Abstract: A lead frame for an integrated electronic device includes a die pad made of a first metallic material. A top coating layer formed by a second metallic material is arranged on a top surface of the die pad. The second metallic material has an oxidation rate lower than the first metallic material. The top coating layer leaves exposed a number of corner portions of the top surface of the die pad. A subsequent heating operation, for example occurring in connection with wirebonding, causes an oxidized layer to form on the corner portions of the top surface of the die pad at a position in contact with the top coating layer.

Abstract: The present invention relates to a composition for electroless platinum plating and an electroless platinum plating method using the same, wherein it is possible to easily and safely produce a uniformly dispersed platinum thin film without expensive additional equipment by performing electroless platinum plating with a composition for electroless platinum plating containing an alcohol, an aqueous solution of a platinum chloride compound, and an aqueous solution of a basic compound.

Abstract: An abradable coating for a turbomachine part, includes a matrix made of a first metal material and particles made of a second metal material that are dispersed in the matrix, the first metal material having a melting temperature greater than 900° C., the second metal material having a melting temperature at least 50° C. lower than the melting temperature of the first metal material.

Abstract: Devices, methods, and/or computer-implemented methods that can facilitate formation of a self assembled monolayer on a quantum device are provided. According to an embodiment, a device can comprise a qubit formed on a substrate. The device can further comprise a self assembled monolayer formed on the qubit.

Abstract: A three-dimensional molded circuit component, includes: a base member which includes a metal part and a resin part; a circuit pattern which is formed on the resin part; and a mounted component which is mounted on the base member, and is electrically connected to the circuit pattern. The resin part includes a resin thin film as a portion thereof, which includes a thermoplastic resin, of which a thickness is in the range of 0.01 mm to 0.5 mm, and which is formed on the metal part. The mounted component is arranged on the metal part via the resin thin film.

Abstract: This invention relates to a double layer composite-coated nano-silicon negative electrode material, and its preparation methods and use, the negative electrode material comprising: a silicon-based nanoparticle, a copper layer coated on the surface of the silicon-based nanoparticle, and a conductive protective layer coated on the surface of the copper layer. Nano-copper has superplastic ductility and conductivity, and the prior art has proved that lithium ions can penetrate nano-copper; therefore, the copper coating layer has effects of inhibiting the volume expansion of the silicon-based nanoparticle and keeping the silicon-based nanoparticle from cracking so that direct contact between the silicon-based nanoparticle and an electrolyte is effectively avoided and a stable SEI is formed, and increasing the conductivity of the electrode.

Abstract: Select carboxymethyl-thio compounds are added to electroless copper plating compositions to improve the stability of the electroless copper plating compositions such that the plating activity of the electroless plating copper compositions is not compromised even when electroless plating at low plating temperatures and high stabilizer and high leached catalyst concentrations.

Abstract: The present invention relates to a method for manufacturing a bump structure capable of enhancing adhesion, comprising the steps of: forming an under bump metal (UBM) layer on a conductive pad; forming a copper bump on the UBM layer by electrolytic plating; forming a nickel bump on the copper bump by electrolytic plating; forming a first gold bump on the nickel bump by electrolytic plating using a first gold plating solution; and forming a second gold bump on the first gold bump by electrolytic plating using a second gold plating solution, wherein the second gold plating solution contains thallium (Tl) and the first gold plating solution is free of thallium.

Abstract: A specific cysteine derivative is added to electroless copper plating compositions to improve the stability of the electroless copper plating compositions such that the plating activity of the electroless plating copper compositions is not compromised even when electroless plating at low plating temperatures and high stabilizer and high leached catalyst concentrations.

Abstract: A carbon dioxide electrolytic device of an embodiment includes: an electrolysis cell including a cathode, an anode, a carbon dioxide supply unit, an electrolytic solution supply unit, and a separator; a power supply; a reaction control unit which causes a reduction reaction and an oxidation reaction by passing an electric current from the power supply to the anode and the cathode; a refresh material supply unit including a gas supply unit which supplies a gaseous substance to at least one of the anode and the cathode; and a refresh control unit which stops supply of the current from the power supply and supply of carbon dioxide and an electrolytic solution, and operates the refresh material supply unit, based on request criteria of a cell output of the electrolysis cell.

