Discontinuous Surface Component Patents (Class 428/601)
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Patent number: 8106186Abstract: There is provided a novel transition metal phosphine complex having excellent anticancer activity. The transition metal phosphine complex is represented by general formula (1): (wherein R1s and R3s each represent an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, a pyridyl group, or a pyrimidyl group; R2s and R4s each represent an alkyl group or a cycloalkyl group, provided that each R1 and each R2 are not the same group and that each R3 and each R4 are not the same group; As each represent a linear alkylene group or a cis-vinylene group; M represents a gold atom, a silver atom, a copper atom, or a platinum atom; and B represents an anionic species).Type: GrantFiled: April 17, 2006Date of Patent: January 31, 2012Assignee: Nippon Chemical Industrial Co., Ltd.Inventors: Hiroaki Kodama, Keisuke Ohto, Nobuhiko Oohara, Kazuhiro Nakatsui, Yoshirou Kaneda
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Publication number: 20120015205Abstract: A process for preparing an imaging surface of an imaging transfer member in a printing machine, the process comprises providing a surface roughness to the imaging surface to produce a plurality of pits having sharp features on the surface, and then exposing the pitted imaging surface to an acid dip for a time period sufficient to substantially reduce the sharp features on the imaging surface. This process may be followed by anodization. The process produces an imaging surface having a pit structure providing reduced oil consumption and wear of components of the printing machine that contact the imaging surface.Type: ApplicationFiled: July 13, 2010Publication date: January 19, 2012Applicant: Xerox CorporationInventors: Trevor James Snyder, David VanKouwenberg, Jignesh Sheth, Paul McConville, Brian Bitz
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Publication number: 20110307068Abstract: A coating for a CoCrMo substrate including a first layer located directly on the substrate and including Ta(CoCrMo)0.5-2.0, a second layer located directly on the first layer and including tantalum, a third layer located directly on the second layer and including tantalum carbide, and a fourth layer located directly on the third layer and including diamond-like carbon (DLC).Type: ApplicationFiled: April 14, 2011Publication date: December 15, 2011Applicant: Synthes USA, LLCInventors: Roland Hauert, Goetz Thorwarth, Claudiu Falub, Ulrich Mueller, Cyril Voisard
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Publication number: 20110291262Abstract: A device includes a work piece including a metal bump; and a dielectric layer having a portion directly over the metal bump. The metal bump and a surface of the portion of the dielectric layer form an interface. A metal finish is formed over and contacting the metal bump. The metal finish extends from over the dielectric layer to below the interface.Type: ApplicationFiled: May 28, 2010Publication date: December 1, 2011Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wen-Wei Shen, Chen-Shien Chen, Chen-Cheng Kuo, Ming-Fa Chen, Rung-De Wang
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Publication number: 20110268984Abstract: A method of controlling “rough coating” and “pinhole-uncoated” surface defects on a steel strip coated with a aluminum-zinc-silicon alloy. The alloy has 50-60% wt Al, 37-46% wt Zn and 1.2-2.3% wt Si. The method includes heat treating the steel strip in a heat treatment furnace and thereafter hot-dip coating the strip in a molten bath and thereby forming a coating of the alloy on the steel strip. The method is characterized by controlling the concentration of (i) strontium or (ii) calcium or (iii) strontium and calcium in the molten bath to be at least 2 ppm.Type: ApplicationFiled: July 14, 2011Publication date: November 3, 2011Applicant: BLUESCOPE STEEL LIMITEDInventors: Wayne Renshaw, Qiyang Liu
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Publication number: 20110242778Abstract: Approaches for formation of a circuit via which electrically connects a first thin film metallization layer a second thin film metallization layer are described. Via formation involves the use of an anodization barrier and/or supplemental pad disposed in a via connection region prior to anodization of the first metallization layer. The material used to form the barrier is substantially impermeable to the anodization solution during anodization, and disrupts the formation of oxide between the electrically conducting layer and the barrier. The supplemental pad is non-anodizable, and is covered by the barrier to substantially prevent current flow through the pad during anodization. Following anodization, the barrier is removed. If the supplemental pad is sufficiently conductive, it can be left on the first metallization layer after removal of the barrier.Type: ApplicationFiled: December 3, 2009Publication date: October 6, 2011Inventors: Steven D. Theiss, Michael A. Haase
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Publication number: 20110244263Abstract: A method of patterning and an article having a patterned structure defined therein are provided. The method comprises the steps of providing a substrate having a patterned conductive metal film disposed thereon. The patterned conductive metal film has at least one raised feature. The patterned conductive metal film defines at least one recess therein that is adjacent to the at least one raised feature. A surface of the substrate is exposed in the at least one recess. The pattern is modified through electrolysis in an electrodeposition setup including an electrolyte and two electrodes. The patterned conductive metal film is one of the electrodes during electrolysis. The method is ideal for shrinking initial patterns having features that are on the magnitude of microscale dimensions to obtain a final pattern having features that are on the magnitude of nanoscale dimensions.Type: ApplicationFiled: April 4, 2011Publication date: October 6, 2011Inventors: Peicheng Ku, Leung Kway Lee
