Abstract: Provided is an optical member where at least a layer having polyimide as a main component and a layer having a textured structure arising from a crystal containing aluminum oxide as a main component are stacked in this order. The polyimide includes a silane group in a side chain via an amide bond.

Abstract: A rapid, scalable methodology for graphene dispersion and concentration with a polymer-organic solvent medium, as can be utilized without centrifugation, to enhance graphene concentration.

Abstract: An adhesive sheet for production of a semiconductor device with bump electrode, including a soft film and an alkali-soluble adhesive film formed on the soft film is capable of exposing the bump electrode without imparting damage to the bump electrode, and then wet etching of an adhesive on bump tops using an aqueous alkali solution makes it possible to put into a state where no adhesive exists on the bump tops, thus enabling the production of a semiconductor device which is excellent in connection reliability after flip chip packaging.

Abstract: A multi-layer structure including an interlayer to relieve stress in the structure, a device including the structure, and a method of forming the device and structure are disclosed. The structure includes a substrate having a first coefficient of thermal expansion, an interlayer, and a coating having a second coefficient of thermal expansion. The interlayer reduces stress in the structure that would otherwise exist in the structure as a result of the difference in coefficients of thermal expansion of the substrate and the coating.

Abstract: Underfill structures useful as pre-applied underfill materials comprise a polymer layer having a first polymer region and a second polymer region, wherein the second polymer region comprises inorganic filler. Electronic assemblies comprising a chip or die and a substrate are formed using such multi-layer structured pre-applied underfill.

Abstract: Disclosed are a liquid crystal alignment agent, a liquid crystal alignment film manufactured using the same, and a liquid crystal display including the liquid crystal alignment film. The liquid crystal alignment agent includes a polymer comprising a polyamic acid including a repeating unit represented by Chemical Formula 1, polyimide including a repeating unit represented by Chemical Formula 2, or a combination thereof: wherein Y1 and Y2 are each independently a divalent organic group derived from diamine, wherein the diamine includes photodiamine represented by Chemical Formula 3 and functional diamine represented by Chemical Formula 5: and wherein the other substituents are the same as defined in the detailed description.

Abstract: An article having a fluid permeation prevention layer, such as a pneumatic tire or hose. A tire for example includes an outer tread layer, intermediate sidewall and carcass layers and an innermost air permeation prevention layer: (i) the air permeation prevention (APP) layer having an upper and a lower surface, the layer having a polymer composition exhibiting an air permeation coefficient (APC) of about 25×10?12 cc cm/cm2 sec cmHg (at 30° C.) or less and a Young's modulus of about 1 MPa to about 500 MPa, the polymer composition comprising: (A) at least 10 wt % of at least one. thermoplastic resin component having an APC of about 25×10?12 cc cm/cm2 sec cmHg (at 30° C.) or less and a Young's modulus of more than 500 MPa, which is preferably a polyamide resin or mixture, and (B) at least 10 wt % of at least one elastomer component having an APC of more than about 25×10?12 cc cm/cm2 sec cmHg (at 30° C.

Abstract: A polyamide-imide resin obtained by a process comprising the step of reacting an aromatic diisocyanate with a diimide dicarboxylic acid containing 40 mol % or more of a compound represented by the following general formula (1) and 20 mol % or more of a compound represented by the following general formula (2).

Abstract: The invention relates in various embodiments to a composite useful as e.g. a medical implant device, and a method of treating fouling, including biofouling as may occur on an implant. The composite comprises a matrix phase and a patterned phase that comprises an energetically activatable wire intermixed with the matrix phase, the wire when energetically activated, which includes thermal activation, causes modification of at least a portion of the matrix phase to treat fouling that might otherwise occur. The method of treating biofouling may be practiced on a patent while the medical implant of the invention is in situ.

Abstract: Provided is an oriented-film-forming composition that can give a laminated body which has a substrate, an oriented film and an optically anisotropic film and which is excellent in heat resistance and light resistance. The oriented-film-forming composition is a composition including an oriented-film-forming material and an antioxidant. The antioxidant is preferably a phenolic antioxidant. The oriented-film-forming material preferably contains at least one selected from the group consisting of polyimides, polyamides and polyamic acids. The composition preferably satisfies Mw(A)/Mw(B)>0.85 wherein Mw(B) represents the weight-average molecular weight of the oriented-film-forming material after the composition is heated at 100° C. for 1 hour, and Mw(A) represents that of the same material before the heating.

