Discontinuous Surface Component Patents (Class 428/601)
  • Patent number: 10070524
    Abstract: A glass core substrate for an integrated circuit (IC) device may be formed to include a glass core and build-up structures on opposing sides of the glass core. Electrically conductive terminals may be formed on both sides of the glass core substrate. An IC die may be coupled with the terminals on one side of the substrate, whereas the terminals on the opposing side may be coupled with a next-level component, such as a circuit board. The glass core may comprise a single piece of glass in which conductors have been formed, or the glass core may comprise two or more glass sections that have been joined together, each section having conductors. The conductors extend through the glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the glass core. Other embodiments are described and claimed.
    Type: Grant
    Filed: April 9, 2012
    Date of Patent: September 4, 2018
    Assignee: Intel Corporation
    Inventors: Qing Ma, Quan A. Tran, Robert L. Sankman, Johanna M. Swan, Valluri R. Rao
  • Patent number: 9702040
    Abstract: A super-hydrophobic thin film and a method of preparing the same are provided. The method of preparing the super-hydrophobic thin film involves forming a super-hydrophobic thin film by plasma enhanced chemical vapor deposition (PECVD) on a substrate by using a precursor and a hydrogen gas.
    Type: Grant
    Filed: October 3, 2014
    Date of Patent: July 11, 2017
    Assignee: Research & Business Foundation Sungkyunkwan University
    Inventors: Jeongeon Han, Yoonseok Choi, Su Bong Jin, Jun Suck Lee
  • Patent number: 9601352
    Abstract: A method of making crystal semi-conducting material-based elements, including providing a support having amorphous semi-conducting material-based semi-conducting elements, the support being further provided with one or more components and with a reflective protective area configured so as to reflect a light radiation in a given wavelength range, exposing the element(s) to a laser radiation emitting in the given wavelength range so as to recrystallize the elements, the reflective protective area being arranged on the support relative to the elements and to the components so as to reflect the laser radiation and protect the components from this radiation.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: March 21, 2017
    Assignee: Commissariat à l'énergie atomique et aux énergies alternatives
    Inventors: Issam Ouerghi, Thomas Ernst, Laurent Grenouillet
  • Patent number: 9087945
    Abstract: Disclosed is a nanostructure including a first set of nanowires formed from filling a plurality of voids of a template. The nanostructure also includes a second set of nanowires formed from filling a plurality of spaces created when the template is removed, such that the second set of nanowires encases the first set of nanowires. Several methods are also disclosed. In one embodiment, a method of fabricating a nanostructure including nanowires is disclosed. The method may include forming a first set of nanowires in a template, removing a first portion of the template, thereby creating spaces between the first set of nanowires, forming a second set of nanowires in the spaces between the first set of nanowires, and removing a second portion of the template.
    Type: Grant
    Filed: January 14, 2010
    Date of Patent: July 21, 2015
    Inventors: Charles Elijah May, Vijay Pal Singh, Suresh K S Rajaputra
  • Publication number: 20150037603
    Abstract: Methods of effecting bond adhesion between metal structures, methods of preparing articles including bonded metal structures, and articles including bonded metal structures are provided herein. In an embodiment, a method of effecting bond adhesion between metal structures includes forming a first metal structure on a substrate. The first metal structure includes grains that have a {111} crystallographic orientation, and the first metal structure has an exposed contact surface. Formation of an uneven surface topology is induced in the exposed contact surface of the first metal structure after forming the first metal structure. A second metal structure is bonded to the exposed contact surface of the first metal structure after inducing formation of the uneven surface topology in the exposed contact surface.
    Type: Application
    Filed: July 30, 2013
    Publication date: February 5, 2015
    Applicant: GLOBALFOUNDRIES, Inc.
    Inventors: Ernesto Gene de la Garza, Martin O'Toole
  • Publication number: 20150024233
    Abstract: Methods and apparatuses to fabricate additive manufactured parts with in-process monitoring are described. As parts are formed layer-by-layer, a 3D measurement of each layer or layer group may be acquired. The acquisition of dimensional data may be performed at least partially in parallel with the formation of layers. The dimensional data may be accumulated until the part is fully formed, resulting in a part that was completely inspected as it was built. The as-built measurement data may be compared to the input geometrical description of the desired part shape. Where the part fails to meet tolerance, it may be amended during the build process or rejected.
