Abstract: A surface coating agent to be coated on the surface of an elastic molding die, which is a solvent solution of a polyurethane obtained by reacting a polyol with an aromatic polyisocyanate. The surface coating agent can be coated on the inside surface of the elastic molding die to form a coating layer, thereby obtaining a molding with surface gloss. Further, the surface coating agent can be incorporated with silicone and/or a fluorine compound to improve oil resistance of the elastic molding die, preventing the elastic molding die from being swollen by oil components of a molding material and improving durability. When a polyether type polyol is used as the polyol, water resistance of the elastic molding die can be even further improved. The surface coating agent using polycarbonatepolyol as the polyol has improved adhesion to the elastic molding die, thereby improving the durability.

Abstract: A method of coating a metal cookware having a cooking surface includes the steps of: (A) roughening and cleaning the cooking surface of the metal cookware; (B) applying a metallic scratch-resistant layer onto the roughened and cleaned cooking surface; and (C) applying an anti-stick layer onto the scratch-resistant layer, whereby the anti-stick layer has a roughness of about 2.5-5.5 .mu.m, a thickness of about 23-36 .mu.m and a pencil hardness of about 8-9 H, the anti-stick layer consisting essentially of polytetrafluoroethylene (PTFE) and perfluoroalkoxy polymers (PFA), the ratio of PTFE to PFA ranging from 55:45 to 60:40.

Abstract: A process is disclosed for treating aramid fibers with a dispersion of particulate material in a swelling solvent to yield embodiment of the particles in the surface of the fibers.

Abstract: In a continuous surface treating method and apparatus with an inline centrifugal separator, an object to be treated is contained in a basket and hung from a hanger of an overhead type and a series of surface treatments of the object is carried out by using a continuous conveyer of a power and free type. By using a hanger attach-detach conveyer, the object is moved from a main conveyer to a sub-conveyer and an excessive treating liquid attached to the object in a previous process is separated by using the centrifugal separator. Then, the object is returned from the sub-conveyer to the main conveyer to perform a next process. The surface treating apparatus includes the rotatable basket for containing the object.

Abstract: A maskless process for forming a protected metal feature in a planar insulating layer of a substrate is disclosed. A first barrier material is disposed in a recess in an insulating layer, a conductive metal is disposed on the first barrier material such that the entire metal feature is positioned within the recess below the top of the recess, a second barrier material is disposed on the metal feature such that the second barrier material occupies the entire portion of the recess above the-metal feature and extends above the top surface of the insulating layer, and the second barrier material is then polished until the top of the second barrier material is in and aligned with the top of the insulating layer. As a result, the metal feature is surrounded and protected by the first and second barrier materials, and the substrate is planarized.

Abstract: Moldings based on polyamides are surface treated with mixtures of at least 20% strength by weight aqueous hydrochloric acid with mono- or diethers of an aliphatic polyfunctional hydroxy compound in a mixing ratio of from 90:10 to 10:90% by volume.

Abstract: A water- and oil-repelling adsorbing film formed on a material having active hydrogen such as hydroxyl group, imino group and amino group at the surface. This film is a chemically adsorbed film having surface irregularities exceeding 10 nanometers. It is directly or indirectly covalently bonded to the material surface and includes a monomolecular film or a polymer film with the molecules thereof containing a fluorocarbon group and a --Si-- bond. The surface irregularities which exceed the molecular level are at least either those formed on the material surface itself, those due to particles formed on the substrate surface or those due to particles present in the chemically adsorbed film.

Abstract: An electrically conducting material is produced by a process which includes a step of treating a polyester substrate with an aqueous alkali solution to dissolve a portion of the polyester substrate into the solution. The resulting substrate is then reacted with a compound containing a group which can capture copper ion to introduce the copper ion capturing groups in the substrate. The copper ion-capturing group-containing substrate is thereafter treated with a source of copper ion and a sulfidizing agent to form copper sulfide bound to the polyester substrate.

Abstract: An improved process for improving the adhesion between a cemented carbide substrate and a diamond layer deposited thereon by removing the binder phase of the cemented material from the surface of the substrate prior to diamond coating. For this purpose, the process of the invention uses an apparatus as is conventionally used in various technologies for the CVD process of diamond layers. The process parameters are here altered from those of the conventional diamond coating in such a way that binder metal is evaporated from a very narrow boundary zone of the substrate surface, utilizing the reaction heat from the recombination of previously dissociated hydrogen gas directly at the substrate surface.

