Etching, Swelling, Or Dissolving Out Part Of The Base Patents (Class 427/307)
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Patent number: 6632470Abstract: A method of modifying surfaces of a device, for example, a medical device, is disclosed. The method includes modifying a surface of a device by providing a device, exposing the device to a reactive gas and plasma energy to create a plasma deposited surface on the device, and quenching the device with the reactive gas. The device exhibits changes in its surface properties thereby making it more desirable for an intended use.Type: GrantFiled: January 31, 2001Date of Patent: October 14, 2003Assignee: PercardiaInventors: Marco Morra, Clara Cassinelli, Linda Lee Cahalan, Patrick T. Cahalan
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Publication number: 20030190426Abstract: Methods and apparatus are provided for forming a metal or metal silicide layer by an electroless deposition technique. In one aspect, a method is provided for processing a substrate including depositing an initiation layer on a substrate surface, cleaning the substrate surface, and depositing a conductive material on the initiation layer by exposing the initiation layer to an electroless solution. The method may further comprise etching the substrate surface with an acidic solution and cleaning the substrate of the acidic solution prior to depositing the initiation layer. The initiation layer may be formed by exposing the substrate surface to a noble metal electroless solution or a borane-containing solution. The conductive material may be deposited with a borane-containing reducing agent. The conductive material may be used as a passivation layer, a barrier layer, a seed layer, or for use in forming a metal silicide layer.Type: ApplicationFiled: April 3, 2002Publication date: October 9, 2003Inventors: Deenesh Padhi, Joseph Yahalom, Sivakami Ramanathan, Chris R. McGuirk, Srinivas Gandikota, Girish Dixit
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Publication number: 20030189026Abstract: Methods and apparatus are provided for forming a metal or metal suicide layer by an electroless deposition technique. In one aspect, a method is provided for processing a substrate including depositing an initiation layer on a substrate surface, cleaning the substrate surface, and depositing a conductive material on the initiation layer by exposing the initiation layer to an electroless solution. The method may further comprise etching the substrate surface with an acidic solution and cleaning the substrate of the acidic solution prior to depositing the initiation layer. The initiation layer may be formed by exposing the substrate surface to a noble metal electroless solution or a borane-containing solution. The conductive material may be deposited with a borane-containing reducing agent. The conductive material may be used as a passivation layer, a barrier layer, a seed layer, or for use in forming a metal silicide layer.Type: ApplicationFiled: April 3, 2002Publication date: October 9, 2003Inventors: Deenesh Padhi, Joseph Yahalom, Sivakami Ramanathan, Chris R. McGuirk, Srinivas Gandikota, Girish Dixit
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Publication number: 20030190418Abstract: The present invention is to provide a method of making a polymer compound material by coating an inorganic material on the surface of a polymer. The method provided by the present invention comprises the step of spraying a high volatile solvent to a chipped polymeric matrix to slightly dissolve the surface of the matrix, and the step of adding inorganic material powders to let the powders be coated on the surface of the matrix layer by layer so as to form the polymer compound material.Type: ApplicationFiled: August 7, 2002Publication date: October 9, 2003Inventor: How Tseng
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Patent number: 6627280Abstract: To provide a polyester hollow molded product which eliminates the possibility of contaminating its contents, retains excellent transparency after it is used repeatedly by recycling and can be re-used with a substantially unscratched surface. The polyester hollow molded product has a polyester coating layer on the exterior surface and the coating layer can be removed with hot water or alkaline aqueous solution.Type: GrantFiled: July 2, 2001Date of Patent: September 30, 2003Assignee: Teijin LimitedInventors: Minoru Suzuki, Hiroki Nagano
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Patent number: 6623786Abstract: A method of modifying the surface characteristics of a polymeric hydrogel, and a polymer article formed therefrom, without causing substantial swelling or distortion or the hydrogel. A preferred method includes photoinitating of the surface of the article with a benzophenone and grafting a macromer having a number-average molecular weight greater than 1000 in the presence of UV irradiation. The preferred article is a siloxane-containing hydrogel, especially a soft contact lens.Type: GrantFiled: June 4, 2001Date of Patent: September 23, 2003Assignee: Novartis AGInventors: Richard Carlton Baron, Qin Liu
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Publication number: 20030175429Abstract: The present invention provides a truck trailer manufacturing facility is for coating workpieces such as metal plates or grating sections with a thermal spray anti-slip coating that provides a durable, high coefficient of friction surface on the workpieces. The manufacturing facility of the invention includes at least one surface preparing machine and at least one coating machine housed in a truck trailer. The present invention also provides a method of coating a workpiece with the truch trailer manufacturing facility.Type: ApplicationFiled: March 11, 2003Publication date: September 18, 2003Applicant: W.S. Molnar CompanyInventors: William S. Molnar, Kevin J. Heinl, Brian P. Pelto, Joseph J. Schulte
