Abstract: Provided is a photosensitive resin composition which has excellent heat resistance, pore explosion resistance, empty foam resistance and crack resistance. A photosensitive resin composition of the present invention contains (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) a diluent solvent, (D) a compound that has two or more ethylenically unsaturated groups in each molecule and (E) a thermosetting component that has two or more cyclic ether groups and/or cyclic thioether groups in each molecule.

Abstract: Provided is a resin composition which enables the formation of a roughened surface having a low roughness degree on the surface of an insulation layer in a printed wiring board material when used on the insulation layer regardless of the roughening conditions employed and also enables the formation of a conductive layer having excellent adhesion properties, heat resistance, heat resistance under absorption of moisture, thermal expansion properties and chemical resistance on the roughened surface. A resin composition comprising (A) an inorganic filler that is soluble in an acid, (B) a cyanic acid ester compound and (C) an epoxy resin.

Abstract: The present invention relates to electrodepositable coating compositions that produce cured coatings that exhibit resistance to cratering. The coating compositions include an active hydrogen-containing cationic salt group-containing polymer; and 0.1 to 20 percent by weight, based on the total weight of resin solids in the coating composition, of an ungelled acrylic polymer.

Abstract: Provided is a silver-plated coated body that is excellent in interlayer adhesion and tarnish resistance. The silver-plated coated body has a silver film layer and a topcoat layer as essential layers on a substrate, the topcoat layer containing at least one kind selected from thiourea and thiourea derivatives, and at least one kind selected from thiol organic acids and thiol organic acid derivatives.

Abstract: Disclosed is an insulating film composition of a non-oriented electrical steel sheet. The insulating film composition of a non-oriented electrical steel sheet according to the present invention comprises a mixed metal phosphate consisting of aluminum phosphate (Al(H3PO4)x=1-3) and cobalt phosphate (Co(H3PO4)3), and an organic/inorganic composite consisting of epoxy resin and silica (SiO2) nanoparticle substituted on the functional group of the epoxy resin.

Abstract: A resin composition forms a roughened surface with low roughness on an insulating layer regardless of roughening conditions when used as an insulating layer of a printed wiring board, and is excellent in adhesion between the insulating layer and a plated conductor layer, and also has low thermal expansion coefficient (linear expansion coefficient) and high glass transition temperature and is also excellent in moist heat resistance. The resin composition includes an epoxy compound, a cyanate ester compound and an inorganic filler, wherein the cyanate ester compound is at least selected from a naphthol aralkyl type cyanate ester compound, an aromatic hydrocarbon formaldehyde type cyanate ester compound, a biphenyl aralkyl type cyanate ester compound and a novolak type cyanate ester compound; and the content of the epoxy compound is 60 to 75% by weight based on the total amount of the epoxy compound and the cyanate ester compound.

Abstract: A resin composition which contains at least constituent elements (A)-(E) described below and wherein the epoxy resin (A) contains 80-100% by mass of a bifunctional epoxy resin and component (D) is contained in an amount of 60-85% by mass relative to 100% by mass of the total mass of the resin composition. This resin composition does not substantially contain a solvent and is in a liquid state at room temperature. (A) an epoxy rein (B) an amine-based curing agent (C) an accelerator that has at least one functional group selected from among a dimethylureide group, an imidazole group and a tertiary amino group (D) silica particles (E) a silane coupling agent Provided is a resin composition which has excellent curability at low temperatures and a sufficiently low linear expansion coefficient after curing. This resin composition does not suffer from warping in cases where applied to a copper thin film and molded, and does not suffer from separation or cracks even if a substrate obtained therefrom is bent.