    Type: Application
    Filed: July 19, 2013
    Publication date: January 22, 2015
    Applicant: The Boeing Company
    Inventor: Steven Matthew GUNTHER
  • Publication number: 20150014841
    Abstract: An apparatus comprising a first substrate having a first surface, a second substrate having a second surface facing the first surface and an array of metallic raised features being in contact with the first surface to the second surface, a portion of the raised features having a mechanical bend or buckle plastic deformation produced therein via a compressive force. One or more of the metallic raised features has one or more surface singularities therein prior to the mechanical bend or the buckle plastic deformation produced by the compressive force.
    Type: Application
    Filed: September 19, 2014
    Publication date: January 15, 2015
    Inventors: Roger Scott Kempers, Shankar Krishnan, Alan Michael Lyons, Todd Richard Salamon
  • Patent number: 8911876
    Abstract: A method for forming pattern on substrate comprises steps of: providing a metal substrate; amorphousizing the metal substrate to from an amorphous pattern layer in the metal substrate; etching the metal substrate and forming an etching portion in the surface of the metal substrate which is not covered with the amorphous pattern layer. The article manufactured by the method is also provided.
    Type: Grant
    Filed: May 29, 2012
    Date of Patent: December 16, 2014
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventors: Quan Zhou, Xin-Wu Guan, Po-Feng Ho
  • Publication number: 20140322458
    Abstract: The present invention discloses a planar glass sealing structure and a manufacturing method thereof, the planar glass sealing structure comprises, in a top-down order: a first glass substrate, an insulating layer, a metal sealing frame and a second glass substrate. The insulating layer is formed as a frame shape, and disposed on a peripheral margin of the first glass substrate; the metal sealing frame is formed by heating to melt a metal solder layer between the first and second glass substrate, and it can keep a fixed gap between the first and second glass substrate, so that an inner space thereof is kept in an excellent sealed condition. The present invention can ensure the sealing structure of two correspondingly assembled glass substrates, so that the inner space thereof is insulated from moisture and oxygen, so as to increase the performance and quality of the device.
    Type: Application
    Filed: June 27, 2013
    Publication date: October 30, 2014
    Inventors: Yawei Liu, Tai-pi Wu, Chih-Che Liu
  • Publication number: 20140315040
    Abstract: A method of integrally forming at least one stiffener onto a sheet metal component configured to carry a load is provided including generating a stereolithography file. The stereolithography file includes a surface geometry of the at least one stiffener extending from a surface of the sheet-metal component. The surface geometry of the stereolithography file is sliced into a plurality of thin strips. The plurality of thin strips is substantially parallel to the surface of the sheet metal component. Energy from an energy source is applied to a powdered material such that the powdered material fuses to form the plurality of thin strips. One of the plurality of thin strips is integrally formed with the surface of the sheet-metal component. Each of the plurality of thin strips is integrally formed with an adjacent thin strip to create at least one stiffener.
    Type: Application
    Filed: April 19, 2013
    Publication date: October 23, 2014
    Applicant: Sikorsky Aircraft Corporation
    Inventor: Michael R. Urban
  • Patent number: 8835017
    Abstract: A metal sheet member for insert molding with a plastic member is disclosed having a plurality of bonding portions arranged on the top wall thereof for enhancing the bonding strength of the plastic member to the metal sheet member, each bonding portion including a groove located on the top wall of the metal sheet member and a lug formed of a part of the metal sheet member and obliquely upwardly curved from one end of the groove.
    Type: Grant
    Filed: July 29, 2009
    Date of Patent: September 16, 2014
    Assignee: Yuan Deng Metals Industrial Co., Ltd.
    Inventor: Chin-Hsing Horng
  • Publication number: 20140242408
    Abstract: The invention relates to a method for manufacturing a metal-ceramic composite structure intended to be exposed to high temperatures. The composite structure includes a base metal structure or component, which is on at least one side covered and permanently joined with one or more ceramic tiles.
    Type: Application
    Filed: February 25, 2014
    Publication date: August 28, 2014
    Inventors: Herbert BRANDL, Hans-Peter BOSSMANN
  • Publication number: 20140186649
    Abstract: A coated article includes a metal substrate, a number of recesses defined in the metal substrate, and a plurality of sealing portions filled in the recesses. The sealing portions include metal, silicon oxide, aluminum oxide, sodium oxide, potassium oxide, and inorganic oxide pigment. The metal includes aluminum. A method for manufacturing the coated article is also provided.
