Abstract: An anti-corrosive sol-gel composition and process for coating an aerospace alloy substrate with the composition.

Abstract: Provided are a method of growing carbon nanotubes and a carbon nanotube device. The method includes: depositing an aluminum layer on a substrate; forming an insulating layer over the substrate to cover the aluminum layer; patterning the insulating layer and the aluminum layer on the substrate to expose a side of the aluminum layer; forming a plurality of holes in the exposed side of the aluminum layer to a predetermined depth; depositing a catalyst metal layer on the bottoms of the holes; and growing the carbon nanotubes from the catalyst metal layer.

Abstract: A method for protecting from corrosion an element comprised of magnesium or a magnesium alloy comprises applying an adhesion promoter after applying a chromate solution to a surface of the element, whereby the chromate solution creates a corrosion-resistant chromate layer on the surface. The method further includes applying an organic coating, such as a resin seal, over the adhesion promoter so as to provide a seal from water and corrosive elements. The adhesion promoter provides improved adhesion between the chromate layer and the organic coating. Corrosion may be removed from the magnesium element before the application of the chromate solution.

Abstract: A phosphor or scintillator sheet, web or panel is provided, wherein a phosphor or a scintillator layer is coated onto a flexible substrate, the stiffness of which is lowered by presence of pits or grooves onto said substrate, preferably applied by a technique selected from the group consisting of mechanical, chemical, (laser) optical, electrical and photo-etching techniques.

Abstract: A method of fabricating a support electrode for a solid oxide fuel cell includes (a) providing a solid support electrode having an upper surface, the solid electrode comprising an electronically non-conductive material and an electronically conductive material; (b) applying a mask over the upper surface to create a desired unmasked pattern on the top surface; (c) removing the desired amount of material(s) from the unmasked pattern to a predetermined depth of the support electrode; and (d) removing the mask.

Abstract: An integrated oxide removal and processing system (10) includes a process module (30) that may intentionally add at least one film layer to a single semiconductor wafer (32). The integrated oxide removal and processing system (10) also includes a transfer chamber module (20) used to align the semiconductor wafer (32) for the process module (30). The transfer chamber module (20) may expose the semiconductor wafer (32) to a vaporous solution that is inert with respect to the semiconductor wafer (32) and operable to remove an oxide layer (110) therefrom. More specifically, the semiconductor wafer (32) includes silicon. In a further embodiment, the vaporous solution includes HF. In yet a further embodiment, the vaporous solution includes 0.049% to 49% HF.

Abstract: A method for surface treating a titanium-containing metal, comprising the steps of: (a) treating at least a portion of a surface of the titanium-containing metal with an anodic activation in an electrolyte bath; and (b) strike plating at least a portion of the surface of the treated titanium-containing metal with a metallic coating in the same electrolyte bath as in step (a), wherein the titanium-containing metal remains submerged in the electrolyte bath during steps (a) and (b).

Abstract: Preparation methods and stabilization processes for low k polymers that consist of sp2C—X and HC-sp3C?—X bonds. A preparation method is achieved by controlling the substrate temperature and feed rate of the polymer precursors. One stabilization process includes a post annealing of as-deposited polymer films under the presence of hydrogen under high temperatures. The reductive annealing of these films is conducted at temperatures from ?20° C. to ?50° C. to +20° C. to +50° C. of their Reversible Crystal Transformation (“CRT”) temperatures, then quenching the resulting films to ?20° C. to ?50° C. below their “CRT” temperatures. The reductive annealing is conducted before the as-deposited film was removed from a deposition system and still under the vacuum. “Re-stabilization” processes of polymer surfaces that are exposed to reactive plasma etching are also disclosed; thus, further coating by barrier metal, cap layer or etch-stop layer can be safely applied.

Abstract: A base layer, which is supposed to be burnt off by baking, is formed on an unbaked member such as ceramic green sheet or laminated ceramic green sheets. This base layer improves ink acceptability of the unbaked ceramic member particularly for low viscosity ink such as jet-ink, and prevents oozing, draining, uneven thickness. This structure thus allows the inkjet to form a precise pattern. The base layer is burnt off at the baking step in the manufacturing process of electronic components, thus it does not adversely affect the reliability of the electronic component.

