Abstract: An inorganic nanolayer surface coated polymer film product is disclosed with enhancements such as improved metallization capability, low cost, low polymer additives and modifiers, improved recyclability, and good web properties. Also method for priming a flexible film substrate to enhance the reactivity or wettability of the substrate for metallization is disclosed. A substrate film is coated with one or more nanolayers of a metal or metal oxide applied by CCVD and/or PECVD at open atmosphere. The deposited coating acts to enhance the surface energy of the film substrate and to and reduce the surface gauge variation of the substrate or supporting film, thereby enhancing the wettability of the film substrate for metallization and/or to improve the anti-block characteristics of the film. The deposited coatings may also act as a barrier layer for lowering the permeability of light, gas and vapor transmission through the substrate.

Abstract: The present disclosure is directed to a base film having a chemically converted polyimide, a particulate polyimide matting agent having a density from 1.3 to 1.5 g/cc and either a non-carbon black pigment or a dye. The particulate polyimide matting agent is present in an amount from 1.6 to 20 weight percent of the base film.

Abstract: A conventional polymer is grafted from a plasma polymer layer provided at a substrate surface by radical polymerisation initiated from plasma induced radicals present at or in the plasma polymer, particularly radicals provided during deposition of the plasma polymer.

Abstract: The invention provides a resin composition which develops excellent flame retardance after curing in spite of its being free from halogen-containing compounds and antimony compounds, which are liable to cause environmental load, and which can give a film meeting the recent sever demands for higher flexing resistance and insulation reliability. Specifically, the invention provides a resin composition which comprises (A) a polyimide precursor and (B) an adduct of an organophosphorus compound represented by formula (1) with a compound having four or more (meth)acrylate groups. It is preferable that the resin composition further contain (C) a phosphazene compound.

Abstract: An intermediate transfer member that includes spirodilactam polycarbonates, mixtures of spirodilactam polycarbonates or copolymers of spirodilactam polycarbonates, an optional polysiloxane, and an optional conductive filler component.

Abstract: Provided is a covering material, in which the covering material is a covering material for covering a superconducting wire, a tensile strength at break thereof at ?196° C. is 12.0 N/3 mm or more, and a tensile elongation at break thereof at ?196° C. is 12% or more. The covering material preferably includes a backing made of a polyimide resin. The covering material preferably includes a viscoelastic layer formed on one surface of the backing.

Abstract: A barrier film including a first layer formed of a semicovalent inorganic material and a second layer formed of an ionic inorganic material is provided. Here, the first layer and the second layer are alternately disposed. The barrier film having an improved moisture barrier property compared to a gas-barrier plastic composite film of the prior art manufactured using only a metal oxide or nitride may be provided.

Abstract: Provided are a multilayer polyimide film that hardly suffers from the peeling of the layers from each other or the clouding of a space between the layers (turning white in color) during heating at a high temperature and a flexible metal-clad laminate using such a multilayer polyimide film. This object can be attained by a multilayer polyimide film having a thermoplastic polyimide layer on at least one side of a nonthermoplastic polyimide layer, wherein at least 60% of the total number of moles of an acid dianhydride monomer and a diamine monomer that constitute the thermoplastic polyimide is the same type of monomer as at least one type of acid dianhydride monomer and at least one type of diamine monomer that constitute the nonthermoplastic polyimide.

Abstract: Provided is a covering material, in which the covering material is a covering material for covering a superconducting wire, and a tensile modulus of elasticity at 25° C. is 6.0 GPa or less. Further provided is also a superconducting electric wire, which includes the covering material and a superconducting wire covered with the covering material. Still further provided is an electrical device produced by using the superconducting electric wire.

Abstract: An intermediate transfer media, such as a belt, that includes a first optional polyimide substrate layer, and a second layer of a fluoropolyimide polymer.

Abstract: This invention provides a method for forming multilayer coating film, which comprises successively carrying out a step of applying an intermediate paint onto a coating object to form an intermediate coating film; a step of forming a base coating film by applying onto the intermediate coating film a water-based base coating paint; a step of forming a clear coating film by applying onto the base coating film a clear coating paint, and a step of heating the uncured intermediate coating film, base coating film and clear coating film to simultaneously cure these three coating films; wherein the intermediate paint has a complex viscosity at 40° C. (?*40) of not higher than 100 Pa·sec under the conditions of shear stress, 1.0 Pa and frequency, 0.1 Hz, and a complex viscosity at 80° C. (?*80) of at least 800 Pa·sec under the conditions of shear stress, 1.0 Pa and frequency, 0.1 Hz.