    Type: Application
    Filed: April 30, 2013
    Publication date: July 3, 2014
    Inventor: REN-BO WANG
  • Publication number: 20140154521
    Abstract: Disclosed are a tailor welded blank and a manufacturing method thereof. The tailor welded blank is manufactured by connecting blank elements of different materials or thicknesses, thereby eliminating quality problems in a welded zone. A hot stamped component is manufactured by hot stamping the tailor welded blank formed by laser-welding blank elements made of coated steel plates having different strengths or thicknesses using a filler wire, wherein a laser-welded zone has a martensite structure.
    Type: Application
    Filed: May 28, 2013
    Publication date: June 5, 2014
    Inventors: Min-Suck Kwon, Yun-Gyu Kim, Young-Jin Kim, Chung-Yun Kang, Jong-Pan Kong, Myeong-Hwan Oh, Hyeon-Jeong Shin, Seung-Taik Oh
  • Publication number: 20140141274
    Abstract: A copper foil structure having blackened ultra-thin copper foil of the instant disclosure includes a carrier foil, a blackened layer, a release layer, and an ultra-thin copper foil. The carrier foil includes a matte surface and a shiny surface wherein the blackened layer is disposed thereon. The release layer is disposed on the blackened layer formed with one selected from the group: copper, cobalt, nickel, and manganese while the release layer is formed with one selected from the group: molybdenum, nickel, chromium, and potassium. Successively, the ultra-thin copper foil is disposed on the release layer. Laser drilling can apply to the blackened ultra-thin copper foil on the inner layers of a high density multi-layer printed wiring board, thus eliminating the traditional blackening or browning chemical process. The blackened ultra-thin copper foil in combination with a polyimide thin (PI) or other substrate materials displays desirable appearance.
    Type: Application
    Filed: September 17, 2013
    Publication date: May 22, 2014
    Applicant: Nan Ya Plastics Corporation
  • Publication number: 20140134451
    Abstract: A coating steel component with a pattern of an iron based matrix with crystalline particles metallurgically bound to the surface of a steel substrate for use as disc cutters or other components with one or more abrading surfaces that can experience significant abrasive wear, high point loads, and large shear stresses during use. The coated component contains a pattern of features in the shape of freckles or stripes that are laser formed and fused to the steel substrate. The features can display an inner core that is harder than the steel substrate but generally softer than the matrix surrounding the core, providing toughness and wear resistance to the features. The features result from processing an amorphous alloy where the resulting matrix can be amorphous, partially devitrified or fully devitrified.
    Type: Application
    Filed: January 16, 2014
    Publication date: May 15, 2014
    Applicant: UT-BATTELLE, LLC
  • Publication number: 20140120362
    Abstract: A partial plating method capable of applying fine hard gold plating, a laser plating device capable of applying partial plating to a minute region with high positional precision, and a plated member. The partial plating method comprising plating a region to be plated by projecting a laser beam having a wavelength of 330 nm or more and 450 nm or less. A laser plating device 10 comprises a plating tank 12, a laser oscillator 14 for emitting a laser beam, a conveying device 16 for conveying a member to be plated 80, a photoelectronic sensor 18 for detecting the position of a positioning hole 82 of the member to be plated 80, and a galvanometer scanner 20 having a galvanometer mirror 22 capable of scanning the laser beam. The plated member is applied with fine spot plating by the laser plating device 10.
    Type: Application
    Filed: March 14, 2013
    Publication date: May 1, 2014
  • Publication number: 20140087205
    Abstract: There is provided an electrode pad including: a connection terminal part; a first plating layer including palladium phosphorus (Pd—P) formed on the connection terminal part; and a second plating layer including palladium (Pd) formed on the first plating layer.
    Type: Application
    Filed: December 6, 2012
    Publication date: March 27, 2014
    Inventors: Jung Youn PANG, Shimoji Teruaki, Eun Heay Lee, Seong Min Cho, Chi Seong Kim
  • Publication number: 20140087204
    Abstract: A method for forming a tool marking structure contains: a first plating means used on a surface of a tool so as to form a first plating layer; a coloring means applied to print a marking area with a first color layer on the first plating layer and to have the first plating layer on a bottom end of the marking area; a carving means served to eliminate a part of the first color layer of the marking area so that the marking area has a marking portion and a contrast portion formed therein; a second plating means provided to form a second plating layer on the surface of the tool and the contrast portion of the marking area.
    Type: Application
    Filed: September 25, 2012
    Publication date: March 27, 2014
    Inventor: Leo Shih
  • Publication number: 20140048066
    Abstract: Nebulizer ampoules are labelled by laser-marking or laser-engraving data on a film to produce a data film and affixing the film onto a nebulizer ampoule using a non-migratory adhesive.
