Of Polyimide Patents (Class 428/473.5)
  • Patent number: 11673103
    Abstract: The present disclosure relates to a process to produce aqueous dispersions of graphene stabilized by cellulose, offering an alternative to the current methods of dispersion of graphene. The present process provides the advantages that it uses biodegradable cellulose compatible with the environment and can be used in industrial processes in alkaline medium or in the absence of alkali; and when graphene is stabilized with cellulose in alkaline medium it becomes unstable when in contact with natural waters, thus precipitating and being easily removed or concentrated. In other embodiments, solids obtained by drying of the dispersions, once dried, can be redispersed in aqueous alkaline solution.
    Type: Grant
    Filed: October 1, 2020
    Date of Patent: June 13, 2023
    Inventors: Elisa Ferreira, Fernando Galembeck
  • Patent number: 11655348
    Abstract: A method for manufacturing a polyimide composite film for a flexible metal-clad substrate includes the following steps, providing a polyamide acid solution; providing fluorine polymer particles and mixing the fluorine polymer particles with a dispersant and an organic solution to prepare a fluorine polymer particle dispersion; forming a colloidal polyimide film from the polyamide acid solution; and coating the colloidal polyimide film with the fluorine polymer particle dispersion and then performing baking to form a polyimide composite film.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: May 23, 2023
    Inventors: Jia-Hao Wu, Chia-Ying Chou, Chun-Yi Cheng
  • Patent number: 11559923
    Abstract: One embodiment relates to a method for preparing a polyamide-imide film which is colorless and transparent and has good mechanical properties, easily and efficiently in terms of yield. Particularly, the embodiment relates to a preparation method capable of obtaining a polyamide-imide film of which the optical characteristics, mechanical properties and flexibility are harmoniously improved without complicated processes, by controlling the amount of imide repeating units and amide repeating units constituting the polyamide-imide film.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: January 24, 2023
    Assignee: SKC CO., LTD.
    Inventors: Jin Woo Lee, Dae Seong Oh, Dawoo Jeong, Dong Jin Lim, Cheol Ho Kim
  • Patent number: 11084906
    Abstract: A class of solvent resistant, flexible copolyimide substrates having high optical transparency (>80% from 400 to 750 nm) that is retained after brief exposure to 300° C., near-zero birefringence (<0.001) and a maximum CTE of approximately 60 ppm/° C. is disclosed. The copolyimides are prepared from alicyclic dianhydrides, aromatic cardo diamines, and aromatic diamines containing free carboxyl groups. The substrates are manufactured from solutions of the copolyimides containing multifunctional epoxides in the form of single layer films, multilayer laminates and glass fiber reinforced composite films. The substrates can be used in the construction of flexible optical displays, and other microelectronic and photovoltaic devices that require their unique combination of properties.
    Type: Grant
    Filed: August 17, 2012
    Date of Patent: August 10, 2021
    Assignee: Akron Polymer Systems, Inc.
    Inventors: Limin Sun, Dong Zhang, Jiaokai Jing, Frank W. Harris
  • Patent number: 11059742
    Abstract: A flexible substrate with a high optical transparency (>80% from 400 to 750 nm) that is retained after exposure to 300° C., near-zero birefringence (<±0.001), and a relatively low CTE (<60 ppm/° C.) is disclosed. The substrate may be manufactured as single layer, polyimide films and as a multi-layer laminate comprising a polyimide layer and a thin glass layer. The polyimides may include alicyclic dianhydrides and aromatic, cardo diamines. The films formed of the polyimides can serve as flexible substrates for optical displays and other applications that require their unique combination of properties.
    Type: Grant
    Filed: May 10, 2013
    Date of Patent: July 13, 2021
    Assignee: Akron Polymer Systems, Inc.
    Inventors: Limin Sun, Dong Zhang, Jiaokai Jing, Frank W. Harris, Zhikuan Lu, Xiaoliang Zheng
  • Patent number: 11015089
    Abstract: Disclosed are a polyimide film for a semiconductor package reflow process, and a manufacturing method therefor, the polyimide film being capable of ensuring ease of attachment/detachment of a semiconductor chip after a reflow process is completed, by means of the application of a thermoplastic polyimide layer having a glass transition temperature less than or equal to a reflow process temperature.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: May 25, 2021
    Assignee: IPI TECH INC.