Abstract: A silicon penetration device with increased fracture toughness and method of fabrication thereof are provided. The method comprises strengthening silicon penetration devices by thermally growing a silicon oxide layer on the penetration device and then subsequently stripping the silicon oxide. The method also includes strengthening silicon penetration devices through the sputtering of thin film coatings on the silicon penetration devices.

Abstract: Silicon substrates having Si—H bonds are chemically modified using a fluorinated olefin having the formula: wherein m is an integer greater than or equal to 1; n is an integer greater than or equal to 0; Z is a divalent linking group; and Rf is a highly fluorinated organic group.

Abstract: A system and method for detecting parallel marketing of an item, include forming at least one of a coating and a code on the item, interrogating the at least one of the coating and said code, and determining from the interrogating whether the item has been transferred from an authorized merchant to an unauthorized merchant.

Abstract: One method of the present invention relates to a method for enhancing adhesion of spraying metal to a ceramic model. The method is comprised of providing the ceramic model having a spray surface, and modifying at least a portion of the spray surface if the ceramic model to enhance adhesion of spray metal to the spray surface.

Abstract: A method for treating surfaces of titanium or titanium alloys which includes the steps of applying a treatment for removing surface adhesion substances from the surface and then forming a transparent protective layer on the surface.

Abstract: The surfaces of apparatuses and apparatus parts for chemical plant construction, including, for example, apparatus, container and reactor walls, discharge apparatuses, fittings, pumps, filters, compressors, centrifuges, columns, heat exchangers, dryers, comminuting machines, internals, packings and mixing elements, are coated by a process wherein protuberances having a mean height of from 100 nm to 50 &mgr;m with a mean spacing of from 100 nm to 100 &mgr;m are produced on the surface to be coated and the coating is applied thereon by currentless deposition of a metal layer or of a metal-polymer dispersion layer with the aid of a plating bath which contains a metal electrolyte, a reducing agent and optionally a polymer or polymer blend to be deposited, in dispersed form.

Abstract: A method for treating a micro-roughened metal surface to improve bonding between the metal surface and a polymer material. The method involves post-treating the micro-roughened conversion coated metal surface with an aqueous wetting agent composition after having formed the micro-roughened conversion coated metal surface with an adhesion promotion composition. The method can be employed in the circuit board industry to improve bonding between layers in multilayer circuit boards.

Abstract: A method for fabricating a plated product including a basecoat layer, a metal plating layer, and a topcoat layer that are formed on a surface of a base is provided. The method includes the step of forming the basecoat layer and the metal plating layer successively on the surface of the base. The step is followed by removing impurities from the surface of the metal plating layer. The topcoat layer is then formed on the surface of the metal plating layer.

Abstract: A layer comprising a stain resistant agent is formed on a treated surface of a ceramic product used with water so that a stain resistant treatment is applied to the treated surface. The stain resistant agent includes a silicon-containing functional group combining with the hydroxyl group present on the treated surface by dehydration or dehydrogenation. Consequently, a high stain resistant effect can be achieved from the ceramic product.

Abstract: An aluminum nitride substrate includes an aluminum nitride sintered body containing a rare earth oxide as a sintering additive component. In the aluminum nitride substrate, a surface thereof is machined so that arithmetic average roughness Ra is 0.5 &mgr;m or less; an aggregate size of the sintering additive component present on the machined surface is 20 &mgr;m or less; and a total aggregate area in a unit area of the machined surface is 5% or less. A metal thin film is deposited on such machined surface with good intimate contact properties, and furthermore deposition accuracy or the like is improved.

Abstract: A method of coating aluminum and aluminum alloy substrates not only imparts a corrosion resistance comparable or even superior to that afforded by chromate treatment but also improves the adhesion to the coating film, while the luster of aluminum is fully retained, notwithstanding the use of a chromium-free treating solution, resulting in an improved coated article with the coated surface having a metallic luster. The method comprises treating an aluminum or aluminum alloy substrate with an acidic solution containing sulfuric acid and 0.2 to 0.4 g/L of a ferric ion and having a pH value of 0.6 to 2.0, subjecting the same to chemical conversion treatment with an acidic coat-forming agent containing 0.01 to 0.125 g/L of a zirconium or titanium ion, 0.01 to 1.0 g/L of a phosphate ion, and 0.01 to 0.5 g/L of a fluoride ion and having a pH value of 1.5 to 4.0, followed by coating.