Abstract: Disclosed is a gas-barrier film laminate having at least two gas-barrier film layers laminated via an adhesive layer, wherein the gas-barrier film layer has a substrate film, and at least one constitutive unit layer comprising an anchor coat layer and an inorganic thin film layer formed on at least one surface of the substrate film in that order, and wherein the number of the bubbles having a diameter of at least 0.5 mm and the impurities having a diameter of at least 0.5 mm existing between the gas-barrier film layers is at most 3 in total per 100 cm2.

Abstract: A liquid radiation curable composition for inkjet printing includes a photoinitiating system consisting of one or more diffusion hindered photoinitiators selected from the group consisting of non-polymeric di- or multifunctional initiators, oligomeric or polymeric initiators, and polymerizable initiators, and one or more polymerizable co-initiators, wherein at least one of the polymerizable co-initiators is a polymerizable aromatic tertiary amine. Inkjet inks, an inkjet printing process, and packaging materials may include the liquid radiation curable composition.

Abstract: The infrared reflective layered product can reflect infrared radiation with certain wavelengths to prevent heat accumulation while exhibiting excellent heat resistance. The product includes a base layer (B), a layer (A) layered on one side of the layer (B), and a layer (C) layered on the other side of the layer (B). Layer (A) is a colored resin layer which has an absorptance of a light with a wavelength of 800-1400 nm of not more than 10%. Layer (B) is a thermoplastic resin layer which shows a dimensional change (s) satisfying 1%?s??1% when left at 150° C. for 30 min. Layer C is a colored resin layer having a reflectance of a light with a wavelength of 400-1400 nm of not less than 50%. The product may also include a water vapor barrier layer (D).

Abstract: One embodiment relates to an, article and a method for producing an article including a plurality of substrates, and an adhesive bonded between at least two of the plurality of substrates. The adhesive can include a polycarbonate copolymer that includes reacted resorcinol, siloxane, and bisphenol-A. Another embodiment relates to an article having a first polyimide substrate, a second polyimide substrate, and an adhesive bonded between the first substrate and the second substrate. The article can have a 2 minute integrated heat release rate of less than or equal to 65 kilowatt?minutes per square meter (kW?min/m2) and a peak heat release rate of less than 65 kilowatts per square meter (kW/m2) as measured using the method of FAR F25.4, in accordance with Federal Aviation Regulation FAR 25.853(d).

Abstract: The invention relates to a radiation-curable laminated sheet or film comprising at least one substrate layer and a top layer which comprises a radiation-curable material having a glass transition temperature below 50° C. and having a high double bond density, processes for the production thereof and the use thereof.

Abstract: Disclosed is a laminate structure including a substrate, a wettability changing layer, and an electrical conductor layer, wherein the wettability changing layer and the electrical conductor layer are laminated on the substrate in order, wherein the wettability changing layer contains a polyimide, wherein the polyimide is obtainable by dehydrating and ring-opening a polyamic acid, wherein the polyamic acid is obtainable by ring-opening and addition-polymerizing a diamine and a tetracarboxylic acid dianhydride, wherein the diamine includes a compound represented by a general formula of: or a compound represented by a general formula of: wherein each of R1 and R2 in formula (1) is defined in the specification, and wherein R1 in formula (2) is defined in the specification.

Abstract: The present invention provides new polyimide materials suitable for use in optically transparent fiber composites, ribbon composites, and optical communications applications. The polyimide compounds include monomeric repeat units comprising a fluorinated moiety and a fluorene cardo structure. The polyimides exhibit good optical transparency and have a low absolute thermo-optic coefficient (|dn/dT|).

Abstract: A gas barrier film and method for manufacturing the abovementioned gas barrier film are disclosed in the present invention. The gas barrier film is applied in electronic product, food, medicine and other fields for protecting them from gas and water. The gas barrier film comprises a gas barrier layer and pluralities of cladding layers. The gas barrier layer is a liquid layer, and the cladding layers are disposed on the opposite surface of the gas barrier layer.

Abstract: The present invention relates to a polarizing plate, a method for producing the same, and an image display device comprising the same, and more specifically to a polarizing plate which is characterized by comprising: a) a polarizer, b) a hardening resin layer which is provided on at least one side of the polarizer and formed from a photocurable composition comprising: 4 to 95 parts by weight of (A) a photocurable acrylic polymer, 4 to 95 parts by weight of (B) a poly-functional acrylic monomer, and 1 to 20 parts by weight of (C) a photo-polymerization initiator, based on 100 parts by weight of the photocurable composition, a method for manufacturing the same, and an image display device using the same. According to the present invention, a polarizing plate, which exhibits excellent polarizing properties and durability, has high surface hardness, and may be formed as a thin plate, may be provided.

