Next To Metal Patents (Class 428/344)
  • Patent number: 6645589
    Abstract: The present invention provides a white biaxially oriented polyester film having a two-layer structure of layer A/layer B, wherein the layer A contains a polyester having a melting point of 240° C.-260° C. and containing titanium dioxide in a proportion of 5-30 wt %, the layer B contains a polyester having a melting point of 210° C.-235° C., and the film shows a dimensional change of not more than 2%, which is obtained by thermally adhering a layer B side of the film to a metal plate to give a laminate, which is heat-treated at 210° C. for 2 minutes, and subjecting the film after the treatment to the measurement, a film-laminated metal plate using the polyester film and a metal container obtained by forming this film-laminated metal plate. The polyester film of the present invention has superior heat resistance and is capable of stably covering the surface of a metal plate even after a heat treatment during a can forming process and the like.
    Type: Grant
    Filed: September 12, 2001
    Date of Patent: November 11, 2003
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Shingo Fujii, Hideki Igushi, Hiroshi Nagano
  • Patent number: 6638607
    Abstract: A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one opening is formed through the substrate extending from one face to the other and through each adhesive tape. An electrically conductive material is dispensed in each of the openings and partially cured. The adhesive tape is removed to allow a nub of the conductive material to extend above the substrate face to form a wiring structure with other elements.
    Type: Grant
    Filed: October 30, 2002
    Date of Patent: October 28, 2003
    Assignee: International Business Machines Corporation
    Inventors: Brian E. Curcio, Donald S. Farquhar, Lisa J. Jimarez, Keith P. Brodock
  • Patent number: 6638606
    Abstract: A hardcoat for a plastic substrate film is provided which has good suitability for printing and satisfactory hardness, can prevent influence of the deformation of a plastic substrate film from extending to the hardcoat, and is resistant to cracking and peeling. The hardcoat is produced from a coating component containing one or more organic components having a polymerizable functional group and an inorganic filler, at least one of the organic components being free from a hydrogen bond-forming group. In the hard coat, the content of the inorganic filler in the surface of the hardcoat is higher than that in the interior of the hardcoat. The hardcoat can be applied to antireflection films and hologram labels.
    Type: Grant
    Filed: January 16, 2002
    Date of Patent: October 28, 2003
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Toshio Yoshihara, Yurie Ota, Nobuko Takahashi, Noboru Kunimine, Satoshi Shioda, Mikiko Hojo
  • Patent number: 6632538
    Abstract: A battery packet (50) comprises a battery case (51) formed by processing a battery case forming laminated sheet (10), a battery 50a contained in the battery case (51), and tabs (59, 60) extending outside from the battery case (51). The battery case forming laminated sheet (10) is formed by laminating a first base film layer (1a), i.e., an outermost layer, a metal foil layer (2), and a heat-adhesive resin layer (3) in that order. The first base film layer (1a) is a biaxially oriented polyethylene terephthalate resin film or a biaxially oriented nylon resin film. The metal foil layer (2) is an aluminum or copper foil. The heat-adhesive resin layer (3) is formed of a polyolefin resin, more preferably, of an acid-denatured polyolefin resin.
    Type: Grant
    Filed: December 13, 1999
    Date of Patent: October 14, 2003
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Takuya Yamazaki, Kiyoshi Oguchi, Koji Shimizu, Kenichiro Suto, Tsutomu Yoshinaka, Hideki Kurokawa, Hitoshi Sekino, Masahiro Yoshikawa, Hiroshi Miyama, Katsuhiko Hayashi, Jun Fukuda
  • Publication number: 20030190466
    Abstract: An adhesive sheet for producing semiconductor devices, such as QFNs, can prevent the generation both of wire-bonding defects and mold flashes, and can thereby prevent the production of defective semiconductor devices. The present invention provides an adhesive sheet for producing semiconductor devices which is detachably attached to a lead frame and which comprises a heat resistant substrate and an adhesive layer which is arranged on one surface of the heat resistant substrate, wherein the adhesive layer contains, a thermosetting resin component (a) and a thermoplastic resin component (b); and the weight ratio of the component (a)/the component (b) is 0.3 to 3.
    Type: Application
    Filed: April 2, 2003
    Publication date: October 9, 2003
    Inventors: Katsuji Nakaba, Toshihiro Nakajima, Takeshi Sato, Osamu Oka
  • Publication number: 20030180531
    Abstract: The invention relates to a pressure sensitive adhesive (PSA) tape and to a process for crosslinking PSA on backing materials which are more resistant to electron beams. The process is distinguished by a backing material which has been modified with one or more very thin layers of one or more conductive materials. During EB crosslinking the accelerated electrons penetrate the adhesive and the backing material and are dispersed over the entire backing material, or braked, at the electrically conductive layer. The damage to the backing which occurs at high EB doses is thereby minimized.
