Etching, Swelling, Or Dissolving Out Part Of The Base Patents (Class 427/307)
  • Patent number: 5221431
    Abstract: A new method for promoting adhesion of a polyethylene fiber/vinyl ester resin composites is provided. The method of the present invention comprises subjecting a fabric made from polyethylene fibers to plasma etching, applying a silane coupling agent to the etched fabric, and impregnating the fabric with vinyl ester resins, followed by the conventional molding.
    Type: Grant
    Filed: February 1, 1991
    Date of Patent: June 22, 1993
    Assignee: Korea Institute of Science and Technology
    Inventors: Chul R. Choe, Jyong S. Jang
  • Patent number: 5217571
    Abstract: A process for the surface treatment of moldings based on liquid crystalline polymers with acidic or alkaline reagents includes using the reagents in a solvent which is an organic solvent to an extent of not less than 60% by weight.
    Type: Grant
    Filed: September 4, 1991
    Date of Patent: June 8, 1993
    Assignee: BASF Aktiengesellschaft
    Inventors: Bernhard Rosenau, Bernd Hisgen, Gerhard Heinz, Graham E. McKee, Helmut Muenstedt, Wolfgang Eberle, Hartmut Zeiner
  • Patent number: 5215790
    Abstract: A microporous structure with layered interstitial surface treatments, and method and apparatus for preparation thereof. The structure is prepared by sequentially subjecting a uniformly surface-treated structure (10a) to atomic oxygen treatment to remove an outer layer (16) of surface treatment to a generally uniform depth, and then surface treating the so exposed layer with another surface treating agent. The atomic oxygen/surface treatment steps may optionally be repeated, each successive time to a lesser depth, to produce a microporous structure having multilayered surface treatments. The apparatus (200) employs at least one side arm (228) from a main atomic oxygen-containing chamber (202). The side arm (228) has characteristic relaxation times such that a uniform atomic oxygen dose rate is delivered to a specimen (239) positioned transversely in the side arm (228) spaced from the main gas chamber (202).
    Type: Grant
    Filed: June 2, 1992
    Date of Patent: June 1, 1993
    Assignee: The United States of America as represented by the National Aeronautics and Space Administration
    Inventor: Steven L. Koontz
  • Patent number: 5211991
    Abstract: A method of forming high temperature resistant coatings having magnetic particles in a ceramic matrix by plasma spraying. Typically, the surface to be coated is cleaned by a combination of solvent cleaning and abrasion, such as by grit blasting. A mixture of ceramic particles and metal particles is provided and the mixture is plasma sprayed onto the surface using a sufficiently large proportion of metal particles to form a conductive first coating layer. A second layer is plasma sprayed with a mixture having a gradually decreasing metal particle content. A third layer is plasma sprayed using a mixture having a sufficiently low proportion of metal particles as to be dielectric. A pattern of small, spaced, conductive areas is then formed on the surface of the third layer. The resulting coating is durable, high temperature resistant and absorbs incident microwave energy.
    Type: Grant
    Filed: July 23, 1992
    Date of Patent: May 18, 1993
    Assignee: Hughes Aircraft Company
    Inventor: Ronald E. Bullock
  • Patent number: 5211803
    Abstract: Poly(arylene sulfide) articles having plated metal paths thereon are disclosed. A pattern of areas of lesser crystallinity and areas of higher crystallinity is created in the polymer morphology of a surface of the article. The surface is then exposed to a chemical etchant selectively active upon the areas of lesser crystallinity thereby etching those areas of lesser crystallinity while leaving areas of higher crystallinity substantially unaffected. Then a conductive metal is deposited on the etched areas of lesser crystallinity by an electroless plating process. Subsequent electroplating can also be used.
    Type: Grant
    Filed: March 23, 1992
    Date of Patent: May 18, 1993
    Assignee: Phillips Petroleum Company
    Inventors: Timothy W. Johnson, Mark L. Stone
  • Patent number: 5209819
    Abstract: A molding capable of forming a precision fine-line circuit by the substractive method is produced by an improvement that a molding prepared by molding a liquid-crystal polyester resin composition comprising a melt-processable polyester (liquid-crystal polyester) capable of forming an anisotropic molten phase and an inorganic filler added thereto is etched and then treated to form a metallic coating on the surface thereof by sputtering, ion plating or vacuum deposition.
    Type: Grant
    Filed: July 3, 1990
    Date of Patent: May 11, 1993
    Assignee: Polyplastics Co., Ltd.