Abstract: Disclosed is a polyimide film having improved adhesiveness to an adhesive and/or adherence to a metal layer. The polyimide film has at least a polyimide layer (b) and a polyimide layer (a) formed contacting the polyimide layer (b), wherein the polyimide layer (a) is a polyimide formed from a tetracarboxylic dianhydride component and a diamine component containing a diamine compound represented by general formula (1): wherein R1 denotes a hydrogen atom, an alkyl group having 1 to 12 carbon atoms or an aryl group, and R2 denotes an alkyl group having 1 to 12 carbon atoms or an aryl group.

Abstract: The present invention relates generally to polyimide composites having dispersed in the polyimide base matrix, useful spinel crystal fillers wherein the composite has a visible-to-infrared light extinction coefficient between and including 0.05 and 0.60 microns?1. The composite polyimides formed therefrom are typically used to make circuits having fine electrically conductive pathways adjacent to the polyimide substrate. These fine electrically conductive pathways are typically formed on the substrate using an electro-less metal plating step. First, the surface of the polyimide composite is light activated, typically by using a laser beam, then the light activated portions are plated to form thin lines, or pathways, on the film's surface.

Abstract: Embodiments of the present invention provide methods of treating a surface of a substrate. In one particular aspect, embodiments of the present invention provide methods of treating a surface of a substrate that promote binding of one or more metal elements to the surface. According to some embodiments of the invention, films are formed on any conducting, semiconductive or non-conductive surface, by thermal reaction of molecules containing reactive groups in an organic solvent or in aqueous solution. The thermal reaction may be produced under a variety of conditions. In another aspect, the present invention provides a printed circuit board, comprising: at least one substrate; a layer of organic molecules attached to the at least one substrate; and a metal layer atop said layer of organic molecules.

Abstract: A barrier film for a flexible copper substrate comprising a Co—Cr alloy film containing 5 to 30 wt % of Cr and a balance of unavoidable impurities and Co is provided. The barrier film has a thickness of 3 to 150 nm and a film thickness uniformity of 10% or less at 1?. A sputtering target for forming a barrier film comprising a Co—Cr alloy containing 5 to 30 wt % of Cr and a balance of unavoidable impurities and Co is also provided. The relative magnetic permeability in the in-plane direction of the sputtered face of the target is 100 or less. The barrier film for a flexible copper substrate and the sputtering target for forming such barrier film have a film thickness that is thin enough to prevent film peeling and inhibiting the diffusion of copper to a resin film such as polyimide, is capable of obtaining a sufficient barrier effect even in a minute wiring pitch and has barrier characteristics that will not change even when the temperature rises due to heat treatment or the like.

Abstract: The present invention relates to a flexible metal-clad laminate for a printed circuit board and a method of manufacturing the same. The flexible metal-clad laminate includes: a first polyimide layer that is disposed on one surface of the metal-clad and has thermal expansion coefficient of 20 ppm/K or less; and a second polyimide layer that is disposed on one surface of the first polyimide layer and has thermal expansion coefficient of 20 ppm/K or more, wherein a difference between the thermal expansion coefficients of the first and second polyimide layers is within 5 ppm/K and a glass transition temperature Tg of resin of the first polyimide layer is 300° C.<Tg<350° C., which is lower than a maximum curing temperature.

Abstract: The invention provides a flexible base material and a flexible electronic device. The flexible base material includes a flexible substrate having a first surface and a second surface opposite to the first surface. A first organic composite barrier layer is deposited on the first surface of the flexible substrate, wherein the first organic composite barrier layer applies a first stress to the flexible substrate. An anti-curved layer is deposited on the second surface of the flexible substrate, wherein the anti-curved layer applies a second stress, which is cancelled off more than 90% of the first stress, to the flexible substrate.

Abstract: Provided is a flexible and self-supporting insulating film including a base polymer layer and a partially cured poly(amide)imide layer applied to the base polymer layer. The composite insulating film may be used as slot liner to provide insulation to the components of the electric motor. The partially cured poly(amide)imide layer of the composite insulation film maybe further cured by the heat generated by the operation of the electric motor.

Abstract: A reactive mixture for coating moldings by reaction injection molding includes at least 40% by weight of (meth)acrylates having at least two double bonds. The reactive mixture also includes at least one photoinitiator and at least one thermal initiator. Furthermore, a coated molding includes a molding obtainable by injection molding processes. The molding includes polymethyl methacrylate, polymethylmethacrylimide, styrene-acrylonitrile copolymer, styrene-maleic acid copolymer, polymethyl methacrylate copolymer, or a combination thereof. A coating is obtainable by polymerization of (meth)acrylates having at least two double bonds, the coating having an adhesive strength rating of not more than 1 according to the cross hatch test and a decrease in gloss at 20° after a scratch resistance test according to ASTM 1044 (12/05) (applied weight 500 g, number of cycles=100) of not more than 10%.

