Abstract: The bonding material for an electronic component comprises a metal material and fine resin particles dispersed in the metal material. Such a material may form an electrical “bump” for the component.

Abstract: In a case where a welding of a member is performed through a friction stir welding, to restrain the generation of a clearance in a portion to be joined by the welding and to provide a joint having a good joining portion, abutting faces of members are formed with slanting surfaces. A friction stir welding is carried out from an upper portion. The welding is carried out with the slanting surfaces resisting the forces produced in forming the welding bead. Since the slanting on surfaces are provided, a flow-out of the material in the welding bead can be restrained, and further a bending of the joining portion can be restrained. Further, a tab is arranged at a beginning end and a finish end of the welding and then the welding is carried out starting at one tab and ending at the other tab.

Abstract: A metal-based composite material is formed by impregnating a matrix metal of Al or Al alloy into ores of a porous preform of a hydrogenatable metal having a metal hydride in at least a part of its surface.

Abstract: The present invention is directed to the application of a liner material which is corrosion resistant to a strong and tough core aluminum alloy which has been grooved out creating a liner bed resulting in an Alclad structure.

Abstract: A high strength dispersion strengthened aluminum alloy comprising an aluminum solid solution matrix strengthened by a dispersion of particles based on the compound Al3X, where Al3X has an L12 structure, is described. Various alloying elements are employed to modify the lattice parameter of the matrix and/or the particles so that the matrix and particles have similar lattice parameters. The alloy is produced by rapid solidification from the melt.

Abstract: A metal matrix composite casting comprises a metal matrix composite and a processed member inserted in the metal matrix composite by enveloped casting. By the processed member which is easier to process than the metal matrix composite, a processed portion of a predetermined shape can be formed in the metal matrix composite. That is, by a simple processing such that the processed member is removed from the metal matrix composite or the processed portion is formed in the processed member itself, the processed portion having a desired shape can be easily formed in the metal matrix composite.

Abstract: A method of manufacturing a metallic fiber in which from a convergent extended wire, which is formed by a metallic fiber and a matrix member which is formed of a metallic material and whose dissolvability is higher than the dissolvability of the metallic fiber, the matrix member is continuously dissolved and removed by an electrolytic processing in a plurality of electrolytic tanks which are arranged in the conveying direction of the convergent extended wire, wherein: the convergent extended wire is passed through electrolytes in the plurality of electrolytic tanks, which are arranged in the shape of a gentle convex arch at the vertical direction upper side which includes the conveying passage of the convergent extended wire, the convergent extended wire is passed above a plurality of feeding devices which are provided at the outer sides of the electrolytes and which are disposed in the same arch-shape so as to correspond to the electrolytic tanks, in each of the plurality of electrolytic tanks, the metallic

Abstract: A laminated structural panel is formed of top, bottom, and one or more intermediate layers of material having low strength at high temperature and with perforated high temperature, high strength materials interleaved between the top, bottom and intermediate layers. Brazing material is clad on the top and bottom layers and the intermediate layer or layers may be entirely of brazing material or clad on both sizes with brazing material, such that when the assembled stack is subjected to high temperature in a high vacuum environment brazing material is caused to melt and fill the perforations in the high strength material. A particular application is for structural panels, used as shelves in manufacturing electronic chips or displays where aluminum is advantageous because it does not outgas or release particles under the high temperature, high vacuum environment used to make the product. Aluminum, however, does not maintain its strength and stiffness at the high temperatures involved.

Abstract: An explosive laminated cutting tool which provides a self sharpening edge. The improved cutting tool s preferably comprised of two softer metals adhered to a hard central layer forming the cutting edge, with the central layer being made of such a material as tungsten carbide. The central laminate layer is preferably perforated to allow the outer layers to fuse through the perforations to adhere to one another, thus creating a strongly bonded laminated cutting structure which may be self sharpening. A method for manufacturing the cutting tool is also described. Another embodiment comprises a laminate wherein one of the layers has a plurality of recesses in the surface facing another layer. The recesses are filled with particles such as tungsten carbide or diamond. When the layers are explosively welded together, the particles are fused in the weld area.

Abstract: Aligned Optoelectronic assembly with improved dimensional stability is disclosed. The assembly is carried out with a bonding material, either a solder or an adhesive, which contain insoluble, non-coarsening dispersoid particles. New solder compositions having enhanced mechanical properties are described. Relatively inert particles having a diameter of 5000 nm or less are dispersed in a solder material having an average grain size of approximately 10,000 nm or less to produce such solder compositions. The dispersed particles act as physical barriers in solders substantially impeding the motion of grain boundaries and inhibiting grain growth during thermal and stress cycling which substantially inhibits coarsening. As a consequence, the optoelectronic device assembly according to the invention exhibit substantially improved dimensional stability, with the rate of creep deformation at the joint reduced by a factor of at least two.

Abstract: A test coupon is formed from a metallic strip having opposite first and second sides that generally define a plane of the strip and the strip includes a laser shock peened patch of the strip that has first and second laser shock peened surfaces on the first and second sides, respectively, first and second laser shocked regions having deep compressive residual stresses imparted by the laser shock peening extending into the strip from the first and second laser shock peened surfaces, respectively, and a deflection of a portion of the strip from a position of the portion before the laser shock peening. The deflection is formed by the laser shock peening such that at least a part and preferably substantially all of the deflection lies in the plane and the test coupon preferably includes an indicating means to indicate the deflection.

Abstract: For forming a preform of composite material, such as aluminum-based composite material (MMC) by using friction during the forming thereof, ceramic reinforcement, such as Al2O3 and binder are prepared, and the prepared reinforcement and the silanor group binder are put into a die for press forming. During the forming, polycondensation occurs due to frictional heat generated between the fibrous or grain-like particles of the reinforcement and the silanor group binder to harden it, thereby obtaining a preform in which the particles of the reinforcement are fixedly connected to one another.