Abstract: A resin composition has high flame retardancy and excellent heat resistance, peel strength with copper foil, thermal expansion coefficient, heat resistance property upon moisture absorption, and electrical properties, a prepreg and single-layer or laminated sheet, a metal foil-clad laminate using the prepreg, and the like. The resin composition has polyphenylene ether (A) having a number average molecular weight of 500 to 5000, a phosphorus-containing cyanate ester compound (B) represented by formula (13), a cyclophosphazene compound (C), a halogen-free epoxy resin (D), a cyanate ester compound (E) other than the phosphorus-containing cyanate ester compound (B), an oligomer (F) of styrene and/or substituted styrene, and a filler (G), wherein a content of the phosphorus-containing cyanate ester compound (B) is 1 to 10 parts by mass based on 100 parts by mass of a total of the (A) to (F) components. wherein m represents an integer of 1 to 3.

Abstract: The object of the present invention is to strongly join an aluminum alloy part with an FRP prepreg. An object obtained by subjecting an aluminum alloy to a suitable liquid treatment so as to form a surface having large, micron-order irregularities and also fine irregularities with a period of several tens of nanometers, eliminating the presence of sodium ions from the surface and additionally forming a surface film of aluminum oxide, which is thicker than a natural oxide layer, has been found to have a powerful adhesive strength with epoxy-based adhesives. By simultaneously curing an FRP prepreg which uses the same epoxy-based adhesive in the matrix, an integral composite or structure in which FRP and aluminum alloy have been united at a joining strength of unprecedented magnitude is produced.

Abstract: A core or sub-composite structure is provided including a dielectric layer between a first conductive film and a second conductive film. The first conductive film may include a first peelable/removable cover layer formed on or coupled to a first conductive layer. The second conductive film may include a second peelable/removable cover layer formed on or coupled to a second conductive layer.

Abstract: Method and apparatus for protecting a metal substrate from corrosion. The method comprises generating an acid organic-inorganic hybrid sol-gel; providing a polyaniline solution; combining the sol-gel with the polyaniline solution; incorporating a polysiloxane within the organic-inorganic hybrid sol-gel, the polyaniline solution or the combined sol-gel and polyaniline solution; coating the substrate with the polysiloxane sol-gel polyaniline solution; and curing the coating at the substrate, such that the coating is chemically bonded to the substrate, the coating comprising a polysiloxane based network having a Si—O backbone.

Abstract: The present invention relates to a polar group-containing olefin copolymer (A?) which is produced through polymerization using a transition metal catalyst, which has a weight-average molecular weight falling within a specific range and which contains a polar group-containing monomer within a specific range; a multinary polar olefin copolymer (A?) indispensably containing a polar monomer component that has a norbornene skeleton and a carboxyl group or an acid anhydride group and having three or more types of monomer units; and a resin composition (C) containing a specific amount of a polar group-containing olefin copolymer (A) and a specific amount of an olefin resin (B).

Abstract: An ultraviolet (UV) curable resin composition is provided which includes 25 to 45 parts by weight of a modified epoxy acrylate oligomer; and 10 to 25 parts by weight of a urethane acrylate oligomer. Further provided is a metal sheet that is transparent and corrosion resistant, impact resistant, scratch resistant, adhesive, anti-corrosive, and bendable (workable) by forming a coating film on the surface of a metal material such as a steel material, specifically a steel sheet, using the UV curable resin composition mentioned above.

Abstract: A method for coating a metal substrate with a white, off-white or gray colored autodeposited coating comprising water, polymeric resin, HF and pigment particles comprising a core of titanium dioxide, an intermediate zirconia and/or alumina layer, and an outer organic layer, optionally the particles are treated with an anionic surfactant.

Abstract: A resin composition of the present invention contains a mixture (A) of at least two of cyanate ester compounds selected from the group consisting of cyanate ester compounds (A1) to (A3) having a specific structural unit, an epoxy resin (B), and an inorganic filler (C). A prepreg of the present invention is obtained by impregnating a base material with the resin composition or applying the resin composition to a base material. Furthermore, a metal foil-clad laminate of the present invention is the laminate comprising the prepreg. Furthermore, a printed wiring board of the present invention contains an insulating layer and a conductor layer formed on a surface of the insulating layer, in which the insulating layer contains the resin composition.

