Abstract: A circuit material, comprising a conductive metal layer or a dielectric circuit substrate layer and an adhesive layer disposed on the conductive metal layer or the dielectric substrate layer, wherein the adhesive comprises a poly(arylene ether) and a polybutadiene or polyisoprene polymer.

Abstract: The present invention provides a structure. The structure includes a stack of sheets. Successive sheets in each pair of successive sheets of the stack are coupled to each other by a removable adhesive. The removable adhesive is also disposed on top and bottom surfaces of the stack so as to respectively couple first and second layers to the cop and bottom surfaces of the stack.

Abstract: A first conductive film is formed on a wiring pattern area on a plate by dropping liquid drops. A second conductive film which is electrically separated from the first conductive film is formed by discharging liquid drops outside of the wiring pattern area on the plate.

Abstract: A device for shaping and contouring a fabric or the like in sewing and handicraft projects. In one configuration, the device includes a strip of solid and ductile metal that is configured to be directly adhered to a fabric surface. At lease one layer of acrylic pressure-sensitive adhesive is formed on a bonding of the metal. The shaping device can be bent into various contours and is strong enough to cause material such as tapestry or balsa wood to assume the contours of the shaping device.

Abstract: An electromagnetic shielding (EMS) tape is provided. The EMS tape comprises a conductive backing film; and a thermosetting resin layer coated on the conductive backing film. The conductive backing film comprises aluminum foil. The thermosetting resin layer comprises modified carboxylated NBR, dimer acid-modified thermosetting epoxy resins and heat-resistive acrylic resins.

Abstract: A method of plating a substrate including coating a substrate surface, laser-treating a region of the coated surface, and plating the region.

Abstract: A pressure-sensitive adhesive sheet for steel plates, which comprises a backing and a resin layer, wherein the backing comprises a resin-coated glass cloth obtainable by coating a glass cloth with a resin emulsion (A) followed by coating with a resin emulsion (B) which is different from the resin emulsion (A).

Abstract: A wiring transfer sheet including a carrier base and a wiring layer formed thereon is produced so that an exposed area of a surface of the carrier base on which the wiring layer is formed has a plurality of concavities. By transferring the wiring layer to an electrically insulating substrate with this wiring transfer sheet, convexities which are complementary to the concavities are formed on the electrically insulating substrate. The convexities improve adhesion between a wiring board and a resin stacked thereon. Therefore, the wiring board thus obtained has surface coplanarity suitable for mounting a semiconductor bare chip and an electronic component as a whole, and a microscopical surface structure which adheres to a material stacked thereon.

Abstract: A multilayer structure comprising a conductor layer, an adhesive layer, and a polymer film layer interposed between the conductor layer and the adhesive layer. The multilayer structure can be used to provide a multilayer wiring board having excellent electrical properties and an excellent balance of physical properties, high heat resistance, a narrow pitch wiring pattern, a small-diameter via, uniform insulating layer thickness, an appropriately low coefficient of linear expansion, and stable adhesiveness between a metal and the polymer film. The polymer film layer may contain at least one repeating unit represented by formula (1) in the molecule. The present invention also provides a multilayer wiring board obtained from the multilayer structure.

Abstract: A dicing adhesive sheet having a base film and an adhesive layer formed on the base film is characterized in that the thickness of the adhesive layer ranges from 1 to 10 ?m and the adhesive layer has an sticking temperature such that the adhesion measured when 180° peeling at 23° C. of the dicing sheet is conducted (the peeling rate is 300 mm/min) after it is applied to a silicon mirror wafer is 10 N/25 mm or more. In a dicing method using such a dicing adhesive sheet, the production yield of a diced body such as a semiconductor wafer is high, and chipping the dicing is prevented.

Abstract: A torsional vibration damper or other vibration damping device with a rubber vibration absorbing element. The rubber element is a peroxide-cured composition comprising 100 parts of ethylene-alpha-olefin elastomer, and 20 to 100 parts of substantially isobutylene or butene polymer having a viscosity average molecular weight greater than about 5000. The polymer may also be a copolymer of isobutylene and isoprene. The addition of the isobutylene polymer to the ethylene-alpha-olefin elastomer composition increases the vibration damping character of the rubber.