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Publication number: 20110194673Abstract: A microstructure manufacturing method includes: preparing a mold having on a front side thereof a plurality of fine structures, with conductivity being imparted to a bottom portion between the plurality of fine structures; forming a first plating layer between the plurality of fine structures by plating the bottom portion; and forming a second plating layer of larger stress than the first plating layer on the first plating layer between the plurality of fine structures, wherein the stress of the second plating layer is used to curve a back side surface of the mold.Type: ApplicationFiled: February 8, 2011Publication date: August 11, 2011Applicant: CANON KABUSHIKI KAISHAInventors: Takayuki Teshima, Shinan Wang, Yutaka Setomoto, Takashi Nakamura
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Publication number: 20110150658Abstract: A process of fabricating rotating hardware and rotating hardware formed thereby. The process includes fabricating at least two members that together define at least two portions of a component. Each member has an interface surface at which the members can be joined to locate a first of the portions in a radially outward direction from a second of the portions. The members are joined together so that the interface surfaces thereof form a joint interface located within a pad region that has a axial thickness that is greater than a contiguous region of the component. The joint interface is not perpendicular to the axial and radial directions of the component. The pad region is defined by embossments that are offset from each other in the radial direction of the component so as to partially but not completely overlap each other in the axial direction of the component.Type: ApplicationFiled: December 22, 2009Publication date: June 23, 2011Applicant: GENERAL ELECTRIC COMPANYInventors: Daniel David Noe, John Todd Wheatley
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Publication number: 20110091738Abstract: A composite material for an electric/electronic part, having a metal base, a resin film on at least a part of the metal base, and a layer of Sn or a Sn alloy on at least a part of the metal base at a site where the resin film is not provided, the layer of Sn or a Sn alloy including a solidified structure, and the resin film having a residual solvent quantity adjusted to 5% to 25% by mass.Type: ApplicationFiled: December 23, 2010Publication date: April 21, 2011Inventors: Akira TACHIBANA, Chikahito SUGAHARA, Shuichi KITAGAWA
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Patent number: 7854995Abstract: The present invention relates to a low cost technique for manufacturing dual helical gears, such as herringbone gears, from powder metals. The dual helical gears made by this technique are of high density (greater than 92% of theoretical density) and offer superior strength. The present invention more specifically discloses a forged metal herringbone gear which is comprised of a body and a plurality of teeth wherein the metal has a density of greater than 92% of theoretical and wherein the grain in the teeth is one range higher on the ASTM E 112 grain size chart than the grain in the body of the gear.Type: GrantFiled: August 23, 2007Date of Patent: December 21, 2010Assignee: Keystone Investment CorporationInventor: Gary L. Anderson
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Publication number: 20100294352Abstract: Layered metal structures are patterned to form a surface with some locations having an alloy along the top surface at some locations and the original top metal layer at other locations along the surface. The alloy and original top metal layer can be selected to have differential etching properties such that the pattern of the alloy or original metal can be selectively etched to form a patterned metal interconnect. In general, the patterning is performed by localized heating that drives formation of the alloy at the heated locations. The metal patterning can be useful for solar cell applications as well as for electronics applications, such as display applications.Type: ApplicationFiled: May 20, 2009Publication date: November 25, 2010Inventors: Uma Srinivasan, Neeraj Pakala, William A. Sanders, Henry Hieslmair
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Publication number: 20100261031Abstract: The present invention relates to the manufacturing method of metal clad laminates by forming a conductive layer on a single side or both sides of a material film that is made of an insulating material using the silver complexes having a unique structure and electroplating metals outside of said conductive layer. The present invention can provide the manufacturing method of metal clad laminates, which has a fast operation speed for mass production, simple process steps to minimize defective ratio and cheap production cost.Type: ApplicationFiled: August 2, 2007Publication date: October 14, 2010Applicant: INKTEC CO., LTD.Inventors: Kwang Choon Chung, Hyun Nam Cho, Seong-Yong Uhm
