Abstract: A first metal is plated onto a substrate comprising a second metal by immersing the substrate into a bath comprising a compound of the first metal and an organic diluent. The second metal is more electropositive than the first metal. The organic diluent has a boiling point higher than a eutectic point in a phase diagram of the first and second metals. The bath is operated above the eutectic point but below the melting point of the second metal. For example, bismuth is immersion plated onto lead-free tin-based solder balls, and subsequently redistributed by fluxless reflow. Plated structures are also provided.

Abstract: A method of forming a metallic feature on a substrate, comprising the steps of: providing a stamp having a raised region; depositing catalytic particles on a selected area of the stamp, including the raised region thereof; providing a substrate; applying the stamp to the substrate, such that the raised region of the stamp causes a corresponding indented region in the substrate and at least some of the catalytic particles are transferred to a selected area of the substrate; and plating the selected area of the substrate.

Abstract: An electroless gold plating solution is provided that contains no cyanide compound as a source of gold and that contains a decomposition inhibitor represented by general formula (1), provided that, in a case in which the solution contains a gold complex of sulfite and the decomposition inhibitor is cytosine, the pH 6.0 or less is excluded. In the formula, R1 to R4 denote hydrogen atom(s), alkyl group(s) having 1 to 10 carbon atom(s), which may have substituent(s), aryl group(s) having 6 to 10 carbon atoms, which may have substituent(s), alkoxy group(s) having 1 to 10 carbon atom(s), which may have substituent(s), amino group(s) (—NH2), hydroxyl group(s) (—OH), ?O, or halogen atom(s), R2 and R3 or R3 and R4 may crosslink with each other and form a saturated or unsaturated ring and the saturated or unsaturated ring may include oxygen, sulfur or nitrogen atom(s), each of the above-mentioned substituents may be a halogen atom or a cyano group, and may be a single bond or a double bond.

Abstract: An object of the invention is to prevent the color on a surface of a plated metal layer from changing. The invention is a wiring substrate obtained by forming a wiring conductor made of a metal having a high melting point on an insulator, and coating a surface of the wiring conductor with an electroless plated metal layer, wherein the electroless plated metal layer contains an element of Group 1B and is free from lead.

Abstract: The present invention relates to a web handling apparatus and process ideally suited for applications involving wet chemistry. The invention involves the horizontal processing of webs in processing containers. The web is redirected into the processing container by inserting a cassette across the web and into the processing container. The cassette includes at least one functional fluid element that facilitates processing of the web. The web handling practices of the invention improve the quality of the processed web. The invention is preferably used in electrodeposition processes.

Abstract: A method of coating a substrate comprises the steps of: (a) providing a substrate in an enclosed vessel, the substrate having a surface portion; (b) at least partially filling the enclosed vessel with a first supercritical fluid so that said first supercritical fluid contacts the surface portion, with the first supercritical fluid carrying or containing a coating component; then (c) adding a separate compressed gas atmosphere to the reaction vessel so that a boundary is formed between the first supercritical fluid and the separate compressed gas atmosphere, said separate compressed gas atmosphere having a density less than said first supercritical fluid; and then (d) displacing said first supercritical fluid from said vessel by continuing adding said separate compressed gas atmosphere to said vessel so that said boundary moves across said surface portion and a thin film of coating component is deposited on said microelectronic substrate.

Abstract: The invention relates to a supported platinum group metal catalyst obtainable by controlled electroless deposition of at least one platinum group metal from a deposition solution which comprises i) at least one homogeneously dissolved platinum group metal compound, ii) a reducing agent and iii) at least one control agent selected from isopolyacids and heteropolyacids of niobium, tantalum, molybdenum, tungsten and vanadium or their salts.

Abstract: Disclosed are methods of depositing electroless gold layers on a metal substrate using a catalytic palladium deposit. Such electroless gold layers have increased adhesion as compared to conventional electroless gold deposits.