    Inventors: Yoshiharu Suzuki, Tomoyuki Aketa
  • Patent number: 5208067
    Abstract: A silicon modified organic surface is roughened by treatment with an oxygen containing plasma. If necessary the organic surface may be silicon-modified by treatment with a silicon containing material prior to plasma treatment. The roughened organic surface provides improved adhesion to other organic surfaces and to deposited metals. Improvements in methods for laminating organic surfaces and for depositing metals on organic surfaces which achieve improved adhesion are disclosed. Structures comprising laminated organic layers or metal deposited on organic surfaces which provide improved adhesion between the organic layers or between the metal and the organic-surface are also disclosed.
    Type: Grant
    Filed: May 16, 1991
    Date of Patent: May 4, 1993
    Assignee: International Business Machines Corporation
    Inventors: Carol R. Jones, Robin A. Susko
  • Patent number: 5198096
    Abstract: Method of modifying a polycarbonate surface to improve adhesion of a metal layer thereon and to the articles produced therefrom. The surface is first rendered hydrophilic by an exposure to actinic light such as ultraviolet light. The surface is then impregnated with a diffuser such as hydrochloric acid. The surface after impregnation is etched with a base such as potassium hydroxide and cleaned by oxidizing it with a solution of an oxidizing agent such as potassium permanganate. The cleaned surface is then neutralized by contacting it with a mild reducing agent. The chemically and physically modified surface is electrolessly plated with a primary metal layer. A secondary metal layer is then electrolessly or electrolytically applied on top of the primary metal layer until a metal layer of a desired thickness is attained.
    Type: Grant
    Filed: November 28, 1990
    Date of Patent: March 30, 1993
    Assignee: General Electric Company
    Inventors: Donald F. Foust, Lewis A. Bernstein
  • Patent number: 5198264
    Abstract: A method of adhering a polyimide to a substrate includes first placing the substrate in a dilute acid solution. The substrate is then placed in a palladium and tin solution followed by a rinse with water. The rinsed substrate is placed in an accelerator solution to substantially remove the tin from the substrate. The palladium which remains on the substrate surface provides nucleation sites for adhesion promotion and enhanced wetting of polyimide which is applied in a liquid form as by spraying or spinning. Adhesion of polyimide to metals such as gold, ceramics, alumina or polyimide is thereby provided.
    Type: Grant
    Filed: September 19, 1990
    Date of Patent: March 30, 1993
    Assignee: Motorola, Inc.
    Inventors: Leonard F. Altman, Jill L. Flaugher, Barry M. Miles
  • Patent number: 5192590
    Abstract: A method of coating metal on a poly(aryl ether ketone) surface comprises treating the surface with a swelling agent, removing the swelling agent, etchinig the treated surface and then plating the etched surface with a metal using an electroless plating process. The process can be used to metal plate articles of poly(aryl ether ketones) of complex shapes, such as electrical connectors. Exceptional bond strength between the metal and the poly(aryl ether ketone) surface is obtained. Poly(aryl ether ketone) compositions, even those containing little, or no, glass or mineral fillers can be plated with a strongly adherent coating of plated metal using a process of this invention. The poly(aryl ether ketone) may contain additives such as pigments, fillers, stabilizers, reinforcing agents or the like. Blends of poly(aryl ether ketones) with other polymers, such as polyetherimides, fluoroelastomers, or the like, can be treated in accordance with this invention.
    Type: Grant
    Filed: December 18, 1989
    Date of Patent: March 9, 1993
    Assignee: Raychem Corporation
    Inventor: Edward S. Sherman
  • Patent number: 5185185
    Abstract: A process of pretreatment of metal-plating a resin molded article molded from a resin composition containing as main components a polyphenylene sulfide (PPS) resin, a glass-reinforcing agent and optionally one or more other thermoplastic resins comprises(1) treating the resin molded article by immersion in an oxidative acid solution (A treatment),(2) treatng the resulting resin molded article by immersion in an organic polar solvent-containing liquid (B treatment), and then(3) treating the resulting resin molded article by immersion in a solvent which can dissolve one or both of the glass reinforcing agent and one or more of the other thermoplastic resins (C treatment). The PPS resin contains a paraphenylene sulfide unit ##STR1## in an amount of at least 70 mole % of all recurring units. Total amount of PPS resin and the glass-reinforcing agent is at least 60% by weight of the resin composition, and the ratio of the PPS resin to the glass-reinforcing agent is in the range of 2:8 to 9:1 by weight.
    Type: Grant
    Filed: December 24, 1990
    Date of Patent: February 9, 1993
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Chiharu Nishizawa, Yoshiharu Kondo, Masaru Ohto
  • Patent number: 5180639
    Abstract: Method of modifying an aromatic polymer surface to improve adhesion of a metal layer thereon and to the articles produced therefrom. The surface of the aromatic polymer such as polycarbonate, is nitrated by a contact with a nitrating solution such as a mixture of nitric and sulfuric acid and then hydroxylated by a contact with a hydroxylating solution such as ammonium hydroxide. The hydroxlyated surface is thus chemically modified to become hydrophilic. The chemically modified surface is electrolessly plated with a primary metal layer. A secondary metal layer is then electrolessly or electrolytically applied on top of the primary metal layer until a metal layer of a desired thickness is attained.The present invention further discloses articles such as an EMI shielded enclosure or a printed circuit board having metal layers as an EMI shield or a conductive metal trace pattern respectively.
