Abstract: An adhesive is provided for bonding cyanate ester composite parts together which is also plateable with metal once chemically etched. The adhesive comprises a polymeric matrix and a filler of cyanate ester polymer. The polymeric matrix comprises at least one polyepoxide resin and a curing agent, while the cyanate ester polymer filler is present in the adhesive as a powder. In practice, the present adhesive is applied to the surface of cyanate ester composite articles to be bonded and is allowed to cure at room temperature. Thereafter, the surface of the assembly is chemically etched and then plated with metal. The present adhesive enable the complete coverage of the cyanate ester composite assembly with the plated metal, including the adhesive bondlines.

Abstract: A method of selectively fabricating metallization on a dielectric substrate is disclosed. A seed layer is sputtered on a polymer dielectric, a patterned photoresist mask is disposed over the seed layer, exposed portions of the seed layer are etched, the photoresist is stripped, and copper is deposited without a mask by electroless plating on the unetched seed layer to form well-adhering high density copper lines without exposing the photoresist to the electroless bath.

Abstract: An open-pore polyurethane foam support body (20) is impregnated in a single step with a solution of a thermoplastic adhesive dissolved in a solvent that is also a foam expander, or in two sequential steps first with a foam expanding solution and then, after the foam has expanded, with a solution of a thermoplastic adhesive, to form an adhesive layer (40) on the surfaces (25) within the pores (22) and passages (24) of the foam body (20). Sorbent particles (30) of activated carbon are introduced into the expanded pores until the expanded foam is packed to the desired density of carbon particle loading. The impregnated and loaded foam is then air dried at room temperature to evaporate the foam expanding solution until the foam body contracts to substantially its original volume.

Abstract: A halogenated polymeric material is exposed to a reducing agent and/or an electrolyte and applied voltage to render exposed portions capable of being metallized and of being etched. The exposed portions can also be doped to thereby induce electrical conductivity therein. Also, new structures containing a free standing halogenated polymeric-containing layer and electrical conductive pattern thereon are provided.

Abstract: Silicon beads are produced by chemical vapor deposition (CVD) on seed particles generated internal to a CVD reactor. The reactor has multiple zones, including an inlet zone where beads are maintained in a submerged spouted bed and an upper zone where beads are maintained in a bubbling fluidized bed. A tapered portion of the upper zone segregates beads by size. Systems for inspecting, sorting and transporting product beads are also disclosed.

Abstract: A layer construction with an organic layer and a transparent cover layer which covers the organic layer and which is harder than the organic layer, and a process for producing such a layer construction in which the cover layer is deposited on the surface of the organic layer from a precursor material present in the gas phase. In order to improve the optical quality of the layer construction, the cover layer, at least in a transition region between the organic layer and the cover layer, is deposited with an index of refraction which differs by a maximum of 20%, in particular by a maximum of 10%, from the index of refraction of the underlying organic layer.

Abstract: Methods for preparing a cutting tool substrate material for diamond coating include providing a grooved pattern on selected portions of at least the top surface and preferably also the sides of the substrate material. The pattern may be a cross-hatching, a diamond-hatching, or another design. The pattern is preferably applied to the tool substrate by scribing with a laser ablation tool. The pattern is designed to optimize adhesion of CVD diamond on the portions of the tool substrate which are expected to be most challenged during a cutting process. The dimensions of the pattern (e.g. the depth and spacing of scribe lines) are selected to provide the optimum combination of mechanical bonding and diamond nucleation during the CVD coating of the tool substrate. According to preferred aspects of the invention, the pattern is applied only to the portions of the surface not immediately adjacent to the cutting edge of the tool substrate, thereby sparing the geometry of the cutting edge itself.

Abstract: A charging device for charging a movable object to be charged. A charging member contacts the object to be charged. A power source applies a voltage to the charging member, wherein the power spectrum PS satisfies the following relation when the space frequency of the profile of the surface of the charging member is analyzed.In the section of 10.ltoreq.f.ltoreq.100 (cycles/mm):PS.ltoreq.-2.5.times.log(f/2)(.mu.m.sup.2)In this way, the charging device prevents charge unevenness due to undulations on the surface of the charging member and charges uniformly while generating very little ozone.

Abstract: A thin fluoropolymer film is covalently bonded to a microporous ptfe film to make a bilayer for separation, filtration or reverse osmosis, by exposing the microporous film to perfluorocyclohexane under plasma. The perfluorocyclohexane molecules undergo scission and the fragments combine on the substrate to make a fluoropolymer film wherein the pores of the substrate have not been completely closed by the coating.