    Type: Application
    Filed: August 14, 2013
    Publication date: February 20, 2014
    Applicant: Holitas Limited
    Inventors: Mark Gibson, Peter Ernest Tasko
  • Publication number: 20140044985
    Abstract: A method of making a probe (and the resulting probe) comprising providing a metal foil, creating a tip on an edge of the foil, and laser cutting a body of the probe from the foil with one or more tips at an end of the body.
    Type: Application
    Filed: August 9, 2013
    Publication date: February 13, 2014
    Applicant: FormFactor, Inc.
    Inventor: January Kister
  • Publication number: 20140044984
    Abstract: Superalloy components are joined or repaired by mating a recess formed in one component substrate with a corresponding projection formed in another component along a contact surface and welding them together with a stud welding apparatus. A mating superalloy repair stud is formed with a stud projection whose profile conforms to the substrate recess profile along a corresponding contact surface. Both the stud and substrate are coupled to a stud welding apparatus, with the stud projection and substrate recess oriented in an opposed spaced relationship with a gap there between. The stud welding apparatus passes current between the stud projection and recess and forms an arc there between, to melt their respective opposed surfaces. The melted stud projection and substrate recess opposed surfaces are pressed into contact with each other with the stud welding apparatus, forming a weld there between.
    Type: Application
    Filed: August 10, 2012
    Publication date: February 13, 2014
    Inventor: Gerald J. Bruck
  • Publication number: 20140030541
    Abstract: Passivation integration schemes and pad structures to reduce the stress gradients and/or improve the contact surface existing between the Al in the pad and the gold wire bond. One of the pad structures provides a plurality of recessed pad areas which are formed in a single aluminum pad. An oxide mesa can he provided under the aluminum pad. Another pad structure provides a single recessed pad area which is formed in a single aluminum pad, and the aluminum pad is disposed above a copper pad and a plurality of trench/via pads. Still another pad structure provides a single recessed pad area which is formed in a single aluminum pad, and the aluminum pad is disposed above a portion of a copper pad, such that the aluminum pad and the copper pad are staggered relative to each other.
    Type: Application
    Filed: October 3, 2013
    Publication date: January 30, 2014
    Applicant: LSI CORPORATION
    Inventors: Hemanshu Bhatt, Dilip Vijay, Jayanthi Pallinti, Sey-Shing Sun, Hong Ying, Chi-Yi Kao
  • Publication number: 20140017575
    Abstract: A method for applying a metal on a substrate comprises: a) applying a coating by treatment in a plasma, comprising a compound selected from alkanes up to 10 carbon atoms, and unsaturated monomers, and b1) producing polymers on the surface of said substrate, said polymers comprising carboxylic groups and adsorbed ions of a second metal, reducing said ions to the second metal, or alternatively b2) producing polymers on the surface, bringing the surface of said substrate in contact with a dispersion of colloidal metal particles of at least one second metal, and c) depositing said first metal on said second metal. Advantages include that materials sensitive to for instance low pH or solvents can be coated. Substrates including glass, SiO2 with very few of no abstractable hydrogen atoms as well as polymer materials containing halogen atoms can be coated with good adhesion.
    Type: Application
    Filed: November 16, 2011
    Publication date: January 16, 2014
    Inventors: Sven Göthe, Björn Atthoff, Karl-Gunnar Larsson
  • Patent number: 8614008
    Abstract: Plate consisting of a steel substrate (1) and a precoat (2) consisting of a layer of intermetallic alloy (3) in contact with said substrate, topped by a layer of metal alloy (4), characterized in that, on at least one precoated face of said plate, an area (6) situated at the periphery of said plate has said metal alloy layer removed.
    Type: Grant
    Filed: March 29, 2007
    Date of Patent: December 24, 2013
    Assignee: ArcelorMittal France
    Inventors: Jean-Francois Canourgues, Aurelien Pic, Pascal Verrier, Rene Vierstraete, Wolfram Ehling, Bernd Thommes
  • Publication number: 20130316185
    Abstract: A sheet metal piece includes a base material layer and one or more intermediate and coating material layers, along with a weld notch formed along an edge region of the piece. At least a portion of the coating and intermediate material layers is removed at the weld notch so that certain constituents from such layers do not affect the integrity of a nearby weld joint when it is subsequently formed along the edge region. Various methods of ablation, including laser ablation, can be used to form the weld notch.
