Next To Metal Patents (Class 428/344)
  • Patent number: 7166678
    Abstract: A torsional vibration damper or other vibration damping device with a rubber vibration absorbing element. The rubber element is a peroxide-cured composition comprising 100 parts of ethylene-alpha-olefin elastomer, and 20 to 100 parts of substantially isobutylene or butene polymer having a viscosity average molecular weight greater than about 5000. The polymer may also be a copolymer of isobutylene and isoprene. The addition of the isobutylene polymer to the ethylene-alpha-olefin elastomer composition increases the vibration damping character of the rubber.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: January 23, 2007
    Assignee: The Gates Corporation
    Inventors: Paul N. Dunlap, Bobbie E. South
  • Patent number: 7163598
    Abstract: An optical waveguide having a optical waveguide path capable of securing a high light propagation characteristic regardless of the type of a supporting base, provided with a multilayer circuit board, an optical waveguide path arranged on the multilayer circuit board, a light receiving element, IC chips, and a light emitting element, the optical waveguide path formed on a transparent substrate excellent in flatness and transferred to the multilayer circuit board. The light propagation loss becomes small, and a signal to be transmitted at a high speed being transmitted as a light signal and a signal which can be transmitted at a relatively low speed being transmitted as an electrical signal, whereby the signal propagation delay which becomes the problem when a signal is transmitted by only electrical wiring is overcome, and the influence of electromagnetic noise becomes small.
    Type: Grant
    Filed: November 21, 2002
    Date of Patent: January 16, 2007
    Assignee: Sony Corporation
    Inventors: Akihiko Okubora, Tsuyoshi Ogawa
  • Patent number: 7141768
    Abstract: A device for fastening surfaces together in an effective, efficient, and preferably reversible bond is disclosed. This device is particularly useful in the construction industry for fastening roll goods, such as wall coverings, or mill work, such as moldings, to surfaces, such as walls. The fastening device comprises a susceptor sheet, preferably having a thickness of no greater than about 2 mils, and a heat-activateable adhesive on at least one surface of the susceptor, wherein adhesive is placed on the substrate in a very carefully and specifically-defined manner. The fastening device is activated by induction heating, preferably by a hand-held induction tool. The method of fastening surfaces together utilizing the fastening device described above is also disclosed.
    Type: Grant
    Filed: April 24, 2001
    Date of Patent: November 28, 2006
    Assignee: Nexicor, LLC
    Inventors: Adam G. Malofsky, Bernard M. Malofsky, William H. Mann
  • Patent number: 7138172
    Abstract: A multilayer, metallizable, white opaque film suitable for use in forming metallized plastic labels for bottles and other containers includes at least a internal core layer and opposed outer skin layers. One of the outer skin layers is a non-voided layer having a surface treated to receive a metal layer thereon and the opposed outer skin layer includes an amount of a void creating additive to provide sufficient porosity for the absorption of an aqueous cold glue adhesive of the type employed to adhere a label to a container. Preferably the core layer is free of void creating additives and the opposed outer skin layer for receiving the cold glue adhesive is oxidatively treated, e.g., corona treated, to improve receptivity for the cold glue adhesive.
    Type: Grant
    Filed: February 7, 2001
    Date of Patent: November 21, 2006
    Assignee: Applied Extrusion Technologies, Inc.
    Inventor: Bruce S. Marks
  • Patent number: 7135088
    Abstract: The invention relates to a method of producing packaging material in the form of a continuous laminate web (17) and being of the type which includes a core layer (2) of paper or cardboard whose one face displays a layer (7) which is disposed outside the core layer (2) and includes first an aluminium foil (4) and secondly a plastic coating (16) disposed outside the aluminium foil layer. Throughout its entire surface, the core layer (2) is covered with the above-mentioned layer (7), while along selected portions it extends out over the edges of the core layer (2). The above-mentioned layer (7) is formed in that the aluminium foil (4) and at least one thermoplastic material (6) are laminated to one another by being brought together between two rollers (10, 12) of which the one roller consists of a cooled roller and the other roller consists of a roller which is heated to a temperature exceeding the melting temperature of the thermoplastic.
    Type: Grant
    Filed: January 21, 2004
    Date of Patent: November 14, 2006
    Assignee: Tetra Laval Holdings & Finance S.A.
