Abstract: A device having an optical system including first and second substrates, a first optical element on a first surface of the first substrate, and a second optical element on a second surface of the second substrate, the first and second surfaces being parallel and the first and second optical elements being substantially centered along an optical axis of the optical system, and an active element positioned in optical communication with the optical system, wherein an imaging function of the optical system is distributed over at least the first and second optical elements.

Abstract: A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part formed by punching process, containing a metal base material of, for example, a copper-type metal material and a substantially one layer of an insulating film provided on at least a part of the metal base material, in which a metal layer formed of Ni or a Ni—Zn alloy is interposed between said metal base material and said insulating film, such that the peel width of said insulating film at the end of the material obtained after said punching process, is less than 10 ?m.

Abstract: A coated article includes a substrate and a pattern layer formed on the substrate. The pattern layer includes a plurality of strips. Each area of these strips is in a range of about 0.001 mm2 to about 0.025 mm2 A distance between two adjacent strips is in a range of about 0.02 mm to about 0.04 mm.

Abstract: The present invention relates to a paint finish that incorporates decorative effects such as a laser effect, a splash effect, or a cloud effect, and to a paint process to obtain a paint finish that incorporates decorative effects.

Abstract: The invention concerns a decorative casing fabricated by bonding a film having a polarizing characteristic to the surface of the casing body via an adhesive layer, and an object of the invention is to provide the casing with enhanced decorativeness by designing the adhesive layer so as to render various color effects in addition to the effect rendered by the polarizing characteristic. The polarizing film is bonded to the surface of the casing body via the adhesive layer containing a special-effect material having a color effect. According to the present invention, by directly bonding the polarizing film to the casing via the adhesive layer that produces a desired color effect, other effects such as color hue can be conferred in the film bonding step, and thus a casing having an excellent decorative effect can be manufactured by a simple process without increasing the number of process steps.

Abstract: The present disclosure relates to reinforced wood products and reinforcement components for use with wood products. In some embodiments, reinforced wood products according to the disclosure include a wood component and a reinforcement component. The reinforcement component may include one or more metal plates and one or more fixation mechanisms. The metal plates may be attached to at least one reinforced surface of the wood component so that the reinforcement component extends over less than about 35% of the length of the wood component. In some embodiments, reinforcement components according to the disclosure may also include one or more buckling resistance notches.

Abstract: In one embodiment, a substrate includes a core material formed from a filler including aluminum trihydrate and a secondary filler material. The secondary filler material has a secondary decomposition reaction that occurs at a temperature higher than a reflow temperature reached during processing of the substrate, or the secondary filler traps water released at reflow temperature by aluminum trihydrate. Other embodiments are described and claimed.

Abstract: A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of high dielectric constant is disposed on the layer of resistance material. Thru-holes are formed by laser.

Abstract: A production method of workpiece is provided. First, an adhesive layer is applied on a workpiece, wherein a material of the adhesive layer includes thermosetting resin and radiationcurable resin. The adhesive layer is impressed by a mold, so that the adhesive layer forms a three-dimensional pattern. A first curing process is performed on the adhesive layer by one of radiation-curing and thermal-curing. The workpiece is punched after the first curing process is performed on the adhesive layer, so that the workpiece forms a three-dimensional workpiece. A second curing process is performed on the adhesive layer by another one of radiation-curing and thermal-curing after the workpiece is punched. In addition, a workpiece with three-dimensional pattern is also provided.

Abstract: Ink composition for continuous deflected jet printing, that is liquid at ambient temperature, comprising a solvent containing less than 0.5% by weight of water and less than 0.5% by weight of alcohols relative to the total weight of the ink composition; one or more dye(s) and/or pigment(s) that is (are) insoluble in water, and in mixtures of water and of at least one alcohol; and a binder, comprising at least 50% by weight, relative to the total weight of the binder, of at least one binder resin capable of being obtained by reaction between at least one alkoxysilane and at least one hydroxyaromatic resin.