    Type: Application
    Filed: January 8, 2003
    Publication date: September 25, 2003
    Applicant: tesa AG
    Inventors: Marc Husemann, Stephan Zollner, Reinhard Storbeck
  • Patent number: 6616999
    Abstract: A thermal interface for facilitating heat transfer from an electronic component to a heat sink. According to a preferred embodiment, the thermal interface comprises a first planar substrate that defines a first continuous peripheral edge, at least a portion of which extends beyond the interface mating surface between the electronic component and heat sink. Formed upon opposed sides, of the substrate are layers of thermally conductive compositions, which preferably comprise certain novel graphitic allotrope compounds. The thermal interface further includes an adhesive deposited upon such portion of the peripheral edge extending beyond the mating surface between the electronic component and heat sink such that the thermal interface may be adhesively secured into position without forming an additional layer at the mating juncture between the electronic component and the heat sink.
    Type: Grant
    Filed: May 17, 2000
    Date of Patent: September 9, 2003
    Inventors: Raymond G. Freuler, Gary E. Flynn
  • Patent number: 6613870
    Abstract: Acrylate hot melt-based self-adhesive composition, characterized by K value of at least 60, in particular 65-80, and obtainable by concentrating or devolatilizing a solution of such a composition in a devolatilizing extruder to give a system which can be processed as a hot melt.
    Type: Grant
    Filed: April 24, 1997
    Date of Patent: September 2, 2003
    Assignee: tesa AG
    Inventors: Christian Harder, Andreas B. Kummer, Klaus Biethahn, Robert Tiburg
  • Patent number: 6607815
    Abstract: The invention describes a biaxially oriented polyester film with at least one base layer B, with at least one metal-adherent outer layer A, and preferably with another outer layer C, the metal-adherent outer layer A having a metal adhesion of at least 4 N/25 mm wherein the metal adherent layer consists essentially of an amorphous copolyester comprising ethylene terephthalate and ethylene isophthalate units.
    Type: Grant
    Filed: July 18, 2001
    Date of Patent: August 19, 2003
    Assignee: Mitsubishi Polyester Film GmbH
    Inventors: Stefan Bartsch, Herbert Peiffer
  • Patent number: 6607825
    Abstract: As a technique capable of stably providing various metal film adhered bodies for printed circuit boards having an excellent peel strength even in the wiring having higher density and higher pattern accuracy and other industrial parts, there are provided adhesive, adhesive layer and metal film adhered body in which a mixed resin consisting of a thermoplastic resin and an uncured thermosetting resin including a resin substituted at a part of its functional group with a photosensitive group and/or an uncured photosensitive resin is used as a heat-resistant resin matrix constituting the adhesive and further a cured homogeneous resin composite forming a quasi-homogeneous compatible structure, co-continuous phase structure or spherical domain structure is used as a heat-resistant resin matrix of the adhesive layer.
    Type: Grant
    Filed: August 22, 1997
    Date of Patent: August 19, 2003
    Assignee: Ibiden Co., Ltd.
    Inventors: Dong Dong Wang, Motoo Asai
  • Patent number: 6607826
    Abstract: A protective layer which prevents marine fouling when attached to a boat hull or other structure intended to be submerged underwater. The protective layer achieves its anti-fouling characteristic by incorporating anti-fouling compounds uniformly dispersed throughout either a plastic film or an adhesive used to bond the film to a surface to be protected which slowly leach into the surrounding marine environment. The film is removably adhered to a boat hull or other structure by a thermally sensitive thermoplastic adhesive. The film may be removed by simply reheating until the adhesive softens to thereby allow the film and any undesired marine organisms attached thereon to be peeled away from the boat hull.
    Type: Grant
    Filed: December 9, 1999
    Date of Patent: August 19, 2003
    Assignee: Brunswick Corporation
    Inventor: Edwin Burton Hatch
  • Patent number: 6605345
    Abstract: Disclosed is an ultraviolet-curable pressure sensitive adhesive composition comprising an ultraviolet-curable pressure sensitive adhesive component and a phosphorus type photopolymerization initiator. Also disclosed is an ultraviolet-curable pressure sensitive adhesive sheet obtained by coating a substrate with the ultraviolet-curable pressure sensitive adhesive composition. The ultraviolet-curable pressure sensitive adhesive composition is capable of retaining ultraviolet curing properties even if the ultraviolet-curable pressure sensitive adhesive sheet is brought into contact with wash water for a long period of time.
    Type: Grant
    Filed: June 28, 2001
    Date of Patent: August 12, 2003
    Assignee: Lintec Corporation
    Inventors: Michio Kanai, Hideki Numazawa
  • Patent number: 6602309
    Abstract: There is provided a cap liner including a fluid impermeable layer for venting gas to and from the container and an adhering device for adhering the impermeable layer to a rim of a container and a channel extending therethrough for venting gas therethrough. Also provided by the present invention is a method of sealing an opening of a container by affixing a meltable layer of a sealing member to a container rim and venting the container through a vent patch, meltable layer, a foil layer, and a fluid impermeable layer having pathways thereon.