Abstract: An optical waveguide having a optical waveguide path capable of securing a high light propagation characteristic regardless of the type of a supporting base, provided with a multilayer circuit board, an optical waveguide path arranged on the multilayer circuit board, a light receiving element, IC chips, and a light emitting element, the optical waveguide path formed on a transparent substrate excellent in flatness and transferred to the multilayer circuit board. The light propagation loss becomes small, and a signal to be transmitted at a high speed being transmitted as a light signal and a signal which can be transmitted at a relatively low speed being transmitted as an electrical signal, whereby the signal propagation delay which becomes the problem when a signal is transmitted by only electrical wiring is overcome, and the influence of electromagnetic noise becomes small.

Abstract: A device for fastening surfaces together in an effective, efficient, and preferably reversible bond is disclosed. This device is particularly useful in the construction industry for fastening roll goods, such as wall coverings, or mill work, such as moldings, to surfaces, such as walls. The fastening device comprises a susceptor sheet, preferably having a thickness of no greater than about 2 mils, and a heat-activateable adhesive on at least one surface of the susceptor, wherein adhesive is placed on the substrate in a very carefully and specifically-defined manner. The fastening device is activated by induction heating, preferably by a hand-held induction tool. The method of fastening surfaces together utilizing the fastening device described above is also disclosed.

Abstract: A multilayer, metallizable, white opaque film suitable for use in forming metallized plastic labels for bottles and other containers includes at least a internal core layer and opposed outer skin layers. One of the outer skin layers is a non-voided layer having a surface treated to receive a metal layer thereon and the opposed outer skin layer includes an amount of a void creating additive to provide sufficient porosity for the absorption of an aqueous cold glue adhesive of the type employed to adhere a label to a container. Preferably the core layer is free of void creating additives and the opposed outer skin layer for receiving the cold glue adhesive is oxidatively treated, e.g., corona treated, to improve receptivity for the cold glue adhesive.

Abstract: The invention relates to a method of producing packaging material in the form of a continuous laminate web (17) and being of the type which includes a core layer (2) of paper or cardboard whose one face displays a layer (7) which is disposed outside the core layer (2) and includes first an aluminium foil (4) and secondly a plastic coating (16) disposed outside the aluminium foil layer. Throughout its entire surface, the core layer (2) is covered with the above-mentioned layer (7), while along selected portions it extends out over the edges of the core layer (2). The above-mentioned layer (7) is formed in that the aluminium foil (4) and at least one thermoplastic material (6) are laminated to one another by being brought together between two rollers (10, 12) of which the one roller consists of a cooled roller and the other roller consists of a roller which is heated to a temperature exceeding the melting temperature of the thermoplastic.

Abstract: The disclosure describes vapor permeable retroreflective material for use on protective garments. The material may be formed in a non-continuous pattern that provides a high-level of retroreflective brightness, yet also provides adequate permeability to prevent exposure to trapped thermal energy and heated moisture. The non-continuous retroreflective pattern may include retroreflective regions and non-retroreflective regions arranged such that thermal decay through the protective garment is not substantially decreased in the regions corresponding to the retroreflective material. Rather, vapor permeation and thermal decay through the garment may be substantially the same as if the retroreflective material was not present.

Abstract: The present invention provides a laminate used for a printed wiring substrate and a multilayer printed wiring board which have high heat resistance, wiring patterns with narrow pitches, vias with a small diameter, insulating layer having uniform thickness and stable adhesion between the metal layer and the synthetic resin film, and which contribute to miniaturization, high capability and functional improvement of electronic equipment. The present invention relates to a metal laminate comprising a metal layer laminated on one or both faces of a synthetic resin film, wherein the metal layer is a metal foil having a thickness of at most 5 ?m.

Abstract: An anisotropic conductive film includes a release layer, an insulating adhesive matrix on the release layer, and conductive particles distributed in the matrix in a substantially uniform pattern. The film may also include a patterned adhesive layer on the release layer, so that the particles are positioned in a pattern that substantially corresponds to the pattern of the patterned adhesive layer.

Abstract: A film carrier tape for mounting electronic components or devices that excels in not only migration resistance but also adhesiveness of wiring to insulating film; and a process for producing the same. The film carrier tape for mounting electronic components or devices has seed layer comprising a zinc layer superimposed on a treated surface of insulating film and a nickel base metal layer superimposed on a surface of a zinc layer, or comprising a layer of alloy containing elemental nickel and elemental zinc in specified proportion, superimposed on a treated surface of insulating film). In the film carrier tape for mounting electronic components or devices, at least part of a region extending across a width of wiring from an edge side thereof to the treated surface of the insulating film may be continuously covered with a zinc coating layer comprising elemental zinc.

