Abstract: A halogen-free resin composition includes (A) 100 parts per hundred resin of epoxy resin; (B) 1 to 100 parts per hundred resin of benzoxazine resin; (C) 1 to 100 parts per hundred resin of styrene-maleic anhydride; (D) 0.5 to 30 parts per hundred resin of amine curing agent; and (E) 5 to 150 parts per hundred resin of halogen-free flame retardant. The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.

Abstract: An easy open end comprising a resin-coated metal plate obtained by coating a metal substrate with a polyester film via a primer, wherein the primer comprises an epoxy resin or a polyester resin and a resole-type phenol resin, and the resole-type phenol resin has 0.2 to 2.0 methylol groups per a benzene ring. The end can be lightly opened without causing defect at the time of opening the end by pushing in the end of a tab and cutting the score and, particularly, can be excellently opened at high temperatures without arousing the problem even in a state of being heated at high temperatures featuring excellent corrosion resistance, resistance against the content and retort resistance.

Abstract: There is provided a resin composition that exhibits excellent heat resistance, heat conductivity, and water absorption. The resin composition comprises a cyanate ester resin (A) represented by formula (I), an epoxy resin (B), and an inorganic filler (C), the content of the inorganic filler (C) being 301 to 700 parts by weight based on 100 parts by weight in total of the cyanate ester resin (A) and the epoxy resin (B) wherein Rs each independently represent a hydrogen atom or a methyl group; and n is an integer of 1 to 50.

Abstract: A thermally conductive composition is made to contain a cured thermosetting resin containing a crystalline epoxy resin component, and an inorganic filler. The content by percentage of the inorganic filler in the thermally conductive composition is 66% or more and 90% or less by volume. This thermally conductive composition has a main portion made mainly of the inorganic filler, and a surface layer portion made mainly of the crystalline epoxy component and formed on the main portion to be continuous to the main portion.

Abstract: Disclosed is an epoxy resin composition, which includes (A) an epoxy resin having at least two epoxy groups in one molecule; (B) a curing agent; and (C) polystyrene.

Abstract: There are provided a resin composition for printed wiring boards that has a low coefficient of thermal expansion in a plane direction, has excellent heat resistance and drilling workability, and, at the same time, can retain a high level of flame retardance, a prepreg prepared using the resin composition, and a laminated sheet and a metal foil-laminated sheet prepared using the prepreg. The resin composition comprises (A) an inorganic filler that is a mixture composed of a hydromagnesite represented by formula (1): xMgCO3.yMg(OH)2.zH2O??(1) wherein x:y:z is 4:1:4, 4:1:5, 4:1:6, 4:1:7, 3:1:3, or 3:1:4 and huntite; (B) an epoxy resin; and (C) a curing agent.

Abstract: Disclosed is an epoxy resin composition comprising: (A) a polymerized compound including, as structural components, phosphaphenanthrene and at least one constituent selected from a structural unit of a phenolic novolak polymer and a structural unit of a phenolic novolak polymer in which a hydrogen atom of a phenolic hydroxyl group is substituted by phosphaphenanthrene; (B) an epoxy resin having two or more epoxy groups in a molecule; and (C) a curing agent that cures the epoxy resin.

Abstract: The invention relates to products and/or methods and/or systems of epoxy foils for the protection and/or sealing of material as wood, metal, steel, stone, concrete, glass etc. for houses, buildings, cars, ships, boats, bridges, roads, floors, ceilings, walls, textiles, paper, airplanes etc. The reactivity and/or the elasticity of epoxy foils are adjustable and are applicable directly or indirectly for the protection and/or sealing of all materials such as wood, concrete, glass, metal, plastic etc. The epoxy foils are universal in use, self fixing, self cleanable, highly durable, very economical, safer, and less harmful to the environment.

