Of Polyimide Patents (Class 428/473.5)
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Publication number: 20140154490Abstract: The present invention aims to provide a non-combustible film having excellent flexibility, excellent moisture resistance, and high mechanical strength. The present invention also aims to provide a dispersion liquid for non-combustible films which is used in production of the non-combustible film, a method for producing a non-combustible film using the above dispersion, and a solar cell back sheet and a flexible board each of which is formed from the above non-combustible film. The present invention further aims to provide a solar cell including the solar cell back sheet. The non-combustible film of the present invention includes a water-insoluble inorganic compound and a heat-resistant synthetic resin, the water-insoluble inorganic compound constituting from 30% by weight to 90% by weight inclusive of the total weight of the non-combustible film, the film exhibiting a flammability of VTM-0 in the UL-94 VTM test.Type: ApplicationFiled: June 7, 2012Publication date: June 5, 2014Applicants: SUMITOMO SEIKA CHEMICALS CO., LTD., Tokyo University of Science Educational Foundation Administrative Organization, National Institute of Advanced Industrial Science and TechnologyInventors: Seiji Bando, Noriyuki Hayashizaka, Yuki Umeda, Kazunori Kawasaki, Takeo Ebina, Hiromichi Hayashi, Manabu Yoshida, Takashi Yamashita
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Patent number: 8741441Abstract: An insulated wire includes a conductor, and an insulating covering layer formed on a periphery of the conductor and including two or more insulating coatings. The insulating coatings include a polyamide-imide resin insulating material represented by chemical formula 1: where R indicates a divalent aromatic diamine including three or more aromatic rings. The insulating coatings are formed by applying and baking the polyamide-imide resin insulating material, and the polyamide-imide resin insulating material is obtained by reacting an imide group containing dicarboxylic acid with a diisocyanate, the imide group containing dicarboxylic acid being obtained by dehydration reaction of a diamine comprising a divalent aromatic diamine including three or more aromatic rings with an acid using an azeotropic solvent.Type: GrantFiled: July 2, 2010Date of Patent: June 3, 2014Assignee: Hitachi Metals, Ltd.Inventors: Yuki Honda, Tomiya Abe, Hideyuki Kikuchi, Daisuke Hino
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Patent number: 8734939Abstract: The invention relates to a thermally reversible hot melt adhesive that is isocyanate-free, moisture independent, crosslinkable and thermally reversible. The thermally reversible hot melt adhesive may be repeatedly heated and cooled without negatively affecting the performance of the adhesive. The thermally reversible composition may also be used as a primer layer. The thermally reversible hot melt adhesive and primer are particularly well suited for end use applications such as packaging, graphic arts, construction, footwear, textiles, general assembly, automotive and consumer goods.Type: GrantFiled: December 12, 2011Date of Patent: May 27, 2014Assignee: Henkel US IP LLCInventors: Donald Herr, Laxmisha M. Sridhar, Andrew Slark
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Publication number: 20140141255Abstract: A laminate body includes a base material, a film-like or a membrane-like undercoat layer that is formed in at least a portion of the outer surface of the base material, and an atomic layer deposition film that is formed on a surface opposite to a surface coming into contact with the base material among both surfaces of the undercoat layer in the thickness direction thereof. At least a portion of precursors of the atomic layer deposition film bind to the undercoat layer, and the atomic layer deposition film is formed into a membrane shape covering the undercoat layer.Type: ApplicationFiled: January 27, 2014Publication date: May 22, 2014Applicant: TOPPAN PRINTING CO., LTD.Inventors: Mitsuru KANO, JIN SATO, TOSHIAKI YOSHIHARA, MASATO KON
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Patent number: 8729217Abstract: The present invention provides a semi-conductive polyimide film having: a common logarithm of a surface resistivity at 25° C. and 60% RH of 9 to 15 log ?/square; a common logarithm of a volume resistivity of 8 to 15 log ?·cm; a fatigue stress in accordance with a fatigue test complying with JIS K7118, upon a number of repetition being 107, of 160 MPa or more; and a number of durable bending in accordance with an MIT test complying with JIS P8115 of 2,000 times or more, and an intermediate transfer belt and an transfer transportation belt using the semi-conductive polyimide film.Type: GrantFiled: March 27, 2007Date of Patent: May 20, 2014Assignee: Nitto Denko CorporationInventors: Masao Nakamura, Masahiro Kanbayashi, Yoshio Oota