Abstract: Provided are a resin composition having excellent electrical characteristics and heat resistance after moisture absorption, and being also excellent in flowing characteristics at the time of production of a laminate, and a prepreg, a metal foil-clad laminate and a resin sheet using the same. Used is a resin composition comprising a bifunctional phenylene ether oligomer (a) having a polyphenylene ether skeleton, an aralkyl-based cyanate ester compound (b), a bisphenol-based cyanate ester compound (c), an epoxy resin (d), a brominated carbonate oligomer (e), an inorganic filler (f), an alkoxynaphthol-based polymerization inhibitor (g) and/or a thioether-based polymerization inhibitor (h).

Abstract: A resin composition is provided. The resin composition comprises: an epoxy resin; a hardener, which comprises a melamine compound of Formula I: wherein, R is the same with or different from each other and has the formula of R1 and R2 are individually selected from a group consisting of H, a halogen, a substituted or unsubstituted C1-C15 alkyl group, a substituted or unsubstituted C1-C15 aloxy group, a substituted or unsubstituted C3-C15 cycloalkyl group, a substituted or unsubstituted C6-C20 aryl group, a substituted or unsubstituted C6-C20 aryloxy group, a substituted or unsubstituted C1-C15 unsaturated hydrocarbyl group, a naphthol group, a phenanthrenol group, and a dicyclopentadiene group, with a proviso that R2 is not H; and m is 1 or 2, wherein the amount of the hardener is about 20 parts by weight to about 150 parts by weight per 100 parts by weight of the epoxy resin.

Abstract: The present invention relates to a powder coating composition for low temperature cure which comprises a mixture of a carboxylic acid group containing first polyester; at least one of a second polyester having a glass transition temperature ?45° C. and/or a crystalline polycarboxylic acid; a glycidyl group containing acrylic copolymer; a further compound and/or resin having functional groups readable with the carboxylic acid groups; and a thermosetting curing catalyst. These thermosetting powder coatings are designed for coating heat-sensitive substrates such as wood, fiber board and other materials which can not withstand the excessive heat/time conditions necessary to cure traditional coatings. The powder coatings of the invention, when cured at temperatures below 150° C., produce a finish which exhibits a high gloss, smooth surface along with an outstanding hardness and weatherability.

Abstract: The invention provides a composition comprising: (a) about 0% to 99% by weight of at least one resin wherein the resin is selected from the group consisting of epoxy, latex, polyurethane, polyurea, polyspartic, or alkyd resins; (b) about 1%-99% by weight of tristyrenated phenol or distyrenated phenol; and (c) optionally about 2% to 98% by weight of an additional solvent.

Abstract: To provide a chromium-free paint composition which can provide paint films which are excellent in terms of corrosion resistance on the edge surfaces, scratched surfaces and worked parts of a pre-coated steel sheet, and the paint films which can be obtained by coating this chromium-free paint composition. A chromium-free paint composition which includes paint film-forming resin (A), anti-rust pigment (B), comprising at least one type of amorphous MgO—V2O5-based compound, and crosslinking agent (C) which is characterized in that the mass content proportion of the aforementioned anti-rust pigment (B) is from 10 to 80 mass % with respect to the sum of the resin solid fraction mass of the aforementioned paint film-forming resin (A) and the aforementioned crosslinking agent (C), and the overall eluted ion content in a 10% aqueous solution of the aforementioned anti-rust pigment (B) is from 10 ppm to 100 ppm.

Abstract: A fiber-metal laminate of mutually bonded fiber-reinforced composite layers and metal sheets comprises a combination of a fiber-reinforced composite layer and an adjacent metal sheet, in which combination the properties satisfy the following relations: Elam*Ecomp/(Emetal*tmetal2) has a value between a lower bound given by a*(Vf?c)(b/(Vf?c)) with b=0.36 and c=0.3??(1a) and zero when Vf?0.3,??(1b) and an upper bound given by a*(Vf?c)(b/(Vf?c)) with b=0.88 and c=0??(1c) 0.10?Vf<0.