    Inventor: Rolf Lasson
  • Patent number: 7107622
    Abstract: The disclosure describes vapor permeable retroreflective material for use on protective garments. The material may be formed in a non-continuous pattern that provides a high-level of retroreflective brightness, yet also provides adequate permeability to prevent exposure to trapped thermal energy and heated moisture. The non-continuous retroreflective pattern may include retroreflective regions and non-retroreflective regions arranged such that thermal decay through the protective garment is not substantially decreased in the regions corresponding to the retroreflective material. Rather, vapor permeation and thermal decay through the garment may be substantially the same as if the retroreflective material was not present.
    Type: Grant
    Filed: July 15, 2005
    Date of Patent: September 19, 2006
    Assignee: 3M Innovative Properties Company
    Inventors: Rino A. Feduzi, Robert L. Jensen, Jr., Jeanine M. Shusta
  • Patent number: 7101619
    Abstract: The present invention provides a laminate used for a printed wiring substrate and a multilayer printed wiring board which have high heat resistance, wiring patterns with narrow pitches, vias with a small diameter, insulating layer having uniform thickness and stable adhesion between the metal layer and the synthetic resin film, and which contribute to miniaturization, high capability and functional improvement of electronic equipment. The present invention relates to a metal laminate comprising a metal layer laminated on one or both faces of a synthetic resin film, wherein the metal layer is a metal foil having a thickness of at most 5 ?m.
    Type: Grant
    Filed: May 20, 2005
    Date of Patent: September 5, 2006
    Assignee: Kaneka Corporation
    Inventors: Masaru Nishinaka, Takashi Itoh, Kanji Shimo-Ohsako
  • Patent number: 7078095
    Abstract: An anisotropic conductive film includes a release layer, an insulating adhesive matrix on the release layer, and conductive particles distributed in the matrix in a substantially uniform pattern. The film may also include a patterned adhesive layer on the release layer, so that the particles are positioned in a pattern that substantially corresponds to the pattern of the patterned adhesive layer.
    Type: Grant
    Filed: July 7, 2004
    Date of Patent: July 18, 2006
    Assignee: Xerox Corporation
    Inventor: Man C. Tam
  • Patent number: 7060364
    Abstract: A film carrier tape for mounting electronic components or devices that excels in not only migration resistance but also adhesiveness of wiring to insulating film; and a process for producing the same. The film carrier tape for mounting electronic components or devices has seed layer comprising a zinc layer superimposed on a treated surface of insulating film and a nickel base metal layer superimposed on a surface of a zinc layer, or comprising a layer of alloy containing elemental nickel and elemental zinc in specified proportion, superimposed on a treated surface of insulating film). In the film carrier tape for mounting electronic components or devices, at least part of a region extending across a width of wiring from an edge side thereof to the treated surface of the insulating film may be continuously covered with a zinc coating layer comprising elemental zinc.
    Type: Grant
    Filed: December 23, 2003
    Date of Patent: June 13, 2006
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Tatsuo Kataoka, Yoshikazu Akashi
  • Patent number: 7056566
    Abstract: A thermal interface for facilitating heat transfer from an electronic component to a heat sink. According to a preferred embodiment, the thermal interface comprises a first planar substrate that defines a first continuous peripheral edge, at least a portion of which extends beyond the interface mating surface between the electronic component and heat sink. Formed upon opposed sides of the substrate are layers of thermally conductive compositions, which preferably comprise certain novel graphitic allotrope compounds. The thermal interface further includes an adhesive deposited upon such portion of the peripheral edge extending beyond the mating surface between the electronic component and heat sink such that the thermal interface may be adhesively secured into position without forming an additional layer at the mating juncture between the electronic component and the heat sink.
    Type: Grant
    Filed: August 19, 2003
    Date of Patent: June 6, 2006
    Assignee: Henkel Corporation
    Inventors: Raymond G. Freuler, Gary E. Flynn
  • Patent number: 7037586
    Abstract: The present invention relates to a film for a circuit board characterized in that the following A layer is adjacent to the following B layer is disclosed in the present application. A circuit board excellent in adhesion strength of a conductor layer can easily be produced by using this film. A layer: a heat-resistant resin layer with a thickness of from 2 to 250 ?m which layer is made of a heat-resistant resin having a glass transition point of 200° C. or more or a decomposition temperature of 300° C. or more, and B layer: a roughenable cured resin layer with a thickness of from 5 to 20 ?m which layer is made of a cured product of a thermosetting resin composition containing at least component (a) of an epoxy resin having two or more epoxy groups in a molecule and component (b) of an epoxy curing agent, the cured product being capable of roughening with an oxidizing agent.
    Type: Grant
    Filed: January 12, 2004
    Date of Patent: May 2, 2006
    Assignee: Ajinomoto Co., Inc.