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Publication number: 20100215979Abstract: A method of forming a metal film and a metal wiring pattern is described a step of forming an organic film by applying and polymerizing an undercoat composition for forming a metal film containing an addition-polymerizable monomer having an acidic group and a polymerization initiator on a substrate or film, a step of converting the acidic group into a metal (M1) salt by treating the organic film with an aqueous solution containing a metal (M1) ion, a step of converting the metal (M1) salt into a metal (M2) salt by treating the organic film with an aqueous solution containing a metal (M2) ion having an ionization tendency lower than the metal (M1) ion, and a step of forming a metal film on the organic film surface by reducing the metal (M2) ion.Type: ApplicationFiled: June 6, 2006Publication date: August 26, 2010Applicants: OMRON CorporationInventors: Seiji Nakajima, Tetsuya Mori, Hidemi Nawafune
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Publication number: 20100200284Abstract: A substrate manufacturing apparatus manufactures a ball-mounted substrate and has a ball mounting apparatus which includes a ball vacuum chucking apparatus including a vacuum chucking head that carries out a vacuum chucking process to chuck balls at edges of inlets formed in a vacuum chucking surface and which mounts the balls vacuum-chucked by the vacuum chucking head on a substrate, the ball vacuum chucking apparatus further including: a holding vessel that holds the balls; and a vacuum chucking/holding unit that vacuum chucks and holds the balls held in the holding vessel on a front end thereof, and carrying out a supplying process that brings the vacuum chucking/holding unit that holds the balls on the front end thereof and the vacuum chucking surface of the vacuum chucking head relatively close to supply the balls to the vacuum chucking head while air is being drawn through the inlets.Type: ApplicationFiled: February 9, 2010Publication date: August 12, 2010Applicant: Hioki Denki Kabushiki KaishaInventors: Kazuhiko SEKI, Hideo MATSUBAYASHI, Makoto SHIMIZU
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Publication number: 20100159268Abstract: In the case of a method for producing decorative surface structures, patterns or the like on articles, in particular sanitary articles, basic bodies made of a first metal, basic bodies made of metal that are coated with a first metal or basic bodies made of plastic that are coated with a first metal are used as a basis. Then, a layer of material temporarily applied to the article is partially removed by electromagnetic radiation or by particle radiation, thereby forming a first surface structure with regions that are free from material. Subsequently, the first metal is at least partially removed in the material-free regions or the first metal or some other metal is built up in the material-free regions. This method step is followed by removal of the still present material, a second (final) surface structure being formed. Finally, further top layers can preferably be applied to the article, the second surface structure being substantially retained.Type: ApplicationFiled: June 14, 2006Publication date: June 24, 2010Inventor: Andreas Fath
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Publication number: 20100143743Abstract: A stainless steel substrate with one or more conductive metal layers, a method for manufacturing the same, and a hard disk drive suspension material using the same that are excellent in etching accuracy and does not involve the use of any substances casing environmental burdens, while ensuring stable adhesion between the conductive metal layers on the stainless steel substrate and the polyimide-based resin layer. The conductive metal layers are formed to have a total thickness ranging from 0.1 to 10 ?m, a centerline average surface roughness Ra from 0.05 to 1 ?m, and a ten-point average surface roughness Rz from 1 to 5 ?m, respectively.Type: ApplicationFiled: January 26, 2007Publication date: June 10, 2010Applicant: NIPPON STEEL MATERIALS CO., LTD.Inventors: Yoshito Yamasaki, Jun Nakatsuka, Shuji Nagasaki, Tooru Inaguma, Yuji Kubo, Tsutomu Sugiura
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Publication number: 20100143744Abstract: The surface of a material is textured and by exposing the surface to pulses from an ultrafast laser. The laser treatment causes pillars to form on the treated surface. These pillars provide for greater light absorption. Texturing and crystallization can be carried out as a single step process. The crystallization of the material provides for higher electric conductivity and changes in optical and electronic properties of the material. The method may be performed in vacuum or a gaseous environment. The gaseous environment may aid in texturing and/or modifying physical and chemical properties of the surfaces. This method may be used on various material surfaces, such as semiconductors, metals and their alloys, ceramics, polymers, glasses, composites, as well as crystalline, nanocrystalline, polycrystalline, microcrystalline, and amorphous phases.Type: ApplicationFiled: March 6, 2008Publication date: June 10, 2010Applicant: UNIVERSITY OF VIRGINIA PATENT FOUNDATIONInventors: Mool C. Gupta, Barada K. Nayak
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Publication number: 20100125254Abstract: Monocyclic chlorine based inductively coupled plasma deep etching processes for the rapid micromachining of titanium substrates and titanium devices so produced are disclosed. The method parameters are adjustable to simultaneously vary etch rate, mask selectivity, and surface roughness and can be applied to titanium substrates having a wide variety of thicknesses to produce high aspect ratio features, smooth sidewalls, and smooth surfaces. The titanium microdevices so produced exhibit beneficially high fracture toughness, biocompatibility and are robust and able to withstand harsh environments making them useful in a wide variety of applications including microelectronics, micromechanical devices, MEMS, and biological devices that may be used in vivo.Type: ApplicationFiled: October 2, 2006Publication date: May 20, 2010Applicant: The Regents of the University of CaliforniaInventors: Emily R. Parker, B. J. Thibeault, Marco F. Aimi, Masa P. Rao, Noel C. MacDonald