Abstract: It is possible to use an oriented monolayer to limit the Van der Waals forces between two elements by passivation. The invention disclosed here details how to do so by building the device to be passivated, cleaning the surface to be passivated, activating the surface, heating it along with the material to be used as the monolayer, exposing a vapor of the material to the surface and evacuating the excess material, leaving only the monolayer.

Abstract: The method for metallizing the surface of dielectric materials according to the invention comprises a first step wherein a metal powder, the size of the grains of which is comprised between 10 and 5000 nm, is deposited and then incorporated into the surface of the dielectric material. In a second step of the method, the dielectric material which is so impregnated with metal, is immersed into an autocatalytic bath to coat the impregnated zones of the material with a layer of the metal contained in the bath in a thickness which is proportional to the immersion time. This method enables to metallize materials such as oxides, polymers and composites containing these oxides and/or these polymers. The characteristics of the metal deposits are controlled, on the one hand, by the type of metal, and the size and the geometry of the metal powder grains and, on the other hand, by the type and the structure of the dielectric materials coated with these deposits.

Abstract: Gold can be selectively deposited onto a catalytically-activated region on a surface of a workpiece in the presence of a catalytically-inactive region on the surface by a chemical vapor deposition method. The method involves placing the workpiece in a vacuum chamber and evacuating the vacuum chamber to a base pressure equal to or less than a catalyst-activity-preserving upper pressure limit to eliminate effectively gaseous catalyst-deactivating contaminants from the chamber. The surface composition of at least one region of a target surface of the workpiece is altered to produce a catalytically-activated region on the target surface. At least one region of the target surface disjoint from the catalytically-activated region is a catalytically-inactive region. A gaseous alkylated (trialkylphosphine)gold compound is introduced into the vacuum chamber to expose the target surface of the workpiece to the compound.

Abstract: The invention relates to a process for producing miniaturized chemical and biological sensor elements with ion-selective membranes. To simplify production in the micro range, an aperture (5,6) starting from the front (3) and tapering toward the back (4) is made in a thin silicon substrate (1) so that the front and back are interconnected. A liquid with which the ion-selective membrane is formed is poured into the containment (2) thus formed. Vertical ISFETs may also be made on the above principle.

Abstract: A maskless process for forming a protected metal feature in a planar insulating layer of a substrate is disclosed. A first barrier material is disposed in a recess in an insulating layer, a conductive metal is disposed on the first barrier material such that the entire metal feature is positioned within the recess below the top of the recess, a second barrier material is disposed on the metal feature such that the second barrier material occupies the entire portion of the recess above the metal feature and extends above the top surface of the insulating layer, and the second barrier material is then polished until the top of the second barrier material is in and aligned with the top of the insulating layer. As a result, the metal feature is surrounded and protected by the first and second barrier materials, and the substrate is planarized.

Abstract: A continuous dry coating method and an apparatus therefor which are capable of removing cut chips and burrs from and smoothing inner walls of small-diameter holes in a substrate material and, then, successively performing a cold coating on these small holes in a short period of time. The continuous dry process coating method comprises the steps of: arranging electrodes on opposite sides of a substrate material; performing a plasma discharge to surface-treat small holes made in the substrate material; and then performing an electron cyclotron resonance plasma (ECR plasma) coating on the surfaces of these holes.

Abstract: Members with excellent water- and oil-repelling, and anti-contaminating properties are provided by exposing fillers partially protruding from the surfaces of fiber reinforced plastics or fiber reinforced metals and chemically adsorbing a chlorosilane-based chemical adsorbent to the rough surface of the fiber reinforced plastic or metal substrate. A siloxane-based chemically adsorbed monomolecular film or a polysiloxane chemically adsorbed film is formed on the substrate by chemically adsorbing a chemical adsorbent having numerous chlorosilane groups to the substrate surface. Following that, a chlorosilane-based chemical adsorbent having fluorocarbon groups is chemically adsorbed to the film, thus forming a chemically adsorbed monomolecular or polymer film with water- and oil-repelling properties.

Abstract: A process of electroplating comprising formation of a semiconductive coating over an article having both metallic and non-metallic portions, dissolving the metal surface underlying the semiconductive coating and removing the semiconductive coating by a high pressure water spray. The process is useful for the formation of printed circuit boards.

