Abstract: A decorative film having a mirror effect is provided for use in decorative panels of various home appliances. The decorative film may include a printing layer, a first base material layer that is a polyethylene terephthalate (PET) film, a deposition layer formed by depositing a metal material or an oxide material, and a second base material layer that is a scattering prevention film. The printing layer, the first base material layer, the deposition layer and the second base material layer may be sequentially laminated. The deposition layer formed on a lower surface of the first base material layer and the second base material layer may be adhered by an adhesive. The decorative film may be attached to a rear side of a glass panel by a gluing agent so as to obtain a mirror effect.

Abstract: A printed wiring board includes an insulating resinous substrate having an aperture unit, a first terminal unit and a second terminal unit consisting of a conductor and formed on top of the resinous substrate, and a fuse unit that electrically couples the first terminal unit and the second terminal unit to each other. At least a part of the fuse unit is disposed over the aperture unit, and in addition, is covered by a porous inorganic covering material having insulating properties.

Abstract: A laminated glazing panel includes two glass plies and a plastic ply having one or more light emitting diodes mounted on a circuit board laminated between the glass plies, forming an LED device. The circuit board is ordinarily a flexible circuit board that includes a substrate and a conductive layer. A plurality of light emitting diodes may be mounted on the flexible circuit board and laminated between the glass plies The resultant glazing panel may further include indicia on at least one ply. Processes for the production of a laminated glazing panel involve positioning an LED device in a cut-out in a plastic ply and interleaving the plastic ply between two glass plies, prior to laminating the plies. One or more plastic plies may be used, and the LED device may be coated in a plastic material.

Abstract: A method for metallizing a surface of a ceramic substrate includes molding and sintering a ceramic composition to obtain the ceramic substrate, in which the ceramic composition comprises a ceramic powder and a functional powder dispersed in the ceramic powder, radiating a predetermined region of the surface of the ceramic substrate, and performing chemical plating on the ceramic substrate.

Abstract: The present invention relates to a multilayer security element having a first, transparent layer structure having first, translucent sub-regions and a second, opaque layer structure exhibiting a color-shift effect and having second, transparent sub-regions.

Abstract: A sealing glass composition includes from about 10 molar percent to about 30 molar percent barium oxide, from about 15 molar percent to about 30 molar percent aluminum oxide, from about 40 molar percent to about 60 molar percent boron oxide and from about 1 molar percent to about 20 molar percent yttrium oxide. Methods for preparing the sealing glass and a sodium battery cell are also provided.

Abstract: Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 ?m, (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter (D50) of 2 to 15 ?m and inorganic particles that have an average particle diameter (D50) of 2 to 15 ?m and that contain crystal water having a release initiation temperature of 400° C. or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D50) of 1.

Abstract: A transparent conductive electrode comprising metal nanowires and method of making is described, wherein the transparent conductive electrode has a pencil hardness more than 1H, nanoporous surface having pore sizes less than 25 nm and surface roughness less than 50 nm. The transparent conductive electrode further comprises an index matching layer, having a refractive index between 1.1-1.5 and a thickness between 100-200 nm.

Abstract: Provided is a ceramic chip assembly configured to economically and reliably insulate an exposed portion of a metal lead wire from an environmental change. The ceramic chip assembly includes a ceramic base having electrical characteristics, a pair of external electrodes that are disposed on a pair of surfaces of the ceramic base, respectively, the surfaces of the ceramic base being opposed to each other, a pair of metal lead wires as single cores having first ends that are electrically and mechanically connected to the external electrodes, respectively, by an electrical conductive adhesive member, an insulation sealant sealing the ceramic base, the external electrodes, and the first ends of the metal lead wires to expose second ends of the metal lead wires, and an insulation polymer coating layer continuously formed on both the insulation sealant and portions of the metal lead wires exposed out of the insulation sealant.

Abstract: Metamaterial devices with environmentally responsive materials are disclosed. In some embodiments, a metamaterial perfect absorber includes a first patterned metallic layer, a second metallic layer electrically isolated from the first patterned metallic layer by a gap, and an environmentally responsive dielectric material positioned in the gap between the first patterned metallic layer and the metallic second layer.