    Type: Application
    Filed: May 28, 2013
    Publication date: November 28, 2013
    Inventors: James J. Evangelista, Michael Telenko, JR., Jason E. Harfoot, Jack A. Atkinson, James W. Walther, Anthony M. Parente
  • Publication number: 20130309522
    Abstract: Provided is a sliding member having slidability and abrasion resistance both at satisfactory levels. This sliding member has a sliding surface including a base and a filling part. The base includes a first material and bears regularly arranged concavities. The filling part includes a second material and is arranged in the sliding surface to fill the concavities. The first material includes one selected from the group consisting of a metallic material, a ceramic material, and a carbonaceous material. The second material includes at least one selected from the group consisting of a metallic material, a ceramic material, and a carbonaceous material. The first and second materials differ from each other in at least one of frictional coefficient and hardness. The base and the filling part are substantially flush with each other in the sliding surface.
    Type: Application
    Filed: February 9, 2012
    Publication date: November 21, 2013
    Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
    Inventors: Hirotaka Ito, Kenji Yamamoto
  • Publication number: 20130302634
    Abstract: Disclosed herein is a method of manufacturing an inner panel of a vehicle tailgate, which is formed in a bending plate shape and to which reinforcing members are coupled to improve rigidity, including: temporarily coupling a plurality of sub-blanks to a main blank by spot welding; forming the main blank into an inner panel and the plurality of sub-blanks into a plurality of reinforcing members, using a forming mold; and permanently coupling the plurality of reinforcing members to the inner panel.
    Type: Application
    Filed: December 18, 2012
    Publication date: November 14, 2013
    Inventors: Youn-Il Jung, Heung-Jun Oh, Sang-Il Lee, Young-Hyun Kim
  • Publication number: 20130236736
    Abstract: An electroplating jig for processing electroplating at a certain location, an electroplating method incorporating with the electroplating jig, and an electro product free of a plating proof layer produced by the electroplating method are provided. The electroplating jig includes a base and a flexible electric conductive pad. An accommodation slot and an opening are respectively installed on two opposite surfaces of the base in which an electro can be disposed in the accommodation slot and the accommodation slot is larger than the opening and communicated with the opening, the opening exposes a first metal pattern of the electro therefrom. The flexible electric conductive pad is blanketed on a second metal pattern formed on another surface of the electro to electrically connect the first metal pattern and the second metal pattern.
    Type: Application
    Filed: September 5, 2012
    Publication date: September 12, 2013
    Inventors: Tzuh-Suan WANG, Ming-Chi Chiu, Yu-te Su, Ming-Chang Ku
  • Patent number: 8530033
    Abstract: The present invention relates to an external wall panel which is excellent in ornamental design and weather resistance and a coating method for the external wall panel. An external wall panel of the invention comprises a base panel having a three-dimensional ornamental design surface, a lower coating layer formed on the surface of the base panel, a mid-coating layer formed on the lower coating layer, a first clear layer containing beads formed on the mid-coating layer, and a second clear layer made of a transparent layer or semi-transparent layer formed on the first clear layer wherein the second clear layer has a thick film layer portion in the vicinity of a corner edge of a convex portion of the three-dimensional ornamental design surface.
    Type: Grant
    Filed: June 16, 2008
    Date of Patent: September 10, 2013
    Assignee: Nichiha Corporation
    Inventor: Syouzou Ohno
  • Publication number: 20130230736
    Abstract: A method for manufacturing a plurality of nanostructures (101) on a substrate (102). The method comprises the steps of: depositing a bottom layer (103) on an upper surface of the substrate (102), the bottom layer (103) comprising grains having a first average grain size; depositing a catalyst layer (104) on an upper surface of the bottom layer (103), the catalyst layer (104) comprising grains having a second average grain size different from the first average grain size, thereby forming a stack of layers comprising the bottom layer (103) and the catalyst layer (104); heating the stack of layers to a temperature where nanostructures (101) can form; and providing a gas comprising a reactant such that the reactant comes into contact with the catalyst layer (104).
    Type: Application
    Filed: October 18, 2010
    Publication date: September 5, 2013
    Applicant: SMOLTEK AB
    Inventor: Mohammad Shafiqul Kabir
  • Patent number: 8524364
    Abstract: The present invention is directed to a composite particle that is microscopically two-dimensional with a third nanoscopic dimension, and to methods of making same. The particle may include a support and a metal layer. The metal layer may be catalytically active such that the particle is adapted to act as a catalyst.