Abstract: An object of the present invention is to provide a resin-coated metal sheet which not only is excellent in stamping performance (lubricity of a resin layer) and film removability by alkaline cleaning but also has improved blocking resistance. Further, another object of the present invention is to provide a resin composition used for forming a resin layer having such properties on a metal sheet. A resin-coated metal sheet according to the present invention is characterized in that a resin layer containing polyethylene glycol whose number average molecular weight is 18,000 to 500,000 and paraffin wax whose average molecular weight is 400 or less is laminated on one side or both the sides of the metal sheet.

Abstract: The present invention provides a halogen-free flame retardant resin composition, and, a prepreg, a laminate, and a laminate for printed circuit that are made from the halogen-free flame retardant resin composition. The halogen-free flame retardant resin composition comprises: (A) 40-80 parts by weight of the mixture of a phenoxyphosphazene compound (A1) and a dihydrobenzoxazine ring-containing compound (A2), and, the weight ratio between the phenoxyphosphazene compound (A1) and the dihydrobenzoxazine ring-containing compound (A2) being between 1:10 and 1:2; (B) 15-45 parts by weight of a polyepoxy compound; (C) 5-25 parts by weight of a phenolic resin type hardener; and (D) 0.1-1 parts by weight of an imidazole type compound as the curing accelerator.

Abstract: A resin composition is provided. The resin composition comprises: an epoxy resin; and a hardener, which is a stable solution obtainable from the following steps: (a) adding a N,O-heterocyclic compound of formula I or II and a DOPO-based compound into an organic solvent to provide a reaction solution: wherein R1 to R3, W1, W2, m, n, p and q are as defined in the specification; (b) heating the reaction solution to carry out a ring-opening reaction to provide a polymer solution; and (c) cooling the polymer solution to obtain the stable solution, wherein the organic solvent is unreactive to the N,O-heterocyclic compound and the DOPO-based compound, and the amounts of the DOPO-based compound and the hardener are as defined in the specification.

Abstract: An inorganic filler containing (1) from 62 to 80 parts by weight of SiO2; (2) from 0 to 10 parts of weight of Al2O3; (3) from 20 to 30 parts by weight of B2O3; and (4) from 0 to 5 parts by weight of Na2O or K2O or a combination of both; based on a total weight of the filler, and the inorganic filler having a maximum particle diameter below 100 ?m is introduced. A resin composition containing the inorganic filler and applied for manufacturing printed circuit boards is also introduced, and a laminate prepared by the inorganic filler provides a good drilling function and a good dielectric performance. The laminate manufactured by adopting the inorganic filler is used for manufacturing high frequency transmission printed circuit board with a good high frequency transmission function.

Abstract: The epoxy resin composition according to the present invention contains (A) a phosphorus-containing curing agent and (B) an epoxy resin, wherein the phosphorus-containing curing agent (A) is a phosphorus compound represented by the following Chemical Formula (1); an organic group represented by R in Chemical Formula (1) has two or more phenolic hydroxyl groups; and the organic group has a molecular weight of 190 or more:

Abstract: Disclosed is a halogen-free resin composition for printed wiring board production, which is remarkably reduced in quality deterioration due to moisture absorption of a semi-cured resin film (layer). Also disclosed is a copper film with resin or the like. The resin composition is characterized by containing a component A (one or more resins selected from the group consisting of bisphenol-A epoxy resins, bisphenol-F epoxy resins and bisphenol-AD epoxy resins, which have an epoxy equivalent of not more than 200, while being in a liquid state at 25 DEG C.), a component B (a linear polymer having a crosslinkable functional group), a component C (a crosslinking agent), a component D (an imidazole-based epoxy resin curing agent) and a component E (a phosphorus-containing epoxy resin). The resin composition is also characterized by containing 0.5-3.0% by weight of phosphorus atoms per 100% by weight of the resin composition. In the copper foil with resin, a resin layer is formed by using the resin composition.