Abstract: A corrosion resistant electrically conductive coating on steel anode studs used in the production of aluminum by electrolysis.

Abstract: A thin film, intagliated phosphor screen structure includes an optical fiber bundle in which each of the fibers has its glass core etched below the level of its cladding sheath at the internal surface of the screen, and a phosphor layer is deposited as a thin film which fills in the core recesses. Preferably, the upper surfaces of the phosphor layers are formed with a spherical or parabolic shape, which is obtained by surface tension when the phosphor film is annealed. The upper surfaces of the phosphor layers may also be finished by polishing. An aluminum reflective layer may also be coated on the phosphor layer. The bottom walls of the cores are preferably etched to be convex or concave to provide a lens effect. The intagliated phosphor screen can transmit 90% to 95% or more of the light generated in the phosphor layers, for an output gain factor of 5 or more over conventional phosphor screens.

Abstract: The invention provides an apparatus and methods of using the apparatus to transfer conductive patterns onto substrates under conditions of heat and pressure. The apparatus comprises a master mold with a printing surface on which is produced a permanent mirror image of the conductive pattern to be created. This pattern is then coated with a loosely adherent film of conductive metal, such as copper, which is transferred onto a substrate to be printed.

Abstract: A method for the manufacture of printed circuit boards is provided comprising conditioning the board, activating with a catalytic metal, post-activating, stabilizing and etching the copper surfaces before the desired circuit is formed on the board. This process eliminates the need for a flash coating of copper in the through holes before the use of protective coatings such as imaging resists and soldermasks.

Abstract: Disclosed herein is a process for reducing the flammability of aramids by contacting a solvent swollen or never dried aramid with an aqueous solution of a tungsten compound, removing the solvent from, and then drying the aramid. The resulting aramids have superior Limiting Oxygen Indices, making them particularly useful where lower flammability is desired, as in firefighters' overcoats.

Abstract: The invention in one aspect involves a method for repairing an optical system. The optical system includes at least one optical element which comprises, in turn, a substrate having a principal surface, and a multilayer coating overlying the principal surface. The substrate comprises a first material, and the multilayer coating comprises plural second and at least third material layers in alternation. The method includes the steps of removing the multilayer coating from the substrate, and redepositing a new multilayer coating on the substrate. The old multilayer coating is removed in a single etching step while preserving the quality of the principal surface to such an extent that the peak reflectivity of the new multilayer coating is at least 80% the reflectivity of the old multilayer coating.

Abstract: Method for treating surface of dielectric polymer with water vapor plasma to form reactive sites and grafting a reactive polymer thereto to tailor the properties of the dielectric polymer surface.

Abstract: A method for producing a thermally shock resistant washcoated substrate involves introducing a buffer solution into the microcracks, and optionally the micropores of a porous sintered body, the pH of the buffer solution being at a predetermined value to result in the formation of a gel on contact of the buffer solution with the slurry which is to be subsequently applied, contacting the body with a washcoating slurry to form a gel at the interface of the buffer solution and slurry. Formation of the gel prevents the slurry from entering the microcracks. The body is then calcined at a temperature and for a time sufficient to form the washcoated substrate.

Abstract: A method for roughening the surface of a resin molded article to make it susceptible to metallizing is disclosed, comprising contacting a resin molded article at least the surface of which to be toughened mainly comprises a block copolymer comprising 100 parts by weight of a polyphenylene sulfide resin and from 30 to 100 parts by weight of a polyphenylene sulfide ketone resin with a solvent capable of dissolving a polyphenylene sulfide ketone resin more than a polyphenylene sulfide resin.

Abstract: A method of preparing an electrically insulating polymer substrate, particularly those containing an aromatic group, for the reception of an electrically conductive pattern, said substrate having a glass transition temperature or a softening temperature, comprises the steps of: performing a first cleaning of the substrate; heating the substrate in a nitrogen atmosphere for about 3 hours at a temperature of about 20.degree. C. below the glass transition temperature or the softening temperature of the substrate; cooling the substrate to room temperature; roughening the surface of the substrate by, for example, etching said substrate in a chromic acid-containing solution for about 3 minutes at a temperature of between 65.degree. C. and 70.degree. C.; and performing a second cleaning and drying of the substrate.

