Of Polyimide Patents (Class 428/473.5)
  • Publication number: 20140154490
    Abstract: The present invention aims to provide a non-combustible film having excellent flexibility, excellent moisture resistance, and high mechanical strength. The present invention also aims to provide a dispersion liquid for non-combustible films which is used in production of the non-combustible film, a method for producing a non-combustible film using the above dispersion, and a solar cell back sheet and a flexible board each of which is formed from the above non-combustible film. The present invention further aims to provide a solar cell including the solar cell back sheet. The non-combustible film of the present invention includes a water-insoluble inorganic compound and a heat-resistant synthetic resin, the water-insoluble inorganic compound constituting from 30% by weight to 90% by weight inclusive of the total weight of the non-combustible film, the film exhibiting a flammability of VTM-0 in the UL-94 VTM test.
    Type: Application
    Filed: June 7, 2012
    Publication date: June 5, 2014
    Applicants: SUMITOMO SEIKA CHEMICALS CO., LTD., Tokyo University of Science Educational Foundation Administrative Organization, National Institute of Advanced Industrial Science and Technology
    Inventors: Seiji Bando, Noriyuki Hayashizaka, Yuki Umeda, Kazunori Kawasaki, Takeo Ebina, Hiromichi Hayashi, Manabu Yoshida, Takashi Yamashita
  • Patent number: 8741441
    Abstract: An insulated wire includes a conductor, and an insulating covering layer formed on a periphery of the conductor and including two or more insulating coatings. The insulating coatings include a polyamide-imide resin insulating material represented by chemical formula 1: where R indicates a divalent aromatic diamine including three or more aromatic rings. The insulating coatings are formed by applying and baking the polyamide-imide resin insulating material, and the polyamide-imide resin insulating material is obtained by reacting an imide group containing dicarboxylic acid with a diisocyanate, the imide group containing dicarboxylic acid being obtained by dehydration reaction of a diamine comprising a divalent aromatic diamine including three or more aromatic rings with an acid using an azeotropic solvent.
    Type: Grant
    Filed: July 2, 2010
    Date of Patent: June 3, 2014
    Assignee: Hitachi Metals, Ltd.
    Inventors: Yuki Honda, Tomiya Abe, Hideyuki Kikuchi, Daisuke Hino
  • Patent number: 8734939
    Abstract: The invention relates to a thermally reversible hot melt adhesive that is isocyanate-free, moisture independent, crosslinkable and thermally reversible. The thermally reversible hot melt adhesive may be repeatedly heated and cooled without negatively affecting the performance of the adhesive. The thermally reversible composition may also be used as a primer layer. The thermally reversible hot melt adhesive and primer are particularly well suited for end use applications such as packaging, graphic arts, construction, footwear, textiles, general assembly, automotive and consumer goods.
    Type: Grant
    Filed: December 12, 2011
    Date of Patent: May 27, 2014
    Assignee: Henkel US IP LLC
    Inventors: Donald Herr, Laxmisha M. Sridhar, Andrew Slark
  • Publication number: 20140141255
    Abstract: A laminate body includes a base material, a film-like or a membrane-like undercoat layer that is formed in at least a portion of the outer surface of the base material, and an atomic layer deposition film that is formed on a surface opposite to a surface coming into contact with the base material among both surfaces of the undercoat layer in the thickness direction thereof. At least a portion of precursors of the atomic layer deposition film bind to the undercoat layer, and the atomic layer deposition film is formed into a membrane shape covering the undercoat layer.
    Type: Application
    Filed: January 27, 2014
    Publication date: May 22, 2014
    Applicant: TOPPAN PRINTING CO., LTD.
    Inventors: Mitsuru KANO, JIN SATO, TOSHIAKI YOSHIHARA, MASATO KON
  • Patent number: 8729217
    Abstract: The present invention provides a semi-conductive polyimide film having: a common logarithm of a surface resistivity at 25° C. and 60% RH of 9 to 15 log ?/square; a common logarithm of a volume resistivity of 8 to 15 log ?·cm; a fatigue stress in accordance with a fatigue test complying with JIS K7118, upon a number of repetition being 107, of 160 MPa or more; and a number of durable bending in accordance with an MIT test complying with JIS P8115 of 2,000 times or more, and an intermediate transfer belt and an transfer transportation belt using the semi-conductive polyimide film.