    Type: Grant
    Filed: May 25, 2001
    Date of Patent: August 5, 2003
    Assignee: Performance Systematix, Inc.
    Inventors: Karlis Vizulis, John W. Grover
  • Publication number: 20030143389
    Abstract: In accordance with the present invention, a foamed structure having closed cells or both closed cells and open cells can be effectively used as a waterstop sealing material. In particular, a waterstop sealing material having excellent sealing properties can be provided.
    Type: Application
    Filed: February 9, 2000
    Publication date: July 31, 2003
    Inventors: Katsuhiko Tachibana, Masahiko Ando, Yasuyuki Tokunaga, Manabu Matsunaga, Atsushi Kuriu
  • Patent number: 6596391
    Abstract: Disclosed is a metal-clad laminate product having a carrier film, a aqueous soluble release or parting layer deposited onto the carrier film and which can be mechanically separated from the carrier film, and an ultra thin metal layer deposited onto the parting layer. Also disclosed is a method for making the metal-clad laminate product.
    Type: Grant
    Filed: May 11, 1998
    Date of Patent: July 22, 2003
    Assignee: Honeywell International Inc.
    Inventor: Gordon C. Smith
  • Patent number: 6596947
    Abstract: A board piece 2 of the present invention comprises a non-thermoplastic resin film 11, a thermoplastic resin film 10 formed on the non-thermoplastic resin film 11 and a metal wiring 8 formed on the surface of the thermoplastic resin film 10. Metal wiring 8 is partially exposed on board piece 2 to form a contact 12. A low-melting metal coating 13 is formed on contact 12 and two board pieces 2a, 2b are pressed against each other under heating with contacts 12a, 12b thereof being in contact with each other so that thermoplastic resin films 10a, 10b soften to adhere board pieces 2a, 2b to each other and low-melting metal coatings 13a, 13b melt and then solidify to connect contacts 12a, 12b to each other. The region of metal wiring 8 not used for connection is wiring 17 connecting contacts 12 to each other and a cover film 19 can be provided on the surface thereof. Contacts 12a, 12b can also be connected by applying ultrasonic wave.
    Type: Grant
    Filed: January 18, 2002
    Date of Patent: July 22, 2003
    Assignee: Sony Chemicals Corp.
    Inventors: Hideyuki Kurita, Masanao Watanabe, Toshihiro Shinohara, Mitsuhiro Fukuda, Yukio Anzai
  • Publication number: 20030129389
    Abstract: A cover tape of the invention for the electronic part conveyance includes a substrate having provided thereon a thermally adhesive resin layer with an antistatic layer being provided on the outer side of the substrate or between the substrate and the thermally adhesive resin layer, which is characterized in that thermally adhesive resin layer surface has a contact angle to water of 0.5 to 95° and a surface resistivity of 1.0×1013 &OHgr;/square or less. Further, the critical surface tension &ggr;c at the surface of the thermally adhesive resin layer may be 2.6×10−4 to 7.0×10−4 N/cm.
    Type: Application
    Filed: December 20, 2002
    Publication date: July 10, 2003
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hiroki Ichikawa, Ichiro Nakano, Wataru Kakimoto, Atsushi Tani
  • Patent number: 6579398
    Abstract: Disclosed is a method of manufacturing an optical waveguide, capable of easily manufacturing an optical waveguide which can hold an excellent light propagating characteristic irrespective of the kind of a supporting substrate. On a transparent substrate, a peelability promoting film obtained by setting silicone oil and an optical waveguide made of an epoxy resin are sequentially formed. The peelability promoting film promotes the peelability between the transparent substrate and the optical waveguide with sufficient adhesion that it is not peeled off from the transparent substrate during formation of the optical waveguide. Subsequently, after adhering a multilayer wiring board to the optical waveguide via an adhering layer made of a photosetting resin, the adhering layer is irradiated with light so as to be set, thereby fixing the multilayer wiring board to the optical waveguide.
    Type: Grant
    Filed: July 13, 2000
    Date of Patent: June 17, 2003
    Assignee: Sony Corporation
    Inventor: Tsuyoshi Ogawa
  • Patent number: 6576316
    Abstract: A metal strip, more particularly a metal strip for producing vibration damping moldings, is provided with a layer of adhesive viscoelastic plastics and permits coiling and comprises an anti-adhesive film-type coating. In a method of producing a metal strip, the metal strip is preferably degreased, preferably stretched, possibly pretreated and coated one-sided with an adhesive viscoelastic plastics. In addition, an anti-adhesive film is applied to the metal strip.