Abstract: A resin material including a hydrogenated crystalline polar group-containing dicyclopentadiene ring-opening polymer and a hydrogenated crystalline non-polar dicyclopentadiene ring-opening polymer in a weight ratio (hydrogenated crystalline polar group-containing dicyclopentadiene ring-opening polymer:hydrogenated crystalline non-polar dicyclopentadiene ring-opening polymer) of 100:0 to 1:99, the hydrogenated crystalline polar group-containing dicyclopentadiene ring-opening polymer being obtained by melt-mixing a hydrogenated crystalline non-polar dicyclopentadiene ring-opening polymer, a radical initiator, and a polar group-containing compound that includes an ethylenically unsaturated bond, the resin material including a structural unit derived from the polar group-containing compound that includes an ethylenically unsaturated bond in a ratio of 0.05 to 3.

Abstract: A composite material includes a metal material having conductivity and an oxidation inhibitor mixed with the metal material. The oxidation inhibitor forms a complex with the metal material to exert a resistance to oxidation of the metal material. For example, the composite material is formed on a surface of a base material as a plating material. As another example, the composite material is plated on a surface of an electrode.

Abstract: A method for producing a foamed molded product includes: using a molding apparatus including a plasticizing cylinder having a high pressure kneading zone and a pressure reduction zone; and a screw; controlling a pressure of the pressure reduction zone to be a first pressure in a state that communication between the high pressure kneading zone and the pressure reduction zone is shut off, the first pressure being not less than an atmospheric pressure and not more than a maximum pressure of the high pressure kneading zone which is reached in a case that a molten resin is brought in contact and kneaded with a physical foaming agent; controlling back pressure of the screw to be a second pressure which is not less than the first pressure; and measuring a predetermined amount of the molten resin from which the gasified physical foaming agent has been separated.

Abstract: The method of plating a stainless steel substrate including depositing a first plating metal layer over the stainless steel substrate), forming an interdiffusion layer in which elements of the stainless steel substrate and elements of the first plating metal layer interdiffuse, by applying a heat treatment to the stainless steel substrate coated by the first plating metal layer, and coating a second plating metal layer over the surface of the stainless steel substrate over which the interdiffusion layer is coated.

Abstract: A plating apparatus includes a vessel and a rack operable to be positioned inside the vessel. The rack includes a number of mandrels including a number of substrate mounting surfaces. The number of mandrels is non-revolving with respect to the rack. The rack further includes a number of gears coupled with the number of mandrels. A partition separates the number of gears from the number of mandrels. A diffuser is positioned below the rack. The diffuser is operable to produce a substantially uniform laminar flow of a fluid from a bottom to a top of the vessel. Thus, the laminar flow may reduce dead zones in the bath and remove defect-causing particles and gases away from the substrate.

Abstract: The present invention relates to a stable palladium ion catalyst aqueous solution for electroless metal plating that does not use boric acid and can be used stably over a wide pH range. The catalyst solution for electroless plating of the present invention contains palladium ion, palladium ion complexing agent, and a specific amine compound and is alkaline.

Abstract: The invention discloses a chemical plating product and method forming thereof, the chemical plating product includes an insulating member (1) and a metal coating covering the insulating member (1), the metal coating includes a pre-plating scope (2) formed by a coating catalyst and a chemical copper layer (3) covering the pre-plating scope (2).

Abstract: Technologies are generally described for method and systems effective to at least partially alter a defect in a layer including graphene. In some examples, the methods may include receiving the layer on a substrate where the layer includes at least some graphene and at least some defect areas in the graphene. The defect areas may reveal exposed areas of the substrate. The methods may also include reacting the substrate under sufficient reaction conditions to produce at least one cationic area in at least one of the exposed areas. The methods may further include adhering graphene oxide to the at least one cationic area to produce a graphene oxide layer. The methods may further include reducing the graphene oxide layer to produce at least one altered defect area in the layer.

Abstract: Disclosed are various methods, kits, and compositions in the field of electroless nickel plating and chemical polishing. An electroless nickel plating composition may include a surfactant-brightener; a coupler; a bismuth metallic stabilizer; and organosulfur stabilizer and a bismuth complexer. Prior to plating, a substrate may be polished with a polishing composition that includes a surface blocker and a surface leveler. When practiced in accordance with the preferred teachings described herein, the electroless nickel plating composition is capable of providing a mirror-bright, lustrous finish, and has good leveling properties. The composition may be made without lead or cadmium.

Abstract: The invention relates to a substrate having a bondable metal coating comprising, in this order, on an Al or Cu surface: (a) a Ni—P layer, (b) a Pd layer and, optionally, (c) an Au layer, wherein the thickness of the Ni—P layer (a) is 0.2 to 10 m, the thickness of the Pd layer (b) is 0.05 to 1.0 m and the thickness of the optional Au layer (c) is 0.01 to 0.5 m, and wherein the Ni—P layer (a) has a P content of 10.5 to 14 wt.-%. The deposit internal stress of the resulting Ni—P/Pd stack is not higher than 34.48M?Pa (5,000 psi). Further, a process for the preparation of such a substrate is described.