    Type: Grant
    Filed: March 27, 2007
    Date of Patent: May 20, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Masao Nakamura, Masahiro Kanbayashi, Yoshio Oota
  • Publication number: 20140134445
    Abstract: The present invention includes a polymer composition comprising a substrate comprising at least a top layer and a bottom layer in contact at one or more regions and a thermoplastic compound that impregnates the corrugated fibrous sheet material. The thermoplastic compound may have between 1-35 weight percent PVC; 1-20 weight percent PAN; 1-60 weight percent PMA; 1-20 weight percent PAI; and 2-25 weight percent PBA. For example, the composition may have about 2 weight percent PVC; 18 weight percent PAN; 45 weight percent PMA; 15 weight percent PAI; and 20 weight percent PBA.
    Type: Application
    Filed: January 21, 2014
    Publication date: May 15, 2014
    Inventor: Evelyn Yaeger
  • Publication number: 20140134439
    Abstract: A method for solvent-less adhesive bonding is provided comprising depositing thin, functional, polymeric films on one or more substrates and bonding the substrates to each other or to other substrates. Depositing the polymeric films, including, for example, chemically reactive polymers and thermoplastics with adhesive qualities, may be accomplished using an initiated chemical vapor deposition technique compatible with a variety of monomers, including monomers with chemically functional moieties such as amine and epoxy groups. The technique allows for deposition of polymeric films on a wide variety of substrates/devices and provides an alternative for other coating/deposition methods that are incompatible with certain substrates/devices and/or do not provide adequate control over the resulting polymeric film. The provided method is advantageous in that it is applicable to fabrication of hybrid devices and is compatible with microfabrication technology, including that in clean-room settings.
    Type: Application
    Filed: November 12, 2013
    Publication date: May 15, 2014
    Applicant: The Research Foundation for the State University of New York
    Inventor: Magnus Bergkvist
  • Patent number: 8697244
    Abstract: A thermosetting adhesive composition comprising (A) a modified polyamideimide resin that dissolves in organic solvents, (B) a thermosetting resin and (C) a curing agent or curing accelerator.
    Type: Grant
    Filed: May 20, 2008
    Date of Patent: April 15, 2014
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Shigehiro Nakamura, Toshihiko Itou, Youichirou Mansei
  • Publication number: 20140099510
    Abstract: A method of manufacture of a bis(phthalimide) composition includes reacting, in the presence of a solvent and a catalytically active amount of an imidization catalyst selected from quaternary ammonium salts, quaternary phosphonium salts, and combinations thereof, a substituted phthalic anhydride with an organic diamine, wherein conversion to the bis(phthalimide) is 99% complete in less than 6 hours.
    Type: Application
    Filed: October 4, 2012
    Publication date: April 10, 2014
    Inventors: Hendrich Chiong, Surya Prakasha Rao Daliparthi, Hareesh Shamrao Deshpande, Thomas Link Guggenheim, Farid Fouad Khouri, Mahesh Srinivas Kumar, Miguel Angel Navarro De Castro, Roy Ray Odle, Sivakumar P, Dhumal Sunil S, Brennan Alexander Smith, Siva Kumar Sreeramagiri
  • Patent number: 8689846
    Abstract: Construction comprising a tie layer.
    Type: Grant
    Filed: October 27, 2005
    Date of Patent: April 8, 2014
    Assignees: The Yokohama Rubber Co., Ltd., ExxonMobil Chemical Patents Inc.
    Inventors: Glenn E. Jones, Andy Haishung Tsou, Yoshiaki Hashimura, Yoshihiro Soeda
  • Patent number: 8693203
    Abstract: A method for making an electronic device includes forming an interconnect layer stack on a rigid wafer substrate having a plurality of patterned electrical conductor layers, a dielectric layer between adjacent patterned electrical conductor layers, and at least one solder pad on an uppermost patterned electrical conductor layer. An LCP solder mask having at least one aperture therein alignable with the at least one solder pad is formed. The LCP solder mask and interconnect layer stack are aligned and laminated together. Solder is positioned in the at least one aperture. At least one circuit component is attached to the at least one solder pad using the solder.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: April 8, 2014
    Assignee: Harris Corporation
    Inventors: Louis Joseph Rendek, Jr., Michael Weatherspoon, Casey Philip Rodriguez, David Nicol
  • Publication number: 20140093706
    Abstract: The present disclosure discloses a coated substrate for electrophotographic (LEP) printing comprising an ink-receiving layer and a base layer, wherein said ink-receiving layer comprises a reactive polycarbodiimide component and a method for producing the same.
    Type: Application
    Filed: September 28, 2012
    Publication date: April 3, 2014
    Applicant: HEWLETT-PACKARD INDIGO B.V.