    Inventors: Tadahiko Yokota, Shigeo Nakamura
  • Patent number: 7001662
    Abstract: A transfer sheet of the present invention includes a resin film having a glass transition temperature of not lower than 60° C., a silicone resin layer formed on the resin film, and a metal wiring pattern formed on the silicone resin layer. The metal wiring pattern has an exposed face that forms a roughened face, and the roughened face has a ten-point average surface roughness (Rz) of 2 ?m or more, while a face of the wiring pattern, which is in contact with the silicone resin layer, has a surface roughness (Rz) lower than that of the exposed face. Thereby, the present invention provides a transfer sheet that has improved transfer performance for enabling transferring at low temperature, and improved dimensional stability and also a via-connection reliability. The present invention provides also a wiring board using the transfer sheet and a method of manufacturing the same.
    Type: Grant
    Filed: March 18, 2004
    Date of Patent: February 21, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yasuhiro Sugaya, Hiroyuki Ishitomi, Seiichi Nakatani
  • Patent number: 6984456
    Abstract: There is provided a flexible printed wiring board including an insulating layer having a high optical transmittance, a high adhesion strength and a high migration resistance, and suitable for a chip on film (hereafter referred to as COF). In a flexible printed wiring board for COF, having an insulating layer on which a conductive layer of an electrodeposited copper foil is laminated, and an optical transmittance of 50% or more of the insulating layer in the etched region when a circuit is formed by etching said conductive layer, electrodeposited copper foil was made to have a rust-proofing layer of a nickel-zinc alloy on the adhering surface to be adhered to the insulating layer; the surface roughness (Rz) of the adhering surface was made to be 0.05 to 1.5 ?m, and the specular gloss was made to be 250 or more when the incident angle is 60°.
    Type: Grant
    Filed: May 12, 2003
    Date of Patent: January 10, 2006
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Kazuyuki Okada, Yasuji Hara, Akira Uchiyama, Masaru Takahashi
  • Patent number: 6974615
    Abstract: To easily connect a coaxial cable to electric connecting devices or a printed circuit board, to prevent the conductors of the cable from being disturbed, to secure the shielding performance of the signal line, and to enable connection of a very fine wire by means of an automatic machine, a binding member for a coaxial cable is formed into a tubular piece that is arranged to cover the outer conductor or the centered conductor which is exposed from the insulating covering of the cable. This binding member is made of a lead-free ultrahigh-conductive plastic resin composite. An electric connector for a coaxial cable has electric contacts, which each have a receiving port into which the binding member is inserted.
    Type: Grant
    Filed: April 1, 2002
    Date of Patent: December 13, 2005
    Assignee: J.S.T. Mfg. Co., Ltd.
    Inventors: Taiji Hosaka, Masaaki Miyazawa
  • Patent number: 6971829
    Abstract: A fastening device, which will facilitate the assembly of associated parts or manufactured articles, and electromagnetic energy absorptive component for absorbing electromagnetic waves and converting wave energy to heat; an expansive component, which expands upon exposure to heat emanating from the target material; matrix material, which will become adhesively active and effect the adherence of the associated parts upon exposure to heat emanating from the target material, and a stiffening component.
    Type: Grant
    Filed: April 2, 2003
    Date of Patent: December 6, 2005
    Assignee: Senco Products, Inc
    Inventors: Duane C. Shomler, David L. Remerowski, Anthony T. Racca, David J. Lococo
  • Patent number: 6955849
    Abstract: A method for producing small pitch z-axis electrical interconnections in layers of dielectric materials which are applied to printed wiring boards and diverse electronic packages. A method for parallel fabrication of intermediate structures which are subsequently jointed to form a final structure. In addition there is provided a z-interconnected electrical structure, employing dielectric materials such as resin coated copper, employable in the manufacture of diverse type of electronic packages, including printed wiring boards (PWBs), substrates, multi-chip modules and the like.
    Type: Grant
    Filed: May 26, 2004
    Date of Patent: October 18, 2005
    Assignee: International Business Machines Corporation
    Inventors: Brian E. Curcio, Frank D. Egitto, Robert M. Japp, Thomas R. Miller, Manh-Quan T. Nguyen, Douglas O. Powell
  • Patent number: 6936336
    Abstract: A transfer sheet for use in forming a conductor circuit comprises a base and a metal layer formed into a circuit pattern on the base. The metal layer is transferred onto a surface of an insulation layer. At least part of the circuit pattern of the metal layer is formed by laser-processing. Since it is possible, without using an etching process and a plating process at a minute part of the conductor circuit, to remove the metal layer by emitting laser light having a minute beam diameter, it is possible to form a minute conductor circuit which is 50 ?m or less in width and pitch, with the result that it is prevented that the conductor circuit has a break because of excessive etching and a failure of plating deposition or the conductor circuit is short-circuited because of the residue of etching and a short of plating.