Abstract: A composite material engineered from metal and resin and a production method of the composite material. The composite material includes a metal portion composed of metal; a resin portion composed of resin; a polar functional group imparted to a surface of the metal portion; and an adhesion modifying agent mixed in the resin and including an adhesive functional group which interacts with the polar functional group. The metal portion and the resin portion are bonded by the interaction between the polar functional group and the adhesive functional group.

Abstract: A thermosetting resin composition contains an active ester resin (A) and an epoxy resin (B) as essential components, the active ester resin (A) having a resin structure which includes a polyaryleneoxy structure (I) and in which aromatic carbon atoms in a plurality of the polyaryleneoxy structures (I) are linked through a structural site (II) represented by a structural formula 1 (wherein Ar represents a phenylene group, a phenylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms, a naphthylene group, or a naphthylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms).

Abstract: An aqueous coating composition comprising (A) at least one water-dispersible organic binder containing cationic groups and (B) 0.05%-10% by weight, based on the solids content of the aqueous coating composition, of a water-thinnable vinylpyrrolidone copolymer, where the vinylpyrrolidone copolymer (B) contains vinylpyrrolidone monomer units and vinyl acetate monomer units in a molar ratio of 0.3:0.7 to 0.7:0.3, preferably of 0.4:0.6 to 0.6:0.4 and possesses a weight-average molecular weight of less than 200 000 g/mol.

Abstract: There is provided a resin composition for printed wiring boards that, while maintaining excellent flame retardance, has excellent heat resistance, reflow resistance, and drilling workability, and, at the same time, has low water absorption without use of halogen compounds and phosphorus compounds. The resin composition comprises (A) a non-halogen epoxy resin, (B) a biphenyl aralkyl phenolic resin, (C) a maleimide compound and (D) an inorganic filler.

Abstract: The present invention provides an adsorptive member which is used in a heat exchanger such as an adsorptive heat pump or a humidity control apparatus such as a desiccant system and which is excellent in heat resistance and adhesion between adsorptive particles and a base material. The adsorptive member comprising a base material and an adsorptive material layer formed on the base material, wherein the adsorptive material layer comprises adsorptive particles and a binder as essential components, and the binder is an epoxy cured product comprising the following structural units (a) and (b): (a): a bisphenol type structural unit; and (b): a linear hydrocarbon structural unit having 4 or more carbon atoms, and/or a polyalkylene ether structural unit having 3 or more ether oxygen atoms.

Abstract: To provide a hydrophilic coating composition excellent in hydrophilicity, wear resistance, transparency, storage stability, antifogging properties, antifouling properties, visible light transmittivity, adhesion properties, chemical resistance, weather resistance, and water resistance and a hydrophilic member using the composition. The hydrophilic coating composition has (A) a ternary copolymer having a1) a repeating unit having a hydrophilic group, a2) a repeating unit having a hydroxyl group, an epoxy group, an isocyanato group, a blocked isocyanato group, a carboxylic acid anhydride group, or an amino group, and a3) a repeating unit having a hydrolyzable silyl group; and (B) a metal complex catalyst, wherein a content of the repeating unit a1) having a hydrophilic group is 50 mol % or greater.

Abstract: A connection method and a connection structure of electronic components by which high connection reliability can be obtained. An anisotropic conductive film is temporarily disposed, and thermally compressed and bonded, in such manner that a boundary of a circuit protection area and a terminal area of a second electronic component is positioned on a single layer area of the anisotropic conductive film; and the terminal area of the second electronic component is positioned on a double-layer area of the anisotropic conductive film.

Abstract: The present invention relates to cationically and radically curable coating compositions for coating a surface. The coating compositions consist essentially of a radically or cationically curable monomer, and a metal salt. The metal salt is chosen so that it is reduced at the surface to be coated, and where the standard reduction potential of the metal salt is greater than the standard reduction potential of the surface, and where when the composition is placed in contact with the surface, the metal salt of the composition is reduced at the surface, thereby initiating cure of the curable component in the compositions. Redox mediated cure of the coating compositions results in a coating or film on the surface. The invention also provides for functionalization of surfaces. Cross-linking of the coating occurs directly on the surface.