    Inventors: Inna Tzomik, Hannoch Ron, Igal Levine
  • Patent number: 8679624
    Abstract: In accordance with the present teachings, there are composite materials, fuser members comprising the composite materials, and methods of making the composite materials. In various embodiments, the composite material can include a polyimide resin having a thermal conductivity and a plurality of passivated aluminum nitride particles substantially uniformly dispersed in the polyimide resin to provide the composite material with a thermal conductivity of about 0.4 W/mK to about 2.5 W/mK, and wherein each of the plurality of passivated aluminum nitride particles can include a passivation layer disposed over an aluminum nitride particle core to inhibit oxidation and thermal degradation of a surface of the aluminum nitride particle core.
    Type: Grant
    Filed: June 5, 2009
    Date of Patent: March 25, 2014
    Assignee: Xerox Corporation
    Inventors: David J. Gervasi, Matthew M. Kelly, Santokh Badesha
  • Patent number: 8679628
    Abstract: There is provided an insulated wire equipped with an insulation film made of polymer alloy, the polymer alloy comprising an amorphous thermosetting resin and an amorphous thermoplastic resin, in which: the insulation film has a sea-island structure; the amorphous thermosetting resin is a sea component of the sea-island structure; and the amorphous thermoplastic resin is an island component of the sea-island structure.
    Type: Grant
    Filed: June 16, 2010
    Date of Patent: March 25, 2014
    Assignees: Hitachi Cable, Ltd., Hitachi Metals, Ltd.
    Inventors: Yuki Honda, Tomiya Abe, Hideyuki Kikuchi, Daisuke Hino
  • Publication number: 20140076397
    Abstract: A color converter comprising at least one layer comprising at least one organic fluorescent colorant and at least one barrier layer having a low permeability to oxygen.
    Type: Application
    Filed: May 9, 2012
    Publication date: March 20, 2014
    Applicant: BASF SE
    Inventors: Gerhard Wagenblast, Martin Koenemann, Sorin Ivanovici, Gerardus De Keyzer, Robert Send
  • Patent number: 8668992
    Abstract: The present invention provides new polyimide materials suitable for use in optically transparent fiber composites, ribbon composites, and optical communications applications. The polyimide compounds include monomeric repeat units comprising a fluorinated moiety and a fluorene cardo structure. The polyimides exhibit good optical transparency and have a low absolute thermo-optic coefficient (|dn/dT|).
    Type: Grant
    Filed: June 1, 2011
    Date of Patent: March 11, 2014
    Assignee: Brewer Science Inc.
    Inventors: Wenbin Hong, Tantiboro Ouattara, Kang Le Wang
  • Publication number: 20140065391
    Abstract: An insulation laminate is disclosed having a base laminate layer, with at least one flat side coated with a layer of an insulating varnish, the insulating varnish including a basecoat; and an added lubricant.
    Type: Application
    Filed: November 4, 2013
    Publication date: March 6, 2014
    Inventor: Jörg NELGES
  • Publication number: 20140065399
    Abstract: The present disclosure provides a flexible graphite sheet and a method for fabricating the same and a composite structure for the same. The method for fabricating a flexible graphite sheet comprises steps of coating an augmenting solution on a first film to form a composite structure, and heating the composite structure such that the first film and the augmenting solution form a flexible graphite sheet, wherein the thermal conducting cross-section of the flexible graphite sheet is larger than the thermal conducting cross-section of the first film, and the thermal conductivity of the flexible graphite sheet ranges from 1200 to 6000 W/m° C.
    Type: Application
    Filed: March 5, 2013
    Publication date: March 6, 2014
    Applicant: HUGE TEMP ENERGY LTD
    Inventors: MING SHENG WENG, LUNG TA HSIAO, CHE LU TSENG, HUNG YUAN LI
  • Patent number: 8663774
    Abstract: A multilayer thermal insulation composite for fire protection applications. The composite includes a fibrous insulation layer, at least one inorganic heat absorbing layer disposed on one side of the fibrous insulation layer, and at least one superinsulation layer disposed on at least one side of the composite adjacent the heat absorbing layer or the fibrous insulation layer. The composite may further include a scrim layer comprising a high temperature resistant, flexible, woven or non-woven scrim or scrim and high temperature resistant material disposed around the multilayer thermal insulation composite partially or substantially totally encapsulating the composite. The composite is lightweight and flexible, exhibits reduced heat transfer to the cold-face, with improved thermal insulation capability.
