Chemical Compound Reducing Agent Utilized (i.e., Electroless Deposition) Patents (Class 427/443.1)
  • Patent number: 10655227
    Abstract: Select carboxymethyl-thio compounds are added to electroless copper plating compositions to improve the stability of the electroless copper plating compositions such that the plating activity of the electroless plating copper compositions is not compromised even when electroless plating at low plating temperatures and high stabilizer and high leached catalyst concentrations.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: May 19, 2020
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Alejo M. Lifschitz Arribio, Donald E. Cleary
  • Patent number: 10629444
    Abstract: The present invention relates to a method for manufacturing a bump structure capable of enhancing adhesion, comprising the steps of: forming an under bump metal (UBM) layer on a conductive pad; forming a copper bump on the UBM layer by electrolytic plating; forming a nickel bump on the copper bump by electrolytic plating; forming a first gold bump on the nickel bump by electrolytic plating using a first gold plating solution; and forming a second gold bump on the first gold bump by electrolytic plating using a second gold plating solution, wherein the second gold plating solution contains thallium (Tl) and the first gold plating solution is free of thallium.
    Type: Grant
    Filed: June 9, 2016
    Date of Patent: April 21, 2020
    Assignee: LBSEMICON CO., LTD.
    Inventor: Young Gu Kim
  • Patent number: 10294569
    Abstract: A specific cysteine derivative is added to electroless copper plating compositions to improve the stability of the electroless copper plating compositions such that the plating activity of the electroless plating copper compositions is not compromised even when electroless plating at low plating temperatures and high stabilizer and high leached catalyst concentrations.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: May 21, 2019
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Alejo M. Lifschitz Arribio, Donald E. Cleary
  • Patent number: 10208385
    Abstract: A carbon dioxide electrolytic device of an embodiment includes: an electrolysis cell including a cathode, an anode, a carbon dioxide supply unit, an electrolytic solution supply unit, and a separator; a power supply; a reaction control unit which causes a reduction reaction and an oxidation reaction by passing an electric current from the power supply to the anode and the cathode; a refresh material supply unit including a gas supply unit which supplies a gaseous substance to at least one of the anode and the cathode; and a refresh control unit which stops supply of the current from the power supply and supply of carbon dioxide and an electrolytic solution, and operates the refresh material supply unit, based on request criteria of a cell output of the electrolysis cell.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: February 19, 2019
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Yuki Kudo, Akihiko Ono, Ryota Kitagawa, Masakazu Yamagiwa, Eishi Tsutsumi, Yoshitsune Sugano, Jun Tamura, Satoshi Mikoshiba
  • Patent number: 10086588
    Abstract: A resin material including a hydrogenated crystalline polar group-containing dicyclopentadiene ring-opening polymer and a hydrogenated crystalline non-polar dicyclopentadiene ring-opening polymer in a weight ratio (hydrogenated crystalline polar group-containing dicyclopentadiene ring-opening polymer:hydrogenated crystalline non-polar dicyclopentadiene ring-opening polymer) of 100:0 to 1:99, the hydrogenated crystalline polar group-containing dicyclopentadiene ring-opening polymer being obtained by melt-mixing a hydrogenated crystalline non-polar dicyclopentadiene ring-opening polymer, a radical initiator, and a polar group-containing compound that includes an ethylenically unsaturated bond, the resin material including a structural unit derived from the polar group-containing compound that includes an ethylenically unsaturated bond in a ratio of 0.05 to 3.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: October 2, 2018
    Assignee: ZEON CORPORATION
    Inventor: Shinsuke Miyazawa
  • Patent number: 9970121
    Abstract: A composite material includes a metal material having conductivity and an oxidation inhibitor mixed with the metal material. The oxidation inhibitor forms a complex with the metal material to exert a resistance to oxidation of the metal material. For example, the composite material is formed on a surface of a base material as a plating material. As another example, the composite material is plated on a surface of an electrode.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: May 15, 2018
    Assignee: DENSO CORPORATION
    Inventors: Kenji Ochi, Toshihiro Miyake, Yasuo Ishihara
  • Patent number: 9884439
    Abstract: A method for producing a foamed molded product includes: using a molding apparatus including a plasticizing cylinder having a high pressure kneading zone and a pressure reduction zone; and a screw; controlling a pressure of the pressure reduction zone to be a first pressure in a state that communication between the high pressure kneading zone and the pressure reduction zone is shut off, the first pressure being not less than an atmospheric pressure and not more than a maximum pressure of the high pressure kneading zone which is reached in a case that a molten resin is brought in contact and kneaded with a physical foaming agent; controlling back pressure of the screw to be a second pressure which is not less than the first pressure; and measuring a predetermined amount of the molten resin from which the gasified physical foaming agent has been separated.