    Type: Grant
    Filed: August 12, 1991
    Date of Patent: January 19, 1993
    Assignee: General Electric Company
    Inventor: Kenneth P. Zarnoch
  • Patent number: 5175026
    Abstract: A method of pretreating and hot-dip coating aluminum or aluminum alloys on a chromium-containing steel strip to provide an improved coating comprising annealing final gauge steel strip in an oxygen excess atmosphere to produce a chromium-rich oxide on the surface and thereafter electrolytically descaling the strip in an aqueous salt solution to remove the oxide and to expose a chromium depleted surface of the strip. The strip is then transported to a coating line where it is heated to a temperature at or above the temperature of a bath of aluminum or aluminum alloy. A substantially hydrogen atmosphere is maintained over the bath while the dew point is maintained below minus 35.degree. C. The strip is then drawn through the bath to coat the strip.
    Type: Grant
    Filed: July 16, 1991
    Date of Patent: December 29, 1992
    Assignees: Wheeling-Nisshin, Inc., Allegheny Ludlum Corporation
    Inventors: William A. Bertol, Yoshio Hayashi, James B. Hill, Eisuke Otani, Donald R. Zaremski, John P. Ziemianski
  • Patent number: 5169493
    Abstract: A conductive paste layer of less than 5 .mu.m is formed on an insulating substrate. After a drying and a baking treatment of the conductive paste layer, an etching is carried out to form a plurality of electrode pairs. Resistor layers are formed corresponding to each pair of the electrodes so as to partially overlap with the electrodes.
    Type: Grant
    Filed: April 16, 1990
    Date of Patent: December 8, 1992
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Minoru Nii, Yoshitaka Fukuoka
  • Patent number: 5169688
    Abstract: At least one antistatic agent is incorporated into a thermoplastic polymer by contacting a polyvinyl chloride polymer with a solution comprising a solvent capable of swelling the PVC surface and at least one antistatic agent selected from the group consisting of 1-dodecylpyridinium chloride monohydrate and (R.sup.1).sub.n (R.sup.2).sub.m ammonium halide, wherein n and m are integers of from 0-4 and n+m=4, and wherein R.sup.1 and R.sup.2 can be different or the same and are alkyl groups of from 1 to 20 carbon atoms.
    Type: Grant
    Filed: February 27, 1991
    Date of Patent: December 8, 1992
    Assignee: Atochem North America, Inc.
    Inventors: Dana S. Garcia, Joseph Silbermann
  • Patent number: 5169723
    Abstract: Chemically etching the surface of galvanized steel with a metal salt that is more electropositive than zinc provides improved adhesion for an unsaturated polyester resin based putty. The invention is particularly suitable for automobile body repair, and the putty can then be shaped to conform to the desired contour of the automobile body.
    Type: Grant
    Filed: April 17, 1990
    Date of Patent: December 8, 1992
    Assignee: Reichhold Chemicals, Inc.
    Inventor: Wolfgang C. Forster
  • Patent number: 5167992
    Abstract: A method for electrolessly plating an overcoat metal on a metal conductor disposed on a dielectric surface of a substrate. The method includes removing carbonized film from the dielectric surface by applying a plasma discharge, acid treating the metal conductor by dipping the substrate in a first acid solution in order to clean the surface of the metal conductor, activating the metal conductor to allow electroless plating thereon by dipping the substrate in a metal activator solution, deactivating the dielectric surface to prevent electroless plating thereon without deactivating the metal conductor by dipping the substrate in a second acid solution, and plating an overcoat metal on the metal conductor by dipping the substrate in an electroless plating solution so that the overcoat metal plates on and coats the metal conductor without plating on the dielectric surface.
    Type: Grant
    Filed: March 11, 1991
    Date of Patent: December 1, 1992
    Assignee: Microelectronics and Computer Technology Corporation
    Inventors: Charles W. C. Lin, Ian Y. K. Yee
  • Patent number: 5164223
    Abstract: A process for producing a light control plate which selectively scatters incident light of a specific angle, which comprises:(1) bringing at least one photopolymerizable compound of a photopolymerizable monomer and a photopolymerizable oligomer into contact with a transparent plastic film or sheet, each of the monomer and the oligomer having a polymerizable carbon-carbon double bond and being capable of forming a polymer having a refractive index different from a refractive index of said transparent plastic film or sheet, to allow said photopolymerizable compound to infiltrate into said transparent film or sheet through a surface of said transparent film or sheet, thereby forming a swollen surface layer, and(2) irradiating the swollen surface layer with light from a linear light source at a predetermined angle to cure said swollen surface surface layer.