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Patent number: 6616966Abstract: A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structure, depositing a structure material (e.g., conductive material) in the opening, and overfilling the opening with the structure material, removing a portion of the structure material, and removing a first portion of the masking material. In this embodiment, at least a portion of the first portion of the spring structure is freed of masking material. In one aspect of the invention, the method includes planarizing the masking material layer and structure material to remove a portion of the structure material. In another aspect, the spring structure formed includes one of a post portion, a beam portion, and a tip structure portion.Type: GrantFiled: February 26, 2001Date of Patent: September 9, 2003Assignee: FormFactor, Inc.Inventors: Gaetan L. Mathieu, Benjamin N. Eldridge, Gary W. Grube
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Patent number: 6610373Abstract: In a device for forming magnetic film which deposits magnetic material on a substrate 12, a device is provided which, before the magnetic film is formed in a magnetic film-forming chamber 11, cleans one or both of the film-forming face and reverse face of the substrate 12 in a cleaning processing chamber 13. The cleaning mechanism carries out cleaning by placing a substrate on a horseshoe-shaped insulator substrate-holding part 51 which moves up and down, and emission of gas from the reverse face of the substrate and the like is brought about by generating Ar plasma between the upper periphery of the substrate, the substrate and a lower insulator 61 of the substrate.Type: GrantFiled: October 10, 2001Date of Patent: August 26, 2003Assignee: Anelva CorporationInventors: Daisuke Nakajima, Koji Tsunekawa, Naoki Watanabe
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Publication number: 20030134040Abstract: Described herein is a method for providing a clean edge at the interface of a portion of a substrate coated with a coating system and an adjacent portion of the substrate which is uncoated. The method includes the step of forming a zone of non-adherence on the substrate portion which is to be uncoated, prior to application of the coating system. The zone of non-adherence is adjacent the interface, so that the coating system will not adhere to the zone of non-adherence, but will adhere to the portion of the substrate which is to be coated with the coating system.Type: ApplicationFiled: January 11, 2002Publication date: July 17, 2003Applicant: General Electric Company-CRDInventors: Robert Anthony Fusaro, Timothy Francis Bethel
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Patent number: 6592947Abstract: The present invention relates to methods for selectively enhancing corrosion protection of fabricated metal parts. One method of the present invention includes providing a non-galvanized metal sheet to be processed to form the fabricated metal part; selecting a localized region on the non-galvanized metal sheet; roughening the localized region for acceptance of a protective coating; applying a protective coating to localized region; and fabricating the non-galvanized metal sheet into a fabricated metal part. Another method includes providing a galvanized metal sheet; selecting a localized region on the galvanized metal sheet; applying a protective coating to the localized region; and fabricating the galvanized metal sheet into a fabricated metal part. Yet another method includes selecting a localized region on a fabricated metal part; roughening the localized region for acceptance of a protective coating; and applying the protective coating to the localized region.Type: GrantFiled: April 12, 2002Date of Patent: July 15, 2003Assignee: Ford Global Technologies, LLCInventors: Robert Corbly McCane, John Lawrence Bomback, Guilian Gao
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Publication number: 20030129310Abstract: The invention includes a method of electroless deposition of nickel over an aluminum-containing material. A mass is formed over the aluminum-containing material, with the mass predominantly comprising a metal other than aluminum. The mass is exposed to palladium, and subsequently nickel is electroless deposited over the mass. The invention also includes a method of electroless deposition of nickel over aluminum-containing materials and copper-containing materials. The aluminum-containing materials and copper-containing materials are both exposed to palladium-containing solutions prior to electroless deposition of nickel over the aluminum-containing materials and copper-containing materials. Additionally, the invention includes a method of forming a solder bump over an aluminum-containing material.Type: ApplicationFiled: January 9, 2002Publication date: July 10, 2003Inventor: Nishant Sinha