    Type: Grant
    Filed: April 21, 2011
    Date of Patent: March 4, 2014
    Assignee: Unifrax I LLC
    Inventors: Joseph A. Fernando, Kenneth B. Miller
  • Publication number: 20140050935
    Abstract: A polyimide film includes a polyimide layer including a polyimide base polymer, and a polyimide powder distributed in the polyimide base polymer, the polyimide powder being obtained by reacting a diamine with a dianhydride at a molar ratio of about 1:0.950 to about 1:0.995. Moreover, the polyimide film may have a multilayered structure including at least a second polyimide layer stacked on a surface of the polyimide layer. The second polyimide can also include the polyimide powder at a weight ratio less than about 20 wt % of the total weight of the second polyimide layer. Embodiments described herein also include methods of preparing the polyimide films.
    Type: Application
    Filed: October 22, 2013
    Publication date: February 20, 2014
    Applicant: TAIMIDE TECHNOLOGY INCORPORATION
    Inventors: Chung-Yi CHEN, Chih-Wei LIN, Chi-Huan LO, Shihan TAI
  • Patent number: 8652622
    Abstract: The disclosure provides a polyimide film laminate and a metal clad laminate employing the same. The polyimide film laminate includes a first polyimide film, a second polyimide film disposed on the first polyimide film, and a third polyimide film disposed on the second polyimide film. Particularly, the first polyimide film has a thermal conductivity of between about 0.2-0.9 watts/m·K and a breakdown voltage greater than about 3KV, the second polyimide film has a thermal conductivity of more than about 1 watts/m·K, and the third polyimide film has a thermal conductivity of between about 0.2-0.9 watts/m·K and a breakdown voltage greater than about 3KV.
    Type: Grant
    Filed: June 13, 2011
    Date of Patent: February 18, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Charng-Shing Lu, Si-Yi Chin, Shur-Fen Liu, Jinn-Shing King
  • Patent number: 8652628
    Abstract: The present teachings provide a fuser member. The fuser member includes a substrate layer comprising a polymer blend polyimide polymer and amino silicone.
    Type: Grant
    Filed: March 25, 2011
    Date of Patent: February 18, 2014
    Assignee: Xerox Corporation
    Inventor: Jin Wu
  • Publication number: 20140023847
    Abstract: A polyimide film having no foaming during heating or other problems, as well as a polyimide laminate-metal laminate in which the polyimide film and a metal layer are laminated. The polyimide film includes a polyimide layer (b), and a polyimide layer (a) laminated in contact with the polyimide layer (b), a side of the polyimide layer (b) which is not in contact with the polyimide layer (a) exhibits thermal fusion bondability, a side of the polyimide layer (a) which is not in contact with the polyimide layer (b) does not exhibit thermal fusion bondability, and the polyimide layer (a) includes a polyimide formed from a tetracarboxylic acid component containing 2,3,3?,4?-biphenyltetracarboxylic dianhydride and a diamine component.
    Type: Application
    Filed: March 28, 2012
    Publication date: January 23, 2014
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Takuro Kochiyama, Eiji Masui, Keiichi Yanagida, Takeshi Uekido
  • Patent number: 8632952
    Abstract: Provided are a photosensitive resin composition which is soluble in an alkaline aqueous solution and which has a good propagation loss in a visible light wavelength region, a photosensitive resin cured matter, a photosensitive resin film, a photosensitive resin film cured matter and an optical waveguide obtained by using the same. Provided are, to be specific, a photosensitive resin composition comprising (A) a vinyl polymer having at least one chain-polymerizable functional group in a molecule, (B) a polymerizable compound and (C) a polymerization initiator, wherein the component (C) is at least one selected from the group consisting of 2-[2-oxo-2-phenylacetoxyethoxy]ethyl oxyphenylacetate, 2-(2-hydroxyethoxy)ethyl oxyphenylacetate and oligo{2-hyroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]}propanone, a photosensitive resin cured matter, a photosensitive resin film, a photosensitive resin film cured matter and an optical waveguide obtained by using the same.
    Type: Grant
    Filed: November 17, 2008
    Date of Patent: January 21, 2014
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Kouji Suzumura, Tatsuya Makino, Atsushi Takahashi
  • Patent number: 8623968
    Abstract: A polyimide precursor composition includes a polyamic acid including a repeating unit represented by Chemical Formula 1 and diisocyanate represented by Chemical Formula 2. OCN-A2-NCO??Chemical Formula 2 The diisocyanate represented by Chemical Formula 2 is included in an amount of about 0.01 moles to about 10 moles based on 100 moles of the repeating unit represented by Chemical Formula 1 in the polyamic acid.
