Protective Coating (e.g., Encapsulating, Etc.) Patents (Class 427/96.2)
  • Patent number: 10550467
    Abstract: An apparatus includes: a rotatable table for revolving a substrate mounting region on which a substrate is mounted about a rotational center thereof; a first gas supply part for supplying a source gas to a first region through injection portions formed to face the rotatable table; an exhaust part for exhausting a gas through an exhaust port; a second gas supply part for supplying a separation gas for separating inner and outer sides of a second closed path from each other; a third gas supply part including two gas injectors arranged to extend at a certain interval in the crossing direction; a plasma generation part for reaction gas for plasmarizing the reaction gas injected toward the second region; and other process regions in which processes different from the supply of the source gas and the supply of the reaction gas are performed.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: February 4, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Hiroaki Ikegawa, Hiroyuki Wada, Katsuyuki Hishiya
  • Patent number: 9603261
    Abstract: A system and a method, the method includes determining or receiving a multiple iteration printing scheme indicative of multiple printing iterations of a coating material to be applied on an electrical circuit that comprises at least one three dimensional structure to be coated by the coating material; wherein the multiple iteration printing scheme is responsive to a shape and size of the at least one three dimensional structure; and performing multiple printing iterations of the coating material, according to the multiple iteration printing scheme; wherein at least one printing iteration is followed by at least partially curing the coating material printed during the at least one printing iteration.
    Type: Grant
    Filed: December 12, 2011
    Date of Patent: March 21, 2017
    Assignee: CAMTEK LTD.
    Inventors: Muhammad Iraqi, Noam Rozenstein, Eva Igner, Michael Litvin, Yaron Mazor
  • Patent number: 9365411
    Abstract: A MEMS device is provided in which, in order to suppress generation of a gas from an inner wall of a space in which a MEMS portion is disposed, the MEMS portion is disposed in a space constituted by at least a silicon nitride film and a silicon film, the silicon film has a first hole, the first hole is filled with a metal film or a metal silicide, and an airtight structure is formed by the metal film or the metal silicide, the silicon nitride film, and the silicon film.
    Type: Grant
    Filed: January 22, 2015
    Date of Patent: June 14, 2016
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Akihiko Ebina
  • Patent number: 9237655
    Abstract: An apparatus includes a circuit card assembly; and a nozzle for depositing material on the circuit card assembly, the nozzle and circuit card assembly capable of being angled relative to one another. In operation, the apparatus performs a process including positioning a circuit card assembly and a nozzle for the nozzle to deposit a material on the circuit card assembly; and angling the nozzle and the circuit card assembly relative to one another to facilitate the deposition.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: January 12, 2016
    Assignee: Lockheed Martin Corporation
    Inventor: Gary J Schreffler
  • Publication number: 20150136456
    Abstract: A process is disclosed for coating a substrate. The process includes providing a substrate having at least one free surface; depositing a first layer of a first material on the free surface of the substrate; depositing a second layer of a second material, different from the first material, on the first layer; depositing a third layer of a third material, different from the first and second materials, on the second layer; depositing a protective layer of a fourth material, different from the first, second and third materials, on the third layer; and performing a reflow of at least the second and third layers from the first, second, and third layers, by transfer of heat through the thermal contact on the protective layer, such that the protective layer prevents oxidation of at least the third layer.
    Type: Application
    Filed: January 20, 2015
    Publication date: May 21, 2015
    Applicant: TYCO ELECTRONICS FRANCE SAS
    Inventor: Alain Bednarek
  • Publication number: 20150129661
    Abstract: The present invention relates to a smart card comprising a card body and an electronic module placed within a recess of the card body and further comprising at least one coloured layer placed between the electronic module and the bottom of the recess of the card body.
    Type: Application
    Filed: March 21, 2013
    Publication date: May 14, 2015
    Applicant: GEMALTO SA
    Inventors: Sebastien Guijarro, Thierry Laviron, Lucile Dossetto
  • Patent number: 8999432
    Abstract: A cap metal forming method capable of obtaining a uniform film thickness on the entire surface of a substrate is provided. A method for forming a cap metal on a processing surface of a substrate provided with two or more regions having different water-repellent properties, includes: holding the substrate horizontally by a rotatable holding mechanism installed in an inner chamber; supplying a gas between the inner chamber and an outer chamber covering the inner chamber via a gas supply hole provided in a top surface of the outer chamber; forming a pressure gradient between the inner chamber and the outer chamber; and supplying a plating solution to a preset position on the processing surface of the substrate after a pressure of the gas inside the inner chamber reaches a preset value so as to form the cap metal on at least one of the regions.