    Type: Grant
    Filed: March 14, 2003
    Date of Patent: August 30, 2005
    Assignee: Kyocera Corporation
    Inventors: Takahiro Matsunaga, Katsura Hayashi
  • Patent number: 6933059
    Abstract: A film material for use in packaging electrostatically sensitive components and corrosion sensitive components. The film material includes a static dissipative polymer attached to a first moisture barrier which in turn is attached to a second moisture barrier. The second moisture barrier has a low charge retaining coating. The first and second moisture barriers are separated by dielectric. Moisture barriers are formed by either a metal foil, or a metallized polymer in which the metallization thickness is at least 178 Angstroms thick. The metal of the second moisture barrier is in contact with the low charge retaining coating. The low charge retaining coating together with the metal in the second moisture barrier has a surface conductivity between 10?3 and 10?7 Siemens.
    Type: Grant
    Filed: May 7, 1999
    Date of Patent: August 23, 2005
    Assignee: SCC Products, Inc.
    Inventor: Brent Beamer
  • Patent number: 6931665
    Abstract: The disclosure describes vapor permeable retroreflective material for use on protective garments. The material may be formed in a non-continuous pattern that provides a high-level of retroreflective brightness, yet also provides adequate permeability to prevent exposure to trapped thermal energy and heated moisture. The non-continuous retroreflective pattern may include retroreflective regions and non-retroreflective regions arranged such that thermal decay through the protective garment is not substantially decreased in the regions corresponding to the retroreflective material. Rather, vapor permeation and thermal decay through the garment may be substantially the same as if the retroreflective material was not present.
    Type: Grant
    Filed: July 30, 2001
    Date of Patent: August 23, 2005
    Assignee: 3M Innovative Properties Company
    Inventors: Rino A. Feduzi, Robert L. Jensen, Jr., Jeanine M. Shusta
  • Patent number: 6911265
    Abstract: The present invention provides a laminate used for a printed wiring substrate and a multilayer printed wiring board which have high heat resistance, wiring patterns with narrow pitches, vias with a small diameter, insulating layer having uniform thickness and stable adhesion between the metal layer and the synthetic resin film, and which contribute to miniaturization, high capability and functional improvement of electronic equipment. The present invention relates to a metal laminate comprising a metal layer laminated on one or both faces of a synthetic resin film, wherein the metal layer is a metal foil having a thickness of at most 5 ?m.
    Type: Grant
    Filed: October 26, 2001
    Date of Patent: June 28, 2005
    Assignee: Kaneka Corporation
    Inventors: Masaru Nishinaka, Takashi Itoh, Kanji Shimo-Ohsako
  • Patent number: 6881476
    Abstract: An adhesive security tape comprises a polymer film whose refractive index and/or interface structure can be changed locally by heating. Disposed below the polymer film is an absorber layer comprising an absorber dye set up at least partly to absorb a write beam directed onto the absorber layer, to emit at least some of the generated heat to the polymer film locally, and in doing so to undergo local change itself. Below the absorber layer there is an adhesive layer. The adhesion between the adhesive layer and the absorber layer is greater than the adhesion to the polymer film. There is preferably a partly transparent reflection layer between the polymer film and the absorber layer.
    Type: Grant
    Filed: July 24, 2002
    Date of Patent: April 19, 2005
    Assignee: tesa scribos, GmbH
    Inventors: Steffen Noehte, Matthias Gerspach, Christoph Dietrich, Annouschka Blazejewski, Stefan Stadler
  • Patent number: 6861140
    Abstract: A binding element including a metal sheet and an intermediate layer secured to the metal sheet. A first glue adheres a first surface of the intermediate layer to the metal sheet, and has a predetermined melting temperature. A second glue is provided on a second surface of the intermediate layer opposite the first surface, and has predetermined melting temperature. The melting temperature of the first glue is higher than the melting temperature of the second glue.
    Type: Grant
    Filed: June 27, 2001
    Date of Patent: March 1, 2005
    Assignee: Unibind (Cyprus) Limited
    Inventor: Guido Frans Maria Jozef Peleman
  • Patent number: 6861092
    Abstract: A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a fluoropolymer composite substrate and a thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.
    Type: Grant
    Filed: November 7, 2002
    Date of Patent: March 1, 2005
    Assignee: Tonoga, Inc.