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Publication number: 20140134445Abstract: The present invention includes a polymer composition comprising a substrate comprising at least a top layer and a bottom layer in contact at one or more regions and a thermoplastic compound that impregnates the corrugated fibrous sheet material. The thermoplastic compound may have between 1-35 weight percent PVC; 1-20 weight percent PAN; 1-60 weight percent PMA; 1-20 weight percent PAI; and 2-25 weight percent PBA. For example, the composition may have about 2 weight percent PVC; 18 weight percent PAN; 45 weight percent PMA; 15 weight percent PAI; and 20 weight percent PBA.Type: ApplicationFiled: January 21, 2014Publication date: May 15, 2014Inventor: Evelyn Yaeger
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Publication number: 20140134439Abstract: A method for solvent-less adhesive bonding is provided comprising depositing thin, functional, polymeric films on one or more substrates and bonding the substrates to each other or to other substrates. Depositing the polymeric films, including, for example, chemically reactive polymers and thermoplastics with adhesive qualities, may be accomplished using an initiated chemical vapor deposition technique compatible with a variety of monomers, including monomers with chemically functional moieties such as amine and epoxy groups. The technique allows for deposition of polymeric films on a wide variety of substrates/devices and provides an alternative for other coating/deposition methods that are incompatible with certain substrates/devices and/or do not provide adequate control over the resulting polymeric film. The provided method is advantageous in that it is applicable to fabrication of hybrid devices and is compatible with microfabrication technology, including that in clean-room settings.Type: ApplicationFiled: November 12, 2013Publication date: May 15, 2014Applicant: The Research Foundation for the State University of New YorkInventor: Magnus Bergkvist
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Patent number: 8697244Abstract: A thermosetting adhesive composition comprising (A) a modified polyamideimide resin that dissolves in organic solvents, (B) a thermosetting resin and (C) a curing agent or curing accelerator.Type: GrantFiled: May 20, 2008Date of Patent: April 15, 2014Assignee: Hitachi Chemical Company, Ltd.Inventors: Shigehiro Nakamura, Toshihiko Itou, Youichirou Mansei
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Publication number: 20140099510Abstract: A method of manufacture of a bis(phthalimide) composition includes reacting, in the presence of a solvent and a catalytically active amount of an imidization catalyst selected from quaternary ammonium salts, quaternary phosphonium salts, and combinations thereof, a substituted phthalic anhydride with an organic diamine, wherein conversion to the bis(phthalimide) is 99% complete in less than 6 hours.Type: ApplicationFiled: October 4, 2012Publication date: April 10, 2014Inventors: Hendrich Chiong, Surya Prakasha Rao Daliparthi, Hareesh Shamrao Deshpande, Thomas Link Guggenheim, Farid Fouad Khouri, Mahesh Srinivas Kumar, Miguel Angel Navarro De Castro, Roy Ray Odle, Sivakumar P, Dhumal Sunil S, Brennan Alexander Smith, Siva Kumar Sreeramagiri
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Patent number: 8689846Abstract: Construction comprising a tie layer.Type: GrantFiled: October 27, 2005Date of Patent: April 8, 2014Assignees: The Yokohama Rubber Co., Ltd., ExxonMobil Chemical Patents Inc.Inventors: Glenn E. Jones, Andy Haishung Tsou, Yoshiaki Hashimura, Yoshihiro Soeda
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Patent number: 8693203Abstract: A method for making an electronic device includes forming an interconnect layer stack on a rigid wafer substrate having a plurality of patterned electrical conductor layers, a dielectric layer between adjacent patterned electrical conductor layers, and at least one solder pad on an uppermost patterned electrical conductor layer. An LCP solder mask having at least one aperture therein alignable with the at least one solder pad is formed. The LCP solder mask and interconnect layer stack are aligned and laminated together. Solder is positioned in the at least one aperture. At least one circuit component is attached to the at least one solder pad using the solder.Type: GrantFiled: January 14, 2011Date of Patent: April 8, 2014Assignee: Harris CorporationInventors: Louis Joseph Rendek, Jr., Michael Weatherspoon, Casey Philip Rodriguez, David Nicol
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Publication number: 20140093706Abstract: The present disclosure discloses a coated substrate for electrophotographic (LEP) printing comprising an ink-receiving layer and a base layer, wherein said ink-receiving layer comprises a reactive polycarbodiimide component and a method for producing the same.Type: ApplicationFiled: September 28, 2012Publication date: April 3, 2014Applicant: HEWLETT-PACKARD INDIGO B.V.Inventors: Inna Tzomik, Hannoch Ron, Igal Levine
