Next To Metal Patents (Class 428/344)
  • Patent number: 5827582
    Abstract: An object with a small orifice has a highly precise orifice diameter which is produced prior to the firing of the object. A ferrule having an orifice is placed inside of a bore in a casing, preferably a ceramic casing. The casing is then shrunk around the ferrule, preferably by sintering, with the cross-sectional areas of both the ferrule and its orifice remaining constant during the shrinking step. Consequently, the ferrule is securely fixed within the casing without any gaps between the two. In an alternative method, the ferrule is pre-shrunk and placed inside the bore, where it expands to fill the bore.
    Type: Grant
    Filed: November 15, 1996
    Date of Patent: October 27, 1998
    Assignees: CeramTec North America Innovative, Ceramic Engineering Corporation
    Inventors: Tariq Quadir, Gary E. Del Regno
  • Patent number: 5820681
    Abstract: A unibody, monolithic, one-piece negative draft crucible for a MBE effusion cell. The crucible maximizes capacity, uniformity and long term flux stability, and minimizes oval defects, depletion effects, and short term shutter-related flux transients. The invention also provides a method and mandrel apparatus for making a unibody containment structure, such as a crucible formed of PBN, having a negative draft, via chemical vapor deposition.
    Type: Grant
    Filed: May 3, 1995
    Date of Patent: October 13, 1998
    Assignee: Chorus Corporation
    Inventors: Paul E. Colombo, Robert F. Donadio
  • Patent number: 5820989
    Abstract: A glass ceramic composition, a glass ceramic-to-metal seal, and more specifically a hermetic glass ceramic-to-metal seal prepared by subjecting a glass composition comprising, by weight percent, SiO.sub.2 (65-80%), LiO.sub.2 (8-16%), Al.sub.2 O.sub.3 (2-8%), K.sub.2 O (1-8%), P.sub.2 O.sub.5 (1-5%), B.sub.2 O.sub.3 (0.5-7%), and ZnO (0-5%) to the following processing steps: 1) heating the glass composition in a belt furnace to a temperature sufficient to melt the glass and crystallize lithium phosphate, 2) holding at a temperature and for a time sufficient to create cristobalite nuclei, 3) cooling at a controlled rate and to a temperature to cause crystallization of lithium silicates and growth of cristobalite, and 4) still further cooling in stages to ambient temperature. This process produces a glass ceramic whose high coefficient of thermal expansion (up to 200.times.10.sup.-7 in/in/.degree.C.
    Type: Grant
    Filed: September 3, 1996
    Date of Patent: October 13, 1998
    Assignee: Sandia Corporation
    Inventors: Scott T. Reed, Ronald G. Stone, Howard L. McCollister, Paul R. Wengert, deceased
  • Patent number: 5814180
    Abstract: A method for low temperature attachment of components is provided which uses an electrically conductive adhesive. The electrically conductive adhesive may be defined by a substrate having numerous passageways through the substrate. The passageways are defined by a plurality of walls of the material making up the substrate. The walls are covered with a layer of conductive metal. The passageways at the outer surfaces are filled with a non-conductive pressure sensitive adhesive resin.
    Type: Grant
    Filed: August 9, 1996
    Date of Patent: September 29, 1998
    Assignee: W. L. Gore & Associates, Inc.
    Inventor: David Robert King
  • Patent number: 5807914
    Abstract: The present invention relates to a glass fiber-reinforced polycarbonate resin composition comprising:(A) 70 to 92% by weight of an aromatic polycarbonate resin;(B) 1 to 20% by weight of an aromatic polycarbonate oligomer;(C) 3 to 20% by weight of a glass fiber comprising a short glass fiber having a fiber length of not more than 140 .mu.m and a long glass fiber having a fiber length of more than 140 .mu.m; and(D) 0.5 to 15% by weight of a composite rubber-based graft copolymer,halogen content in said resin composition being not more than 0.5% by weight based on total weight of said resin composition.
    Type: Grant
    Filed: March 27, 1997
    Date of Patent: September 15, 1998
    Assignee: Mitsubishi Engineering-Plastics Corporation
    Inventors: Naoto Obayashi, Tooru Watanabe, Hiroyoshi Maruyama
  • Patent number: 5807616
    Abstract: A method of lessening the tendency for carbon to deposit on a metal surface during thermal cracking of hydrocarbons which comprises isolating the metal surface with a glass-ceramic coating, and a coated furnace element for use in such method.
    Type: Grant
    Filed: April 24, 1995
    Date of Patent: September 15, 1998
    Assignee: Corning Incorporated
    Inventor: Donald M. Trotter, Jr.
  • Patent number: 5800616
    Abstract: A reversible manifold collar design for use in a vertical low pressure chemical vapor deposition (LPCVD) furnace incorporates first and second notches in opposing ends thereof such that one of the notches aligns with an exhaust port in the deposition chamber of the furnace irrespective of the installed orientation of the collar. As such, blockage of the exhaust port, which might otherwise increase deposition rates and/or decrease film uniformity, may be avoided. Also, a method of retrofitting a LPCVD furnace includes removing an existing manifold collar and replacing it with a reversible manifold collar such that one of a pair of notches therein is adapted to align with an exhaust port irrespective of the orientation of the collar.