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: February 6, 2018
    Assignee: HITACHI MAXELL, LTD.
    Inventors: Satoshi Yamamoto, Atsushi Yusa, Hironori Ota, Tetsuya Ano, Hideto Goto
  • Patent number: 9347145
    Abstract: The method of plating a stainless steel substrate including depositing a first plating metal layer over the stainless steel substrate), forming an interdiffusion layer in which elements of the stainless steel substrate and elements of the first plating metal layer interdiffuse, by applying a heat treatment to the stainless steel substrate coated by the first plating metal layer, and coating a second plating metal layer over the surface of the stainless steel substrate over which the interdiffusion layer is coated.
    Type: Grant
    Filed: May 23, 2011
    Date of Patent: May 24, 2016
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Takeshi Bessho
  • Patent number: 9222191
    Abstract: A plating apparatus includes a vessel and a rack operable to be positioned inside the vessel. The rack includes a number of mandrels including a number of substrate mounting surfaces. The number of mandrels is non-revolving with respect to the rack. The rack further includes a number of gears coupled with the number of mandrels. A partition separates the number of gears from the number of mandrels. A diffuser is positioned below the rack. The diffuser is operable to produce a substantially uniform laminar flow of a fluid from a bottom to a top of the vessel. Thus, the laminar flow may reduce dead zones in the bath and remove defect-causing particles and gases away from the substrate.
    Type: Grant
    Filed: October 20, 2011
    Date of Patent: December 29, 2015
    Assignee: Seagate Technology LLC
    Inventor: Samuel Kah Hean Wong
  • Publication number: 20150118406
    Abstract: The present invention relates to a stable palladium ion catalyst aqueous solution for electroless metal plating that does not use boric acid and can be used stably over a wide pH range. The catalyst solution for electroless plating of the present invention contains palladium ion, palladium ion complexing agent, and a specific amine compound and is alkaline.
    Type: Application
    Filed: October 30, 2014
    Publication date: April 30, 2015
    Inventors: Hiroki OKADA, Li SHENGHUA, Shinjiro HAYASHI
  • Publication number: 20150111047
    Abstract: The invention discloses a chemical plating product and method forming thereof, the chemical plating product includes an insulating member (1) and a metal coating covering the insulating member (1), the metal coating includes a pre-plating scope (2) formed by a coating catalyst and a chemical copper layer (3) covering the pre-plating scope (2).
    Type: Application
    Filed: July 21, 2014
    Publication date: April 23, 2015
    Inventors: CHUN-YI CHANG, WEI-HAO SU, CHIN-WANG LEE, CHENG-LUNG CHEN
  • Patent number: 9011968
    Abstract: Technologies are generally described for method and systems effective to at least partially alter a defect in a layer including graphene. In some examples, the methods may include receiving the layer on a substrate where the layer includes at least some graphene and at least some defect areas in the graphene. The defect areas may reveal exposed areas of the substrate. The methods may also include reacting the substrate under sufficient reaction conditions to produce at least one cationic area in at least one of the exposed areas. The methods may further include adhering graphene oxide to the at least one cationic area to produce a graphene oxide layer. The methods may further include reducing the graphene oxide layer to produce at least one altered defect area in the layer.
    Type: Grant
    Filed: September 16, 2011
    Date of Patent: April 21, 2015
    Assignee: Empire Technology Development LLC
    Inventors: Seth Miller, Thomas Yager
  • Publication number: 20150093514
    Abstract: Disclosed are various methods, kits, and compositions in the field of electroless nickel plating and chemical polishing. An electroless nickel plating composition may include a surfactant-brightener; a coupler; a bismuth metallic stabilizer; and organosulfur stabilizer and a bismuth complexer. Prior to plating, a substrate may be polished with a polishing composition that includes a surface blocker and a surface leveler. When practiced in accordance with the preferred teachings described herein, the electroless nickel plating composition is capable of providing a mirror-bright, lustrous finish, and has good leveling properties. The composition may be made without lead or cadmium.