    Type: Grant
    Filed: September 27, 1991
    Date of Patent: November 17, 1992
    Assignees: Nippon Sheet Glass Co., Ltd., Sumitomo Chemical Company, Limited
    Inventors: Toshifumi Tsujino, Hiroaki Yamamoto, Naoto Hirayama, Satoshi Ishizuka, Koichi Maeda
  • Patent number: 5160600
    Abstract: The process of electroless plating of polymers containing units derived from at least one member of the group consisting of acrylonitrile, butadiene and styrene, is carried out in an environment free of chromium ions, by the sequential steps of roughening and activating the surface of the polymer by contacting the same with an aqueous solution of a concentrated sulfur acid, of concentrated nitric acid or of concentrated phosphoric acid, in the presence of noble metal ion and an oxidant selected from the group consisting of nitric acid, hydrogen peroxide and persulfates. This is followed by an aqueous suspension of Pd.sup.0 and then by the conventional chemical metallization.
    Type: Grant
    Filed: March 5, 1990
    Date of Patent: November 3, 1992
    Inventors: Gordhanbai N. Patel, Durgadas Bolikal, Hemant H. Patel
  • Patent number: 5143592
    Abstract: Described herein is a process for desmearing and etching back the surface of a nonconductive substrate which comprises (a) contacting the substrate with a strong acid; (b) then contacting the substrate with an aqueous basic solution; and (c) contacting the substrate with a reducing agent dissolved in a strong acid.
    Type: Grant
    Filed: June 1, 1990
    Date of Patent: September 1, 1992
    Assignee: Olin Corporation
    Inventor: Salvador Toro
  • Patent number: 5135773
    Abstract: A molded article of a crystalline thermoplastic resin is electrostatically coated by preparing the molded article from a composition comprising 100 parts by weight of the crystalline thermoplastic resin and 2 to 100 parts by weight of one or more electrically conductive fillers. The surface of the molded article is roughened so as to expose the electrically conductive filler on the article's surface and thereby enhance the article's electrical conductivity. Surface roughening of the article may be accomplished through (1) chemical techniques and/or (2) physical techniques. The thus surface roughened article may then be electrostatically spray coated.
    Type: Grant
    Filed: September 15, 1989
    Date of Patent: August 4, 1992
    Assignee: Polyplastics Co., Ltd.
    Inventor: Yoshiharu Suzuki
  • Patent number: 5132038
    Abstract: Disclosed herein are compositions for use in a process for preparing the surfaces of through-holes in printed circuit boards (especially multilayer printed circuit boards) preparatory to a treatment of the through-holes with an alkaline permanganate solution, the composition being in the form of a substantially homogeneous, substantially clear mixture comprised of a substantially water-immiscible organic material which acts upon the insulating substrate of the circuit board, water, an alkakli metal compound and a surfactant component. The composition is useful as a pretreatment prior to the use of an alkaline permanganate solution in a desmearing and/or etch-back process, a combined desmearing-conditioning process, or a conditioning process following a separate desmearing process.
    Type: Grant
    Filed: April 18, 1990
    Date of Patent: July 21, 1992
    Assignee: MacDermid, Incorporated
    Inventors: Peter E. Kukanskis, Joseph J. D'Ambrisi, John J. Kuzmik
  • Patent number: 5116463
    Abstract: A method for detecting the completion of electrolessly depositing metal into a via. The method includes providing a non-autocatalytic detection mask with an opening over a via containing an autocatalytic material, electrolessly depositing a conductive metal into the via which fails to plate to the mask, and continuing the deposition until metal in the via contacts the mask, at which time the electrochemical potential of the mask changes and the metal plates to and covers the entire mask. The completion of the electroless via fill can be detected by changes in both the appearance and electrochemical potential of the mask.
    Type: Grant
    Filed: June 19, 1991
    Date of Patent: May 26, 1992
    Assignee: Microelectroncs and Computer Technology Corporation
    Inventors: Charles W. C. Lin, Randy L. German, Ian Y. K. Yee, David M. Sigmond
  • Patent number: 5112513
    Abstract: An aqueous solution for etching and activating a surface of a nonconductive substrate for subsequent chemical and, if necessary, electrochemical deposition of a metal coating containing both an activator and an etching agent. The activator is a salt or complex compound containing a metal selected from group Ib or group VIII of the periodic table. The etching agent is manganate or permanganate ion. This solution can be used in a shortened process for metallizing isolated surfaces, especially as a part of a process for making electrical connecting elements and circuit boards.