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Patent number: 8679624Abstract: In accordance with the present teachings, there are composite materials, fuser members comprising the composite materials, and methods of making the composite materials. In various embodiments, the composite material can include a polyimide resin having a thermal conductivity and a plurality of passivated aluminum nitride particles substantially uniformly dispersed in the polyimide resin to provide the composite material with a thermal conductivity of about 0.4 W/mK to about 2.5 W/mK, and wherein each of the plurality of passivated aluminum nitride particles can include a passivation layer disposed over an aluminum nitride particle core to inhibit oxidation and thermal degradation of a surface of the aluminum nitride particle core.Type: GrantFiled: June 5, 2009Date of Patent: March 25, 2014Assignee: Xerox CorporationInventors: David J. Gervasi, Matthew M. Kelly, Santokh Badesha
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Patent number: 8679628Abstract: There is provided an insulated wire equipped with an insulation film made of polymer alloy, the polymer alloy comprising an amorphous thermosetting resin and an amorphous thermoplastic resin, in which: the insulation film has a sea-island structure; the amorphous thermosetting resin is a sea component of the sea-island structure; and the amorphous thermoplastic resin is an island component of the sea-island structure.Type: GrantFiled: June 16, 2010Date of Patent: March 25, 2014Assignees: Hitachi Cable, Ltd., Hitachi Metals, Ltd.Inventors: Yuki Honda, Tomiya Abe, Hideyuki Kikuchi, Daisuke Hino
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Publication number: 20140076397Abstract: A color converter comprising at least one layer comprising at least one organic fluorescent colorant and at least one barrier layer having a low permeability to oxygen.Type: ApplicationFiled: May 9, 2012Publication date: March 20, 2014Applicant: BASF SEInventors: Gerhard Wagenblast, Martin Koenemann, Sorin Ivanovici, Gerardus De Keyzer, Robert Send
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Patent number: 8668992Abstract: The present invention provides new polyimide materials suitable for use in optically transparent fiber composites, ribbon composites, and optical communications applications. The polyimide compounds include monomeric repeat units comprising a fluorinated moiety and a fluorene cardo structure. The polyimides exhibit good optical transparency and have a low absolute thermo-optic coefficient (|dn/dT|).Type: GrantFiled: June 1, 2011Date of Patent: March 11, 2014Assignee: Brewer Science Inc.Inventors: Wenbin Hong, Tantiboro Ouattara, Kang Le Wang
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Publication number: 20140065391Abstract: An insulation laminate is disclosed having a base laminate layer, with at least one flat side coated with a layer of an insulating varnish, the insulating varnish including a basecoat; and an added lubricant.Type: ApplicationFiled: November 4, 2013Publication date: March 6, 2014Inventor: Jörg NELGES
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Publication number: 20140065399Abstract: The present disclosure provides a flexible graphite sheet and a method for fabricating the same and a composite structure for the same. The method for fabricating a flexible graphite sheet comprises steps of coating an augmenting solution on a first film to form a composite structure, and heating the composite structure such that the first film and the augmenting solution form a flexible graphite sheet, wherein the thermal conducting cross-section of the flexible graphite sheet is larger than the thermal conducting cross-section of the first film, and the thermal conductivity of the flexible graphite sheet ranges from 1200 to 6000 W/m° C.Type: ApplicationFiled: March 5, 2013Publication date: March 6, 2014Applicant: HUGE TEMP ENERGY LTDInventors: MING SHENG WENG, LUNG TA HSIAO, CHE LU TSENG, HUNG YUAN LI
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Patent number: 8663774Abstract: A multilayer thermal insulation composite for fire protection applications. The composite includes a fibrous insulation layer, at least one inorganic heat absorbing layer disposed on one side of the fibrous insulation layer, and at least one superinsulation layer disposed on at least one side of the composite adjacent the heat absorbing layer or the fibrous insulation layer. The composite may further include a scrim layer comprising a high temperature resistant, flexible, woven or non-woven scrim or scrim and high temperature resistant material disposed around the multilayer thermal insulation composite partially or substantially totally encapsulating the composite. The composite is lightweight and flexible, exhibits reduced heat transfer to the cold-face, with improved thermal insulation capability.Type: GrantFiled: April 21, 2011Date of Patent: March 4, 2014Assignee: Unifrax I LLCInventors: Joseph A. Fernando, Kenneth B. Miller