    Type: Application
    Filed: December 8, 2014
    Publication date: April 2, 2015
    Inventors: Peter Tremmel, Orville Broch, Stephen Brent Cornwell
  • Patent number: 8986789
    Abstract: The invention relates to a substrate having a bondable metal coating comprising, in this order, on an Al or Cu surface: (a) a Ni—P layer, (b) a Pd layer and, optionally, (c) an Au layer, wherein the thickness of the Ni—P layer (a) is 0.2 to 10 m, the thickness of the Pd layer (b) is 0.05 to 1.0 m and the thickness of the optional Au layer (c) is 0.01 to 0.5 m, and wherein the Ni—P layer (a) has a P content of 10.5 to 14 wt.-%. The deposit internal stress of the resulting Ni—P/Pd stack is not higher than 34.48M?Pa (5,000 psi). Further, a process for the preparation of such a substrate is described.
    Type: Grant
    Filed: October 1, 2009
    Date of Patent: March 24, 2015
    Assignee: Atotech Deutschland GmbH
    Inventors: Albrecht Uhlig, Josef Gaida, Christof Suchentrunk, Michael Boyle, Brian Washo
  • Patent number: 8974860
    Abstract: The present invention relates to a method of selectively plating a plastic article comprising a first polymer resin portion and a second polymer resin portion, wherein said first polymer resin portion is not rendered plateable by sulfonation and said second polymer resin portion is rendered plateable by sulfonation. The method comprises the steps of sulfonating the plastic article, activating the sulfonated plastic article to accept plating thereon, and plating the sulfonated and activated article in an electroless plating bath. The plastic article is selectively plated such that the first polymer resin portion does not have plating thereon and the second polymer resin portion is electrolessly plated.
    Type: Grant
    Filed: June 19, 2009
    Date of Patent: March 10, 2015
    Inventors: Robert Hamilton, Mark Wojtaszek
  • Patent number: 8974869
    Abstract: A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.
    Type: Grant
    Filed: January 26, 2010
    Date of Patent: March 10, 2015
    Inventors: Robert Hamilton, Ernest Long, Andrew M. Krol
  • Publication number: 20150056379
    Abstract: Provided is a method of manufacturing a gold (Au) thin film on a dielectric surface by using an electroless-plating method, the method including: manufacturing a reaction mixture by adding an Au chloride compound and an alkaline compound to an alcohol-water mixed solution; and forming an Au thin film by putting a substrate in the reaction mixture and stirring the reaction mixture. Accordingly, compounds that are relatively low toxic may be used as raw materials, and an Au thin film having a surface enhancement Raman scattering (SERS) effect may be conveniently and stably formed on a dielectric surface without having to use expensive additional equipment, such as a vacuum device.
    Type: Application
    Filed: August 24, 2014
    Publication date: February 26, 2015
    Inventors: Kuan Soo SHIN, Young Kwan CHO, Myung Chan PARK
  • Patent number: 8962076
    Abstract: A method of manufacturing a hollow body is disclosed, the body provided with a glass inside surface defining a cavity, said method being characterized in that it includes a step of covering at least a fraction of said inside surface with a lining of composition that is mostly metal, said covering step including sub-steps of activating and of grafting said inside surface respectively with an activation agent and with a grafting agent, and in that said hollow body comprises a single piece of glass inside which said cavity is formed.
    Type: Grant
    Filed: November 27, 2009
    Date of Patent: February 24, 2015
    Assignee: SGD S.A.
    Inventor: Christophe Jean Wagner
  • Patent number: 8961669
    Abstract: Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: February 24, 2015
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Feng Liu, Maria Anna Rzeznik
  • Publication number: 20150024139
    Abstract: Provided is an electroless copper plating solution that forms a highly adhesive conductive film regardless of the degree of roughness of the resin surface and also has a fast deposition rate. The electroless copper plating solution of the present invention is characterized in that it contains guanosine. The electroless copper plating solution of the present invention preferably also contains copper ion, reducing agent, copper ion complexing agent, and pH adjuster.
    Type: Application
    Filed: July 18, 2014
    Publication date: January 22, 2015
    Inventors: Katsuhiro YOSHIDA, Yoshiyuki HAKIRI, Makato KONDO
  • Patent number: 8906446
    Abstract: An apparatus is provided having a closable chamber that can be sealed and is capable of withstanding an increased pressure and high temperature. The chamber has several inlet ports for the supply of various process liquids, such as deposition solutions, DI water for rinsing, etc., and a port for the supply of a gas under pressure. The apparatus also includes a solution heater and a control system for controlling temperature and pressure in the chamber. Uniform deposition is achieved by carrying out the deposition process under pressure and under temperature slightly below the boiling point of the solution. The solution can be supplied from above via a shower head formed in the cover, or through the bottom of the chamber. Rinsing or other auxiliary solutions are supplied via a radially moveable chemical dispensing arm that can be arranged above the substrate parallel thereto.