Abstract: Filled phase-separated blends of polyaryl ether ketones, polyaryl ketones, polyether ketones, polyether ether ketones and mixtures thereof with at least one polysulfone etherimide, wherein the polysulfone etherimide has greater than or equal to 50 mole % of the polymer linkages contain at least one aryl sulfone group are described. Such filled blends have improved load-bearing capability at high temperature. In another aspect the filled blends have a higher crystallization temperature, especially at fast cooling rates.

Abstract: A resin composition containing (A) a polyimide having acidic functional groups and (B) a compound having functional groups that react with the acidic functional groups, where (a) a solution rate in 3 mass % aqueous sodium hydroxide at 45° C. is 0.95 or more after a heat history of 90° C. for 10 minutes with the solution rate before the heat history assumed to be 1, (b) the solution rate in 3 mass % aqueous sodium hydroxide at 45° C. ranges from 0.001 ?m/sec to 0.02 ?m/sec after the heat history of 180° C. for 60 minutes, (c) a bleed-out amount is 50 mg/m2 or less in storing at 40° C. for 2 weeks after the heat history of 180° C. for 60 minutes, and (d) a thermogravimetric decrease at 260° C. is 2.0% or less in measuring on a temperature rising condition of 10° C./min from 40° C. by thermogravimetric analysis (TG).

Abstract: The present invention provides an encapsulant with a base for use in semiconductor encapsulation, for collectively encapsulating a device mounting surface of a substrate on which semiconductor devices are mounted, or a device forming surface of a wafer on which semiconductor devices are formed, the encapsulant comprising the base, an encapsulating resin layer composed of an uncured or semi-cured thermosetting resin formed on one surface of the base, and a surface resin layer formed on the other surface of the base. The encapsulant enables a semiconductor apparatus having a good appearance and laser marking property to be manufactured.

Abstract: A flexible composite comprising a plastic foil, having an upper and a lower surface, and at least one dielectric barrier layer against gases and liquids which is applied directly to at least one of the surfaces by plasma-enhanced thermal vapor deposition and comprises an inorganic vapor-depositable material, is provided. The flexible composite can be used for constructing flexible circuits or displays and has a high barrier effect with regard to oxygen and/or water vapor.

Abstract: The present application provides an ultrathin shielding film of high shielding effectiveness, comprising two or more solid shielding layers. An electrically-conductive adhesive layer is coated onto the outer surface at one side of the solid shielding layers, and one or more insulation film layers are formed on the outer surface at the other side of the solid shielding layers. A carrier film layer is provided on the outer surface of the insulation film layers. A protective film covers the lower surface of the electrically-conductive adhesive layer. The present application further discloses a manufacturing method of an ultrathin shielding film of high shielding effectiveness.

Abstract: A composition comprising: a first polymer comprising a poly(etherimide-siloxane) copolymer comprising (a) a repeating polyetherimide unit, and (b) a poly(siloxane) block unit, a second polymer different from the first polymer and comprising bromine; and optionally, a third polymer comprising a polycarbonate different from the first polymer and second polymer; wherein polysiloxane block units are present in the composition in an amount of at least 0.3 wt %, and bromine is present in the composition in an amount of at least 7.8 wt %, each based on the sum of the wt % of the first, second, and third polymers; and further wherein an article molded from the composition has an OSU integrated 2 minute heat release test value of less than 65 kW-min/m2 and a peak heat release rate of less than 65 kW/m2, and an E662 smoke test Dmax value of less than 200.

Abstract: A thermoplastic polyimide resin containing a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), a content ratio of the repeating structural unit of formula (2) with respect to the total of the repeating structural unit of formula (1) and the repeating structural unit of formula (2) being from 40 to 70% by mol: wherein R1 represents a divalent group having from 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R2 represents a divalent chain aliphatic group having from 5 to 12 carbon atoms; and X1 and X2 each independently represent a tetravalent group having from 6 to 22 carbon atoms containing at least one aromatic ring.