Abstract: The present invention relates to an acidic, aqueous, particulate composition having a high stability with respect to agglomeration for autophoretic deposition of organic-inorganic hybrid layers on metal surfaces, comprising, in addition to iron(III) ions, fluoride ions and at least one dispersed organic binder (B), pigment-binder particles comprising a pigment portion and a binder portion (B), such that the binder (B) comprises a polymer of at least one monomer having acid groups and at least one polymerizable double bond. Likewise, the invention relates to the use of an aqueous dispersion comprising pigment-binder particles comprising a pigment portion and a binder portion (B) for the production of a self-depositing composition as well as a method for autophoretic deposition on metal surfaces.

Abstract: A halogen-free resin composition, a copper clad laminate using the same, and a printed circuit board using the same are introduced. The halogen-free resin composition comprising (A) 100 parts by weight of epoxy resin; (B) 3 to 15 parts by weight of diaminodiphenyl sulfone (DDS); and (C) 5 to 70 parts by weight of phenolic co-hardener. The halogen-free resin composition features specific ingredients and proportion to thereby achieve satisfactory maximum preservation period of the prepreg manufactured from the halogen-free resin composition, control the related manufacturing process better, and attain satisfactory laminate properties, such as a high degree of water resistance, a high degree of heat resistance, and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Abstract: A resin composition used to prepare a sheet-like prepreg by impregnating a substrate with the resin composition includes an epoxy resin that contains a naphthalene-modified epoxy resin, and a triazine-modified novolac resin. A sheet-like prepreg is formed by impregnating a substrate with the resin composition. A laminate formed using the prepreg exhibits excellent flame retardancy, solder heat resistance, and lead-free heat resistance, has a small coefficient of linear expansion in the thickness direction, and has excellent adhesion to a conductor circuit.

Abstract: Disclosed are an alkoxysilylated isocyanurate epoxy compound, a composite of which exhibiting low CTE and high glass transition temperature or Tg-less and/or a cured product of which exhibiting good flame retardant property, a method of preparing the same, a composition including the same, a cured product formed of the composition, and a use of the composition. An isocyanurate epoxy compound having an alkoxysilyl group and an epoxy group in a core; a method of manufacturing the epoxy compound by the epoxidation and alkoxysilylation of a starting material; an epoxy composition including the epoxy compound; and a cured product and a use thereof, are provided. A composite of the epoxy composition has improved bonding efficiency between alkoxysilyl group and filler and between alkoxysilyl groups, and has good heat resistance, low CTE, and high glass transition temperature or Tg-less. A cured product formed of the epoxy composition has good flame retardant property.

Abstract: Provided is a PAS resin composition with which molded articles having excellent high- and low-temperature impact properties can be obtained and which can be highly inhibited from leaving mold deposits when molded and is suitable for use in insert molding. Also provided is an insert-molded article obtained using the resin composition. The PAS-derived resin composition comprises a PAS resin having carboxylic terminal groups and an olefin-derived copolymer, wherein the olefin-derived copolymer comprises units of an ?-olefin, a glycidyl ester of an ?,?-unsaturated acid, and an acrylic ester as comonomer units, the PAS resin has a number average molecular weight of 1,000-10,000, and the content of the comonomer units derived from the glycidyl ester in the resin composition is 0.08-0.20 mass %, the ratio of the content of the comonomer units derived from the glycidyl ester (mmol/kg) to the amount of the carboxylic terminal groups (mmol/kg) being 0.35-1.00.

Abstract: Provided is an epoxy resin allowing a cured product that is less changed in terms of heat resistance due to thermal history and has low thermal expansion, the epoxy resin having high solvent solubility. The epoxy resin is a polyglycidyl ether of a naphthol-novolac resin including, at predetermined proportions, a trimer and a dimer that have specific structures.