Abstract: A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.

Abstract: The present invention relates to a method of selectively plating a plastic article comprising a first polymer resin portion and a second polymer resin portion, wherein said first polymer resin portion is not rendered plateable by sulfonation and said second polymer resin portion is rendered plateable by sulfonation. The method comprises the steps of sulfonating the plastic article, activating the sulfonated plastic article to accept plating thereon, and plating the sulfonated and activated article in an electroless plating bath. The plastic article is selectively plated such that the first polymer resin portion does not have plating thereon and the second polymer resin portion is electrolessly plated.

Abstract: Provided is a method of manufacturing a gold (Au) thin film on a dielectric surface by using an electroless-plating method, the method including: manufacturing a reaction mixture by adding an Au chloride compound and an alkaline compound to an alcohol-water mixed solution; and forming an Au thin film by putting a substrate in the reaction mixture and stirring the reaction mixture. Accordingly, compounds that are relatively low toxic may be used as raw materials, and an Au thin film having a surface enhancement Raman scattering (SERS) effect may be conveniently and stably formed on a dielectric surface without having to use expensive additional equipment, such as a vacuum device.

Abstract: Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices.

Abstract: A method of manufacturing a hollow body is disclosed, the body provided with a glass inside surface defining a cavity, said method being characterized in that it includes a step of covering at least a fraction of said inside surface with a lining of composition that is mostly metal, said covering step including sub-steps of activating and of grafting said inside surface respectively with an activation agent and with a grafting agent, and in that said hollow body comprises a single piece of glass inside which said cavity is formed.

Abstract: Provided is an electroless copper plating solution that forms a highly adhesive conductive film regardless of the degree of roughness of the resin surface and also has a fast deposition rate. The electroless copper plating solution of the present invention is characterized in that it contains guanosine. The electroless copper plating solution of the present invention preferably also contains copper ion, reducing agent, copper ion complexing agent, and pH adjuster.

Abstract: An apparatus is provided having a closable chamber that can be sealed and is capable of withstanding an increased pressure and high temperature. The chamber has several inlet ports for the supply of various process liquids, such as deposition solutions, DI water for rinsing, etc., and a port for the supply of a gas under pressure. The apparatus also includes a solution heater and a control system for controlling temperature and pressure in the chamber. Uniform deposition is achieved by carrying out the deposition process under pressure and under temperature slightly below the boiling point of the solution. The solution can be supplied from above via a shower head formed in the cover, or through the bottom of the chamber. Rinsing or other auxiliary solutions are supplied via a radially moveable chemical dispensing arm that can be arranged above the substrate parallel thereto.

Abstract: Stable tin-free palladium catalysts are used to metalize through-holes of printed circuit boards. A stabilizer is included in the catalyst formulation which prevents precipitation and agglomeration of the palladium.

Abstract: Thermoplastic moulding composition (F), comprising: A) from 5 to 80% by weight of a graft polymer (A) having bimodal particle size distribution and a moisture content of 0 to 27% by weight, made, based on (A), a1) from 40 to 90% by weight of an elastomeric particulate graft base (a1), obtained by emulsion polymerization of based on (a1), a11) from 70 to 100% by weight of at least one conjugated diene, or of at least one C1-8-alkyl acrylate, or of mixtures of these, a12) from 0 to 30% by weight of at least one other monoethylenically unsaturated monomer and a13) from 0 to 10% by weight of at least one polyfunctional, cross linking monomer; a2) from 10 to 60% by weight of a graft a2), made, based on a2), a21) from 64 to 76% by weight of at least one vinyl aromatic monomer, a22) from 24 to 36% by weight of acrylonitrile, a23) from 0 to 30% by weight of at least one other monoethylenically unsaturated monomer, and a24) from 0 to 10% by weight of at least one polyfunctional, cross linking monomer; B) from 10 to 94

Abstract: The present invention relates to a surface-modified tantalum oxide nanoparticle, a method for preparation thereof, a contrast agent (medium) for X-ray computed tomography, and a highly dielectric (high-?) film using the same. In particular, the present invention is directed to a surface-modified tantalum oxide nanoparticle, a method for preparing surface-modified tantalum oxide nanoparticles, comprising: (i) adding an aqueous phase to an organic solvent which contains a surfactant, to prepare a water-in-oil microemulsion; (ii) introducing a tantalum precursor to said microemulsion; (iii) adding a surface-modifier having an organic silane group or phosphine group to a solution obtained at the step (ii); (iv) removing said organic solvent from a product obtained at the step (iii); and (v) separating surface-modified tantalum oxide nanoparticles from a mixture obtained at the step (iv), a contrast agent for X-ray computed tomography, and a highly dielectric (thin) film using the same.