Abstract: To avoid problems associated with the formation of unwanted cracks and spalls during the growth of a polycrystalline silicon rod, a flaw is induced in a filament on which silicon will be deposited to produce a rod. The flaw causes the grown rod to have a cleavage plane such that the rod will break in a controlled manner at a desired location. The flaw can be placed at a location selected such that breakage at the cleavage plane will produce long rods and thereby improve the yield of the rod growing process. Such a flaw will also have the effect of minimizing useable rod length losses due to spalling.

Abstract: System and method for coating a medical appliance is provided. In accord with one embodiment, a system for applying a coating to a medical appliance having accessible patterned surfaces is provided. This system may include: a processor, a support, and a bubble jet printing head having individual printing nozzles. In this system the support may be adapted to hold the medical appliance and to provide direct access for a coating to contact the exposed external patterned surfaces of the medical appliance. The bubble jet printing head in this system may move with respect to the medical appliance and may be in communication with a source of coating and with the processor. The processor in this system may contain commands that instruct the bubble jet printing head to force coating onto the accessible patterned surfaces of the medical appliance in a pattern that correlates with the accessible patterned surfaces of the medical appliance.

Abstract: A method for adhering a resistive coating to a substrate for use in process fluids employed in the semiconductor processing industry in clean, particle-free, nonreactive, non-trapping, ultra-pure, thermally tolerant, sealed systems. In one arrangement, the method may include the steps of selecting a substrate having a wall, modifying a surface of the wall to provide a roughened texture suitable for mechanically securing a coating thereto, and applying a conductive coating that is configured to be electrically resistive, to extend over at least a portion of the roughened texture, and to adhere thereto throughout variations in operational temperatures thereof.

Abstract: A method of fabricating a process chamber component that has a ceramic form with grains and grain boundary regions. In the method, the component is bead blasted to provide a surface having a relatively low roughness average of less than about 150 microinches. The component is dipped into a solution having a concentration that is sufficiently low to reduce etching of grain boundary regions of the ceramic form. A metal coating is formed over at least a portion of the ceramic form. The component fabricated by this method can tolerate thicker deposits of sputtered material in a sputtering process without the sputtered deposit accumulates causing spalling of the coating of the component.

Abstract: A method for fabricating a plated product with a basecoat layer, a metal plating layer, and a topcoat layer that are formed on a surface of a base is provided. The method includes the step of forming the basecoat layer and the metal plating layer on the surface of the base. The step is followed by subjecting the metal plating layer to a cold heat treatment or an ultrasonic wave treatment, thus forming a microcrack in the metal plating layer. Afterwards, the topcoat layer is formed on the surface of the metal plating layer.

Abstract: A method for treating a metal enclosure to prevent the enclosure from being contaminated, comprises the steps of: (a) sand-blasting the enclosure; (b) preheating the enclosure to a predetermined temperature, and putting the enclosure into the space in a vacuum chamber between two electrodes; (c) introducing reactive gases into the vacuum chamber, the reactive gases including 1,1,3,3-tetramethyldisiloxane and oxygen; (d) applying high electrical power to the electrodes to cause the reactive gases to become an ionized plasma, the plasma reacting with a surface of the enclosure to form a layer of silicon oxide thereon. The layer of silicon oxide resists formation of a fingerprint when it is touched by a user.

Abstract: A method of coating of mass-produced bulk goods (5) including loading the bulk goods (5) into a rotatable drum (1) through an opening (4) formed in a side surface of the drum (1), heating a coating material in coating apparatus (8), having a spray gun (6) and provided outside of the rotatable drum (1); and thereafter, applying the heated coating material to the bulk goods (5) with the spray gun (6) through the drum opening (4).

Abstract: The present invention provides a method for coating bare, untreated metal substrates wherein a coating composition comprising one or more particularly defined additives is applied directly to a bare metal substrate which has not been chemically and/or mechanically altered. The invention provides a method of coating a bare untreated metal substrate. The method requires the steps of (i) providing a bare, untreated metal substrate, the substrate being substantially free of mechanical and/or chemical alterations, (ii) applying a two-component urethane coating composition directly to the bare, untreated metal substrate so as to make a coated metal substrate, and (iii) sanding at least a portion of the coated metal substrate within one hour from the time the two-component urethane coating composition was applied to the bare, untreated metal substrate. The resulting coated metal substrate has an initial adhesion loss of less than 20% as measured by a cross hatch adhesion test per ASTM D-3359 93.

