Abstract: An electrical contact part comprising, a carrier substrate of a metallic material, a metallic coating applied to the carrier substrate, and a coating barrier material applied to the carrier substrate in a partial area of the carrier substrate, wherein the coating barrier material substantially prevents coating of the carrier substrate in the portion.

Abstract: Fe-Al-based plated hot-stamped member exhibiting excellent formed part corrosion resistance and post-coating corrosion resistance and manufacturing method. The hot-stamping member includes Fe-Al-based plated layer on one or both surfaces of a base material, the base material has a predetermined steel component, Fe-Al-based plated layer has a thickness of 10 ?m or more and 60 ?m or less, formed by A, B, C and D layers sequentially from a surface toward the base material, and each of the four layers is a Fe-Al-based intermetallic compound containing Al, Fe, Si, Mn and Cr for predetermined contents with the balance made up of impurities, the D layer further contains Kirkendall voids each of which cross-sectional area is 3 ?m2-30 ?m2 for 10 pieces/6000 ?m2 or more and 40 pieces/6000 ?m2 or less.

Abstract: A radial bearing having a wear surface with improved wear characteristics comprises a steel support, to which is bonded a metal carbide composite wear surface made by first arranging, within a cavity defined between a steel mold and the steel support, tiles made of microwave sintered, cemented metal carbide, closely packing the voids between the tiles with metal carbide powder, and infiltrating the mold cavity with a metal brazing alloy by subjecting the filled mold to rapid heating. The brazing alloy fills voids between the metal carbide particles, the microwave sintered metal carbide tiles, and the metal support, thereby relatively rapidly consolidating the carbide into a wear layer bonded with the steel support without substantially damaging the properties of the microwave-sintered metal carbide tiles.

Abstract: A high-performance thermal interface material comprising a heterogeneous copper-tin nanowire array that is ultra-compliant and that can reduce thermal resistance by two times as compared with the state-of-the-art thermal interface materials. The high-performance thermal interface material can be further used in electronic systems, ranging from microelectronics to portable electronics to massive data centers, to operate at lower temperatures, or at the same temperature but with higher performance and higher power density.

Abstract: Method for forming a metallic component surface to achieve lower electrical contact resistance. The method comprises modifying a surface chemical composition and creating a micro-textured surface structure of the metallic component that includes small peaks and/or pits. The small peaks and pits have a round or irregular cross-sectional shape with a diameter between 10 nm and 10 microns, a height/depth between 10 nm and 10 microns, and a distribution density between 0.4 million/cm2 and 5 billion cm2.

Abstract: This invention provides a substrate for a superconducting wire used for manufacturing a superconducting wire with excellent superconductivity and a method for manufacturing the same. Such substrate for a superconducting wire exhibits the crystal orientation of metals on the outermost layer, such as a c-axis orientation rate of 99% or higher, a ?? of 6 degrees or less, and a percentage of an area in which the crystal orientation is deviated by 6 degrees or more from the (001) [100] per unit area of 6% or less.

Abstract: A modular auxiliary switch includes a housing including a first housing part and a separate second housing part secured to the first housing part. A printed circuit board is housed in one of the first and second housing parts, and has a first side facing the first housing part and a second opposite side facing the second housing part. An actuator mechanism is housed in the first housing part and is coupled to the printed circuit board. A separate first electrical contactor is selectively mounted to the printed circuit board so that a first electrical contact surface of the first electrical contactor overlaps and is in direct contact with one of the first side and the second side to define a first electrical contact pad on the printed circuit board.

Abstract: A blue-ray resisting glass protection sheet of a display screen comprises a glass substrate (4). One side surface of the glass substrate (4) is atomized to form an atomization layer (1), an atomization surface of the atomization layer (1) is coated with a fingerprint resisting coating (3), the other side surface of the glass substrate (4) is coated with a blue-ray resisting coating (2), and an A/B glue layer (5) is bonded to a surface of the blue-ray resisting coating (2).