    Type: Grant
    Filed: September 7, 2011
    Date of Patent: January 7, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Eun Seog Cho, Byung Hee Sohn, Young Suk Jung, Yoo Seong Yang, Sang Mo Kim
  • Patent number: 8623515
    Abstract: Disclosed is a liquid crystal alignment agent that includes a polymer including polyamic acid including a repeating unit represented by the following Chemical Formula 1, polyimide including a repeating unit represented by the following Chemical Formula 2, or a combination thereof. In Chemical Formulae 1 and 2, X1, X2, Y1 and Y2 are the same as defined in the detailed description.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: January 7, 2014
    Assignee: Cheil Industries Inc.
    Inventors: Jae-Deuk Yang, Eun-Ha Kim, Myoung-Youp Shin, Yong-Sik Yoo, Guk-Pyo Jo, Jung-Gon Choi
  • Publication number: 20140004349
    Abstract: Some embodiments provided herein relate to a thermoplastic material that can include a thermoplastic surface, a protective coating, and a degradable intermediate layer.
    Type: Application
    Filed: March 30, 2012
    Publication date: January 2, 2014
    Applicant: Empire Technology Development LLC
    Inventor: Nicholas D. Buker
  • Patent number: 8617712
    Abstract: An intermediate transfer member that includes biaryl polycarbonates, an optional polysiloxane, and an optional conductive filler component.
    Type: Grant
    Filed: August 2, 2011
    Date of Patent: December 31, 2013
    Assignee: Xerox Corporation
    Inventor: Jin Wu
  • Publication number: 20130295309
    Abstract: A resin composition, preferably an adhesive composition, comprising a polyether polyamide elastomer capable of being strongly bended with a polyimide resin, preferably strongly bended through an easy process to form an interface between the polyimide resin and the composition, and a bonded composite having the resin composition and a polyimide resin which together form an interface to be bonded with each other. A resin composition for forming an interface together with a polyimide resin for bonding, wherein the resin composition comprises a polyether polyamide elastomer (component R) obtained by subjecting a specific aminocarboxylic acid compound A1 and/or lactam compound A2, polyether compound B, and dicarboxylic acid compound C to polymerization, wherein the content of the component R in the resin composition is 80 to 100% by weight.
    Type: Application
    Filed: December 28, 2011
    Publication date: November 7, 2013
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Yuma Irisa, Shuichi Maeda
  • Patent number: 8574720
    Abstract: The present disclosure is directed to a base film having a thickness from 8 to 152 microns, a 60 degree gloss value from 2 to 35, an optical density greater than or equal to 2 and a dielectric strength greater than 1400 V/mil. The base film comprises a chemically converted (partially or wholly aromatic) polyimide in an amount from 71 to 96 weight percent of the base film. The base film further comprises a pigment and a matting agent. The matting agent is present in an amount from 1.6 to 10 weight percent of the base film, has a median particle size from 1.3 to 10 microns, and has a density from 2 to 4.5 g/cc. The pigment is present in an amount from 2 to 9 weight percent of the base film. The present disclosure is also directed to coverlay films comprising the base film in combination with an adhesive layer.
    Type: Grant
    Filed: July 23, 2010
    Date of Patent: November 5, 2013
    Assignee: E.I. du Pont de Nemours & Company
    Inventors: Thomas Edward Carney, Jeffrey Michael Bartolin, Meredith L. Dunbar, Scott John Herrmann
  • Patent number: 8568868
    Abstract: Disclosed is a gas-barrier film laminate having at least two gas-barrier film layers laminated via an adhesive layer, wherein the gas-barrier film layer has a substrate film, and at least one constitutive unit layer comprising an anchor coat layer and an inorganic thin film layer formed on at least one surface of the substrate film in that order, and wherein the number of the bubbles having a diameter of at least 0.5 mm and the impurities having a diameter of at least 0.5 mm existing between the gas-barrier film layers is at most 3 in total per 100 cm2.
    Type: Grant
    Filed: August 24, 2012
    Date of Patent: October 29, 2013
    Assignee: Mitsubishi Plastics, Inc.