Abstract: This disclosure relates to epoxides, polyepoxide compositions and epoxy resins whose degradation products exhibit little or no estradiol binding activity. Also disclosed are methods for making the disclosed compositions and articles of manufacture comprising the disclosed compositions.

Abstract: Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a composite curing agent, including amino-triazine-novolac resin, diaminodiphenylsulfone, and dicyandiamide mixed in a certain proportion; (C) a curing accelerator; and (D) an optional inorganic filler.

Abstract: Methods and associated structures of forming underfill material are described. Those methods may include applying an underfill to an interconnect structure comprising residue from a no clean flux, wherein the underfill comprises at least one of a functionalized nanofiller and a micron-sized filler.

Abstract: [Object] A phosphorus-containing oligomer that has high solubility in an organic solvent and exhibits high flame retardancy and heat resistance in the form of a cured product thereof is provided.

Abstract: Provided is an epoxy resin composition for a circuit board including an epoxy resin (A); an inorganic filler (B); and a cyclic or cage-shape siloxane compound (C) having at least two Si—H bonds or two Si—OH bonds.

Abstract: A composition, including at least one curable structural adhesive, and at least one thermoplastic elastomer, wherein the thermoplastic elastomer is present in the structural adhesive as penetrating polymer network. Such a composition constitutes a so-called shape memory material and is suitable for reinforcing cavities in structural components, such as, for example, in automobile bodies.

Abstract: Disclosed is a chromium-free rust-inhibitive surface treatment agent to form a siliceous film that rarely cracks or peels off and yields an excellent rust-inhibitive performance on zinc surfaces of a metal part. The chromium-free rust-inhibitive surface treatment agent is an alcoholic solution of alkoxysilane oligomer having weight-averaged molecular weight of 1,000 to 10,000, and 2.5 to 15% of silicon in molecules of the alkoxysilane oligomer has been replaced with titanium. To prepare partly titanium-replaced alkoxysilane oligomer, titanium compound, in which about a half of alkoxy groups in titanium tetraalkoxide has been chelated, is reacted with tetraalkoxysilane monomer or alkoxysilane oligomer in the alcoholic solution.

Abstract: A one-part, storage-stable, air-dryable, latex-coatable waterborne film-forming coating composition has dispersed therein sufficient conductive material to provide an autoweldable hardened shop primer layer when applied to metal components. The thus-primed components may be welded together using automated arc welding equipment without having to remove the coating composition at the weld site. The conductive material desirably causes little or no airborne emission of unsafe quantities of heavy metals or other harmful substances when the primer is volatilized or combusted during welding.

Abstract: A resin composition is provided. The resin composition comprises: an epoxy resin; a hardener, which comprises a melamine derivative of Formula I: wherein, R is the same with or different from each other and has the formula of R1 and R2 are individually selected from a group consisting of H, a halogen, a substituted or unsubstituted C1-C15 alkyl group, a substituted or unsubstituted C1-C15 aloxy group, a substituted or unsubstituted. C3-C15 cycloalkyl group, a substituted or unsubstituted C6-C20 aryl group, a substituted or unsubstituted C6-C20 aryloxy group, a substituted or unsubstituted C1-C15 unsaturated hydrocarbyl group, a naphthol group, a phenanthrenol group, and a dicyclopentadiene group, with a proviso that R2 is not H; and m is 1 or 2, wherein the amount of the hardener is about 20 parts by weight to about 150 parts by weight per 100 parts by weight of the epoxy resin.

Abstract: The present disclosure provides a thermosetting resin composition including a benzoxazine component comprising two or more benzoxazine monomer compounds and at least one epoxy resin characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards and semiconductor devices.

Abstract: A composite particle is constituted to include: an aluminum nitride particle; a first coating layer that contains ?-alumina and coats at least a part of a region of a surface of the aluminum nitride particle; and a second coating layer that contains organic matter and coats a region other than the first coating layer of the surface of the aluminum nitride particle.