Abstract: Improved anti-corrosion systems are provided for use with hydrocarbon recovery, treatment and distribution equipment, in order to inhibit corrosion on the metal surfaces thereof. The systems include an epoxy resin, a curing agent for the resin, and a surfactant, which is the reaction product of an alkyl benzene sulfonic acid at least partially neutralized of from about 6-11 with an ammonia or amine neutralizing agent. The systems provide improved anti-corrosion protection in the case of metal surfaces not continually wetted with liquid hydrocarbons, such as crude oil.

Abstract: The disclosure relates to curable polyepoxysilane compounds and compositions, methods related to curing of such compounds via hydrolysis and/or condensation to form coatings on a substrate, and coated articles formed from the curable polyepoxysilane compounds. The polyepoxysilane compounds are silane-functional precursors and can be used as coatings (or pretreatments) on various substrates (e.g., metals such as aluminum) and provide a substantial improvement in corrosion resistance relative to other anti-corrosion coatings. The silane-functional precursors can be prepared by reaction of functional silanes (e.g., amino-functional silanes or other epoxide-reactive functionalized silanes) with epoxide-containing organic or hydrocarbon compounds and oligomers/polymers thereof (e.g., glycidyl-type ethers or other epoxide-/oxirane-functionalized hydrocarbon compounds), for example including hydrocarbons with one or more aromatic hydrocarbon groups (e.g., in an aromatic polyether).

Abstract: Improved anti-corrosion systems are provided for use with hydrocarbon recovery, treatment and distribution equipment, in order to inhibit corrosion on the metal surfaces thereof. The systems include an epoxy resin, a curing agent for the resin, and a surfactant, which is the reaction product of an alkyl benzene sulfonic acid at least partially neutralized of from about 6-11 with an ammonia or amine neutralizing agent. The systems provide improved anti-corrosion protection in the case of metal surfaces not continually wetted with liquid hydrocarbons, such as crude oil.

Abstract: An electrodepositable film-forming composition is provided, comprising a resinous phase dispersed in an aqueous medium. The resinous phase comprises: (1) an ungelled active hydrogen-containing, cationic resin derived from a polyepoxide; (2) a cationic acrylic resin containing urethane functional groups; and (3) an at least partially blocked polyisocyanate curing agent. Also provided is a coated metal substrate comprising: A) a metal substrate having at least one coatable surface, and B) a cured coating layer deposited on at least one surface of the substrate and having a coating/air interface and a coating/substrate interface, wherein the cured coating layer is deposited from the electrodepositable film-forming composition described above. Further provided is a process for coating an electroconductive substrate, comprising electrophoretically depositing on the substrate the curable, electrodepositable coating composition described above.

Abstract: A prepreg for a printed wiring board, comprising a cyanate ester resin having a specific structure, a non-halogen epoxy resin, a silicone rubber powder as a rubber elasticity powder, an inorganic filler and a base material, which prepreg retains heat resistance owing to a stiff resin skeleton structure, has high-degree flame retardancy without the use of a halogen compound or a phosphorus compound as a flame retardant, and has a small thermal expansion coefficient in plane direction without using a large amount of inorganic filler, and a laminate comprising the above prepreg.

Abstract: An aqueous electrodeposition coating composition comprising (a) an organometallic compound and (b) a cathodically electrodepositable binder, the binder comprising an amine-functional phosphorylated resin, provides corrosion protection equivalent to that obtained by the conventional phosphate pretreatment-electrodeposition coating process.

Abstract: The object of the present invention is to provide a copper foil with an ultra thin resin layer for a printed wiring board without roughening treatment. In order to achieve the object, there is adopted a copper foil with an ultra thin adhesive layer for a printed wiring board 1 or the like, which is a copper foil provided with an ultra thin primer resin layer for securing good laminating adhesiveness with a resin base material on one side of a copper foil 3 without roughening treatment, characterized in that a silane coupling agent layer 2 is formed on a surface of the copper foil without the roughening treatment having a surface roughness (Rz) of 2 ?m or below, and an ultra thin primer resin layer 4 having a converted thickness of 1 to 5 ?m is formed on the silane coupling agent layer 2.