    Inventors: Kye-Ung Lee, Ho-Young Park, Tae-Seok Lee
  • Patent number: 10981865
    Abstract: Bismaleimides (BMI) exhibit excellent heat resistance (high Tg and high resistance to thermal decomposition) compared to epoxy resins and phenolic resins, and therefore, in recent years, more attention is paid to bismaleimides as a resin material for the next-generation devices represented by SiC power semiconductors, in addition to the investigation on the use of bismaleimides for electronic material applications. As such, conventional BMI's are known as highly heat-resistant resins; however, there is a demand for a resin having higher heat resistance for advanced material applications and the like. Thus, an object of the invention is to provide a novel maleimide compound having superior heat resistance. Disclosed is a substituted or unsubstituted allyl group-containing maleimide compound having a structure with three or more benzene rings, having one or more groups each having a substituted or unsubstituted allyl group, and having one or more maleimide groups.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: April 20, 2021
    Assignee: DIC Corporation
    Inventors: Junji Yamaguchi, Tomohiro Shimono, Kazuo Arita, Masato Otsu
  • Patent number: 10720600
    Abstract: Provided are an encapsulation film, an organic electronic device (OED) comprising the same, and a method of manufacturing the organic electronic device. When the organic electronic device is encapsulated using the encapsulation film, an excellent moisture barrier property may be realized, and as reflection or scattering of light is prevented by absorbing and blocking internal or external light, external defects of the organic electronic device may be prevented.
    Type: Grant
    Filed: February 17, 2015
    Date of Patent: July 21, 2020
    Assignee: LG CHEM, LTD.
    Inventors: Jung Ok Moon, Hyun Jee Yoo, Seung Min Lee, Hyun Suk Kim, Ban Seok Choi, Se Woo Yang
  • Patent number: 10665362
    Abstract: An insulating coating material including an insulating film, and an adhesion layer on at least one side of an insulating film. The insulating film satisfies Formula (1) a=k×b3 . . . Formula (1) where a is a loop stiffness value in g/cm of the insulating film, b is a thickness in ?m of the insulating film, and k is 0.000105 or more.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: May 26, 2020
    Inventors: Yasutaka Kondo, Makoto Tawada, Kazuhiro Ono
  • Patent number: 10625216
    Abstract: A polyimide mixture including a polyimide and an amino-containing silica particle is provided. The polyimide includes a repeating unit represented by formula 1: wherein Ar includes and A includes The amino-containing silica particle is mixed with the polyimide, and is obtained by the hydrolysis condensation reaction of an alkoxysilane shown in formula 2 and an alkoxysilane shown in formula 3 in the presence of a catalyst: Si(OR1)4??formula 2, (NH2—Y)m—Si(OR2)4-m??formula 3, wherein in formula 2, R1 is a C1-C10 alkyl group; and in formula 3, Y is a C1-C10 alkyl group or a C2-C10 alkenyl group, R2 is a C1-C10 alkyl group, and m is an integer of 1 to 3.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: April 21, 2020
    Assignee: Taiwan Textile Research Institute
    Inventors: Shang-Chih Chou, Chun-Hung Chen, Chien-Chieh Hu
  • Patent number: 10629328
    Abstract: An insulating coating material including an insulating film, and an adhesion layer on at least one side of an insulating film. The insulating film satisfies Formula (1) a=k×b3 . . . Formula (1) where a is a loop stiffness value in g/cm of the insulating film, b is a thickness in ?m of the insulating film, and k is 0.000105 or more.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: April 21, 2020
    Inventors: Yasutaka Kondo, Makoto Tawada, Kazuhiro Ono
  • Patent number: 10619024
    Abstract: The invention relates to the production of PMI foams, more particularly to their formulating ingredients, which lead to particular facility in adjusting the density at given foaming temperature.