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Publication number: 20100034335Abstract: Articles having surfaces with enhanced wetting properties are presented. One embodiment is an article having a surface configured for promoting a phase transformation from a liquid phase to a vapor phase. The article comprises an element comprising a surface disposed to be in contact with a liquid to be transformed to a vapor, and the surface comprises a plurality of surface features having a median feature size, a, and a median feature spacing, b, such that the ratio b/a is up to about 8. The surface comprises a material disposed to contact the liquid, and this material has a nominal wettability sufficient to generate a nominal contact angle of up to about 80 degrees with a drop of the liquid. Another embodiment is a fuel rod for a nuclear reactor comprising a surface configured as described above.Type: ApplicationFiled: December 19, 2006Publication date: February 11, 2010Applicant: GENERAL ELECTRIC COMPANYInventors: Kripa Kiran Varanasi, Nitin Bhate, Ming Feng Hsu, Andrew Maxwell Peter, Tao Deng, Gregory Allen O'Neil, Judith Stein
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Publication number: 20090284443Abstract: A flexible film and a display device including the same are disclosed. The flexible film includes an insulating film including at least one hole. The insulating film further includes a first surface corresponding to an inner circumferential surface of the hole, a second surface corresponding to an upper surface of the insulating film, and a third surface corresponding to a lower surface of the insulating film. The flexible film includes a first metal layer and a second metal layer that is positioned on the first surface and at least one of the second and third surfaces. A thickness of the first metal layer is smaller than a thickness of the second metal layer.Type: ApplicationFiled: January 22, 2009Publication date: November 19, 2009Inventors: Jungsup Yum, Dongki Ko
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Publication number: 20090269206Abstract: A process for building up a leading edge of a machine component such as a leading edge of a turbine blade for a turbocharger includes forming a molten pool along the edge of the machine component, feeding a filler material in a solid state into the molten pool and melting the filler material via heat transfer between the molten pool and the filler material. A solid layer may be formed along the leading edge by cooling the molten pool. The process is applicable to remanufacturing damaged machine components having a plurality of blades with relatively thin leading edges.Type: ApplicationFiled: April 25, 2008Publication date: October 29, 2009Inventors: Alexei Yelistratov, Marion Grant
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Publication number: 20090263674Abstract: An integrated circuit structure includes a substrate and a metallization layer over the substrate. The metallization layer includes a dielectric layer and metal lines in the dielectric layer. The integrated circuit structure further includes a sensing element over the metallization layer. The sensing element may be formed in passivation layers.Type: ApplicationFiled: April 22, 2008Publication date: October 22, 2009Inventors: Ke Chun Liu, Kuan-Chieh Huang, Chin-Min Lin, Ken Wen-Chien Fu, Mingo Lin
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Patent number: 7569286Abstract: Disclosed is a hardfacing alloy capable of withstanding service abrasion of the order of silicious earth particles and weldable on industrial products, such as tool joints and stabilizers used in oil and gas well drilling, and other industrial products. The hardfacing alloy has a low coefficient of friction resulting from excellent metal to metal resistance and significant reduction in industrial wear on industrial products, such as casing wear. Other embodiments of the invention include tool joints having the hardbanding alloy welded to the outer cylindrical surface to its box and pin members and to stabilizer ribs on the stabilizer used in earth boring, such as boring for oil and gas, other industrial products, and methods of applying the hardfacing alloy to their surfaces.Type: GrantFiled: March 10, 2008Date of Patent: August 4, 2009Assignee: ATT Technology, Ltd.Inventors: Roger Auguste Daemen, Keith E. Moline
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Patent number: 7566504Abstract: An iron species preform for forming a metal matrix composite is inserted in an aluminum species alloy member to be cast-in. The aluminum species alloy member has bearing faces having a section in a semicircular arc shape. An inner peripheral face of the iron species preform is provided with a plurality of inner side grooves. The inner side groove includes flat portions and groove bottom portions continuous to two end edges continuous to the inner peripheral face and opposed to each other. In a cast-in step, shrinkage in a peripheral direction accompanied by solidifying a melted aluminum species alloy is uniformly received by the respective inner side grooves, movement in the peripheral direction is restrained, a clearance at an interface can be prevented from being brought about, so that a cast-in performance is excellent, and stable bonding strength and close contact of the interface can be ensured.Type: GrantFiled: September 28, 2006Date of Patent: July 28, 2009Assignees: Fuji Jukogyo Kabushiki Kaisha, Nippon Piston Ring, Co. LtdInventors: Teruyuki Oda, Hiroshi Takiguchi