Abstract: A glass core substrate for an integrated circuit (IC) device may be formed to include a glass core and build-up structures on opposing sides of the glass core. Electrically conductive terminals may be formed on both sides of the glass core substrate. An IC die may be coupled with the terminals on one side of the substrate, whereas the terminals on the opposing side may be coupled with a next-level component, such as a circuit board. The glass core may comprise a single piece of glass in which conductors have been formed, or the glass core may comprise two or more glass sections that have been joined together, each section having conductors. The conductors extend through the glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the glass core. Other embodiments are described and claimed.

Abstract: A super-hydrophobic thin film and a method of preparing the same are provided. The method of preparing the super-hydrophobic thin film involves forming a super-hydrophobic thin film by plasma enhanced chemical vapor deposition (PECVD) on a substrate by using a precursor and a hydrogen gas.

Abstract: A method of making crystal semi-conducting material-based elements, including providing a support having amorphous semi-conducting material-based semi-conducting elements, the support being further provided with one or more components and with a reflective protective area configured so as to reflect a light radiation in a given wavelength range, exposing the element(s) to a laser radiation emitting in the given wavelength range so as to recrystallize the elements, the reflective protective area being arranged on the support relative to the elements and to the components so as to reflect the laser radiation and protect the components from this radiation.

Abstract: Disclosed is a nanostructure including a first set of nanowires formed from filling a plurality of voids of a template. The nanostructure also includes a second set of nanowires formed from filling a plurality of spaces created when the template is removed, such that the second set of nanowires encases the first set of nanowires. Several methods are also disclosed. In one embodiment, a method of fabricating a nanostructure including nanowires is disclosed. The method may include forming a first set of nanowires in a template, removing a first portion of the template, thereby creating spaces between the first set of nanowires, forming a second set of nanowires in the spaces between the first set of nanowires, and removing a second portion of the template.

Abstract: Methods of effecting bond adhesion between metal structures, methods of preparing articles including bonded metal structures, and articles including bonded metal structures are provided herein. In an embodiment, a method of effecting bond adhesion between metal structures includes forming a first metal structure on a substrate. The first metal structure includes grains that have a {111} crystallographic orientation, and the first metal structure has an exposed contact surface. Formation of an uneven surface topology is induced in the exposed contact surface of the first metal structure after forming the first metal structure. A second metal structure is bonded to the exposed contact surface of the first metal structure after inducing formation of the uneven surface topology in the exposed contact surface.

Abstract: Methods and apparatuses to fabricate additive manufactured parts with in-process monitoring are described. As parts are formed layer-by-layer, a 3D measurement of each layer or layer group may be acquired. The acquisition of dimensional data may be performed at least partially in parallel with the formation of layers. The dimensional data may be accumulated until the part is fully formed, resulting in a part that was completely inspected as it was built. The as-built measurement data may be compared to the input geometrical description of the desired part shape. Where the part fails to meet tolerance, it may be amended during the build process or rejected.

Abstract: An apparatus comprising a first substrate having a first surface, a second substrate having a second surface facing the first surface and an array of metallic raised features being in contact with the first surface to the second surface, a portion of the raised features having a mechanical bend or buckle plastic deformation produced therein via a compressive force. One or more of the metallic raised features has one or more surface singularities therein prior to the mechanical bend or the buckle plastic deformation produced by the compressive force.

Abstract: A method for forming pattern on substrate comprises steps of: providing a metal substrate; amorphousizing the metal substrate to from an amorphous pattern layer in the metal substrate; etching the metal substrate and forming an etching portion in the surface of the metal substrate which is not covered with the amorphous pattern layer. The article manufactured by the method is also provided.

Abstract: The present invention discloses a planar glass sealing structure and a manufacturing method thereof, the planar glass sealing structure comprises, in a top-down order: a first glass substrate, an insulating layer, a metal sealing frame and a second glass substrate. The insulating layer is formed as a frame shape, and disposed on a peripheral margin of the first glass substrate; the metal sealing frame is formed by heating to melt a metal solder layer between the first and second glass substrate, and it can keep a fixed gap between the first and second glass substrate, so that an inner space thereof is kept in an excellent sealed condition. The present invention can ensure the sealing structure of two correspondingly assembled glass substrates, so that the inner space thereof is insulated from moisture and oxygen, so as to increase the performance and quality of the device.