    Inventors: Thomas F. McCarthy, David L. Wynants, Sr.
  • Patent number: 6841605
    Abstract: Disclosed are an adhesive composition for a metal foil which comprises a material wherein a tracking resistance test is carried out according to the IEC method by making a thickness of an adhesive layer 30 to 40 ?m, using a copper foil pattern with a width of 4 mm and making a distance between electrodes 0.4 mm, then the adhesive layer dissolves out for the first time when 5 drops or more of an electrolyte are dropped thereon, an adhesive-coated metal foil, a metal-clad laminate, a wiring board, a multi-layer board and a multi-layer wiring board using the same.
    Type: Grant
    Filed: September 24, 1999
    Date of Patent: January 11, 2005
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Toshihisa Kumakura, Takeshi Horiuchi, Kazuyuki Magome, Norifumi Shiraishi
  • Patent number: 6835453
    Abstract: A laminar, thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermally-conductive pathway therebetween. The interface includes a first layer formed of a flexible, lamellar graphite or tin foil material, and a second layer formed of a thermally-conductive phase-change material.
    Type: Grant
    Filed: January 14, 2002
    Date of Patent: December 28, 2004
    Assignee: Parker-Hannifin Corporation
    Inventors: Alfred W. Greenwood, Michael H. Bunyan, Kent M. Young, Deanna J. Wright
  • Patent number: 6811883
    Abstract: Auto-adhesive display film comprising at least one electrically charged, dielectric layer (2). A screen layer (3), which is adapted to form a barrier to the electric field, is fixed to one surface of the dielectric layer (2). This display support does not attract dust particles and is specifically adapted to be printed sheet by sheet.
    Type: Grant
    Filed: May 6, 2003
    Date of Patent: November 2, 2004
    Assignee: JLJ
    Inventors: Jacques Lewiner, Jean Lionel Georges Martin
  • Patent number: 6808587
    Abstract: A self-adhesive article for mechanical protection of painted plastic mounted parts of automobiles, comprising a backing material in film form whose outer side is laminated with a layer of knitted fabric and whose inner side is pressure-sensitively adhesive through application of a self-adhesive composition.
    Type: Grant
    Filed: February 15, 2002
    Date of Patent: October 26, 2004
    Assignee: tesa AG
    Inventors: Nicolai Böhm, Ulrike Wappler, Jobst-Waldemar Klemp, Ingolf Schütz
  • Patent number: 6800352
    Abstract: The present invention provides a product that includes (a) a wood-based composite panel having a pair of outer surfaces; and (b) a radiant barrier material having a pair of outer surfaces, wherein at least a portion of an outer surface of the radiant barrier material is adhered to at least a portion of an outer surface of the wood-based composite panel; wherein the radiant barrier material that includes apertures such that the apertures are present in about 49 apertures per square inch of radiant barrier material or less, inclusive. The invention also includes methods for manufacturing such product.
    Type: Grant
    Filed: June 5, 2002
    Date of Patent: October 5, 2004
    Assignee: Potlach Corporation
    Inventors: Donald J. Hejna, Stephen B. Bailey, Michael C. Wagner, Thomas G. Herion
  • Patent number: 6797376
    Abstract: The present invention provides a metallic member reinforcing epoxy-based adhesive coating. The epoxy-based adhesive coating including a first epoxy material containing approximately 25% solids by weight and a second curative material containing about 32% solids by weight. According to one aspect of the present invention, the first epoxy offered suitably includes about 3% to about 35% liquid Diglycidylether of Bisphenol-A, about 35% to about 60% solid Diglycidylether of Bisphenol-A, about 10% to about 30% Novolac-Epoxy, and about 5% to about 18% Solid Carboxy—Terminated Acrylonitrile—Butadiene Rubber, and the second curative material suitably includes about 0% to about 100% 4,4′-Diaminodiphenylsulfone, about 0% to about 100% 3,3′-Diaminodiphenylsulfone, and about 0% to about 0.2% Chromium octoate.