Abstract: In a viscous liquid feed nozzle having a nozzle body provided with a thin and long hole with a front end serving as a feed port, a lubricative plated layer is provided by immersing the liquid feed nozzle in a plating tank containing a lubricative plating solution and forming, by electroless plating, the lubricative plated layer at least on the inside and outside of the feed port.

Abstract: A plating apparatus includes a processing bath configured to store a processing liquid therein, a transporter configured to immerse a substrate holder, holding a substrate, in the processing liquid, raise the substrate holder out of the processing bath, and transport the substrate holder in a horizontal direction, and a gas flow generator configured to generate a clean gas flow forward of the substrate with respect to a direction in which the substrate holder is transported. The transporter moves the gas flow generator together with the substrate holder in the horizontal direction while transporting the substrate holder in the horizontal direction.

Abstract: A process of electroless plating a tin or tin-alloy active material onto a metal substrate for the negative electrode of a rechargeable lithium battery comprising steps of (1) immersing the metal substrate in an aqueous plating solution containing metal ions to be plated, (2) plating tin or tin-alloy active material onto the metal substrate by contacting the metal substrate with a reducing metal by swiping one on the other, and (3) removing the plated metal substrate from the plating bath and rinsing with deionized water. A rechargeable lithium battery using tin or tin-alloy as the anode active material.

Abstract: Provided are a reducing electroless silver plating solution and a reducing electroless silver plating method using the silver plating solution, the reducing electroless silver plating solution being capable of preventing decomposition of silver in the plating solution thereby to maintain stability of the solution and also being capable of preventing excessive roughening of an underlying metal or the like thereby to form a plating film having good film characteristics and a good appearance. The reducing electroless silver plating solution according to the present invention comprises a water-soluble silver salt and a reducing agent, wherein cyanide ions in a concentration of 0.006×10?3 mol/L to 12.5×10?3 mol/L are contained.

Abstract: A solution including a precious metal nanoparticle and a polymer polymerized from at least two monomers, (1) a monomer having two or more carboxyl groups or carboxyl acid salt groups and (2) a monomer which has ? electron-available features. The solution is useful for a catalyst of a process for electroless plating a metal on non-conductive surface.

Abstract: The invention relates to an electroless aqueous copper plating solution, comprising a source of copper ions, a source of glyoxylic acid as reducing agent, and at least one polyamino disuccinic acid or at least one polyamino monosuccinic acid, or a mixture of at least one polyamino disuccinic acid and at least one polyamino monosuccinic acid as complexing agent, as well as to a method for electroless copper plating utilizing said solution and the use of the solution for the plating of substrates.

Abstract: Novel methods of electroless plating are described. Catalyst coatings can be applied within microchannel apparatus. Various reactions, including combustion and steam reforming, can be conducted over electroless catalyst coatings.

Abstract: A method includes forming a master embossing roller to have a predetermined pattern, coating a flexible unpatterned substrate with a catalyst coating layer and forming a corresponding pattern in the coated substrate using the master embossing roller to thereby form a patterned substrate. The method may also include electrolessly plating the patterned substrate.

Abstract: An electroless silver plating ink useful in a one step process for coating an article substrate with a bright metallic silver plate, wherein the silvering ink comprises a silver diammine ion, [Ag(NH.sub.3).sub.2].sup.+, in dimethyl sulfoxide.

Abstract: A method of manufacturing ULSI wiring in which wiring layers are separately formed via a diffusion prevention layer and an insulating interlayer portion made of SiO2. The method comprises the steps of treating, with a silane compound, a SiO2 surface of the insulating interlayer portion on which the diffusion layer is to be formed, performing catalyzation with an aqueous solution containing a palladium compound, forming the diffusion prevention layer by electroless plating, and then forming the wiring layer on this diffusion prevention layer. A capping layer may be formed on the wiring layer by electroless plating. Consequently, a diffusion prevention layer having good adhesive properties can be formed through a simple wet process, and, the wiring layer can directly be formed on this diffusion prevention layer by a wet process. The capping layer can also be directly formed on the wiring layer by electroless plating.

Abstract: A method of reducing magnetite formation in the bore of a pipe including the steps of selecting a pipe with a pre-existing oxide layer on its inner bore surface and coating the pre-existing oxide layer with an oxidation resistant metal to thereby reduce magnetite formation in the bore of the pipe.