Abstract: A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether skeleton, a specific maleimide compound (b), a naphthol aralkyl type cyanate ester resin (c) and a naphthalene-skeleton-modified novolak type epoxy resin (d) for a high-multilayer and high-frequency printed wiring board, which resin composition is excellent in varnish shelf life at low temperature and does not show a decrease in multilayer moldability, heat resistance after moisture absorption, electrical characteristics and peel strength even in a winter period and for a long period of time, and a prepreg, a metal-foil-clad laminate and a resin sheet each of which uses the above resin composition.

Abstract: A resin composition contains a cyanate ester compound, a maleimide compound, an epoxy resin, a silicone rubber powder, and an inorganic filler. The cyanate ester compound contains a compound represented by the following formula. The silicone rubber powder is contained in an amount of 40 to 150 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. The inorganic filler is contained in an amount of 100 to 340 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. A total content of the silicone rubber powder and the inorganic filler is 140 to 380 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin.

Abstract: It is an object of the present invention to provide, without using a halogenated compound or a phosphorus compound, a resin composition for printed wiring boards, a prepreg, a laminate, and a metal foil-clad laminate, each of which has high-degree flame retardance, has a low water absorption ratio and a high glass transition temperature, and has a high elastic modulus at high temperature. A resin composition according to the present invention includes a specific maleimide compound (A); a cyanate ester compound (B); a non-halogen epoxy resin (C); and an inorganic filler (D).

Abstract: The present invention is directed to anti-corrosion coatings. It is particularly directed to coatings comprising a monomer, such as pyrrole, aniline, thiophene, or their analogs, and a resin. These coatings can be used with substrates such as cold-rolled steel and other metals to inhibit surface oxidation.

Abstract: An entry sheet comprising polymer material for drilling printed circuit boards is provided. The entry sheet is suitable for use with a broad range of diameters, including commonly available drill diameters. The entry sheet comprises an adhesive epoxy configured to, among others, resist drill deflection, resist mechanical damage, and reduce to dust such that the entry sheet may increase drilling accuracy, protect printed circuit board from damage, minimize entry burrs, and may addresses other issues such as fliers, bird nesting, and the like.

Abstract: A thermally curable adhesive in strip or film form, having a thickness in the range of 0.1 to 5 mm, containing: a) at least one reactive epoxy prepolymer, b) at least one latent hardener for epoxies, and c) one or more elastomers that are selected from: c1) thermoplastic polyurethanes, c2) thermoplastic isocyanates, and c3) block copolymers having thermoplastic polymer blocks. Further components can additionally be contained, for example a blowing agent for foaming. The adhesive in the uncured state at 22° C. is bendable or wrappable and can be extended at least 100% before tearing. It can be laid onto a foil. It can be used, for example, for adhesive bonding of planar, tubular, or cylindrical components, preferably components made of metal, wood, ceramic, or ferrites.

Abstract: The present invention relates to composite coating systems and methods for the manufacture and reconstruction of condensate pans, floors or other internal structures of a heating ventilation and air conditioning (HVAC) or heating ventilation air conditioning and refrigeration (HVACR) unit. The composite coating system comprises a base epoxy coating and a top surface coating. The base epoxy coating is substantially free of volatile organic compounds (VOC's) and adheres to the condensate pans, floors or other internal structures of the HVAC or HVACR unit to fill pinholes and to provide corrosion and water resistance, and the top surface coating provides a barrier to high thermal exposure of the base coating.

Abstract: A low dielectric constant, a low dielectric loss tangent, and heat resistance are achieved. An active ester resin that has a resin structure produced by reacting a polyfunctional phenolic compound (a1) with a monofunctional aromatic carboxylic acid or its chloride (a2) and an aromatic dicarboxylic acid or its chloride (a3). The polyfunctional phenolic compound (a1) is represented by structural formula (1) below: (where Ar represents a benzene ring, a naphthalene ring, a benzene ring nuclear-substituted by an alkyl group having 1 to 4 carbon atoms, or a naphthalene ring nuclear-substituted by an alkyl group having 1 to 4 carbon atoms, X represents a methylene group, a divalent cyclic aliphatic hydrocarbon group, a phenylene dimethylene group, or a biphenylene-dimethylene group, and n represents the number of repeating units and the average thereof is in a range of 0.5 to 10).