    Inventors: Tsutomu Matsui, Shigenobu Yoshida
  • Patent number: 8568867
    Abstract: A solvent cast film comprises a polyimide comprising structural units derived from polymerization of a dianhydride component comprising a dianhydride selected from the group consisting of 3,4?-oxydiphthalic dianhydride, 3,3?-oxydiphthalic dianhydride, 4,4?-oxydiphthalic dianhydride, and combinations thereof, with a diamine component comprising 4,4?-diaminodiphenylsulfone; wherein the polyimide has a glass transition temperature from 190° C. to 400° C.; and wherein the film has a coefficient of thermal expansion of less than 60 ppm/° C., a thickness from 0.1 to 250 micrometers, endless than 5% residual solvent by weight.
    Type: Grant
    Filed: June 6, 2007
    Date of Patent: October 29, 2013
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Kwok Pong Chan, Erik Hagberg, Tara J. Mullen, Roy Ray Odle
  • Patent number: 8563116
    Abstract: There is described a method for producing a fuser member. The method includes obtaining a substrate and positioning a fluoroplastic sleeve around the substrate. The outer surface of the fluoroplastic sleeve is roughened to a surface roughness of between about 0.03 ?m Ra and about 3 ?m Ra. The outer surface is coated with a functional silicone oil.
    Type: Grant
    Filed: September 2, 2010
    Date of Patent: October 22, 2013
    Assignee: Xerox Corporation
    Inventors: Patrick J. Finn, Kenneth R. Rasch
  • Publication number: 20130273797
    Abstract: This invention relates to electrically conductive polymers grafted to the surface of insulating polymers. Simultaneous polymerization and grafting reactions of conducting precursors form conductive polymer layers that dramatically increase the electrical conductivity of the respective insulating polymer films.
    Type: Application
    Filed: March 14, 2013
    Publication date: October 17, 2013
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: SIMONA PERCEC, CONOR GORDON BOLAS
  • Publication number: 20130265522
    Abstract: A film for a backlight unit including a semiconductor nanocrystal-polymer composite film including a semiconductor nanocrystal and a matrix polymer in which the semiconductor nanocrystal is dispersed, wherein the matrix polymer is a polymer produced by a polymerization of a multifunctional photo-curable oligomer, a mono-functional photo-curable monomer, and a multifunctional photo-curable cross-linking agent, the multifunctional photo-curable oligomer has an acid value of less than or equal to about 0.1 mg of KOH/g, and a content (A1) of a first structural unit derived from the multifunctional photo-curable oligomer, a content (A2) of a second structural unit derived from the mono-functional photo-curable monomer, and a content (A3) of a third structural unit derived from the multifunctional photo-curable cross-linking agent satisfy Equation 1: A1<(A2+A3).
    Type: Application
    Filed: March 15, 2013
    Publication date: October 10, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chul Ho JUNG, Hyun A. KANG, Soo Kyung KWON, Won Joo LEE, Eun Joo JANG, Hyo Sook JANG, Shin Ae JUN, Oul CHO, In Taek HAN
  • Publication number: 20130260094
    Abstract: Disclosed herein are substrates which have been dry coated with a layered material. Generally, a layered material precursor composition is mixed with a milling medium so that the milling medium is coated with the layered material. The substrate is then contacted with the coated milling medium. The layered material on the milling medium transfers to the substrate to form a coating on the substrate. In particular, conductive films can be formed on a substrate without the need for additives such as a surfactant or a polymeric binder.
    Type: Application
    Filed: April 3, 2012
    Publication date: October 3, 2013
    Applicant: Xerox Corporation
    Inventors: Yiliang Wu, Sandra J. Gardner, Ping Liu, Nan-Xing Hu
  • Publication number: 20130255881
    Abstract: An internal member of a plasma processing vessel includes a base material and a film formed by thermal spraying of ceramic on a surface of the base material. The film is formed of ceramic which includes at least one kind of element selected from the group consisting of B, Mg, Al, Si, Ca, Cr, Y, Zr, Ta, Ce and Nd. In addition, at least a portion of the film is sealed by a resin.
    Type: Application
    Filed: May 24, 2013
    Publication date: October 3, 2013
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Kouji MITSUHASHI, Hiroyuki NAKAYAMA, Nobuyuki NAGAYAMA, Tsuyoshi MORIYA, Hiroshi NAGAIKE
  • Patent number: 8545988
    Abstract: Compositions and articles of manufacture made therefrom for use in high temperature application, such as automotive reflectors, have a minimum haze onset temperature of about 205° C. and are made from a transparent, miscible blend of from about 30 to about 70 weight percent of a polyetherimide sulfone comprising greater than or equal to 50 mole percent of the polymer linkages have an aryl sulfone group and from about 70 to about 30 weight percent of a polyetherimide or polyimide.