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Patent number: 6589593Abstract: A process for coating substrates having polymer surfaces with metals in the manufacturing of printed circuit boards, in particular in the manufacturing of printed circuit boards having microscopic holes and fine geometries by the application of an electroconductive polymer layer and a subsequent metallization, wherein the electroconductive polymer layer is preferably doped with a zinc-containing, colloidal palladium solution prior to the metallization step, the electroconductive polymer is poly-3,4-ethylenedioxythiophene and a contacting with a copper(II) salt solution is performed prior to the metallization.Type: GrantFiled: November 15, 2000Date of Patent: July 8, 2003Assignee: Blasberg Oberflächentechnik GmbHInventors: Jürgen Hupe, Sabine Fix, Ortrud Steinius
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Publication number: 20030118719Abstract: The invention relates to a method for producing a marking device (1), according to which a coding coating is applied to the surface of a support (2). The coding coating comprises at least one magnetic base layer (3), at least one magnetic coding layer (5) and a non-magnetic intermediate layer (4) placed therebetween. Said intermediate layer is composed in such a way that areas of non-parallel or anti-parallel magnetic coupling occur. The invention is characterized in that zones on the surface of the support (2) are roughened, before the coding coating is applied. The invention also relates to apparatus for carrying out said method.Type: ApplicationFiled: October 16, 2002Publication date: June 26, 2003Inventors: Jan Morenzin, Daniel Schondelmaier, Wolfgang Eberhardt
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Publication number: 20030118731Abstract: A method of fabricating a process chamber component that has a ceramic form with grains and grain boundary regions. In the method, the component is bead blasted to provide a surface having a relatively low roughness average of less than about 150 microinches. The component is dipped into a solution having a concentration that is sufficiently low to reduce etching of grain boundary regions of the ceramic form. A metal coating is formed over at least a portion of the ceramic form. The component fabricated by this method can tolerate thicker deposits of sputtered material in a sputtering process without the sputtered deposit accumulates causing spalling of the coating of the component.Type: ApplicationFiled: December 21, 2001Publication date: June 26, 2003Applicant: Applied Materials, Inc.Inventors: Yongxiang He, Hong Wang, Clifford Stow
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Publication number: 20030104128Abstract: A method of reducing the formation of surface defects in a coated substrate includes providing coating powders at both the appearance surfaces and the non-appearance surfaces of the substrate. A method of coating a substrate includes machining the appearance surface of the substrate, machining the non-appearance surface of the substrate, disposing a first powder at the appearance surface of the substrate, and disposing a second powder at the non-appearance surface of the substrate. The powders are disposed at the surfaces by electrostatic deposition. A method of facilitating the adherence of a coating at an edge between two surfaces of a substrate includes configuring the edge to have a rounded surface.Type: ApplicationFiled: November 25, 2002Publication date: June 5, 2003Inventor: Gordon L. Tullos
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Patent number: 6572926Abstract: Applicants' invention is a product that is biocompatible and antimicrobial. According to Applicants' invention, a monomeric quaternary ammonium salt in a solvent is exposed to a polymeric substrate. The quaternary salt in solvent is absorbed by the polymeric substrate and the quaternary salt is polymerized thereby creating a product having quaternary salts impregnated on its surface. The polymerized material also penetrates the surface to some depth forming an interpenetrating network.Type: GrantFiled: November 9, 2000Date of Patent: June 3, 2003Assignee: Biosafe, Inc.Inventors: Harry C. Morgan, Joseph F. Meier, Robert L. Merker
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Patent number: 6569492Abstract: The invention relates to a process of repairing a MCrAlY-coating of an article, which has being exposed to the hot gases of, for example, a gas turbine. The MCrAlY-coating is examined and repaired only locally where it is needed and then, subsequently, on top of the MCrAlY-coating the article is aluminized and/or chromized, avoiding the stripping of the whole coating and re-coating over the entire surface of the article. This is for replenishing the coating of Al and/or Cr that become depleted during engine operation, in an easy, cost and time saving manner.Type: GrantFiled: June 1, 2001Date of Patent: May 27, 2003Assignee: Alstom LtdInventors: John Fernihough, Abdus S. Khan, Maxim Konter, Markus Oehl, Hans-Joachim Dorn
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Publication number: 20030091746Abstract: A method of coating a fluorocarbon resin includes roughening a coating surface by shot-blasting using a water-soluble shot material or a vaporizable shot material or by irradiation of laser or plasma. The method provides a high-quality fluorocarbon resin coating having excellent contact and adhesion properties, which is not peeled off even during a sliding movement performed under severe load conditions. In addition, a shot material used in the coating substrate treatment does not remain in a base material made of an aluminum alloy or the like in the vicinity of a coating layer. Thus, there is no possibility that residual shot material damages the coating layer or the like.Type: ApplicationFiled: October 25, 2002Publication date: May 15, 2003Inventors: Toru Takahashi, Toshio Watakabe, Akira Matsuno