    Type: Grant
    Filed: February 29, 2012
    Date of Patent: December 9, 2014
    Assignee: Lam Research Corporation
    Inventors: Igor C. Ivanov, Jonathan Weiguo Zhang, Artur Kolics
  • Patent number: 8900666
    Abstract: Stable tin-free palladium catalysts are used to metalize through-holes of printed circuit boards. A stabilizer is included in the catalyst formulation which prevents precipitation and agglomeration of the palladium.
    Type: Grant
    Filed: October 21, 2011
    Date of Patent: December 2, 2014
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Feng Liu, Maria Anna Rzeznik
  • Publication number: 20140329100
    Abstract: Thermoplastic moulding composition (F), comprising: A) from 5 to 80% by weight of a graft polymer (A) having bimodal particle size distribution and a moisture content of 0 to 27% by weight, made, based on (A), a1) from 40 to 90% by weight of an elastomeric particulate graft base (a1), obtained by emulsion polymerization of based on (a1), a11) from 70 to 100% by weight of at least one conjugated diene, or of at least one C1-8-alkyl acrylate, or of mixtures of these, a12) from 0 to 30% by weight of at least one other monoethylenically unsaturated monomer and a13) from 0 to 10% by weight of at least one polyfunctional, cross linking monomer; a2) from 10 to 60% by weight of a graft a2), made, based on a2), a21) from 64 to 76% by weight of at least one vinyl aromatic monomer, a22) from 24 to 36% by weight of acrylonitrile, a23) from 0 to 30% by weight of at least one other monoethylenically unsaturated monomer, and a24) from 0 to 10% by weight of at least one polyfunctional, cross linking monomer; B) from 10 to 94
    Type: Application
    Filed: December 15, 2011
    Publication date: November 6, 2014
    Applicant: BASF SE
    Inventors: Michel Pepers, Christian Schade, Davy Roger Suwier, Norbert Niessner
  • Patent number: 8871310
    Abstract: The present invention relates to a surface-modified tantalum oxide nanoparticle, a method for preparation thereof, a contrast agent (medium) for X-ray computed tomography, and a highly dielectric (high-?) film using the same. In particular, the present invention is directed to a surface-modified tantalum oxide nanoparticle, a method for preparing surface-modified tantalum oxide nanoparticles, comprising: (i) adding an aqueous phase to an organic solvent which contains a surfactant, to prepare a water-in-oil microemulsion; (ii) introducing a tantalum precursor to said microemulsion; (iii) adding a surface-modifier having an organic silane group or phosphine group to a solution obtained at the step (ii); (iv) removing said organic solvent from a product obtained at the step (iii); and (v) separating surface-modified tantalum oxide nanoparticles from a mixture obtained at the step (iv), a contrast agent for X-ray computed tomography, and a highly dielectric (thin) film using the same.
    Type: Grant
    Filed: February 22, 2011
    Date of Patent: October 28, 2014
    Assignee: SNU R&DB Foundation
    Inventors: Taeghwan Hyeon, Myoung Hwan Oh
  • Patent number: 8859039
    Abstract: In a viscous liquid feed nozzle having a nozzle body provided with a thin and long hole with a front end serving as a feed port, a lubricative plated layer is provided by immersing the liquid feed nozzle in a plating tank containing a lubricative plating solution and forming, by electroless plating, the lubricative plated layer at least on the inside and outside of the feed port.
    Type: Grant
    Filed: November 18, 2011
    Date of Patent: October 14, 2014
    Assignee: NHK Spring Co., Ltd.
    Inventors: Shinpei Kakiuchi, Eijiro Furuta, Takashi Ando
  • Publication number: 20140295093
    Abstract: A plating apparatus includes a processing bath configured to store a processing liquid therein, a transporter configured to immerse a substrate holder, holding a substrate, in the processing liquid, raise the substrate holder out of the processing bath, and transport the substrate holder in a horizontal direction, and a gas flow generator configured to generate a clean gas flow forward of the substrate with respect to a direction in which the substrate holder is transported. The transporter moves the gas flow generator together with the substrate holder in the horizontal direction while transporting the substrate holder in the horizontal direction.
    Type: Application
    Filed: March 24, 2014
    Publication date: October 2, 2014
    Inventor: Tomonori HIRAO
  • Patent number: 8834958
    Abstract: A process of electroless plating a tin or tin-alloy active material onto a metal substrate for the negative electrode of a rechargeable lithium battery comprising steps of (1) immersing the metal substrate in an aqueous plating solution containing metal ions to be plated, (2) plating tin or tin-alloy active material onto the metal substrate by contacting the metal substrate with a reducing metal by swiping one on the other, and (3) removing the plated metal substrate from the plating bath and rinsing with deionized water. A rechargeable lithium battery using tin or tin-alloy as the anode active material.