Abstract: Magnetic blocks have images disposed thereon. Specifically, a block made from a rigid material includes an image over at least a portion of a first surface and a magnet on at least a portion of a second surface of the block. The block is disposed within a frame or board having a metallic and/or magnetic surface thereon and/or is provided on a metallic and/or magnetized surface. A plurality of blocks having images thereon are disposed together in a tiled arrangement, either in the frame, board or otherwise on the metallic and/or magnetic surface. Moreover, a system comprises the magnetic blocks having images thereon and a frame, board and/or metallic and/or magnetic surface. Methods of making and using the same are further provided.

Abstract: A method of forming an interconnect joint includes providing a first metal layer (210, 310), providing a film (220, 320) including metal particles (221, 321) and organic molecules (222, 322), placing the film over the first metal layer, placing a second metal layer (230, 330) over the film, and sintering the metal particles such that the organic molecules degrade and the first metal layer and the second metal layer are joined together.

Abstract: The invention is directed to polyimide based adhesives having a coefficient of thermal expansion (“CTE”) equal to or below 50 ppm/° C. The adhesives of the present invention contain a polyimide base polymer present in the overall adhesive in an amount from 25 to 95 weight percent. The polyimide base polymer has a glass transition temperature (“Tg”) in a range of from about 150 to about 300° C. and typically has a coefficient of thermal expansion above 50 ppm/° C. The polyimide based adhesives of the invention also contain an aramid micro fiber filler in an amount from 5 to 75 weight percent, based upon the total weight of the polyimide based adhesive. The fiber filler can be used to lower CTE of the overall adhesive to match (or nearly match) the CTE of other materials like metal, silicon wafers, other polymers (including polyimide) and the like.

Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.

Abstract: A circuit board has a low thermal expansion coefficient that suits the thermal expansion coefficient of an element to be mounted thereupon and can prevent the occurrence of delamination and cracking of a core layer when the circuit board is used in a low temperature environment. The circuit board is constructed by laminating a core layer and at least one wiring layer, where the at least one wiring layer has slightly smaller external dimensions in a planar direction than the core layer.

Abstract: Provided herein are, among other things, epoxy resin varnishes and methods of making and using the same. In some embodiments, the epoxy resin varnishes comprise at least a filler such as silica. In certain embodiments, the epoxy resin varnishes provided herein are used for making laminates such as copper clad laminates. In further embodiments, the copper clad laminates provided herein are used for making printed circuit boards (PCBs).

Abstract: A method for manufacturing a power module substrate, includes: preparing a ceramics substrate and a metal plate made of pure aluminum; a fusion step in which the ceramics substrate and the metal plate are stacked in layers with a brazing filler metal interposed therebetween, and a fused aluminum layer is formed at an interface between the ceramics substrate and the metal plate by fusing the brazing filler metal which is caused by heating; and a solidifying step in which the fused aluminum layer is solidified by cooling, and a crystal is grown so as to be arranged in a crystal orientation of the metal plate when the fused aluminum layer is solidified.

Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.

Abstract: A method for manufacturing a wiring substrate includes forming a conductor circuit on an insulating layer, the conductor circuit including a pad, a circuit pattern connected to the pad, and a lead pattern connected to the pad. A solder resist layer is formed on the circuit pattern and on the insulating layer, and a plating resist layer is formed on the lead pattern and on the insulating layer and forming a metal film on a first portion of the conductor circuit not covered by the solder resist layer and not covered by the plating resist layer. The plating resist layer is removed to expose a second portion of the conductor circuit adjacent to the first portion of the conductor circuit and not covered with the metal film, and an etching resist layer is formed on the metal film and on the second portion of the conductor circuit. A third portion of the conductor circuit not covered by the etching resist layer is removed by etching, and the etching resist is removed.