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Patent number: 6558733Abstract: An implantable prosthesis, for example a stent, is provided having one or more micropatterned microdepots formed in the stent. Depots are formed in the prosthesis via chemical etching and laser fabrication methods, including combinations thereof. They are formed at preselected locations on the body of the prosthesis and have a preselected depth, size, and shape. The depots can have various shapes including a cylindrical, a conical or an inverted-conical shape. Substances such as therapeutic substances, polymeric materials, polymeric materials containing therapeutic substances, radioactive isotopes, and radiopaque materials can be deposited into the depots.Type: GrantFiled: October 26, 2000Date of Patent: May 6, 2003Assignee: Advanced Cardiovascular Systems, Inc.Inventors: Syed F. A. Hossainy, Li Chen
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Patent number: 6559242Abstract: An aqueous immersion bath contains a water-soluble peroxide compound and a transition metal salt and is used to activate the surface of a thermoplastic olefin prior to the application of a coating thereon. After immersion of the thermoplastic olefin material in the aqueous immersion bath, an improved adhesion between the coating and the surface of the thermoplastic olefin material is obtained.Type: GrantFiled: May 2, 2002Date of Patent: May 6, 2003Assignee: Ford Global Technologies, Inc.Inventors: James Charles Ball, Willie C Young
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Publication number: 20030082313Abstract: A method for treating a metal enclosure to prevent the enclosure from being contaminated, comprises the steps of: (a) sand-blasting the enclosure; (b) preheating the enclosure to a predetermined temperature, and putting the enclosure into the space in a vacuum chamber between two electrodes; (c) introducing reactive gases into the vacuum chamber, the reactive gases including 1,1,3,3-tetramethyldisiloxane and oxygen; (d) applying high electrical power to the electrodes to cause the reactive gases to become an ionized plasma, the plasma reacting with a surface of the enclosure to form a layer of silicon oxide thereon. The layer of silicon oxide resists formation of a fingerprint when it is touched by a user.Type: ApplicationFiled: January 16, 2002Publication date: May 1, 2003Inventor: Wen-Shan Chien
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Patent number: 6555163Abstract: A developing roller is provided with a roller core, an electrically conductive layer provided on a circumferential surface of the roller core, and a covering layer provided on the outer circumferential surface of the conductive layer. The covering layer has a thickness of 30 &mgr;m or less, but 0.1 &mgr;m or more, and has at least its surface region formed of a porous body.Type: GrantFiled: May 3, 2002Date of Patent: April 29, 2003Assignee: Nitto Kogyo Co., Ltd.Inventor: Naka Hirayama
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Publication number: 20030072888Abstract: A method of forming a buried wiring comprising the steps of: (A) forming a wiring and a first insulating layer filled between the wirings on a substratum, (B) immersing the first insulating layer in a fluid which can dissolve the first insulating layer, to dissolve the first insulating layer into the fluid, (C) substituting, for the fluid, a raw material solution containing a raw material for forming a second insulating layer, without bringing the wiring into contact with a gas, and (D) filling a second insulating layer formed by gelation in the raw material solution at least between the wirings, and then, drying off the raw material solution, thereby to form the second insulating layer at least between the wirings.Type: ApplicationFiled: November 19, 2002Publication date: April 17, 2003Inventors: Takeshi Nogami, Naoki Komai, Koichi Ikeda, Takashi Kinoshita, Kohei Suzuki, Nobuyuki Kawakami, Yoshito Fukumoto
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Patent number: 6548428Abstract: The invention consists of a multilayer material and a process for manufacturing this material. The multilayer material comprises a polyester substrate which is provided with a thermoset plastic polymer coating and a layer of contact adhesive. The polymer coating is produced by a reaction between a polyurethane polymer containing hydroxyl groups and a low molecular linear polyisocyanate, with catalytic tin-organic additives and colorants. The multilayer material is resistant to tearing and is also weather-resistant. A transparent, reactive layer, consisting, for example of a layer to take toner or ink, or a metallic layer, can be deposited on the side opposite to the polymer-coated substrate. Multilayer materials of this kind are suitable for large-scale covering of supporting frameworks in the construction of model aircraft and are also suitable as a medium onto which images and print may be applied using a plain paper copier, and can also be used to carry advertising.Type: GrantFiled: July 2, 1996Date of Patent: April 15, 2003Inventors: Siegfried Lanitz, Heinz Piesold