    Type: Grant
    Filed: July 8, 2011
    Date of Patent: September 16, 2014
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventor: Shengshui Zhang
  • Publication number: 20140242264
    Abstract: The invention relates to an electroless aqueous copper plating solution, comprising a source of copper ions, a source of glyoxylic acid as reducing agent, and at least one polyamino disuccinic acid or at least one polyamino monosuccinic acid, or a mixture of at least one polyamino disuccinic acid and at least one polyamino monosuccinic acid as complexing agent, as well as to a method for electroless copper plating utilizing said solution and the use of the solution for the plating of substrates.
    Type: Application
    Filed: October 1, 2012
    Publication date: August 28, 2014
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Edith Stenhäuser, Sandra Röseler, Stefanie Wiese, Tang Cam Lai Nguyen, Lutz Stamp
  • Publication number: 20140242287
    Abstract: A solution including a precious metal nanoparticle and a polymer polymerized from at least two monomers, (1) a monomer having two or more carboxyl groups or carboxyl acid salt groups and (2) a monomer which has ? electron-available features. The solution is useful for a catalyst of a process for electroless plating a metal on non-conductive surface.
    Type: Application
    Filed: February 24, 2013
    Publication date: August 28, 2014
    Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Suk Kwan KWONG, Weijuan ZHOU, Wenjia ZHOU, Dennis Chit Yiu CHAN, Dennis Kwok-Wai YEE
  • Publication number: 20140242288
    Abstract: Provided are a reducing electroless silver plating solution and a reducing electroless silver plating method using the silver plating solution, the reducing electroless silver plating solution being capable of preventing decomposition of silver in the plating solution thereby to maintain stability of the solution and also being capable of preventing excessive roughening of an underlying metal or the like thereby to form a plating film having good film characteristics and a good appearance. The reducing electroless silver plating solution according to the present invention comprises a water-soluble silver salt and a reducing agent, wherein cyanide ions in a concentration of 0.006×10?3 mol/L to 12.5×10?3 mol/L are contained.
    Type: Application
    Filed: October 9, 2012
    Publication date: August 28, 2014
    Applicant: C. UYEMURA & CO., LTD
    Inventors: Daisuke Hashimoto, Kota Kitajima, Akira Okada
  • Publication number: 20140217328
    Abstract: Novel methods of electroless plating are described. Catalyst coatings can be applied within microchannel apparatus. Various reactions, including combustion and steam reforming, can be conducted over electroless catalyst coatings.
    Type: Application
    Filed: February 10, 2014
    Publication date: August 7, 2014
    Inventors: Francis P. Daly, Richard Q. Long, Barry Lee-Mean Yang, Terry J. Mazanec, Rachid Taha, Junko Ida
  • Patent number: 8795778
    Abstract: A method includes forming a master embossing roller to have a predetermined pattern, coating a flexible unpatterned substrate with a catalyst coating layer and forming a corresponding pattern in the coated substrate using the master embossing roller to thereby form a patterned substrate. The method may also include electrolessly plating the patterned substrate.
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: August 5, 2014
    Assignee: Unipixel Displays, Inc.
    Inventors: Robert J. Petcavich, Ed S. Ramakrishnan, Daniel K. Van Ostrand
  • Publication number: 20140205859
    Abstract: An electroless silver plating ink useful in a one step process for coating an article substrate with a bright metallic silver plate, wherein the silvering ink comprises a silver diammine ion, [Ag(NH.sub.3).sub.2].sup.+, in dimethyl sulfoxide.
    Type: Application
    Filed: January 22, 2013
    Publication date: July 24, 2014
    Inventor: Andre Reiss
  • Patent number: 8784931
    Abstract: A method of manufacturing ULSI wiring in which wiring layers are separately formed via a diffusion prevention layer and an insulating interlayer portion made of SiO2. The method comprises the steps of treating, with a silane compound, a SiO2 surface of the insulating interlayer portion on which the diffusion layer is to be formed, performing catalyzation with an aqueous solution containing a palladium compound, forming the diffusion prevention layer by electroless plating, and then forming the wiring layer on this diffusion prevention layer. A capping layer may be formed on the wiring layer by electroless plating. Consequently, a diffusion prevention layer having good adhesive properties can be formed through a simple wet process, and, the wiring layer can directly be formed on this diffusion prevention layer by a wet process. The capping layer can also be directly formed on the wiring layer by electroless plating.