Abstract: A structure of a microporous resin bonded to metal is prepared by a method, comprising, molding a resin composition comprising a polymer alloy consisting of polyether imide and polyphenylene ether and particles of aluminum borate or amorphous silica filler, wherein the particles of aluminum borate and amorphous silica have an aspect ratio of 10 or less and an average diameter of 0.01-100 .mu.m, the aluminum borate having the formula: nAl.sub.2 O.sub.3.mB.sub.2 O.sub.3, wherein n and m individually represent an integer of 1-100, and the amorphous silica having the formula: SiO.sub.2, into a shaped object, treating the molded resin composition with an aqueous alkaline solution to remove the filler, thereby creating micropores within the resin object, and depositing a metal film on a surface of the treated resin object.

Abstract: A process is disclosed for preparing an aramid surface to be metal plated by nonaqueous treatment with a strong base followed by water washing--all in the absence of metal cations.

Abstract: A method of altering a portion of the semiconductive layer of an electric power cable, to increase its resistance so as to render it electrically insulative. The semiconductive layer is loaded with carbon powder which forms chains to provide conductive pathways through the layer. By introducing an intercalant into the semiconductive layer, which causes the layer to swell, the conductive pathways are interrupted and the material is rendered insulative (>10.sup.4 .OMEGA.-cm). The intercalant may be a polymerizable material with a curing agent which is cured in situ, i.e., without removing the semiconductive layer from the cable. By this method, flashover to the semiconductive layer at a cable splice or termination may be prevented without requiring tedious removal of the exposed portion of the semiconductive layer. The method is usable with both strippable and coextruded semiconductive layers.

Abstract: A method and apparatus for transporting thin materials, such as printed circuit boards, through an apparatus for treatment of said boards with an etchant, rinse or other chemical process step, including a transport conveyor having a plurality of rotation members with a specially configured rim for contacting the thin materials and moving them through the apparatus with a longer contact path in each rotation of a rotation member than the circumference of the rotation member.

Abstract: In a method of producing a printed wiring board, solder layers are formed on pads beforehand. After the solder layers have been covered with a solder resist, the solder layers are caused to flow so as to render only the portion of the solder resist overlying the pads fragile. Then, the fragile portions of the solder resist are removed by roughening with the result that solder resist dams for preventing the solder from flowing are formed. This kind of procedure allows thick solder layers to be formed simultaneously with the solder resist dams without resorting to a great number of steps or an extra mask.

Abstract: A coating composition of an alkoxy silane reacted with the surface of a glass substrate and a cleaning composition and method for cleaning said glass area is disclosed. The coating provides water repellency, durability and ease of cleaning to a glass or other siliceous surface. The coating is formed by applying an excess of an alkoxy solution containing a sulfuric acid to a glass surface with an excess of solution being applied. Preparatory to such coating application, the glass, especially if its surface is a weathered (non-virgin) surface, is cleaned vigorously with a cleaning solution containing water, phosphoric acid, hydrofluoric acid and sulfuric acid.

Abstract: This invention relates to a process for the application of conducting metallic, structured coatings on glass substrates, for example, for the manufacture of integrated circuits. The invention relies on placing a negative mask of the structure to be applied into the beam path of an excimer laser. After leaving the mask, the laser beam is directed onto a flat silica glass slice, the back side of which is in contact with a reductive copper bath. The process according to this invention requires exposure times no longer than seconds, after which the process proceeds autocatalytically. It can be stopped as soon as the desired coating thickness has been attained.

Abstract: Carboxymethyl cellulose fiber having a degree of substitution of at least 0.1, preferably 0.2-0.5, carboxymethyl groups per glucose unit is derived from solvent-spun cellulose fiber, for example by reaction with a strong alkali and a monochloroacetate reagent. The fiber has an absorbency of at least 8 grams, usually at least 15 grams, 0.9% saline solution per gram of fibre and a tenacity of at least 10, usually at least 15, cN/tex. It can be used for absorbent personal products.