    Type: Grant
    Filed: June 24, 2011
    Date of Patent: September 3, 2013
    Assignee: Southwest Research Institute
    Inventors: James H. Arps, Kent Edward Coulter
  • Publication number: 20130108886
    Abstract: A metal component for one or more of a fitting, a piece of furniture and a household appliance. The metal component includes a coating, at least in sections, the coating including one of a hardness-containing composite material and a ceramic-metal composite material.
    Type: Application
    Filed: May 11, 2011
    Publication date: May 2, 2013
    Applicant: PAUL HETTICH GMBH & CO. KG
    Inventors: Peter Jährling, Daniel Rehage, Uwe Sobolewski, Lars Schrubke, Willi Grigat, Arthus Krause, Björn Gebhardt
  • Patent number: 8367191
    Abstract: Optical thin-films are disclosed that are formed from optical thin films formed on a base plate arranged in a vacuum chamber. The base plates are held on a plurality of retaining frames of a base-plate retainer. The thin films are formed by heating the base plate and emitting a deposition material from a deposition source. The retaining frames are configured to make the entire base plate uniformly heated.
    Type: Grant
    Filed: November 9, 2011
    Date of Patent: February 5, 2013
    Assignee: Nihon Dempa Kogyo Co., Ltd.
    Inventors: Shinya Kikegawa, Toshimasa Nishi, Motoo Takada
  • Publication number: 20130029172
    Abstract: Coated steel having a well defined and uniform thickness is useful and advantageous for preparing products by hot stamping. Products prepared by hot stamping such a steel are particularly advantageous when subjected to a subsequent spot welding step.
    Type: Application
    Filed: September 15, 2012
    Publication date: January 31, 2013
    Applicant: ArcelorMittal France
    Inventors: Pascal DRILLET, Dominique Spehner, Ronald Kefferstein
  • Publication number: 20130022830
    Abstract: A bumping process comprises steps of forming a metal layer with copper on a substrate, and the metal layer with copper comprises a plurality of first zones and second zones; forming a photoresist layer on the metal layer with copper; patterning the photoresist layer to form a plurality of openings; forming a plurality of copper bumps within the openings, each of the copper bumps covers the first zones and comprises a first top surface; forming a connection layer on the first top surface; removing the photoresist layer; removing the second zones and enabling each of the first zones to form an under bump metallurgy layer, wherein the under bump metallurgy layer, the copper bump, and the connection layer possess their corresponded peripheral walls, and covering sections of a first protective layer formed on the connection layer may cover those peripheral walls to prevent ionization phenomenon.
    Type: Application
    Filed: July 20, 2011
    Publication date: January 24, 2013
    Inventors: Chin-Tang Hsieh, Chih-Ming Kuo
  • Publication number: 20130004789
    Abstract: On the surface of the spread multi-layered metal object, as reaches from outside to inside of step-wise, the pattern shaped concave is formed by reaching the lower layer of metal layer of the metal layer. The concave is formed as step-wise, the innermost reaches inside of the metal layer from the surface, the outer reaches the top of the metal layer from the surface, and the outermost reaches the top of the metal layer. The metals removed to form the concave remains inside and effectively control on the pattern part obtained at the end. As a result, able to form desired pattern stably.
    Type: Application
    Filed: June 29, 2012
    Publication date: January 3, 2013
    Inventor: Masaki Takahashi
  • Patent number: 8309636
    Abstract: There are provided a flame-retardant resin composition for a multilayer wiring board and a multilayer wiring board having the same. The flame-retardant resin composition for a multilayer wiring board according to an exemplary embodiment of the present invention includes a composite epoxy resin including a naphthalene modified epoxy resin, a cresol novolac epoxy resin, a rubber modified epoxy resin and a phosphorous-based epoxy resin, as well as a flame retardant represented by a specific chemical formula. The flame-retardant resin composition for a multilayer wiring board and the multilayer wiring board having the same disclosed herein exhibits excellent flame retardancy, moisture resistance and peel strength.