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Publication number: 20090183991Abstract: A corrosion detection method detects galvanic corrosion occurring in a heterogeneous metal layer using a forming step and an observing step. The forming step is the step of forming the heterogeneous metal layer and a monitoring pattern by electrolytic plating a plurality of types of metal layers on a substrate. The observing step is the step of observing a surface of the monitoring pattern from above. The monitoring pattern has an identical structure of the heterogeneous metal layer. The monitoring pattern is in an area different from an area in which the heterogeneous layer is formed on the substrate.Type: ApplicationFiled: December 18, 2008Publication date: July 23, 2009Applicant: FUJITSU LIMITEDInventor: Yukio Yamamoto
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Publication number: 20090176120Abstract: A method is described that can be used in electrodes for electrochemical devices and includes disposing a precious metal on a top surface of a corrosion-resistant metal substrate. The precious metal can be thermally sprayed onto the surface of the corrosion-resistant metal substrate to produce multiple metal splats. The thermal spraying can be based on a salt solution or on a metal particle suspension. A separate bonding process can be used after the metal splats are deposited to enhance the adhesion of the metal splats to the corrosion-resistant metal substrate. The surface area associated with the splats of the precious metal is less than the surface area associated with the top surface of the corrosion-resistant metal substrate. The thermal spraying rate can be controlled to achieve a desired ratio of the surface area of the metal splats to the surface area of the corrosion-resistant metal substrate.Type: ApplicationFiled: January 8, 2009Publication date: July 9, 2009Applicant: TREADSTONE TECHNOLOGIES, INC.Inventor: Conghua Wang
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Publication number: 20090148720Abstract: An electronic component device includes an electronic component element including a lower surface having a metal surface provided thereon, a metal plate arranged so that a first principal surface thereof faces the lower surface of the electronic component element, and a first solder provided between the lower surface of the electronic component element and the first principal surface of the metal plate, the first solder arranged to connect the electronic component element to the metal plate. At least a portion of a peripheral portion of the first principal surface of the metal plate is located outwardly beyond an outer periphery of the lower surface of the electronic component element. A ridge defined by the first solder is provided in the peripheral portion of the first principal surface of the metal plate along the outer periphery of the lower surface of the electronic component element.Type: ApplicationFiled: February 23, 2009Publication date: June 11, 2009Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Hiroki KITAYAMA, Yoshitsugu HORI
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Patent number: 7517590Abstract: A metal band inlay for trim strips or sealing strips of flexible material that is bent to form a section. The metal band includes a plurality of edge slots in the longitudinal direction, which are guided inwardly from an edge of the metal band transversely to the longitudinal direction. The edge slots are wedge shaped. Central slots run to a tip toward their respective two ends and are arranged between the sequential edge slots. The central slots extend transversely to the longitudinal direction, but do not extend up to the edge. To simplify the cutting, the metal band further includes throughcuts that extend transversely to the longitudinal direction of the metal band, that correspond to at least some of the central slots and that extend from at least one edge of the metal band in the direction toward the tip of the respective central slot disposed opposite to the edge.Type: GrantFiled: November 15, 2005Date of Patent: April 14, 2009Assignee: BFC Buro-und Fahrzeugtechnik GmbH & Co. Prod. KGInventor: Joachim Wagner
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Publication number: 20090087680Abstract: A coated metal product is disclosed in which the surface of a ferrous component is coated using an anticorrosive layer, and the surface of the anticorrosive layer is coated using a coating film. The coating film has numerous very small uncoated portions for exposing the surface of the anticorrosive layer to the exterior of the coated metal product, rather than the entire surface of the anticorrosive layer being coated.Type: ApplicationFiled: September 24, 2008Publication date: April 2, 2009Applicant: Honda Motor Co., Ltd.Inventors: Hideaki Takada, Kenji Suto
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Publication number: 20090053550Abstract: Orientation degree and smoothness of a substrate surface better than those of conventional ones are provided in a textured substrate for epitaxial thin film growth. The present invention is a textured substrate for epitaxial film formation, including a crystal orientation improving layer made of a metal thin film of 1 to 5000 nm in thickness on the surface of the textured substrate for epitaxial film formation having a textured metal layer at least on one surface, wherein differences between orientation degrees (?? and ??) in the textured metal layer surface and orientation degrees (?? and ??) in the crystal orientation improving layer surface are both 0.1 to 3.0°. Further, when another metal different from the metal constituting this textured substrate crystal orientation improving layer is added equivalent to a thin film which is 30 nm or less, and subsequently is subjected to heat treatment, the smoothness of that surface can be improved.Type: ApplicationFiled: July 18, 2008Publication date: February 26, 2009Inventors: Naoji Kashima, Shigeo Nagaya, Kunihiro Shima, Shuichi Kubota