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Publication number: 20140050935Abstract: A polyimide film includes a polyimide layer including a polyimide base polymer, and a polyimide powder distributed in the polyimide base polymer, the polyimide powder being obtained by reacting a diamine with a dianhydride at a molar ratio of about 1:0.950 to about 1:0.995. Moreover, the polyimide film may have a multilayered structure including at least a second polyimide layer stacked on a surface of the polyimide layer. The second polyimide can also include the polyimide powder at a weight ratio less than about 20 wt % of the total weight of the second polyimide layer. Embodiments described herein also include methods of preparing the polyimide films.Type: ApplicationFiled: October 22, 2013Publication date: February 20, 2014Applicant: TAIMIDE TECHNOLOGY INCORPORATIONInventors: Chung-Yi CHEN, Chih-Wei LIN, Chi-Huan LO, Shihan TAI
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Patent number: 8652622Abstract: The disclosure provides a polyimide film laminate and a metal clad laminate employing the same. The polyimide film laminate includes a first polyimide film, a second polyimide film disposed on the first polyimide film, and a third polyimide film disposed on the second polyimide film. Particularly, the first polyimide film has a thermal conductivity of between about 0.2-0.9 watts/m·K and a breakdown voltage greater than about 3KV, the second polyimide film has a thermal conductivity of more than about 1 watts/m·K, and the third polyimide film has a thermal conductivity of between about 0.2-0.9 watts/m·K and a breakdown voltage greater than about 3KV.Type: GrantFiled: June 13, 2011Date of Patent: February 18, 2014Assignee: Industrial Technology Research InstituteInventors: Charng-Shing Lu, Si-Yi Chin, Shur-Fen Liu, Jinn-Shing King
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Patent number: 8652628Abstract: The present teachings provide a fuser member. The fuser member includes a substrate layer comprising a polymer blend polyimide polymer and amino silicone.Type: GrantFiled: March 25, 2011Date of Patent: February 18, 2014Assignee: Xerox CorporationInventor: Jin Wu
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Publication number: 20140023847Abstract: A polyimide film having no foaming during heating or other problems, as well as a polyimide laminate-metal laminate in which the polyimide film and a metal layer are laminated. The polyimide film includes a polyimide layer (b), and a polyimide layer (a) laminated in contact with the polyimide layer (b), a side of the polyimide layer (b) which is not in contact with the polyimide layer (a) exhibits thermal fusion bondability, a side of the polyimide layer (a) which is not in contact with the polyimide layer (b) does not exhibit thermal fusion bondability, and the polyimide layer (a) includes a polyimide formed from a tetracarboxylic acid component containing 2,3,3?,4?-biphenyltetracarboxylic dianhydride and a diamine component.Type: ApplicationFiled: March 28, 2012Publication date: January 23, 2014Applicant: UBE INDUSTRIES, LTD.Inventors: Takuro Kochiyama, Eiji Masui, Keiichi Yanagida, Takeshi Uekido
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Patent number: 8632952Abstract: Provided are a photosensitive resin composition which is soluble in an alkaline aqueous solution and which has a good propagation loss in a visible light wavelength region, a photosensitive resin cured matter, a photosensitive resin film, a photosensitive resin film cured matter and an optical waveguide obtained by using the same. Provided are, to be specific, a photosensitive resin composition comprising (A) a vinyl polymer having at least one chain-polymerizable functional group in a molecule, (B) a polymerizable compound and (C) a polymerization initiator, wherein the component (C) is at least one selected from the group consisting of 2-[2-oxo-2-phenylacetoxyethoxy]ethyl oxyphenylacetate, 2-(2-hydroxyethoxy)ethyl oxyphenylacetate and oligo{2-hyroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]}propanone, a photosensitive resin cured matter, a photosensitive resin film, a photosensitive resin film cured matter and an optical waveguide obtained by using the same.Type: GrantFiled: November 17, 2008Date of Patent: January 21, 2014Assignee: Hitachi Chemical Company, Ltd.Inventors: Kouji Suzumura, Tatsuya Makino, Atsushi Takahashi
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Patent number: 8623968Abstract: A polyimide precursor composition includes a polyamic acid including a repeating unit represented by Chemical Formula 1 and diisocyanate represented by Chemical Formula 2. OCN-A2-NCO??Chemical Formula 2 The diisocyanate represented by Chemical Formula 2 is included in an amount of about 0.01 moles to about 10 moles based on 100 moles of the repeating unit represented by Chemical Formula 1 in the polyamic acid.Type: GrantFiled: September 7, 2011Date of Patent: January 7, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Eun Seog Cho, Byung Hee Sohn, Young Suk Jung, Yoo Seong Yang, Sang Mo Kim