    Type: Grant
    Filed: March 17, 2009
    Date of Patent: April 7, 2015
    Assignee: Tokyo Electron Limited
    Inventors: Takashi Tanaka, Yusuke Saito, Mitsuaki Iwashita
  • Patent number: 8962069
    Abstract: A process for making an encapsulation structure comprising the following steps: 1) make at least one portion of material capable of releasing at least one gas when said material is heated, the portion of material communicating with the inside of a hermetically closed cavity of the encapsulation structure, 2) heat all or part of said portion of material such that at least part of the gas is released from said portion of material in the cavity, and in which said portion of material capable of releasing at least one gas when said material is heated comprises elements trapped in said portion of material, said trapped elements being released from said portion of material in gaseous form when said material is heated.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: February 24, 2015
    Assignee: Commissariat à l'énergie atomique et aux énergies alternatives
    Inventors: Jean-Louis Pornin, Xavier Baillin, Charlotte Gillot, Laurent Vandroux
  • Publication number: 20150029678
    Abstract: A substrateless device comprises a plurality of first conductive elements and an encapsulant. The encapsulant encapsulates the plurality of first conductive elements, wherein the locations of the plurality of first conductive elements are fixed by the encapsulant; and a plurality of terminals of the plurality of first conductive elements are exposed outside the encapsulant, wherein the plurality of first conductive elements are not supported by a substrate.
    Type: Application
    Filed: July 25, 2013
    Publication date: January 29, 2015
    Applicant: CYNTEC CO., LTD.
    Inventors: BAU-RU LU, MING-CHIA WU
  • Publication number: 20140377453
    Abstract: The present invention relates to an insulating adhesive composition for metal printed circuit board, an adhesive-coated metal plate using the same, and a method for manufacturing the adhesive-coated metal plate. The adhesive composition according to the present invention forms an adhesive layer that is excellent in terms of adhesion to a copper foil, electrical insulating properties, and thermal resistance. The composition contains a specific epoxy resin, a curing agent and alumina. According to the present invention, in coating the metal plate with the solvent type adhesive, a roll coating method is used to perform a continuous coating process on the metal plate, thereby improving productivity when compared to the general method using a sheet type adhesive film.
    Type: Application
    Filed: December 21, 2012
    Publication date: December 25, 2014
    Inventors: Chan Sup Park, Rae-Hong Cho, Dong Hyon Kim, Kyung Ho Park, Sang-Kwon Han, Chong Soo Park, Bae Geun Lee, Jung Bong Kim, Jae Man Han, Tae Kyoo Shin, Dae Chul Bae
  • Publication number: 20140345923
    Abstract: A circuit board may include a substrate, an interconnected structure associated with the substrate, and a solder mask associated with the interconnected structure and the substrate. The solder mask may be based on a mixture that includes epoxy and a powder. The powder may be hollow glass micro-balloons.
    Type: Application
    Filed: December 9, 2011
    Publication date: November 27, 2014
    Inventor: Dennis J. Miller
  • Publication number: 20140340811
    Abstract: Optical stacks containing one or more patterned transparent conductor layers may be damaged by electrostatic discharges that occur during the optical stack manufacturing process. Such damage may result in non-conductive conductors within the patterned transparent conductor layer. An electrostatic discharge protected optical stack may include a substrate layer, a first anti-static layer having a sheet resistance of from about 106 ohms per square (?/sq) to about 109 ?/sq, and a patterned transparent conductor layer. Methods of testing and assessing damage to patterned transparent conductors are provided.
    Type: Application
    Filed: April 24, 2014
    Publication date: November 20, 2014
    Applicant: Cambrios Technologies Corporation
    Inventor: Florian Pschenitzka
  • Publication number: 20140314967
    Abstract: The present invention relates to a water-based pore sealing agent enhancing PCB coating anti-oxidation and anti-corrosion properties, consisting of, by weight, 4-12 parts of a corrosion inhibitor, 15-25 parts of a mixed surfactants system, 10-20 parts of an ion chelating agent, 6-15 parts of a pH regulator, 20-40 parts of a builder, and the rest being purified water. When used to perform pore sealing on a PCB, the water-based pore sealing agent is diluted with purified water first to be diluted 10-100 times, preferably, 100/8-100/3 times. The pH value is 7-11, and is preferably 7.5-9.5. The surface tension is 18-28 dyn/cm. The pore sealing treatment uses a immersion process, and preferably ultrasonic waves are added at the same time to assist in cleaning the pores. For the pore sealing treatment, the temperature is 20-60° C., and the time is 60-150 seconds. After pore sealing, the temperature for drying the coated piece is 80-150° C., and the time is 60-120 seconds.
    Type: Application
    Filed: November 14, 2011
    Publication date: October 23, 2014
    Applicant: TANTZ ENVIRONMENTAL TECHNOLOGIES LTD.