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Publication number: 20080299409Abstract: A composite metal article provided in the present invention includes a carbon steel core and a dissimilar composite metal out-layer, said out-layer combined with the carbon steel core by high pressure forging. As the high pressure forging belongs to the precise forging type, which molded by the method of inpour the metal liquid into the cavity on high pressure, thus it can form a thin composite out-layer out of the carbon steel core; it can combined a composite out-layer with the complex structure carbon steel core thus form a complex structure railing and metal table/chair etc.; it can combined complex structure composite out-layer with the simplex structure carbon steel core thus form a complex structure railings and metal table/chair etc.; as there are no air holes on the composite out-layer surface, it has a precise and nice-looking surface and can manufacture products by a simple post-processing.Type: ApplicationFiled: May 30, 2008Publication date: December 4, 2008Inventor: Jiahui HU
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Patent number: 7459219Abstract: An item made of wear resistant material, the item, in certain aspects, made by a method including forming a mass of wear resistant material, the wear resistant material comprising at least one element from the group consisting of arsenic, antimony, cerium and bismuth, wherein the at least one element is present by weight as between 0.01% to 0.0001% of a total weight of the wear resistant material, wherein the wear resistant material includes by weight percent chromium 29.10-30.00%; nickel 5.00-6.00%; titanium 1.00-2.10%; boron 3.00-3.90%; silicon 1.00-2.10%; manganese 1.10-2.00%; iron-balance.Type: GrantFiled: April 1, 2005Date of Patent: December 2, 2008Inventors: Jimmie Brooks Bolton, Billi Marie Rogers
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Publication number: 20080213616Abstract: The present invention relates to a door skin comprising an exterior surface having outer portions lying on a first plane, spaced grooves recessed from the plane of the outer portions, and tonal portions having a planar area and a plurality of spaced depressions recessed from the plane of said planar area. The present invention is also directed to a method of etching a plate, for use with a molded die set, for embossing a wood grain pattern in the door skin, and the etched plate formed therefrom.Type: ApplicationFiled: March 25, 2008Publication date: September 4, 2008Inventors: Karine A. LUETGERT, Mark E. RICHTER, William R. IMMELL, Stephen G. HUHN
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Patent number: 7368175Abstract: A metal band as an inlay for trim strips or sealing strips of flexible material, in particular of rubber or plastic, which is in particular bent to form a shape, having a plurality of slots, in particular periodically sequential slots in the longitudinal direction of the band which are directed inwardly from an edge of the metal band transversely to its longitudinal direction, which are wedge shaped or which run out inwardly in wedge shape, and also having central slots which run out to a tip at their two ends, which are arranged between sequential edge slots in the longitudinal direction and which likewise extend transversely to the longitudinal direction of the metal band, but do not extend up to the edge, wherein at least two sequential central slots in the longitudinal direction of the metal band are arranged between two sequential edge slots to improve the band properties.Type: GrantFiled: June 29, 2005Date of Patent: May 6, 2008Assignee: BFC Buro-und Fahrzeugtechnik GmbH & Co. Prod. KGInventor: Walter Neth
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Patent number: 7364803Abstract: The present invention relates to a low cost technique for manufacturing dual helical gears, such as herringbone gears, from powder metals. The dual helical gears made by this technique are of high density (greater than 92% of theoretical density) and offer superior strength. The present invention more specifically discloses a forged metal herringbone gear which is comprised of a body and a plurality of teeth wherein the metal has a density of greater than 92% of theoretical and wherein the grain in the teeth is one range higher on the ASTM E 112 grain size chart than the grain in the body of the gear. The present invention also discloses a method for manufacturing a high density forged dual helical gear.Type: GrantFiled: June 21, 2005Date of Patent: April 29, 2008Assignee: Keystone Investment CorporationInventor: Gary L. Anderson
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Patent number: 7361411Abstract: Disclosed is a hardfacing alloy capable of withstanding service abrasion of the order of silicious earth particles and weldable on industrial products, such as tool joints and stabilizers used in oil and gas well drilling, and other industrial products. The hardfacing alloy has a low coefficient of friction resulting from excellent metal to metal resistance and significant reduction in industrial wear on industrial products, such as casing wear. Other embodiments of the invention include tool joints having the hardbanding alloy welded to the outer cylindrical surface to its box and pin members and to stabilizer ribs on the stabilizer used in earth boring, such as boring for oil and gas, other industrial products, and methods of applying the hardfacing alloy to their surfaces.Type: GrantFiled: April 21, 2003Date of Patent: April 22, 2008Assignee: ATT Technology, Ltd.Inventors: Roger Auguste Daemen, Keith E. Moline
