Abstract: The present invention provides a laminate having a two-layer or three-layer structure including a non-thermoplastic polyimide film and a thermoplastic polyimide layer provided on one or both of the surfaces thereof, the surface of the thermoplastic polyimide layer being surface-treated; a laminate including a polymer film and a layer provided on one or both of the surfaces thereof, the layer including a polyimide resin composition comprising a polyimide resin with a specified structure and a thermosetting component; and a resin film and a laminate including the same which provided one, at least, of surface having a Ra1 value of arithmetic mean roughness of 0.05 ?m to 1 ?m measured with a cutoff value of 0.002 mm, and a Ra1/Ra2 ratio of 0.4 to 1, Ra2 being a value measured with a cutoff value of 0.1 mm. These laminates can provide a printed circuit board with excellent adhesiveness, on which a micro-wiring circuit can be formed.

Abstract: A method for coating a metallic substrate includes applying a powder coating composition to a majority of a surface of the metallic substrate, and applying an autodepositable coating composition to less than the majority of the surface of the metallic substrate. According to a preferred embodiment, the powder coating composition is applied to at least one continuous surface of the metallic substrate, while the autodepositable coating composition is applied to at least one discontinuous surface, such as an edge, of the metallic substrate.

Abstract: A laminate for a printed wiring board (PWB) in which the laminate has a resin system containing a binder. The binder is made of ultra-fine binding particles that reinforce the resin system thereby reducing adhesive and cohesive failure of the laminate. The particles in addition to reducing occurrences such as pad cratering, eyebrowing, and tail-cracking, have the benefits of increasing thermal heat transfer and reducing resin shrinkage. The particles are preferably the same material as a reinforcing material contained in the laminate which can be a woven glass.

Abstract: A circuit board and method of manufacturing a circuit board. The circuit board includes a substrate, a conductor layer formed on the substrate, and an insulation layer formed on the substrate and the conductor layer, the insulating layer having an opening with an undercut therein, the opening reaching the conductor layer. A metal layer is formed in the opening of the insulation layer and connected to the conductor layer, a solder layer formed in the opening of the insulation layer and outside of the opening; and an alloy layer formed in a boundary region between the metal layer and the solder layer in the opening. The alloy layer includes a metal of the metal layer and a composition of the solder layer, the alloy layer being more fragile than the metal layer and being formed in a position misaligned from an edge of the undercut of the opening formed on the insulation layer.

Abstract: A mask stick including a main body part having a pattern formed therein, one or more side clamping parts extending from a side of the main body part, and a slant clamping part disposed adjacent an outermost one of the one or more side clamping parts, wherein an angle (?) between the slant clamping part and the outermost side clamping parts is greater than 0° and less than 90° (0°<?<90°).

Abstract: Certain examples disclosed herein are directed to devices that include a substrate and conductor disposed on the substrate. In some examples, each of the conductor and the substrate may include materials that are mutually insoluble in each other. In other examples, the conductor may further comprise a substantially pure metal. In certain examples, the disposed conductor may be configured to pass adhesion tape test ASTM D3359-02. Methods of forming the conductors are also provided.

Abstract: An aluminum or aluminum alloy article is described. The aluminum or aluminum alloy article includes an aluminum or aluminum alloy substrate, a barrier layer formed on the substrate, a color layer formed on the barrier layer, and an insulation layer formed on the color layer. The barrier layer and the color layer are formed by vacuum sputtering. The barrier layer is a layer of silver-aluminum-oxygen-nitrogen. The insulation layer is an external layer of the aluminum or aluminum alloy article.

Abstract: An aluminum or aluminum alloy article is described. The aluminum or aluminum alloy article includes an aluminum or aluminum alloy substrate, a barrier layer formed on the substrate, a color layer formed on the barrier layer, and an insulation layer formed on the color layer. The barrier layer and the color layer are formed by vacuum sputtering. The barrier layer is a layer of chromium-oxygen-nitrogen, aluminum-oxygen-nitrogen, or titanium-oxygen-nitrogen. The insulation layer is an external layer of the aluminum or aluminum alloy article.

Abstract: Articles enabled by an injection molding process that molds parts on a carrier web located between mold halves and uses ultrasonic energy to assist flow of polymer melt into the mold cavity. One such article is a carrier web having a high density of molded parts, i.e., bearing an array of molded articles adhered to the web in rows and columns, the articles being spaced closer (center-to-center or edge-to-edge) than the diagonal spacing between articles in the next adjacent row and next adjacent column. Another such article is a microneedle array on a land no more than 250 ?m thick on which at least 60% of the microneedles across the array are filled (i.e., completely formed).