    Type: Grant
    Filed: September 23, 2009
    Date of Patent: July 22, 2014
    Assignees: Waseda University, Renesas Electronics Corporation
    Inventors: Kazuyoshi Ueno, Tetsuya Osaka, Nao Takano
  • Patent number: 8771790
    Abstract: A method of reducing magnetite formation in the bore of a pipe including the steps of selecting a pipe with a pre-existing oxide layer on its inner bore surface and coating the pre-existing oxide layer with an oxidation resistant metal to thereby reduce magnetite formation in the bore of the pipe.
    Type: Grant
    Filed: January 12, 2010
    Date of Patent: July 8, 2014
    Inventor: Michael John de Vink
  • Publication number: 20140170328
    Abstract: An electroless plating Ru bath for the deposition of Ru on the surface of a substrate comprises a Ru stock solution and hydrazine as a reducing reagent. Ru layers may be applied, for example, for use in membranes for the separation of hydrogen gas from mixtures of gases or to protect materials from corrosion. An example Ru stock solution comprises Ru chloride, hydrochloric acid, ammonia, nitrite salt, alkali hydroxide, and deionized water. The electroless plating bath may be applied to deposit ruthenium layers onto palladium layers to prepare Pd—Ru composite or alloy membranes or multilayer Pd—Ru composite or alloy membranes. Such membranes have example application to the separation of hydrogen from mixtures of gases.
    Type: Application
    Filed: December 13, 2013
    Publication date: June 19, 2014
    Applicant: NORAM Engineering and Constructors Ltd.
    Inventors: David Anthony Boyd, Anwu Li
  • Patent number: 8715811
    Abstract: The present invention relates to a vanadium oxide thin film pattern which is fabricated by using APTS (3-aminopropyltriethoxysilane, H2NC3H5Si(OCH3)3) or the like to prepare an APTS-SAM or the like on the surface of a substrate, irradiating this APTS-SAM with vacuum ultraviolet light through a photomask to thereby modify amino-terminal silanes into silanol groups in the exposed area, and then depositing vanadium oxide in a liquid phase using a patterned self-assembled monolayer having the amino-terminated silane surface and silanol group surface as a template for patterning the vanadium oxide, to a method of fabricating the same, and to a vanadium oxide device.
    Type: Grant
    Filed: September 10, 2008
    Date of Patent: May 6, 2014
    Assignee: National Institute of Advanced Industrial Science and Technology
    Inventors: Yoshitake Masuda, Kunihito Koumoto
  • Patent number: 8703232
    Abstract: The present disclosure describes an article and a method of forming a microstructure. The method includes providing a substrate having a structured surface region comprising one or more recessed features with recessed surfaces. The structured surface region is substantially free of plateaus. The method includes disposing a fluid composition comprising a functional material and a liquid onto the structured surface region. The method includes evaporating liquid from the fluid composition. The functional material collects on the recessed surfaces such that a remainder of the structured surface region is substantially free of the functional material.
    Type: Grant
    Filed: June 25, 2009
    Date of Patent: April 22, 2014
    Assignee: 3M Innovative Properties Company
    Inventors: Matthew S. Stay, Mikhail L. Pekurovsky, Cristin E. Moran, Matthew H. Frey
  • Patent number: 8703251
    Abstract: A method and apparatus are provided for growing a composite metal sulphide photcatalyst thin film, wherein photochemical deposition and chemical bath deposition are both performed for growing the composite metal sulphide thin film, such as (AgInS2)x/(ZnS)2(1-x), wherein x is 0-1.
    Type: Grant
    Filed: January 26, 2010
    Date of Patent: April 22, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Kong-Wei Cheng, Jau-Chyn Huang, Ching-Chen Wu, Tai-Chou Lee, Ching-Sung Hsiao
  • Patent number: 8697233
    Abstract: A metal-coated material comprising a metal-coated lipid bilayer vesicle and a preparation method thereof are provided. A metal-coated material comprising a metal-coated lipid bilayer vesicle having a network of siloxane bonding (Si—O—Si) on its surface. a method for preparing the metal-coated lipid bilayer vesicle comprising the following steps: (1) rendering the functional group(s) having the ability of carrying the metal catalyst to the surface of lipid bilayer vesicle having a network of siloxane bonding (Si—O—Si bonding) on its surface, at or after the formation, by self-organization, of the lipid bilayer vesicle; (2) immobilizing the metal catalyst on the surface of the lipid bilayer vesicle; (3) optionally, reducing the metal catalyst; and (4) performing electroless plating.