    Type: Grant
    Filed: May 10, 1989
    Date of Patent: May 12, 1992
    Assignee: Schering AG
    Inventors: Burkhard Bressel, Hans-Joachim Grapentin, Detlef Tessmann
  • Patent number: 5100703
    Abstract: There are disclosed a diamond-coated sintered body, comprising a film or diamond and/or diamond-like carbon deposited on the surface of a sintered body of a hard phase composed mainly of a mixture of W.sub.2 C and WC and inevitable impurities and a process for preparing the same.
    Type: Grant
    Filed: December 7, 1990
    Date of Patent: March 31, 1992
    Assignee: Toshiba Tungaloy Co., Ltd.
    Inventors: Kosuke Saijo, Masaru Yagi, Kunio Shibuki, Takeshi Sadahiro, Mika Niwa
  • Patent number: 5096602
    Abstract: A method of feeding a coating liquid into a path from a tank to a coating apparatus through a filter and a degassing apparatus by a pump, comprising the steps of preparing a cleaning liquid containing degassed warm water in advance and aqueous solution of low surface tension; pouring the cleaning liquid into the path through the filter by the pump to dissolve bubbles contained in the filter into the cleaning liquid; exhausting the cleaning liquid from the path; filling the path as far as the coating apparatus with the new cleaning liquid anew; and substituting a coating liquid for the cleaning liquid sequentially.
    Type: Grant
    Filed: December 31, 1990
    Date of Patent: March 17, 1992
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Shingo Yamauchi, Yoshikatsu Takagi
  • Patent number: 5093152
    Abstract: Process for protecting a transparent optical substrate which is polymeric and has a vitreous transformation temperature and is selected from the group consisting of polycarbonate, polymethylmethacrylate, polystyrene acrylonitrile, crystalline polystyrene, polyimide, polyester, polyamide, polyvinyl chloride and glass, by deposition of an inorganic continous and transparent film consisting essentially of silicon, carbon, nitrogen, oxygen and hydrogen of the formula Si C.sub.x N.sub.y O.sub.z H.sub.t, in whichx is between 0 and 5y is between 0.3 and 0.8z is between 1.3 and 2.5t is between 0.5 and 1.2.A surface of the substrate is exposed to a plasma at a temperature below the temperature of vitreous transition of the substrate in the presence of precursors of Si, C, N, O and H is gaseous form, the precursor gas of the silicon being selected from the group consisting of SiH.sub.4, Si.sub.2 H.sub.6 and Si.sub.3 H.sub.
    Type: Grant
    Filed: June 7, 1990
    Date of Patent: March 3, 1992
    Assignee: L'Air Liquide, Societe Anonyme pour l'Etude et l'Exploitation des Procedes Georges Claude
    Inventors: Claude Bonet, Francois Coeuret, Sylvie Nowak, Jean-Marie Gauthier
  • Patent number: 5091219
    Abstract: A CVD process for the deposition of at least one layer of material on a wafer substrate is disclosed, which comprises the steps of : (a) positioning at least one wafer substrate horizontally within a generally circular wafer deposition zone; (b) passing a reactive gas radially through the zone and across the surface of the wafer substrate in a single pass and preventing the recirculation of any reactive gas or gaseous reaction products over any wafer substrate or through any part of the reaction chamber which affects the wafer substrate; (c) heating the wafer substrate to a point at which the desired deposition material will be formed from the reactive gas by reaction on the surface of the heated wafer substrate and will subsequently bond with the surface; and (d) causing the deposition of material on the surface to be substantially uniform by maintaining the radial flow of the gas at a flow rate to produce a predetermined residence time of the gas over each such wafer substrate sufficiently short to prevent
    Type: Grant
    Filed: July 20, 1990
    Date of Patent: February 25, 1992
    Assignee: LAM Research Corporation
    Inventors: Joseph R. Monkowski, Mark A. Logan
  • Patent number: 5085939
    Abstract: The present invention relates to thin film-coated polymer webs, and more particularly to thin film electronic devices supported upon a polymer web, wherein the polymer web is treated with a purifying amount of electron beam radiation.
    Type: Grant
    Filed: October 24, 1990
    Date of Patent: February 4, 1992
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Robert P. Wenz, Michael F. Weber, Ravindra L. Arudi
  • Patent number: 5084302
    Abstract: A process for preparing an organic compound thin film for use in an optical device including steps of forming a multiplicity of geometric linear streaks with microscopic unevenness in section on a substrate at least whose surface is made up of an amorphous organic polymer layer; thereafter vapor-depositing on the surface an organic compound capable of exhibiting non-linear optical characteristics to form a non-linear optical material film.