Abstract: There is provided a coating liquid for forming a colored transparent conductive film using ruthenium in a fine particle form, which has a satisfactory electromagnetic wave shielding effect, which is excellent in transparency, chemical resistance, and abrasion resistance, and which achieves a neutral transmitted color tone. There are provided a substrate with the colored transparent conductive film and a method for its production, and a display device having the substrate as a front panel. A coating liquid for forming a colored transparent conductive film is one characterized by containing noble metal-supporting ruthenium in a fine particle form wherein a noble metal except for ruthenium is supported in a fine particle form on ruthenium. A method for making the noble metal supported in the fine particle form is a method of adding a reducing agent into a dispersing liquid containing ruthenium particles and then adding thereinto a solvent containing a compound of a noble metal.

Abstract: The present invention relates to compositions and a method for electroless formation of alkaline-metal-free coatings on the basis of cobalt and composition of cobalt with tungsten and phosphorus, which have high resistance to oxidation and stability of electrical characteristics, when the Co—Cu system layer is used in IC chips. The composition of the electroless solution contains more than one reducing agents, one of which can catalyze the initial electroless deposition layer of cobalt on copper (called initiator), while the other maintains deposition of cobalt on the aforementioned initial layer as the process is continued. Small amount (100-5000 ppm) of elements from the initiator also builds into the electroless film, which is expected to further improve the barrier properties of the resultant film compared to the deposition bath without initiator.

Abstract: Methods and systems are provided which are adapted to process a microelectronic topography, particularly in association with an electroless deposition process. In general, the methods may include loading the topography into a chamber, closing the chamber to form an enclosed area, and supplying fluids to the enclosed area. In some embodiments, the fluids may fill the enclosed area. In addition or alternatively, a second enclosed area may be formed about the topography. As such, the provided system may be adapted to form different enclosed areas about a substrate holder. In some cases, the method may include agitating a solution to minimize the accumulation of bubbles upon a wafer during an electroless deposition process. As such, the system provided herein may include a means for agitating a solution in some embodiments. Such a means for agitation may be distinct from the inlet/s used to supply the solution to the chamber.

Abstract: This process results in directed electroless plating of the metal to form discrete metal structures over the entire surface. Because the surface is pre-patterned with passivated regions inert to metal deposition, the metal is directed only to the unstamped regions. This allows the formation of unconnected metal structures without any chemical etching steps. These metallic arrays are varied in size, separation and shape by using gratings of different periodicities and blaze angles as the stamp templates. A variety of well-defined geometric patterns have been fabricated and imaged using scanning probe, scanning electron, and optical microscopies.

Abstract: Electroless copper plating solutions and methods of use thereof are disclosed. A representative electroless copper plating solution includes a reducing agent that is a source of hypophosphite ions and at least one accelerator compound that accelerates the rate of copper deposition.

Abstract: The present invention is directed to an activator solution and method for activating a copper-seeded surface to facilitate plating of copper onto the copper-seeded surface. The activator solution is prepared by heating a precursor solution to a temperature of at least about 95° C., and maintaining the precursor solution at said temperature for at least about 30 minutes, wherein the precursor solution comprises water, chlorine ions, copper ions, tin (II) ions, and an antioxidant compound which substantially prevents the oxidation of the tin (II) ions to tin (IV) ions.

Abstract: The invention includes processes for combined polymer surface treatment and metal deposition. Processes of the invention include forming an aqueous solution containing a metal activator, such as an oxidized species of silver, cobalt, ruthenium, cerium, iron, manganese, nickel, rhodium, or vanadium. The activator can be suitably oxidized to a higher oxidation state electrochemically. Exposing a part to be plated (such as an organic resin, e.g. a printed circuit board substrate) to the solution enables reactive hydroxyl species (e.g. hydroxyl radicals) to be generated and to texture the polymer surface. Such texturing facilitates good plated metal adhesion. As part of this contacting process sufficient time is allowed for both surface texturing to take place and for the oxidized metal activator to adsorb onto said part. The part is then contacted with a reducing agent capable of reducing the metal activator to a lower ionic form, or a lower oxidation state.