Abstract: A fuser member having a substrate and a polyimide aerogel layer disposed on the substrate is shown. The polyimide aerogel layer has a porosity of from about 50 percent to about 95 percent. A fluoropolymer surface layer is disposed on the polyimide aerogel layer.

Abstract: Disclosed herein is a conductive polymer composition capable of deteriorating water-absorption property and maintaining electrical conductivity by neutralizing polyethylenedioxythiophene/polystyrenesulfonate (PEDOT/PSS) with dicyclohexylmethylamine which is lipid-soluble tertiary amine, and a conductive film using the same.

Abstract: The present teachings provide a fuser member. The fuser member includes a substrate layer comprising a polyimide polymer and polyethylene glycol ester.

Abstract: An aqueous polyimide precursor solution composition in which a polyamic acid which is obtained by reacting a tetracarboxylic acid component and a diamine component is dissolved in an aqueous solvent together with an imidazole in an amount of 1.6 moles or more per mole of the tetracarboxylic acid component of the polyamic acid.

Abstract: In accordance with the present teachings, there are composite materials, fuser members comprising the composite materials, and methods of making the composite materials. In various embodiments, the composite material can include a polyimide resin having a thermal conductivity and a plurality of passivated aluminum nitride particles substantially uniformly dispersed in the polyimide resin to provide the composite material with a thermal conductivity of about 0.4 W/mK to about 2.5 W/mK, and wherein each of the plurality of passivated aluminum nitride particles can include a passivation layer disposed over an aluminum nitride particle core to inhibit oxidation and thermal degradation of a surface of the aluminum nitride particle core.

Abstract: The present teachings provide a fuser member. The fuser member includes a substrate layer comprising a polyamideimide/polybenzimidazole polymer blend. A method of manufacturing the fuser member is described.

Abstract: A surface-treated polymer film is disclosed. The film has a polymer substrate having a first surface and an opposing second surface and a primer applied to the first surface of the substrate. The primer is a cross-linked acrylic polymer or other suitable polymer. A method of insulating a surface with an insulation material constructed from the surface-treated polymer is also disclosed.

Abstract: A laminate of the present invention comprises a plating-target material including a layer-A, that is subjected to electroless copper plating and has a surface roughness such that an arithmetic mean roughness Ra measured at a cutoff value of 0.002 mm is less than 0.5 ?m. The 90° anti-peeling adhesive force of the layer-A is 1.0 N/25 mm or less. Furthermore, the layer-A includes a polyimide resin having a siloxane structure formed by polymerizing a diamine component having a structure represented by Formula (6) in a content of 5 to 95 mol % based on the entire diamine component. A sheet containing the layer-A has an elongation modulus of 1.8 GPa or less. The plating-target material of the present invention has a high adhesiveness to an electroless plating film formed on its surface, even if the surface is not so rough, and it is possible to favorably form electroless plating on the entire surface.

Abstract: The present invention includes compositions and methods of supplying a corrosion inhibitor including placing a corrosion inhibitor attached to a nanostructure carrier, placing the nanostructure carrier containing the corrosion inhibitor at a location and the nanostructure carrier is capable of releasing the corrosion inhibitor.

Abstract: The present invention is directed to a coating system deposited onto at least a portion of a substrate comprising: an inner coating layer deposited onto at least a portion of the substrate; a viscous gel coating layer deposited onto at least a portion of the inner coating layer wherein the viscous coating layer comprises: (A) the reaction product of: (i) at least one primary amine; (ii) a monofunctional surfactant; and (iii) a liquid polybutadiene; (B) optionally, a fatty acid; and (C) optionally, a secondary swelling agent; and an outer coating layer deposited onto a least a portion of the viscous coating layer; and an outer coating layer deposited onto a least a portion of the viscous coating layer.

Abstract: A cut-out sintered ceramic sheet including a side surface, the entire surface of which is a fracture surface having reliefs, wherein a plastic resin film is adhered onto upper and lower surfaces of the cut-out sintered ceramic sheet.