    Type: Grant
    Filed: December 15, 1997
    Date of Patent: September 1, 1998
    Assignees: Sony Corporation, Sony Electronics Inc.
    Inventor: Steven C. Persyn
  • Patent number: 5792524
    Abstract: A decorative construction material such as a glass tile is produced from recycled glass granulate, and exhibits a smooth, external surface substantially free from defects on one side of the tile. One or two layer tiles may be produced. A binder, together with control of the maximum temperature and temperature gradient in the layers, if applicable, is used during manufacture to ensure a substantially flawless outer surface.
    Type: Grant
    Filed: July 25, 1996
    Date of Patent: August 11, 1998
    Assignee: Futuristic Tile L.L.C.
    Inventors: Jury K. Lingart, Nailia A. Tikhonova
  • Patent number: 5789045
    Abstract: In the present invention, various sizes of non-wetting droplets are inserted into microtube devices of various shapes having therein a gas or wetting fluid which causes the droplets to movement in response to fluid pressure. The droplets may translate within a void of the microtube device which is filled with the gas or wetting fluid or rotate in a fixed position. The nonwetting fluid may also be formed into rings within ring shaped channels. The microtube devices may operate to stop fluid flow, act as a check-valve, act as a flow restrictor, act as a flow regulator, act as a support for a turning axle, and act as a logic device, for example.
    Type: Grant
    Filed: May 10, 1996
    Date of Patent: August 4, 1998
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Phillip G. Wapner, Wesley P. Hoffman, Gregory Price
  • Patent number: 5786048
    Abstract: A ferroelectric ceramic material, for the storage of information in electrostatic printing processes, which ferroelectric ceramic material has a coercive force of less than 200 V/mm. The ferroelectric ceramic material consists of a ceramic perovskitic mixed crystal, which contains one or more components from each of Groups 1 and 2, whereby Group 1 contains the components PbTiO.sub.3, BaTiO.sub.3, Pb(Fe.sub.1/2 Nb.sub.1/2)O.sub.3 and Pb(Zn.sub.1/3 Nb.sub.2/3)O.sub.3 and Group 2 contains the components Pb(Mg.sub.1/3 Nb.sub.2/3)O.sub.3, Pb(Ni.sub.1/3 Nb.sub.2/3)O.sub.3, Pb(Fe.sub.2/3 W.sub.1/3)O.sub.3 and Pb(Mn.sub.1/2 Nb.sub.1/2)O.sub.3. The proportions of the components from the two groups in the mixed crystal are determined according to the following equation: ##EQU1## where X.sub.i is the mole fraction of the i-component, T.sub.ci is the Curie point of the i-component and T.sub.cM is the Curie point of the mixture between 50.degree. C. and 100.degree. C.
    Type: Grant
    Filed: June 10, 1996
    Date of Patent: July 28, 1998
    Assignee: Man Roland Druckmaschinen AG
    Inventors: Hans-Jurgen Gesemann, Lutz Seffner, Andreas Schonecker, Falko Schlenkrich
  • Patent number: 5786055
    Abstract: An adhesive for semiconductor device, comprising (a) a polyamide resin having an amine value of 20 to 60 and a weight average molecular weight of 1,000 to 5,000 and (b) a phenolic compound having a weight average molecular weight of 2,000 or less and having a skeleton containing at least 2 methylol groups.
    Type: Grant
    Filed: February 1, 1995
    Date of Patent: July 28, 1998
    Assignee: Tomoegawa Paper Co., Ltd.
    Inventors: Akinori Sei, Yoshikazu Tsukamoto, Takashi Shiozawa, Shouji Aoki, Tadahiro Oishi, Hitoshi Narushima
  • Patent number: 5783267
    Abstract: A method for manufacture of glassware with an EM Culture embedded in the glass matrix to improve the palatability of foods or drinks is disclosed. A suitable amount of broth or stock made from fish is mixed with hot water and then a suitable amount of an EM Culture is added to the broth/hot water mixture. The resulting mixture is added to raw materials for glass in a suitable proportion. The mixture is then subjected to aging for a sufficient period of time to have activated the an. EM Culture contained therein. Thereafter, the mixture is melted and formed into a glass article of a desired shape.