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Patent number: 6544583Abstract: A method for adjusting resistivity of a film heater on a substrate for use in process fluids employed in the semiconductor-processing industry as part of a clean, particle-free, nonreactive, non-trapping, ultra-pure, thermally tolerant, sealed system. In one arrangement, the method includes the steps of selecting a heating rate, selecting an electrical resistance value in accordance with the heating rate, selecting a resistive material for coating a substrate to produce resistance heating consistent with the electrical resistance value, selecting dimensions for a film of the resistive material selected to balance effects of conductivity, resistivity, length, and area against effects of the heating rate, and forming the film by conformally coating a surface of the substrate with the film at the selected dimensions.Type: GrantFiled: December 15, 2000Date of Patent: April 8, 2003Assignee: Trebor International, Inc.Inventor: Steven A. Black
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Patent number: 6537608Abstract: A method of forming an electronic structure, including adhesively coupling a plated metallic layer (e.g. a copper layer) of a plated through hole (PTH) to holefill material (e.g., epoxy resin) distributed within the PTH. The adhesive coupling utilizes an adhesion promoter film on the plated metallic layer such that the adhesion promoter film is bonded to the resin. The adhesion promoter film may include a metallic oxide layer such as a layer containing cupric oxide and cuprous oxide, which could be formed from bathing a PTH plated with copper in a solution of sodium chlorite. The adhesion promoter film may alternatively include an organometallic layer such as a layer that includes a chemical complex of metal and an organic corrosion inhibitor. The organometallic layer could be formed from bathing the PTH in a bath of hydrogen peroxide, sulfuric acid, and the organic corrosion inhibitor.Type: GrantFiled: January 2, 2001Date of Patent: March 25, 2003Assignee: International Business Machines CorporationInventors: Thomas R. Miller, Kristen A. Stauffer, Michael Wozniak
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Publication number: 20030049434Abstract: A diamond coated cutting tool that has a treated substrate and a diamond coating thereon. In the process of making the substrate, the sintered substrate is re-sintered to form a re-sintered substrate and the re-sintered substrate is chemically treated to remove cobalt on the surface of the re-sintered substrate as to form a treated substrate.Type: ApplicationFiled: September 5, 2001Publication date: March 13, 2003Inventors: Yixiong Liu, Joseph M. Tauber, Charles Erik Bauer
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Patent number: 6528159Abstract: A diamond sintered body tool (20) having superior adhesion resistance, chipping resistance and high strength includes a tool base material (22) including a diamond sintered body, and a surface layer (21) formed on a surface of the tool base material (22). The surface layer (21) includes at least one of silicon, a silicon oxide, a silicon carbide, a silicon nitride and a solid solution thereof. The tool base material (22) has an inner portion (22b) including a first content of an iron group metal, and a surface portion (22a) surrounding the inner portion (22b ) and including a second content of the iron group metal lower than the first content.Type: GrantFiled: September 1, 2000Date of Patent: March 4, 2003Assignee: Sumitomo Electric Industries, Ltd.Inventors: Yasuyuki Kanada, Yoshihiro Kuroda, Noboru Yamazaki, Yasunobu Ogata, Kunihiro Tomita, Tetsuo Nakai, Makoto Abe
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Patent number: 6528111Abstract: Provided is a method for recovering a slip resistance value of a basalt-tiled road surface by treating with an acid solution.Type: GrantFiled: April 5, 2000Date of Patent: March 4, 2003Assignee: Nippon Hodo Co., Ltd.Inventors: Hajime Taniwaki, Osamu Taitoh, Yoshishige Takagi
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Publication number: 20030035895Abstract: The present invention discloses a sucker rod with high resistance to corrosion, to be used preferably in oil wells. Said sucker rod comprises a core of carbon steel, whether alloyed or not, whose surface is coated by a copper base alloy. Said alloy comprises a 50 to 99.9% copper rate. A process for manufacturing said sucker rod is included.Type: ApplicationFiled: August 30, 2002Publication date: February 20, 2003Inventors: Gustavo Luis Bianchi, Lelio Alberto Gawantka Da Silva
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Patent number: 6517888Abstract: The present invention is directed to a method for manufacturing a medical device having a coated portion which comprises obtaining a structure having an inner surface and an outer surface; coating at least a portion of the inner or outer surface with a first coating material; and ablating the coated tubular structure with a laser to form at least one opening therein to form the coated portion. A plate can be used instead of the structure, and the plate is folded to form the structure after the ablation. A plurality of medical devices, made of any materials and having uniform coating(s), can be easily manufactured by the method of the present invention.Type: GrantFiled: November 28, 2000Date of Patent: February 11, 2003Assignee: Scimed Life Systems, Inc.Inventor: Jan Weber