Abstract: A local probe storage array is provided that includes a substrate, and a polymeric layer over the substrate, the polymeric layer comprising a crosslinking agent that has been cured, the crosslinking agent comprising at least three alkyne groups.

Abstract: This invention relates to a cooking article (1) including a metal dish (2) having a base area (20), a concave internal face (21) intended to be arranged on the side of the food to be placed in said article (1) and a convex external face (22) intended to be arranged toward a heat source, and an external coating (3) covering said external face (22), characterized in that said external coating (3) includes between 30% and 50% by weight, with respect to the entire weight of said coating (3), of at least one polyimide having a glass transition temperature Tg equal to or above 250° C. This invention also relates to a process for producing such an article (1).

Abstract: The present disclosure relates generally to a light emitting diode assembly and a thermal control blanket. The light emitting diode assembly and the thermal control blanket have advantageous reflective and thermal properties.

Abstract: A flexible substrate includes a flexible base substrate and a first passivation layer formed on one surface of the base substrate and made of a material having a coefficient of thermal expansion lower than that of the base substrate.

Abstract: A carrier belt for fabricating a device or component such as an anisotropic conductive film. The carrier belt includes a substrate having a sacrificial image enhancing layer. Microcavities are formed in the carrier by laser ablation through the image enhancing layer. After the image enhancement layer is removed, a plurality of conductive particles are distributed into an array of microcavities formed by laser ablation on a surface of a carrier belt and transferred to an adhesive layer. The image enhancing layer enables one to form microcavities with a fine pitch and spacing and partitions having a high aspect ratio.

Abstract: Processes involving wetting fibers with an aqueous dispersion of micronized thermoplastic powders; processes for producing an aqueous dispersion of micronized thermoplastic powders; processes of chemically surface cross-linking micronized particles; and articles of produced therefrom.

Abstract: Disclosed are a belt member having high wear resistance and thereby capable of maintaining its initial surface properties for a long period of time and a fixing device provided with, the belt member, and an image forming apparatus. The belt member has a belt shape, and its surface is formed of a cured resin including a structural unit derived from urethane (meth)acrylate (A) having at least three (meth)acryloyloxy groups per molecule, a structural unit derived from a polyfunctional monomer (B) having no urethane bond and having at least three (meth)acryloyloxy groups per molecule, and a structural unit derived from a fluorine-modified acrylate (C). The cured resin contains 18 to 63% by mass of the structural unit derived from the urethane(meth)acrylate (A), 18 to 63% by mass of the structural unit derived from the polyfunctional monomer (B), and 10 to 40% by mass of the structural unit derived from the fluorine-modified acrylate(C).

Abstract: To provide a polyamic acid ester-containing polyimide precursor composition having a good storage stability, from which a polyimide film having a high imidization degree and excellent adhesion to an inorganic substrate can be obtained. A polyimide precursor composition comprising a polyamic acid ester, a thermal imidization accelerator and a solvent, wherein the thermal imidization accelerator is a compound which has a carboxy group and an amino group or an imino group which is deprotected by heat to show basicity, and which will not accelerate the imidization of the polyamic acid ester before the protecting group leaves, and a polyimide precursor composition containing a silane coupling agent.

Abstract: According to various embodiments, the present teachings provide an intermediate transfer member including a layer having a phosphorous containing polyamideimide having dispersed therein a conductive additive. A method of manufacturing the intermediate transfer member is provided.

Abstract: An electrical insulation system includes a first insulation layer having a first polymer and a first filler in the form of nanoparticles, and a second insulation layer including a second polymer and a second filler in the form of either chromium oxide, Cr2O3, iron oxide, Fe2O3, or a mixture of chromium oxide and iron oxide. At least one of the insulation layers is in the form of a solid and flat sheet. By an insulation system combining the first insulation layer with well dispersed nanoparticles and the second insulation layer filled with Cr2O3 particles and/or Fe2O3 particles, a synergetic effect of the two insulation layers provides an excellent shield and resistance of the insulation system against electrical discharges. The sheet material allows anybody to put together an insulation system without any special equipment.

