Abstract: The invention relates to a composite component of at least (3) different material layers, having the following layer composition: a) a carrier layer or carrier structure of metal and/or fiber-reinforced plastic, b) a bonding agent layer of elastomer, c) a cover layer of carbon fiber-reinforced or mixed carbon fiber-reinforced plastic, wherein the plastic and the arrangement of the carbon fibers or mixed carbon fibers are chosen such that the carbon fibers or mixed carbon fibers are optically visible on the surface of the cover layer.

Abstract: The invention relates to flexible circuits and more particularly to flexible printed circuits having cover layers. The cover layers may be a chemically-etchable adhesive polyimide. The cover layers may be patterned after they are applied to the flexible circuit substrate.

Abstract: Provided is a method of producing a laminated body, wherein, while winding off a carrier A from a bobbin, an adhesive is applied to both facing ends thereof, a metal foil B is laid on and bonded to a side to which the adhesive was applied while being wound off from a bobbin, the obtained laminated body is subsequently cut, the cut laminated bodies are aligned, a roller is applied from the top of an object to be cut configured from the aligned laminated bodies when the elevation of the center of the object to be cut becomes high to vent air existing between the objects to be cut and in the laminated bodies, and the adhesive is eventually hardened to mutually bond the laminated bodies. In particular, this invention provides a carrier-attached copper foil to be used upon producing a laminated plate, and aims to realize the improvement in the handling ability in the production process of a printed board and cost reduction based on an improved production yield.

Abstract: A control panel (2) for a keyboard module (1) is proposed, comprising a cost-effective genuine metal optic, said panel not having a shielding effect for antennas and capable of being manufactured and installed in a simple manner. The control panel (2) comprises a polycarbonate film (4) as a surface element, said film having a UV coating (5) on a top side and a mechanical structure (6) and having a non-conducting PVD, screen printed or NCVM coating (7) on a bottom side. Following said coating (7) is a black coating (8) with material removed at selected locations such that image structures (9) are arranged which mechanically penetrate the black coating (8) and at the same time penetrate the non-conducting PVD, screen printed or NCVM coating (7) proximate to said selected locations of the black coating (8). Following the black coating (8) is in turn a color coating (10), such that the color coating (10) covers at least the areas of the image structures (9) and in a pre-selected color, respectively.

Abstract: A surface metal film material including, in this order, a substrate, a polymer layer that receives a plating catalyst or a precursor thereof, and a metal film formed by plating, wherein, when x ?m represents surface roughness (Ra) at the interface between the substrate and the polymer layer, and y ?m represents surface roughness (Ra) at the interface between the polymer layer and the metal film, x>y and 5 ?m>x>0.1 ?m, and wherein, when T ?m represents a thickness of the polymer layer, T and x satisfy the relationship 2x?T.

Abstract: A plasmonic nanostructure for enhanced light excitation is disclosed. The plasmonic nanostructure includes a substrate, an adhesion layer disposed on top of the substrate, a surface plasmon resonance layer, and a cavity that extends into the surface plasmon resonance layer. The surface plasmon resonance layer is configured to concentrate an applied plasmon field to a bottom portion of the cavity.

Abstract: A method of fabricating an injection-molded product includes: manufacturing an injection-molded material using a mold; forming a metal layer on an inner or outer surface of the injection-molded material; and removing a portion of the metal layer using a laser, and forming a pattern. Since the injection-molded product fabricated through the method has pattern with a metallic feeling, it can provide a metallic feeling of a high brightness that cannot be realized by a method such as printing and can provide a cubic feeling due to removal of a metal layer. The method provides portable products such as cases for cosmetic products and portable terminals with various visually appealing feelings, allowing users to express various individual styles or preferences using the portable products.

Abstract: The present invention generally relates to the deposition of nanowires and other nanoparticles on surfaces. According to one aspect of the invention, a fluid containing nanoscale objects, such as nanowires, is deposited on a surface having one or more relatively hydrophilic regions and one or more relatively hydrophobic regions. If the fluid is hydrophilic, it will preferentially be located in the relatively hydrophilic regions (or vice versa if the fluid is relatively hydrophobic). The fluid is then allowed to evaporate to cause the nanoscale objects to deposit. For instance, the rate of evaporation may be controlled so as to allow the nanoscale objects to substantially deposit at the centers of the regions and/or at a rate that causes the nanoscale objects to become substantially aligned. In some cases, the regions may be relatively small, e.g., having a minimum surface dimension of less than about 3000 nm. In one set of embodiments, one or more cylindrical droplets may be formed on the surface.