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Publication number: 20030026917Abstract: A domed enclosure wall for a plasma processing chamber is made from a dielectric material having a roughened surface with a roughness average of from about 150 to about 450 microinches. A plasma sprayed ceramic coating is applied on the roughened surface of the dielectric material. The plasma sprayed coating comprises a textured surface having a roughness with an average skewness that is a negative value. When the enclosure wall is used in a plasma processing chamber, sputtered material generated by a plasma formed in a plasma processing chamber has good adherence to the textured surface.Type: ApplicationFiled: June 27, 2001Publication date: February 6, 2003Inventors: Shyh-Nung Lin, Mark D. Menzie, Joe F. Sommers, Daniel Owen Clawson, Glen T. Mori, Lolita L. Sharp
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Patent number: 6500488Abstract: A method of forming a fluorine-bearing diamond layer on non-diamond substrates, especially on tool substrates comprising a metal matrix and hard particles, such as tungsten carbide particles, in the metal matrix. The substrate and a fluorine-bearing plasma or other gas are then contacted under temperature and pressure conditions effective to nucleate fluorine-bearing diamond on the substrate. A tool insert substrate is treated prior to the diamond nucleation and growth operation by etching both the metal matrix and the hard particles using suitable etchants.Type: GrantFiled: August 4, 1992Date of Patent: December 31, 2002Assignee: Northwestern Univ.Inventors: R. P. H. Chang, Kevin J. Grannen
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Publication number: 20020198601Abstract: A process for creating surface microporosity on a titanium (or other metal) medical device includes creating a surface oxide layer on the device; placing the device, which is connected to a negative terminal of an electrical power supply, into a calcium chloride bath; connecting the positive terminal of the power supply to an anode immersed in or containing calcium chloride thereby forming an electrolytic cell; passing current through the cell; removing the device from the bath; and cooling and rinsing the device to remove any surface salt. If necessary, the device is etched to remove metal oxide which may have formed during the cooling process. The resulting device has a microporous surface structure. Alternatively, only a designated surface portion of a medical device is made microporous, either by applying a non-oxidizing mask, removing a portion of the oxide layer, or subtracting a portion of a microporous surface.Type: ApplicationFiled: June 21, 2001Publication date: December 26, 2002Applicant: SYNTHEON, LLCInventors: Thomas O. Bales, Scott L. Jahrmarkt
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Publication number: 20020192460Abstract: A laminate is made by adhering at least one metal layer selected from the group consisting of copper and a copper alloy to a resin layer. A coating film of an azole-copper complex compound formed by a contact with an aqueous solution containing an azole compound in an range from 0.1 mass % to 15 mass % and an organic acid in a range from 1 mass % to 80 mass % is formed on the metal layer surface, and the metal layer adheres to the resin layer via the coating film of the azole-copper complex compound. Thereby, the present invention provides a laminate with improved adhesion between a surface of copper or a copper alloy and resin in a multilayered printed circuit board, and also a method of manufacturing the laminate.Type: ApplicationFiled: April 23, 2002Publication date: December 19, 2002Applicant: MEC COMPANY LTD.Inventors: Mutsuyuki Kawaguchi, Jun Hisada, Toshiko Nakagawa
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Patent number: 6488993Abstract: A process for coating a moving length of sheet metal is disclosed that includes the steps of 1) cleaning the moving length of sheet metal to remove surface contaminants that may interfere with the coating adhering to the sheet metal; 2) applying an electron beam curable coating to the moving length of sheet metal; and, 3) exposing the coating on the moving length of sheet metal to an electron beam to cure the coating, the cleaning, coating and curing resulting in no emission of pollutants that need to be removed before the emission is released into the atmosphere.Type: GrantFiled: October 13, 1999Date of Patent: December 3, 2002Inventor: William V Madigan
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Publication number: 20020176931Abstract: A used developer-carrying member having a resin coating layer on a substrate is regenerated through a step of scraping the resin coating layer of the used developer-carrying member to form a developer-carrying member surface having unevenness showing a central line-average roughness Ra of at most 0.8 &mgr;m, and a step of coating the developer-carrying member surface having the unevenness with a coating layer of a resinous composition comprising at least a binder resin and electroconductive fine powder. The regenerated developer-carrying member can be reinstalled in a developing apparatus and subjected to repetitive electrophotographic image forming cycles.Type: ApplicationFiled: January 14, 2002Publication date: November 28, 2002Applicant: Canon Kabushiki KaishaInventors: Yasuhide Goseki, Masayoshi Shimamura, Yasutaka Akashi, Kenji Fujishima, Kazunori Saiki, Satoshi Otake, Naoki Okamoto