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: April 14, 2020
    Assignee: Evonik Operations GmbH
    Inventors: Thomas Richter, Thomas Barthel, Lars Bork, Christoph Seipel, Kay Bernhard
  • Patent number: 10435511
    Abstract: A polyetherimide of improved color and processes for preparing the polyetherimide are disclosed.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: October 8, 2019
    Inventors: Thomas Link Guggenheim, Maria Patricia Forcen Jimenez, Javier Nieves Remacha, Bernabe Quevedo Sanchez, Juan Justino Rodriguez Ordonez
  • Patent number: 10429699
    Abstract: A liquid crystal display includes a display area and a border area at least partially surrounding the display area, where the display area displays images for viewing and the border area displays display-protection images, which are used to control ion migration in the liquid crystal layer. In a more particular embodiment, the border area displays a series of checkerboard pattern(s), where the checkerboard patterns can alternate between initial and inverted values. The display-protection images protect the liquid crystal display from migrating ions accumulating in particular regions of the pixel array and causing permanent defects in the display area. A liquid crystal display that includes a liquid crystal alignment layer having a plurality of liquid crystal alignment directions is also disclosed. The customized liquid crystal alignment director(s) over the border area promote ion migration away from the display area.
    Type: Grant
    Filed: February 9, 2017
    Date of Patent: October 1, 2019
    Assignee: OmniVision Technologies, Inc.
    Inventors: Christopher Morgan Walker, Libo Weng, Oray Orkun Cellek, Ming Zhang, Yin Qian, Dyson Hsin-Chih Tai, Regis Fan
  • Patent number: 10228644
    Abstract: Provided is an electrophotographic member, the member including an elastic layer that is formed by graphite particles dispersed in a silicone rubber and has high thermal conductivity in the thickness direction. The electrophotographic member has a substrate and an elastic layer on the substrate, in which the elastic layer contains a cured product of an addition-curable liquid silicone rubber mixture including graphite particles, the dibutyl phthalate (DBP) oil absorption number of the graphite particles is from 80 cm3/100 g to 150 cm3/100 g, the thermal conductivity in the thickness direction of the elastic layer is from 1.1 W/(m·K) to 5.0 W/(m·K), and the modulus in tension of the elastic layer is from 0.1 MPa to 4.0 MPa.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: March 12, 2019
    Inventors: Katsuya Abe, Katsuhisa Matsunaka
  • Patent number: 10199619
    Abstract: Provided is a secondary battery, including a battery cell; a frame unit surrounding the battery cell; an adhesive portion overlapping the battery cell and the frame unit and attached to the battery cell; and a label unit covering at least portions of the battery cell and the frame unit, at least a portion of the label unit overlapping the adhesive portion.
    Type: Grant
    Filed: August 13, 2015
    Date of Patent: February 5, 2019
    Assignee: SAMSUNG SDI CO., LTD.
    Inventor: Seon-Hee Hwang
  • Patent number: 10189951
    Abstract: Aliphatic polyimides are synthesized by a 2:1 molar ratio reaction of an unsaturated monoanhydride or an unsaturated diacid with a diamine. Bio-derived monomers are particularly useful in the synthesis of the aliphatic polyimides.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: January 29, 2019
    Assignee: PolyOne Corporation
    Inventors: Yannan Duan, Roger W. Avakian
  • Patent number: 10131748
    Abstract: A polyimide resin containing a repeating structural unit of the following formula (1), a repeating structural unit of the following formula (2), and a repeating structural unit of the following formula (A) or a repeating structural unit of the following formula (B), a content ratio of formula (1) with respect to the total of formula (1) and formula (2) being from 40 to 70 mol %, and a content ratio of formula (A) or formula (B) with respect to the total of formula (1) and formula (2) being more than 0 mol % and 25 mol % or less: wherein R1 represents a divalent group having from 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R2 represents a divalent chain aliphatic group having from 5 to 20 carbon atoms; Ra represents a divalent group containing at least one aromatic ring which is bonded to a monovalent or divalent electron-attracting group; Rb represents a divalent group containing —SO2— or —Si(Rx)(Ry)O— wherein Rx and Ry each independently represent a chain aliphatic group
    Type: Grant
    Filed: August 4, 2014
    Date of Patent: November 20, 2018
    Inventors: Yuuki Sato, Jun Mitadera
  • Patent number: 10036952
    Abstract: This disclosure relates to a photosensitive composition that includes at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons; at least one solubility switching compound; at least one photoinitiator; and at least one solvent. The composition is capable of forming a film or a dry film having a dissolution rate of greater than about 0.15 micron/second using cyclopentanone as a developer.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: July 31, 2018
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Sanjay Malik, Raj Sakamuri, Ognian N. Dimov, Binod B. De, William A. Reinerth, Ahmad A. Naiini
  • Patent number: 9884942