Abstract: A reliable flexible board prevents disconnection from occurring in a conductor layer in a stacking process or during use of a product that repeatedly causes deformation. The flexible board includes resin layers and conductor layers that are alternately stacked on top of one another, wherein each of the conductor layers includes a first conductor layer made of a first metal and a second conductor layer made of a second metal disposed between one of the resin layers and the first conductor layer, the second metal having a higher ductility than the first metal.

Abstract: Disclosed are laminated articles comprising a first polymer layer and a second polymer layer having an inclusion embedded between the layers, wherein at least one layer comprises a branching agent to improve dimensional stability during the lamination process. Disclosed are laminated articles comprising a first polymer layer and a second polymer layer having an inclusion embedded between the layers, wherein at least one layer comprises a copolyester comprising a branching agent to improve dimensional stability during the lamination process. Also disclosed are methods of laminating a first layer and a second layer with an inclusion between the layers to form a laminated article with an embedded inclusion, wherein at least one layer comprises a copolyester comprising a branching agent.

Abstract: The invention relates to the preparation of multilayer microcomponents which comprise one or more films, each consisting of a material M selected from metals, metal alloys, glasses, ceramics and glass-ceramics. The method consists in depositing on a substrate one or more films of an ink P, and one or more films of an ink M, each film being deposited in a predefined pattern selected according to the structure of the microcomponent, each film of ink P and each film of ink M being at least partially consolidated before deposition of the next film; effecting a total consolidation of the films of ink M partially consolidated after their deposition, to convert them to films of material M; totally or partially removing the material of each of the films of ink P. An ink P consists of a thermoset resin containing a mineral filler or a mixture comprising a mineral filler and an organic binder. An ink M consists of a mineral material precursor of the material M and an organic binder.

Abstract: An article, such as a hardfaced wearpart, includes a substrate, a sheet metal shell connected to the substrate to define a cavity between the surface of the substrate and the shell, and a composite material filling the cavity and forming a coating on at least a portion of the surface of the substrate, the composite material including a hard particulate material infiltrated with a metallic brazing material. The shell may be connected to the substrate by welding or brazing to the substrate, and may wear away during use. The shell and the substrate may be used as part of an assembly for producing the article, where the shell is used as a mold for forming the composite material by filling the shell with the hard particulate material and subsequently infiltrating with the brazing material.

Abstract: According to this process for manufacturing a ceramic element intended to be fitted onto a watch case, the visible surface of which has features, a soluble layer (2) is selectively deposited on said visible surface, the thickness of said soluble layer being at least equal to the height of said features, a first tie layer (3) of the Ti, Ta, Cr or Th type is vacuum-deposited by magnetron sputtering with a thickness of at least 100 nm by physical vapor deposition (PVD) on said surface thus selectively coated, followed, without venting atmosphere, by PVD deposition of said second layer (4) made of Au, Pt, Ag, Ni, Pd, TiN, CrN, ZrN or alloys thereof with a thickness of at least 100 nm, and then said soluble layer (2) is dissolved.

Abstract: The invention relates to an enamelled part (3, 11, 21) for a dial comprising a ceramic substrate (31) coated with a first enamel layer (4?, 12, 24, 33) to improve the appearance of said part. According to the invention, the part includes at least one other enamel layer (6?, 8?, 9, 14, 16, 25, 35, 37, 39, 41, 43, 45) partially covering the first enamel layer (4?, 12, 24, 33) so as to form a decoration with a similar improved appearance. The invention concerns the field of timepieces, jewellery and gems.

Abstract: A graphene pattern is fabricated by forming a pattern of passivation material on a growth substrate. The pattern of passivation material defines an inverse pattern of exposed surface on the growth substrate. A carbon-containing gas is supplied to the inverse pattern of the exposed surface of the growth substrate, and patterned graphene is formed from the carbon. The passivation material does not facilitate graphene growth, and the inverse pattern of exposed surface of the growth substrate facilitates graphene growth on the exposed surface of the growth substrate.

Abstract: A glass material for producing insulation layers is provided. The glass material can improve the radio-frequency properties of radio-frequency substrates or radio-frequency conductor arrangements. In one embodiment, the glass material for producing insulation layers for radio-frequency substrates or radio-frequency conductor arrangements is an applied layer with a layer thickness in the range between 0.05 ?m and 5?mm and has a loss factor tan ? of less than or equal to 70*10?4 in at least a frequency range above 1 GHz.