    Type: Grant
    Filed: March 29, 1990
    Date of Patent: January 28, 1992
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Atsuhisa Inoue, Mariko Ishino, Yoshiro Akagi
  • Patent number: 5082685
    Abstract: A treatment, typically plasma treatment apparatus comprises a plasma creating chamber adapted to create a plasma therein, a treating chamber in communication with the plasma creating chamber through an electrode for drawing electron beams from the plasma, an input conduit coupled to the treating chamber for introducing a reaction gas therein, and directive means associated with the input conduit for imparting directivity to the reaction gas. With the apparatus, plasma treatment, typically plasma CVD or plasma etching is carried out on an article in the chamber by forming a high density region of the reaction gas substantially perpendicular to the electron beams in the chamber.
    Type: Grant
    Filed: July 19, 1990
    Date of Patent: January 21, 1992
    Assignee: TDK Corporation
    Inventor: Hisao Morooka
  • Patent number: 5082359
    Abstract: A method of forming a polycrystalline film, such as a diamond, on a foreign substrate involves preparing the substrate before film deposition to define discrete nucleation sites. The substrate is prepared for film deposition by forming a pattern of irregularities in the surface thereof. The irregularities, typically craters, are arranged in a predetermined pattern which corresponds to that desired for the location of film crystals. The craters preferrably are of uniform, predetermined dimensions (in the sub-micron and micron size range) and are uniformly spaced apart by a predetermined distance. The craters may be formed by a number of techniques, including focused ion beam milling, laser vaporization, and chemical or plasma etching using a patterned photoresist. Once the substrate has been prepared the film may be deposited by a number of known techniques. Films prepared by this method are characterized by a regular surface pattern of crystals which may be arranged in virtually any desired pattern.
    Type: Grant
    Filed: November 28, 1989
    Date of Patent: January 21, 1992
    Assignee: Epion Corporation
    Inventor: Allen R. Kirkpatrick
  • Patent number: 5080993
    Abstract: The present invention relates to a method for producing a photoreceptor for electrophotography. An aluminum base substrate is worked so that the R.sub.max is between 1.3 and 1.8 microns, with a filtered maximum waviness not exceeding 0.5 microns. The substrate is etched with an aqueous solution of alkali, and then etched with an aqueous solution of nitric acid to form an oxide thin film. A Se-As alloy is vacuum deposited thereon to form a light sensitive layer. This photoreceptor is flat and smooth so that the images obtained by electrophotography are substantially free from white point defects.
    Type: Grant
    Filed: September 19, 1989
    Date of Patent: January 14, 1992
    Assignee: Fuji Electric Co. Ltd.
    Inventors: Yukihiro Maruta, Toshinao Ishizone
  • Patent number: 5077082
    Abstract: A shaped body formed of a polypropylene resin is surface-treated by a method which includes the steps of:providing a shaped body formed of a composition containing (A) 5-95% by weight of a specific propylene-ethylene block copolymer and (B) 5-95% by weight of a specific ethylene-propylene copolymer rubber;contacting a surface of the shaped body with a UV-ray absorbing liquid at a temperature and for a period of time sufficient to swell the surface; andirradiating UV rays having wavelengths of 300 nm or less on the swollen surface thereby increasing the surface energy of the surface of the shaped body. The thus treated shaped body is ready for coating with a coating material.
    Type: Grant
    Filed: April 9, 1990
    Date of Patent: December 31, 1991
    Assignees: Director-General of Agency of Industrial Science and Technology, Sumitomo Chemical Co., Ltd.
    Inventors: Koichiroh Katoh, Tatasuyuki Mitsuno, Hideo Shinonaga, Akio Daimon
  • Patent number: 5065491
    Abstract: A method of producing curved slide fastener chains or a curved slide fasteners is disclosed. Fastener elements are planted along respective one side edges of a pair of fastener tapes, at least one of which tapes is made of solvent-swelling fibers. The fastener elements planted on the respective tapes are inter-engaged with each other to form a fastener chain. A solvent or its aqueous solution, or a solution containing a solvent and dissolving a soluble adhesive, is applied onto either one of the fastener tapes made of solvent-swelling fibers. Subsequently, the fastener chain is shaped into a desired curved configuration. The shaped fastener chain has its curved configuration fixed by being served on a texture, by solidification of the adhesive dissolved in the solvent after evaporation of the solvent or by applying an adhesive onto the shaped fastener chain and solidifying the adhesive.
    Type: Grant
    Filed: October 12, 1989
    Date of Patent: November 19, 1991
    Assignee: Yoshida Kogyo K. K.
    Inventor: Shigeki Takada
  • Patent number: 5064809
    Abstract: A Josephson junction consisting of high temperature ceramic superconductors layers, separated by an ultra-thin insulating barrier made of an non-oxide substance like diamond-like carbon. An integral part of this disclosure is the technique involving the use of an activated oxygen species for providing an oxygen chemical potential which is higher than that obtainable at barometric pressure.