Abstract: A cover for camouflage against electromagnetic radiation. According to the invention, the cover includes a random set of puckered features in relief, these being formed by a camouflage net associated with a flexible dielectric mesh.

Abstract: A reinforcer includes a carrier conforming generally to one or more inner walls of a cavity, and an adhesive arranged in one or more beads between the carrier and the one or more inner walls of the cavity, such that when the one or more adhesive beads is cured, the carrier is adhered to the one or more inner walls defining the cavity.

Abstract: An architectural transparency includes a substrate, a first dielectric layer formed over at least a portion of the substrate, a continuous metallic layer formed over at least a portion of the first dielectric layer, a second dielectric layer formed over at least a portion of the first metallic layer, and a subcritical metallic layer formed over at least a portion of the second dielectric layer such that the subcritical metallic layer forms discontinuous metallic regions.

Abstract: The present invention provides a method for preparing a conductive pattern, comprising a pattern forming step of forming a conductive pattern on a substrate; and a blackening processing step of blackening the surface of the conductive pattern by immersing the conductive pattern in an aqueous solution containing reducing metal ions to oxidize the surface of the conductive pattern, and a conductive pattern prepared therefrom.

Abstract: A hybrid structure of multi-layer substrates comprises a first multi-layer substrate and a second multi-layer substrate. The first multi-layer substrate stacks up first metal layers, first dielectric layers alternately and has VIAs. A border district of a first metal layer connects with a border district of the corresponding first dielectric layer. The border districts are separated from adjacent first metal layers and adjacent first dielectric layers. The second multi-layer substrate stacks up second metal layers and second dielectric layers alternately. A border district of a second metal layer connects with a border district of the corresponding second dielectric layer. The border districts are separated from adjacent second metal layers and adjacent second dielectric layers. The VIAs are located at the border districts of the first dielectric layers and each VIA has electric conductor therein to connect one first metal layer with one second metal layer.

Abstract: Shaped articles with the inherent capability to evolve in response to at least one of external and internal stimuli are described. These articles comprise at least one solid electrolyte with at least one dissolved salt, and at least one interface which involves a solid electrolytes and a conductive solid. Electric potential gradients, generated within the solid electrolyte by at least one of external and internal stimuli, guide and drive the self-healing and adaptation phenomena.

Abstract: A hybrid structure of multi-layer substrates comprises a first multi-layer substrate and a second multi-layer substrate. The first multi-layer substrate stacks up first metal layers, first dielectric layers alternately and has VIAs. A border district of a first metal layer connects with a border district of the corresponding first dielectric layer. The border districts are separated from adjacent first metal layers and adjacent first dielectric layers. The second multi-layer substrate stacks up second metal layers and second dielectric layers alternately. A border district of a second metal layer connects with a border district of the corresponding second dielectric layer. The border districts are separated from adjacent second metal layers and adjacent second dielectric layers. The VIAs are located at the border districts of the first dielectric layers and each VIA has electric conductor therein to connect one first metal layer with one second metal layer.

Abstract: A flip chip mounting process includes the steps of supplying a resin (13) containing solder powder and a convection additive (12) onto a wiring substrate (10) having a plurality of electrode terminals (II), then bringing a semiconductor chip (20) having a plurality of connecting terminals (11) into contact with a surface of the supplied resin (13), and then heating the wiring substrate (10) to a temperature that enables the solder powder to melt. The heating step is carried out at a temperature that is higher than the boiling point of the convection additive (12) to allow the boiling convection additive (12) to move within the resin (12). During this heating step, the melted solder powder is allowed to self-assemble into the region between each electrode terminal (11) of the wiring substrate (10) and each connecting terminal (21) of the semiconductor chip to form an electrical connection between each electrode terminal (11) and each connecting terminal (21).

Abstract: Methods and structures including a release mechanism for use with the formation and then separation of a multi-layered structure are provided. The methods and structures provide for a master substrate on which is formed a temperature-sensitive release layer. A releasable structure is then formed on top of the temperature-sensitive release layer. The releasable structure can be freed from the master substrate by exposing the temperature-sensitive release layer to a temperature sufficient to soften or melt of the release layer.