    Type: Grant
    Filed: July 22, 1996
    Date of Patent: July 21, 1998
    Inventor: Taro Soejima
  • Patent number: 5780147
    Abstract: Disclosed is a laminate comprising a thermosetting resin-impregnated prepreg layer (A) constituting a surface layer, a rubber or thermoplastic resin layer (B) having a flexibility and a hot melt resin adhesive layer (C), the thermosetting resin-impregnated prepreg layer and rubber or thermoplastic resin layer being heat bonded through the hot melt resin adhesive layer. The layer (A) is a prepreg impregnated with a thermosetting resin selected from a diallyl phthalate resin, an unsaturated polyester, a phenol resin, an aminoalkyd resin, an epoxy resin, an acrylurethane resin and a melamine resin. The rubber or resin of the layer (B) is a rubber or a thermoplastic resin selected from chlorinated polyethylene, polybutene, ethylene-vinyl acetate copolymer, an ethylene-propylene-diene copolymer, a chloroprene polymer, chlorosulfonated polyethylene, a styrene-butadiene copolymer and polyvinyl chloride. In addition, the hot melt resin of the layer (C) is a hot melt resin having a melting point of 60.degree. to 165.
    Type: Grant
    Filed: March 13, 1996
    Date of Patent: July 14, 1998
    Assignee: Daiso Co., Ltd.
    Inventors: Mikio Sugahara, Mitsutoshi Yoshinobu, Yoshiyuki Tanaka
  • Patent number: 5780126
    Abstract: Fluid permeable filter material comprising a self supporting fluid permeable wall and a fluid permeable filter layer. The self supporting wall comprises ceramic oxide fibers, ceramic oxide particles, and silicate ceramic oxide bonding phase. The filter layer comprises non-woven ceramic oxide fibers and silicate ceramic oxide bonding phase.
    Type: Grant
    Filed: July 17, 1996
    Date of Patent: July 14, 1998
    Assignees: Minnesota Mining & Manufacturing, Hexcel Corporation
    Inventors: Robert G. Smith, Joseph H. Eaton, Edward M. Fischer, Larry R. Visser, Venecia M. Grobelny, Kevin D. McVicker
  • Patent number: 5773104
    Abstract: A high temperature and highly corrosive resistant structure and method of fabricating the structure. In one embodiment of the present invention, vacuum plasma spray or other materials deposition techniques are used to fabricate the structure on a removable support member in the form of a gradient or composite structure that sequentially consists of a 100% ceramic interior layer, a first transition layer of ceramic/refractory metal, a layer of 100% refractory metal, a second transition layer of ceramic/refractory metal, and an outer layer of 100% ceramic material. In a second embodiment, the ceramic/refractory metal/ceramic cartridge is formed without transition layers between the ceramic and metal layers. In another embodiment of the invention the structure is fabricated on a removable support member by depositing an outer layer of ceramic material on a refractory metal. No transition layers of ceramic material/refractory metals are used.
    Type: Grant
    Filed: November 13, 1996
    Date of Patent: June 30, 1998
    Assignee: Plasma Processes, Inc.
    Inventors: Timothy N. McKechnie, Richard R. Holmes, Frank R. Zimmerman, Chris A. Power
  • Patent number: 5773112
    Abstract: A label with a metallic layer of controlled thickness comprising a transparent or semi-transparent film, a metallic layer which is formed by metal deposition, has a light transmittance of 3 to 70%, and is formed on one side of the film, and a layer of an adhesive material formed on the metallic layer. Alternatively, a protective layer may be formed on the metallic layer, and the layer of an adhesive material formed on the other side of the film. The label is transparent even though it shows metallic gloss, has remarkably beautiful appearance, and is suitable for artistic design.
    Type: Grant
    Filed: January 2, 1997
    Date of Patent: June 30, 1998
    Assignee: Lintec Corporation
    Inventors: Kohei Tachikawa, Akira Katayama, Toshio Minagawa, Shigenobu Maruoka
  • Patent number: 5770296
    Abstract: An adhesive device, featuring a target element, absorptive of electromagnetic waves, contiguous with a heat-activatable adhesive material, shaped into an article having a mathematically smooth perimeter, will facilitate a quick, neat, easy and secure assembly of associated component pieces or manufactured articles. Exposing the device to electromagnetic waves will produce heat energy which will activate the adhesive material and result in the bonding of the associated component pieces. This adhesive device is particularly beneficial when used within or between pieces to be assembled that are substantially transparent to electromagnetic waves.
    Type: Grant
    Filed: August 5, 1996
    Date of Patent: June 23, 1998
    Assignee: Senco Products, Inc.
    Inventors: David L. Remerowski, Duane C. Shomler, Anthony T. Racca, David J. Lococo, Vladimir Pilic
  • Patent number: 5763053
    Abstract: An ambient lighted plaque structure with self-created aesthetic illusory-colored sides comprising a glass blank. The glass blank being colorless and transparent and homogeneous in composition. The glass blank bounded by front and back surfaces and a series of angularly related sides where the series of angularly related sides define a thickness between the front and back surfaces of the glass blank. One of the series of angularly related sides facing in an upward direction. Another of the series of angularly related sides facing in a downward direction. A colored glass strip structure underlying the glass blank and being homogeneous in composition. The colored glass strip structure is rigidly bonded to the side facing in a downward direction and the bond provides a colorless transparent joint therebetween. The joint enables ambient light to travel between the colored glass strip structure and the side facing in a downward direction without substantial internal reflection.