Abstract: A halogen-free resin composition includes 100 parts by weight of epoxy resin; 10 to 100 parts by weight of benzoxazine resin; 10 to 100 parts by weight of styrene-maleic anhydride copolymer; and 10 to 90 parts by weight of dicyclopentadiene phenol novolac resin. The halogen-free resin composition features specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dielectric dissipation factor, high heat resistance and high non-flammability and produce prepregs or resin film, and is thus applicable to copper clad laminates and printed circuit boards.

Abstract: Carbon nanotube compositions suitable for printing, methods of making carbon nanotube compositions, and substrates having a print thereon containing carbon nanotube compositions, and uses thereof. The carbon nanotubes of the compositions are individualized. The carbon nanotube compositions can be used in applications, such as document security.

Abstract: Synthetic paper, including: between 10 and 90 wt. % of structural fibers, and between 90 and 10 wt. % of bonding fibers. The structural fibers are poly(p-phenylene telephthalamide) (PPTA) fibers having a fineness of between 1 and 2 d, and a length of between 3 and 10 mm. The bonding fibers are fibrids or a pulp of the PPTA. The structural fibers and the bonding fibers are shaped by a wet-forming papermaking method, and hot rolled to form the synthetic paper.

Abstract: A gutter guard mesh for application to the gutter/roof interface of a roof includes a length of woven mesh or the like having an array of apertures dimensioned to maximize traversal by rain water and minimize traversal of accumulated debris from the roof wherein at least a first edge of the mesh is fitted on a first side with a double sided acrylic foam closed cell tape having acrylic adhesive on both sides and on a second opposing side with a double sided butyl tape wherein the free side of the foam tape is available for adherence to the gutter via the acrylic adhesive and the free side of the butyl tape is available for adherence of a protective laminate.

Abstract: Disclosed is a carrier for manufacturing a printed circuit board, which includes a first carrier including a first binder having a first opening and a first metal layer formed in the first opening of the first binder, and a second carrier, stacked with the first carrier and including a second binder having a second opening and a second metal layer which is formed in the second opening of the second binder and which partially overlaps with the first metal layer, so that the carrier is simply configured and the binders are formed not only on the lateral surfaces of the metal layers but also on the upper surfaces thereof, thus improving the reliability of bonding of the carrier at the periphery. A method of manufacturing the carrier and a method of manufacturing a printed circuit board using the carrier are also provided.

Abstract: Provided are a substrate structure and method of forming the same. The method of forming the substrate structure may include etching a substrate to form an etched portion having a vertical surface, forming a diffusion material layer on the whole substrate or in part of the substrate; annealing the diffusion material layer to form a seed layer diffused downward toward the surface of the etched portion, and forming a metal layer on the seed layer. Accordingly, surface characteristics of the etched portion of the substrate may be enhanced by the seed layer, and therefore, a metal layer with improved adhesion and a uniform thickness may be formed on the vertical surface of the etched portion.

Abstract: The invention relates to articles, e.g., sheet metal, comprising surface coatings that have the appearance of polished stone and methods for making such articles.

Abstract: Embodiments of the current invention describe a method of plating platinum selectively on a copper film using a self-initiated electroless process. In particular, platinum films are plated onto very thin copper films having a thickness of less than 300 angstroms. The electroless plating solution and the resulting structure are also described. This process has applications in the semiconductor processing of logic devices, memory devices, and photovoltaic devices.

Abstract: This publication discloses an electronics module and a method for manufacturing it. The electronic module includes at least one first embedded component (6), the contact terminals (7) of which face essentially towards the first surface of the insulating-material layer (1) and which is connected electrically by its contact terminals (7) to the conductor structures contained in the electronic module. According to the invention, a second embedded component (6?), the contact terminals (7?) of which face essentially towards the second surface of the insulating-material layer and which is connected electrically by its contact terminals (7?) to the conductor structures contained in the electronic module, is attached by means of glue or two-sided tape to the first component (6), and the contact terminals (7, 7?) are connected to the conductor structures with the aid of a conductive material, which is arranged in the insulating-material layer in holes (17) at the locations of the contact terminals (7, 7?).