Abstract: A thermal interface for facilitating heat transfer from an electronic component to a heat sink. According to a preferred embodiment, the thermal interface comprises a first planar substrate that defines a first continuous peripheral edge, at least a portion of which extends beyond the interface mating surface between the electronic component and heat sink. Formed upon opposed sides of the substrate are layers of thermally conductive compositions, which preferably comprise certain novel graphitic allotrope compounds. The thermal interface further includes an adhesive deposited upon such portion of the peripheral edge extending beyond the mating surface between the electronic component and heat sink such that the thermal interface may be adhesively secured into position without forming an additional layer at the mating juncture between the electronic component and the heat sink.

Abstract: The present invention relates to a film for a circuit board characterized in that the following A layer is adjacent to the following B layer is disclosed in the present application. A circuit board excellent in adhesion strength of a conductor layer can easily be produced by using this film. A layer: a heat-resistant resin layer with a thickness of from 2 to 250 ?m which layer is made of a heat-resistant resin having a glass transition point of 200° C. or more or a decomposition temperature of 300° C. or more, and B layer: a roughenable cured resin layer with a thickness of from 5 to 20 ?m which layer is made of a cured product of a thermosetting resin composition containing at least component (a) of an epoxy resin having two or more epoxy groups in a molecule and component (b) of an epoxy curing agent, the cured product being capable of roughening with an oxidizing agent.

Abstract: A transfer sheet of the present invention includes a resin film having a glass transition temperature of not lower than 60° C., a silicone resin layer formed on the resin film, and a metal wiring pattern formed on the silicone resin layer. The metal wiring pattern has an exposed face that forms a roughened face, and the roughened face has a ten-point average surface roughness (Rz) of 2 ?m or more, while a face of the wiring pattern, which is in contact with the silicone resin layer, has a surface roughness (Rz) lower than that of the exposed face. Thereby, the present invention provides a transfer sheet that has improved transfer performance for enabling transferring at low temperature, and improved dimensional stability and also a via-connection reliability. The present invention provides also a wiring board using the transfer sheet and a method of manufacturing the same.

Abstract: There is provided a flexible printed wiring board including an insulating layer having a high optical transmittance, a high adhesion strength and a high migration resistance, and suitable for a chip on film (hereafter referred to as COF). In a flexible printed wiring board for COF, having an insulating layer on which a conductive layer of an electrodeposited copper foil is laminated, and an optical transmittance of 50% or more of the insulating layer in the etched region when a circuit is formed by etching said conductive layer, electrodeposited copper foil was made to have a rust-proofing layer of a nickel-zinc alloy on the adhering surface to be adhered to the insulating layer; the surface roughness (Rz) of the adhering surface was made to be 0.05 to 1.5 ?m, and the specular gloss was made to be 250 or more when the incident angle is 60°.

Abstract: To easily connect a coaxial cable to electric connecting devices or a printed circuit board, to prevent the conductors of the cable from being disturbed, to secure the shielding performance of the signal line, and to enable connection of a very fine wire by means of an automatic machine, a binding member for a coaxial cable is formed into a tubular piece that is arranged to cover the outer conductor or the centered conductor which is exposed from the insulating covering of the cable. This binding member is made of a lead-free ultrahigh-conductive plastic resin composite. An electric connector for a coaxial cable has electric contacts, which each have a receiving port into which the binding member is inserted.

Abstract: A fastening device, which will facilitate the assembly of associated parts or manufactured articles, and electromagnetic energy absorptive component for absorbing electromagnetic waves and converting wave energy to heat; an expansive component, which expands upon exposure to heat emanating from the target material; matrix material, which will become adhesively active and effect the adherence of the associated parts upon exposure to heat emanating from the target material, and a stiffening component.

Abstract: A method for producing small pitch z-axis electrical interconnections in layers of dielectric materials which are applied to printed wiring boards and diverse electronic packages. A method for parallel fabrication of intermediate structures which are subsequently jointed to form a final structure. In addition there is provided a z-interconnected electrical structure, employing dielectric materials such as resin coated copper, employable in the manufacture of diverse type of electronic packages, including printed wiring boards (PWBs), substrates, multi-chip modules and the like.

Abstract: A transfer sheet for use in forming a conductor circuit comprises a base and a metal layer formed into a circuit pattern on the base. The metal layer is transferred onto a surface of an insulation layer. At least part of the circuit pattern of the metal layer is formed by laser-processing. Since it is possible, without using an etching process and a plating process at a minute part of the conductor circuit, to remove the metal layer by emitting laser light having a minute beam diameter, it is possible to form a minute conductor circuit which is 50 ?m or less in width and pitch, with the result that it is prevented that the conductor circuit has a break because of excessive etching and a failure of plating deposition or the conductor circuit is short-circuited because of the residue of etching and a short of plating.