Abstract: An electroless gold plating solution is provided in which an amount of gold deposited by a displacement reaction is at least 15 ?g/cm2, and the electroless gold plating solution includes a reducing agent that is oxidized by gold, and a reducing agent that is of the same type as or is a different type from the above reducing agent and is oxidized by a substrate metal. The solution can form a uniform gold coating having good adhesion and low porosity in one step.

Abstract: A gas sensing element has a solid electrolytic body, a reference gas side electrode provided on a surface of the solid electrolytic body so as to be exposed to a reference gas, and a measured gas side electrode provided on another surface of the solid electrolytic body so as to be exposed to a measured gas. A crystal face strength ratio of the measured gas side electrode according to X-ray diffraction is 0.7?{I(200)/I(111)} or 0.6?{I(220)/I(111)}.

Abstract: The method for electroless deposition of a coating material, which may be a metal, semiconductor, or dielectric, that is carried out at a relatively low temperature of the working solution compensated by an increased temperature on the substrate which is controlled by a heater built into the substrate chuck. A decrease in the temperature of the working solution prevents thermal decomposition of the solution and reduces formation of gas bubbles, normally generated at increased temperatures. Accumulation of bubbles on the surface of the substrate is further prevented due to upwardly-facing orientation of the treated surface of the substrate. The substrate holder is equipped with a substrate heater and a substrate cooler, that can be used alternatingly for quick heating or cooling of the substrate surface.

Abstract: An autodeposition process is disclosed which eliminates conventional wet pretreatment steps and comprises a non-contact, cleaning step for the metal part in an electromagnetic field, volatilizing contaminants and forming an in-situ surface oxide (Fe2O3 and/or Fe3O4) pigment layer on the part, cooling the part, autodepositing a coating on the entire surface oxide layer, followed by dehydration and/or further curing.

Abstract: A system and method for storing a solution containing a subset of a group consisting of a metal ion, a complexing agent, an ammonium salt, and a strong base and then nearer to a time of use in an electroless deposition process, using the solution to form an electroless deposition solution containing the entire group. In one embodiment of the invention, the metal ion includes a cobalt ion, the complexing agent includes citric acid, the ammonium salt includes ammonium chloride, and the strong base includes tetramethylammonium hydroxide.

Abstract: A method for applying at least one coating composition to an electrochemically active metal substrate, and the coated substrate produced thereby are disclosed. Preferably, an articulable electromechanical device such as a robot arm is utilized to aid in precision coating electrochemically active metal substrates, particularly complex shaped electrochemically active metal substrates through autodeposition. The electromechanical device is articulable through a wide range of motions and can substantially eliminate drip edges or pockets of retained coating in otherwise poorly draining areas of the substrate, producing fully and/or evenly coated, aesthetically pleasing coated substrates. Throughput of coated substrates is maximized through the method of the present invention.

Abstract: The invention provides a hydrogen permeable structure, which can effectively prevent peeling-off of a hydrogen permeable film and hence has higher durability, and a method of manufacturing the structure. The hydrogen permeable structure has a hydrogen permeable film formed on the surface of or inside a porous support, having a thickness of not more than 2 &mgr;m, and containing palladium (Pd). The hydrogen permeable film is formed on the surface of or inside the porous support by supplying a Pd-containing solution and a reducing feed material from opposite sides of the porous support.

Abstract: Disclosed is a substrate construction for immobilizing a physiological material that has a substrate; an organic polymer linker material layer formed on the substrate; and a gold thin layer formed on the organic polymer linker material layer. The organic polymer linker material layer has a thickness ranging form 30 to 200 nm and shows peaks of 111 and 200 planes using X-ray diffractometry when the X-rays radiate at an incident angle of 1.5. The substrate is prepared through the processes of forming an organic polymer linker material layer by coating a coating composition including organic polymer linker material on a substrate; forming a seed colloid catalytic layer by coating a gold colloid dispersion on the organic polymer linker material layer; drying or heat-treating the substrate on which the seed colloid catalytic layer is formed; and obtaining a gold thin layer by coating a coating composition that includes a gold salt-containing aqueous solution and a reducing agent-containing solution.

Abstract: Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures.