Abstract: Disclosed are articles comprising layered nanocrystalline calcite and methods for forming nanocrystalline calcite layers and compositions comprising nanocrystalline calcite layers.

Abstract: A system, method, and computer program product are provided for controlling warping of a substrate. In use, a first solder mask is attached to a top side of a substrate. Additionally, a second solder mask is attached to a bottom side of the substrate, wherein the first solder mask and the second solder mask control warping of the substrate.

Abstract: There is provided a printed circuit board. The printed circuit board may be configured to include: a core layer in which a bending prevention portion of at least two layers is interposed between a plurality of insulating members and includes metal layers having different thermal expansion coefficients is disposed; a circuit pattern that is formed so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and an insulating layer that is formed on the core layer and includes an opening portion that exposes the circuit pattern, and a method of manufacturing the printed circuit board. According to the above-described printed circuit board and the method of manufacturing the printed circuit board, by disposing a bending prevention portion inside the printed circuit board, a printed circuit board capable of improving the progress rate and the productivity and a method of manufacturing the printed circuit board can be provided.

Abstract: An article has a metallic substrate. The substrate has a first surface region and a plurality of blind recesses along the first surface region. The substrate has perimeter lips at the openings of the plurality of recesses and extending partially over the respective associated recesses. A ceramic coating is along the first surface region.

Abstract: In accordance with the teachings of one embodiment of the present disclosure, a method of forming high-density metal interconnects on flexible, thin-film plastic includes laminating a dry photoresist layer to a substrate. The photoresist-laminated substrate is baked. An assembly is formed by laminating a plastic film to the baked, photoresist-laminated substrate. One or more electrically conductive interconnect layers are processed on a first surface of the laminated plastic film. The processing of the one or more electrically conductive interconnects includes photolithography. The assembly is baked and soaked in a liquid. The processed plastic film is then separated from the substrate.

Abstract: A process for producing metallic structures includes an initiator composition comprising photocatalytic nanorods being applied to a substrate. A precursor composition is applied to the layer, and is reduced to form a metal by the photocatalytic activity of the nanorods. High-resolution metallic structures can be obtained by structured exposure.

Abstract: An anti-mold film assembly has an absorptive sheet, a metallic coating and two first films. The absorptive sheet absorbs vaporizable ingredients and has a first side and a second side opposite to the first side of the absorptive sheet. The metallic coating is connected with the first side of the absorptive sheet and has a surface opposite to the absorptive sheet. The first films are ventilative and are respectively connected with the second side of the absorptive sheet and the surface of the metallic coating. Because the metallic coating is capable of drawing sulfhydryl groups of enzyme proteins contained in bacteria and killing the bacteria, the antibiotic effect of the anti-mold film assembly is greatly enhanced.

Abstract: Methods of forming a metal nanoparticle-graphene composite are provided. The methods include providing a functionalized hydrogen exfoliated wrinkled graphene (f-HEG) substrate and dispersing metal nanoparticles on a first major surface of the f-HEG substrate to form the metal nanoparticle-graphene composite.

Abstract: One aspect of the present invention includes a method of fabricating an electronic device. According to one embodiment, the method comprises providing a substrate having dielectric oxide surface areas adjacent to electrically conductive surface areas, chemically bonding an anchor compound with the dielectric oxide surface areas so as to form an anchor layer, initiating the growth of a metal using the electrically conductive surface areas and growing the metal so that the anchor layer also bonds with the metal. The anchor compound has at least one functional group capable of forming a chemical bond with the oxide surface and has at least one functional group capable of forming a chemical bond with the metal. Another aspect of the present invention is an electronic device. A third aspect of the present invention is a solution comprising the anchor compound.

Abstract: A multi-layer packaging film comprising a bio-based layer and method for making the same. An outer layer comprising a bio-based film is adhered to a product side layer comprising a bio-based film having barrier properties. A non-compostable sealant layer is pattern applied to a portion of the product side layer. Because a portion of the bio-based product side layer is exposed, upon opening of the package the product side layer is susceptible to moisture. This allows for subsequent biodegradation or compostability of the films. In another embodiment the sealant layer comprises a water permeable material. Upon opening of the package moisture can subsequently contact the product side layer and initiate biodegradation.