Abstract: A film material for use in packaging electrostatically sensitive components and corrosion sensitive components. The film material includes a static dissipative polymer attached to a first moisture barrier which in turn is attached to a second moisture barrier. The second moisture barrier has a low charge retaining coating. The first and second moisture barriers are separated by dielectric. Moisture barriers are formed by either a metal foil, or a metallized polymer in which the metallization thickness is at least 178 Angstroms thick. The metal of the second moisture barrier is in contact with the low charge retaining coating. The low charge retaining coating together with the metal in the second moisture barrier has a surface conductivity between 10?3 and 10?7 Siemens.

Abstract: The disclosure describes vapor permeable retroreflective material for use on protective garments. The material may be formed in a non-continuous pattern that provides a high-level of retroreflective brightness, yet also provides adequate permeability to prevent exposure to trapped thermal energy and heated moisture. The non-continuous retroreflective pattern may include retroreflective regions and non-retroreflective regions arranged such that thermal decay through the protective garment is not substantially decreased in the regions corresponding to the retroreflective material. Rather, vapor permeation and thermal decay through the garment may be substantially the same as if the retroreflective material was not present.

Abstract: The present invention provides a laminate used for a printed wiring substrate and a multilayer printed wiring board which have high heat resistance, wiring patterns with narrow pitches, vias with a small diameter, insulating layer having uniform thickness and stable adhesion between the metal layer and the synthetic resin film, and which contribute to miniaturization, high capability and functional improvement of electronic equipment. The present invention relates to a metal laminate comprising a metal layer laminated on one or both faces of a synthetic resin film, wherein the metal layer is a metal foil having a thickness of at most 5 ?m.

Abstract: An adhesive security tape comprises a polymer film whose refractive index and/or interface structure can be changed locally by heating. Disposed below the polymer film is an absorber layer comprising an absorber dye set up at least partly to absorb a write beam directed onto the absorber layer, to emit at least some of the generated heat to the polymer film locally, and in doing so to undergo local change itself. Below the absorber layer there is an adhesive layer. The adhesion between the adhesive layer and the absorber layer is greater than the adhesion to the polymer film. There is preferably a partly transparent reflection layer between the polymer film and the absorber layer.

Abstract: A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a fluoropolymer composite substrate and a thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.

Abstract: A binding element including a metal sheet and an intermediate layer secured to the metal sheet. A first glue adheres a first surface of the intermediate layer to the metal sheet, and has a predetermined melting temperature. A second glue is provided on a second surface of the intermediate layer opposite the first surface, and has predetermined melting temperature. The melting temperature of the first glue is higher than the melting temperature of the second glue.

Abstract: Disclosed are an adhesive composition for a metal foil which comprises a material wherein a tracking resistance test is carried out according to the IEC method by making a thickness of an adhesive layer 30 to 40 ?m, using a copper foil pattern with a width of 4 mm and making a distance between electrodes 0.4 mm, then the adhesive layer dissolves out for the first time when 5 drops or more of an electrolyte are dropped thereon, an adhesive-coated metal foil, a metal-clad laminate, a wiring board, a multi-layer board and a multi-layer wiring board using the same.

Abstract: A laminar, thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermally-conductive pathway therebetween. The interface includes a first layer formed of a flexible, lamellar graphite or tin foil material, and a second layer formed of a thermally-conductive phase-change material.

Abstract: Auto-adhesive display film comprising at least one electrically charged, dielectric layer (2). A screen layer (3), which is adapted to form a barrier to the electric field, is fixed to one surface of the dielectric layer (2). This display support does not attract dust particles and is specifically adapted to be printed sheet by sheet.

Abstract: A self-adhesive article for mechanical protection of painted plastic mounted parts of automobiles, comprising a backing material in film form whose outer side is laminated with a layer of knitted fabric and whose inner side is pressure-sensitively adhesive through application of a self-adhesive composition.

Abstract: The present invention provides a product that includes (a) a wood-based composite panel having a pair of outer surfaces; and (b) a radiant barrier material having a pair of outer surfaces, wherein at least a portion of an outer surface of the radiant barrier material is adhered to at least a portion of an outer surface of the wood-based composite panel; wherein the radiant barrier material that includes apertures such that the apertures are present in about 49 apertures per square inch of radiant barrier material or less, inclusive. The invention also includes methods for manufacturing such product.