Abstract: Epoxy containing phosphonate monomers, polymers, copolymers, oligomers and co-oligomers and methods for making the same are describes herein. These materials can be used to make polymers, and can be combined with other polymers, oligomers or monomer mixtures to make resins with excellent fire resistance that can be used in a variety of industrial and consumer products.

Abstract: An implantable device includes an exterior gold surface and a thin film disposed on the exterior gold surface and forming a barrier between the exterior gold surface and an implanted environment, in which the thin film includes molecules with a head portion, the head portion attached to the exterior gold surface.

Abstract: A composition and a method for coating metallic surfaces with a silane/silanol/siloxane/polysiloxane-containing composition, whereby the composition contains a) at least one compound selected from the silanes, silanols, siloxanes and polysiloxanes, b) at least two compounds selected from titanium-, hafnium-, zirconium-, aluminum- or boron-containing compounds, optionally c) at least one type of cation selected from cations of metals of the 1st to 3rd and 5th to 8th sub-groups including the lanthanides and the 2nd main group of the periodic table of the elements or at least one corresponding compound, d) at least one organic compound selected from monomers, oligomers, polymers, copolymers and block copolymers or e) at least one substance affecting the pH value, water and optionally at least one organic solvent.

Abstract: An object is to provide a resin composition that has excellent dielectric properties, that yields a highly heat-resistant cured product, that provides a low viscosity when made into a varnish, and that has a high Tg and a high flame retardancy without containing halogen. The resin composition contains a polyarylene ether copolymer (A) that has an intrinsic viscosity, measured in methylene chloride at 25° C., of 0.03 to 0.12 dL/g and that has an average of 1.5 to 3 phenolic hydroxyl groups in molecular terminal position per molecule, a triphenylmethane-type epoxy resin (B) that has a softening point of 50 to 70° C., and a cure accelerator (C), wherein the content of the polyarylene ether copolymer (A) is 60 to 85 mass parts where the total of the polyarylene ether copolymer (A) and the epoxy resin (B) is 100 mass parts.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of naphthalene epoxy resin; (B) 10 to 100 parts by weight of styrene maleic anhydride copolymer; and (C) 30 to 70 parts by weight of DOPO-containing bisphenol F novolac resin. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby attain a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high flame retardation, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 2 to 15 parts by weight of oxydianiline (ODA); and (C) 2 to 20 parts by weight of amino triazine novolac (ATN) resin. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high flame retardation, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Abstract: A resin composition includes (A) an epoxy resin; (B) a benzoxazine (BZ) resin; (C) a styrene maleic anhydride (SMA) copolymer; and (D) a polyester. The resin composition includes specific ingredients of a polyester and is characterized by specific proportions thereof so as to achieve a low delta Tg value of copper clad laminates manufactured in accordance with the resin composition and attain a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high fire retardation of the copper clad laminates and printed circuit boards manufactured in accordance with the resin composition.

Abstract: A surface ornament composition for a fishing tackle or a bicycle is provided. An inner coating layer is laminated on a part made of fiber reinforced plastics, a silver thin film coating layer is laminated on the inner coating layer and an outer coating layer is laminated on the silver thin film coating layer. The inner and outer coating layers are formed by use of one selected from resin paint of two-part type formed by urethane reaction of isocyanate group and hydroxyl group, resin paint of two-part type formed by reaction of resin having amino group and silicon compound having epoxy group and resin paint of two-part or three part type in which the above two reactions are simultaneously generated. The silver thin film coating layer is formed of metal complex of silver with amine as ligand that is heated after having been applied.