Abstract: Disclosed are electroless nickel plating composition including nickel, a reducing agent, a complexing agent, and an accelerator, wherein the accelerator is a mesoionic compound in an amount sufficient to accelerate the rate of deposition the composition.

Abstract: An article of manufacture produced by a method for electroless plating a metallic layer on the surface of a non-metallic substrate. The method comprises (a) exposing the non-metallic substrate to a solution comprising non-precious metal ions so as to obtain a non-metallic substrate covered with a layer of non-precious metal ions; and (b) exposing the covered non-metallic substrate obtained in step (a) to a reducing solution comprising a reducing agent capable of reducing the metal ions that cover the substrate from their oxidation state in step (a) to a lower oxidation state, preferably to zero valence state. In a preferred embodiment, metallization is accomplished by inducing precipitation of metal, e.g. copper, on the surface to be metallized (this effect also being referred to as “plate-out”), via decomposition of the electroless solution. The inventive process contrasts with the prior art, wherein electroless copper deposition is predominantly initiated or triggered through a Pc-bearing layer.

Abstract: Materials and methods are described for electroless deposition of cobalt phosphorus and cobalt tungsten phosphorus, employing tungsten trioxide or tungsten phosphoric acid as a source of tungsten. Electolessly deposited metals produced are substantially devoid of alkali metal ions and alkaline earth metal ions. The deposits are typically oxygen-free thin films having a low sheet resistivity of less than 50 &mgr;&OHgr;.cm. The films may be used as capping layers or barriers for the prevention of interlayer metallic drift, diffusion and migration in semiconductor, ULSI, VLSI, electroplating industries and products.

Abstract: The present invention is aimed to provide an electroless gold plating solution which requires less amount of a reducing agent, retains a sufficient deposition rate for a practical use, and has an excellent stability as a plating solution; and a method for carrying out an electroless gold plating. The present invention provides an electroless gold plating solution comprising a gold salt, a phenyl compound based reducing agent and a water-soluble amine and a method for plating using the gold plating solution.

Abstract: A dual-sided stamper/imprinter for simultaneously forming magnetic transition patterns in spaced-apart first and second layers of magnetic material by contact printing comprises a mechanically hard, substantially rigid magnetic material having high saturation magnetization and high permeability and including first and second oppositely facing imprinting surfaces, wherein each of the imprinting surfaced has a topographical pattern formed therein comprising a patterned plurality of spaced-apart recesses with a plurality of non-recessed areas therebetween, each topographical pattern corresponding to a magnetic transition pattern to be formed in a respective layer of magnetic material. Also disclosed is a method for manufacturing dual-sided stampers/imprinters.

Abstract: This invention relates to aqueous electroless nickel plating solutions, and more particularly, to nickel plating solutions based on nickel salts of alkyl sulfonic acids as the source of nickel ions. The plating solutions utilize, as a reducing agent, hypophosphorous acid or bath soluble salts thereof selected from sodium hypophosphite, potassium hypophosphite and ammonium hypophosphite. The electroless nickel plating solutions of the invention are free of added nickel hypophosphite, and free of alkali or alkaline earth metal ions capable of forming an insoluble orthophosphite.

Abstract: A fiber-reinforced plastic base body is first of all provided with a coating of hard rubber or thermoplastic having a dispersed metal or ceramic content of 5% by volume to 80% by volume, and the coating is ground down to provide a smooth surface In a further step a layer of metal and/or ceramic, which has a printing function, is applied to the smooth surface, preferably by thermal spraying.

Abstract: A corrosion-resistant, copper-finned heat exchanger for a water heater is provided. The heat exchanger includes a conduit through which water runs, heat-transfer fins extending from the conduit and an anti-corrosive coating containing electroless nickel. The heat-transfer fins contain copper, and the coating is deposited directly onto at least one of the copper heat-transfer fins.

Abstract: The present invention relates to compositions and a method for electroless formation of alkaline-metal-free coatings on the basis of cobalt and composition of cobalt with tungsten and phosphorus, which have high resistance to oxidation and stability of electrical characteristics, when the Co—Cu system layer is used in IC chips. The composition of the electroless solution contains more than one reducing agents, one of which can catalyze the initial electroless deposition layer of cobalt on copper (called initiator), while the other maintains deposition of cobalt on the aforementioned initial layer as the process is continued. Small amount (100-5000 ppm) of elements from the initiator also builds into the electroless film, which is expected to further improve the barrier properties of the resultant film compared to the deposition bath without initiator.