    Type: Grant
    Filed: December 31, 2008
    Date of Patent: October 1, 2013
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Norimitsu Yamaguchi, Roy Ray Odle, Sanjay Mishra
  • Patent number: 8545989
    Abstract: An intermediate transfer member that includes a mixture of a poly(amic acid amideimide), a tertiary amine, an optional phosphate ester, an optional polysiloxane or an optional fluoro polymer, and an optional conductive filler component.
    Type: Grant
    Filed: June 3, 2011
    Date of Patent: October 1, 2013
    Assignee: Xerox Corporation
    Inventor: Jin Wu
  • Patent number: 8545975
    Abstract: A solvent cast film comprises a polyimide comprising structural units derived from polymerization of a dianhydride component comprising a dianhydride selected from the group consisting of 3,4?-oxydiphthalic dianhydride, 3,3?-oxydiphthalic dianhydride, 4,4?-oxydiphthalic dianhydride, and combinations thereof, with a diamine component comprising 4,4?-diaminodiphenylsulfone; wherein the polyimide has a glass transition temperature from 190° C. to 400° C.; and wherein the film has a coefficient of thermal expansion of less than 60 ppm/° C., a thickness from 0.1 to 250 micrometers, endless than 5% residual solvent by weight.
    Type: Grant
    Filed: June 6, 2007
    Date of Patent: October 1, 2013
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Kwok Pong Chan, Erik Hagberg, Tara J. Mullen, Roy Ray Odle
  • Publication number: 20130251947
    Abstract: The present invention relates generally to optical retardation films. The invention may be used as optical element in liquid crystal display (LCD) devices, particularly as phase-shifting component of LCDs of both reflection and transmission type, and in ant other field of science and technology where optical retardation films are applied such as architecture, automobile industry, decoration arts. The present invention provides an optical film comprising a substrate having front and rear surfaces, and at least one solid optical retardation layer on the front surface of the substrate. The solid optical retardation layer comprises organic rigid rod-like macromolecules based on 2,2?-disulfo-4,4?-benzidine terephthalamide-isophthalamide copolymer or its salt of the general structural formula I. The solid optical retardation layer is a negative C-type or Ac-type plate substantially transparent to electromagnetic radiation in the visible spectral range.
    Type: Application
    Filed: February 8, 2013
    Publication date: September 26, 2013
    Applicant: CRYSOPTIX KK
    Inventor: Alexander Lazarev
  • Patent number: 8541049
    Abstract: Provided is an optical member capable of keeping a high performance antireflection effect over a long period of time with respect to an arbitrary substrate. The optical member has plural layers on a substrate, and includes at least one metal oxide layer having a void, and at least one layer containing an organic resin as a main component formed between the substrate and the metal oxide layer. The metal oxide layer is a plate crystal layer formed of a plate crystal containing aluminum oxide as a main component and a surface of the plate crystal layer has an uneven profile. The organic resin has an aromatic ring and/or a hetero ring in at least a part thereof.
    Type: Grant
    Filed: March 12, 2012
    Date of Patent: September 24, 2013
    Assignee: Canon Kabushiki Kaisha
    Inventors: Tomonari Nakayama, Masayuki Yamada
  • Patent number: 8541107
    Abstract: The present disclosure is directed to a base film having a thickness from 8 to 152 microns, a 60 degree gloss value from 2 to 35, an optical density greater than or equal to 2 and a dielectric strength greater than 1400 V/mil. The base film comprises a chemically converted (partially or wholly aromatic) polyimide in an amount from 63 to 96 weight percent of the base film. The base film further comprises a pigment and a matting agent. The matting agent is present in an amount from 1.6 to 10 weight percent of the base film, has a median particle size from 1.3 to 10 microns, and has a density from 2 to 4.5 g/cc. The pigment is present in an amount from 2 to 35 weight percent of the base film. The present disclosure is also directed to coverlay films comprising the base film in combination with an adhesive layer.
    Type: Grant
    Filed: August 5, 2010
    Date of Patent: September 24, 2013
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Thomas Edward Carney, Jeffrey Michael Bartolin, Meredith L Dunbar, Scott John Herrmann
  • Patent number: 8541108
    Abstract: The present teachings provide a fuser member. The fuser member includes a substrate layer comprising a polyimide polymer and a hydroxyl terminated polybutadiene. A method of manufacturing a fuser member containing a polyimide polymer and a hydroxyl terminated polybutadiene is presented.