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Patent number: 8623515Abstract: Disclosed is a liquid crystal alignment agent that includes a polymer including polyamic acid including a repeating unit represented by the following Chemical Formula 1, polyimide including a repeating unit represented by the following Chemical Formula 2, or a combination thereof. In Chemical Formulae 1 and 2, X1, X2, Y1 and Y2 are the same as defined in the detailed description.Type: GrantFiled: September 21, 2011Date of Patent: January 7, 2014Assignee: Cheil Industries Inc.Inventors: Jae-Deuk Yang, Eun-Ha Kim, Myoung-Youp Shin, Yong-Sik Yoo, Guk-Pyo Jo, Jung-Gon Choi
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Publication number: 20140004349Abstract: Some embodiments provided herein relate to a thermoplastic material that can include a thermoplastic surface, a protective coating, and a degradable intermediate layer.Type: ApplicationFiled: March 30, 2012Publication date: January 2, 2014Applicant: Empire Technology Development LLCInventor: Nicholas D. Buker
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Patent number: 8617712Abstract: An intermediate transfer member that includes biaryl polycarbonates, an optional polysiloxane, and an optional conductive filler component.Type: GrantFiled: August 2, 2011Date of Patent: December 31, 2013Assignee: Xerox CorporationInventor: Jin Wu
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Publication number: 20130295309Abstract: A resin composition, preferably an adhesive composition, comprising a polyether polyamide elastomer capable of being strongly bended with a polyimide resin, preferably strongly bended through an easy process to form an interface between the polyimide resin and the composition, and a bonded composite having the resin composition and a polyimide resin which together form an interface to be bonded with each other. A resin composition for forming an interface together with a polyimide resin for bonding, wherein the resin composition comprises a polyether polyamide elastomer (component R) obtained by subjecting a specific aminocarboxylic acid compound A1 and/or lactam compound A2, polyether compound B, and dicarboxylic acid compound C to polymerization, wherein the content of the component R in the resin composition is 80 to 100% by weight.Type: ApplicationFiled: December 28, 2011Publication date: November 7, 2013Applicant: UBE INDUSTRIES, LTD.Inventors: Yuma Irisa, Shuichi Maeda
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Patent number: 8574720Abstract: The present disclosure is directed to a base film having a thickness from 8 to 152 microns, a 60 degree gloss value from 2 to 35, an optical density greater than or equal to 2 and a dielectric strength greater than 1400 V/mil. The base film comprises a chemically converted (partially or wholly aromatic) polyimide in an amount from 71 to 96 weight percent of the base film. The base film further comprises a pigment and a matting agent. The matting agent is present in an amount from 1.6 to 10 weight percent of the base film, has a median particle size from 1.3 to 10 microns, and has a density from 2 to 4.5 g/cc. The pigment is present in an amount from 2 to 9 weight percent of the base film. The present disclosure is also directed to coverlay films comprising the base film in combination with an adhesive layer.Type: GrantFiled: July 23, 2010Date of Patent: November 5, 2013Assignee: E.I. du Pont de Nemours & CompanyInventors: Thomas Edward Carney, Jeffrey Michael Bartolin, Meredith L. Dunbar, Scott John Herrmann
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Patent number: 8568868Abstract: Disclosed is a gas-barrier film laminate having at least two gas-barrier film layers laminated via an adhesive layer, wherein the gas-barrier film layer has a substrate film, and at least one constitutive unit layer comprising an anchor coat layer and an inorganic thin film layer formed on at least one surface of the substrate film in that order, and wherein the number of the bubbles having a diameter of at least 0.5 mm and the impurities having a diameter of at least 0.5 mm existing between the gas-barrier film layers is at most 3 in total per 100 cm2.Type: GrantFiled: August 24, 2012Date of Patent: October 29, 2013Assignee: Mitsubishi Plastics, Inc.Inventors: Tsutomu Matsui, Shigenobu Yoshida