Abstract: An electroless plating Ru bath for the deposition of Ru on the surface of a substrate comprises a Ru stock solution and hydrazine as a reducing reagent. Ru layers may be applied, for example, for use in membranes for the separation of hydrogen gas from mixtures of gases or to protect materials from corrosion. An example Ru stock solution comprises Ru chloride, hydrochloric acid, ammonia, nitrite salt, alkali hydroxide, and deionized water. The electroless plating bath may be applied to deposit ruthenium layers onto palladium layers to prepare Pd—Ru composite or alloy membranes or multilayer Pd—Ru composite or alloy membranes. Such membranes have example application to the separation of hydrogen from mixtures of gases.

Abstract: The present invention relates to a vanadium oxide thin film pattern which is fabricated by using APTS (3-aminopropyltriethoxysilane, H2NC3H5Si(OCH3)3) or the like to prepare an APTS-SAM or the like on the surface of a substrate, irradiating this APTS-SAM with vacuum ultraviolet light through a photomask to thereby modify amino-terminal silanes into silanol groups in the exposed area, and then depositing vanadium oxide in a liquid phase using a patterned self-assembled monolayer having the amino-terminated silane surface and silanol group surface as a template for patterning the vanadium oxide, to a method of fabricating the same, and to a vanadium oxide device.

Abstract: The present disclosure describes an article and a method of forming a microstructure. The method includes providing a substrate having a structured surface region comprising one or more recessed features with recessed surfaces. The structured surface region is substantially free of plateaus. The method includes disposing a fluid composition comprising a functional material and a liquid onto the structured surface region. The method includes evaporating liquid from the fluid composition. The functional material collects on the recessed surfaces such that a remainder of the structured surface region is substantially free of the functional material.

Abstract: A method and apparatus are provided for growing a composite metal sulphide photcatalyst thin film, wherein photochemical deposition and chemical bath deposition are both performed for growing the composite metal sulphide thin film, such as (AgInS2)x/(ZnS)2(1-x), wherein x is 0-1.

Abstract: A metal-coated material comprising a metal-coated lipid bilayer vesicle and a preparation method thereof are provided. A metal-coated material comprising a metal-coated lipid bilayer vesicle having a network of siloxane bonding (Si—O—Si) on its surface. a method for preparing the metal-coated lipid bilayer vesicle comprising the following steps: (1) rendering the functional group(s) having the ability of carrying the metal catalyst to the surface of lipid bilayer vesicle having a network of siloxane bonding (Si—O—Si bonding) on its surface, at or after the formation, by self-organization, of the lipid bilayer vesicle; (2) immobilizing the metal catalyst on the surface of the lipid bilayer vesicle; (3) optionally, reducing the metal catalyst; and (4) performing electroless plating.

Abstract: Disclosed herein is a structure having a spatially organized polymer nanostructured thin film and a metal coating on the film. The thin film is made by directing a monomer vapor or pyrolyzed monomer vapor towards a substrate at an angle other than perpendicular to the substrate, and polymerizing the monomer or pyrolyzed monomer on the substrate.

Abstract: The present invention refers to a method of making an copper-free article having a metal coating deposited on a substrate comprising: providing a substrate; contacting a surface of said substrate with a solution comprising: at least one metal ion selected from the group consisting of Ce, Pr, Nd, Eu, Er, Ga, W, Al, Mn, Mo, Sb, Te, La, Sm or their mixtures; and applying a metal coating on said surface of said substrate. In another embodiment the present invention refers to a method of making a metal coated article: providing a substrate; contacting a surface of said substrate with a solution comprising a mixture of more than one metal ion selected from the same group as listed above; or contacting said surface of said substrate with more than one solution comprising in each solution at least one metal ion selected from the same group; and applying a metal coating on said surface of said substrate.

Abstract: An electroless plating system is provided. The system includes a first vacuum chuck supporting a first wafer and a second vacuum chuck supporting a second wafer such that a top surface of the second wafer is opposing a top surface of the first wafer. The system also includes a fluid delivery system configured to deliver a plating solution to the top surface of the first wafer, wherein in response to delivery of the plating solution, the top surface of the second wafer is brought proximate to the top surface of the first wafer so that the plating solution contacts both top surfaces. A method for applying an electroless plating solution to a substrate is also provided.

Abstract: There is provided a method for producing a molded product of which surface is modified by a functional material using a molding machine such as a general-purpose injection molding machine or extrusion molding machine. The method for producing the molded product includes: mixing a block copolymer having a hydrophilic segment with the functional material; mixing the block copolymer, which has been mixed with the functional material, with a thermoplastic resin; and molding the thermoplastic resin in which the functional material and the block copolymer are mixed.