Abstract: A method for producing an inner tin film on the surface of plumbing components, such as those made of red brass or yellow brass, for drinking water supply. The lead content on the inner surface of the hollow component parts is first reduced by treatment with an acid-based aqueous reducing solution. For this purpose, chloride-free and sulfate-free, non-oxidizing hydracids may be used. The hollow component parts are subsequently chemically internally tinned.

Abstract: In a method for the pretreatment of work pieces having a surface made of aluminium or aluminium alloys, for non-cutting shaping and/or the connection by welding or gluing to work pieces as well as for a subsequent permanent corrosion-preventing treatment, the work pieces are subjected to a three-stage treatment by a) rinsing with an aqueous, acidic solution containing a mineral acid, b) rinsing with water, c) bringing them into contact with an aqueous, acidic solution which is chromium-free and polymer-free and contains Ti and Zr as complex fluorides in a weight ratio of Ti:Zr of 2:1 to 1:2, in such a way that, after the subsequent drying off, a layer weight of 2 to 15 mg/m2 (calculated as Ti/Zr metal) results, wherein depending on the type of application, solutions having different concentrations and different pH values are used.

Abstract: A method of fabricating a spin valve sensor includes sequentially depositing, without breaking vacuum, a seed layer and an antiferromagnetic layer. Sequentially depositing the seed layer and the antiferromagnetic layer includes depositing a seed layer on a substrate; depositing a Mn-alloy layer of the antiferromagnetic layer directly on top of the seed layer; and depositing a buffer layer of the antiferromagnetic layer directly on top of the Mn-alloy layer. The seed layer, the Mn-alloy layer and the buffer layer are annealed. After annealing, a portion of the buffer layer is etched and a synthetic antiferromagnetic layer is deposited on top of the buffer layer. A spacer layer is deposited on top of the synthetic antiferromagnetic layer, and a free layer is deposited on top of the spacer layer.

Abstract: A method for adjusting resistivity of a film heater on a substrate for use in process fluids employed in the semiconductor-processing industry as part of a clean, particle-free, nonreactive, non-trapping, ultra-pure, thermally tolerant, sealed system. In one arrangement, the method includes the steps of selecting a heating rate, selecting an electrical resistance value in accordance with the heating rate, selecting a resistive material for coating a substrate to produce resistance heating consistent with the electrical resistance value, selecting dimensions for a film of the resistive material selected to balance effects of conductivity, resistivity, length, and area against effects of the heating rate, and forming the film by conformally coating a surface of the substrate with the film at the selected dimensions.

Abstract: This invention relates to a method of making a window (e.g., vehicle windshield, architectural window, etc.), and the resulting window product. At least one glass substrate of the window is ion beam treated and/or milled prior to application of a coating (e.g., sputter coated coating) over the treated/milled substrate surface and/or prior to heat treatment. As a result, defects in the resulting window and/or haze may be reduced. The ion beam used in certain embodiments may be diffused. In certain embodiments, the ion beam treating and/or milling is carried out using a fluorine (F) inclusive gas(es) and/or argon/oxygen gas(es) at the ion source(s). In certain optional embodiments, F may be subimplanted into to treated/milled glass surface for the purpose of reducing Na migration to the glass surface during heat treatment or thereafter, thereby enabling corrosion and/or stains to be reduced for long periods of time.

Abstract: A diamond sintered body tool (20) having superior adhesion resistance, chipping resistance and high strength includes a tool base material (22) including a diamond sintered body, and a surface layer (21) formed on a surface of the tool base material (22). The surface layer (21) includes at least one of silicon, a silicon oxide, a silicon carbide, a silicon nitride and a solid solution thereof. The tool base material (22) has an inner portion (22b) including a first content of an iron group metal, and a surface portion (22a) surrounding the inner portion (22b ) and including a second content of the iron group metal lower than the first content.

Abstract: Provided is a method for recovering a slip resistance value of a basalt-tiled road surface by treating with an acid solution.