Abstract: A process is disclosed which is beneficially employed in sensitizing plastic surfaces prior to etching which sensitization enhances the coverage and adhesiveness of the subsequent plate. The composition and process proposed use Limonene, solutions of Limonene and Emulsions of Limonene for the sensitizer.

Abstract: A method for producing a protective coating on the surface of a carbonaceous substrate is described. A substantially uniform coating of a liquid or solid precursor material is provided on the surface of the substrate. The precursor material is one which has boron-oxygen bonds and is substantially non-reactive with the substrate at a first relatively low temperature and is capable of reacting with the substrate at a second temperature which is substantially higher than the first temperature. The substrate is then raised to the second temperature to react the coating with the substrate to form a porous region of substantially uniform depth in the substrate surface. This region contains interconnecting interstices and boron carbide. The interconnecting interstices are then at least partially filled with a glass forming material such as boron, boron oxide, boron carbide, silicon, silicon alloy, silicon dioxide, silicon nitride, silicon oxynitride, germania, and mixtures thereof.

Abstract: The present invention includes methods of permanently modifying the surface of a substrate material so as to develop a microscopically smooth, biocompatible surface thereon. A portion of the substrate surface is first removed, as by etching, in a radio frequency plasma reactor using inert argon gas. A biocompatible polymeric material may be covalently grafted to the surface of the substrate material by radio frequency plasma-induced grafting. The biocompatible polymeric material is preferably the same as the substrate material but may be different. Alternatively, after etching, the surface of a substrate material may be subjected to radio frequency plasma sufficient to raise the temperature at the substrate surface to just above the glass transition temperature (T.sub.g) of the substrate material for a time sufficient to produce a microscopically smooth, biocompatible surface on the substrate material.

Abstract: A method for roughening the surface of a resin molded article to make it susceptible to metallizing is disclosed, including contacting a resin molded article at least the surface portion of which to be roughened mainly includes a block copolymer including 100 parts by weight of a polyarylene sulfide component block and from 100 to 200 parts by weight of a polyarylene sulfide ketone component block with a solvent capable of dissolving a polyarylene sulfide ketone more than a polyarylene sulfide.

Abstract: To provide a process for coating substrate material in which coating material is ablated in an ablation region by a laser beam in a coating chamber containing a negative pressure, propagates in the form of a coating particle stream in the direction of the substrate material and is deposited on it in the form of a coating, with which substrate material can be coated in large quantities by laser ablation, it is proposed that the substrate material be flat material, that the flat material be passed continuously as a continuous strip through the coating chamber and coated under the negative pressure substantially maintained therein, and that the necessary coating material be fed to the coating chamber while the negative pressure is substantially maintained therein.

Abstract: A high gloss color finish for a plastic article is formed by coating and curing a colored primer layer (12) onto a plastic substrate (10). A light transmissive basecoat (14) is applied and cured onto the primer layer (12) to form a substrate (10) with a colored surface. Indium islands (20) are vacuum deposited onto the basecoat (12) to a thickness up to 100 Angstroms to form a visually macroscopically continuous layer (21). The island layer (21) is etched to remove smaller sized islands. A transparent topcoat (24) is applied onto the basecoat and indium islands and cured in place.

Abstract: An automatic manufacturing system receives a semiconductor substrate with etched patterns, loads it onto a chuck in a chamber which is then evacuated. Plasma etching cleans the substrate, then coated with adhesion and nucleation seed layers. A reactor selectively connected, adjacent to the chamber sublimes a precursor of the metal, which is then transported to the substrate. A reactor heat transfer system provides selective reactor cooling and heating above and below the precursor sublimation temperature under the control of programmable software. The heated chuck heats the substrate above the dissociation temperature of the precursor, releasing the metal from the precursor onto the substrate to nucleate the metal species onto the seed layer on the substrate. Then the system is pumped to a lower pressure after expiration of each period of sublimation, and the substrate is advanced to the next chamber, released from the chuck and returned to its original cassette.

Abstract: Disclosed is a method of drilling, desmearing, and additively circuitizing a printed circuit board. The printed circuit board is drilled under conditions which produce glass and polymer smeared vias and through holes. The particulate debris is removed by vapor blasting the drilled printed circuit board. Next the printed circuit board is soaked in a solvent to swell the drill smear on the circuit interplanes of the printed circuit board. This solvent is then removed by entrainment in a gas, and a stream of an aqueous, acidic, oxidizing solution is passed through the printed circuit board holes to remove swollen smear in the thru holes and produce an etchback of conductors. After a water rinse an aqueous reducing solution is passed through the printed circuit board to reduce and remove aqueous acidic oxidizing solution, e.g., residual aqueous acid oxidizing solution. The printed circuit board is rinsed to remove the aqueous reducing solution.

