensitive material to expose it; developing the photosensitive material to make a minute photoresist pattern; etching the substrate to a specified depth with a mask of the photoresist pattern; removing the photoresist as the mask to make a glass master; arbitrarily forming a first nickel layer on a surface of the glass master; forming an intermediate layer of a metal having a smaller linear expansion coefficient than nickel over the first nickel layer; forming a second nickel layer on the intermediate layer to form a conductive film having a two- or three-stratum structure; arbitrarily subjecting the whole substrate to a process to make nickel passive; forming an electroformed layer on the conductive film by an electroforming process; and separating the conductive film from the glass master.

Abstract: Method for providing a patterned thin film on a flexible web-like substrate having at least one surface. A patterned release coating which carries the desired pattern is deposited on the surface and has openings therein through which the surface of the substrate is exposed. A thin film is deposited over the patterned release coat and onto the portions of the surface exposed through the openings. The patterned release coating is then removed and the thin film portions carried thereby to provide a patterned thin film on the substrate.

Abstract: An aqueous slurry process for producing a diffusion aluminide protective coating in superalloy articles, particularly on internal passages in superalloy articles.Aqueous slurry containing a source of aluminum in particulate form, an inert ceramic particulate, a halide activator compound in particulate form and a viscous aqueous base dispersant is injected into the internal passage or otherwise coated on the internal surface to be protected. The coated article is heated to dry the slurry and remove the aqueous solvent base. The dried, coated article is diffusion heat treated between about 1,350.degree. F. and 2,250.degree. F. for a period of time between approximately 4 hours and 24 hours to transfer the aluminum to the surfaces of the passages and diffuse the aluminum into the substrate material to form the protective coating.

Abstract: A pattern forming method comprises at least a lower pattern forming step for printing a setting ink on a substrate, a setting step for setting the setting ink, an upper layer pattern forming step for forming a metalo-organic compound paste layer on the lower layer pattern by a printing method, and a firing step for firing at high temperature to remove the lower layer pattern. In the upper layer pattern forming step, the metalo-organic compound paste is printed so that the metalo-organic compound paste may be divided on the hardened setting ink so as to fill up gaps of the lower layer pattern. Otherwise the metalo-organic compound paste is printed on the hardened setting ink, and the metalo-organic compound paste is mechanically cut off, before the metalo-organic compound paste is dried, on the hardened setting ink, thereby forming an upper layer pattern. The setting ink comprises a thermo-setting resin, a setting agent, and an organic solvent, with an amount of nonvolatile materials of 50 to 70 wt.

Abstract: A decorative painting is made by wetting a paper substrate, stretching the paper onto a rigid flat board, drying the paper, defining outlines of figures on the paper, masking the outlines, applying watercolor to the paper, applying crystals of rock salt on the watercolor by a method such as dropping, throwing, or scattering while the watercolor is wet, drying the watercolor, removing the rock salt, paining the figures, removing the masking, and painting the outlines. The rock salt reacts with the wet watercolor to create decorative gradiations in pigmentation.

Abstract: A drum is provided on its surface with depressions corresponding to the portions of a web not to be coated and is partially enclosed by a chamber in which separating agent is evaporated. The depressions capture vapor as the drum is rotated, and the web is passed over the drum where it is not enclosed by the chamber. Separating agent condenses on selective of the web correspond to the depressions, and a functional coating is subsequently applied. Thereafter the functional coating is removed from the areas where the separating agent was applied.

Abstract: A probe for use in a scanning tunneling microscope which can measure a macromolecule, i.e., a protein molecule. The probe is manufactured by covering a metal wire having a sharp end with a thin organic film, removing an end of the metal wire by an electric field evaporation process, electrodepositing metal ions on the metal wire and removing a portion of the organic film. A monomolecular film is formed on the surface of a metal wire by chemically adsorbing a chlorosilane based chemical adsorbent. Only a tip of the chemically adsorbed film is removed by the electric field evaporation procedure, and the metal ions are electrodeposited on the tip of the metal wire. As a result, a sharp metal tip is formed. After that, the chemically adsorbed film is removed by alkyl treatment.

Abstract: Color filter arrays containing one or more colors for liquid crystal displays and other optoelectronic devices are made by using a laser to ablate portions of a coating on either a colored or transparent substrate. Color filter materials are placed into the ablated openings and cured. The number of laser ablated openings in the coated substrate varies, depending on the quantity and types of colors desired.