    Type: Grant
    Filed: January 25, 1996
    Date of Patent: June 9, 1998
    Inventor: Harshad N. Amin
  • Patent number: 5763026
    Abstract: An anchor-fixing capsule comprising a crushable capsule, and a hardenable resin component and a powdery or granular hardener component with which the crushable capsule is filled, said hardenable resin component being separated from said hardener component by a separation layer, wherein said hardenable resin component and said hardener component are each alternately disposed in two or more layers, which provides uniform good mixing of the hardenable resin component and the hardener component in driving an anchor, resulting in good adhesive strength of the anchor.
    Type: Grant
    Filed: September 19, 1996
    Date of Patent: June 9, 1998
    Assignee: Maeda Kousen Kabushiki Kaisha
    Inventors: Keiichi Makino, Kouji Shirasaki, Tooru Utsunomiya
  • Patent number: 5759683
    Abstract: A holographic article and method for forming permits the party producing the final document to print the holographic image directly on the final document thereby permitting such party to retain and maintain control of its own embossing shim on which the hologram has been formed and which is utilized for embossing the holographic image on the document. A film upon which a holographic image can be directly stamped upon the final document includes a layer of metal having a thickness in the range of 20 millimicrons to 100 millimicrons, a lacquer coating having a thickness in the range of 0.5 microns to 3 microns and a heat activatible adhesive. The metal layer lacquer coating and heat activatible adhesive are caused to be adhered to the substrate forming the final document during a stamping operation which releases said metal layer, lacquer coating and heat activatible adhesive from a plastic carrier film to which had initially been applied.
    Type: Grant
    Filed: June 27, 1995
    Date of Patent: June 2, 1998
    Assignee: NovaVision, Inc.
    Inventor: David R. Boswell
  • Patent number: 5759646
    Abstract: Proposed is an improvement in a vessel, e.g., crucible, of pyrolytic boron nitride (PBN) used, for example, in the process of molecular beam epitaxy for melting silicon and the like at a high temperature. Different from conventional PBN crucibles used for such a process, in which contamination of high-purity silicon is unavoidable by the reaction of molten silicon with PBN or a thermal decomposition products of boron nitride, the inventive PBN vessel is provided on the surface with a protective coating layer of pyrolytic graphite or a refractory metal such as platinum so as not to cause troubles due to contamination of high-purity silicon melted therein with the crucible materials.
    Type: Grant
    Filed: August 16, 1996
    Date of Patent: June 2, 1998
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Shoji Kano, Nobuo Kawada, Ryoji Nakajima, Yukio Kurosawa
  • Patent number: 5756185
    Abstract: A gluable fixing element for holding structural or functional components to essentially flat surfaces of carrier parts. It consists of a bonding portion for producing an adhesive bond with the surface of the carrier part and at least one further holding portion for producing a positive or non-positive connection with the component. The bonding portion has a bonding surface which is provided with a curable and/or crosslinkable, reactive hot-melt adhesive that when dry is wear-resistant and non-adhesive at temperatures up to 80.degree. C. but that can be reactivated within a very short time when heated by thermal or other energy to a temperature sufficient to melt the adhesive to produce a durable adhesive bond between the element and the carrier parts.
    Type: Grant
    Filed: January 30, 1995
    Date of Patent: May 26, 1998
    Assignee: A. Raymond & GmbH & Co. KG
    Inventor: Hans-Jurgen Lesser
  • Patent number: 5756186
    Abstract: The invention relates to a layered reflector (1) for light radiation comprising: a) a scratch resistant outer layer (2) transmitting this radiation, b) a first resin layer (3) bonded to it, which is provided with slip properties at least at its contact side (7) with the outer layer (2) and which layer c) is covered at its opposite side with a layer (4) reflecting said radiation and which by interposition of a bonding layer (6), d) is laminated to a second resin layer (5) which has slip properties at least at its free outer surface (8) opposite to the contact side bonding layer. The invention relates also to a process and intermediate products for manufacturing the reflector as well as a self-adhesive reflector (15) derived therefrom and a light reflecting structure (16).
    Type: Grant
    Filed: January 11, 1996
    Date of Patent: May 26, 1998
    Assignee: N.V. Bekaert S.A.
    Inventors: Hugo Lievens, Pascal Verheyen
  • Patent number: 5750225
    Abstract: A vapor barrier laminate for use in insulation applications as a facing material. A fiberglass yarn or scrim is positioned between layers of kraft paper. An aluminum foil is adhered directly to the outer kraft paper layer. The paper to foil bond and the paper to paper bond are accomplished with a flame retardant adhesive. The resulting heavier and thicker laminate provides increased rigidity, a smoother outer surface for better abrasion resistance, and a greater tensile strength. Use of the laminate in duct board facing improves the strength of the duct board while facilitating tape adherence for sealing gaps between board sections.