Abstract: There is provided an electroless plating method and device which can form a plated film having an improved uniformity of film thickness with an enhanced selectivity, while preventing the formation of fine pores in the plated film. The electroless plating method comprises, bringing a substrate into contact with an electroless plating solution to form a plated film on the surface of the substrate, and scrubbing the surface of the plated film formed or being formed on the surface of the substrate.

Abstract: The surfaces of apparatuses and apparatus parts for chemical plant construction, including, for example, apparatus, container and reactor walls, discharge apparatuses, fittings, pumps, filters, compressors, centrifuges, columns, heat exchangers, dryers, comminuting machines, internals, packings and mixing elements, are coated by a process wherein protuberances having a mean height of from 100 nm to 50 &mgr;m with a mean spacing of from 100 nm to 100 &mgr;m are produced on the surface to be coated and the coating is applied thereon by currentless deposition of a metal layer or of a metal-polymer dispersion layer with the aid of a plating bath which contains a metal electrolyte, a reducing agent and optionally a polymer or polymer blend to be deposited, in dispersed form.

Abstract: A work piece is mixed with Ni pieces having an average diameter of 1 mm and exhibiting catalytic activity to oxidation reaction of sodium phosphinate (NaH2PO2) added as a reducing agent in a plating bath containing the reducing agent and a Ni salt to form a Ni—P film on an electrode made of Cu, Ag or Ag—Pd by auto-catalytic electroless plating. Then, the work piece is dipped in a plating bath containing an Au salt to form an Au film on the surface of the Ni—P film by substitutional electroless plating. This method is capable of forming a desired plating film only on a desired portion at a low cost.

Abstract: An plating apparatus which can easily form a plated film having more uniform thickness on a surface, to be plate, of a material to be plated. The plating apparatus includes a holding portion having a heating portion for holding a material to be plated in such a state that a surface to be plated faces downward, and a plating bath for introducing an electroless plating liquid having a predetermined temperature into a plating chamber, and holding the electroless plating liquid while allowing the electroless plating liquid to overflow an overflow dam. The material which is by the holding portion, is brought into contact with the plating liquid in the plating bath to plate the material.

Abstract: Compositions and methods for coating and plating a non-conductive substrate, the substrate having a surface, comprising coating the surface with a binding solution composition, the binding solution composition comprising between approximately 30% by weight and approximately 70% by weight of a binding solution, between approximately 2% by weight and approximately 10% by weight of carbon black powder, between approximately 25% by weight and approximately 50% by weight of aluminum powder, cleaning the coated surface, and immersing the cleaned, coated surface into a plating bath, the plating bath comprising between approximately 5% by volume and approximately 20% by volume hydrofluoric acid, between approximately 4% by volume and approximately 6% by volume copper sulfate, and water.

Abstract: The invention concerns an electrolyte for electroless deposition of metal layers with internal compressive stresses containing a metal base salt, a reducing agent, a complexing agent, an accelerator and a stabilizer. In order to make available an electrolyte of the said kind, from which uniform pore-free and crack-free metal-phosphorus coatings can be deposited with constant layers properties and high phosphorus contents at an elevated deposition rate over a long period of time, it is proposed by means of the invention that the electrolyte contain as metal base salt a metal salt whose anions contain at least one carbon atom and that is present in a starting concentration from 0.01 to 0.3 mol/L. At least one salt consisting of metal acetate, metal formate, metal oxalate, metal propionate, metal citrate and metal ascorbate, especially preferably metal acetate, is used as the metal salt whose anion contains at least one carbon atom.

Abstract: The present invention is a process for manufacturing resistors integral with the printed circuit board by plating the resistors onto the insulative substrate. The invention uses a mask during the activation step so as to selectively activate only selected portions of the surface thus enabling smaller areas to be plated on the printed circuit board because no plating mask is used. The process of the instant invention produced printed circuit boards having greater uniformity and reliability as compared to the prior art.