Abstract: A method of integrally forming at least one stiffener onto a sheet metal component configured to carry a load is provided including generating a stereolithography file. The stereolithography file includes a surface geometry of the at least one stiffener extending from a surface of the sheet-metal component. The surface geometry of the stereolithography file is sliced into a plurality of thin strips. The plurality of thin strips is substantially parallel to the surface of the sheet metal component. Energy from an energy source is applied to a powdered material such that the powdered material fuses to form the plurality of thin strips. One of the plurality of thin strips is integrally formed with the surface of the sheet-metal component. Each of the plurality of thin strips is integrally formed with an adjacent thin strip to create at least one stiffener.

Abstract: A metal sheet member for insert molding with a plastic member is disclosed having a plurality of bonding portions arranged on the top wall thereof for enhancing the bonding strength of the plastic member to the metal sheet member, each bonding portion including a groove located on the top wall of the metal sheet member and a lug formed of a part of the metal sheet member and obliquely upwardly curved from one end of the groove.

Abstract: The invention relates to a method for manufacturing a metal-ceramic composite structure intended to be exposed to high temperatures. The composite structure includes a base metal structure or component, which is on at least one side covered and permanently joined with one or more ceramic tiles.

Abstract: A coated article includes a metal substrate, a number of recesses defined in the metal substrate, and a plurality of sealing portions filled in the recesses. The sealing portions include metal, silicon oxide, aluminum oxide, sodium oxide, potassium oxide, and inorganic oxide pigment. The metal includes aluminum. A method for manufacturing the coated article is also provided.

Abstract: Disclosed are a tailor welded blank and a manufacturing method thereof. The tailor welded blank is manufactured by connecting blank elements of different materials or thicknesses, thereby eliminating quality problems in a welded zone. A hot stamped component is manufactured by hot stamping the tailor welded blank formed by laser-welding blank elements made of coated steel plates having different strengths or thicknesses using a filler wire, wherein a laser-welded zone has a martensite structure.

Abstract: A copper foil structure having blackened ultra-thin copper foil of the instant disclosure includes a carrier foil, a blackened layer, a release layer, and an ultra-thin copper foil. The carrier foil includes a matte surface and a shiny surface wherein the blackened layer is disposed thereon. The release layer is disposed on the blackened layer formed with one selected from the group: copper, cobalt, nickel, and manganese while the release layer is formed with one selected from the group: molybdenum, nickel, chromium, and potassium. Successively, the ultra-thin copper foil is disposed on the release layer. Laser drilling can apply to the blackened ultra-thin copper foil on the inner layers of a high density multi-layer printed wiring board, thus eliminating the traditional blackening or browning chemical process. The blackened ultra-thin copper foil in combination with a polyimide thin (PI) or other substrate materials displays desirable appearance.

Abstract: A coating steel component with a pattern of an iron based matrix with crystalline particles metallurgically bound to the surface of a steel substrate for use as disc cutters or other components with one or more abrading surfaces that can experience significant abrasive wear, high point loads, and large shear stresses during use. The coated component contains a pattern of features in the shape of freckles or stripes that are laser formed and fused to the steel substrate. The features can display an inner core that is harder than the steel substrate but generally softer than the matrix surrounding the core, providing toughness and wear resistance to the features. The features result from processing an amorphous alloy where the resulting matrix can be amorphous, partially devitrified or fully devitrified.

Abstract: A partial plating method capable of applying fine hard gold plating, a laser plating device capable of applying partial plating to a minute region with high positional precision, and a plated member. The partial plating method comprising plating a region to be plated by projecting a laser beam having a wavelength of 330 nm or more and 450 nm or less. A laser plating device 10 comprises a plating tank 12, a laser oscillator 14 for emitting a laser beam, a conveying device 16 for conveying a member to be plated 80, a photoelectronic sensor 18 for detecting the position of a positioning hole 82 of the member to be plated 80, and a galvanometer scanner 20 having a galvanometer mirror 22 capable of scanning the laser beam. The plated member is applied with fine spot plating by the laser plating device 10.