    Type: Grant
    Filed: May 26, 1995
    Date of Patent: May 12, 1998
    Assignee: Compac Corporation
    Inventor: Charles J. Petty
  • Patent number: 5750241
    Abstract: A thermal transfer foil (4) on which the following layer are stacked is superimposed on one side of a base film (4a), approximately 12 .mu.m to 25 .mu.m thick, relative to a substrate (11), such as a metal plate, comprising a timepiece face plate: a separable processing layer (4b), approximately 0.02 .mu.m thick; a transparent protective coloring layer (4c), approximately 2 .mu.m thick; and a reflection layer (4d), approximately 0.03 .mu.m to 0.05 .mu.m thick; as well as a thermoplastic resin layer (4e). Then, the base film (4a) is peeled off the thermal transfer foil (4), and then heat-pressed using a mold (21). Fine relief-and-indentation patterns are provided on the pressing surface (22) of the mold (21), which are transferred to the protective coloring layer (4c), the reflection layer (4d), and the thermoplastic resin layer (4e).
    Type: Grant
    Filed: December 21, 1994
    Date of Patent: May 12, 1998
    Assignee: Seiko Epson Corporation
    Inventors: Koichi Kobayashi, Wataru Iwanami, Taiyo Kanai
  • Patent number: 5733639
    Abstract: A laminated circuit board comprising a high frequency, low dielectric, and low dissipation factor foam substrate layer and at least one metal cladding layer laminated to the foam substrate layer. The foam substrate layer is formed of a closed-cell polyisocyanurate rigid foam having a closed-cell structure greater than 95%.
    Type: Grant
    Filed: June 28, 1996
    Date of Patent: March 31, 1998
    Assignee: Poly Circuits/M-Wave
    Inventor: Daniel T. Gosselin
  • Patent number: 5731064
    Abstract: There is disclosed a hot stamping foil assembly, in particular a hot stamping foil, which has spatial decorative or security elements formed in a region-wise manner. An adhesive layer is provided only in a region-wise manner and in matching relationship with respect to the spatial elements to effect transfer of the spatial decorative or security elements or other decorative layer structure.
    Type: Grant
    Filed: December 20, 1996
    Date of Patent: March 24, 1998
    Assignee: Leonhard Kurz GmbH & Co.
    Inventor: Joachim Suss
  • Patent number: 5725948
    Abstract: This invention provides an adhesive tape and a liquid adhesive for electronic parts having sufficient thermal resistance and reliability. The adhesive tape of the invention comprises an adhesive layer composed of at least a polyimide selected from (I) a polyimide comprising the repeating unit represented by the following formula (1), (II) a polyimide comprising the repeating unit represented by the following formula (2), and (III) a polyimide comprising the repeating units represented by the following formulas (1) and (2) in a suitable proportion, provided on at least one surface of a heat resistance film or on a surface of a release film: ##STR1## wherein Ar is a divalent group having aromatic rings, Ra is a divalent group having 2 to 6 benzene rings; Rb is an alkylene group having 2 to 20 carbon atoms, a specific ether group or a specific dimethylsiloxane group: X.sup.1 is NH, NR (R is a C.sub.1 -C.sub.4 alkyl group or alkoxy group) or S; and X.sup.2 is NH, NR (R is a C.sub.1 -C.sub.
    Type: Grant
    Filed: August 28, 1996
    Date of Patent: March 10, 1998
    Assignee: Tomoegawa Paper Co., Ltd.
    Inventors: Osamu Oka, Takeshi Nishigaya
  • Patent number: 5721028
    Abstract: The present invention provides a strong heat seal to a thermoplastic polyester container which can withstand hot water treatment such as retorting, and to a heat sealed container. A heat-sealable closure is also provided. It is composed of a laminate consisting of a heat-seal layer comprising as a main component a copolymerized polyester resin having a softening temperature of 120.degree. C. and a glass-transition temperature of 30.degree. to 85.degree. C., a metal substrate, and an epoxy-phenol resin primer layer interposed between them.Preferably, the container has a heat seal portion composed of a thermoplastic polyester having a fusion temperature in the crystalline state of at least 200.degree. C. This polyester portion is oriented and crystallized or heat-crystallized.
    Type: Grant
    Filed: January 5, 1993
    Date of Patent: February 24, 1998
    Assignee: Toyo Seikan Kaisha, Ltd.
    Inventors: Kouji Suzuki, Tsuneo Imatani, Hideo Kurashima, Kazuo Taira
  • Patent number: 5718953
    Abstract: A heat-shrinkable tubing formed substantially from a polyphenylene sulfide, which can be produced by stretching an unstretched tubing formed substantially from a polyphenylene sulfide 1.05 to 4.5 times in the longitudinal direction and 1.3 to 4.5 times in the direction perpendicular to the longitudinal direction at 85.degree. to 105.degree. C.; and a surface-covered inorganic material product which is obtained by covering an inorganic material product with the above tubing and then subjecting the tubing to heat shrinkage.