Abstract: Improved adhesion of electroless metal deposited on an organic dielectric layer with phase separated morphology is accomplished by the spontaneous formation of a morphologically and topographically rough surface. In one embodiment a ternary solution of a polar solvent and two polymer precursors of the same polymer which are separable in two phases of different order are cast in film on a substrate and heated to form two phases of different order to spontaneously produce a rough surface. Upon exposure to an alkaline solution, one phase is etched at a faster rate than the other. Seeding and electroless deposition of a metal on the rough surface results in improved adhesion of the metal to the dielectric layer. In a second embodiment a quaternary solution of a polar solvent, a seeding agent, two polymer precursors of the same polymer which are separable in two phases of different order are cast in a thin film on a substrate and heated to form three phases.

Abstract: A multi-layered printed wiring board for high frequency application includes a first board of polytetrafluoroethylene (PTFE) having a metallic sheet on each side. The first side is etched to form high frequency circuity using micro-strip technology and the second side being a metallic sheet forming the ground plane. Laminated to the ground plane of the first board is a fiberglass board of thickness, A. Further, laminated to the fiberglass board is a second board of fiberglass having a thickness, A. The second board also has metallic sheets on both side, the side being laminated to the fiberglass board being etched to form strips, prior to being laminated, forming signal and transmission lines utilizing strip-line technology. Vias are formed to interconnect predetermined metallic layers.

Abstract: An aqueous solvent composition for pre-etching plastic materials prior to plating with metal consists essentially of an aqueous solution containing a component selected from diethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate, and mixtures thereof, and preferably containing a surfactant.

Abstract: The invention relates to a process for producing a plurality of magnetoresistive sensors on the same substrate. The invention particularly has as its object to facilitate a polishing phase of this process. The process of the invention comprises depositing a layer of a magnetoresistive material on a substrate, and then forming in this layer a plurality of magnetoresistive elements. The process further comprises making, at the site of each sensor and before the depositing the magnetoresistive layer, an inclined surface, in such a way that each magnetoresistive element is formed on this inclined surface and exhibits an edge directed outward from the substrate.

Abstract: A method of processing the surface of a metallic rod, wherein coating films (2, 22 and 32) are applied onto portions other than the shape where grooves are to be formed on the surface of the rod, the surfaces of the rods (1, 21 and 31) which are not coated are dissolved and processed by chemical polishing or etching, whereby patterns of very shallow grooves (6, 24 and 34) are formed on the surface of the rod, so that making of grooves on the surface of a very heavy rod, a long rod and a curved rod, which have been considered difficult by the conventional machining, can be easily and accurately carried out. Furthermore, after the making of the grooves, the surface of a rod (41) is plated in a state (42) of being coated by photoresist films and screens, whereby the grooves and the recessed portions (43) are plated (44), and thereafter, the coating films (42) are removed by buffing (45) and the like and the plated surface is finished, thus effectively plating the grooves and the recessed portions.

Abstract: An improved method of laminating a metal foil or sheet to a polyimide material is provided. A solution of a precursor of an intractable (i.e. thermosetting) polyimide is applied to a substrate and the solvent is removed to form a dry tack-free film. Thereafter, a solution of a precursor of a thermoplastic polyimide is applied onto the first film of polyimide and the solvent is removed to form a dry tack-free second film. Both films are then cured concomitantly at a sufficiently rapid rate and low temperature to effect substantial imidization of the polyimide precursors of both films without substantial crosslinking or densification of the polyimides in either of the films. Thereafter, a metal sheet or foil is laminated onto the thermoplastic polyimide film according to the following process. The thermoplastic film is contacted with the sheet or foil of metal to be laminated thereto.

Abstract: A method for producing ultra-high strength galvanized steel strip from a martensitic, plain carbon, steel strip which is pre-treated by induction heating rapidly or by fluxing, then hot dip galvanized and tempered, and then cooled to stop further tempering. The resulting galvanized steel strip has a microstructure comprising tempered martensite, a tensile strength substantially greater than 120,000 psi (827 MPa) and a coating weight substantially greater than 30 g/m.sup.2 /side.