Abstract: According to the invention, a durable hydrophilic adsorbed film is formed on the surface of a substrate including metals, glass, plastics and the like in which the substrate has a surface layer containing hydroxyl groups or imino groups. The film is formed by covalently bonding chemical absorbents of silane groups containing a pluralilty of chloro groups to the substrate surfaces. The substrate 1 such as glass or nylon is dipped and held in a non-aqueous solution containing fluorocarbon groups and hydrocarbon groups containing chemical absorbents of silane groups containing a plurality of chloro goups including SiCl.sub.4, Cl.sub.3 SiOSiCl.sub.3, HSiCl.sub.3 or Cl.sub.3 SiOSiCl.sub.2 OSiCl.sub.3. After taking out the substrate 1 from the solution, drying it in a low moisture or substantially moistureless atmosphere to remove said non-aqueous solvents, the substrate is exposed to the air. A hydrophilic adsorbed ultra-thin film is thus formed by a dehydrochlorination reaction.

Abstract: The present invention relates to improving the durability of water repellent films and a method for providing the film on a substrate. The water repellent film is preferably formed over the substrate by applying a water repellent composition over the substrate which will form the water repellent film. The durability of the water repellency of the film is improved by activating the substrate with an acid prior to forming the water repellent film over the substrate.

Abstract: A polymer substrate is plated with a metal, using metallic filler particles in the polymer as anchorage points for a layer of metal formed by an electroless plating operation. The polymer has a filler that includes non-metallic filler particles and metallic filler particles; the non-metallic filler particles contiguous to the polymer surface can be etched away, so as to expose metallic filler particles proximate to the etched surfaces. The exposed metallic filler particles serve as anchorage points for the electroless plate layer.

Abstract: This invention relates to a method for manufacturing a tooth pick (1), whereby the tooth pick (1) has a blade (2) of elastic plastic material, whereby the surface of said blade (2) is provided with bristles (4) which have been brought in contact with the blade (2) through electrostatic attraction, whereby the bristles (4) have been brought to unite with the blade (2) and whereby the blade (2) comprises a brushing portion (5) provided with bristles (4) and furthermore, a cleaning tip (6) without or substantially without bristles. In order to also permit cleaning of very narrow interdental spaces by means of this tooth pick (1) without damaging the gums, the cleaning tip (6) has in its full length or at least substantial parts thereof a rectangular cross section.

Abstract: A method of making a gas-impermeable, chemically inert container wall structure comprising the steps of providing a base layer of an organic polymeric material; conducting a pair of reactive gases to the surface of the base layer preferably by pulsed gas injection; heating the gases preferably by microwave energy pulses sufficiently to create a plasma which causes chemical reaction of the gases to form an inorganic vapor compound which becomes deposited on the surface, and continuing the conducting and heating until the compound vapor deposit on the surface forms a gas-impermeable, chemically inert barrier layer of the desired thickness on the surface. Various wall structures and apparatus for making them are also disclosed.

Abstract: A method of preparing a carrier for a blood treatment apparatus includes the steps of dipping a carrier containing about 10 to about 100 parts by weight of a plasticizer with respect to 100 parts by weight of thermoplastic resin in a solvent dissolving only the plasticizer without dissolving the thermoplastic resin thereby extracting the plasticizer, thereafter dipping the carrier in an aqueous solution of about pH 5 to about pH 9, and then drying the same to retain the solute of the aqueous solution in the pores of the resin.

Abstract: A method of preparing electrodes is now described, which electrodes have enhanced adhesion of subsequently applied coatings combined with excellent coating service life. In the method, a substrate metal, such as a valve metal as represented by titanium, is provided with a highly desirable rough surface characteristic for subsequent coating application. This can be achieved by various operations including etching to ensure a roughened surface morphology. In subsequent operations, a barrier layer is provided on the surface of enhanced morphology. This may be achieved by operations including heating, as well as including thermal decomposition of a layer precursor. Subsequent coatings provide enhanced lifetime even in the most rugged commercial environments.

Abstract: A process for forming a protective layer on a rigid surface, such as a metal or wood surface, to provide protection against abrasion, corrosion, heat and fire. The process comprises first preparing the surface of the article. On metal articles, the surface can be prepared by cleaning the surface and then exposing the surface to concentrated phosphoric acid. On wood, the surface can be prepared by thoroughly cleaning the surface with hot water and detergent only. Preferably, the surface is prepared such that a uniform, continuous layer of liquid can be formed thereon. After the surface is prepared, a 10-16% (v/v) silicate-containing solution is then applied for 20 seconds and allowed to dry completely at 305.degree. F. to form a layer of silicate material over the surface. During the drying process, at least a portion of the sodium silicate is converted into silicon dioxide. An acid is then applied to the surface to form the protective layer on the surface.