    Inventors: Xiaoming Wu, Yong Lu, Hong Liu, Yinfeng Wu, Qianyuan Liu
  • Publication number: 20140293562
    Abstract: An integrated circuit (IC) package with a fibrous interface is provided. The package includes a substrate, a bond coat and a top coat. The substrate is configured to contain IC components and connections. The bond coat layer is configured to encapsulate the IC components. The top coat layer has at least a portion embedded in the bond coat layer. Moreover, the top coat layer includes a fibrous interface configured to provide security and strengthen the bond coat layer.
    Type: Application
    Filed: April 14, 2014
    Publication date: October 2, 2014
    Applicant: Honeywell International Inc.
    Inventors: Kenneth H. Heffner, William J. Dalzell, Kara L. Warrensford
  • Publication number: 20140295353
    Abstract: A manufacturing method of a circuit structure is provided. A metal layer having an upper surface is provided. A surface passivation layer is formed on the metal layer. The surface passivation layer exposes a portion of the upper surface of the metal layer, and a material of the metal layer is different from a material of the surface passivation layer. A covering layer is formed on the surface passivation layer, and the covering layer covers the surface passivation layer.
    Type: Application
    Filed: June 16, 2014
    Publication date: October 2, 2014
    Applicant: Subtron Technology Co., Ltd.
    Inventor: Ching-Sheng Chen
  • Publication number: 20140272113
    Abstract: A rosin composition includes a gum rosin, an emulsifier, and a randomizing additive. The rosin composition may be applied to circuit cards for protection of the circuit card during storage. The rosin composition is solderable and is also easily removed for the soldering of components.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Applicant: RAYTHEON COMPANY
    Inventors: Luke M. Flaherty, Randal E. Knar, Tiffanie T. Randall
  • Publication number: 20140262461
    Abstract: The present invention provides a printed circuit board comprising a metal surface, such as a final finish, that has been coated with a self-assembled monolayer. The self-assembled monolayer forms a coating on the metal surface that is resistant to corrosion, thus preserving the solderability of the metal surface. The present invention also provides a solution of an alkanethiol and a non-organic solvent that can be used for forming a self-assembled monolayer on a metal substrate. The present invention also provides a process for depositing a self-assembled monolayer on a metal substrate by applying a solution of an alkanethiol and a non-organic solvent to a metal substrate, such as a surface of a printed circuit board.
    Type: Application
    Filed: March 7, 2014
    Publication date: September 18, 2014
    Applicant: OMG Electronic Chemicals, Inc.
    Inventors: Jim Trainor, Yubing Wang
  • Patent number: 8815332
    Abstract: An apparatus, comprising two conductive surfaces or layers and a nanostructure assembly bonded to the two conductive surfaces or layers to create electrical or thermal connections between the two conductive surfaces or layers, and a method of making same.
    Type: Grant
    Filed: August 9, 2012
    Date of Patent: August 26, 2014
    Assignee: Smoltek AB
    Inventors: Mohammad Shafiqul Kabir, Andrzej Brud
  • Patent number: 8815333
    Abstract: Disclosed is a manufacturing method of metal structure in multi-layer substrate. The manufacturing method includes following steps: coating at least one photoresist layer on a surface of a dielectric layer; exposing the photoresist dielectric layer to define a predetermined position of the metal structure; removing the photoresist layer at the predetermined position to undercut an edge of the photoresist layer adjacent to the predetermined position by a horizontal distance of at least 0.1 ?m between a top and a bottom of the edge; forming the metal structure at the predetermined position; and forming at least one top-cover metal layer to cover a top surface and two side surfaces of the metal structure. The present invention can form a cover metal layer covering the top surface and the two side surfaces by one single photomask.
    Type: Grant
    Filed: April 16, 2012
    Date of Patent: August 26, 2014
    Assignee: Princo Middle East FZE
    Inventor: Chih-kuang Yang
  • Publication number: 20140231127
    Abstract: A multi-finish printed circuit board may include one or more electrically conductive elements, such as through hole pads, that may have a first surface finish and one or more electrically conductive elements, such as surface mount pads, that may have a second surface finish that is different from the first surface finish. The first surface finish may be a hot air solder leveling (HASL) surface finish or a lead-free hot air solder leveling (LF HASL) surface finish and the second surface finish may be an organic surface protector (OSP) surface finish. The second surface finish may be applied to one or more electrically conductive elements from which the first surface finish was removed.
    Type: Application
    Filed: February 19, 2013
    Publication date: August 21, 2014
    Applicant: LUTRON ELECTRONICS CO., INC.