    Type: Grant
    Filed: October 4, 1996
    Date of Patent: February 17, 1998
    Assignee: Teiyo Limited
    Inventors: Kozo Shikama, Seiki Mukai
  • Patent number: 5714252
    Abstract: The present invention relates to a deformable substrate assembly for microelectronic components which includes an array of ductile metal circuit traces on a surface thereof. When an electronic component is adhesively bonded to the substrate assembly, and bonding elements from the component contact the traces, the substrate has material properties which allow individual bonding elements to locally deform the traces until the traces penetrate into the substrate surface.
    Type: Grant
    Filed: January 2, 1997
    Date of Patent: February 3, 1998
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Peter B. Hogerton, Kenneth E. Carlson
  • Patent number: 5714216
    Abstract: The storable glass tube sealed on both sides contains the two components of a two-component adhesive and fibers or chips incorporated therein in separate sections which are in immediate contact, being located in said glass tube such that there are portions of both components present at as many as possible intersecting planes perpendicular to the longitudinal axis of said glass tube.
    Type: Grant
    Filed: April 4, 1996
    Date of Patent: February 3, 1998
    Assignee: Koch Marmorit GmbH
    Inventors: Volker Banhardt, Ulrich Koberski
  • Patent number: 5714241
    Abstract: An improved gold paste for use in the manufacture of ceramic circuit boards is disclosed, which has a composition comprising an inorganic component, an organic binder, a solvent. The inorganic component contains (a) 84-94 wt % powdery gold with a particle size of 0.3-0.7 .mu.m, (b) 0.3-2.0 wt % powdery V.sub.2 O.sub.5 with a particle size of 0.3-2.0 .mu.m, and (c) 0.3-2.0 wt % powdery CuO with a particle size of 0.3-2.0 .mu.m.
    Type: Grant
    Filed: February 10, 1995
    Date of Patent: February 3, 1998
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Akihiko Miyoshi
  • Patent number: 5711833
    Abstract: A process is provided for the manufacture of thin walled ceramic structures, particularly conical or near conical shaped structures. The process involves a tape casting technique wherein a green tape is prepared from a colloidal suspension containing a ceramic powder, a binder system, a plasticizer and a solvent. The suspension is cast into a thin sheet and dried to form a pliable tape. The tape is cut into planar, shaped pieces. Non-planar components of the final structure are preformed from the cut planar tape pieces into predetermined three dimensional shapes. The planar and preformed components are sequentially assembled within a die and compacted under pressure to form a green body. The green body is subjected first, to a burnout cycle to form a brown body, and then sintered to form the unitary, cohesive, thin walled ceramic structure.
    Type: Grant
    Filed: July 25, 1995
    Date of Patent: January 27, 1998
    Assignee: Thermicedge Corporation
    Inventors: Prasad S. Apte, Ernesto S. Tachauer, Travis Kyle Solomon
  • Patent number: 5710184
    Abstract: A molded closure for a liquid container comprising a thermoplastic elastomer and a blowing agent. The molded closure is particularly suitable for use as a synthetic wine cork in a wine bottle. The molded closure does not permit passage of oxygen into the container, does not absorb oxygen from the contents of the container, can be removed from the container using a corkscrew without significant expansion, crumbling or disintegration, does not significantly taint a liquid in the container, permits the container to be placed horizontally immediately after insertion of the molded closure, and can permanently retain printed matter on its surface.
    Type: Grant
    Filed: February 27, 1997
    Date of Patent: January 20, 1998
    Assignee: Supreme Corq
    Inventor: Dennis L. Burns
  • Patent number: 5707729
    Abstract: An adhesive composition and foils coated with the adhesive, wherein the adhesive consisting essentially of: (I) a fist amount of a non-modified epoxy resin and a second amount of a rubber-modified epoxy resin in a total amount of 60-100 parts by weight, wherein the amount of rubber-modified epoxy resin is 0.5 to 20 parts by weight; (II) 5-30 parts by weight of a polyvinyl acetal resin; and optionally contains (III) at least one resin selected rom the group consisting of blocked isocyanate resins, polyester resins, polyester resins, melamine resins and urethane resins. The adhesive coating can optionally contain inorganic fillers, fire retardants, and curing agents.
    Type: Grant
    Filed: September 7, 1995
    Date of Patent: January 13, 1998
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventor: Tetsuro Satoh
  • Patent number: 5707730
    Abstract: An adhesive for bonding a reinforcing sheet to a lead-formed surface of a tape carrier package used for forming a semiconductor device, the adhesive being a resin composition which constitutes an interlayer between the lead-formed surface and the reinforcing sheet, comprises a polyamide resin having an amine value of 3.0 to 50 and an epoxy resin, is free from peeling and foaming, undergoes sufficient softening and curing at a temperature lower than about 150.degree. C., has high insulation reliability after cured, and has heat resistance against a temperature up to 260.degree. C.