Abstract: An anisotropic conductive joint package in which an anisotropic conductive film is joined to at least one conductive material selected from among the group consisting of gold (Au), silver (Ag), copper (Cu), aluminum (Al), magnesium (Mg), nickel (Ni), a tin oxide doped with indium (ITO), molybdenum (Mo), iron (Fe), palladium (Pd), beryllium (Be), and rhenium (Re).

Abstract: The present invention provides a wiring board giving good heat dissipation over a long period of use. The present invention also provides a method for producing a wiring board, including coating a surface of a metal substrate, which is made of an aluminum plate, with a composition containing a substance having a polysiloxane structure and inorganic particles having insulating and heat-dissipating properties, curing the composition, then bonding a copper foil to the cured composition, and partially removing the copper foil, thereby forming a wiring layer.

Abstract: A workpiece, such as a turbine engine component, comprises a substrate, a thermal barrier coating on the substrate, and a hard erosion barrier deposited over the thermal barrier coating. The erosion barrier preferably has a Vickers hardness in the range of from 1300 to 2750 kg/mm2. The erosion barrier may be formed from aluminum oxide, silicon carbide, silicon nitride, or molybdenum disilicide. The erosion barrier may be formed using either an electrophoretic deposition process or a slurry process.

Abstract: The present invention provides an alkyl sulfonated tetrazole compound, a method of preparing the same, an epoxy resin containing the same and a substrate produced therefrom. The epoxy resin is usefully used as a raw material of printed circuit boards, and has high adhesion to metal.

Abstract: A corrosion resistant seaming tape includes a metal layer capable of blocking selected frequencies of electromagnetic radiation arranged on a polymeric substrate and covered with adhesive that protects the metal layer and prevents it from corroding. Also disclosed is a method of sealing a seam between adjacent edges of two adjacent pieces of window film including an internal metal layer by applying a polymeric film to the seam.

Abstract: A printed wiring board is formed by adhering a coverlay film having a resistance layer formed on a surface of the coverlay film body to a printed wiring board body having a conductive layer formed on a surface of a substrate through an adhesive layer. The resistance layer is separated from and opposed to the conductive layer through the adhesive layer.

Abstract: The present invention relates to laminate comprising a first thermoplastic polymer layer with a first melt flow index, adjacent a thermoplastic polymer second layer with a second melt flow index, the first and second layer comprising the same thermoplastic polymer, characterized in that the first melt flow index is lower than the second melt flow index. The invention also relates to a microfluidic device comprising the laminate and a method for incorporating an ink pattern in the laminate.

Abstract: A method for modifying a surface by generating nanotubes at one or more selected sites on the surface, the surface including a first metal. The method includes the steps of positioning at least one cathode and at least one anode relative to the surface in an electrolyte solution including a fluoride salt of a second metal, and applying a voltage between the at least one anode and the at least one cathode sufficient to generate nanotubes at one or more selected sites on the surface and to inhibit nanotube formation at one or more of the other selected sites, wherein the nanotubes include the first metal and the second metal.

Abstract: An object structure having patterns of refractive veins thereon is provided, in which a heat insulated base plate capable of combining with object major body is provided, then a first base layer, a soft material layer, an aluminum film layer, and a second base layer being respectively build-up in this order thereon. Further, embossing process is conducted on the second base layer and then a pattern layer is printed thereon. In turn, a protection layer is overlaid on the pattern layer for protecting the colors thereof. Configuring like this, the heat insulated base plate having pattern design thereon can be combined integrally with the object major body by injection molding process, and pattern integrity can be ensured during injection molding by means of the heat-blocking effect obtained from the heat insulated base plate.

Abstract: A method for producing a matrix containing nanostructures. The method includes obtaining a layer having a thickness of 10 nm-100 ?m, wherein the layer contains organic macromolecules arranged in a nanopattern, staining the layer with a solution containing a salt so that a portion of the salt is retained in the layer, and removing the organic mcaromolecules from the layer to form a matrix containing nanostructures. Also within the scope of this invention are nanostructures prepared by this method.