    Inventor: David Manero
  • Patent number: 8806741
    Abstract: An electronic device is disclosed. One embodiment provides a metallic body. A first electrically insulating layer is applied over the metallic body and having a thickness of less than 100 ?m. A first thermally conductive layer is applied over the first electrically insulating layer and having a thermal conductivity of more than 50 W/(m·K). A second electrically insulating layer is applied over the first thermally conductive layer and having a thickness of less than 100 ?m.
    Type: Grant
    Filed: October 6, 2011
    Date of Patent: August 19, 2014
    Assignee: Infineon Technologies AG
    Inventor: Ralf Otremba
  • Publication number: 20140224526
    Abstract: The present invention provides a multi-layer flexible circuit board, comprising at least an electric circuit disposed on a vertical interval layer, wherein at least two sides of the electric circuit are covered by neighboring interval layer and another vertical interval composed layer of electric insulating material. The disclosure provides a non-pressing way to stack the multi-layer flexible circuit board, preventing fault crevice derived from a prior-known pressing way.
    Type: Application
    Filed: March 28, 2013
    Publication date: August 14, 2014
    Applicant: ICHIA TECHNOLOGIES, INC.
    Inventors: CHIEN-HWA CHIU, CHIH-MIN CHAO, PEIR-RONG KUO, CHIA-HUA CHIANG, CHIH-CHENG HSIAO, FENG-PING KUAN, YING-WEI LEE, YUNG-CHANG JUANG
  • Patent number: 8802183
    Abstract: The system of the present invention includes a conductive element, an electronic component, and a partial power source in the form of dissimilar materials. Upon contact with a conducting fluid, a voltage potential is created and the power source is completed, which activates the system. The electronic component controls the conductance between the dissimilar materials to produce a unique current signature. The system can also measure the conditions of the environment surrounding the system.
    Type: Grant
    Filed: July 11, 2011
    Date of Patent: August 12, 2014
    Assignee: Proteus Digital Health, Inc.
    Inventors: Jeremy Frank, Peter Bjeletich, Hooman Hafezi, Robert Azevedo, Robert Duck, Iliya Pesic, Benedict Costello, Eric Snyder
  • Patent number: 8753711
    Abstract: The present techniques provide systems and methods for protecting electronic devices, such as organic light emitting devices (OLEDs) from adverse environmental effects. The edges of the devices may also be protected by a edge protection coating to reduce the adverse affects of a lateral ingress of adverse environmental conditions. In some embodiments, inorganic materials, or a combination of inorganic and organic materials, are deposited over the device to form a edge protection coating which extends approximately 3 millimeter or less beyond the edges of the device. In other embodiments, the device may be encapsulated with an organic region, and with an inorganic region, or the device may be encapsulated with inorganic materials, which may form the edge protection coating and may be combined with ultra high barrier technology. The coatings formed over the device may extend beyond the edges of the device to ensure lateral protection.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: June 17, 2014
    Assignee: General Electric Company
    Inventors: Ahmet Gun Erlat, George Theodore Dalakos, Brian Joseph Scherer
  • Publication number: 20140151094
    Abstract: A low dielectric constant, a low dielectric loss tangent, and heat resistance are achieved. An active ester resin that has a resin structure produced by reacting a polyfunctional phenolic compound (a1) with a monofunctional aromatic carboxylic acid or its chloride (a2) and an aromatic dicarboxylic acid or its chloride (a3). The polyfunctional phenolic compound (a1) is represented by structural formula (1) below: (where Ar represents a benzene ring, a naphthalene ring, a benzene ring nuclear-substituted by an alkyl group having 1 to 4 carbon atoms, or a naphthalene ring nuclear-substituted by an alkyl group having 1 to 4 carbon atoms, X represents a methylene group, a divalent cyclic aliphatic hydrocarbon group, a phenylene dimethylene group, or a biphenylene-dimethylene group, and n represents the number of repeating units and the average thereof is in a range of 0.5 to 10).
    Type: Application
    Filed: May 25, 2012
    Publication date: June 5, 2014
    Applicant: DIC Corporation
    Inventors: Kan Takeuchi, Etsuko Suzuki, Kunihiro Morinaga, Kazuo Arita
  • Patent number: 8728568
    Abstract: The presently disclosed subject matter is directed to method for forming an encapsulant and coating electronic components such as those utilized in AMR technology with the encapsulant. The encapsulant comprises a wax, a tackifier, a polymer, a plasticizer, a thixotropic agent, and an antioxidant and is designed to protect electronic components from harsh environments such as those where high levels of humidity or corrosive liquids may be present. For example, the encapsulant exhibits minimal percent weight gain due to moisture vapor when subjected to temperatures ranging from about ?40° C. to about 70° C. and relative humidities ranging from 0% to 85% over a period of 200 days.