    Abstract: A curable polymer composition comprising: (A) a thermoset maleimide resin precursor component; and further comprising one or both of: (B) an arylsulphone-containing maleimide component; and (C) a polyarylpolymer thermoplastic toughening agent component, wherein in the absence of component (B), said component (C) comprises one or more maleimide pendant and/or end groups, and thermoset resins and composites derived therefrom.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: February 6, 2018
    Inventors: Steven Richard Ward, Paul Mark Cross, Robin Maskell
  • Patent number: 9761832
    Abstract: Provided are a substrate for an organic electronic device (OED) and a use thereof. The substrate may have excellent interfacial cohesive property by preventing interlayer delamination between the organic material layer and the inorganic material layer when being applied to manufacture a flexible device including a structure in which an organic material layer and an inorganic material layer are present together. In addition, when the substrate for an OED is used, an OED may have excellent durability and an excellent another required physical property such as light extraction efficiency.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: September 12, 2017
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Ji Hee Kim, Hang Ah Park, Sang Jun Lee, Hye Won Jeong, Jung Hyoung Lee, Bo Ra Shin, Mi Ra Im
  • Patent number: 9732855
    Abstract: An extreme temperature gasket material capable of withstanding temperatures in excess of 850° F. is provided. The extreme temperature gasket generally includes an inorganic filler, an inorganic fiber, and an organic binder. In some embodiments, the inorganic filler is from 75 to 90 wt % of the gasket material and can include submicron-sized talc particles. The inorganic fiber can be from 5 to 20 wt % of the gasket material and can include silicic acid fiber. The binder can be a latex emulsion and can be present in the gasket material in the range of from 1 to 5 wt % of the gasket material. The gasket material also can include additives, such as flocculant and defoamer. In some embodiments, the amount of organic material present in the gasket material is limited to less than 5 wt % of the gasket material.
    Type: Grant
    Filed: October 4, 2011
    Date of Patent: August 15, 2017
    Inventors: Sherwin Damdar, James Drago, Paul Jude Nichols
  • Patent number: 9533438
    Abstract: Method for forming a transparent timepiece component including top and bottom surfaces: a transparent polymerizable material is chosen; there is applied to a plate a flexible female mold including a capillary network and having a contact surface which is the negative of the bottom surface, bordered by an edge; a cavity is delimited by the sealed juxtaposition of the edge with a plate having a contact surface which is the negative of the top surface; the material is injected through the capillary network to fill the cavity; the material is polymerized to obtain a rigid component; the component is removed from the plates by the deformation of this flexible mold. Hardness is improved by the UV exposition of this component.
    Type: Grant
    Filed: October 2, 2012
    Date of Patent: January 3, 2017
    Assignee: ETA SA Manufacture Horlogere Suisse
    Inventors: Christian Poffet, Philipp Gaechter, Xavier Tinguely
  • Patent number: 9492841
    Abstract: Method for pore sealing a porous substrate, comprising: forming a continuous monolayer of a polyimide precursor on a liquid surface, transferring said polyimide precursor monolayer onto the porous substrate with the Langmuir-Blodgett technique, and imidization of the transferred polyimide precursor monolayers, thereby forming a polyimide sealing layer on the porous substrate. Porous substrate having at least one surface on which a sealing layer is provided to seal pores of the substrate, wherein the sealing layer is a polyimide having a thickness of a few monolayers and wherein there is no penetration of the polyimide into the pores.
    Type: Grant
    Filed: March 19, 2013
    Date of Patent: November 15, 2016
    Assignees: IMEC, St. Petersburg Electrotechnical University
    Inventors: Victor Luchinin, Svetlana Goloudina, Vyacheslav Pasyuta, Alexey Ivanov, Mikhail Baklanov, Mikhail Krishtab
  • Patent number: 9431040
    Abstract: A magnetic recording transducer comprises a magnetoresistive sensor having a left side, a right side opposite to the left side, a left junction angle at the left side, a right junction angle at the right side, and a track width. The right junction angle and the left junction angle are characterized by a junction angle difference of not more than six degrees. The track width is less than one hundred nanometers. The magnetic recording transducer further comprises a left hard bias structure residing adjacent to the left side of the magnetoresistive sensor, and a right hard bias structure residing adjacent to the right side of the magnetoresistive sensor.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: August 30, 2016
    Assignee: Western Digital (Fremont), LLC
    Inventors: Guanxiong Li, Wei Zhang, Ming Mao
  • Patent number: 9278505
    Abstract: The present invention relates to a thermosetting resin composition used in a printed circuit board for a semiconductor package, and a prepreg and a metal clad laminate using the same. More particularly, the present invention provides a thermosetting resin composition that includes a mixture of a BT or cyanate resin and an epoxy resin and a specific content of a novolac resin as a curing agent so as to inhibit separation of the resin and an inorganic filler during a process of laminating a prepreg on a metal foil, thereby providing a printed circuit board having a uniform insulation layer, and a prepreg and a metal clad laminate for a double-sided or multilayer printed circuit board that are manufactured by using the same.