    Type: Grant
    Filed: May 9, 2002
    Date of Patent: September 28, 2004
    Assignee: The Boeing Company
    Inventors: Robert A. Anderson, William B. H. Grace, Stephen R. Barnes, Matthew S. Tillman, Kay Y. Blohowiak
  • Patent number: 6794030
    Abstract: The invention is directed toward a heat conductive sheet that has flexibility, can follow a specific shape such as ruggedness and curvature, which can therefore insure high adhesion and, at the same time, excellent heat releasing property, is free from the occurrence of wrinkle and rupture or elongation, even when the thickness is decreased, and is excellent in formability of sheet formation and in bonding work. Such heat conductive sheet includes a substrate and a heat conductive resin layer applied to at least one surface of the substrate, wherein the heat conductive resin layer is constituted as to contain a binder resin and a heat conductive filler dispersed in the binder resin.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: September 21, 2004
    Assignee: 3M Innovative Properties Company
    Inventors: Mitsuhiko Okada, Tomoaki Uchiya
  • Patent number: 6790520
    Abstract: The present invention provides a vibration dampening laminate that is lightweight and has superior sound insulation and vibration dampening properties. The vibration dampening laminate comprises a constraining layer, a viscoelastic adhesive layer, a foam spacing layer and a pressure sensitive adhesive layer including a release layer. The pressure sensitive adhesive layer and release layer are contoured to fit a profile of the article being soundproofed and vibration dampened.
    Type: Grant
    Filed: July 20, 2000
    Date of Patent: September 14, 2004
    Assignee: Collins & Aikman Products Co.
    Inventors: John Todd, Robert S. Boyd, Melvyn J. Care
  • Patent number: 6783841
    Abstract: A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a reinforced fluoropolymer composite and a high-flowing thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.
    Type: Grant
    Filed: May 29, 2003
    Date of Patent: August 31, 2004
    Assignee: Tonoga, Inc.
    Inventors: Thomas F. McCarthy, David L. Wynants, Sr.
  • Publication number: 20040131844
    Abstract: A sealant composition having improved coat adhesion to the coat. A sealant composition comprising a low hygroscopic resin and a metallic powder. A sealant having a flat shape selected from the group consisting of sheet, tape and strap, comprising the sealant composition. A laminated structure comprising steel sheets forming a joint, a sealant which seals the joint on the steel sheets, and a coat on the sealant.
    Type: Application
    Filed: October 20, 2003
    Publication date: July 8, 2004
    Inventor: Kotaro Shinozaki
  • Publication number: 20040131847
    Abstract: The present invention relates to a film (10) for the decoration of a surface (100) by hot marking, in particular a surface made of glass or metal, the film comprising a first layer (11) of a heat-sensitive adhesive intended to be brought in contact with the said surface, a second layer (12) of a material suitable for forming the said decoration, a protective support (13) fixed on the second layer via a layer (14) of a heat-sensitive material, characterised in that the film comprises at least one first compound (20) capable of chemically reacting in a humid environment with at least one second compound of the said surface (10) so as to promote the adhesion of the film when it is applied to the said surface.
    Type: Application
    Filed: February 11, 2004
    Publication date: July 8, 2004
    Inventor: Alain Bethune
  • Publication number: 20040109995
    Abstract: It is an object of the invention to provide coated particles excellent in the reliability of connection.
    Type: Application
    Filed: June 19, 2003
    Publication date: June 10, 2004
    Inventors: Takeshi Wakiya, Takeharu Morita, Hiroshi Hiraike, Katsutoshi Nagai, Tatsuo Taniguchi
  • Patent number: 6720065
    Abstract: A laminated structure having a film composite overlying a substrate sheet, used as a decorative panel for appliances and motor vehicles. The laminated structure has high distinctness of image in both the machine direction and the transverse direction, and a ratio of these approaching 1.0.
    Type: Grant
    Filed: May 29, 2003
    Date of Patent: April 13, 2004
    Assignee: DuPont Teijin Films U.S. Limited Partnership
    Inventor: Steven R. Cosentino
  • Publication number: 20040038025
    Abstract: Highly heat-resistant labels usable with the adherends which can be exposed to high temperatures are provided.
    Type: Application
    Filed: June 10, 2003
    Publication date: February 26, 2004
    Inventors: Shino Matsumi, Takanari Yamaguchi, Hiroaki Kumada, Masaru Kijima, Shinji Kinoshita, Koji Age
  • Publication number: 20040028881
    Abstract: A hardcoat for a plastic substrate film is provided which has good suitability for printing and satisfactory hardness, can prevent influence of the deformation of a plastic substrate film from extending to the hardcoat, and is resistant to cracking and peeling. The hardcoat is produced from a coating component containing one or more organic components having a polymerizable functional group and an inorganic filler, at least one of the organic components being free from a hydrogen bond-forming group. In the hard coat, the content of the inorganic filler in the surface of the hardcoat is higher than that in the interior of the hardcoat. The hardcoat can be applied to antireflection films and hologram labels.