    Type: Grant
    Filed: January 16, 2012
    Date of Patent: May 20, 2014
    Assignee: Itron, Inc.
    Inventors: Satish D. Bhakta, Tom Chastek
  • Patent number: 8720365
    Abstract: A method for fabricating a display is provided. The method includes providing a substrate having a pixel area, forming a plurality of patterned first electrodes on the pixel area, forming a plurality of partitions on both sides of the patterned first electrodes, respectively filling in spaces between the partitions with various colored material to cover the patterned first electrodes by a depositing process, and forming a cover on the partitions and the colored materials.
    Type: Grant
    Filed: September 24, 2008
    Date of Patent: May 13, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Chao-Kai Cheng, Wan-Wen Chiu, Yuh-Zheng Lee, Yuan-Chang Liao, Jyh-Wen Shiu, Jen-Chieh Yang
  • Publication number: 20140126165
    Abstract: An assembled component and a method for assembling a component are disclosed. In one embodiment the assembled component includes a component carrier, an attachment layer disposed on the component carrier and a component disposed on the attachment layer, the component having a nano-structured first main surface facing the component carrier.
    Type: Application
    Filed: November 6, 2012
    Publication date: May 8, 2014
    Applicant: Infineon Technologies Austria AG
    Inventors: Khalil Hosseini, Joachim Mahler, Georg Meyer-Berg
  • Publication number: 20140085857
    Abstract: An electronic module includes a circuit board, a plurality of electronic components, a plurality of molding layers, at least one first conductive layer, at least one insulating filler, and one second conductive layer. The circuit board has a first plane and at least one grounding pad on the first plane. The electronic components are mounted on the first plane and electrically connected with the circuit board. The molding layers cover the electronic components and the first plane. The trench appears between two adjacent molding layers. The grounding pad is positioned at the bottom of the trench. The first conductive layer covers the sidewall of the trench and the grounding pad. The grounding pad electrically connected with the first conductive layer. The insulating filler is positioned in the trench. The second conductive layer covers the molding layers and the insulating filler, and electrically connects with the first conductive layer.
    Type: Application
    Filed: January 23, 2013
    Publication date: March 27, 2014
    Applicants: UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD., UNIVERSAL SCIENTIFIC INDUSTRIAL ( SHANGHAI ) CO., LTD.
    Inventors: UNIVERSAL SCIENTIFIC INDUSTRIAL ( SHANGHAI ) CO., LTD., UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD.
  • Patent number: 8674017
    Abstract: An object of the invention is to provide carboxyl group-containing polyurethanes that have small curing warpage and can give cured products having excellent electrical insulating properties and flexibility, curable compositions that contain the carboxyl group-containing polyurethane and can give cured products having good electrical insulating properties, cured products obtained from the compositions, flexible circuit boards covered with the cured products, and processes for manufacturing flexible circuit boards. The carboxyl group-containing polyurethane is obtainable from materials including a (poly)carbonate polyol (a), a polyisocyanate (b) and a carboxyl group-containing polyol (c). The (poly) carbonate polyol includes an organic residue derived from a dimer diol and an organic residue derived from a polyol having a C10-20 alicyclic structure.
    Type: Grant
    Filed: January 20, 2010
    Date of Patent: March 18, 2014
    Assignee: Showa Denko K.K.
    Inventors: Kazuhiko Ooga, Ritsuko Azuma, Atsushi Umino
  • Publication number: 20140034360
    Abstract: A conductive member containing: a base material; a conductive layer provided on the base material, wherein the conductive layer includes a metallic nanowire having an average short axis length of 150 nm or less and a matrix; and a protective layer including a three-dimensional crosslinked structure represented by the following Formula (I), sequentially in this order, and which has a surface resistivity measured at a surface of the protective layer of 1,000 ?/? or less, a production method of the conductive member, and a touch panel and a solar cell, each of which uses the conductive member. The conductive member may provide high resistance against scratches and abrasion, excellent conductivity, excellent transparency, excellent heat resistance, excellent moisture and heat resistance, and excellent bendability. -M1-O-M1-??Formula (I): In the Formula (I), M1 represents an element selected from the group consisting of Si, Ti Zr and Al.
    Type: Application
    Filed: October 9, 2013
    Publication date: February 6, 2014
    Applicant: FUJIFILM Corporation
    Inventors: Satoshi TANAKA, Kenji NAOI, Shinichi NAKAHIRA, Kenichi YAMAMOTO
  • Publication number: 20130335906
    Abstract: Simulated anodized coating systems and methods are provided. The method can include preparing an exterior surface of a metallic electronic enclosure and applying a translucent powder coating to the prepared exterior surface of the metallic electronic enclosure. The method can also include curing the translucent powder coating to form a continuous, translucent, chromatic surface on the prepared exterior surface of the metallic electronic enclosure. The method can also include applying a transparent, matte, liquid coating over the cured translucent powder coating to provide a consistent matte, continuous, chromatic surface on the prepared exterior surface of the metallic electronic enclosure.