    Type: Grant
    Filed: June 26, 2001
    Date of Patent: June 10, 2003
    Assignee: Alcan Deutschland GmbH
    Inventors: Jan-Peter Simons, Hans-Eckard Weitsch, Fred-Roderich Pohl
  • Patent number: 6565694
    Abstract: Laminating a pre-press proof (200) onto a coated metal plate (340), consisting of the steps of: laminating a pre-laminate sheet (240) to a coated metal plate (340). Removing the first support layer (150) forming a pre-laminated receiver stock (230). Creating an imaged receiver sheet (140) laminating the imaged receiver sheet (140) to the pre-laminated receiver stock (230) thereby encapsulating the representative image (290) and removing the second support layer (170) forming a pre-press proof (200) onto a coated metal plate (340).
    Type: Grant
    Filed: July 24, 2001
    Date of Patent: May 20, 2003
    Assignee: Eastman Kodak Company
    Inventors: Roger S. Kerr, David A. Niemeyer, Larry R. Gartz
  • Patent number: 6565954
    Abstract: Through holes formed in an electrical insulating substrate having adhesive layers on its both surfaces are filled with a conductor. Then, supporting bases having wiring layers with a predetermined pattern are laminated on both the surfaces of the electrical insulating substrate, which are then heated and pressurized. After that, the supporting bases are removed, thus obtaining a circuit board in which the wiring layers have been embedded in the adhesive layers. The conductor within the through holes are compressed sufficiently, thus forming minute via holes with high reliability.
    Type: Grant
    Filed: December 1, 2000
    Date of Patent: May 20, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Daizou Andou, Toshio Sugawa, Tadashi Nakamura, Hideki Higashitani, Masahide Tsukamoto
  • Patent number: 6562454
    Abstract: An IC tag and label are provided which allow data to be recorded on the surface thereof, are free from security problem that the inner IC circuit or wiring circuit can be seen through, exhibit excellent strength and water resistance, can be used even in the atmosphere and water and can be used for frozen food vessels, industrial products, various chemical vessels, etc. and for flow control, production line control, etc. The IC tag has a laminated structure that includes a thermoplastic resin film layer (A), an adhesive layer (D), and an IC circuit layer (B) or an IC circuit protective layer (C) having a hole containing an IC circuit layer (B). The IC label has a laminated structure that includes a thermoplastic resin film layer (A), an adhesive layer (D), an IC circuit layer (B) or an IC circuit protective layer (C) having a hole containing an IC circuit layer (B), and an adhesive layer (G). An airline tag includes the IC label.
    Type: Grant
    Filed: December 4, 2001
    Date of Patent: May 13, 2003
    Assignee: Yupo Corporation
    Inventors: Tomotsugu Takahashi, Tamio Shikano
  • Patent number: 6551433
    Abstract: An object of the invention is to prevent dent faults generated during bonding of an outer copper foil layer onto an inner layer substrate having a through hole or a cavity serving as an interlayer electrical connection means such as an interstitial via hole (IVH) or a blind via hole (BVH).
    Type: Grant
    Filed: July 12, 2001
    Date of Patent: April 22, 2003
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Fujio Kuwako, Tomohiro Ishino
  • Patent number: 6544369
    Abstract: Thin film-like material that has printability, that can have unique surface patterns of various kinds, and that can have a design having an effect that has been never produced, and process of producing it are provided. The thin film-like material has a laminated structure in which an adhesive layer and a metal thin layer are laid in this order on the entire surface or parts of the surface of one or each of opposite sides of a base material A surface of the metal thin layer is formed by transfer process as a smooth surface having a mirror pattern, a surface having a mat pattern, a surface having a hairline pattern, a surface having an embossed pattern, a surface having a hologram pattern or a surface having two or more of those patterns combined appropriately.
    Type: Grant
    Filed: October 26, 2000
    Date of Patent: April 8, 2003
    Assignees: Japan Tobacco Inc., JT Prosprint Co., Ltd.
    Inventors: Yoshinori Kitamura, Shigenobu Matsumoto
  • Patent number: 6544638
    Abstract: An electronic chip package is provided having a laminated substrate. The laminated substrate includes at least one conductive layer and at least one dielectric layer which is bonded to the conductive layer. The dielectric layer has a glass transition temperature Tg greater than 200° C. and a volumetric coefficient of thermal expansion of ≦75 ppm/° C. A semiconductor device is electrically attached to the laminated substrate.
    Type: Grant
    Filed: September 10, 2001
    Date of Patent: April 8, 2003
    Assignee: Gore Enterprise Holdings, Inc.
    Inventors: Paul J. Fischer, Joseph E. Korleski
  • Publication number: 20030064215
    Abstract: This invention relates to window films and more particularly to a low haze colored window film wherein coloration of the window film is effected with a pigment. The invention further is concerned with a process for the manufacture of the pigmented window film. The window film of this invention is pigmented with a pigment having small particle size wherein the particles are coated with a resin binder which encapsulates the pigment particles. The encapsulated pigment particles are blended into an adhesive which is compatible with the resin binder which is used to encapsulate the pigment particles. The resulting adhesive is used to secure one or more film layers of a composite window film structure together. The resulting films have haze levels which approximate the haze levels of dyed window films. The window films of this invention have outstanding light stability.