Abstract: A film member and a film molded product are disclosed that include a film layer, a decorative layer having a predetermined image, a metal wiring layer having a metal wiring, and a shape retaining layer.

Abstract: Metal plated organic polymer compositions are useful as vehicular engine oil pans. Such oil pans may have lighter weight, and/or superior corrosion resistance, than conventional metal oil pans.

Abstract: A process is described for treating metal surfaces printed wiring boards and similar substrates to provide improved creep corrosion resistance on such surfaces. A modified organic solderability preservative composition is used in combination with an emulsion polymer to provide a modified polymer coating on the metal surface finish via a chemical reaction to provide enhanced corrosion protection of the surface.

Abstract: Molded metallized polymeric components are formed by methods of multi-shot injection molding of a first resin and a second resin, where the first resin forms a first polymer that is metal-platable and the second resin forms a second polymer that is colored and resistant to metallization. Select regions corresponding to the metal-platable polymer surface are metallized. Further, one or more interface regions between the first metal-platable polymer and the second colored polymer can be concealed from a visible direction. Molded decorative polymeric components formed from such methods are also provided.

Abstract: A composite element is provided. The composite element includes a ceramic component defining a cavity having a first end and a second end, and a metallic component comprising a head and a body. At least a portion of the body of the metallic component is disposed in the cavity, and the head of the component is disposed on the first end of the cavity. A cross-sectional area of a portion of the body is greater than an area of the first end. In addition, the ceramic and metallic components are interlocked. Methods of making a composite element and of making a clearance sensor part are also provided.

Abstract: The invention comprises methods for the photolithographic patterning of features in a photo-curable polymer composition coated onto a plastic substrate. In one embodiment of this invention, the plastic substrate is coated with a reflective film such as a metallic barrier. In another embodiment, the plastic substrate is coated or co-extruded with a polymer barrier layer containing an additive that absorbs the photo-curing radiation. In yet another embodiment the plastic substrate contains an intrinsic additive that absorbs the photo-curing radiation. Combinations of these embodiments are also within the scope of this invention. The methods of the present invention may be advantageously applied to the fabrication of optical waveguides comprising a photo-curable polymer supported on a plastic substrate, but are applicable to the fabrication of any device or object comprising a photo-curable polymer supported on a plastic substrate.

Abstract: A durable printed composite material can include a printable layer having an image reverse printed thereon. The printable layer can be a transparent or translucent material. A metallic layer can be adhered to the image side of the printable layer using an adhesive layer. The layers are formed such that at least a portion of the metallic layer is visible through the printable layer. A method of forming a durable printed composite material can include reverse printing an image on a printable layer to form a printed surface. A metallic layer can then be adhered to the printed surface of the printable layer. Heat and pressure can be applied to the metallic layer to produce a durable printed composite material. The metallic layer can be at least partially visible through the printable layer. The durable printed composite material provides a medium which has an image having a reflective metallic background useful in a variety of applications.

Abstract: According to one embodiment of the invention, a circuit board comprises a conductive layer including a land portion and a line portion connected to the land portion, and; a conductor connected to a surface of the land portion. A planar shape of the connected portion between the conductor and the land portion has a elongated shape along a width direction of the line portion. A part of the connected portion is located within an imaginary region formed by imaginarily extending the line portion toward the land portion.

Abstract: An LTCC substrate structure with at least one contact element for connecting a wire conductor, which has a first metallization (20) arranged on and/or in the ceramic substrate for electrical connection to the wire conductor, wherein the first metallization (20) preferably contains silver or a silver alloy. To avoid via posting or a plating process, a diffusion barrier layer covering the first metallization or metal layer, which diffusion barrier layer (22) covering the first metallization (20), which diffusion barrier layer is produced with a locally acting application method, and a second metal layer (24) arranged on the diffusion barrier layer (22) are provided, wherein the second metal layer (24) preferably contains gold and/or platinum and/or an alloy that has at least one of these elements. The invention also discloses a production method for an LTCC substrate structure of this type.

Abstract: Method of joining a ceramic matrix composite article to a metallic component by providing the ceramic matrix composite article with a metallic region which bonds to the metallic component.

Abstract: An integrated circuit mounted board includes a printed wiring board and an integrated circuit bare chip mounted on the printed wiring board. The printed wiring board includes a metal base, an insulating member made of an insulating material and disposed on the metal base, and a wiring pattern disposed on the insulating member. The wiring pattern includes an electrode part to which the integrated circuit bare chip is electrically coupled. The insulating member includes an under region being opposite to the electrode part. The metal base includes a metal substrate and a metal portion protruding from the metal substrate. The metal portion is buried in the under region of the insulating member.