Abstract: The present invention provides a metallic member reinforcing epoxy-based adhesive coating. The epoxy-based adhesive coating including a first epoxy material containing approximately 25% solids by weight and a second curative material containing about 32% solids by weight. According to one aspect of the present invention, the first epoxy offered suitably includes about 3% to about 35% liquid Diglycidylether of Bisphenol-A, about 35% to about 60% solid Diglycidylether of Bisphenol-A, about 10% to about 30% Novolac-Epoxy, and about 5% to about 18% Solid Carboxy—Terminated Acrylonitrile—Butadiene Rubber, and the second curative material suitably includes about 0% to about 100% 4,4′-Diaminodiphenylsulfone, about 0% to about 100% 3,3′-Diaminodiphenylsulfone, and about 0% to about 0.2% Chromium octoate.

Abstract: The invention is directed toward a heat conductive sheet that has flexibility, can follow a specific shape such as ruggedness and curvature, which can therefore insure high adhesion and, at the same time, excellent heat releasing property, is free from the occurrence of wrinkle and rupture or elongation, even when the thickness is decreased, and is excellent in formability of sheet formation and in bonding work. Such heat conductive sheet includes a substrate and a heat conductive resin layer applied to at least one surface of the substrate, wherein the heat conductive resin layer is constituted as to contain a binder resin and a heat conductive filler dispersed in the binder resin.

Abstract: The present invention provides a vibration dampening laminate that is lightweight and has superior sound insulation and vibration dampening properties. The vibration dampening laminate comprises a constraining layer, a viscoelastic adhesive layer, a foam spacing layer and a pressure sensitive adhesive layer including a release layer. The pressure sensitive adhesive layer and release layer are contoured to fit a profile of the article being soundproofed and vibration dampened.

Abstract: A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a reinforced fluoropolymer composite and a high-flowing thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.

Abstract: A sealant composition having improved coat adhesion to the coat. A sealant composition comprising a low hygroscopic resin and a metallic powder. A sealant having a flat shape selected from the group consisting of sheet, tape and strap, comprising the sealant composition. A laminated structure comprising steel sheets forming a joint, a sealant which seals the joint on the steel sheets, and a coat on the sealant.

Abstract: The present invention relates to a film (10) for the decoration of a surface (100) by hot marking, in particular a surface made of glass or metal, the film comprising a first layer (11) of a heat-sensitive adhesive intended to be brought in contact with the said surface, a second layer (12) of a material suitable for forming the said decoration, a protective support (13) fixed on the second layer via a layer (14) of a heat-sensitive material, characterised in that the film comprises at least one first compound (20) capable of chemically reacting in a humid environment with at least one second compound of the said surface (10) so as to promote the adhesion of the film when it is applied to the said surface.

Abstract: It is an object of the invention to provide coated particles excellent in the reliability of connection.

Abstract: A laminated structure having a film composite overlying a substrate sheet, used as a decorative panel for appliances and motor vehicles. The laminated structure has high distinctness of image in both the machine direction and the transverse direction, and a ratio of these approaching 1.0.

Abstract: Highly heat-resistant labels usable with the adherends which can be exposed to high temperatures are provided.

Abstract: A hardcoat for a plastic substrate film is provided which has good suitability for printing and satisfactory hardness, can prevent influence of the deformation of a plastic substrate film from extending to the hardcoat, and is resistant to cracking and peeling. The hardcoat is produced from a coating component containing one or more organic components having a polymerizable functional group and an inorganic filler, at least one of the organic components being free from a hydrogen bond-forming group. In the hard coat, the content of the inorganic filler in the surface of the hardcoat is higher than that in the interior of the hardcoat. The hardcoat can be applied to antireflection films and hologram labels.

Abstract: A protective film contains a base material and a pressure-sensitive adhesive layer formed thereon, wherein the surface of the pressure-sensitive adhesive layer has a contact angle with methylene iodide as measured just after contact, &thgr;1, of 70° or smaller and a change in contact angle with methylene iodide through 30-second standing, &Dgr;&thgr;, of 8% or less.

Abstract: A flexible imaging belt seam treatment article comprising a high-temperature-resistant flexible substrate that supports a thermoplastic polymer film. The film is deposited on the flexible substrate by dissolution of a film-forming thermoplastic polymer in a carrier solvent, applying the resulting solution to the flexible substrate, and eliminating the carrier solvent. The article can then be used to treat a seam of a flexible imaging belt by placing it on the seam, heating the strip and seam, and applying pressure to the strip and seam.