    Type: Application
    Filed: February 28, 2011
    Publication date: December 19, 2013
    Inventors: Michael Shamassian, peter M. On, William Adam Graiewski, Dustin L. Hoffman
  • Publication number: 20130334292
    Abstract: A printed circuit board to which a localised solder connection is to be made, the surface of said printed circuit board having a continuous or non-continuous coating of a composition comprising a halo-hydrocarbon polymer at a thickness of from 1 nm to 10 ?m.
    Type: Application
    Filed: July 22, 2013
    Publication date: December 19, 2013
    Inventors: Frank Ferdinandi, Rodney Edward Smith, Mark Robson Humphries
  • Publication number: 20130307954
    Abstract: An image sensor integrated circuit may contain image sensor pixels. A channel for receiving a fluid with samples may be formed on top of the image sensor. The image sensor pixels may form light sensors and imagers. The imagers may gather images of the samples as the fluid passes over the imagers or when the samples from the fluid adhere to the surface above an imager array. A protective coating may be formed on surfaces of the channel to protect the image sensor pixels and integrated circuit from potentially damaging materials in the fluid, samples, or materials provided for evaluating the samples. The protective coating may be a base-resistant material such as a silylating agent. A cover glass may be attached above the image sensor integrated circuit to form a portion of the channel. The protective coating may be formed on surfaces of the cover glass.
    Type: Application
    Filed: May 2, 2013
    Publication date: November 21, 2013
    Applicant: Aptina Imaging Corporation
    Inventor: Brian Vaartstra
  • Patent number: 8551559
    Abstract: The invention relates to a method for producing a plastic molded part (9) comprising an integrated conductor path (3), which plastic molded part is used in particular as an intermediate product to be further processed into an electrically heatable mirror (1). The method steps are: a) producing a substrate (7) from a carrier body (2) made of an electrically insulating plastic material having a conductor path (3) made of an electrically conductive material on or in a surface (8) of the carrier body (2), b) flooding the surface (8) of the substrate (7) equipped with the conductor path (3) or the surface (11) of the substrate (7) opposite said surface with a liquid, electrically insulating coating material. The flooding evens out depressions due to uneven shrinkage in the thick and thin areas of the carrier body and a smooth surface can be produced, which can subsequently be covered with a reflective layer.
    Type: Grant
    Filed: May 17, 2010
    Date of Patent: October 8, 2013
    Assignee: KraussMaffei Technologies GmbH
    Inventors: Martin Eichlseder, Helmut Piringer
  • Publication number: 20130201581
    Abstract: A suspension substrate includes a metal substrate, a first insulating layer provided on the metal substrate, a first wiring line layer provided on the first insulating layer, a second insulating layer provided on the first insulating layer and the first wiring line layer, and a second wiring line layer provided on the second insulating layer. When a total of a thickness of the first wiring line layer and a thickness of the second insulating layer on the first wiring line layer is T1 and a thickness of the second insulating layer at a position where a surface of the second insulating layer is flat and which is away from the first wiring line layer by a predetermined distance is T2, T1?T2<4.5 ?m is satisfied.
    Type: Application
    Filed: November 2, 2011
    Publication date: August 8, 2013
    Inventors: Jin Nishiyama, Yuji Narita, Hiroki Furushou
  • Publication number: 20130189489
    Abstract: The present invention provides a method of forming a relief pattern as part of a layered structure and comprising, forming a relief pattern on the surface of a layer of the said structure and subsequently forming a protective fixing layer on at least part of the said relief pattern and serving to protect the underlying relief pattern during any subsequent processing of the said structure, and thereby also provides for a layered structure, generally comprising a substrate having a relief pattern formed on a surface of the substrate and wherein at least a portion of the said relief has been provided with a protective fixing layer serving to retain the characteristics of the relief pattern during any subsequent processing of the structure such as, for example, when forming a laminate structure with the relief pattern provided therein.
    Type: Application
    Filed: February 8, 2010
    Publication date: July 25, 2013
    Applicant: Optaglio S.R.O.
    Inventors: Igor Jermolajev, Libor Kotacka, Tomas Tethal, Robert Dvorak
  • Patent number: 8491956
    Abstract: An encapsulation apparatus capable of securely sealing a gap of a display panel and improving intensity of the display panel, and a method of manufacturing an organic light emitting display device using the encapsulation apparatus are taught. The encapsulation apparatus includes an injection port having tapered projecting edges formed in both sides of one end the injection port, and injecting a reinforcing material into a gap of a display panel in a dual surface contact manner, the first substrate and the second substrate being attached to each other using a sealant; and a supporter coupled to the injection port and supporting the injection port.