Abstract: Provided is a moisture detection device including: a moisture detection label that has at least a pair of detection terminals and a pattern, the detection terminals being provided on a base material with an insulated front surface, the pattern being provided on the surface of the base material and formed between the detection terminals with water-dispersible and conductive paint; and detection circuit which detects an electrical connection state between the detection terminals.

Abstract: In a curable resin composition containing an inorganic filler, the average particle diameter of the inorganic filler is 1 ?m or less and the content of the inorganic filler is 50 wt % or less. The curable resin composition can be preferably used for a halogen-free resin substrate and the like having a small load on an environment as a hole-plugging curable resin composition as well as used to provide a hole-plugging build-up printed wiring board having a via-on-via structure (in particular, a stacked via structure) having an excellent crack-resistant property, an excellent insulation/connection reliability, and the like.

Abstract: This invention relates to an article (1) including a substrate (2) including two opposite faces (21, 22), and a sol-gel coating (3) covering at least one of the faces (21, 22) of said substrate (2), in which said sol-gel coating (3) is in the form of a continuous film of a material including a matrix formed by at least one metal polyalkoxylate and at least 5% by weight with respect to the total weight of the coating (3) of at least one metal oxide dispersed in said matrix. According to the invention, the sol-gel coating (3) is coated with a functional design (4) including at least one optically non-transparent chemical substance. This invention also relates to a process for producing an article.

Abstract: A decorative member (1A) includes: a resin layer (2) having a front surface (2b) and a back surface (2a); and a reflective layer (3) formed on the back surface (2a) of the resin layer (2). The back surface (2a) of the resin layer (2) includes a receding surface (21) formed therein. The receding surface recedes gradually toward the front surface (2b) to change a thickness of the resin layer (2). A pigmented layer (4) configured so that lightness/depth of color thereof changes in accordance with the change in the thickness of the resin layer (2) is provided between the back surface (2a) of the resin layer (2) and the reflective layer (3).

Abstract: The present invention provides a resin composition which can produce a multilayer printed wiring board not causing peeling and crack in a thermal shock test such as a cooling/heating cycle, and having high heat resistance and low-thermal expansion characteristics, when the resin composition is used for an insulating layer of the multilayer printed wiring board; and also an insulating sheet provided on a base, a prepreg, a multilayer printed wiring board and a semiconductor device using thereof. The resin composition is used for forming an insulating layer of the multilayer printed wiring board, wherein a surface roughness parameter Rvk value of the insulating layer is from 0.1 ?m to 0.8 ?m, measured after the insulating layer being formed with the resin composition, and subject to roughening treatment.

Abstract: A method of fabricating a film. The method comprises directing onto a substrate a pulsed supersonic beam of a molecular precursor characterized by kinetic energy of at least 1 eV per molecule, such that non-volatile species of molecules of the precursor are deposited on the substrate.

Abstract: The subject of the invention is a process for obtaining a substrate coated on at least part of its surface with at least one film of oxide of a metal M the physical thickness of which is 30 nm or less, said oxide film not being part of a multilayer comprising at least one silver film, said process comprising the following steps: at least one intermediate film of a material chosen from the metal M, a nitride of the metal M, a carbide of the metal M and an oxygen-substoichiometric oxide of the metal M is deposited by sputtering, said intermediate film not being deposited above or beneath a titanium-oxide-based film, the physical thickness of said intermediate film being 30 nm or less; and at least part of the surface of said intermediate film is oxidized using a heat treatment, during which said intermediate film is in direct contact with an oxidizing atmosphere, especially air, the temperature of said substrate during said heat treatment not exceeding 150° C.

Abstract: A pressure sensor is provided, wherein a ballast resistive layer is integrated in the pressure sensor so that the resistive output curve for the pressure sensor has saturation characteristics. The pressure sensor shall be prevented from breaking down by a large current that may be caused, when an overload pressure is applied on the pressure sensor, if no ballast resistive layer is added.

Abstract: Disclosed herein are a printed circuit board having metal bumps which have uniform diameter and are formed at fine pitch, and a method of manufacturing the printed circuit board.