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Patent number: 6479094Abstract: A method for forming a resistor on a roughened surface for use in process fluids employed in the semiconductor-processing industry as part of a clean, particle-free, nonreactive, non-trapping, ultra-pure, thermally tolerant, sealed system. In one arrangement, the method for forming the resistor includes the steps of selecting a coating for the roughened surface from among the group of resistive materials, roughening a surface to promote mechanical adherence of the coating to the selection of a coating comprising resistive material, roughening a surface for promoting mechanical adherence of the resistive material thereto, and electroplating the resistive material onto the roughened surface to provide a uniformly controllable resistance in the coating.Type: GrantFiled: January 30, 2001Date of Patent: November 12, 2002Assignee: Trebor International, Inc.Inventor: Steven A. Black
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Patent number: 6475553Abstract: The invention is based on the discovery that flocked or textured materials (e.g., for use as dental floss, or toothbrush bristles) can be manufactured without using adhesives to secure the short fibers or texture particles to the base material, or substrate. The flocked or textured materials are formed by thermally or chemically softening a preformed substrate (e.g., sheets, fibers, or filaments made of TEFLON® fibers, KEVLAR® fibers, cotton, polyester, polyethylene, or other plastic), then treating the softened substrate with short fibers or texture particles. Alternatively, the short fibers or texture particles can be applied during the formation of the substrate (e.g., in an extrusion, melt-blowing, die casting, weaving, or drawing process).Type: GrantFiled: April 10, 2001Date of Patent: November 5, 2002Assignee: Gillette Canada CompanyInventors: Gordon G. Guay, Ahmet Cem Firatli, Norbert Schaefer, Armin Schwarz-Hartmann, Georges Driesen, Rainer Hans
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Patent number: 6465040Abstract: A method is provided for refurbishing a service operated metallic coating on a substrate alloy, the coating including at least within a coating outer surface at least one oxide chemically grown from at least one coating element, for example Al, and chemically bonded with the coating outer surface as a result of thermal exposure during service operation. Growth of the oxide has depleted at least a portion of the coating element from the coating. The method comprises removing the oxide from the coating outer surface while substantially retaining the metallic coating, thereby exposing in the coating outer surface at least one surface void that had been occupied by the oxide. The retained metallic coating is mechanically worked, substantially without removal of the retained coating, to close the void, providing a treated metallic coating surface over which a refurbishing coating is applied.Type: GrantFiled: February 6, 2001Date of Patent: October 15, 2002Assignee: General Electric CompanyInventors: Bhupendra Kumar Gupta, Nripendra Nath Das, Lyle Timothy Rasch, Jeffrey Allen Conner, Michael James Weimer
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Patent number: 6461674Abstract: A developing roller is provided with a roller core, an electrically conductive layer provided on a circumferential surface of the roller core, and a covering layer provided on the outer circumferential surface of the conductive layer. The covering layer has a thickness of 30 &mgr;m or less, but 0.1 &mgr;m or more, and has at least its surface region formed of a porous body.Type: GrantFiled: May 24, 2000Date of Patent: October 8, 2002Assignee: Nitto Kogyo Co., Ltd.Inventor: Naka Hirayama
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Patent number: 6458869Abstract: The present invention is directed to an etchant/primer composition, an etchant/primer/adhesive monomer composition, kits using the same and methods using the same for improved bonding to dental structures. The etchant/primer composition comprises a compound having the formula: RN(CH2YCO2M)2 wherein R=R1 or R2; R1=an aromatic group; R2=a conjugated unsaturated aliphatic group; Y=a single bond, CH2, CHCH3 or C═CH2; and each M is independently H, an alkali metal, an alkaline earth metal, aluminum, a transition or redox metal or an alkyl group having 1 to 18 carbon atoms, with the proviso that when both M groups are alkyl groups, said compound is capable of being easily hydrolyzed, displaced, or exchanged with other reagents present in the etchant/primer composition, a polar solvent system, and nitric acid.Type: GrantFiled: March 30, 2000Date of Patent: October 1, 2002Assignees: National Institute of Standards of Technology, American Dental Association Health FoundationInventors: Joseph M. Antonucci, Frederick C. Eichmiller, Gary E. Schumacher
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Patent number: 6444255Abstract: An electrode substrate is brush cleaned with a hydrogen gas dissolved water, which has an oxidation-reduction potential of −860 mV to −400 mV and a pH of 8 to 12, before applying an alignment layer material on the electrode substrate. Thus, it is possible to decrease the manufacturing costs without decreasing the detergency.Type: GrantFiled: February 13, 2001Date of Patent: September 3, 2002Assignee: Kabushiki Kaisha ToshibaInventors: Yoshiyuki Nagahara, Naoya Hayamizu, Naoaki Sakurai, Noriko Okoshi, Toshitaka Nonaka, Hiroaki Furuya
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Patent number: 6436488Abstract: Method of depositing a layer of amorphous silicon film on a substrate at a very fast deposition rate while maintaining superior film quality. A plasma volume in a process chamber is defined. A total flow rate of a mixture of gases introduced into the chamber is also defined. The total flow rate is the sum of the flow rates of the respective gases in the mixture. Next, a process parameter that includes the plasma volume and total flow rate is defined. The process parameter is then maintained in a first predetermined relationship with a predetermined value during the deposition of the amorphous silicon film.Type: GrantFiled: June 12, 2000Date of Patent: August 20, 2002Assignee: Agilent Technologies, Inc.Inventors: Jeremy A Theil, Gerrit J Kooi, Ron P Varghese