Abstract: A method for making a liquid barrier includes forming a liquid barrier layer on a substrate, forming a mask layer on the liquid barrier layer such that part of the liquid barrier remains exposed, forming a contact layer on the exposed liquid barrier layer, and removing the mask layer to expose the part of the liquid barrier layer which was covered by the mask layer. A liquid wetting boundary is formed when the wettability on the liquid barrier surface area is less than the wettability of the contact surface area.

Abstract: The present invention relates to an article of manufacture having a reflective design thereon, as well as a method for manufacture thereof. The article of manufacture, such as a tire cover, comprises a substrate having a display surface, at least one adhesive material disposed on the display surface, and a first pigmented material arranged in a first design pattern and adhered to the display surface by the adhesive material, where the first pigmented material includes a plurality of glass particles operative to reflect light received from a light source. A second pigmented material, such as a reflective or non-reflective material of a different color, may be adhered to the display surface in a second design pattern. The present invention also provides a transfer pattern, and method for forming the same, that is for use in transferring a reflective design to a display surface.

Abstract: A ductile media for receiving an image thereon is disclosed and comprises a ductile mesh and an elastomeric membrane fixed to at least a top side of the mesh. The ductile mesh is preferably an expanded metal material. The elastomeric membrane has a substantially flat top surface that is adapted to receive the image thereon. A printable coating may be further applied to the top surface of the membrane. In one embodiment of the invention, a selectively removable liner is temporarily fixed with adhesive to a bottom surface of the mesh or to a bottom surface of the elastomeric membrane to prevent printer feeding rollers of a printing device, for example, from deforming or stretching the media as the media advances through the printing process. Alternately the image may be applied to the ductile media through a heat transfer or dye-sublimation process. Once the image is printed on the media, the user may form the media into a desired shape by applying pressure thereto.

Abstract: An article comprising a metal support with two opposing faces at least one of which is covered by a discontinuous ceramic coating. Said coating has a softening point above the melting point of the support and has at least one absorbing element for the laser radiation at a wavelength of the order of 1 ?m, being at least 1% of the weight of said coating. The invention further relates to a method for producing said article.

Abstract: A multilayer ceramic substrate includes an inner layer portion and surface portions that sandwich the inner layer portion in the stacking direction and have an increased transverse strength because of the surface layer portion having a thermal expansion coefficient less than that of the inner layer portion. At least one of the surface portions covers peripheries of main-surface conductive films arranged on a main surface of an inner portion so as to leave central portions of the main-surface conductive films exposed, so that the main-surface conductive films function as via conductors, thereby eliminating the need to provide a via conductor in the surface portions.

Abstract: A flexible base includes a main region configured for forming flexible printed circuit board units; and two conveying regions respectively arranged on two sides of the main region. Each of the conveying regions includes an insulating substrate, a plurality of sprocket holes, and a patterned supporting layer. The sprocket holes are defined along a lengthwise direction of the insulating substrate. The patterned supporting layer is formed on the insulating substrate. The patterned supporting layer extends from an edge of each sprocket hole towards a periphery region of the corresponding sprocket.

Abstract: The invention relates to a security element for security papers, bank notes, ID cards or the like, having at least one plastic layer on which at least two metal layers of different color are so disposed side by side and on the same side of the plastic layer that the different colors are visually checkable.

Abstract: A method for reducing porosity of metal layers on a substrate may comprise depositing a precursor onto at least a portion of the substrate, and adding metal layers over the precursor comprising at least one cycle, wherein each cycle comprises: depositing a metal layer over the precursor, and exposing the metal layer to a breath-out solution.

Abstract: A stiffener sheet for flexible printed flexible printed circuit boards, includes alternately laminated polyimide layers and polyamideimide layers, wherein a molecular structure of the polyamideimide is represented by the following formula: wherein Ar and Ar? represents different substituted aromatic groups.

Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.

Abstract: Disclosed are a method of electroless nickel-gold plating an object and a printed circuit board. The method in accordance with an embodiment of the present invention includes: forming a first nickel plated layer on a surface of the object; forming a second nickel plated layer on the first nickel plated layer; and forming a gold plated layer on the second nickel plated layer.

Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.