    Type: Grant
    Filed: May 3, 2012
    Date of Patent: July 23, 2013
    Assignee: Samsung Display Co., Ltd.
    Inventor: Ki-Chul Kim
  • Publication number: 20130176260
    Abstract: An objective of the present invention is to provide a touch panel mother substrate that has a novel structure and facilities the cutting of a touch panel, and a touch panel that has been cut from the touch panel mother substrate. A plurality of touch panel units (50) that are to be touch panels (10) after being cut is formed on a touch panel mother substrate (48). The touch panel mother substrate (48) includes an organic resin film (46) that is deposited on the front side of the touch panel mother substrate (48), and a cutting groove (52) that opens at the surface of the organic resin film (46) and extends in a predetermined direction. The materials of a bottom surface (54) of the cutting groove (52) and a back surface (58) of the touch panel mother substrate (46) have the same main ingredient.
    Type: Application
    Filed: September 29, 2011
    Publication date: July 11, 2013
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Hijiri Nakahara, Yasuhiro Kohara
  • Publication number: 20130164487
    Abstract: An encapsulation is formed on a printed circuit board that is populated with electronic components, especially a printed circuit board having electronic components that have to meet certain safety standards because they are used, e.g. in the area of explosion control. The printed circuit board assembly is coated with a bottom layer, preferably a bottom layer produced from a plasma and pretreated such that the protective coat adheres on the entire surface of the printed circuit board assembly evenly and in a sufficient thickness and does not shrink during the subsequent curing process regardless of the material of the surface and/or regardless of the fact whether the coat is applied to a geometrically problematic area on the printed circuit board assembly such as a corner or an edge.
    Type: Application
    Filed: August 17, 2011
    Publication date: June 27, 2013
    Inventor: Florian Eder
  • Publication number: 20130140270
    Abstract: Embodiments in accordance with the present invention relate to packed-column nano-liquid chromatography (nano-LC) systems integrated on-chip, and methods for producing and using same. The microfabricated chip includes a column, flits/filters, an injector, and a detector, fabricated in a process compatible with those conventionally utilized to form integrated circuits. The column can be packed with supports for various different stationary phases to allow performance of different forms of nano-LC, including but not limited to reversed-phase, normal-phase, adsorption, size-exclusion, affinity, and ion chromatography. A cross-channel injector injects a nanolitre/picolitre-volume sample plug at the column inlet. An electrochemical/conductivity sensor integrated at the column outlet measures separation signals.
    Type: Application
    Filed: November 17, 2012
    Publication date: June 6, 2013
    Applicants: California Institute of Technology, City of Hope Medical Center
    Inventors: City of Hope Medical Center, California Institute of Technology
  • Publication number: 20130105213
    Abstract: A packaging substrate having an embedded through-via interposer is provided, including an encapsulant layer, a through-via interposer embedded in the encapsulant layer and having a plurality of conductive through-vias therein, a redistribution layer embedded in the encapsulant layer and formed on the through-via interposer so as to electrically connect with first end surfaces of the conductive through-vias, and a built-up structure formed on the encapsulant layer and the through-via interposer for electrically connecting second end surfaces of the conductive through-vias.
    Type: Application
    Filed: September 6, 2012
    Publication date: May 2, 2013
    Applicant: UNIMICRON TECHNOLOGY CORPORATION
    Inventors: Dyi-Chung Hu, Tzyy-Jang Tseng
  • Publication number: 20130025915
    Abstract: A resistive device includes a resistive layer, a flexible substrate arranged on the resistive layer, and an electrode layer. The electrode layer includes two electrode sections arranged below the resistive layer and separate to each other. Moreover, a method for manufacturing the resistive device with flexible substrate is also disclosed.
    Type: Application
    Filed: July 12, 2012
    Publication date: January 31, 2013
    Inventors: Yen-Ting LIN, Dar-Win LO, Sung-Chan YEN, Hsing-Kai CHENG
  • Publication number: 20130029031
    Abstract: A method for manufacturing an interposer includes forming a via hole in an insulation plate including a resin or a ceramic; simultaneously forming resists for a first upper redistribution layer on the top surface of the insulation plate, and a resistor for a lower redistribution layer on the bottom surface of the insulation plate; plating copper to fill the via hole and simultaneously forming the first upper redistribution layer and the lower redistribution layer along a designed circuit pattern; and forming a first upper protection layer and a lower protection layer to expose a portion of the first upper redistribution layer and a portion of the lower redistribution layer.