Abstract: A process for the preparation of polyaniline by an oxidation polymerization of aniline with use of an oxidizing agent and a protonic acid, wherein the pKa value of a byproduct produced by the reduction of the oxidizing agent is greater than the pKa value of the protonic acid. The protonic acid is an aromatic sulfonic acid compound having at least a sulfonic-acid group. A process is also provided for the formation of a solid electrolytic capacitor including an electrolyte of the polyaniline. A method is provided of improving the electrical conductivity of the polyaniline prepared by the above process. The polyaniline is subjected to a heat treatment in a vacuum or an inert gas in which a partial pressure of oxygen is 10 mmHg or below.

Abstract: A ferroelectric thin film superior in coatability, fineness of structure and uniformity of composition, is obtained by a method comprised of inducing ferroelectric reactant materials consisting of plural elements into dissociation by exciting plasma with RF power in order for them to participate in a deposition reaction; setting an optimal process condition in which the ions dissociated from the reactant materials by the excited plasma are subjected to deposition at high temperatures under low pressures; supplying the reactant materials through conduits, a manifold and a shower head to a reactor without deterioration, the manifold collecting the reactant materials, the shower head serving to spray the mixed reactant materials; and depositing a ferroelectric thin film in the reactor while purging residual gas from the conduits.

Abstract: The present invention is related to a method for manufacturing a photodetector which comprises the steps of: (a) preparing a substrate having a back surface; (b) applying a first conducting layer on the back surface; (c) annealing the substrate coated with the first conducting layer in an inert gas atmosphere; (d) applying a anti-corrosion layer on the first conducting layer; (e) immersing the anti-corrosion layer-applied substrate in a hydrofluoric acid aqueous solution with a concentration of 5%.about.10%; (f) eroding the anti-corrosion layer-applied substrate under a current density of about 12.5.about.25 mA/cm.sup.2 for about 5.about.40 minutes to obtain a porous layer therereon; and (g) applying a thin film layer of a second conducting layer to an upper surface of the porous layer to obtain the photodetector. The present photodetector has a wider frequency band and a higher sensitivity than conventional ones and the present manufacturing method is simple and economical.

Abstract: Methods for improving the corrosion inhibition of a metal or metal alloy substrate surface are provided wherein the substrate surface is coated with a polyaniline film. The polyaniline film coating is applied by contacting the substrate surface with a solution of polyaniline. The polyaniline is dissolved in an appropriate organic solvent and the solvent is allowed to evaporate from the substrate surface yielding the polyaniline film coating.

Abstract: An organic layer for subsequent coating with a cover layer which is harder than the organic layer, and a process for surface treatment of the organic layer. In order to improve the quality of a subsequently applied cover layer, growth nuclei for the cover layer, which exhibit sp.sup.2 and/or sp.sup.3 bonding orbital hybridization, are arranged and/or exposed on the free surface of the organic layer.

Abstract: A process for coating metal substrates including cleaning, degreasing and activating the substrate wherein a strongly adhering bonding agent layer is deposited on the substrate. The bonding agent layer comprises a thickness of aluminum. The bonding agent layer is deposited at a temperature not exceeding 300.degree. C.

Abstract: Disclosed is a process of making an elastomeric metallized fabric composed of an elastomeric fabric and a metallic coating substantially covering at least a portion of at least one side of the fabric. The elastomeric fabric may be an elastomeric knit fabric, an elastomeric woven fabric, an elastomeric nonwoven fibrous web, or laminates of one or more of the same. The elastomeric metallized fabric has a metallic coating with a thickness ranging from about 1 nanometer to about 5 microns and which remains on the fabric when the fabric is stretched at least about 25 percent. The elastomeric metallized fabric may be joined with other materials to form multi-layer laminates.

Abstract: The present invention provides methods for modifying surfaces made from metal alloy and/or UHMWPE, preferably surfaces which are frictionally engaged, e.g., in an orthopaedic implant. The methods of the present invention reduce the coefficient of friction of the metal alloy component, reduce the shearing of fibrils from the UHMWPE component, and reduce sub-surface fatigue in the UHMWPE component. The method involves solvent immersion of the UHMWPE component to remove short chains of polyethylene at or near the surface of the component, and to swell and toughen the subsurface of the component. The method also involves firmly coating the surface of the metal alloy component with an adherent layer of diamond-like carbon ("DLC") by creating a metal-silicide interface at the surface of the metal alloy to permit firmer adhesion of DLC.

Abstract: There is disclosed a process of etching the surface of polymeric materials made of polymers having at least one oxidatively degradable functionality which comprises treating said surface with a solution of at least one member of the etchant group consisting of nitronium, nitrosonium ions and complexes thereof, in a solvent containing less than 40% by weight of water and nitroacidium ions and complexes thereof. The process further comprises use of cosolvents and swellants. It also includes pre and post etching steps directed to the preparation of the surface for etching and removal of the etchant respectively.