    Type: Grant
    Filed: July 20, 2012
    Date of Patent: March 8, 2016
    Assignee: LG CHEM, LTD.
    Inventors: Hee-Yong Shim, Jung-Jin Shim, Jeong-An Kang, Hyun-Sung Min
  • Patent number: 9248627
    Abstract: Multilayer films of polyamide and polypropylene which have good layer adhesion and are suitable for a back cover of a solar module are provided. In a first embodiment, the multilayer film contains in the order listed: a) a layer containing at least 35% by weight, of polyamide; c) a layer containing at least 35% by weight of a polypropylene; and e) a layer containing at least 35% by weight, of polyamide; wherein the layer c) further comprises a polypropylene having acid anhydride groups or a polypropylene compatible functionalized polyolefin having functional groups to adhere the layer c) to each of layers a) and e). In a second embodiment adhesion promoter layers are present between the respective polyamide and polypropylene layers.
    Type: Grant
    Filed: October 11, 2012
    Date of Patent: February 2, 2016
    Assignee: EVONIK DEGUSSA GmbH
    Inventors: Andreas Pawlik, Martin Wielpuetz, Harald Haeger
  • Publication number: 20150148724
    Abstract: An improved thermoplastic material for orthoses and prostheses. This material comprises at least one resin layer of polymeric resin, optionally reinforced with multiple layers or internal fibers, designed to be compatible with vacuum thermoforming, with thickness between 3/64 inches and ¾ inches. The material additionally comprises at least one and optionally two extremely thin cap layers with thickness between 2/1000 and 12/1000 inches, at least one of which is intended for improved compatibility with human skin, and the other of which can be configured for various cosmetic or UV protection purposes. Methods of producing this material, and various orthotic and prosthetic devices using this material, are also taught.
    Type: Application
    Filed: November 24, 2014
    Publication date: May 28, 2015
    Inventor: Gary George Bedard
  • Publication number: 20150140883
    Abstract: A resin composition comprises a polyimide resin, a thermosetting resin, and a filler, the polyimide resin containing a first repeat unit represented by formula (I) and a second repeat unit represented by formula (III), wherein the ratio of the second repeat unit to the polyimide resin is between 5 and 80 mol %.
    Type: Application
    Filed: January 28, 2015
    Publication date: May 21, 2015
    Inventors: Takabumi OOMORI, Keiichi HASEBE
  • Patent number: 9034475
    Abstract: Provided are a thermosetting adhesive composition excellent in storage stability, reliability, and low-temperature adhesion properties; and a curl-resistant heat-resistant film and a wiring film obtained using the composition. The thermosetting adhesive composition includes 100 parts by weight of a phenoxy resin having a bisphenol S skeleton in the structure thereof; 5 to 30 parts by weight of a maleimide compound containing a plurality of maleimide groups in the structure thereof; and 3 to 20 vol % of an inorganic needle-like filler. The heat resistant adhesive film is obtained by applying the thermosetting adhesive composition onto a polyimide film, followed by drying. The wiring film is obtained by placing a conductor wiring layer on the heat resistant adhesive film.
    Type: Grant
    Filed: February 19, 2013
    Date of Patent: May 19, 2015
    Assignee: Hitachi Metals, Ltd.
    Inventors: Satoru Amou, Tomiya Abe, Daisuke Shanai, Hiroaki Komatsu, Kenichi Murakami
  • Patent number: 9034474
    Abstract: A fixing belt includes a cylindrical base composed of a metal and a polyimide resin layer formed on the inner peripheral surface of the cylindrical base, in which the polyimide resin layer has an imidization rate of 70% to 93%, and comprises a polyimide resin containing a specific constitutional unit.