Abstract: A composite material for an electric/electronic part, having a metal base, a resin film on at least a part of the metal base, and a layer of Sn or a Sn alloy on at least a part of the metal base at a site where the resin film is not provided, the layer of Sn or a Sn alloy including a solidified structure, and the resin film having a residual solvent quantity adjusted to 5% to 25% by mass.

Abstract: A hybrid structure of multi-layer substrates comprises a first multi-layer substrate and a second multi-layer substrate. The first multi-layer substrate stacks up first metal layers, first dielectric layers alternately and has VIAs. A border district of a first metal layer connects with a border district of the corresponding first dielectric layer. The border districts are separated from adjacent first metal layers and adjacent first dielectric layers. The second multi-layer substrate stacks up second metal layers and second dielectric layers alternately. A border district of a second metal layer connects with a border district of the corresponding second dielectric layer. The border districts are separated from adjacent second metal layers and adjacent second dielectric layers. The VIAs are located at the border districts of the first dielectric layers and each VIA has electric conductor therein to connect one first metal layer with one second metal layer.

Abstract: This invention relates to an article (1) including a substrate (2) including two opposite faces (21, 22), and a sol-gel coating (3) covering at least one of the faces (21, 22) of said substrate (2), in which said sol-gel coating (3) is in the form of a continuous film of a material including a matrix formed by at least one metal polyalkoxylate and at least 5% by weight with respect to the total weight of the coating (3) of at least one metal oxide dispersed in said matrix. According to the invention, the sol-gel coating (3) is coated with a functional design (4) including at least one optically non-transparent chemical substance. This invention also relates to a process for producing an article.

Abstract: A vehicle structure can include a coating that provides a three-dimensional tactile pattern to the vehicle structure. In addition, a method for forming a vehicle structure can include applying a film that provides a three-dimensional tactile pattern to the vehicle structure. The vehicle structure can be a trim piece of a vehicle to which the film provides decorative and tactile features. A thin metal layer can be applied on top of a substrate by a metallizing technique, such as physical vapor deposition, followed by applying a radiation curable formulation and exposing it to radiation source, such as UV light. The radiation curable formulation can be a UV ink that is spaced at separate and distinct locations on the film and extends from the metallic layer to such an extent that it is discernable by human touch.

Abstract: A multilayer printed circuit board includes a first printed circuit board, a second printed circuit board, an adhesive film, and a function layer. The adhesive film is sandwiched between the first printed circuit board and the second printed circuit board. The function layer is disposed between the first printed circuit board and the second printed circuit board for blocking water from passing therethrough and for screening electromagnetic interference between the first printed circuit board and the second printed circuit board.

Abstract: Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.

Abstract: A glass ceramic composition which is formed by firing into a sintered body having a relatively high relative dielectric constant and Q value is provided. It includes a CaZrO3-based ceramic and a Li2O—MgO—ZnO—B2O3—SiO2-based glass. The Li2O—MgO—ZnO—B2O3—SiO2-based glass is 1 to 12 percent by weight of the total composition, the content of Li2O is 3.5 to 15 percent by weight, the content of MgO is 20 to 50 percent by weight, the content of BaO is 0 to 25 percent by weight, the content of CaO is 0 to 10 percent by weight, the content of SrO is 0 to 25 percent by weight, the content of B2O3 is 16 to 29 percent by weight, the content of SiO2 is 11 to 35 percent by weight, the content of ZnO is 5 to 20 percent by weight, and the content of Al2O3 is 0 to 15 percent by weight. This glass ceramic composition is advantageously used for green glass ceramic layers to form a green laminate structure useful as a main component body of an LC filter or the like.

Abstract: A current collector forming an electrode for battery. The electrode current collector is made of copper or a copper alloy, and has a front surface color and a back surface color, at least one color of which is a color belonging to a color space represented by: 50?L*?80, 5?a*<60, 5?b*<60, where L*, a*, and b* are numeric values determined based on the L*a*b* calorimetric system described in JIS Z 8729.