Abstract: Electroless plating solutions are disclosed for forming metal alloys, such as cobalt-tungsten alloys. In accordance with the present invention, the electroless plating solutions may be formulated so as not to contain any alkali metals. Further, the solutions can be formulated without the use of tetramethylammonium hydroxide. In a further embodiment, a plating solution can be formulated that does not require the use of a catalyst, such as a palladium catalyst prior to depositing the metal alloy on a substrate.

Abstract: A copper plating solution according to the present invention is characterized by that it comprising 0.03 mol/L to 0.5 mol/L of copper sulfate, 0.05 mol/L to 0.7 mol/L of ethylenediaminetetraacetic acid and 0.02 mol/L to 0.3 mol/L of sulfite, and has a pH adjusted to 5.0 to 8.5. A method for copper plating according to the present invention is characterized by that it comprises using the copper plating solution above. The copper plating solution and the method for copper plating according to the present invention stably provide a uniform copper plating film excellent in adhesion on the surface of an article to be plated, such as rare earth metal-based permanent magnet.

Abstract: A method is provided for the preparation of metal/porous substrate composite membranes by flowing a solution of metal to be plated over a first surface of a porous substrate and concurrently applying a pressure of gas on a second surface of the porous substrate, such that the porous substrate separates the solution of metal from the gas, and the use of the resulting membrane for the production of highly purified hydrogen gas.

Abstract: The disclosure relates to a process for forming a deposit on the surface of a metallic or conductive surface. The process employs an electroless process to deposit a silicate containing coating or film upon a metallic or conductive surface.

Abstract: An electroless gold plating solution is provided that contains no cyanide compound as a source of gold and that contains a decomposition inhibitor represented by general formula (1) (provided that a case in which the solution contains a gold complex of sulfite, the decomposition inhibitor is cytosine, and the pH is 6.

Abstract: A method of applying a metal coating to optical element, such as an optical waveguide, comprising the steps of partially depleting stabilizers in an electroless metallic solution and immersing an optical waveguide in the electroless metallic solution to deposit the metal coating to the optical waveguide. The step of partially depleting may include creating an electroless metallic solution having a sodium hypophoshite concentration of about 25 grams per liter. The electroless metallic solution may comprise a Fidelity solution 4865A, a Fidelity solution 4865B and de-ionized water in a ratio of 1:1:18; and sodium hypophosphite crystals. Alternatively, the step of partially depleting may include placing a dummy load into the electroless metallic solution. The dummy load may be a rectangular block of metal, formed of a low carbon steel, and may have a threaded cylindrical passage therein.

Abstract: An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system.

Abstract: A base of synthetic resins or other materials is partially plated. The base includes not only a single base but an assembly with a number of chip bases for producing electronic and electric parts such as printed circuit board, lead frame insert molded circuit parts, etc. A method for partially plating a base by the use of a plating catalyst includes a coating process to coat a surface to be plated or not to be plated by means of a coating material selected from a water soluble polymer or hydrolyzable polymer either before or after a catalyst applying process to soak a container containing the base in a plating catalyst bath.

Abstract: An electroless cobalt plating solution, comprising cobalt ions, at least one reducing agent, and an ammonia-free complexing/buffering agent (such as glycine, triethanolamine, and tris(hydrozymethyl)aminoethane). The electroless cobalt plating solution may be used in the fabrication of variety of structures including copper diffusion barriers and salicides contact in the manufacture of microelectronic dice.

Abstract: It is an object of the present invention to manufacture a conductive film with a small shape fluctuation at a high stability and a high reproducibility by using the ink jet system. It is another object of the present invention to provide an electron-emitting device having a preferable electron-emitting characteristic, an electron source in which a plurality of preferable electron-emitting devices having a high uniformity are arranged, and an image-forming apparatus having a high uniformity and a preferable display quality. It is still another object of the present invention to provide inexpensive electron-emitting device, electron source, and image-forming apparatus at a high yield.