    Type: Grant
    Filed: December 23, 1988
    Date of Patent: November 12, 1991
    Assignee: Troy Investments, Inc.
    Inventor: Aharon Z. Hed
  • Patent number: 5061521
    Abstract: A method for improving the properties of a metathesis polymerized cycloolefin article by treating with molecular halogen in an organic solvent. Degree of treatment can be regulated according to the swelling power of the solvent for the polymer. Improved properties include improved flame retardance, oxidation resistance and surface properties.
    Type: Grant
    Filed: December 18, 1989
    Date of Patent: October 29, 1991
    Assignee: Hercules Incorporated
    Inventors: Zen-ichiro Endo, Shigeyoshi Hara, Umewaka Nakatani
  • Patent number: 5059447
    Abstract: A shaped body formed of a synthetic organic polymer is surface-treated for increasing the surface energy by a spark discharge treatment which is preceded and/or followed by a treatment with a UV ray-absorbing organic liquid and/or a UV irradiation treatment.
    Type: Grant
    Filed: February 15, 1990
    Date of Patent: October 22, 1991
    Assignee: Director-General of Agency of Industrial Science and Technology
    Inventors: Koichiroh Katoh, Etsuji Takehara, Yoshiie Matsumoto
  • Patent number: 5053106
    Abstract: Plastic molded articles having low friction and excellent wear resistance are produced by treating the surface of the plastic article with an aqueous solution of an inorganic fluoride such as hydrogen fluoride. Plastic articles which can be made in accordance with the invention include plastic brake pistons, bearings, motors and drives, commutators, slip ring alternators for DC drive motors, thrust washers, spacers and reactors, clutch plates, electrical switching equipment with sliding parts, gears, pulleys for belt drives, such as cog belt pulleys, V-belt pulleys and poly V-belt pulleys, gas meter discs, and the like. In addition to the treatment step, the plastic articles are neutralized, washed and dried.
    Type: Grant
    Filed: February 7, 1990
    Date of Patent: October 1, 1991
    Assignee: Occidental Chemical Corporation
    Inventors: George T. Miller, Russell J. Morgan
  • Patent number: 5053256
    Abstract: A method of improving the paint adhesion properties of a cycloolefin polymer article comprising exposing the surface of said article to a solution of sodium hypochlorite or a solution of potassium permanganate. Preferably the solution is of sodium hypochlorite and it further contains a detergent solution.
    Type: Grant
    Filed: November 3, 1988
    Date of Patent: October 1, 1991
    Assignee: Hercules Incorporated
    Inventor: Harold F. Haag
  • Patent number: 5049230
    Abstract: A one-step process for treating polymer surfaces prior to electroless deposition is disclosed. Polymer parts are dipped in a solution containing a good solvent for the polymer, a substantial non-solvent for the polymer, an etchant and, where one of these is immiscible with one or more of the others, a solubilizing agent miscible with the immiscible components to provide a single liquid phase. Formulations are provided for pre-swelling and etching of functionalized polymers, such as polycarbonate in one, two and three steps. The etched surface can then be plated with electroless nickel or copper with satisfactory adhesion of the plated metals. Swelling agents make polymer molecules on and near the surface of the polymer easily accessible to a degradation agent. A degradation agent degradates the polymer molecules. If required, a solubilizing agent increases the miscibility of the degradation agent and the swelling agent. A wetting agent increases the effectiveness of the etching agent.
    Type: Grant
    Filed: March 6, 1990
    Date of Patent: September 17, 1991
    Assignee: JP Laboratories, Inc.
    Inventors: Gordhanbhai N. Patel, Durgadas Bolikal
  • Patent number: 5041311
    Abstract: A CVD method comprises the steps of making a plasma self-cleaning within a chamber using a gas which includes fluorine, coating an inside of the chamber by a first layer of a material which includes silicon and nitrogen, and forming a second layer on a predetermined surface within the chamber by a chemical vapor deposition. The second layer is made of a material which includes a quantity of nitrogen smaller than a quantity of nitrogen included in the first layer.
    Type: Grant
    Filed: March 9, 1990
    Date of Patent: August 20, 1991
    Assignee: Fujitsu Limited
    Inventors: Atsuhiro Tsukune, Kenji Koyama
  • Patent number: 5032427
    Abstract: Disclosed herein is a process for preparing the surfaces of through-holes in printed circuit boards (especially multilayer printed circuit boards) for subsequent metallization, in which the through-hole surfaces are treated with a substantially water-immiscible organic liquid which acts upon the insulating substrate of the board, and preferably in the form of a substantially homogeneous, clear mixture comprised of the water-immiscible organic liquid, water, an alkali metal compound and a surfactant component, followed by treatment of the through-hole surfaces with an alkaline permanganate solution. The process can be used as a desmearing and/or etch-back process, a combined desmearing-conditioning process, or a conditioning process following a separate desmearing process.