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Patent number: 8568867Abstract: A solvent cast film comprises a polyimide comprising structural units derived from polymerization of a dianhydride component comprising a dianhydride selected from the group consisting of 3,4?-oxydiphthalic dianhydride, 3,3?-oxydiphthalic dianhydride, 4,4?-oxydiphthalic dianhydride, and combinations thereof, with a diamine component comprising 4,4?-diaminodiphenylsulfone; wherein the polyimide has a glass transition temperature from 190° C. to 400° C.; and wherein the film has a coefficient of thermal expansion of less than 60 ppm/° C., a thickness from 0.1 to 250 micrometers, endless than 5% residual solvent by weight.Type: GrantFiled: June 6, 2007Date of Patent: October 29, 2013Assignee: Sabic Innovative Plastics IP B.V.Inventors: Kwok Pong Chan, Erik Hagberg, Tara J. Mullen, Roy Ray Odle
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Patent number: 8563116Abstract: There is described a method for producing a fuser member. The method includes obtaining a substrate and positioning a fluoroplastic sleeve around the substrate. The outer surface of the fluoroplastic sleeve is roughened to a surface roughness of between about 0.03 ?m Ra and about 3 ?m Ra. The outer surface is coated with a functional silicone oil.Type: GrantFiled: September 2, 2010Date of Patent: October 22, 2013Assignee: Xerox CorporationInventors: Patrick J. Finn, Kenneth R. Rasch
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Publication number: 20130273797Abstract: This invention relates to electrically conductive polymers grafted to the surface of insulating polymers. Simultaneous polymerization and grafting reactions of conducting precursors form conductive polymer layers that dramatically increase the electrical conductivity of the respective insulating polymer films.Type: ApplicationFiled: March 14, 2013Publication date: October 17, 2013Applicant: E I DU PONT DE NEMOURS AND COMPANYInventors: SIMONA PERCEC, CONOR GORDON BOLAS
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Publication number: 20130265522Abstract: A film for a backlight unit including a semiconductor nanocrystal-polymer composite film including a semiconductor nanocrystal and a matrix polymer in which the semiconductor nanocrystal is dispersed, wherein the matrix polymer is a polymer produced by a polymerization of a multifunctional photo-curable oligomer, a mono-functional photo-curable monomer, and a multifunctional photo-curable cross-linking agent, the multifunctional photo-curable oligomer has an acid value of less than or equal to about 0.1 mg of KOH/g, and a content (A1) of a first structural unit derived from the multifunctional photo-curable oligomer, a content (A2) of a second structural unit derived from the mono-functional photo-curable monomer, and a content (A3) of a third structural unit derived from the multifunctional photo-curable cross-linking agent satisfy Equation 1: A1<(A2+A3).Type: ApplicationFiled: March 15, 2013Publication date: October 10, 2013Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Chul Ho JUNG, Hyun A. KANG, Soo Kyung KWON, Won Joo LEE, Eun Joo JANG, Hyo Sook JANG, Shin Ae JUN, Oul CHO, In Taek HAN
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Publication number: 20130260094Abstract: Disclosed herein are substrates which have been dry coated with a layered material. Generally, a layered material precursor composition is mixed with a milling medium so that the milling medium is coated with the layered material. The substrate is then contacted with the coated milling medium. The layered material on the milling medium transfers to the substrate to form a coating on the substrate. In particular, conductive films can be formed on a substrate without the need for additives such as a surfactant or a polymeric binder.Type: ApplicationFiled: April 3, 2012Publication date: October 3, 2013Applicant: Xerox CorporationInventors: Yiliang Wu, Sandra J. Gardner, Ping Liu, Nan-Xing Hu
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Publication number: 20130255881Abstract: An internal member of a plasma processing vessel includes a base material and a film formed by thermal spraying of ceramic on a surface of the base material. The film is formed of ceramic which includes at least one kind of element selected from the group consisting of B, Mg, Al, Si, Ca, Cr, Y, Zr, Ta, Ce and Nd. In addition, at least a portion of the film is sealed by a resin.Type: ApplicationFiled: May 24, 2013Publication date: October 3, 2013Applicant: TOKYO ELECTRON LIMITEDInventors: Kouji MITSUHASHI, Hiroyuki NAKAYAMA, Nobuyuki NAGAYAMA, Tsuyoshi MORIYA, Hiroshi NAGAIKE
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Patent number: 8545988Abstract: Compositions and articles of manufacture made therefrom for use in high temperature application, such as automotive reflectors, have a minimum haze onset temperature of about 205° C. and are made from a transparent, miscible blend of from about 30 to about 70 weight percent of a polyetherimide sulfone comprising greater than or equal to 50 mole percent of the polymer linkages have an aryl sulfone group and from about 70 to about 30 weight percent of a polyetherimide or polyimide.Type: GrantFiled: December 31, 2008Date of Patent: October 1, 2013Assignee: Sabic Innovative Plastics IP B.V.Inventors: Norimitsu Yamaguchi, Roy Ray Odle, Sanjay Mishra