Abstract: An attachment surface for increasing adhesion between two objects or materials and a method for creating such a surface is disclosed. A substrate, including articles such as particularly an implantable device and high performance aircraft parts, is provided with a random irregular pattern formed through a repetitive masking and chemical milling process. Surface material is removed from the substrate without stress on the adjoining material and the process provides fully dimensional fillet radii at the base of the surface irregularities. This irregular surface is adapted to receive the adjacent material to be joined thereto, such as the ingrowth of bone material, and to provide a strong anchor for that material. The unitary nature of the substrate and surface features provides a strong anchoring surface with is resistant to cracking or breaking.

Abstract: In a method of producing a device having at least one optical waveguide on a substrate, two transparent layers are formed one on top of the other on the substrate. The material of the two layers is selected so that the melting point of the material of the second layer is lower than that of the material of the first layer, but has a higher refractive index than the first layer. After formation of the structure, a heating process is performed in which the material of the second layer melts and, due to surface tension, its surface, when seen in cross section, takes on the shape at least approximating the arc of a circle. With this cross-sectional shape, coupling of light waves into and out of an optical fiber is possible at one edge of the substrate after the end faces of the optical waveguide have been ground or polished.

Abstract: A method is provided for immobilizing a semiconductor or noble metal material on a selected support material. In accordance with the method, the support is treated with a first solvent to clean and prepare the surface of the support. A powder slurry including fine particles of the semiconductor in a second solvent is then formed. The resultant slurry is applied to surface of the support. Subsequently, the slurry on the surface of the support is dried at room temperature to remove the second solvent to achieve an intermediate type of bonding between the semiconductor and the support surface.

Abstract: The adhesion of electroless copper to a substrate (1) for a conductor pattern can be improved by applying a SiO.sub.2 layer (3) on which a thin metal pattern of, for example, TiW (51) is provided. Anchors are formed on the surface by subjecting the SiO.sub.2 layer to an underetching treatment. The electroless copper (9) grows around these anchors and, hence, adheres to the substrate.

Abstract: The object of the invention is to minutely roughen a surface of a substrate, e.g. a glass plate, by an etching method for the purpose of enhancing adhesion of a coating film to the substrate surface or preventing sticking of a certain article to the substrate surface. An easily vaporizable material such as a fat or wax as a masking material is used as a masking material, and the substrate surface is scattered with numerous microscopic droplets of the masking material by exposing the substrate surface to vapor of the masking material and simultaneously to vapor of another material, e.g. water or an alcohol, which is immiscible with the masking material and serves the purpose of preventing agglomeration of droplets of the masking material on the substrate surface. After that the substrate is etched with a suitable etching fluid, and then the masking material is removed. As the result the etched surface of the substrate is scattered with numerous microscopic, islet-like land regions.

Abstract: A cemented tungsten carbide substrate is prepared for coating with a layer of diamond film by subjecting the substrate surface to be coated to a process which first removes a small amount of the tungsten carbide at the surface of the substrate while leaving the cobalt binder substantially intact. Murakami's reagent is presently preferred. The substrate is then subjected to a process which removes any residue remaining on the surface as a result of the performance of the process which removes the tungsten carbide. A solution of sulfuric acid and hydrogen peroxide is presently preferred. A diamond coated cemented tungsten carbide tool is formed using an unpolished substrate, which may be prepared by etching as described above or by etching in nitric acid prior to diamond film deposition. Deposition of a substantially continuous diamond film may be accomplished by reactive vapor deposition, thermally assisted (hot filament) CVD, plasma-enhanced CVD, or other techniques.

Abstract: A method of manufacturing a magnetic head which includes a first step of roughening one surface of a core block formed by a polycrystalline magnetic material, a second step of forming a first core member by forming a metallic magnetic film on the one surface, and a third step of joining two core members, at least one of which is the first core member, through a non-magnetic material, so as to form a magnetic gap between them.

Abstract: A method for promoting adhesion of an ultra high modulus polyethylene fiber/epoxy resin composite is proved. The method entails subjecting a fabric made from ultra high modulus polyethylene fibers to a plasma etching, applying a silane coupling agent in hydrolyzed form to the etched fabric, and impregnating the fabric with epoxy resins, followed by molding.