    Type: Application
    Filed: July 11, 2001
    Publication date: April 3, 2003
    Inventors: Ratka Damnjanovic, Haibin Huang
  • Patent number: 6541550
    Abstract: The invention provides low temperature thermally activatable water-dispersed adhesive compositions and adhesives made from the compositions by removing water. The adhesive compositions of the invention comprise a mixture of low modulus crystallizing polyester polyurethane, acrylic ester copolymer, one or more hydrophobically-modified associative polyurethanes, and a stabilizer system comprising a combination of carbodiimide and branched primary amino alcohol.
    Type: Grant
    Filed: April 5, 2000
    Date of Patent: April 1, 2003
    Assignee: 3M Innovative Properties Company
    Inventors: Arianne E. McCarthy, Terry J. Rayner
  • Publication number: 20030044600
    Abstract: An adhesive sheet is provided comprising a base layer, a protective layer disposed on the front surface of the base layer, and an adhesive layer disposed on the back surface of the base layer. The protective layer comprises a surface modifier for modifying the surface of the protective layer, a cured resin and inorganic oxide particles, and the adhesive sheet further comprises a cushion layer comprising an elastomer, disposed between the base layer and the protective layer. ThIS adhesive sheet is suitable for use as a flooring adhesive sheet having high abrasion resistance.
    Type: Application
    Filed: September 5, 2002
    Publication date: March 6, 2003
    Inventor: Takahide Okuyama
  • Patent number: 6521144
    Abstract: A mounting technique with improved adhesive strength and higher reliability against bending stress is provided with the use of a conductive adhesive including a binder resin and a metal filler as main components, in which a functional group is introduced into the molecular chain of the binder resin to form a multidentate bonding with an electrode metal easily. As a thermoplastic resin, at least two kinds of functional groups selected from the group consisting of a carbonyl group, a carboxyl group, an amino group, an imino group, an iminoacetic acid group, an iminopropionic acid group, a hydroxyl group, a thiol group, a pyridinium group, an imido group, an azo group, a nitrilo group; an ammonium group and an imidazole group are introduced. Accordingly, a strong bond with the electrode metal can be achieved. The conductive adhesive is screen-printed to an electrode disposed on a substrate, and after an electrode of a component is mounted, the structure is heated so as to create a mounted structure.
    Type: Grant
    Filed: December 29, 2000
    Date of Patent: February 18, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Takezawa, Takashi Kitae, Yukihiro Ishimaru, Tsutomu Mitani
  • Patent number: 6518356
    Abstract: The invention relates to the addition of dyes to aerobically curable adhesive compositions based on free-radically polymerizable compounds. The dyes serve as user-friendly indicators for monitoring the oxygen intake required to trigger the polymerization. The indicator dyes are especially suitable for aerobically adhesive compositions which contain activator systems for forming peroxides upon contact with air. Suitable dyes and indicators are those whose color change in aqueous solution lies within a pH range from 3.0 to 6.5.
    Type: Grant
    Filed: July 24, 2000
    Date of Patent: February 11, 2003
    Assignee: Henkel Kommanditgesellschaft auf Aktien
    Inventors: Carsten Friese, Georg Knuebel
  • Patent number: 6514365
    Abstract: A process for forming a light-reflecting bar code on an end disc of photographic film spool is performed by the steps of placing on the end disc of photographic film spool a hot-stamp film comprising, in order, an adhesive layer, a light-reflecting metal layer, a transparent protective layer, a releasing layer, a support film, and a stain-shielding layer formed of material inhibiting migration of a compound having a low molecular weight from the support film (e.g., compound having a siloxane bonding or deposited inorganic oxide) in such manner that the adhesive layer is brought into contact with the end disc, and pressing for 0.1 to 2.0 seconds a stamper having a heated bar code-stamping die, so as to transfer the light-reflecting metal layer onto the end disc in the form of the bar code.
    Type: Grant
    Filed: August 9, 2000
    Date of Patent: February 4, 2003
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Akira Tomita, Takao Uchida
  • Patent number: 6500529
    Abstract: A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a fluoropolymer composite substrate and a thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.
    Type: Grant
    Filed: September 14, 2001
    Date of Patent: December 31, 2002
    Assignee: Tonoga, Ltd.
    Inventors: Thomas F. McCarthy, David L. Wynants, Sr.
  • Patent number: 6485803
    Abstract: The process for applying labels to articles by first adhering a limited portion of the label to the article and subsequently rendering additional portions of the label adhesive so that they will adhere to the article after the label is affixed to the article. The leading and trailing edges of the label may be bonded to the article or each other to affix the label to a container or other such article. The portions of the label between the leading and trailing edges may be either provided with an adhesive agent that is in a non-adhesive state or be formed from a label material which is not normally adhesive but can be rendered adhesive through an additional process step. For example, coated polyethylene film can be applied to a container by means of a hot melt adhesive and then subsequently heated to a temperature at which the polyethylene material becomes adhesive causing it to stick to the container.