Abstract: A photocatalytic oxidation purification system includes an ultra violet light source and a filter that comprises a pleated wire mesh substrate with a nanophase metal oxide oxidation catalyst suspended on the substrate, wherein the catalyst is applied without an adhesive using an electromechanical plating process. As a fluid containing organic contaminants is directed through the filter in the presence of ultra violet light from the light source, the catalyst oxidizes and decomposes the organic contaminants into environmentally harmless components. Methods of making the purification system including preparing a solution of catalyst and applying the catalyst without adhesive binding material to the filter substrate electromagnetically.

Abstract: A surface treatment, especially for titanium and aluminum alloys, forms a Si—Y sol-gel film covalently bonded on the metal surface to produce strong, durable adhesive bonds between the metal and an organic adhesive without using toxic chemicals and while significantly reducing or eliminating rinse water requirements of traditional anodizing or etching processes. The sol should produce bonds in a single application comparable in strength and performance to standard anodize controls. Parameters affecting performance include the sol composition, the ratio of silicon to yttrium in the sol, the ratio of other sol ingredients, the concentration of the sol, the carrier solvent, solution age, catalysts, surface pretreatment, application method, curing process, and primer used.

Abstract: An article having a substrate is protected by a thermal barrier coating system. An interfacial layer contacts the upper surface of the substrate. The interfacial layer may comprise a bond coat only, or a bond coat and an overlay coat. The interfacial layer has on its upper surface a preselected, controllable pattern of three-dimensional features, such as grooves in a parallel array or in two angularly offset arrays. The features are formed by an ablation process using an ultraviolet laser such as an excimer laser. A ceramic thermal barrier coating is deposited over the pattern of features on the upper surface of the interfacial layer.

Abstract: A method of forming a fluorine-bearing diamond layer on non-diamond substrates, especially on tool substrates comprising a metal matrix and hard particles, such as tungsten carbide particles, in the metal matrix. The substrate and a fluorine-bearing plasma or other gas are then contacted under temperature and pressure conditions effective to nucleate fluorine-bearing diamond on the substrate. A tool insert substrate is treated prior to the diamond nucleation and growth operation by etching both the metal matrix and the hard particles using suitable etchants.

Abstract: A thermal barrier coating (TBC) system and method for improving the thermal fatigue life of a thermal barrier coating. The invention entails modifying the surface morphology of an aluminide bond coat that adheres the thermal barrier coating to a substrate of a superalloy component. The aluminide bond coat has columnar grains, such that grain boundaries are exposed at the surface of the bond coat and define ridges. The surface of the bond coat is then treated so that a sufficient amount of material is removed from the grain boundary ridges and other surface peaks to flatten the bond coat surface, i.e., the ridges and peaks are replaced with flattened surfaces that are nearly parallel to the diffusion zone of the bond coat. By removing these surface irregularities, it is believed that a more stable bond coat surface is created where the critical alumina-bond coat interface will exist following a thermal treatment, such as TBC deposition.

Abstract: A method for forming a resistor on a roughened surface for use in process fluids employed in the semiconductor-processing industry as part of a clean, particle-free, nonreactive, non-trapping, ultra-pure, thermally tolerant, sealed system. In one arrangement, the method for forming the resistor includes the steps of selecting a coating for the roughened surface from among the group of resistive materials, roughening a surface to promote mechanical adherence of the coating to the selection of a coating comprising resistive material, roughening a surface for promoting mechanical adherence of the resistive material thereto, and electroplating the resistive material onto the roughened surface to provide a uniformly controllable resistance in the coating.

Abstract: Disclosed are a conversion coating composition for use in the surface treatment of a PCB and a conversion coating method using the same. The composition comprises 0.1-30 vol % of sulfuric acid; 0.1-15 vol % of hydrogen peroxide; 0.01-10 wt % of an organic acid; 0.1-30 wt % of a nitrogen compound; 0.01-10 wt % of an organic silicate and/or organic titanate; and 0.1-20 wt % of a film forming auxiliary, 0.1-30 wt % of an etching rate controller, 0.1-20 wt % of a reaction promoter and/or 0.1-20 g/l of a stabilizer. This composition is applied to a PCB at 10-60° C. for 1-10 min. The conversion coating film is superb in adhesive strength, acid resistance, and adhesion and can be formed with ease.