    Type: Grant
    Filed: July 26, 2010
    Date of Patent: May 19, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kazuo Kishino, Katsuhisa Matsunaka, Hiroto Sugimoto, Hidekazu Maruta, Nobuyuki Kume, Keigo Kaji, Ko Nakano
  • Patent number: 9028970
    Abstract: Provided are an adhesive composition with good storage stability, heat resistance, moisture resistance reliability, and adhesion properties; and a curl- and heat-resistant adhesive film and a wiring film using the adhesive composition. The adhesive composition contains 100 parts by weight of a phenoxy resin (A) having plural alcoholic hydroxyl groups in a side chain of the molecule thereof; 2 to 60 parts by weight of a polyfunctional isocyanate compound (B) having an isocyanate group and at least one functional group selected from vinyl, acrylate, and methacrylate groups in the molecule thereof; and 5 to 30 parts by weight of a maleimide compound (C) having plural maleimide groups in the molecule thereof or/and reaction product thereof, in which a total amount of the components (B) and (C) is from 7 to 60 parts by weight.
    Type: Grant
    Filed: February 20, 2013
    Date of Patent: May 12, 2015
    Assignee: Hitachi Metals, Ltd.
    Inventors: Satoru Amou, Tomiya Abe, Daisuke Shanai, Hiroaki Komatsu, Kenichi Murakami
  • Publication number: 20150125692
    Abstract: A multi-layered laminate for producing membranes for electroacoustic transducers, comprises a first layer of a polyether ether ketone film having a heat of crystallisation of at least 15 J/g, a second layer (of a thermoplastic plastic film having a heat of crystallisation of no more than 5 J/g, and an adhesive layer arranged between the first and second layers. Alternatively, the first and second layers are defined by their shrinkage properties after 15 minutes at 200° C.: the first layer has shrinkage of more than 10% in at least one direction, and the second layer has shrinkage of less than 10% in the longitudinal and transverse directions. A laminate constructed in this manner exhibits lower fold formation when processed using multi-cavity thermoforming. The laminates are useful for the production of membranes for electroacoustic transducers.
    Type: Application
    Filed: April 25, 2013
    Publication date: May 7, 2015
    Applicant: TESA SE
    Inventors: Bernhard Müssig, Yeliz Tepe, Michael Egger
  • Patent number: 9023482
    Abstract: Disclosed herein is an optical article including a multilayer optical film and a primer layer disposed on the multilayer optical film. The primer layer consists essentially of a sulfopolyester and a crosslinker. The multilayer optical film may be a reflective film, a polarizer film, a reflective polarizer film, a diffuse blend reflective polarizer film, a diffuser film, a brightness enhancing film, a turning film, a mirror film, or a combination thereof. A microstructured or unstructured optical layer may be disposed on the primer layer opposite the multilayer optical film. Also disclosed herein is a method of making the optical article. Also disclosed herein is a display device including the optical article.
    Type: Grant
    Filed: March 27, 2009
    Date of Patent: May 5, 2015
    Assignee: 3M Innovative Properties Company
    Inventors: James E. Lockridge, Hang K. Loi, Mark J. Pellerite, Jeffrey A. Peterson
  • Patent number: 9017805
    Abstract: The present disclosure relates to a polyimide-graphene composite material and a method for preparing same. More particularly, it relates to a polyimide-graphene composite material prepared by adding modified graphene and a basic catalyst during polymerization of a polyimide precursor so as to improve mechanical strength and electrical conductivity and enable imidization at low temperature and a method for preparing same.
    Type: Grant
    Filed: March 26, 2013
    Date of Patent: April 28, 2015
    Assignee: Korea Institute of Science and Technology
    Inventors: Nam Ho You, Ok-kyung Park, Bon-Cheol Ku, Joong Hee Lee, Munju Goh
  • Publication number: 20150111013
    Abstract: Provided is an a aramid-resin film laminate comprising an aramid paper comprising an aramid fibrid and an aramid short fiber, and a resin film laminated on each other. The aramid-resin film laminate is obtained by conducting a plasma treatment on a surface of the aramid paper, the surface having a skin layer portion whose heat of fusion measured with a differential scanning calorimeter (DSC) is 25 cal/g or less, and bonding the aramid paper and the resin film to each other by heating, pressing, or heating under pressure, with the plasma treated surface of the aramid paper and a plasma treated surface of the resin film facing each other. This laminate is an aramid-resin film laminate in which the aramid paper and the resin film are laminated on each other without using any adhesive agent and without impairing characteristics of both the aramid paper and the resin film, and is excellent in heat resistance, electrical characteristics, chemical resistance, mechanical characteristics, and the like.