    Type: Grant
    Filed: January 30, 1996
    Date of Patent: January 13, 1998
    Assignee: Tomoegawa Paper Co. Ltd.
    Inventors: Tadahiro Oishi, Akira Tezuka
  • Patent number: 5705237
    Abstract: Containers incorporating a hydraulically settable structural matrix including a hydraulically settable binder such as cement for use in the storing, dispensing, and/or packaging of food and beverage products are disclosed. The disposable and nondisposable food and beverage articles of manufacture have high tensile, compressive, and flexural strengths, and are lightweight, insulative (if desired), inexpensive, and more environmentally compatible than those currently used. These disposable containers and cups are particularly useful for dispensing hot and cold food and beverages in the fast food restaurant environment. The structural matrix of the food and beverage containers includes a hydraulic cement paste (formed from the reaction of water with, e.g., a portland-type cement) preferably in combination with a rheology-modifying plasticizer, such as methylhydroxyethylcellulose, various aggregate materials, and fibrous materials, which provide desired properties at a cost which is economical.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: January 6, 1998
    Assignee: E. Khashoggi Industries
    Inventors: Per Just Andersen, Simon K. Hodson
  • Patent number: 5702994
    Abstract: A a fastening device and/or shielding or insulating device in the form of a film 1 for parts, especially components, pipes or electric lines on a surface. The film 1 has at least two layers, which on one side exhibit at least two adhesive surfaces 5 placed at a distance to one another. In this way, the fastening device 1 or a thus designed adhesive strip can be used as the cable conduit 12.
    Type: Grant
    Filed: March 28, 1994
    Date of Patent: December 30, 1997
    Assignee: Besma Beschichtungsmassen GmbH
    Inventor: Egon Klosel
  • Patent number: 5700527
    Abstract: A sound absorbing glass building component or transparent synthetic glass building component is provided with holes penetrating through it and is disposed at a distance from a surface, such as a wall, ceiling, window or door. The glass building component is formed as a panel having microperforated holes having a diameter of 0.1-2.0 mm, the holes being spaced 2-20 mm apart and the panel having a thickness of 0.2-30 mm.
    Type: Grant
    Filed: November 13, 1995
    Date of Patent: December 23, 1997
    Assignee: Fraunhofer-Gesellschaft Zur Foerderung der Angewandten Forschung e.v.
    Inventors: Helmut Fuchs, Xuegin Zha
  • Patent number: 5698316
    Abstract: An electrically conductive bridge is formed over a non conductive joint between two or more adjacent electrically conductive panels. The bridge provides a continuous conductive path between the panels. In an exemplary embodiment, the panels form part of a shield against electromagnetic and/or lightning strike energy. The bridge is formed by taping an expanded conductive mesh over exposed conductive portions of the panels and applying an epoxy adhesive. During a following cure cycle, vacuum compression is applied. The expanded mesh of the bridge has an out-of-plane cross sectional configuration which remains in contact with the panel conductive portions during cure so that when the adhesive has cured, the bridge mesh and the panel conductive portions are held in contact with each other.
    Type: Grant
    Filed: October 7, 1996
    Date of Patent: December 16, 1997
    Assignee: The Boeing Company
    Inventors: John Charles Kuras, Nadine McClam-Brown
  • Patent number: 5691013
    Abstract: Glass tubing that utilizes silica-titania glass as material for the tubing. The tubing of the invention can be formed of a single layer of silica-titania glass or the tubing can be formed in layers, with an outer layer of silica-titania glass and an inner layer of silica glass. The tubing can also be formed with an inner layer of silica-titania glass covered by a layer of silica glass, or the tubing can be formed with three layers, an inner layer and an outer layer of silica-titania glass sandwiching a layer of silica glass. In all embodiments, the resulting tubing has improved mechanical strength or improved chemical durability or both making the tubing useful in a variety of medical and industrial applications.
    Type: Grant
    Filed: July 16, 1996
    Date of Patent: November 25, 1997
    Inventors: Abdelouahed Soufiane, Gerald J. Shirk
  • Patent number: 5691050
    Abstract: Unreinforced or reinforced concrete moldings, for example concrete pipes, with improved corrosion resistance to acids and acidic sewage, improved permeation resistance to inorganic and organic liquids and gases and improved mechanical stability, produced by molding with machines, for example in press molding machines or extrusion machines or concrete pipe pressing machines, and allowing to harden plastic-viscous concrete mixtures of hydraulic inorganic binders, preferably cement, aggregates and water, where, in the preparation of the plastic-viscous concrete mixtures, to the latter has been added in a positive mixer an effective amount of an aqueous plastics dispersion based on anionic and hydrolysis-resistant copolymers of ethylenically unsaturated monomers, the minimum film forming temperature (MFT) of which is above the setting temperature of the concrete mixture, preferably above 23.degree. C.