Abstract: An optical device having a first optical member, a second optical member, and an antistatic layer disposed between the first optical member and the second optical member wherein the antistatic layer contains the reaction product of a mixture comprising at least one polymerizable onium salt having an anion and at least one non-onium polymerizable monomer, oligomer, or polymer.

Abstract: One embodiment relates to an article and a method for producing an article including a plurality of substrates, and an adhesive bonded between at least two of the plurality of substrates. The adhesive can include a polycarbonate copolymer that includes reacted resorcinol, siloxane, and bisphenol-A. Another embodiment relates to an article having a first polyimide substrate, a second polyimide substrate, and an adhesive bonded between the first substrate and the second substrate. The article can have a 2 minute integrated heat release rate of less than or equal to 65 kilowatt-minutes per square meter (kW-min/m2) and a peak heat release rate of less than 65 kilowatts per square meter (kW/m2) as measured using the method of FAR F25.4, in accordance with Federal Aviation Regulation FAR 25.853(d).

Abstract: An intermediate transfer member, such as a belt, that includes, for example, a supporting substrate, a silane first intermediate layer, and contained on the silane layer a second layer of a self crosslinking acrylic resin; a mixture of a glycoluril resin and an acrylic polyol resin; or a mixture of a glycoluril resin and a self crosslinking acrylic resin.

Abstract: A polyimide resin composed of a repeating unit represented by the following formula (1): or composed of the repeating unit represented by the formula (1) and at least one repeating unit represented by the following formula (2): wherein X is the same as defined in the specification, exhibits a good thermoplastic property, a high solubility in solvents and a good heat resistance as well as a low water absorption and an excellent adhesion property. The polyimide resin is useful as the material for the adhesive layer of a metal-clad laminate which is composed of an insulating substrate, a metal layer and an adhesive layer disposed between the insulating substrate and the metal layer.

Abstract: The invention describes novel coating agents that include a polymer, one or more latent reactive groups and one or more noncovalent linking groups, the noncovalent linking groups selected to interact with a substrate to which the coating agent is applied. The coating agents are useful for providing a coating that can be further functionalized (for example, by application of additional coating layers), or for providing desirable properties to a surface.

Abstract: This multilayer component (11) for encapsulating an element (12) which is sensitive to air and/or moisture comprises an organic polymer layer (1) and at least one barrier stack (2). The barrier stack (2) comprises at least three successive thin layers (21-23) having alternately lower and higher degrees of crystallinity, the ratio of the degree of crystallinity of a layer of higher degree of crystallinity to the degree of crystallinity of a layer of lower degree of crystallinity being greater than or equal to 1.1.

Abstract: A substrate comprising a crosslinked polymer primer layer, and grafted thereto a ligand-functionalized polymer is provided. The grafted polymer has the requisite affinity for binding neutral or negatively charged biomaterials, such as cells, cell debris, bacteria, spores, viruses, nucleic acids, and proteins, at pH's near or below the pI's of the biomaterials.

Abstract: An electret in disclosed including a laminate. A layer (A) containing a resin (a) and a layer (B) containing a resin (b) other than the resin (a) or an inorganic substance (c) are directly laminated. The resin (a) is a fluororesin (a1), or a resin (a2) having an alicyclic structure and containing no fluorine atom. The layer (B) is disposed on the outermost surface on a side opposite to the side where electric charge is injected at the time of injecting electric charge into the laminate to form the electret.

Abstract: The disclosure provides in one embodiment a method of promoting adhesion on a composite surface. The method comprises providing a composite structure having at least one composite surface to be bonded. The method further comprises preparing the at least one composite surface. The method further comprises providing a chemical derivatization compound containing active functional groups that promote adhesion. The method further comprises depositing the chemical derivatization compound on the prepared composite surface to form a functional group-adhesive promoter derivatized layer. The method further comprises applying an adhesive layer to the derivatized layer. The method further comprises heat curing the adhesive layer to result in a bond with another structure made of a composite, a metal, or a combination thereof.

Abstract: There is provided a transparent composite conductor. The composite conductor has a first layer that includes a transparent conductive material and a second layer that includes a fluorinated acid polymer.

Abstract: The present teachings provide a fuser member. The fuser member includes a substrate layer comprising a polyimide polymer and an amine neutralized phosphate ester.