    Type: Application
    Filed: April 16, 2013
    Publication date: April 23, 2015
    Inventors: Tatsushi Fujimori, Shinji Naruse, Chihiro Kondo, Yoshihiko Kagetani, Hisashi Katsumata, Masashi Kato
  • Patent number: 9011998
    Abstract: Phase separated blends of polyaryl ether ketones, polyaryl ketones, polyether ketones, polyether ether ketones and mixtures thereof with at least one polysulfone etherimide, wherein the polysulfone etherimide has greater than or equal to 50 mole % of the polymer linkages contain at least one aryl sulfone group are described. Such blends have improved load bearing capability at high temperature. In another aspect a high crystallization temperature, especially at fast cooling rates, is achieved.
    Type: Grant
    Filed: July 10, 2006
    Date of Patent: April 21, 2015
    Assignee: Sabic Global Technologies B.V.
    Inventors: Ashish Aneja, Robert Russell Gallucci, Roy Ray Odle, Kapil Chandrakant Sheth
  • Patent number: 9005749
    Abstract: An intermediate transfer member that includes a mixture of superhydrophobic dimpled polyimide particles, an optional conductive component, and an optional polymer.
    Type: Grant
    Filed: November 21, 2012
    Date of Patent: April 14, 2015
    Assignee: Xerox Corporation
    Inventors: Jennifer A Coggan, Jin Wu
  • Publication number: 20150093568
    Abstract: In an aspect, a window panel for a display device includes a plastic substrate formed of a transparent polyimide, and a first colored hard coating layer disposed at one surface of the plastic substrate is provided.
    Type: Application
    Filed: April 3, 2014
    Publication date: April 2, 2015
    Applicant: Samsung Display Co., Ltd.
    Inventors: Hun Kyo Kim, Ju Suk Oh, Sang Gu Kim, Hyoung Suk Roh
  • Publication number: 20150090574
    Abstract: A touch panel is formed by firstly forming a film layer on a first plate, and next, sequentially forming a buffer layer on the film layer, forming a sensing layer on the buffer layer, forming a second plate on the sensing layer. After the foregoing formation procedures, the first plate is removed from the film layer. Next, a cover is attached to the film layer. In this way, the film layer is located between the cover and the buffer layer. Finally, the second plate is removed from the sensing layer, so as to form a touch panel with the features of light weight, thin thickness and low costs.
    Type: Application
    Filed: August 25, 2014
    Publication date: April 2, 2015
    Inventors: Ching-Shan Lin, Chunyan Wu, Lianjie Ji, Fang Fang
  • Patent number: 8993108
    Abstract: An object of this invention is to provide a polyimide film suitable for use in flexible printed circuit boards and the like which have high flexibility and dimensional stability, and to provide a laminate and metal-clad laminate which uses such a polyimide film. This invention relates to a multilayer polyimide film being a polyimide film having a multilayer structure, including: a core layer; and clad layers provided on each side of the film, which clad layers are exposed, the core layer being a non-thermoplastic polyimide having an average coefficient of linear expansion at a temperature from 100° C. to 200° C. in a range of 5 ppm/° C. to 20 ppm/° C., each of the clad layers being a polyimide having a peeling strength of 3 N/cm or less, the film as a whole having an average coefficient of linear expansion at a temperature range of 100° C. to 200° C. in a range of 9 ppm/° C. to 30 ppm/° C.
    Type: Grant
    Filed: July 18, 2008
    Date of Patent: March 31, 2015
    Assignee: Kaneka Corporation
    Inventors: Masayoshi Shimizu, Hisayasu Kaneshiro, Shogo Fujimoto
  • Publication number: 20150086798
    Abstract: An endless belt comprising a polyimide-based substrate layer. The polyimide-based substrate layer is made by curing a mixture comprising a polyimide precursor and a polyalkylene glycol silicone phosphate. A method of making the polyimide-based substrate layer and a coating composition for making the endless belt are also disclosed.