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Patent number: 7261950Abstract: Electrically conductive films comprising a flexible support, an extensible metal or metal alloy layer, and a crosslinked polymeric protective layer have at least one permanently deformed curved region. The films can be light transmissive and can have regions of compound curvature, and the metal or metal alloy layer can be substantially continuous. The films have reduced susceptibility to fracture or corrosion compared to commercially available electromagnetic interference (EMI) shielding films.Type: GrantFiled: August 15, 2003Date of Patent: August 28, 2007Assignee: 3M Innovative Properties CompanyInventors: Robert J. Fleming, Peter D. Condo, Edward J. Anderson, Clark I. Bright
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Patent number: 7244511Abstract: A single-side embossed color steel sheet, and a method for manufacturing the same are disclosed. The steel sheet comprises a steel sheet substrate, a zinc or zinc alloy-plated layer, a non-chromate or chromate pretreated layer, a primary coat paint layer of modified epoxy or modified polyester, a color base paint layer, a printed layer, and a top coat clear paint layer. The printed layer exhibits a feeling of solidity with various feelings of texture and colors. The top coat clear paint layer serves to protect the printed layer from contaminants. The color steel sheet exhibits a remarkably enhanced feeling of solidity at an irregular surface thereof, and has enhanced contaminant resistance properties and environmental friendliness, thereby satisfying requirements for aesthetic design and functionality of products.Type: GrantFiled: January 4, 2006Date of Patent: July 17, 2007Assignee: Union Steel Manufacturing Co., Ltd.Inventors: Jang Hyun Choi, Sung Su Jun, Sang Hoon Park, Won Young Lee, Byung Hak Lee
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Patent number: 7132173Abstract: Braze and electrode wire assemblies, e.g., used with an implantable microstimulator, include a wire welded in the through-hole of an electrode, which electrode is brazed to a ceramic case that is brazed to a metal ring that is welded to a metal can. The braze joints are step or similar joints that self-center the case, provide lateral support during braze assembly, and provide increased surface area that prevents braze material from exuding from the joints. The end of the ceramic case that is brazed to the metal ring need not be specially machined. The shell has a reference electrode on one end and an active electrode on the other, and is externally coated on selected areas with conductive and non-conductive materials.Type: GrantFiled: June 27, 2003Date of Patent: November 7, 2006Assignee: Advanced Bionics CorporationInventor: Jay Daulton
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Patent number: 7078108Abstract: Very high strength single phase stainless steel coating has been prepared by magnetron sputtering onto a substrate. The coating has a unique microstructure of nanometer spaced twins that are parallel to each other and to the substrate surface. For cases where the coating and substrate do not bind strongly, the coating can be peeled off to provide foil.Type: GrantFiled: July 14, 2004Date of Patent: July 18, 2006Assignee: The Regents of the University of CaliforniaInventors: Xinghang Zhang, Amit Misra, Michael A. Nastasi, Richard G. Hoagland
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Patent number: 7078109Abstract: The thermal interface structure of the present invention is suited for use in a non-referenced die system between a heat source and heat sink spaced up to 300 mils apart and comprises a plurality of layers including a core body of high conductivity metal or metal alloy having opposite sides, a soft thermal interface layer disposed on one side of the core body for mounting against the heat sink and a thin layer of a phase change material disposed on the opposite side of the core body for mounting against the heat source wherein the surface area dimension (footprint) of the core body is substantially larger than the surface area of the heat source upon which the phase change material is mounted to minimize the thermal resistance between the heat source and the heat sink and wherein said soft thermal interface layer is of a thickness sufficient to accommodate a variable spacing between the heat source and the heat sink of up to 300 mils.Type: GrantFiled: July 7, 2004Date of Patent: July 18, 2006Assignee: Thermagon Inc.Inventors: Richard Hill, Jason Strader, James Latham
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Patent number: 7067200Abstract: A joined body and method of producing the joined body are provided. A first member containing at least a ceramic and a second member containing at least one of a metal and a metal composite are joined with each other via a metal adhesive. The metal adhesive contains at least indium and at least one material containing at least a component capable of reducing the melting point of indium and is provided between the first and second members to provide a laminate. The laminate is heated at a temperature in a solid-liquid coexisting range of an alloy comprising indium and the indium melting point reducing component to join the first and second members.Type: GrantFiled: July 18, 2003Date of Patent: June 27, 2006Assignee: NGK Insulators, Ltd.Inventors: Tomoyuki Fujii, Hideyoshi Tsuruta, Tetsuya Kawajiri