Abstract: An entry sheet comprising polymer material for drilling printed circuit boards is provided. The entry sheet is suitable for use with a broad range of diameters, including commonly available drill diameters. The entry sheet comprises an adhesive epoxy configured to, among others, resist drill deflection, resist mechanical damage, and reduce to dust such that the entry sheet may increase drilling accuracy, protect printed circuit board from damage, minimize entry burrs, and may addresses other issues such as fliers, bird nesting, and the like.

Abstract: A method for coating a metallic substrate includes applying a powder coating composition to a majority of a surface of the metallic substrate, and applying an autodepositable coating composition to less than the majority of the surface of the metallic substrate. According to a preferred embodiment, the powder coating composition is applied to at least one continuous surface of the metallic substrate, while the autodepositable coating composition is applied to at least one discontinuous surface, such as an edge, of the metallic substrate.

Abstract: Discloses are a thermosetting resin composition containing a maleimide compound including an unsaturated maleimide compound having a specified chemical structure, a thermosetting resin, an inorganic filler, and a molybdenum compound; a laminate plate for wiring boards obtained by coating a base material with a thermosetting resin composition containing a thermosetting resin, silica, and a specified molybdenum compound and then performing semi-curing to form a prepreg, and laminating and molding the prepreg; and a method for manufacturing a resin composition varnish including specified steps. According to the present invention, electronic components having low thermal expansion properties and excellent drilling processability and heat resistance, for example, a prepreg, a laminate plate, an interposer, etc., can be provided.

Abstract: A vibration-damping reinforcement composition contains 30 to 300 parts by weight of butyl rubber, 30 to 300 parts by weight of acrylonitrile-butadiene rubber, 100 parts by weight of epoxy resin, and 0.5 to 30 parts by weight of an epoxy resin curing agent.

Abstract: Amorphous polymers with chromogenic pendant groups are provided. The amorphous polymers can be used to make elastomeric films and coatings that can be incorporated into laminates and used to make articles such as architectural and vehicular glazing, and in applications such as eyewear, displays and signage.

Abstract: Corrosion and chip-resistant coatings for high tensile steel components, such as automotive coil springs, can be formed from a coating composition comprising a primer having an epoxy resin with the proviso that the epoxy resin does not have an EEW of about 860 to about 930, a polyhydroxyl functional phenolic curing agent having a HEW of about 200 to about 500, and a platy filler. The primer contains less than 20 wt % zinc. The topcoat includes an epoxy resin having an epoxy equivalent weight of about 450 to about 1400, an elastomer-modified epoxy resin having an epoxy equivalent weight of about 1000 to about 1600, a foaming agent and a reinforcing fiber.

Abstract: Coating compositions are disclosed that include corrosion resisting particles such that the coating composition can exhibit corrosion resistance properties. Also disclosed are substrates at least partially coated with a coating deposited from such a composition and multi-component composite coatings, wherein at least one coating later is deposited from such a coating composition. Methods and apparatus for making ultrafine solid particles are also disclosed.

Abstract: A resin composition constituted by containing an epoxy resin monomer having a mesogenic structure, a novolac resin containing a compound having a structural unit represented by the following general formula (I), and an inorganic filler is superior in preservation stability before curing, and can attain high thermal conductivity after curing. In the following general formula (I), R1, R2 and R3 independently represent a hydrogen atom, an alkyl group, an aryl group, or an aralkyl group; m represents an integer of 0 to 2; and n an integer of 1 to 7.

Abstract: A coating film is formed on a surface of a coating object by adhering a coating powder to the coating object by spraying the coating powder from an electrostatic gun together with a compressed gas. A voltage not smaller than 80 kV but not larger than 100 kV is applied between the electrostatic gun and the coating object. Moreover, a current flowed between the electrostatic gun and the coating object is set to be not smaller than 10 ?A but not larger than 20 ?A. Further, a pressure of the compressed gas for spraying the coating powder is set to be not smaller than 3 kgf/cm2 but not larger than 6 kgf/cm2.