    Type: Grant
    Filed: November 3, 1989
    Date of Patent: July 16, 1991
    Assignee: MacDermid, Incorporated
    Inventors: Peter E. Kukanskis, Joseph J. D'Ambrisi, John J. Kuzmik
  • Patent number: 5030536
    Abstract: A process for restoring imaging members, which comprises (1) providing, subsequent to its utilization and removal from an electrophotographic imaging device, an amorphous silicon photoconductive imaging member with a protective overcoating; (2) contacting this member with a fluorine containing composition for an effective time period enabling the removal of the protective layer; (3) washing and drying the surface of the resulting imaging member; and (4) subsequently depositing a protective layer thereover.
    Type: Grant
    Filed: December 26, 1989
    Date of Patent: July 9, 1991
    Assignee: Xerox Corporation
    Inventors: Damodar M. Pai, Santokh S. Badesha
  • Patent number: 5019210
    Abstract: Method for water vapor plasma treating the surface of a polymer body to enhance the adhesion of a first and second polymer surface. The method is particularly useful for polyimide surfaces.
    Type: Grant
    Filed: April 3, 1989
    Date of Patent: May 28, 1991
    Assignee: International Business Machines Corporation
    Inventors: Ned J. Chou, Ronald D. Goldblatt, John E. Heidenreich, III, Steven E. Molis, Luis M. Ferreiro, deceased
  • Patent number: 5019425
    Abstract: The invention concerns a process disclosed for the pre-treatment of synthetic materials (plastics), particularly polyetherimide, polycarbonate and poly(ester-co-carbonate), for the adhesive chemical metallization, involving treating the synthetic material with a quaternary base dissolved in an organic solvent.
    Type: Grant
    Filed: November 23, 1988
    Date of Patent: May 28, 1991
    Assignee: Schering Aktiengesellschaft
    Inventors: Michael Romer, Ludwig Stein
  • Patent number: 5015329
    Abstract: Formulations are provided for pre-swelling and etching of functionalized polymers, such as polycarbonate in two or three steps. The etched surface can then be plated with electroless nickel or copper with satisfactory adhesion of the plated metals. Swelling agents make polymer molecules on and near the surface of the polymer easily accessible to a degradation agent. A degradation agent degradates the polymer molecules. If required, a solubilizing agent increases the miscibility of the degradation agent and the swelling agent. A wetting agent increases the effectiveness of the etching agent. In a two-step process, polymer parts are first treated with a solution of a swelling agent followed by etching with a solution of degradation agent.
    Type: Grant
    Filed: March 6, 1990
    Date of Patent: May 14, 1991
    Assignee: JP Laboratories, Inc.
    Inventors: Gordhanbhai N. Patel, Durgadas Bolikal, Richard A. Bellemare
  • Patent number: 5013584
    Abstract: A method for treating permeable plastics and other porous materials to provide solid barriers within the materials that reduce permeability. One method involves migrating a first gas reactant into the material and migrating a second reactant into the material wherein the first and second reactants react at a reaction interface to form a solid reaction product which provides reduced gas permeability for the material. Embodiments are disclosed in which gaseous reactants are migrated from opposite sides of the material to form an internal gas impermeable barrier. Embodiments are also disclosed where the reactants are sequentially migrated into the material to produce gas impermeable barriers. Swelling of the materials prior to treatment with reactants is also disclosed in order to maximize permeation and reactant migration.
    Type: Grant
    Filed: March 15, 1989
    Date of Patent: May 7, 1991
    Assignee: Hughes Aircraft Company
    Inventors: John E. Wreede, Edward T. Knobbe
  • Patent number: 5000980
    Abstract: The present invention relates to a process for coating reinforcing elements preferably in fiber form, wherein said material is treated, between two electrodes, by the field obtained by means of a direct electric current of voltage included between 50 and 150,000 V and/or by means of an alternating electric current of frequency between 50 and 1,000 Hz and of voltage included between 10,000 and 30,000 V, and said element is placed in contact with a powder of a conductive or semi-conductive material.
    Type: Grant
    Filed: December 7, 1988
    Date of Patent: March 19, 1991
    Assignee: Pradom Limited
    Inventor: Michel Berger
  • Patent number: H1164
    Abstract: The surface of commercially available polymer films are treated with a low emperature gas plasma to improve the subsequent bonding of aluminum to the polymer surface without the need for adhesives.
    Type: Grant
    Filed: June 13, 1991
    Date of Patent: April 6, 1993
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: William L. Wade, Jr., Robert J. Mammone, Michael Binder