Abstract: The invention is directed to a process for treating polymer-containing workpiece surfaces and to an aqueous non-aging solution. In addition to the swelling agents used for swelling, alkalizing agents and basic salts, the solution applied in the process contains at least one solubilizer for the swelling agent in the solution which is selected from the group of organic compounds having the general formula HO--A(OH)--R, where A represents a branched or unbranched alkane chain, R represents a branched or unbranched alkyl group or hydrogen, and A and R together contain at least three carbon atoms. The process and the swelling solution can be used for metallizing polymers.

Abstract: The present invention relates to;a method for surface treating a polypropylene resin composition molded article, which comprises irradiating a molded article with ultraviolet light having an irradiation wavelength of 300 nm or less, said molded article being obtained from a polypropylene resin composition which comprises:(A) 15-92% by weight of a crystalline propylene-ethylene block copolymer resin,(B) 5-40% by weight of an ethylene-propylene copolymer rubber,(C) 1-15% by weight of a hydroxyl group-containing propylene oligomer, and(D) 2-30% by weight of an inorganic filler;a method for paint-coating a polypropylene resin composition molded article, which comprises irradiating a molded article with ultraviolet light having an irradiation wavelength of 300 nm or less and coating the irradiated surface with a paint, said molded article being obtained from a polypropylene resin composition which comprises said components (A), (B), (C) and (D) above-mentioned; anda paint-coated article obtained by said method for

Abstract: A method is provided for preparing the surface of a cured cyanate ester resin or composite for metal plating. The composite may comprise graphite fibers embedded in a cured cyanate ester resin matrix The surface is treated with a preheated solution containing an alkali metal salt of an alkoxide. Preferred alkoxides are methoxide, ethoxide, propoxide, isopropoxide, butoxide, tert-butoxide, sec-tutoxide, 2- methyl-2-butoxide, pentoxide and hexoxide. The method of the invention operates to improve adhesion between the treated surface and a subsequently plated metal, such that the resulting cured cyanate ester resin or composite may replace certain metallic components in such applications as aircraft, spacecraft, and automobiles given its highly conductive metallic coating.

Abstract: Structures containing a dielectric material having a polymeric reactive ion etch barrier embedded therein. The preferred dielectric materials are polymers, preferably polyimide materials. The RIE etch barrier is a copolymer having an aromatic component having high thermal stability and having a cross-linking component selected from metallacyclobutane, metallabutene and vinyl groups. The etch barrier is deposited as a solvent free liquid which can fill gaps between the dielectric material and electrical conductors embedded therein. The liquid polymer is cured to a solid insoluble state. The structures with electrical conductors embedded therein are useful for electronic applications.

Abstract: In a plasma-CVD method and apparatus, plasma is formed from a film material gas in a process chamber and, in the plasma, a film is deposited on a substrate disposed in the process chamber. Formation of the plasma from the material gas is performed by application of an rf-power prepared by effecting an amplitude modulation on a basic rf-power having a frequency in a range from 10 MHz to 200 MHz. A modulation frequency of the amplitude modulation is in a range from 1/1000 to 1/10 of the frequency of the basic rf-power. Alternatively, the rf-power is prepared by effecting on the basic rf-power a first amplitude modulation at a frequency in a range from 1/1000 to 1/10 of the frequency of the basic rf-power, and additionally effecting a second amplitude modulation on the modulated rf-power. A modulation frequency of the second amplitude modulation is in a range from 1/100 to 100 times the modulation frequency of the first amplitude modulation.

Abstract: A method of producing an improved adherent interface between a film or coating and a substrate of metal, ceramic, or composite material by laser treatment of the surface. Semi-periodic microscale surface structures of less than 200 microns in magnitude are made by laser radiation of at least 50 pulses with an energy density of 0.01 to 15 J/cm.sup.2 and a duration of 100 femtoseconds to 1 millisecond on each surface area treated.

Abstract: A painted article and a method of producing the same provides that the substrate consisting of polyvinyl chloride is adhered to a paint film selected from the group consisting of polyurethane, acrylic enamel, lacquer and water soluable organic coating is adhered to the substrate while under the residual chemical influence caused by a wetted layer of liquid lacquer material.