    Type: Grant
    Filed: July 7, 1997
    Date of Patent: November 26, 2002
    Assignee: B&H Manufacturing Company, Inc.
    Inventor: Lyn E. Bright
  • Patent number: 6472037
    Abstract: A non-permanent adhesive-backed magnetized securing device allows for affixing and removing objects from the adhesive portion of the device with minimal to no destruction or marring of the contacted surface of the object. The device includes a base member and a non-permanent adhesive connected to the base member. The base member has a surface that exhibits magnetic characteristics and is capable of magnetically connecting the device to a magnetic attracting element. The non-permanent adhesive is permanently affixed to another surface of the base member and is capable of allowing objects to be removably attached to the device. A dividing member may be located between the base member and the non-permanent adhesive. A permanent adhesive fixedly connects the dividing member to the base member.
    Type: Grant
    Filed: July 8, 1999
    Date of Patent: October 29, 2002
    Assignee: Kane Graphical Corporation
    Inventor: Jonathan E. Kane
  • Patent number: 6458445
    Abstract: A quartz glass jig having large irregularities on the surface thereof, wherein said irregularities have a center line roughness Ra in the range of from 2 to 30 &mgr;m, a maximum height Rmax in the range of from 10 to 150 &mgr;m, and a width in the range of from 10 to 500 &mgr;m, and by a method which comprises forming an inorganic thin film on the surface of a quartz glass jig free from microcracks and having fine irregularities on the surface thereof and thereafter rinsing it a plurality of times.
    Type: Grant
    Filed: July 29, 2000
    Date of Patent: October 1, 2002
    Assignees: Heraeus Quarzglas GmbH & Co. KG, Shin-Etsu Quartz Products Co., Ltd.
    Inventor: Kyoichi Inaki
  • Patent number: 6447630
    Abstract: Applied to a substrate such as paper banknotes is a thread which includes a PET carrier layer with release layers on both surfaces of the carrier layer, and a metallic layer outward of one release layer. An adhesive layer lies outward of the metallic layer. When a substrate is brought into contact with the adhesive layer, the result is to bond the metallic layer to the substrate. Following this, the PET carrier layer is peeled away, leaving the metallic layer bonded to the substrate. An apparatus for accomplishing these steps includes means for bringing the substrate into contact with the adhesive layer, and means for peeling the PET carrier layer away so that it separates from the metallic layer at the adjacent release layer.
    Type: Grant
    Filed: November 15, 1999
    Date of Patent: September 10, 2002
    Assignee: Agra Vadeko Inc.
    Inventors: John Nicholas Disano, Nigel P. W. Walsh, Tom D. Brett
  • Patent number: 6426146
    Abstract: This invention relates to a treated copper foil, comprising: a copper foil with a layer of zinc oxide adhered to the base surface of at least on side of said copper foil, said layer of zinc oxide having a thickness of about 3 Å to about 80 Å; and a layer of a trivalent chromium oxide adhered to said layer of zinc oxide. In one embodiment, the foil has a layer of a silane coupling agent adhered to the layer of trivalent chromium oxide. The invention also relates to a process for applying the layer of zinc oxide and the layer of trivalent chromium oxide to the copper foil. The invention also relates to laminates comprising a dielectric substrate and the foregoing copper foil adhered to the substrate. In one embodiment, the dielectric substrate is comprised of an epoxy resin made with a curing agent that is other than an amine curing agent.
    Type: Grant
    Filed: February 10, 2000
    Date of Patent: July 30, 2002
    Assignee: GA-TEK Inc.
    Inventors: Thomas J. Ameen, Edward Czapor
  • Publication number: 20020089810
    Abstract: A system and method for the fabrication of high reliability capacitors (1011), inductors (1012), and multi-layer interconnects (1013) (including resistors (1014)) on various thin film hybrid substrate surfaces (0501) is disclosed. The disclosed method first employs a thin metal layer (0502) deposited and patterned on the substrate (0501). This thin patterned layer (0502) is used to provide both lower electrodes for capacitor structures (0603) and interconnects (0604) between upper electrode components. Next, a dielectric layer (0705) is deposited over the thin patterned layer (0502) and the dielectric layer (0705) is patterned to open contact holes (0806) to the thin patterned layer. The upper electrode layers (0907, 0908, 1009, 1010) are then deposited and patterned on top of the dielectric (0705).
    Type: Application
    Filed: September 21, 2001
    Publication date: July 11, 2002
    Inventors: Michael D. Casper, William B. Mraz
  • Patent number: 6413630
    Abstract: A decorative film having an excellent decorative effect, excellent three-dimensional curvature emulating properties, three-dimensional curvature formability, long-term weather resistance and stain resistance. The decorative film comprises one or more transparent layers and a decorative metal layer. The transparent layer has an adhered side for being adhered to a substrate. The transparent layer comprises a copolymer of a tetrafluoroethylene, a hexafluoropropylene and a vinylidene fluoride. The decorative metal layer is on the adhered side of the transparent layer. A substrate can be bonded to the metal layer of the decorative film. The substrate can be a complex three-dimensional shaped substrate. The substrate can also be an injection molded substrate. An adhesive can be disposed on the metal layer of the decorative film, and the adhesive layer can be disposed between the metal layer and the substrate.