    Type: Application
    Filed: September 20, 2013
    Publication date: March 26, 2015
    Inventors: Jin Wu, Jonathan H. Herko, Varun Sambhy, Lin Ma
  • Publication number: 20150075603
    Abstract: A coating is described. The coating includes a metal oxide layer, which in turn includes a surface having a water contact angle greater than 90 degrees. A metal-oxide coating composition is also described. The composition includes effective amounts of a first type and a second of metals and an effective amount of oxygen to react with the first type and the second type of metals to produce a first type and a second type of metal oxides, both of which produce a structure that is greater than about 50% (by volume) amorphous.
    Type: Application
    Filed: March 21, 2013
    Publication date: March 19, 2015
    Inventors: Mark Allen George, Ching-Lin Chang, Ravi Prasad
  • Patent number: 8980410
    Abstract: A thermally conductive sheet may include an electrically insulative bottom film, an electrically insulative top film, and an intermediate layer positioned between the bottom film and the top film. The intermediate layer may include a mixture of granulated thermally conductive material and granulated electrically insulating polymer. The granulated electrically insulating polymer is adapted to form a polyimide bridge between the bottom film and the top film.
    Type: Grant
    Filed: March 12, 2014
    Date of Patent: March 17, 2015
    Assignee: Lighting Science Group Corporation
    Inventors: Clyde F. Parrish, Fredric S. Maxik, David E. Bartine
  • Patent number: 8980401
    Abstract: Provided is an optical member where at least a layer having polyimide as a main component and a layer having a textured structure arising from a crystal containing aluminum oxide as a main component are stacked in this order. The polyimide includes a silane group in a side chain via an amide bond.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: March 17, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Tomonari Nakayama, Kenji Makino
  • Publication number: 20150072162
    Abstract: A rapid, scalable methodology for graphene dispersion and concentration with a polymer-organic solvent medium, as can be utilized without centrifugation, to enhance graphene concentration.
    Type: Application
    Filed: July 30, 2014
    Publication date: March 12, 2015
    Inventors: Mark C. Hersam, Yu Teng Liang, Ethan B. Secor, Pradyumna L. Prabhumirashi, Kanan P. Puntambekar, Michael L. Geier
  • Publication number: 20150072477
    Abstract: An adhesive sheet for production of a semiconductor device with bump electrode, including a soft film and an alkali-soluble adhesive film formed on the soft film is capable of exposing the bump electrode without imparting damage to the bump electrode, and then wet etching of an adhesive on bump tops using an aqueous alkali solution makes it possible to put into a state where no adhesive exists on the bump tops, thus enabling the production of a semiconductor device which is excellent in connection reliability after flip chip packaging.
    Type: Application
    Filed: May 21, 2013
    Publication date: March 12, 2015
    Inventors: Kazuyuki Matsumura, Koichi Fujimaru, Toshihisa Nonaka
  • Publication number: 20150072119
    Abstract: A multi-layer structure including an interlayer to relieve stress in the structure, a device including the structure, and a method of forming the device and structure are disclosed. The structure includes a substrate having a first coefficient of thermal expansion, an interlayer, and a coating having a second coefficient of thermal expansion. The interlayer reduces stress in the structure that would otherwise exist in the structure as a result of the difference in coefficients of thermal expansion of the substrate and the coating.
    Type: Application
    Filed: April 12, 2013
    Publication date: March 12, 2015
    Inventors: Steven George, Shih-Hui Jen, Peter Carcia, Robert McLean
  • Publication number: 20150064851
    Abstract: Underfill structures useful as pre-applied underfill materials comprise a polymer layer having a first polymer region and a second polymer region, wherein the second polymer region comprises inorganic filler. Electronic assemblies comprising a chip or die and a substrate are formed using such multi-layer structured pre-applied underfill.
    Type: Application
    Filed: September 3, 2013
    Publication date: March 5, 2015
    Inventors: Michael K. GALLAGHER, Edgardo ANZURES, David FLEMING, Avin V. DHOBLE, Chi Q. TRUONG, Anupam CHOUBEY, Jeffrey M. CALVERT
  • Patent number: RE48141
    Abstract: Disclosed are a transparent polyamide-imide resin and a film using the same, which can be colorless and transparent, can show excellent thermal stability and mechanical properties, and can have low birefringence, making it possible to serve in various fields including a semiconductor insulator, a TFT-LCD insulator, a passivation layer, a liquid crystal alignment layer, materials for optical communication, a protective film for a solar cell, a flexible display substrate and the like.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: August 4, 2020
    Inventors: Chul Ha Ju, Hyo Jun Park, Hak Gee Jung