Abstract: The invention relates to a laminate comprising two plastic films and (optionally in between a metal or metal oxide layer and) a layer of an organic compound other than triazine, the laminate having a lamination strength of about 2 N/inch or more as measured in a 90 degree tensile testing at 30 mm/min. The invention further relates to a composite layer, suitable for said laminate. The invention further relates to laminate having a crystalline organic compound other than triazine to improve the barrier properties.

Abstract: A through-hole type laminated circuit board is given with high reliability of electrical connection using copper foil and conductive paste containing low melting point metal without generating harmful void and crack at boundary between the copper foil and conductive paste metal. The laminated circuit board is made by laminating a multiple number of resin boards with roughening treated copper foils at least on their one surface sides with roughening projection deposition of less than 150 mg/dm2 to make surface roughness Rz of 0.3 to 10 ?m and height of the projection to be 0.3 to 10 ?m. Surface roughness of the original foil is 0.1 to 5 ?m and the amount of copper metal atoms of roughening treated layer is set at 4 times or less than the amount of diffusible conductive paste metal atoms containing low melting point metal into the roughening treated layer on the foil surface.

Abstract: A rustproof steel sheet includes an organic and/or inorganic coating layer on at least one side thereof, the thickness of the coating layer in a portion where spot welding is performed being smaller than that of the coating layer in a portion where spot welding is not performed, and a method for manufacturing the rustproof steel sheet. Since the rustproof steel sheet has sufficiently low electric resistance at a weld spot and a satisfactory weld spot can be formed, the rustproof steel sheet has both spot weldability and corrosion resistance.

Abstract: In a dyeing method of an aluminum-based member, a first color forming material is held in a hole of a first region of an anodized film, a second color forming material is held in holds of a second region that is smaller than the first region by diagonally spraying, When the second colored layer is formed, a gradation region is formed in a boundary with the first region and the second region, and the hole are closed.

Abstract: A ceramic compact having a patterned conductor is obtained by coating the patterned conductor with a slurry and then by hardening the slurry. The slurry is prepared by mixing a thermosetting resin precursor, a ceramic powder, and a medium. In the ceramic compact, an isocyanate- or isothiocyanate-containing gelling agent and a hydroxyl-containing polymer are reacted and hardened to produce a thermosetting resin. The hydroxyl-containing polymer is preferably a butyral resin, an ethylcellulose-based resin, a polyethyleneglycol-based resin, or a polyether-based resin.

Abstract: An electrical connector including a base pad formed of aluminum and having a bottom surface. An electrical contact can be connected to the base pad. A layer of copper can be on the bottom surface of the base pad.

Abstract: An electronic component that includes a substrate and a phase-separated layer supported on the substrate and a method of forming the same are disclosed. The phase-separated layer includes a first phase comprising lanthanum manganate (LMO) and a second phase selected from a metal oxide (MO), metal nitride (MN), a metal (Me), and combinations thereof. The phase-separated material can be an epitaxial layer and an upper surface of the phase-separated layer can include interfaces between the first phase and the second phase. The phase-separated layer can be supported on a buffer layer comprising a composition selected from the group consisting of IBAD MgO, LMO/IBAD-MgO, homoepi-IBAD MgO and LMO/homoepi-MgO. The electronic component can also include an electronically active layer supported on the phase-separated layer.

Abstract: A shell for an electronic device is provided. The shell includes a transparent shell body, a pattern layer formed on an inner surface of the shell body, and a metal coating formed on an outer surface of the shell body which is light transmitting.

Abstract: A method for making a desired pattern of a metallic nanostructure of a metal includes: (a) forming the desired pattern of a self-assembled monolayer matrix of a first organic compound on a substrate, the first organic compound having a tail group selected to be active toward deposition of the metal on the self-assembled monolayer matrix; (b) forming an inert layer of a second organic compound on the substrate by contacting an assembly of the substrate and the self-assembled monolayer matrix with a solution containing the second organic compound, the second organic compound having a tail group selected to be inactive toward the deposition of the metal on the inert layer; and (c) depositing the metal on the self-assembled monolayer matrix by contacting an assembly of the substrate, the self-assembled monolayer matrix and the inert layer with a solution containing metal ions, followed by reducing the metal ions.

Abstract: An exemplary method for making a device housing includes the following steps. Providing a substrate, and then forming a decorative coating on the substrate by paint jet printing. A device housing made by the method includes a substrate and a decorative coating formed on the substrate.