    Type: Grant
    Filed: November 4, 1999
    Date of Patent: July 2, 2002
    Assignee: 3M Innovative Properties Company
    Inventor: Akihiko Nakayama
  • Patent number: 6413622
    Abstract: A non-asbestos friction material is made by molding and curing a composition comprising a fibrous base, an inorganic filler, an organic filler and a binder. The inorganic filler, typically zirconium silicate, has a 90% particle size of 0.1 to 8 &mgr;m, a Mohs hardness of 6 to 8, and accounts for 0.1 to 10% by volume of the overall composition. The friction material is useful as brake linings and has a high braking effectiveness in normal use, a small speed spread, low change over time in braking effectiveness, and can prevent morning effect and jerky low-speed braking.
    Type: Grant
    Filed: February 22, 2000
    Date of Patent: July 2, 2002
    Assignee: Nisshinbo Industries, Inc.
    Inventor: Mitsuru Kobayashi
  • Patent number: 6399191
    Abstract: The present invention relates to coated metal substrates such as metal piping having improved environmental stress crack resistance and resistance to hydrolytic and/or cathodic disbondment. The coating composition contains a blend of modified and unmodified polyolefins as well as a tackifier. For cathodic disbondment resistance, the preferred tackifiers are rosin esters or hydrogenated versions thereof. The modified polyolefins are grafted versions of metallocene or non-metallocene produced low density or high density polyethylenes.
    Type: Grant
    Filed: February 23, 2000
    Date of Patent: June 4, 2002
    Assignee: Du Pont Canada Inc.
    Inventor: Chun Sing Wong
  • Patent number: 6395391
    Abstract: An adhesive tape for electronic parts which comprises a metal substrate and an adhesive layer A and an adhesive layer B and an adhesive layer C laminated in order wherein said adhesive A comprises a polyimide consisting of 100-20% by mol of the repeating unit represented by the following formula-(1a) and 0-80% by mol of the repeating unit represented by the following formula (1b), said adhesive B comprises a polyimide consisting of 100-40% by mol of the repeating unit represented by the following formula (1a) and 0-60% by mol of the repeating unit represented by the following formula (2), and the adhesive layer A and the adhesive layer B have each a different glass transition temperature: wherein Ar represents a divalent group selected from the specified structures containing aromatic rings, R is an alkylene group having 1 to 10 carbon atoms or —CH2OC6H4—, the methylene group of which attaches to Si, and n means an integer of 1 to 20.
    Type: Grant
    Filed: April 27, 2000
    Date of Patent: May 28, 2002
    Assignee: Tomoegawa Paper Co., Ltd.
    Inventors: Osamu Oka, Jun Tochihira, Fumiki Komagata
  • Patent number: 6387485
    Abstract: A flexible composite substrate is disclosed and includes a flexible carrier, a first adhesive and a second adhesive. The first adhesive is adhered to the flexible carrier and includes ferromagnetic material. The second adhesive is adhered to the first adhesive, and is for removably applying the flexible composite substrate to a receiving surface. The adhesive strength of the second material is greater than the adhesive strength of the first material.
    Type: Grant
    Filed: August 12, 1999
    Date of Patent: May 14, 2002
    Assignee: Flexcon Company, Inc.
    Inventors: Yan P. Bielek, William W. Sullivan
  • Patent number: 6376050
    Abstract: An electrically connecting device and an electrical connecting method in which electrical connections can be positively realized via electrically conductive particles despite slight irregularities of objects to be eclectically connected to each other. The electrical connecting device 100 electrically connects an electrically connection portion 5 of the first object and the electrically connection portion 3 of the second object. The electrical connecting device 100 is made up of a first film-shaped adhesive layer 6 and a second film-shaped adhesive layer 9. The first film-shaped adhesive layer 6, arranged on the first object 4, is made up of plural electrically conductive particles 7 and a binder 8 containing the electrically conductive particles 7. The second film-shaped adhesive layer 9, arranged on the first film-shaped adhesive layer 6 containing the electrically conductive particles, is made up only of a fluid binder.
    Type: Grant
    Filed: December 23, 1999
    Date of Patent: April 23, 2002
    Assignees: Sony Corporation, Sony Chemicals Corporation
    Inventors: Tohru Terasaki, Noriyuki Honda, Seiichi Miyachi, Yasuhiro Suga
  • Patent number: 6368697
    Abstract: A metal-clad laminate product including a carrier film, a release agent layer, a semi-transparent metal layer and a photo dielectric layer deposited on the conductive metal layer and a method for using the metal-clad laminate product to form an interlayer via by exposing at least a portion of an circuit board intermediate prepared from the metal-clad laminate product to light through the semi-transparent metal layer for a period of time sufficient to form an exposed or an unexposed photo dielectric portion and thereafter removing the exposed or unexposed portion of the photo dielectric layer and a corresponding portion of the semi-transparent metal layer overlying the exposed or unexposed portion of the photo dielectric layer to form an interlayer via.