    Type: Grant
    Filed: October 31, 2006
    Date of Patent: April 15, 2014
    Assignees: Nara Institute of Science and Technology, JX Nippon Mining & Metals Corporation
    Inventors: Jun-ichi Kikuchi, Yoshihiro Sasaki, Mineo Hashizume, Toru Imori
  • Patent number: 8652632
    Abstract: Disclosed herein is a structure having a spatially organized polymer nanostructured thin film and a metal coating on the film. The thin film is made by directing a monomer vapor or pyrolyzed monomer vapor towards a substrate at an angle other than perpendicular to the substrate, and polymerizing the monomer or pyrolyzed monomer on the substrate.
    Type: Grant
    Filed: June 3, 2009
    Date of Patent: February 18, 2014
    Assignee: The United States of America, as represented by the Secretary of the Navy
    Inventors: Melik C. Demirel, Walter J. Dressick, David Allara
  • Patent number: 8623460
    Abstract: The present invention refers to a method of making an copper-free article having a metal coating deposited on a substrate comprising: providing a substrate; contacting a surface of said substrate with a solution comprising: at least one metal ion selected from the group consisting of Ce, Pr, Nd, Eu, Er, Ga, W, Al, Mn, Mo, Sb, Te, La, Sm or their mixtures; and applying a metal coating on said surface of said substrate. In another embodiment the present invention refers to a method of making a metal coated article: providing a substrate; contacting a surface of said substrate with a solution comprising a mixture of more than one metal ion selected from the same group as listed above; or contacting said surface of said substrate with more than one solution comprising in each solution at least one metal ion selected from the same group; and applying a metal coating on said surface of said substrate.
    Type: Grant
    Filed: March 29, 2006
    Date of Patent: January 7, 2014
    Assignee: Valspar Sourcing, Inc.
    Inventor: Harry J. Bahls
  • Patent number: 8622020
    Abstract: An electroless plating system is provided. The system includes a first vacuum chuck supporting a first wafer and a second vacuum chuck supporting a second wafer such that a top surface of the second wafer is opposing a top surface of the first wafer. The system also includes a fluid delivery system configured to deliver a plating solution to the top surface of the first wafer, wherein in response to delivery of the plating solution, the top surface of the second wafer is brought proximate to the top surface of the first wafer so that the plating solution contacts both top surfaces. A method for applying an electroless plating solution to a substrate is also provided.
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: January 7, 2014
    Assignee: Lam Research Corporation
    Inventors: William Thie, John M. Boyd, Yezdi Dordi, Fritz C. Redeker
  • Publication number: 20140004335
    Abstract: There is provided a method for producing a molded product of which surface is modified by a functional material using a molding machine such as a general-purpose injection molding machine or extrusion molding machine. The method for producing the molded product includes: mixing a block copolymer having a hydrophilic segment with the functional material; mixing the block copolymer, which has been mixed with the functional material, with a thermoplastic resin; and molding the thermoplastic resin in which the functional material and the block copolymer are mixed.
    Type: Application
    Filed: September 3, 2013
    Publication date: January 2, 2014
    Applicant: Hitachi Maxell, Ltd.
    Inventors: Atsushi YUSA, Satoshi YAMAMOTO, Tetsuya ANO, Hironori OTA, Masahiro OSHIMA
  • Publication number: 20130344310
    Abstract: A method for electroless coating of substrates by applying an activating coat of polyelectrolyte or salt with a first aqueous composition; rinsing the activating coat such that the activating coat not being entirely removed; contacting and coating of the activated surfaces that have remained after rinsing with an aqueous composition in the form of a solution, emulsion or suspension, to form an organic secondary coat; and drying. The activating coat is a solution, emulsion or suspension containing a anionic polyelectrolyte or at least one anionic salt in solution in water. The aqueous composition forming the secondary coat has constituents which can be precipitated, deposited or salted out and which are anionically, zwitterionically, sterically or cationically stabilized. The dry film formed in the process, comprising the activating coat and the secondary coat, has a thickness of at least 1 ?m.