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Patent number: 7067198Abstract: Disclosed is a method for processing a three-dimensional structure having a fine three-dimensional shape and a smooth surface is disclosed in which the three-dimensional structure is usable for an optical device. The process method comprises the steps of depositing a thin layer for absorption of laser light on a flat substrate; depositing a transparent layer on the thin layer for absorption of laser light; and irradiating a process laser light, passing through the transparent layer; in which pulse injection energy of the process laser light is set to be the same as or smaller than the maximum pulse injection energy capable of exposing a surface of the thin layer in front in the incident direction of the process laser light, and to be set the same as or greater than the minimum pulse injection energy capable of removing the transparent layer in rear in the incident direction of the process laser light.Type: GrantFiled: December 30, 2003Date of Patent: June 27, 2006Assignees: Ricoh Company, Ltd., RIKENInventors: Yasufumi Yamada, Katsumi Midorikawa, Hiroshi Kumagai
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Patent number: 7037594Abstract: There is provided an electromagnetic wave shielding member which has see-through properties and electromagnetic wave shielding properties, is free from a change in color of an adhesive at the time of the formation of a mesh by etching, is improved in etchability, and can withstand etching at the time of the formation of the mesh. The electromagnetic wave shielding member according to the present invention comprises: a transparent film substrate; and a mesh consisting of a metal foil provided on the surface of the substrate through an adhesive, the adhesive comprising a styrene-maleic acid copolymer-modified polyesterpolyurethane and an aliphatic polyisocyanate.Type: GrantFiled: July 9, 2002Date of Patent: May 2, 2006Assignee: Dai Nippon Printing Co., Ltd.Inventors: Hiroshi Kojima, Fumihiro Arakawa
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Patent number: 7026056Abstract: A structure for encapsulating and protecting fiber insulation material as well as other materials in multicompartment devices in order to provide unitized material which can be applied to any surface desired for insulation or other purposes. A first sheet of material is formed with pockets or depressions in the sheet which are adapted for receiving the material desired to be unitized and a second sheet placed over the first sheet, and the two sheets are attached together in the areas between the pockets or depressions thus encapsulating the material in the pockets. The material is unitized by placing the material in individual sealed metal foil containers or compartments, then the individual containers of unitized material are attached in matrix form to a continuous sheet, such as positioning the containers in openings in the continuous sheet. The product can be applied to any surface desired for insulation or other purposes. Preferably a multilayer metal foil material is employed in the structures.Type: GrantFiled: October 13, 2004Date of Patent: April 11, 2006Assignee: ATD CorporationInventor: G. William Ragland
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Patent number: 7022416Abstract: The present invention provides a film-coated article coated by a film having silicon oxide as a main component, in which recesses and projections conferring super hydrophobicity or super hydrophilicity are formed. This film includes minute projections and columnar projections, and the columnar projections are formed by local growth of the minute projections in a thickness direction of the film or formed with a plurality of minute particles constituting the minute projections laminated locally.Type: GrantFiled: November 8, 2002Date of Patent: April 4, 2006Assignee: Nippon Sheet Glass Company, LimitedInventor: Toyoyuki Teranishi
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Patent number: 6902826Abstract: A film structure and deposition method for creating laminated Fe—M—N and Fe—M—O—N films which retain good anisotropy after HA annealing are provided. Interleaved layers of thin alumina laminations between the Fe—M—[O]—N layers and sublayer alumina nanolaminations within the Fe—M—[O]—N layers create stable magnetic anisotropy in the film. The magnetic anisotropy in the film survives HA annealing at hardbake resist curing conditions in wafer manufacturing processes for GMR magnetic recording heads.Type: GrantFiled: August 18, 2000Date of Patent: June 7, 2005Assignee: International Business Machines CorporationInventor: John David Westwood
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Patent number: 6858287Abstract: The invention is a formable, bright metallized laminate that has superior optical and deformation properties. The metallized laminate is made from a plurality of discontinuous metal island layers deposited on a formable clear coat film. The invention is also a method that includes depositing a first discontinuous layer of metal islands upon a formable clear coat film and then depositing a second discontinuous layer of metal islands onto the first discontinuous layer of metal islands.Type: GrantFiled: August 10, 2001Date of Patent: February 22, 2005Assignee: Soliant LLCInventor: Thomas R. Fields
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Patent number: 6787247Abstract: Heat dissipation devices and molding processes for fabricating such devices, which have at least two regions comprising different conductive materials such that efficient thermal contact is made between the different conductive materials. The molding processes include injection molding at least two differing conductive materials.Type: GrantFiled: March 14, 2003Date of Patent: September 7, 2004Assignee: Intel CorporationInventor: Joseph A. Benefield