Abstract: A polymeric substrate is exposed to an oxygen containing plasma; and then exposed to a reducing atmosphere at an elevated temperature. The reducing treatment reverses the effects on the polymer surface chemistry imparted by action of the oxidizing plasma. In this manner, the original electroactive properties of certain polymers are regenerated at the surface.

Abstract: Process for reducing the friction coefficient between water, and, surfaces of fabricated bodies made from polymeric materials, and for increasing the water repellency of said surfaces, which process comprises treating the concerned surface with a corrosive solution, and coating it with a thin layer of fluorinated polymer.

Abstract: A polymeric film structure having improved oxygen, flavor/odor, grease/oil and moisture barrier characteristics is disclosed. The structure includes a polymeric core sandwiched between an oxygen barrier on one side thereof and a moisture barrier on the other side of the polymeric core. The oxygen barrier includes polyvinyl alcohol cross-linked with aldehyde containing cross-linking agents in the presence of a catalytic amount of an inorganic acid, preferably sulfuric acid. The moisture barrier is a coating of polyvinylidene chloride, which also enhances the oxygen barrier of the polymeric film structure.

Abstract: A method for forming sub-micron sized bumps on the bottom surface of a suspended microstructure or the top surface of the underlying layer in order to reduce contact area and sticking between the two layers without the need for sub-micron standard photolithography capabilities and the thus-formed microstructure. The process involves the deposition of latex spheres on the sacrificial layer which will later temporarily support the microstructure, shrinking the spheres, depositing aluminum over the spheres, dissolving the spheres to leave openings in the metal layer, etching the sacrificial layer through the openings, removing the remaining metal and depositing the microstructure material over the now textured top surface of the sacrificial layer.

Abstract: A method for depositing a conductive metal onto a dielectric substrate is provided. The method includes obtaining a metal sheet having a roughened surface that has the following parameters:R.sub.a =0.05-0.08 mil,R.sub.max =0.20-0.55 mil,S.sub.m =1.00-3.00 mil,R.sub.p =0.20-0.35 mil, andsurface area=0.90-1.20 square milswherein R.sub.a is the average roughness and the arithmetic mean of the departures from horizontal mean line profile;R.sub.max is the maximum peak-to-valley height;S.sub.m is the mean spacing between high spots at the mean line;R.sub.p is the maximum profile height from the mean line; andsurface area is the area under the surface profile from each measurement using a Talysurf S-120 profilometer;The sheet is laminated to the dielectric substrate surface by pressing the roughened surface of the metal sheet against the surface of the substrate and then removed from the substrate.

Abstract: A process for producing a nitrogen-alloyed stainless steel layer on steel by applying nitride containing mixed metal powder or stainless powder to the steel surface, and thereafter treating the steel with laser beams.

Abstract: A process is disclosed for pretreating aluminum-bearing surfaces in a vacuum deposition chamber after a previous step of cleaning the chamber, and prior to depositing tungsten silicide on substrates in the chamber, which first comprises treating the aluminum-bearing surfaces with a mixture of silane and a tungsten-bearing gas, such as WF.sub.6, to form a first deposition of a silane-based tungsten silicide on the aluminum-bearing surfaces. In a preferred embodiment, the process further comprises subsequently treating the already coated aluminum-bearing surfaces of the chamber in a second step with a mixture of a tungsten-bearing gas, such as WF.sub.6, and a chlorine-substituted silane such as dichlorosilane (SiH.sub.2 Cl.sub.2), monochlorosilane (SiH.sub.3 Cl), or trichlorosilane (SiHCl.sub.3) to form a chlorine-substituted silane-based tungsten silicide deposition over the previous deposited silane-based tungsten silicide.

Abstract: Polyimide-metal laminates are formed by etching the surfaces of a polyimide web with a glycol-containing etchant followed by electroless nickel or cobalt deposition and then by copper per deposition. The glycol containing etchant can be utilized to form through holes through the web.

Abstract: A method of manufacturing a thin film magnetic transducer in which a layer of photoresist material is used to pattern the turns of a bi-level electrical coil. The thickness of the photoresist layer is increased to the maximum height of the bi-level coil. A multi-turn spiral type rectangular trench is formed to define the pattern of the coil structure. In the first coil plating step, a first coil section is plated in the trench to approximately the midpoint of its height. The layer of the resist material is then cured and a blocking mask is deposited over the portion of the first coil section that is not to be further increased in height. The area of the coil that is not blocked by the blocking mask is again plated using the initial pattern until each partial turn in the unblocked section reaches the top of the groove. The cured resist material and the blocking mask are then removed.