    Type: Grant
    Filed: June 16, 2011
    Date of Patent: November 13, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyung Mi Jung, Jae Choon Cho, Choon Keun Lee
  • Patent number: 8277953
    Abstract: The present invention relates to an apparatus with a structured hard chrome layer electrodeposited onto a work-piece, the structured hard chrome layer being cup-shaped and/or labyrinth-like and/or column-shaped. The structured hard chrome layer can be electrodeposited from an electrolyte onto the work-piece, said electrolyte containing (a) a Cr (VI) compound in an amount corresponding to 50 g/l to 600 g/l of chromic acid anhydride; (b) 0.5 g/l to 10 g/l of sulphuric acid; (c) 1 g/l to 20 g/l of aliphatic sulphonic acid, comprising 1 to 6 carbon atoms; and (d) 10 g/l to 200 g/l of at least one compound forming a dense cathode film, said compound being selected from among ammonium molybdate, alkali molybdate and alkaline earth molybdate, ammonium vanadate, alkali vanadate and alkaline earth vanadate, ammonium zirconate, alkali zirconate and alkaline earth zirconate.
    Type: Grant
    Filed: January 7, 2010
    Date of Patent: October 2, 2012
    Assignee: Federal-Mogul Burscheid GmbH
    Inventors: Rudolf Linde, Stefan Durdoth
  • Publication number: 20120213917
    Abstract: A tube-shaped sputtering target is provided having a carrier tube and an indium-based sputtering material arranged on the carrier tube. The sputtering material has a microstructure having a mean grain size of less than 1 mm, measured as the mean diameter of the grains on the sputtering-roughened surface of the sputtering material.
    Type: Application
    Filed: February 3, 2012
    Publication date: August 23, 2012
    Inventors: Christoph SIMONS, Martin SCHLOTT, Josef HEINDEL, Christoph STAHR
  • Publication number: 20120094141
    Abstract: A welding method is provided which makes it possible to obtain a joint body having a sufficient strength by selecting a metal glass and a crystalline metal having given conditions. According to the present invention, there is provided a welding method of applying energy to an interface where a metal glass and a crystalline metal make contact with each other or to the metal glass near the interface, of forming a molten layer by heating and melting the metal glass and of performing welding, in which the molten layer after the metal glass and the crystalline metal have been joined together has a glass formation ability, the metal glass has a glass formation ability in which a nose time of a TTT curve when a solid of the metal glass is reheated is 0.
    Type: Application
    Filed: March 18, 2010
    Publication date: April 19, 2012
    Inventors: Yoshihito Kawamura, Jonghyun Kim, Hironori Kuroki, Yuji Yanagida, Naohisa Sawai, Masafumi Miyajima
  • Patent number: 8133538
    Abstract: A method of producing a mold having an uneven structure and a mold for an optical element are provided. The method includes forming on a nickel substrate a mixed film using nickel and a material which phase separates from nickel simultaneously, the mixed film including a plurality of cylinders including nickel as a component thereof and a matrix region including the material which phase separates from nickel as a component thereof and surrounding the plurality of cylinders; and removing the matrix portion from the mixed film by etching to give a mold including nickel or a nickel alloy. The uneven structure is disposed in plurality on the substrate, and a pitch of the uneven structure is within a range of 30 nm or more and 500 nm or less and a depth of the uneven structure is within a range of 100 nm or more.
    Type: Grant
    Filed: March 15, 2007
    Date of Patent: March 13, 2012
    Assignee: Canon Kabushiki Kaisha
    Inventors: Ryoko Horie, Yasuhiro Matsuo, Nobuhiro Yasui, Toru Den
  • Patent number: 8106186
    Abstract: There is provided a novel transition metal phosphine complex having excellent anticancer activity. The transition metal phosphine complex is represented by general formula (1): (wherein R1s and R3s each represent an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, a pyridyl group, or a pyrimidyl group; R2s and R4s each represent an alkyl group or a cycloalkyl group, provided that each R1 and each R2 are not the same group and that each R3 and each R4 are not the same group; As each represent a linear alkylene group or a cis-vinylene group; M represents a gold atom, a silver atom, a copper atom, or a platinum atom; and B represents an anionic species).
    Type: Grant
    Filed: April 17, 2006
    Date of Patent: January 31, 2012
    Assignee: Nippon Chemical Industrial Co., Ltd.
    Inventors: Hiroaki Kodama, Keisuke Ohto, Nobuhiko Oohara, Kazuhiro Nakatsui, Yoshirou Kaneda
  • Publication number: 20120015205
    Abstract: A process for preparing an imaging surface of an imaging transfer member in a printing machine, the process comprises providing a surface roughness to the imaging surface to produce a plurality of pits having sharp features on the surface, and then exposing the pitted imaging surface to an acid dip for a time period sufficient to substantially reduce the sharp features on the imaging surface. This process may be followed by anodization. The process produces an imaging surface having a pit structure providing reduced oil consumption and wear of components of the printing machine that contact the imaging surface.