Abstract: A layered material may include a ply material and a backing film disposed upon the ply material. The backing film may comprise a polyester film.

Abstract: The present disclosure provides polyamides and amidoamine curing agents including the reaction product of (1) a modified amine component comprising at least one multifunctional amine of structure 1: wherein R1 is selected from C1-C16 linear, cyclic, and branched alkyl, alkenyl, and alkaryl groups; R2 and R4 are hydrogen, R3 is R1 or hydrogen, X, Y, and Z are independently selected from C2-C10 alkylene, hexylene and cycloalkylene groups, n=0, 1, 2, 3, 4, 5, 6, or 7; and (2) a fatty acid component. Exemplary fatty acid components include at least one of monomer fatty acids, dimer fatty acids, trimer fatty acids, polymer fatty acids, esters of monomer, dimer, trimer, and polymer fatty acids and combinations thereof. The method for making the curing agents and articles formed therefrom are also disclosed.

Abstract: Copper clad laminates having reduced laminate curl include copper foil with a tensile strength of less than 47 ksi.

Abstract: A coating composition is provided for use in laminate substrates useful in packaging of liquids and solids where the coating provides and increased resistance to the permeability of gases such as oxygen and carbon dioxide. In one embodiment the coating composition is a dispersion or a solution that comprises at least one hydroxyl functional polyetheramine, phosphoric acid and a defoamer. The backbone of the polyetheramine has diglycidyl ether linkages that comprise about 5 to about 70 mole percent resorcinol diglycidyl ether. The coating composition can be applied to substrates by coating applications such as spraying, rolling reverse and direct, rolling direct and reverse gravure, kiss coat, flow coating, brushing, dipping and curtain-wall coating, for example.

Abstract: The present disclosure is directed to coalescing agent for waterborne coatings. The coalescing agent comprises low molecular weight polytrimethylene ether glycol having a Mn (number average molecular weight) in a range of from 100 to 490. This disclosure is further directed to a waterborne coating composition comprising the coalescing agent. The waterborne coating compositions can be used as interior and exterior top coats, basecoats, primers, primer surfacers and primer fillers. The waterborne coating compositions can be used as architecture coatings, automotive original equipment manufacturer (OEM) coatings, automotive refinish coatings, sports equipment coatings or any other coatings. The disclosure is particularly directed to a coating composition comprising components derived from renewable resources.

Abstract: Coating compositions are disclosed that include corrosion resisting particles such that the coating composition can exhibit corrosion resistance properties. Also disclosed are substrates at least partially coated with a coating deposited from such a composition and multi-component composite coatings, wherein at least one coating later is deposited from such a coating composition. Methods and apparatus for making ultrafine solid particles are also disclosed.

Abstract: To provide an anti-fogging article having excellent anti-fogging performance and further having excellent durability, and an anti-fogging agent composition. An anti-fogging article comprising a substrate and a water-absorptive crosslinked resin layer formed on the surface of the substrate, wherein the water-absorptive crosslinked resin is a crosslinked resin with a saturated water absorption of at least 45 mg/cm3, or a water-absorptive crosslinked resin with a glass transition point of at least 50° C. as measured by a differential scanning calorimeter and further with a saturated water absorption of at least 45 mg/cm3.

Abstract: The present invention provides a conductive connecting material having a multi-layered structure comprising a resin composition and a metal foil selected from a solder foil or a tin foil, wherein the minimum ion viscosity value of the resin composition is 4-9 when measured in accordance with ASTM standard E2039 by applying a frequency of 10000 Hz at the melting point of the metal foil. The present invention further provides a method for connecting terminals and a method for producing a connection terminal using the conductive connecting material. By using the conductive connecting material of the present invention, good electric connection between connection tell finals as well as highly-reliable insulation between adjacent terminals can be achieved.