Abstract: There is provided an electrode pad including: a connection terminal part; a first plating layer including palladium phosphorus (Pd—P) formed on the connection terminal part; and a second plating layer including palladium (Pd) formed on the first plating layer.

Abstract: A method for forming a tool marking structure contains: a first plating means used on a surface of a tool so as to form a first plating layer; a coloring means applied to print a marking area with a first color layer on the first plating layer and to have the first plating layer on a bottom end of the marking area; a carving means served to eliminate a part of the first color layer of the marking area so that the marking area has a marking portion and a contrast portion formed therein; a second plating means provided to form a second plating layer on the surface of the tool and the contrast portion of the marking area.

Abstract: Nebulizer ampoules are labelled by laser-marking or laser-engraving data on a film to produce a data film and affixing the film onto a nebulizer ampoule using a non-migratory adhesive.

Abstract: A method of making a probe (and the resulting probe) comprising providing a metal foil, creating a tip on an edge of the foil, and laser cutting a body of the probe from the foil with one or more tips at an end of the body.

Abstract: Superalloy components are joined or repaired by mating a recess formed in one component substrate with a corresponding projection formed in another component along a contact surface and welding them together with a stud welding apparatus. A mating superalloy repair stud is formed with a stud projection whose profile conforms to the substrate recess profile along a corresponding contact surface. Both the stud and substrate are coupled to a stud welding apparatus, with the stud projection and substrate recess oriented in an opposed spaced relationship with a gap there between. The stud welding apparatus passes current between the stud projection and recess and forms an arc there between, to melt their respective opposed surfaces. The melted stud projection and substrate recess opposed surfaces are pressed into contact with each other with the stud welding apparatus, forming a weld there between.

Abstract: Passivation integration schemes and pad structures to reduce the stress gradients and/or improve the contact surface existing between the Al in the pad and the gold wire bond. One of the pad structures provides a plurality of recessed pad areas which are formed in a single aluminum pad. An oxide mesa can he provided under the aluminum pad. Another pad structure provides a single recessed pad area which is formed in a single aluminum pad, and the aluminum pad is disposed above a copper pad and a plurality of trench/via pads. Still another pad structure provides a single recessed pad area which is formed in a single aluminum pad, and the aluminum pad is disposed above a portion of a copper pad, such that the aluminum pad and the copper pad are staggered relative to each other.

Abstract: A method for applying a metal on a substrate comprises: a) applying a coating by treatment in a plasma, comprising a compound selected from alkanes up to 10 carbon atoms, and unsaturated monomers, and b1) producing polymers on the surface of said substrate, said polymers comprising carboxylic groups and adsorbed ions of a second metal, reducing said ions to the second metal, or alternatively b2) producing polymers on the surface, bringing the surface of said substrate in contact with a dispersion of colloidal metal particles of at least one second metal, and c) depositing said first metal on said second metal. Advantages include that materials sensitive to for instance low pH or solvents can be coated. Substrates including glass, SiO2 with very few of no abstractable hydrogen atoms as well as polymer materials containing halogen atoms can be coated with good adhesion.

Abstract: Plate consisting of a steel substrate (1) and a precoat (2) consisting of a layer of intermetallic alloy (3) in contact with said substrate, topped by a layer of metal alloy (4), characterized in that, on at least one precoated face of said plate, an area (6) situated at the periphery of said plate has said metal alloy layer removed.

Abstract: A sheet metal piece includes a base material layer and one or more intermediate and coating material layers, along with a weld notch formed along an edge region of the piece. At least a portion of the coating and intermediate material layers is removed at the weld notch so that certain constituents from such layers do not affect the integrity of a nearby weld joint when it is subsequently formed along the edge region. Various methods of ablation, including laser ablation, can be used to form the weld notch.