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Patent number: 8545989Abstract: An intermediate transfer member that includes a mixture of a poly(amic acid amideimide), a tertiary amine, an optional phosphate ester, an optional polysiloxane or an optional fluoro polymer, and an optional conductive filler component.Type: GrantFiled: June 3, 2011Date of Patent: October 1, 2013Assignee: Xerox CorporationInventor: Jin Wu
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Patent number: 8545975Abstract: A solvent cast film comprises a polyimide comprising structural units derived from polymerization of a dianhydride component comprising a dianhydride selected from the group consisting of 3,4?-oxydiphthalic dianhydride, 3,3?-oxydiphthalic dianhydride, 4,4?-oxydiphthalic dianhydride, and combinations thereof, with a diamine component comprising 4,4?-diaminodiphenylsulfone; wherein the polyimide has a glass transition temperature from 190° C. to 400° C.; and wherein the film has a coefficient of thermal expansion of less than 60 ppm/° C., a thickness from 0.1 to 250 micrometers, endless than 5% residual solvent by weight.Type: GrantFiled: June 6, 2007Date of Patent: October 1, 2013Assignee: Sabic Innovative Plastics IP B.V.Inventors: Kwok Pong Chan, Erik Hagberg, Tara J. Mullen, Roy Ray Odle
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Publication number: 20130251947Abstract: The present invention relates generally to optical retardation films. The invention may be used as optical element in liquid crystal display (LCD) devices, particularly as phase-shifting component of LCDs of both reflection and transmission type, and in ant other field of science and technology where optical retardation films are applied such as architecture, automobile industry, decoration arts. The present invention provides an optical film comprising a substrate having front and rear surfaces, and at least one solid optical retardation layer on the front surface of the substrate. The solid optical retardation layer comprises organic rigid rod-like macromolecules based on 2,2?-disulfo-4,4?-benzidine terephthalamide-isophthalamide copolymer or its salt of the general structural formula I. The solid optical retardation layer is a negative C-type or Ac-type plate substantially transparent to electromagnetic radiation in the visible spectral range.Type: ApplicationFiled: February 8, 2013Publication date: September 26, 2013Applicant: CRYSOPTIX KKInventor: Alexander Lazarev
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Patent number: 8541049Abstract: Provided is an optical member capable of keeping a high performance antireflection effect over a long period of time with respect to an arbitrary substrate. The optical member has plural layers on a substrate, and includes at least one metal oxide layer having a void, and at least one layer containing an organic resin as a main component formed between the substrate and the metal oxide layer. The metal oxide layer is a plate crystal layer formed of a plate crystal containing aluminum oxide as a main component and a surface of the plate crystal layer has an uneven profile. The organic resin has an aromatic ring and/or a hetero ring in at least a part thereof.Type: GrantFiled: March 12, 2012Date of Patent: September 24, 2013Assignee: Canon Kabushiki KaishaInventors: Tomonari Nakayama, Masayuki Yamada
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Patent number: 8541107Abstract: The present disclosure is directed to a base film having a thickness from 8 to 152 microns, a 60 degree gloss value from 2 to 35, an optical density greater than or equal to 2 and a dielectric strength greater than 1400 V/mil. The base film comprises a chemically converted (partially or wholly aromatic) polyimide in an amount from 63 to 96 weight percent of the base film. The base film further comprises a pigment and a matting agent. The matting agent is present in an amount from 1.6 to 10 weight percent of the base film, has a median particle size from 1.3 to 10 microns, and has a density from 2 to 4.5 g/cc. The pigment is present in an amount from 2 to 35 weight percent of the base film. The present disclosure is also directed to coverlay films comprising the base film in combination with an adhesive layer.Type: GrantFiled: August 5, 2010Date of Patent: September 24, 2013Assignee: E. I. du Pont de Nemours and CompanyInventors: Thomas Edward Carney, Jeffrey Michael Bartolin, Meredith L Dunbar, Scott John Herrmann
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Patent number: 8541108Abstract: The present teachings provide a fuser member. The fuser member includes a substrate layer comprising a polyimide polymer and a hydroxyl terminated polybutadiene. A method of manufacturing a fuser member containing a polyimide polymer and a hydroxyl terminated polybutadiene is presented.Type: GrantFiled: September 27, 2010Date of Patent: September 24, 2013Assignee: Xerox CorporationInventor: Jin Wu