    Type: Application
    Filed: July 13, 2010
    Publication date: January 19, 2012
    Applicant: Xerox Corporation
    Inventors: Trevor James Snyder, David VanKouwenberg, Jignesh Sheth, Paul McConville, Brian Bitz
  • Publication number: 20110307068
    Abstract: A coating for a CoCrMo substrate including a first layer located directly on the substrate and including Ta(CoCrMo)0.5-2.0, a second layer located directly on the first layer and including tantalum, a third layer located directly on the second layer and including tantalum carbide, and a fourth layer located directly on the third layer and including diamond-like carbon (DLC).
    Type: Application
    Filed: April 14, 2011
    Publication date: December 15, 2011
    Applicant: Synthes USA, LLC
    Inventors: Roland Hauert, Goetz Thorwarth, Claudiu Falub, Ulrich Mueller, Cyril Voisard
  • Publication number: 20110291262
    Abstract: A device includes a work piece including a metal bump; and a dielectric layer having a portion directly over the metal bump. The metal bump and a surface of the portion of the dielectric layer form an interface. A metal finish is formed over and contacting the metal bump. The metal finish extends from over the dielectric layer to below the interface.
    Type: Application
    Filed: May 28, 2010
    Publication date: December 1, 2011
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wen-Wei Shen, Chen-Shien Chen, Chen-Cheng Kuo, Ming-Fa Chen, Rung-De Wang
  • Publication number: 20110268984
    Abstract: A method of controlling “rough coating” and “pinhole-uncoated” surface defects on a steel strip coated with a aluminum-zinc-silicon alloy. The alloy has 50-60% wt Al, 37-46% wt Zn and 1.2-2.3% wt Si. The method includes heat treating the steel strip in a heat treatment furnace and thereafter hot-dip coating the strip in a molten bath and thereby forming a coating of the alloy on the steel strip. The method is characterized by controlling the concentration of (i) strontium or (ii) calcium or (iii) strontium and calcium in the molten bath to be at least 2 ppm.
    Type: Application
    Filed: July 14, 2011
    Publication date: November 3, 2011
    Inventors: Wayne Renshaw, Qiyang Liu
  • Publication number: 20110244263
    Abstract: A method of patterning and an article having a patterned structure defined therein are provided. The method comprises the steps of providing a substrate having a patterned conductive metal film disposed thereon. The patterned conductive metal film has at least one raised feature. The patterned conductive metal film defines at least one recess therein that is adjacent to the at least one raised feature. A surface of the substrate is exposed in the at least one recess. The pattern is modified through electrolysis in an electrodeposition setup including an electrolyte and two electrodes. The patterned conductive metal film is one of the electrodes during electrolysis. The method is ideal for shrinking initial patterns having features that are on the magnitude of microscale dimensions to obtain a final pattern having features that are on the magnitude of nanoscale dimensions.
    Type: Application
    Filed: April 4, 2011
    Publication date: October 6, 2011
    Inventors: Peicheng Ku, Leung Kway Lee
  • Publication number: 20110242778
    Abstract: Approaches for formation of a circuit via which electrically connects a first thin film metallization layer a second thin film metallization layer are described. Via formation involves the use of an anodization barrier and/or supplemental pad disposed in a via connection region prior to anodization of the first metallization layer. The material used to form the barrier is substantially impermeable to the anodization solution during anodization, and disrupts the formation of oxide between the electrically conducting layer and the barrier. The supplemental pad is non-anodizable, and is covered by the barrier to substantially prevent current flow through the pad during anodization. Following anodization, the barrier is removed. If the supplemental pad is sufficiently conductive, it can be left on the first metallization layer after removal of the barrier.
    Type: Application
    Filed: December 3, 2009
    Publication date: October 6, 2011
    Inventors: Steven D. Theiss, Michael A. Haase
  • Publication number: 20110194673
    Abstract: A microstructure manufacturing method includes: preparing a mold having on a front side thereof a plurality of fine structures, with conductivity being imparted to a bottom portion between the plurality of fine structures; forming a first plating layer between the plurality of fine structures by plating the bottom portion; and forming a second plating layer of larger stress than the first plating layer on the first plating layer between the plurality of fine structures, wherein the stress of the second plating layer is used to curve a back side surface of the mold.
    Type: Application
    Filed: February 8, 2011
    Publication date: August 11, 2011
    Inventors: Takayuki Teshima, Shinan Wang, Yutaka Setomoto, Takashi Nakamura