Abstract: Provided is a sliding member having slidability and abrasion resistance both at satisfactory levels. This sliding member has a sliding surface including a base and a filling part. The base includes a first material and bears regularly arranged concavities. The filling part includes a second material and is arranged in the sliding surface to fill the concavities. The first material includes one selected from the group consisting of a metallic material, a ceramic material, and a carbonaceous material. The second material includes at least one selected from the group consisting of a metallic material, a ceramic material, and a carbonaceous material. The first and second materials differ from each other in at least one of frictional coefficient and hardness. The base and the filling part are substantially flush with each other in the sliding surface.

Abstract: Disclosed herein is a method of manufacturing an inner panel of a vehicle tailgate, which is formed in a bending plate shape and to which reinforcing members are coupled to improve rigidity, including: temporarily coupling a plurality of sub-blanks to a main blank by spot welding; forming the main blank into an inner panel and the plurality of sub-blanks into a plurality of reinforcing members, using a forming mold; and permanently coupling the plurality of reinforcing members to the inner panel.

Abstract: An electroplating jig for processing electroplating at a certain location, an electroplating method incorporating with the electroplating jig, and an electro product free of a plating proof layer produced by the electroplating method are provided. The electroplating jig includes a base and a flexible electric conductive pad. An accommodation slot and an opening are respectively installed on two opposite surfaces of the base in which an electro can be disposed in the accommodation slot and the accommodation slot is larger than the opening and communicated with the opening, the opening exposes a first metal pattern of the electro therefrom. The flexible electric conductive pad is blanketed on a second metal pattern formed on another surface of the electro to electrically connect the first metal pattern and the second metal pattern.

Abstract: The present invention relates to an external wall panel which is excellent in ornamental design and weather resistance and a coating method for the external wall panel. An external wall panel of the invention comprises a base panel having a three-dimensional ornamental design surface, a lower coating layer formed on the surface of the base panel, a mid-coating layer formed on the lower coating layer, a first clear layer containing beads formed on the mid-coating layer, and a second clear layer made of a transparent layer or semi-transparent layer formed on the first clear layer wherein the second clear layer has a thick film layer portion in the vicinity of a corner edge of a convex portion of the three-dimensional ornamental design surface.

Abstract: A method for manufacturing a plurality of nanostructures (101) on a substrate (102). The method comprises the steps of: depositing a bottom layer (103) on an upper surface of the substrate (102), the bottom layer (103) comprising grains having a first average grain size; depositing a catalyst layer (104) on an upper surface of the bottom layer (103), the catalyst layer (104) comprising grains having a second average grain size different from the first average grain size, thereby forming a stack of layers comprising the bottom layer (103) and the catalyst layer (104); heating the stack of layers to a temperature where nanostructures (101) can form; and providing a gas comprising a reactant such that the reactant comes into contact with the catalyst layer (104).

Abstract: The present invention is directed to a composite particle that is microscopically two-dimensional with a third nanoscopic dimension, and to methods of making same. The particle may include a support and a metal layer. The metal layer may be catalytically active such that the particle is adapted to act as a catalyst.

Abstract: A metal component for one or more of a fitting, a piece of furniture and a household appliance. The metal component includes a coating, at least in sections, the coating including one of a hardness-containing composite material and a ceramic-metal composite material.

Abstract: Optical thin-films are disclosed that are formed from optical thin films formed on a base plate arranged in a vacuum chamber. The base plates are held on a plurality of retaining frames of a base-plate retainer. The thin films are formed by heating the base plate and emitting a deposition material from a deposition source. The retaining frames are configured to make the entire base plate uniformly heated.

Abstract: Coated steel having a well defined and uniform thickness is useful and advantageous for preparing products by hot stamping. Products prepared by hot stamping such a steel are particularly advantageous when subjected to a subsequent spot welding step.