Abstract: Disclosed are a polyamic acid solution, a polyimide resin prepared by imidization of the polyamic acid solution, a flexible metal clad laminate using the polyimide resin, and a printed circuit board including the flexible metal clad laminate, wherein the polyamic acid solution includes (a) 3,3?,4,4?-biphenyltetracarboxylic acid dianhydride (BPDA), and pyromellitic dianhydride (PMDA) as aromatic tetracarboxylic acid dianhydride; (b) at least one aromatic diamine; (c) an organic solvent; and (d) an inorganic filler.

Abstract: A transparent electro-conductive laminate comprising: a substrate film made of a polyimide; and a thin film made of an electro-conductive material and stacked on the substrate film, wherein the polyimide is a polyimide containing at least one repeating unit represented by the following general formula (1): [in the formula (1), R1, R2, and R3 each independently represent one selected from the group consisting of a hydrogen atom, alkyl groups having 1 to 10 carbon atoms, and a fluorine atom, R4 represents an aryl group having 6 to 40 carbon atoms, and n represents an integer of 0 to 12], having a glass transition temperature of 350° C. to 450° C., and having a linear expansion coefficient of 30 ppm/° C. or less, the linear expansion coefficient being determined by measuring change in length under a nitrogen atmosphere and under a condition of a rate of temperature rise of 5° C./minute in a temperature range from 50° C. to 200° C.

Abstract: The invention relates to a method for bonding a thermoplastic polymer to a thermosetting polymer component, the thermoplastic polymer having a melting temperature that exceeds the curing temperature of the thermosetting polymer. The method comprises the steps of providing a cured thermosetting polymer component comprising an implant of a thermoplastic polymer at least at the part of the thermosetting polymer component to be bonded, locating a thermoplastic polymer in contact with at least the part to be bonded, heating the assembly to the melting temperature of the thermoplastic polymer, whereby the thermoplastic polymer of the implant melts and fuses with the thermoplastic polymer, and cooling the assembly.

Abstract: A p-type transparent conductive material can comprise a thin film of BCSF on a substrate where the film has a conductivity of at least 1 S/cm. The substrate may be a plastic substrate, such as a polyethersulfone, polyethylene terephthalate, polyimide, or some other suitable plastic or polymeric substrate.

Abstract: This invention relates to a method for making soluble precursors to imides, polyimides, and polymers containing imide groups, and a method of making thin films of the same by solution casting and then removing the solubilizing group to produce thermally stable and insoluble materials.

Abstract: Exemplary embodiments provide materials and methods for a nanocomposite material and a fuser member containing the nanocomposite material in a fusing system, wherein the nanocomposite material can contain a plurality of carbon nanotubes (CNTs) and a plurality of inorganic nano-fillers (INFs) disposed in a polymer matrix to provide the nanocomposite material with desirable properties.

Abstract: An intermediate transfer member includes a poly(amic acid amideimide), or a mixture of a poly(amic acid amideimide), a phosphate ester, an optional polysiloxane, and an optional conductive filler component.

Abstract: The present disclosure discloses a coated substrate for electrophotographic (LEP) printing comprising an ink-receiving layer and a base layer, wherein said ink-receiving layer comprises a reactive polycarbodiimide component and a method for producing the same.

Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.

Abstract: Provided is a transparent laminated film having excellent transparency and heat dimensional stability at high temperatures, which can be produced using a simple production process. This is to be a transparent laminated film, which is a laminated film of a constitution in which a cured layer of curable resin composition is laminated on both sides of a base film, the storage elastic modulus (E?) by dynamic viscoelasticity measurement in the longitudinal direction of the laminated film at 200° C. temperature is greater than the storage elastic modulus (E?) of the base film in the same conditions, and the total light transmittance of the laminated film is 80% or greater.

Abstract: The present invention relates to a copolymer for the photoalignment of liquid crystals comprising a photoreactive group as given below in formula (I), compositions thereof, and its use for optical and electro optical devices, especially liquid crystal devices (LCDs).

Abstract: A polyimide film is effectively formed on a complicated surface. The polyimide film is formed by reacting, on the surface, diamine monomer and tetracarboxylic acid dianhydride monomer both of which are dissolved within carbon dioxide in a supercritical states, together with a polyamic acid resulting from a reaction between the diamine monomer and the tetracarboxylic acid dianhydride reached to the surface.