Abstract: A die having a base formed of a first material is connected to a board having a base formed of a second material. An interposer having a coefficient of thermal expansion intermediate coefficients of thermal expansion of the first and second materials is positioned between the die and the board.

Abstract: A complex sheet structure includes a base plate, a microstructure layer, and a shielding layer. The microstructure layer is formed on the base plate and has a first side and an opposite second side. The microstructure layer has a plurality of prismatic structures, and the base plate touches the first side of the microstructure layer. The shielding layer covers the second side of the microstructure layer and contains a low light-transmittance material.

Abstract: A device housing and a manufacturing method for fabricating the device housing are provided. The device housing includes a transparent substrate, a first decorative coating formed on the transparent substrate, a second decorative coating formed on the first decorative coating and the transparent substrate, and a third decorative coating formed on the first decorative coating and the second decorative coating. The first decorative coating has a grid pattern appearance. The second decorative coating is light reflective. The third decorative coating has a color that contrasts against the first decorative coating.

Abstract: An artificial microstructure comprises two “I” shaped metal wire structures. The two “I” shaped metal wire structures are separated to each other. The present invention also discloses an artificial electromagnetic material using the artificial microstructures. The artificial electromagnetic material has high resonance frequency, wide effective frequency band and has a wide application range.

Abstract: A workpiece, such as a turbine engine component, comprises a substrate, a thermal barrier coating on the substrate, and a hard erosion barrier deposited over the thermal barrier coating. The erosion barrier preferably has a Vickers hardness in the range of from 1300 to 2750 kg/mm2. The erosion barrier may be formed from aluminum oxide, silicon carbide, silicon nitride, or molybdenum disilicide. The erosion barrier may be formed using either an electrophoretic deposition process or a slurry process.

Abstract: A thermally conductive composition is made to contain a cured thermosetting resin containing a crystalline epoxy resin component, and an inorganic filler. The content by percentage of the inorganic filler in the thermally conductive composition is 66% or more and 90% or less by volume. This thermally conductive composition has a main portion made mainly of the inorganic filler, and a surface layer portion made mainly of the crystalline epoxy component and formed on the main portion to be continuous to the main portion.

Abstract: The use of aqueous polyurethane dispersions is described for composite foil lamination, where at least 10% by weight of the polyurethane derives from at least one amorphous polyester polyol.

Abstract: A multifunctional composite having high strength, low weight, low distortion, low CTE, impact resistance, and multi-faceted radiation protection.

Abstract: The invention is a method and apparatus for laser marking a stainless steel specimen with commercially desirable marks. The method includes providing a laser processing system having a laser, and laser optics and a controller with pre-determined laser pulse parameters, selecting the pre-determined laser pulse parameters associated with the desired mark, and directing the laser marking system to produce laser pulses having laser pulse parameters associated with the desired marks including temporal pulse widths greater than about 1 and less than about 1000 picoseconds.

Abstract: The invention provides a process for making a multilayer structure with a printed pattern by providing a film substrate having a crystalline organic compound layer, wherein the substrate optionally has a metal or metaloxide layer between the film substrate and the organic compound layer; applying a printed pattern via a plurality of printing rolls wherein the following steps are performed: optionally, applying as a first layer a primer over the whole surface, applying one or more ink layers on the film to obtain a printed pattern, and optionally, applying a cover varnish layer to obtain a film substrate with a crystalline organic compound layer and a printed pattern. The invention further relates to a laminate comprising a multilayer structure and a plastic film; the laminate preferably comprises a primer substantially covering the whole surface of the organic compound layer, on which primer the print is present.

Abstract: The present invention provides novel methods of fabricating microelectronics structures, and the resulting structures formed thereby, using EUV lithographic processes. The method involves utilizing an assist layer immediately below the photoresist layer. The assist layer can either be directly applied to the substrate, or it can be applied to any intermediate layer(s) that may be applied to the substrate. The preferred assist layers are formed from spin-coatable, polymeric compositions. The inventive method allows reduced critical dimensions to be achieved with improved dose-to-size ratios, while improving adhesion and reducing or eliminating pattern collapse issues.