    Type: Application
    Filed: September 12, 2011
    Publication date: December 26, 2013
    Applicant: Chemetall GmbH
    Inventors: Daniel Wasserfallen, Michael Schwamb, Cindy Ettrich, Vera Sotke, Martin Droll, Oliver Seewald, Wolfgang Bremser, Aliaksandr Frenkel
  • Patent number: 8603623
    Abstract: A spatially organized polymer nanostructured thin film and a ligand adsorbate attached to the polymer nanostructured thin film and, optionally, an additional material or materials attached to the ligand adsorbate. A method for forming a structure by: providing a spatially organized polymer nanostructured thin film and a ligand adsorbate, and adsorbing the ligand adsorbate onto the thin film and, optionally, binding additional material or materials to the ligand adsorbate.
    Type: Grant
    Filed: April 24, 2008
    Date of Patent: December 10, 2013
    Assignee: The United States of America, as represented by the Secretary of the Navy
    Inventors: Melik C. Demirel, Alok K Singh, Walter J Dressick
  • Patent number: 8591985
    Abstract: A method is provided which includes dispensing a deposition solution at a plurality of locations extending different distances from a center of a microelectronic topography each at different moments in time during an electroless plating process. An electroless plating apparatus used for the method includes a substrate holder, a moveable dispense arm, and a storage medium comprising program instructions executable by a processor for positioning the moveable dispense arm. Another method and accompanying electroless deposition chamber are configured to introduce a gas into an electroless plating chamber above a plate which is suspended above a microelectronic topography and distribute the gas to regions extending above one or more discrete portions of the microelectronic topography.
    Type: Grant
    Filed: July 19, 2010
    Date of Patent: November 26, 2013
    Assignee: Lam Research Corporation
    Inventor: Igor C. Ivanov
  • Publication number: 20130295294
    Abstract: Provided are an electroless copper plating bath and an electroless copper plating method using the electroless copper plating bath, the electroless copper plating bath not containing formaldehyde; being usable under approximately neutral pH conditions; improving plating bath stability; and capable of forming a plating film with a good thickness while controlling deposition outside a pattern. The electroless copper plating bath according to the present invention contains a water-soluble copper salt, and amine borane or a substituted derivative thereof as a reducing agent; does not contain formaldehyde; and has a pH of 4 to 9, wherein polyaminopolyphosphonic acid as a complexing agent, an anionic surface-active agent, an antimony compound, and a nitrogen-containing aromatic compound are contained.
    Type: Application
    Filed: December 28, 2012
    Publication date: November 7, 2013
    Applicant: C. UYEMURA & CO., LTD.
    Inventors: Takahiro ISHIZAKI, Tomoharu NAKAYAMA, Teruyuki HOTTA
  • Patent number: 8551560
    Abstract: Methods for improving selective deposition of a capping layer on a patterned substrate are presented, the method including: receiving the patterned substrate, the patterned substrate including a conductive region and a dielectric region; forming a molecular masking layer (MML) on the dielectric region; preparing an electroless (ELESS) plating bath, where the ELESS plating bath includes: a cobalt (Co) ion source: a complexing agent: a buffer: a tungsten (W) ion source: and a reducing agent; and reacting the patterned substrate with the ELESS plating bath for an ELESS period at an ELESS temperature and an ELESS pH so that the capping layer is selectively formed on the conductive region. In some embodiments, methods further include a pH adjuster for adjusting the ELESS pH to a range of approximately 9.0 pH to 9.2 pH. In some embodiments, the pH adjuster is tetramethylammonium hydroxide (TMAH). In some embodiments, the MML is hydrophilic.
    Type: Grant
    Filed: May 22, 2009
    Date of Patent: October 8, 2013
    Assignee: Intermolecular, Inc.
    Inventors: Jinhong Tong, Zhi-Wen Sun, Chi-I Lang, Nitin Kumar, Bob Kong, Zachary Fresco
  • Patent number: 8551575
    Abstract: Methods and solutions for preventing the formation of metal particulate defect matter upon a substrate after plating processes are provided. In particular, solutions are provided which are free of oxidizing agents and include a non-metal pH adjusting agent in sufficient concentration such that the solution has a pH between approximately 7.5 and approximately 12.0. In some cases, a solution may include a chelating agent. In addition or alternatively, a solution may include at least two different types of complexing agents each offering a single point of attachment for binding metal ions via respectively different functional groups. In any case, at least one of the complexing agents or the chelating agent includes a non-amine or non-imine functional group. An embodiment of a method for processing a substrate includes plating a metal layer upon the substrate and subsequently exposing the substrate to a solution comprising the aforementioned make-up.
    Type: Grant
    Filed: February 21, 2012
    Date of Patent: October 8, 2013
    Assignee: Lam Research
    Inventors: Shijian Li, Artur K. Kolics, Tiruchirapalli N. Arunagiri