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Publication number: 20130244046Abstract: The present invention includes a polymer composition comprising a substrate comprising at least a top layer and a bottom layer in contact at one or more regions and a thermoplastic compound that impregnates the corrugated fibrous sheet material. The thermoplastic compound may have between 1-35 weight percent PVC; 1-20 weight percent PAN; 1-60 weight percent PMA; 1-20 weight percent PAI; and 2-25 weight percent PBA. For example, the composition may have about 2 weight percent PVC; 18 weight percent PAN; 45 weight percent PMA; 15 weight percent PAI; and 20 weight percent PBA.Type: ApplicationFiled: April 11, 2013Publication date: September 19, 2013Inventors: Galen W. Hartman, Anne Yaeger
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Publication number: 20130236702Abstract: An antistatic article having an antistatic layer disposed on a substrate is disclosed herein. The antistatic layer is formed from a cationic copolymer, a non-cationic (meth)acrylic polymer, and a crosslinking agent. The cationic copolymer consists essentially of a cationic monomer, a hydrophobic monomer, a crosslinkable monomer, and an optional nitrogen-containing monomer. The substrate may comprise an optical film such as a multilayer optical film. Methods for making the antistatic article and display devices containing the antistatic article are also disclosed.Type: ApplicationFiled: April 24, 2013Publication date: September 12, 2013Applicant: 3M INNOVATIVE PROPERTIES COMPANYInventors: Mark J. Pellerite, Mahfuza B. Ali, Eileen M. Haus, Gregory F. King, James E. Lockridge, Hang K. Loi, Jeffrey A. Peterson
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Patent number: 8524371Abstract: An intermediate transfer media, such as a belt, that includes a first optional polyimide substrate layer, and a second layer of a fluoropolyimide polymer.Type: GrantFiled: November 26, 2012Date of Patent: September 3, 2013Assignee: Xerox CorporationInventors: Jin Wu, Yu Qi, Nan-Xing Hu, Yuhua Tong
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Publication number: 20130220674Abstract: Provided are an adhesive composition with good storage stability, heat resistance, moisture resistance reliability, and adhesion properties; and a curl- and heat-resistant adhesive film and a wiring film using the adhesive composition. The adhesive composition contains 100 parts by weight of a phenoxy resin (A) having plural alcoholic hydroxyl groups in a side chain of the molecule thereof; 2 to 60 parts by weight of a polyfunctional isocyanate compound (B) having an isocyanate group and at least one functional group selected from vinyl, acrylate, and methacrylate groups in the molecule thereof; and 5 to 30 parts by weight of a maleimide compound (C) having plural maleimide groups in the molecule thereof or/and reaction product thereof, in which a total amount of the components (B) and (C) is from 7 to 60 parts by weight.Type: ApplicationFiled: February 20, 2013Publication date: August 29, 2013Applicants: HITACHI CABLE, LTD., HITACHI CABLE FINE-TECH, LTD.Inventors: Hitachi Cable Fine-Tech, Ltd., Hitachi Cable, Ltd.
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Patent number: 8518550Abstract: A polyimide wherein a tetracarboxylic dianhydride including 3,3?,4,4?-phenyltetracarboxylic dianhydride as the essential component is the starting tetracarboxylic dianhydride component, and an amine comprising between 0.5 and 30 mole percent of a diamine represented by the following general formula is the starting diamine component. (wherein A is a direct bond or a crosslinking group, and R1-R4 each represent a substituent). It is possible to obtain a polyimide, a polyimide film and a laminated body with an improved adhesion property and an improved moisture permeation rate, even without surface treatment, comprising, as the essential tetracarboxylic dianhydride, 3,3?,4,4?-biphenyltetracarboxylic dianhydride which has conventionally only yielded polyimides with low adhesive strength.Type: GrantFiled: August 30, 2005Date of Patent: August 27, 2013Assignee: UBE Industries, Ltd.Inventors: Hiroaki Yamaguchi, Masato Murakami, Masafumi Kohda
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Patent number: 8512722Abstract: The disclosure provides methods and materials suitable for preparing coating layers on substrates. The coatings comprise quaternary amine groups and therefore impart anti-bacterial properties to the substrate. In one embodiment, for example, there is provided a quaternary amine-containing polymeric coating comprising propylene and ethylene repeat units.Type: GrantFiled: July 23, 2010Date of Patent: August 20, 2013Assignees: California Institute of Technology, University of Southern CaliforniaInventors: Choon Woo Lee, Robert H. Grubbs, Mark Humayun