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: September 24, 2013
    Assignee: Xerox Corporation
    Inventor: Jin Wu
  • Publication number: 20130244046
    Abstract: The present invention includes a polymer composition comprising a substrate comprising at least a top layer and a bottom layer in contact at one or more regions and a thermoplastic compound that impregnates the corrugated fibrous sheet material. The thermoplastic compound may have between 1-35 weight percent PVC; 1-20 weight percent PAN; 1-60 weight percent PMA; 1-20 weight percent PAI; and 2-25 weight percent PBA. For example, the composition may have about 2 weight percent PVC; 18 weight percent PAN; 45 weight percent PMA; 15 weight percent PAI; and 20 weight percent PBA.
    Type: Application
    Filed: April 11, 2013
    Publication date: September 19, 2013
    Inventors: Galen W. Hartman, Anne Yaeger
  • Publication number: 20130236702
    Abstract: An antistatic article having an antistatic layer disposed on a substrate is disclosed herein. The antistatic layer is formed from a cationic copolymer, a non-cationic (meth)acrylic polymer, and a crosslinking agent. The cationic copolymer consists essentially of a cationic monomer, a hydrophobic monomer, a crosslinkable monomer, and an optional nitrogen-containing monomer. The substrate may comprise an optical film such as a multilayer optical film. Methods for making the antistatic article and display devices containing the antistatic article are also disclosed.
    Type: Application
    Filed: April 24, 2013
    Publication date: September 12, 2013
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Mark J. Pellerite, Mahfuza B. Ali, Eileen M. Haus, Gregory F. King, James E. Lockridge, Hang K. Loi, Jeffrey A. Peterson
  • Patent number: 8524371
    Abstract: An intermediate transfer media, such as a belt, that includes a first optional polyimide substrate layer, and a second layer of a fluoropolyimide polymer.
    Type: Grant
    Filed: November 26, 2012
    Date of Patent: September 3, 2013
    Assignee: Xerox Corporation
    Inventors: Jin Wu, Yu Qi, Nan-Xing Hu, Yuhua Tong
  • Publication number: 20130220674
    Abstract: Provided are an adhesive composition with good storage stability, heat resistance, moisture resistance reliability, and adhesion properties; and a curl- and heat-resistant adhesive film and a wiring film using the adhesive composition. The adhesive composition contains 100 parts by weight of a phenoxy resin (A) having plural alcoholic hydroxyl groups in a side chain of the molecule thereof; 2 to 60 parts by weight of a polyfunctional isocyanate compound (B) having an isocyanate group and at least one functional group selected from vinyl, acrylate, and methacrylate groups in the molecule thereof; and 5 to 30 parts by weight of a maleimide compound (C) having plural maleimide groups in the molecule thereof or/and reaction product thereof, in which a total amount of the components (B) and (C) is from 7 to 60 parts by weight.
    Type: Application
    Filed: February 20, 2013
    Publication date: August 29, 2013
    Applicants: HITACHI CABLE, LTD., HITACHI CABLE FINE-TECH, LTD.
    Inventors: Hitachi Cable Fine-Tech, Ltd., Hitachi Cable, Ltd.
  • Patent number: 8518550
    Abstract: A polyimide wherein a tetracarboxylic dianhydride including 3,3?,4,4?-phenyltetracarboxylic dianhydride as the essential component is the starting tetracarboxylic dianhydride component, and an amine comprising between 0.5 and 30 mole percent of a diamine represented by the following general formula is the starting diamine component. (wherein A is a direct bond or a crosslinking group, and R1-R4 each represent a substituent). It is possible to obtain a polyimide, a polyimide film and a laminated body with an improved adhesion property and an improved moisture permeation rate, even without surface treatment, comprising, as the essential tetracarboxylic dianhydride, 3,3?,4,4?-biphenyltetracarboxylic dianhydride which has conventionally only yielded polyimides with low adhesive strength.
    Type: Grant
    Filed: August 30, 2005
    Date of Patent: August 27, 2013
    Assignee: UBE Industries, Ltd.
    Inventors: Hiroaki Yamaguchi, Masato Murakami, Masafumi Kohda
  • Patent number: 8512722
    Abstract: The disclosure provides methods and materials suitable for preparing coating layers on substrates. The coatings comprise quaternary amine groups and therefore impart anti-bacterial properties to the substrate. In one embodiment, for example, there is provided a quaternary amine-containing polymeric coating comprising propylene and ethylene repeat units.
    Type: Grant
    Filed: July 23, 2010
    Date of Patent: August 20, 2013
    Assignees: California Institute of Technology, University of Southern California
    Inventors: Choon Woo Lee, Robert H. Grubbs, Mark Humayun