Abstract: A deposition process for coating a substrate with an ultrasonically generated aerosol spray of a pseudocapacitive material, or a precursor thereof, contacted to a substrate heated to a temperature to instantaneously solidify the pseudocapacitive material or convert the precursor to a solidified pseudocapacitive metal compound, is described. The ultrasonic aerosol droplets are much smaller in size than those produced by conventional processes and the heated substrate minimizes the possibility of contamination, thereby providing the present coating having an increased surface area. When the coated substrate is an electrode in a capacitor, a greater surface area results in an increased electrode capacitance.

Abstract: A method is provided for refurbishing a service operated metallic coating on a substrate alloy, the coating including at least within a coating outer surface at least one oxide chemically grown from at least one coating element, for example Al, and chemically bonded with the coating outer surface as a result of thermal exposure during service operation. Growth of the oxide has depleted at least a portion of the coating element from the coating. The method comprises removing the oxide from the coating outer surface while substantially retaining the metallic coating, thereby exposing in the coating outer surface at least one surface void that had been occupied by the oxide. The retained metallic coating is mechanically worked, substantially without removal of the retained coating, to close the void, providing a treated metallic coating surface over which a refurbishing coating is applied.

Abstract: A water-repellent solution for forming a superior water-repellent film on a glass substrate is produced by subjecting a fluoroalkyl-group contained silane compound to a hydrolysis and a condensation polymerization. With this, at least dimers and trimers of the silane compound are produced. In case wherein the fluoroalkyl-group contained silane compound is of a type having the following general formula, satisfied performance of the formed water-repellent film is expected: CF3(CF2)m(CH2)2SiX3 wherein “m” is equal to or greater than 7 (seven) and “X” represents halogen, isocyanate-group or alkoxy-group, said alkoxy-group including methoxy-group [OCH3], ethoxy-group [OC2H5] or isopropoxy-group [OC3H5]. When the “m” is equal to or greater than 9 (nine), the performance of the film is much increased.

Abstract: The invention includes methods of treating sodalime glass surfaces for deposition of silicon nitride and methods of forming field emission display devices. In one aspect, the invention includes a method of treating a sodalime glass surface for deposition of silicon nitride comprising: a) cleaning a surface of the glass with detergent; and b) contacting the cleaned surface with a solution comprising a strong oxidant to remove non-silicon-dioxide materials from the surface and from a zone underlying and proximate the surface.

Abstract: The invention discloses a method for producing a nitrogen-silicon containing stainless steel layer on a metal. The method includes a pack cementation process involving the use of silicon nitride, silica and sodium fluoride as the source materials.

Abstract: An aluminum nitride substrate includes an aluminum nitride sintered body containing a rare earth oxide as a sintering additive component. In the aluminum nitride substrate, a surface thereof is machined so that arithmetic average roughness Ra is 0.5 &mgr;m or less; an aggregate size of the sintering additive component present on the machined surface is 20 &mgr;m or less; and a total aggregate area in a unit area of the machined surface is 5% or less. A metal thin film is deposited on such machined surface with good intimate contact properties, and furthermore deposition accuracy or the like is improved.

Abstract: A zinc coating directly covers a bare ferrous base of parking meter housing parts. A non-epoxy thermosetting electrically insulating organic non-epoxy powder coating directly covers the zinc coating. The organic coating is directly applied to the zinc coating by electrostatically charging the powder and parts with opposite d.c. voltage polarities and by heating the powder so it adheres to and covers the zinc coating. Alternatively, the base is zinc, directly covered by the organic powder coating.

Abstract: Chemical microreactors for chemical systhesis and their methods of manufacture are known, but have disadvantages such as extremely high manufacturing costs or poor flexibility for adaptation to various cases of application. These disadvantages are avoided by means of the microreactors and manufacturing methods according to the invention. The microreactors are characterized in that the reactors contain fluid ducts in at least one plane as well as feed and return lines for fluids, wherein the fluid ducts are defined by side walls of metal opposing each other and further side walls of metal or plastic extending between said side walls, and in which the planes are connected together and/or with a closure segment closing open fluid ducts by means of appropriate solder or adhesive layers. The manufacturing method is characterized by process sequences in which the individual reactor planes produced by means of electrolytic methods, are connected together by soldering or gluing.