Abstract: It is an object of the present invention to provide a component for plating suitably used in, for example, producing a printed circuit board, a solution, and a printed circuit board including the component, the component for plating having satisfactory adhesion to an electroless plating film provided on a surface of the component even when the surface roughness of the surface of the component is small. The object is achieved by a component for electroless plating including at least a surface a for electroless plating, the surface a having a surface roughness of 0.5 ?m or less in terms of arithmetic average roughness measured with a cutoff value of 0.002 mm, and the surface a containing a polyimide resin having a siloxane structure.

Abstract: A decoration film including a substrate, a releasing layer, at least an alignment mark and a pattern layer is provided. A substrate has a surface. The releasing layer is disposed on the surface of the substrate. The alignment mark is disposed on the surface of the substrate or a side of the releasing layer far from the substrate. The pattern layer is disposed on the releasing layer at a side far from the substrate in the correspondence with the alignment mark.

Abstract: An aluminum-plastic composite structure includes an aluminum portion and a plastic portion. The aluminum portion defines a plurality of micro grooves by ultraviolet lithography. The plastic portion is integrally formed on the aluminum portion and substantially filling in the micro grooves. A width of each micro groove is in a range from 0.02 millimeters to 0.05 millimeters. A depth of each micro groove is in a range from 0.2 millimeters to 0.25 millimeters.

Abstract: The present invention provides a wiring material for forming wiring on a substrate by causing coalescence of conductive particles through heating, and including a binder layer and a wiring layer. The binder layer contains metal particles and having a binder function to be adhered to the substrate; and the wiring layer contains metal particles and laminated on the binder layer. The metal particles of the binder layer and the metal particles of the wiring layer are in contact with each other. With this arrangement, it is possible to provide a wiring material allowing use of a larger variety of materials, while also ensuring low resistance of wiring and improvement of adhesion between the wiring and the substrate.

Abstract: Two-component solventless adhesive compositions for lamination applications and laminated structures, including flexible laminated packaging, comprising at least two substrates, including structures comprising reverse printed ink films and/or metalized films. The adhesive comprises a prepolymer having one or more oligomers with a relatively high molecular weight.

Abstract: A process for producing a substrate, which comprises processing an aluminum/graphite composite into plates having a thickness of 0.5-3 mm using a multi-wire saw under the following conditions (1) to (4): (1) the wires have abrasive grains bonded thereto which are one or more substances selected from diamond, C—BN, silicon carbide, and alumina and have an average particle diameter of 10-100 ?m; (2) the wires have a diameter of 0.1-0.3 mm; (3) the wires are run at a rate of 100-700 m/min; and (4) the composite is cut at a rate of 0.1-2 mm/min. The aluminum/graphite composite has a surface roughness (Ra) of 0.1-3 ?m, a thermal conductivity at 25° C. of 150-300 W/mK, a ratio of the maximum to the minimum value of thermal conductivity in three perpendicular directions of 1-1.3, a coefficient of thermal expansion at 25-150° C. of 4×106 to 7.5×10?6/K, a ratio of the maximum to the minimum value of coefficient of thermal expansion in three perpendicular directions of 1-1.

Abstract: The invention relates to a cover adapted to be removably attachable to a portable electronic apparatus. The cover has an outer face which is exposed when the cover is attached to the apparatus. Said outer face has entirely or partly a distinctive appearance composed of leather and/or textile as a surface of said outer face.

Abstract: The present invention provides a conductive connecting material for electrically connecting terminals of electronic members, which has a layered structure comprising: a curable resin composition containing a resin component and a compound having a flux function; and a metal foil selected from a solder foil and a tin foil. Further, the present invention provides a method for connecting terminals comprising: a placement step in which the conductive connecting material is placed between opposed terminals; a heating step in which the conductive connecting material is heated at a temperature, which is equal to or higher than the melting point of the metal foil, and at which the resin composition is not completely cured or the resin composition is softened; and a curing step/solidifying step in which the resin composition is cured or solidified.