Abstract: A bumping process comprises steps of forming a metal layer with copper on a substrate, and the metal layer with copper comprises a plurality of first zones and second zones; forming a photoresist layer on the metal layer with copper; patterning the photoresist layer to form a plurality of openings; forming a plurality of copper bumps within the openings, each of the copper bumps covers the first zones and comprises a first top surface; forming a connection layer on the first top surface; removing the photoresist layer; removing the second zones and enabling each of the first zones to form an under bump metallurgy layer, wherein the under bump metallurgy layer, the copper bump, and the connection layer possess their corresponded peripheral walls, and covering sections of a first protective layer formed on the connection layer may cover those peripheral walls to prevent ionization phenomenon.

Abstract: On the surface of the spread multi-layered metal object, as reaches from outside to inside of step-wise, the pattern shaped concave is formed by reaching the lower layer of metal layer of the metal layer. The concave is formed as step-wise, the innermost reaches inside of the metal layer from the surface, the outer reaches the top of the metal layer from the surface, and the outermost reaches the top of the metal layer. The metals removed to form the concave remains inside and effectively control on the pattern part obtained at the end. As a result, able to form desired pattern stably.

Abstract: There are provided a flame-retardant resin composition for a multilayer wiring board and a multilayer wiring board having the same. The flame-retardant resin composition for a multilayer wiring board according to an exemplary embodiment of the present invention includes a composite epoxy resin including a naphthalene modified epoxy resin, a cresol novolac epoxy resin, a rubber modified epoxy resin and a phosphorous-based epoxy resin, as well as a flame retardant represented by a specific chemical formula. The flame-retardant resin composition for a multilayer wiring board and the multilayer wiring board having the same disclosed herein exhibits excellent flame retardancy, moisture resistance and peel strength.

Abstract: The present invention relates to an apparatus with a structured hard chrome layer electrodeposited onto a work-piece, the structured hard chrome layer being cup-shaped and/or labyrinth-like and/or column-shaped. The structured hard chrome layer can be electrodeposited from an electrolyte onto the work-piece, said electrolyte containing (a) a Cr (VI) compound in an amount corresponding to 50 g/l to 600 g/l of chromic acid anhydride; (b) 0.5 g/l to 10 g/l of sulphuric acid; (c) 1 g/l to 20 g/l of aliphatic sulphonic acid, comprising 1 to 6 carbon atoms; and (d) 10 g/l to 200 g/l of at least one compound forming a dense cathode film, said compound being selected from among ammonium molybdate, alkali molybdate and alkaline earth molybdate, ammonium vanadate, alkali vanadate and alkaline earth vanadate, ammonium zirconate, alkali zirconate and alkaline earth zirconate.

Abstract: A tube-shaped sputtering target is provided having a carrier tube and an indium-based sputtering material arranged on the carrier tube. The sputtering material has a microstructure having a mean grain size of less than 1 mm, measured as the mean diameter of the grains on the sputtering-roughened surface of the sputtering material.

Abstract: A welding method is provided which makes it possible to obtain a joint body having a sufficient strength by selecting a metal glass and a crystalline metal having given conditions. According to the present invention, there is provided a welding method of applying energy to an interface where a metal glass and a crystalline metal make contact with each other or to the metal glass near the interface, of forming a molten layer by heating and melting the metal glass and of performing welding, in which the molten layer after the metal glass and the crystalline metal have been joined together has a glass formation ability, the metal glass has a glass formation ability in which a nose time of a TTT curve when a solid of the metal glass is reheated is 0.

Abstract: A method of producing a mold having an uneven structure and a mold for an optical element are provided. The method includes forming on a nickel substrate a mixed film using nickel and a material which phase separates from nickel simultaneously, the mixed film including a plurality of cylinders including nickel as a component thereof and a matrix region including the material which phase separates from nickel as a component thereof and surrounding the plurality of cylinders; and removing the matrix portion from the mixed film by etching to give a mold including nickel or a nickel alloy. The uneven structure is disposed in plurality on the substrate, and a pitch of the uneven structure is within a range of 30 nm or more and 500 nm or less and a depth of the uneven structure is within a range of 100 nm or more.