Abstract: A polyimide tube composed of a polyimide resin composition in which 5 to 23.5 volume percent of boron nitride and 1 to 15 volume percent of an acicular substance are dispersed as a filler in a polyimide resin on the basis of the total volume of the composition, a method of producing the tube, a method of producing a polyimide varnish used for producing the tube, and a fixing belt including the tube as a base member are provided.

Abstract: Machinable composite molds for use in molding composite structures. The mold includes a mold body having a tool surface that is shaped to provide the molded surface of the composite structure. The mold body is made up of at least one mold layer composed of a quasi-isotropic material composed of a plurality of randomly oriented fiber bundles or chips impregnated with a resin. The use of randomly oriented fiber chips allows post-cure machining of the mold body.

Abstract: Present invention provides a film and an article including the film. The film includes first layer, second layer and third layer. The first layer includes a polymer dielectric material. The second layer is disposed on at least one surface of the first layer and includes inorganic oxide dielectric material. The third layer is disposed on the first or second layer and includes a nitride or oxynitride material.

Abstract: There is provided a resin laminate having a layer construction of a first inorganic material layer/insulating layer/second inorganic material layer or a layer construction of an inorganic material layer/insulating layer, wherein the insulating layer has a multi-layer structure of two or more resin layers of a core insulating layer and an adhesive insulating layer. In this case, the resin laminate has the adhesive insulating layer which can realize optimal etching, is suitable for etching by a wet process, and has excellent adhesion. At least one of the layers constituting the insulating layer is formed of a polyimide resin which comprises repeating units represented by formula (1) and has a glass transition point of 150 to 360° C. and is dissolvable in a basic solution at a rate of more than 3 ?m/min, preferably more than 5 ?m/min, and most preferably more than 8 ?m/min.

Abstract: A durable printed composite material can include a printable layer having an image reverse printed thereon. The printable layer can be a transparent or translucent material. A metallic layer can be adhered to the image side of the printable layer using an adhesive layer. The layers are formed such that at least a portion of the metallic layer is visible through the printable layer. A method of forming a durable printed composite material can include reverse printing an image on a printable layer to form a printed surface. A metallic layer can then be adhered to the printed surface of the printable layer. Heat and pressure can be applied to the metallic layer to produce a durable printed composite material. The metallic layer can be at least partially visible through the printable layer. The durable printed composite material provides a medium which has an image having a reflective metallic background useful in a variety of applications.

Abstract: An intermediate transfer member that includes a mixture of a polyamideimide, a polybenzimidazole, and an optional conductive filler.

Abstract: In various embodiments, the present invention provides electrically conductive and radio frequency (RF) transparent films that include a graphene layer and a substrate associated with the graphene layer. In some embodiments, the graphene layer has a thickness of less than about 100 nm. In some embodiments, the graphene layer of the film is adhesively associated with the substrate. In more specific embodiments, the graphene layer includes graphene nanoribbons that are in a disordered network. Further embodiments of the present invention pertain to methods of making the aforementioned electrically conductive and RF transparent films. Such methods generally include associating a graphene composition with a substrate to form a graphene layer on a surface of the substrate.

Abstract: Disclosed herein is a buffer substrate comprising: a first substrate having a first surface and a second surface opposite to the first surface, the first substrate having one or more through-holes formed therein; a first elastic material component filling the through-holes and covering the second surface of the first substrate; and a second substrate arranged on the first elastic material component arranged on the second surface of the first substrate.

Abstract: The present invention relates to a method for coating a carrier during the production of an electrode for electrical energy stores, in particular for lithium ion cells, using a specific solvent and/or dispersant, characterized in that the solvent and/or dispersant is or comprises N-ethylpyrrolidone.

Abstract: The present teachings provide a fuser member. The fuser member includes a substrate layer comprising a polyimide polymer and an alkylthiophosphate.

Abstract: This invention relates to the composition and a solvent-free process for preparing novel imide oligomers and polymers specifically formulated with effective amounts of a dianhydride such as 2,3,3?,4-biphenyltetra carboxylic dianydride (a-BPDA), at least one aromatic diamine and an endcapped of 4-phenylethynylphthalic anhydride (PEPA) or nadic anhydride to produce imide oligomers that possess a low-melt viscosity of 1-60 poise at 260-280° C. When the imide oligomer melt is cured at about 371° C. in a press or autoclave under 100-500 psi, the melt resulted in a thermoset polyimide having a glass transition temperature (Tg) equal to and above 310° C. A novel feature of this process is that the monomers; namely the dianhydrides, diamines and the endcaps, are melt processable to form imide oligomers at temperatures ranging between 232-280° C. (450-535° F.) without any solvent.