Abstract: A recycling program provides a monetary incentive to encourage recycling of target waste materials, such as paper, glass and plastic products. A precious metal, such as gold, silver, platinum or palladium, is incorporated into the target waste material during manufacturing to provide an incentive for recycling the target material. A visual marking is placed on the target material to distinguish from other waste items that do not contain a precious metal. A deposit is collected from consumers when purchasing the target material, and the deposit is paid back when the target material is delivered to a recycling collection point. Recycling of the target material is encouraged by efforts to reclaim the precious metal.

Abstract: A method (300) of texturing silicon surfaces (116) such to reduce reflectivity of a silicon wafer (110) for use in solar cells. The method (300) includes filling (330, 340) a vessel (122) with a volume of an etching solution (124) so as to cover the silicon surface 116) of a wafer or substrate (112). The etching solution (124) is made up of a catalytic nanomaterial (140) and an oxidant-etchant solution (146). The catalytic nanomaterial (140) may include gold or silver nanoparticles or noble metal nanoparticles, each of which may be a colloidal solution. The oxidant-etchant solution (146) includes an etching agent (142), such as hydrofluoric acid, and an oxidizing agent (144), such as hydrogen peroxide. Etching (350) is performed for a period of time including agitating or stirring the etching solution (124). The etch time may be selected such that the etched silicon surface (116) has a reflectivity of less than about 15 percent such as 1 to 10 percent in a 350 to 1000 nanometer wavelength range.

Abstract: A fabrication method for metallized a ceramics substrate including the steps of: forming a first conductive paste layer containing metallic powder on a sintered ceramics substrate; forming a second conductive paste layer containing metallic powder of which average particle diameter is different from that of metallic powder constituting the first conductive paste layer; and forming a first conductive layer and a second conductive paste layer. The surface roughness of the first conductive layer and the second conductive layer is different. By this method, it is possible to secure airtightness of the metallized ceramics substrate even if it is a multilayered substrate having a plurality of metallized layers.

Abstract: A method is provided for removing a substrate from a component with a laser. The method includes the steps of: applying a laser to a component at different locations with different power or different laser speed levels so as to remove a portion of a substrate from the component and thereby yield a number of markings on the component; measuring the different markings and generating a collection of data associated with different power or speed levels for the laser based on the markings; and adjusting at least one operating parameter of the laser based on the collection of data from the markings. Optionally, the method may be automated.

Abstract: An article surface ornamental structure that is easy to work and able to form a decorative pattern of an optional design and a high-grade feeling produced thanks to the metallic luster and, if necessary, to form a third dimensional decorative pattern. A metal-coated layer is formed by depositing a metal material with metallic luster on a surface of a base material. The metal-coated layer is at least partly provided with a separation part, in which the based material has its surface exposed to create an ornamental pattern thanks to a difference between the outer appearance of the base material and the metallic luster of the remaining metal-coated layer. With the base material and the metal-coated layer exposed, respectively, each of their surfaces is coated with a clear-coating layer made of synthetic resin material having transmittancy in order to protect the surface of the ornamental pattern.

Abstract: An electromagnetic-wave shielding and light transmitting plate 1 comprising an antireflection film 3, an electromagnetic-wave shielding film 10, a transparent substrate 2, and a near-infrared ray blocking film 5, wherein they are laminated and united by using intermediate adhesive layers 4A, 4B and a pressure-sensitive adhesive 4C, and the peripheries thereof are covered by a conductive sticky tape 7. The electromagnetic-wave shielding film 10 has a conductive foil 11 formed by pattern etching on a substrate film 13, is processed to have antireflection function by forming a light absorbing layer 12 on the conductive foil 11, and is subjected to a matting process to form small irregularities by roughening the surface of the light absorbing layer 12. A display panel is manufactured by bonding this electromagnetic-wave shielding film 10 to the front surface of a plasma display panel body.