Abstract: A coating composition which includes an ionizing radiation-polymerizable oligomer, an ionizing radiation-polymerizable monomer and a releasing agent. The composition has a viscosity regulated to 1000 cps or less, can be rapidly and continuously produced and has excellent surface characteristics. A process for forming a decorative material using the coating composition is also disclosed.

Abstract: An aqueous correction fluid is provided which includes a latex binder, an opacifying pigment, a protective colloid, a nonionic surfactant, an anionic dispersant, and water. Preferably, the polymer binder is provided in the form of an aqueous emulsion. The correction fluid has improved freeze-thaw stability.

Abstract: A printed wiring board is selectively covered with solid solder resist pattern implemented by a first solder resist sub-pattern formed from liquid photo-sensitive solder resist and a second solder resist sub-pattern formed from photo-sensitive fry films, and a first area with pads and a second area with a through-hole or via-hole are respectively covered with the first solder resist sub-pattern and the second solder resist sub-pattern so that any peeling of the first solder resist sub-pattern and any residue of the liquid photo-sensitive solder resist in the through-hole or via-hole never take place.

Abstract: Disclosed are a class of phenolic-hydrazide compounds of diverse structure which are useful as stabilizers for polyolefins. The phenolic-hydrazide compounds inhibit oxidative degradation of polyolefins which is attributable to heat and/or ultraviolet light and is promoted or accelerated by metals, e.g., copper, in contact with the polyolefin.

Abstract: An improved liquid spray masking composition including an effective amount of a non-volatile polyhydroxy component is provided. The preferred polyhydroxy components comprise polyglycerols, especially triglycerols or larger polyglycerols. The presence of such materials in masking compositions improves performance of the compositions with respect to inhibition of high temperature swelling, blistering or spotting of the painted surface to which it is applied.

Abstract: A method of processing the surface of a metallic rod, wherein coating films (2, 22 and 32) are applied onto portions other than the shape where grooves are to be formed on the surface of the rod, the surfaces of the rods (1, 21 and 31) which are not coated are dissolved and processed by chemical polishing or etching, whereby patterns of very shallow grooves (6, 24 and 34) are formed on the surface of the rod, so that making of grooves on the surface of a very heavy rod, a long rod and a curved rod, which have been considered difficult by the conventional machining, can be easily and accurately carried out. Furthermore, after the making of the grooves, the surface of a rod (41) is plated in a state (42) of being coated by photoresist films and screens, whereby the grooves and the recessed portions (43) are plated (44), and thereafter, the coating films (42) are removed by buffing (45) and the like and the plated surface is finished, thus effectively plating the grooves and the recessed portions.

Abstract: According to the present invention, inequality in the film thickness of the solder resist and the occurrence of the blur can be eliminated, and it is possible to perform a screen printing for the solder resist with a minute pattern which leads to the formation of a minute solder land.A solder resist 60 is screen printed while leaving an etching resist 3 in the step for forming a printed wiring circuit 5 on the front of an insulating board 4. Afterward, the etching resist and the overlaid solder resist 60a are simultaneously removed, thereby forming a flat surface over the printed wiring circuit 5.

Abstract: This invention relates to a method for controlling the conductance of heated structures used to initiate faster light-off in emission control systems such as used for automotive catalytic converters, diesel particulate filters and industrial stacks and other applications in which the exhaust gas stream temperature is too low to initiate fast light-off. The invention also relates to a method for minimizing the amount of conductive material used for making such structures.

Abstract: The present invention provides a method for determining the development endpoint in a X-ray lithographic process. Endpoint is determined by visually observing resist test field patterns through a microscope during the developing step. During the developing, changing test field patterns are formed because test field locations each had been exposed simultaneously to different radiation doses. These different doses are produced when radiation passes through a mask containing a plurality of different size radiation attenuators. When the changing test field pattern matches a known pattern, which is correlated to the desired development endpoint, the workpiece is removed from the developing step.

Abstract: Method for masking at least part of a surface to be treated wherein an elongated, compressible, windowless, masking cushion that is resistant to the treatment is removably applied by an adhesive to the at least part of the surface to be treated. When the compressible cushion is used to mask an irregularity in the surface to be treated, such as an opening in the body of a vehicle, the cushion is adaptable to the irregularity.