    Type: Grant
    Filed: February 25, 2000
    Date of Patent: April 9, 2002
    Assignee: Honeywell International Inc.
    Inventors: Michael Petti, Gordon C. Smith
  • Patent number: 6355328
    Abstract: A composite structure comprising a preformed flexible laminate in adhering contact with at least a first and second transparent or translucent panel members such as would be useful as an insulated glass unit. The flexible laminate contains an undulating spacer element either partially or totally embedded within a core material and has a polymeric coating on at least one surface thereof. The flexible laminate effectively seals the interior of the panel structure from air and/or moisture and maintains a desired distance between the panels. A multi-cavity extrusion die for forming the preformed flexible laminate has a core cavity for receiving the core material as well as the undulating continuous spacer element. Converging walls within the core cavity serve to embed at least one side of the spacer element in the core material and a land area forms a desired shape or configuration wherein the spacer element undulation is maintained.
    Type: Grant
    Filed: November 23, 1998
    Date of Patent: March 12, 2002
    Assignee: TruSeal Technologies, Inc.
    Inventors: James Lynn Baratuci, Ronald Ellsworth Buchanan, Louis Anthony Ferri, Lanny Dean Ritz
  • Patent number: 6350344
    Abstract: Solvent-free and water-free radiation-curable primers based on hydroxy-functional prepolymers and cycloaliphatic epoxides or based on hydroxy-functional prepolymers and olefinically unsaturated compounds or based on epoxides and vinyl ethers together with cationic or free-radical initiators may be applied in the same manner as conventional commercial solvent-free laminating adhesives and, for many coatings, allow subsequent in-line coating without there being any need to evaporate solvent or water from the primer coating.
    Type: Grant
    Filed: April 26, 1999
    Date of Patent: February 26, 2002
    Assignee: Henkel Kommanditgesellschaft auf Aktien
    Inventors: Hans-Georg Kinzelmann, Michael Drobnik
  • Patent number: 6342680
    Abstract: A lead-free super-highly conductive plastic is formed of a conductive resin composition which includes a thermoplastic resin, a lead-free solder that melts during plasticization, and metal powder or a mixture of metal powder and metal short fibers that promotes the fine dispersion of particles of the lead-free solder within the thermoplastic resin. In the lead-free super-highly conductive plastic, since particles of the lead-free solder are connected with each other via solder melted within the plastic, the particles of the lead-free solder are mutually joined, so that high conductivity is attained.
    Type: Grant
    Filed: February 20, 1998
    Date of Patent: January 29, 2002
    Assignee: Japan Science and Technology Corporation
    Inventors: Takeo Nakagawa, Hiroyuki Noguchi
  • Publication number: 20020009587
    Abstract: A sheet for protecting a paint film, the sheet comprising a substrate and formed on one side thereof a rubber-based pressure-sensitive adhesive layer which comprises a rubbery polymer and incorporated therein a copolymer of at least one aromatic compound with at least one terpene compound or aliphatic hydrocarbon compound. The sheet can be efficiently applied and satisfactorily adhered to a paint film and retain the satisfactorily adherent state over long. After accomplishment of the protection, the sheet can be easily peeled off and is less apt to foul the paint film even when the paint film is of the type susceptible to fouling upon protective sheet removal. No cleaning treatment is hence necessary.
    Type: Application
    Filed: June 6, 2001
    Publication date: January 24, 2002
    Applicant: NITTO DENKO CORPORATION and KANSAI PAINT CO., LTD.
    Inventors: Tsuyoshi Inoue, Kenji Sano, Yoshiki Kobayashi, Kenichi Shibata, Keiji Hayashi, Mitsuru Horada, Komaharu Matsui, Yu Akaki, Takeshi Eda, Hiroshi Ueda
  • Patent number: 6338898
    Abstract: A heat-conductive rubber composition material, which comprises a rubber essentially consisting of an acrylic rubber, a butyl rubber, an ethylene propylene rubber or a blended rubber which comprises at least two of acrylic rubber, butyl rubber, and ethylene propylene rubber are blended, and 50 to 85 weight % of hydrophobic magnesium oxide powder, a heat-conductive rubber sheet prepared by forming the above thermal conductive rubber composition material, and a heat-conductive sheet, which comprises a soft metal sheet and a rubber layer formed on at least one surface of the soft metal sheet.
    Type: Grant
    Filed: June 20, 2000
    Date of Patent: January 15, 2002
    Assignee: Furakawa Electric Co., Inc.
    Inventors: Toshio Miyahara, Naoki Kimura, Jun Niekawa