Abstract: A ceramic substrate part comprising on its upper surface pluralities of external electrodes comprising wire-bonding electrodes, each of which comprises a primer layer based on Ag or Cu, a Ni-based lower layer, an intermediate layer based on a Pd—P alloy containing 0.4-5% by mass of P, and a Au-based upper layer formed in this order on a ceramic substrate, the upper layer containing Pd after heated by soldering, and having a Au concentration of 80 atomic % or more based on the total concentration (100 atomic %) of Au and Pd.

Abstract: A method of manufacturing a heat radiation substrate having a metal core, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed.

Abstract: In accordance with a first embodiment, the present invention provides a circuit substrate comprising a first surface; a second surface; a first via having a first end near said first surface and a second end near said second surface; a second via having a first end near said first surface and a second end near said second surface; a first conductive element electrically coupling said first end of said first via and said first end of said second via; a second conductive element electrically coupling said second end of said first via and said second end of said second via; an input signal line coupled to said first via; and an output signal line coupled to said second via.

Abstract: A system and method for combining specific fire barrier materials along with graphic materials and interior aircraft material/parts to lower the heat release and smoke density when tested using the FAA regulated OSU Heat Release and Smoke Density Tests and/or any other test as required by any countries government in order to install graphics onto an aircraft material/part.

Abstract: In an advantage of embodiments of the invention, there is provided an aqueous ink composition at least containing water, silver particles, and a humectant, and the humectant is at least one member selected from glycerols, glycols, and saccharide.

Abstract: A system for altering a functionality of an optical article from a pre-activated state to an activated state, comprising an optical article comprising an optical data layer for storing data, an external radiation source for generating an external stimulus adapted to interact with the optical article, such interaction causing a change in optical accessibility of optically stored data, a directing material, wherein said directing material is for directing the external stimulus to selective portions of the optical article, thereby altering the functionality of the optical article from a pre-activated state to an activated state; a convertible element capable of responding to the external stimulus to irreversibly alter the optical article from the pre-activated state of functionality to the activated state of functionality, wherein said convertible element comprises a color-shift dye, a magnetic material, a thermo-chromic material, a magneto-optical material, a light scattering material, a phase-change material,

Abstract: A manufacturing method of a circuit board is provided. A metal core is provided. A conductive layer is formed on each of some carriers. The carriers and dielectric layers are laminated at both sides of the metal core to form a stacked structure. Each of the dielectric layers is located between the corresponding carrier and the metal core, and a portion of the conductive layer is embedded in the corresponding dielectric layer. Then, the carriers are removed. A blind via and/or a through via are/is formed in the stacked structure to connect the corresponding conductive layer and the metal core and/or connect the conductive layers at both sides of the metal core, wherein the through via penetrates the metal core. The conductive layer on a surface of the dielectric layer is removed.

Abstract: The present invention provides a method for producing a sintered magnet, which can have a sufficient sintered density even when the magnet has a low-R composition. The method is for producing a sintered magnet comprising R (R: one or more rare-earth elements), T (T: one or more transition metal elements essentially comprising Fe, or Fe and Co) and B (boron) as the main components, wherein a starting alloy prepared by strip casting is pulverized to a given particle size to form a fine powder, where the starting alloy comprises discolored deposit 1 on the surface and the area ratio of the discolored deposit 1 is 1.5% or less, the resulting fine powder is compacted in a magnetic field to prepare a compact, and the compact is sintered.

Abstract: An interface forming method includes forming a first layer containing a first chemical element and chemisorbing on the first layer an interface layer containing at least one monolayer of the first chemical element intermixed with a second chemical element different from the first chemical element. A second layer comprising the second chemical element can be formed on the interface layer. The first layer might not substantially contain the second chemical element, the second layer might not substantially contain the first chemical element, or both. An apparatus can include a first layer containing a first chemical element, an interface layer chemisorbed on the first layer, and a second layer containing a second element on the interface layer. The interface layer can contain at least one monolayer of the first chemical element intermixed with a second chemical element different from the first chemical element.