    Type: Application
    Filed: October 1, 2012
    Publication date: January 31, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: SAMSUNG ELECTRO-MECHANICS CO., LTD.
  • Patent number: 8361540
    Abstract: A randomized elliptical grid disposed on a sensor window for electro-magnetic and/or radio-frequency shielding of sensors, and a method of applying same. Grids may be made of electrically conductive or resistive material and may include elliptical or circular shapes. The shapes are in physical contact with each-other and preferably do not contain straight lines to reduce detection artifacts caused by the coating. Grid element shape, size, orientation, and grid pattern density may be randomized or varied across a sensor window.
    Type: Grant
    Filed: December 16, 2009
    Date of Patent: January 29, 2013
    Assignee: Lockheed Martin Corporation
    Inventors: Michael I. Jones, Leslie D. Hines
  • Publication number: 20120321780
    Abstract: A method of preventing oxidation of multilayer wirings in ultra large scale integrated circuits after alkaline polishing, the method including: a) mixing between 0.5 and 1 wt. % of a surfactant, between 0.05 and 0.5 wt. % of a chelating agent, between 1 and 10 wt. % of a corrosion inhibitor, and deionized water, and stirring to yield a water soluble antioxidant solution with pH value of between 6.8 and 7.5; and b) washing the multilayer wirings in the ultra large scale integrated circuits using the antioxidant solution after alkaline CMP under following conditions: between 1000 and 2000 Pa pressure; between 2000 and 5000 mL/min flow rate; and at least between 0.5 and 1 min washing time.
    Type: Application
    Filed: August 23, 2012
    Publication date: December 20, 2012
    Inventors: Yuling LIU, Xiaoyan LIU, Jun TIAN
  • Patent number: 8329248
    Abstract: An electrical component includes a conductive substrate, a tin layer formed on the substrate, and a barrier coating formed on the tin layer to impede tin whisker growth. The barrier coating includes a polymer matrix, and abrasive particles that are dispersed about the matrix.
    Type: Grant
    Filed: September 11, 2009
    Date of Patent: December 11, 2012
    Assignee: Honeywell International Inc.
    Inventors: Merrill M. Jackson, David Humphrey
  • Publication number: 20120305306
    Abstract: An ink adapted for forming conductive elements is disclosed. The ink includes a plurality of nanoparticles and a carrier. The nanoparticles comprise copper and have a diameter of less than 20 nanometers. Each nanoparticle has at least a partial coating of a surfactant configured to separate adjacent nanoparticles. Methods of creating circuit elements from copper-containing nanoparticles by spraying, tracing, stamping, burnishing, or heating are disclosed.
    Type: Application
    Filed: June 1, 2011
    Publication date: December 6, 2012
    Applicant: LOCKHEED MARTIN CORPORATION
    Inventor: Alfred A. Zinn
  • Publication number: 20120279759
    Abstract: A transparent conductive structure applied to a touch panel includes a substrate unit, a first coating unit, a transparent conductive unit, and a second coating unit. The substrate unit includes a transparent substrate. The first coating unit includes a first coating layer formed on the top surface of the transparent substrate. The transparent conductive unit includes a transparent conductive layer formed on the top surface of the first coating layer. The transparent conductive layer includes a plurality of conductive circuits arranged to form a predetermined circuit pattern. The second coating unit includes a second coating layer formed on the top surface of the transparent conductive layer. The second coating layer has a touching surface formed on the top side thereof for an external object to touch. The second coating layer is substantially formed by mixing silicon oxide, aluminum oxide, lithium oxide and Teflon.
    Type: Application
    Filed: May 3, 2011
    Publication date: November 8, 2012
    Applicant: INNOVATION & INFINITY GLOBAL CORP.
    Inventor: CHAO-CHIEH CHU
  • Publication number: 20120279758
    Abstract: A transparent conductive structure applied to a touch panel includes a substrate unit, a first coating unit, a transparent conductive unit, and a second coating unit. The substrate unit includes a transparent substrate. The first coating unit includes a first coating layer formed on the top surface of the transparent substrate. The transparent conductive unit includes a transparent conductive layer formed on the top surface of the first coating layer. The transparent conductive layer includes a plurality of embedded conductive circuits embedded therein and arranged to form a predetermined embedded circuit pattern. The second coating unit includes a second coating layer formed on the top surface of the transparent conductive layer to cover the embedded conductive circuits. The second coating layer has a touching surface formed on the top side thereof, and the touching surface allows an external object (such as user's finger or touch pen) to touch.
    Type: Application
    Filed: May 3, 2011
    Publication date: November 8, 2012
    Applicant: INNOVATION & INFINITY GLOBAL CORP.
    Inventor: CHAO-CHIEH CHU