Abstract: There is described a multi-layer film. The film comprises a biodegradable layer and a metallised layer, wherein the biodegradable layer comprises a biopolymer selected from the group consisting of carbohydrates, polysaccharides, gums, proteins, colloids, polyorganic acids and mixtures thereof.

Abstract: Thermal imaging donors are useful for thermal transfer patterning of a metal layer and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers. These include electromagnetic interference shields and touchpad sensors.

Abstract: A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 ?m or less is provided. According to the present invention, there is no such a defect that gold plating is deposited on a resin, and fine wiring formation with accuracy is realized.

Abstract: A circuit board structure and fabrication method thereof are disclosed, including: a circuit board with a circuit layer thereon; a reactant formed on the surface of the circuit layer, wherein the reactant is an organic metallic polymer having a polymer end and a metal ion end; and a dielectric layer formed above the reactant and the circuit board, thus forming a metallic bond between the metal ion end of the reactant and the circuit layer and forming a chemical bond between the polymer end of the reactant and the dielectric layer. Owing to enhanced bonding between the dielectric layer and the circuit board, electrical performance of the circuit board structure is improved, and the demand for fine circuits is met.

Abstract: The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufacturing method thereof, in which the metal clad laminate or the resin coated metal foil is used, the reliability and circuit formability are high, and the conductor loss is extremely low.

Abstract: Piezoelectric material is shaped by plasma etching to form deep features with high aspect ratios, and desired geometries.

Abstract: A method of thermally insulating an object that requires a Class A standard insulation material, said method comprising suitably locating a metallized polymeric reflective insulation material adjacent said object, wherein said polymeric material is selected from a closed cell foam, polyethylene foam, polypropylene foam, expanded polystyrene foam, multi-film layers assembly and a bubble-pack assembly. The object is preferably packaging, a vehicle or a residential, commercial or industrial building or establishment. The polymeric material may contain a fire-retardant and the bright surface of the metallized layer has a clear lacquer coating to provide anti-corrosion properties, and which maintains satisfactory reflectance commercial criteria.

Abstract: A method of thermally insulating an object that requires a Class A standard insulation material, said method comprising suitably locating a metallized polymeric reflective insulation material adjacent said object, wherein said polymeric material is selected from a closed cell foam, polyethylene foam, polypropylene foam, expanded polystyrene foam, multi-film layers assembly and a bubble-pack assembly. The object is preferably packaging, a vehicle or a residential, commercial or industrial building or establishment. The polymeric material may contain a fire-retardant and the bright surface of the metallized layer has a clear lacquer coating to provide anti-corrosion properties, and which meets commercial reflectance criteria.

Abstract: A device housing comprises a transparent substrate, a paint coating, and a metallic coating. The paint coating is formed on portions of one surface of the transparent substrate. The metallic coating is formed on other portions of the surface of the transparent substrate having the paint coating. A method for making the device housing is also described there.

Abstract: Disclosed is a manufacturing method of metal structure in multi-layer substrate and structure thereof. The manufacturing method of the present invention comprises following steps: coating at least one photoresist layer on a surface of a dielectric layer, and then exposing the photoresist dielectric layer to define a predetermined position of the metal structure; therefore, removing the photoresist layer at the predetermined position and forming the metal structure at the predetermined position before forming at least one top-cover metal layer on a surface of the metal structure. The present invention can form a cover metal layer covering over the top surface and the two side surfaces, even the under surface of the metal structure, by one single photomask. Moreover, a finer metal structure with higher reliability can be manufactured. Furthermore, a metal structure can be used as a coaxial structure is also realized.

Abstract: The present invention provides a process for preparing a light transmissive electromagnetic wave shielding material having an excellent light transmissive property, an excellent electromagnetic wave shielding property, an excellent appearance property and an excellent legibility by a simple method. A process for the preparation of a light transmissive electromagnetic wave shielding material comprising; (A1) printing a pretreatment agent for electroless plating comprising a noble metal compound and a mixture of silane coupling agent and azole compound or a reaction product thereof in a mesh pattern on a transparent substrate 11 to form a mesh-patterned pretreatment layer 12, and (A2) subjecting the pretreatment layer 12 to electroless plating to form a mesh-patterned metal conductive layer 13 on the pretreatment layer 12.