Abstract: A method of changing a functionality of an optical article is provided. The method includes exposing the optical article to an external stimulus. The optical article includes an electrically responsive layer being configured to transform from a first optical state to a second optical state upon exposure to the external stimulus. The electrically responsive layer is configured to transform from a first optical state to a second optical state upon exposure to an external stimulus, and is capable of irreversibly transforming the optical article from the pre-activated state of functionality to the activated state of functionality.

Abstract: A circuit substrate laminate, comprising a conductive metal layer; and a dielectric composite material having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006, wherein the dielectric composite material comprises: a polymer resin; and about 10 to about 70 volume percent of cenospheres having a ferric oxide content of less than or equal to 3 weight percent.

Abstract: A coated article includes a substrate; a color layer deposited on the substrate; and a pattern layer deposited on the surface of the color layer opposite to the substrate. A network of metal nuclei groups forms the pattern layer. The network of metal nuclei groups includes a plurality of metal nuclei, and each metal nucleus is bonded to at least one other metal nucleus.

Abstract: A multilayer wiring board includes a core insulating layer with a first conductive wiring, a first insulating layer with a softening temperature lower than the core insulating layer, and a second insulating layer formed on the core insulating layer through the first insulating layer, the second insulating layer with a second conductive wiring electrically connected to the first conductive wiring and a softening temperature higher than the first insulating layer. The first insulating layer is mainly formed of a liquid crystal polymer. The core insulating layer and the second insulating layer are mainly formed of a polyimide resin or a bismaleimide triazine resin. The first conductive wiring and the second conductive wiring are electrically connected through a conductive via formed penetrating through the first insulating layer and the second insulating layer in a thickness direction.

Abstract: An article for insulation comprises a flexible substrate (200) and a thermal sprayed working layer (206) on the flexible substrate (200). The working layer (206) comprises an array of insulating elements. The insulating elements are separated by gaps so that the article is flexible.

Abstract: Stiff, lightweight composite materials that include a Class A surface finish as well as methods of making these composites and articles that include these composites. The fiber reinforced HPPC composite sheet material includes a glass laminate layer and a metal layer. The metal layer covers the unidirectional glass fibers in the HPPC composite while the glass laminate layer gives the composite mechanical puncture resistance, while providing a composite sheet material with Class A surface properties that is still lightweight.

Abstract: The present invention provides electrodes comprised of metal-coated vertically aligned carbon nanofibers. Arrays of vertically aligned carbon nanofibers provide highly accessible, high density templates having large electrochemically active surface areas that may be modified to further increase the surface area of the nanofibers. The methods of the present invention involve functionalizing the surface of the nanofibers and coating the functionalized surface with metal using electroless deposition. The resulting metal-coated nanofibers form highly stable and highly reproducible electrodes having very high surface areas. The electrodes of the present invention are expected to be useful in a variety of applications, including high-density energy storage, i.e., supercapacitors and fuel cells.

Abstract: In a multilayer ceramic substrate manufactured by a non-shrinking process, a bonding strength of an external conductive film formed on a primary surface of the multilayer ceramic substrate is increased. After a laminate of a multilayer ceramic substrate is formed from first ceramic layers and second shrinkage suppressing ceramic layers, and an underlayer is formed along one primary surface of the multilayer ceramic substrate, an external conductive film is formed on the underlayer. A non-sintering ceramic material powder in a non-sintered state is included in both the external conductive film and the underlayer, and this non-sintering ceramic material powder is fixed due to diffusion of a glass component from the first ceramic layers.

Abstract: Disclosed herein is a polymer substrate for a flexible display, comprising a reticular superelastic alloy structure and/or an annular superelastic alloy structure therein. The polymer substrate has an improved flexibility because the superelastic alloy structure is embedded therein.

Abstract: The present invention provides a plated article that has a thin seed layer having a uniform thickness, formed by electroless plating and allowing formation of ultrafine wiring, and that avoids the complicated formation of a bilayer of a barrier layer and a catalytic metal layer prior to forming the seed layer. The present invention also provides a method for manufacturing the plated article. The plated article has an alloy thin film formed on a substrate and containing a catalytically active metal (A) for electroless plating and a metal (B) capable of undergoing displacement plating with a metal ion contained in an electroless plating solution, and a metal thin film formed on the alloy thin film by electroless displacement and reduction plating. The alloy thin film of the catalytically active metal (A) and the metal (B) capable of displacement plating has a composition comprising 5at% to 40at% of the metal (A).

Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.

Abstract: Provided, are multi-layer chip carriers comprising an asymmetric cross-linked polymeric dielectric film, and processes for making the chip carriers.

Abstract: A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.