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Patent number: 6432220Abstract: A process for the preliminary treatment of a metallic workpiece before coating is disclosed. The surface to be coated is cleaned with a solution containing a degreasing agent and coated with a corrosion-inhibiting layer. In order to obtain particularly advantageous conditions, the invention proposes that the surface of a workpiece to be coated be treated with a solution of polyaspartic acid to apply a corrosion-resistant coating.Type: GrantFiled: March 2, 2001Date of Patent: August 13, 2002Assignee: Aware Chemicals L.L.C.Inventors: Johannes Lindemann, Karl Manderscheid, Rainer Kluth, Dirk Bohnes
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Patent number: 6428886Abstract: A method for fabricating an object to attenuate thermal sensation when handling the object at non-body temperature, and an object fabricated in accord with the method. There is first provided a substrate which has a first surface subject to handling. There is then formed upon the first surface of the substrate a coating. The coating has an optimal density, an optimal thermal conductivity and an optimal thickness such that when the substrate having the coating formed thereupon is equilibrated at a non-body temperature differing from a body temperature and the coating is subsequently contacted with a body at the body temperature during handling, the temperature of the surface of the coating at a contact point of the body with the coating changes precipitously to a temperature near the body temperature and subsequently returns towards the non-body temperature at a rate which permits handling of the coating at the location of the first surface of the substrate by the body with attenuated thermal sensation.Type: GrantFiled: November 7, 1997Date of Patent: August 6, 2002Assignee: International Business Machines CorporationInventors: David Andrew Lewis, Lawrence Shungwei Mok
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Publication number: 20020098278Abstract: A medical device (10) includes a structure (12) adapted for introduction into a patient, the structure (12) being formed of a preferably non-porous base material (14) having a roughened or textured surface (16). The structure (12) is conveniently configured as a vascular stent with a base material (14) of stainless steel, nitinol or another suitable material. The medical device (10) also includes a layer (18) of a bioactive material posited directly upon the roughened or textured surface (16) of the base material (14) of the structure (12). The surface (16) of the base material (14) is roughened or textured by etching or by abrasion with sodium bicarbonate or another suitable grit. A preferred roughened or textured surface (16) is thought to have a mean surface roughness of about 10 &mgr;in. (about 250 nm) and a surface roughness range between about 1 &mgr;in. and about 100 &mgr;in. (about 25 nm and about 2.5 &mgr;m).Type: ApplicationFiled: October 31, 2001Publication date: July 25, 2002Applicant: Cook IncorporatedInventors: Brian L. Bates, Anthony O. Ragheb, Joseph M. Stewart, William J. Bourdeau, Brian D. Choules, James D. Purdy, Neal E. Fearnot
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Patent number: 6423372Abstract: A method of depositing a functional group on a surface portion of an elastic substrate comprises the steps of: (a) stretching an elastic substrate having an initial surface portion to form an enlarged surface portion from the initial surface portion; then (b) conjugating a functional group on the enlarged surface portion; and then (c) releasing the substrate to form a reduced surface portion from the enlarged surface portion, with the reduced surface portion having an area less than the enlarged surface portion, and with the reduced surface portion having the functional group deposited therein at a greater density than the enlarged surface portion.Type: GrantFiled: December 13, 2000Date of Patent: July 23, 2002Assignee: North Carolina State UniversityInventors: Jan Genzer, Kirill Efimenko
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Patent number: 6403221Abstract: Epoxy resin compositions which comprise, as essential components, (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a phenolic curing agent, (C) a phenoxy resin containing a bisphenol S skeleton and having a weight average molecular weight of 5,000 to 100,000, and (D) a curing accelerator, are useful for making adhesive films formed by coating the epoxy resin composition on a supporting base film. Such compositions are also useful for making prepregs, by coating and/or impregnating a sheet-shaped reinforced base material made of a fiber with the resin composition, as well as multilayer printed-wiring boards made with such prepregs. Such epoxy resin compositions are also useful for forming conductor layers with excellent adhesiveness without requiring, in the insulating layer, a roughening component which deteriorates performance, as well as multilayer printed-wiring boards.Type: GrantFiled: October 11, 2000Date of Patent: June 11, 2002Assignee: Ajinomoto Co., Inc.Inventors: Shigeo Nakamura, Tadahiko Yokota