    Type: Application
    Filed: August 12, 2003
    Publication date: February 12, 2004
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Toshio Yoshihara, Yurie Ota, Nobuko Takahashi, Noboru Kunimine, Satoshi Shioda, Mikiko Hojo
  • Publication number: 20040001949
    Abstract: A protective film contains a base material and a pressure-sensitive adhesive layer formed thereon, wherein the surface of the pressure-sensitive adhesive layer has a contact angle with methylene iodide as measured just after contact, &thgr;1, of 70° or smaller and a change in contact angle with methylene iodide through 30-second standing, &Dgr;&thgr;, of 8% or less.
    Type: Application
    Filed: June 4, 2003
    Publication date: January 1, 2004
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tsuyoshi Inoue, Kazuhito Okumura, Hiroshi Yada
  • Publication number: 20030224161
    Abstract: A flexible imaging belt seam treatment article comprising a high-temperature-resistant flexible substrate that supports a thermoplastic polymer film. The film is deposited on the flexible substrate by dissolution of a film-forming thermoplastic polymer in a carrier solvent, applying the resulting solution to the flexible substrate, and eliminating the carrier solvent. The article can then be used to treat a seam of a flexible imaging belt by placing it on the seam, heating the strip and seam, and applying pressure to the strip and seam.
    Type: Application
    Filed: May 30, 2002
    Publication date: December 4, 2003
    Applicant: Xerox Corporation
    Inventor: Robert C.U. Yu
  • Patent number: 6645589
    Abstract: The present invention provides a white biaxially oriented polyester film having a two-layer structure of layer A/layer B, wherein the layer A contains a polyester having a melting point of 240° C.-260° C. and containing titanium dioxide in a proportion of 5-30 wt %, the layer B contains a polyester having a melting point of 210° C.-235° C., and the film shows a dimensional change of not more than 2%, which is obtained by thermally adhering a layer B side of the film to a metal plate to give a laminate, which is heat-treated at 210° C. for 2 minutes, and subjecting the film after the treatment to the measurement, a film-laminated metal plate using the polyester film and a metal container obtained by forming this film-laminated metal plate. The polyester film of the present invention has superior heat resistance and is capable of stably covering the surface of a metal plate even after a heat treatment during a can forming process and the like.
    Type: Grant
    Filed: September 12, 2001
    Date of Patent: November 11, 2003
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Shingo Fujii, Hideki Igushi, Hiroshi Nagano
  • Patent number: 6638606
    Abstract: A hardcoat for a plastic substrate film is provided which has good suitability for printing and satisfactory hardness, can prevent influence of the deformation of a plastic substrate film from extending to the hardcoat, and is resistant to cracking and peeling. The hardcoat is produced from a coating component containing one or more organic components having a polymerizable functional group and an inorganic filler, at least one of the organic components being free from a hydrogen bond-forming group. In the hard coat, the content of the inorganic filler in the surface of the hardcoat is higher than that in the interior of the hardcoat. The hardcoat can be applied to antireflection films and hologram labels.
    Type: Grant
    Filed: January 16, 2002
    Date of Patent: October 28, 2003
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Toshio Yoshihara, Yurie Ota, Nobuko Takahashi, Noboru Kunimine, Satoshi Shioda, Mikiko Hojo
  • Patent number: 6638607
    Abstract: A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one opening is formed through the substrate extending from one face to the other and through each adhesive tape. An electrically conductive material is dispensed in each of the openings and partially cured. The adhesive tape is removed to allow a nub of the conductive material to extend above the substrate face to form a wiring structure with other elements.
    Type: Grant
    Filed: October 30, 2002
    Date of Patent: October 28, 2003
    Assignee: International Business Machines Corporation
    Inventors: Brian E. Curcio, Donald S. Farquhar, Lisa J. Jimarez, Keith P. Brodock
  • Patent number: 6632538
    Abstract: A battery packet (50) comprises a battery case (51) formed by processing a battery case forming laminated sheet (10), a battery 50a contained in the battery case (51), and tabs (59, 60) extending outside from the battery case (51). The battery case forming laminated sheet (10) is formed by laminating a first base film layer (1a), i.e., an outermost layer, a metal foil layer (2), and a heat-adhesive resin layer (3) in that order. The first base film layer (1a) is a biaxially oriented polyethylene terephthalate resin film or a biaxially oriented nylon resin film. The metal foil layer (2) is an aluminum or copper foil. The heat-adhesive resin layer (3) is formed of a polyolefin resin, more preferably, of an acid-denatured polyolefin resin.