    Type: Grant
    Filed: May 25, 1995
    Date of Patent: November 25, 1997
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Volkmar Berg, Helmut Rinno
  • Patent number: 5681647
    Abstract: This self-supported, anisotropic conductive film has a partly annealed polymer layer (46) containing through holes, nail-shaped conductive elements (51) filling said through holes, having a central portion and ends, and the central portion of the nails is made from a hard material (52) and each end respectively of a first and a second meltable materials (44, 54).
    Type: Grant
    Filed: October 3, 1995
    Date of Patent: October 28, 1997
    Assignee: Commissariat a l'Energie Atomique
    Inventor: Patrice Caillat
  • Patent number: 5679444
    Abstract: A method for producing a panel of a multi-layer electronic circuit package and resulting article of manufacture is provided comprising the steps of coating a circuitized core material that has been cut into panels with a dielectric material and copper cover sheets; forming circuits from the cover sheets by etching; applying an adhesive polymer across the dielectric material covering the entire area of the panel; applying a cover sheet; drilling the panel to form through-holes and vias; seeding and plating the through-holes and vias with joining metal; applying photo-resist to the panels exposed with an image of the area of the panel to be joined and developed; and etching the cover sheet and the photo-resist away in the area of the panel to be joined to expose the adhesive polymer.
    Type: Grant
    Filed: July 15, 1996
    Date of Patent: October 21, 1997
    Assignee: International Business Machines Corporation
    Inventors: Charles Robert Davis, Thomas P. Gall
  • Patent number: 5679457
    Abstract: A mechanically conformable thermally conductive interface for use in electrically isolating and thermally connecting printed circuit boards to either beat sinks, metal chasses, or heat spreaders. The interface material utilizes silicone polymers of controlled molecular weight and a surface layer of a pressure sensitive adhesive may be employed. The silicone polymer is filled with a thermally conductive electrically insulative particulate such as alumina and/or boron nitride, with the silicone being prepared as a reaction product of a liquid organosiloxane together with a chain extender such as a hydride terminated polydimethylsiloxane material. A release film such as polyethylene may be utilized as the undersurface layer, if desired.
    Type: Grant
    Filed: March 18, 1996
    Date of Patent: October 21, 1997
    Assignee: The Bergquist Company
    Inventor: Steven E. Bergerson
  • Patent number: 5675956
    Abstract: A post and/or pole segment formed by filling a form with a composite mixture of a bonding agent and a filler material. The composite mixture is placed in a form in a fluid state and allowed to solidify. The form is retained as an integral member of the post and/or pole segment. The post and/or pole segments are arranged to be connected in an end to end arrangement to form a post or pole of extended length. The form and the composite mixture of the post and/or pole segment are of recycled material.
    Type: Grant
    Filed: May 29, 1996
    Date of Patent: October 14, 1997
    Inventor: Jerome F. Nevin
  • Patent number: 5674611
    Abstract: An adhesive for copper foils which comprises 40-70% by weight of an epoxy resin, 20-50% by weight of a polyvinyl acetal resin and 0.1-20% weight of a melamine or urethane resin, all of said resins totalling 100% by weight, with the proviso that 5-80% by weight of said epoxy resin is a rubber-modified epoxy resin; andAn adhesive-applied copper foil having said adhesive attached onto its one face.
    Type: Grant
    Filed: May 8, 1995
    Date of Patent: October 7, 1997
    Assignee: Mitsui Mining Smelting Co., Ltd.
    Inventors: Muneo Saida, Muneharu Ohara, Teturoh Satoh
  • Patent number: 5674610
    Abstract: Chromium is deposited on a surface using a coating tape having a source layer including a powdered source of chromium, a solid reactant that reacts with solid chromium at elevated temperature to produce a gaseous chromium-containing compound, an inert powder dispersed with the powdered source of chromium, and a binder. Preferably, a porous media layer including a porous media material and a binder is affixed to the source layer. The coating tape is positioned adjacent to the surface of the substrate, with the porous media layer, where present, in contact with the surface. The coating tape and substrate are placed into a container, and the container is heated to elevated temperature in a non-oxidizing atmosphere. The gaseous chromium-containing compound is produced and chromium is deposited from the gaseous chromium-containing compound onto the surface of the substrate.
    Type: Grant
    Filed: March 24, 1995
    Date of Patent: October 7, 1997
    Assignee: General Electric Company
    Inventors: Jon C. Schaeffer, Mark A. Rosenzweig, Warren D. Grossklaus, Jr., Robert J. Van Cleaf, Frederick S. Kaempf
  • Patent number: 5665473
    Abstract: A package for mounting a semiconductor device comprises a base plate and a conductive layer laminated onto the base plate via an adhesive layer. The modulus of elasticity at 25.degree. C. of the adhesive layer is 10 kg/mm.sup.2 or less.
    Type: Grant
    Filed: September 12, 1995
    Date of Patent: September 9, 1997
    Assignee: Tokuyama Corporation
    Inventors: Tokio Okoshi, Yuka Kato, Hideki Okoshi, Kenichiro Miyahara, Masakatsu Maeda