    Type: Grant
    Filed: December 13, 1999
    Date of Patent: October 14, 2003
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Takuya Yamazaki, Kiyoshi Oguchi, Koji Shimizu, Kenichiro Suto, Tsutomu Yoshinaka, Hideki Kurokawa, Hitoshi Sekino, Masahiro Yoshikawa, Hiroshi Miyama, Katsuhiko Hayashi, Jun Fukuda
  • Publication number: 20030190466
    Abstract: An adhesive sheet for producing semiconductor devices, such as QFNs, can prevent the generation both of wire-bonding defects and mold flashes, and can thereby prevent the production of defective semiconductor devices. The present invention provides an adhesive sheet for producing semiconductor devices which is detachably attached to a lead frame and which comprises a heat resistant substrate and an adhesive layer which is arranged on one surface of the heat resistant substrate, wherein the adhesive layer contains, a thermosetting resin component (a) and a thermoplastic resin component (b); and the weight ratio of the component (a)/the component (b) is 0.3 to 3.
    Type: Application
    Filed: April 2, 2003
    Publication date: October 9, 2003
    Inventors: Katsuji Nakaba, Toshihiro Nakajima, Takeshi Sato, Osamu Oka
  • Publication number: 20030180531
    Abstract: The invention relates to a pressure sensitive adhesive (PSA) tape and to a process for crosslinking PSA on backing materials which are more resistant to electron beams. The process is distinguished by a backing material which has been modified with one or more very thin layers of one or more conductive materials. During EB crosslinking the accelerated electrons penetrate the adhesive and the backing material and are dispersed over the entire backing material, or braked, at the electrically conductive layer. The damage to the backing which occurs at high EB doses is thereby minimized.
    Type: Application
    Filed: January 8, 2003
    Publication date: September 25, 2003
    Applicant: tesa AG
    Inventors: Marc Husemann, Stephan Zollner, Reinhard Storbeck
  • Patent number: 6616999
    Abstract: A thermal interface for facilitating heat transfer from an electronic component to a heat sink. According to a preferred embodiment, the thermal interface comprises a first planar substrate that defines a first continuous peripheral edge, at least a portion of which extends beyond the interface mating surface between the electronic component and heat sink. Formed upon opposed sides, of the substrate are layers of thermally conductive compositions, which preferably comprise certain novel graphitic allotrope compounds. The thermal interface further includes an adhesive deposited upon such portion of the peripheral edge extending beyond the mating surface between the electronic component and heat sink such that the thermal interface may be adhesively secured into position without forming an additional layer at the mating juncture between the electronic component and the heat sink.
    Type: Grant
    Filed: May 17, 2000
    Date of Patent: September 9, 2003
    Inventors: Raymond G. Freuler, Gary E. Flynn
  • Patent number: 6613870
    Abstract: Acrylate hot melt-based self-adhesive composition, characterized by K value of at least 60, in particular 65-80, and obtainable by concentrating or devolatilizing a solution of such a composition in a devolatilizing extruder to give a system which can be processed as a hot melt.
    Type: Grant
    Filed: April 24, 1997
    Date of Patent: September 2, 2003
    Assignee: tesa AG
    Inventors: Christian Harder, Andreas B. Kummer, Klaus Biethahn, Robert Tiburg
  • Patent number: 6607815
    Abstract: The invention describes a biaxially oriented polyester film with at least one base layer B, with at least one metal-adherent outer layer A, and preferably with another outer layer C, the metal-adherent outer layer A having a metal adhesion of at least 4 N/25 mm wherein the metal adherent layer consists essentially of an amorphous copolyester comprising ethylene terephthalate and ethylene isophthalate units.
    Type: Grant
    Filed: July 18, 2001
    Date of Patent: August 19, 2003
    Assignee: Mitsubishi Polyester Film GmbH
    Inventors: Stefan Bartsch, Herbert Peiffer
  • Patent number: 6607825
    Abstract: As a technique capable of stably providing various metal film adhered bodies for printed circuit boards having an excellent peel strength even in the wiring having higher density and higher pattern accuracy and other industrial parts, there are provided adhesive, adhesive layer and metal film adhered body in which a mixed resin consisting of a thermoplastic resin and an uncured thermosetting resin including a resin substituted at a part of its functional group with a photosensitive group and/or an uncured photosensitive resin is used as a heat-resistant resin matrix constituting the adhesive and further a cured homogeneous resin composite forming a quasi-homogeneous compatible structure, co-continuous phase structure or spherical domain structure is used as a heat-resistant resin matrix of the adhesive layer.
    Type: Grant
    Filed: August 22, 1997
    Date of Patent: August 19, 2003
    Assignee: Ibiden Co., Ltd.
    Inventors: Dong Dong Wang, Motoo Asai