Abstract: The present invention provides a joining, brazing or soldering material wherein solderability is effectively improved without using a flux, and a production method thereof. In production of a joining material, a halogen compound is mixed, a film is formed on the surface of a solder molding or the surface of a solder molding is halogenated. In production of a joining material, a halogen compound is added to a solder melt, a film of a halogen compound is formed on the surface of a processed joining material, or the surface layer of the processed joining material is converted to a halogen compound layer by halogenation. Film formation or surface treatment may be carried out either a dry or wet method.

Abstract: An impeller shoe (110) having a front side (112) with a series of half column members (114) and raised upper and lower rims (116, 118) that form the impact surface of the impeller shoe. Half columns (114) and raised rims (116, 118) are formed with carbide material (120) formed therein in order to improve wear resistance at these critical surfaces.

Abstract: A method is provided for producing a preform structure which is used in a composite aluminium or aluminium alloy component in which a base metal of an aluminium or aluminium alloy is reinforced with reinforcing materials. A slurry is prepared by mixing reinforcing materials including ceramic particles and first whiskers with burning-away powders and liquid. Liquid components contained in the slurry are filtered to provide a dehydrated structure. Thereafter a preform structure is produced by sintering the ceramic particles with the first whiskers after burning the burning-away powders in the dehydrated structure.

Abstract: A composite panel is formed by bonding together at least two overlying sheets of metal. The method comprises performing a first corrugating operation on each of said sheets, and positioning said sheets in overlying relationship with the corrugations of each sheet extending in a common first direction and the corrugations of each sheet nested into those of the other sheet. The method also comprises performing a second corrugating operation arranged to produce corrugations which extend in a second direction which is inclined at an angle of at least 10.degree. to said first direction. Each sheet is formed into parallel upstanding ridges separated by troughs. The troughs in each sheet are received within the ridges of the other sheet. The troughs have reentrant side walls and the ridges vary in width along their length.

Abstract: Provided are a heat spreader that can reduce an increase in the thermal expansion coefficient up to high temperatures of not lower than 500.degree. C. and has an excellent thermal expansion property and an adequate heat-conductive property and a method of making the same. This heat spreader comprises high-thermal-conductivity layers made of a Cu-base metal, low-thermal-expansion layers made of an Fe--Ni-base alloy each of which layers is provided with a plurality of through holes, and thermal expansion-restraining layers of a metal with a thermal expansion coefficient .alpha. at 30-800.degree. C. of not more than 7.5.times.10.sup.-6 /.degree. C.

Abstract: An electromechanical assembly, having a pressed joint with a low thermal resistance which is residue free when disassembled, includes: 1) an integrated circuit module having a contact surface of a first material; 2) a temperature regulating unit having a contact surface of a second material which faces the contact surface of the first material and which is separated therefrom by a gap; and, 3) a film of a metal alloy, which substantially fills the gap, and which is limited to an alloy that adheres in a solid state to the second material but not the first material. Preferred alloys for filling the gap include combinations of two or more metals which are selected from the group of lead, tin, bismuth, cadmium, indium, and antimony. Preferred first materials for the contact surface on the integrated circuit module to which the alloy does not adhere include silicon dioxide, aluminum nitrite, silicon and ceramic.

Abstract: The invention relates to a method for manufacturing a micromachined structure to be at least partly released from a substrate surface. A surface contact area, over which structure and the said substrate surface are in surface contact with each other during the manufacturing step, is divided into at least a first and a second contact zone, the adhesiveness between the structure and the substrate being greater in the first contact zone than in the second contact zone. As a manufacturing step, or as a step subsequent to the manufacturing, the structure can be released from the substrate surface at least over said second contact zone. The completed structure may also be completely loose from the substrate. The invention is also directed to a micromachined structure manufactured according to the method.

Abstract: A metallic porous product is produced by applying a slurry of a mixture of skeleton constituent metal particles and property modifying particles to an inflammable porous foam, burning the inflammable porous foam having open pores by heat to provide a metallic skeleton structure, and sintering the metallic skeleton structure.

Abstract: A metal-matrix composite material includes a matrix having magnesium in an amount of more than about 0.3 weight percent but no more than about 2.5 weight percent, an alloying element of about 0.8 to about 2.5 weight percent iron or from about 1.0 to about 2.5 weight percent manganese, and the balance aluminum and impurities. Dispersed throughout the matrix is a plurality of metal oxide particles present in an amount of more than about 5 volume percent but no more than about 25 volume percent of the total volume of the matrix and the particles. This material may be cast into casting molds. After casting is complete and during solidification of the matrix alloy, a high volume fraction of intermetallic particles is crystallized in the matrix alloy. The total of the volume fractions of the metal oxide particles and the intermetallic particles is from about 10 to about 40 volume percent, preferably from about 25 to about 40 volume percent.

Abstract: A highly wear-resistant aluminum-based composite alloy has improved wear resistant itself and the wear amount of the opposed Fe-based material is decreased as compared with the conventional wear-resistant aluminum alloys. The inventive composite alloy has a structure that at least either a dispersing phase selected from the group consisting of hard fine particles or a solid-lubricant particles having average diameter of 10 um or less is dispersed in an aluminum-alloy matrix which contains quasi-crystals.

Abstract: An electronic structure includes an electronic device, and a heat sink assembly in thermal contact with the electronic device. The heat sink assembly is formed of a piece of pyrolytic graphite embedded within a metallic casing and intimately contacting an interior wall of the metallic casing. The heat sink assembly is substantially fully dense. The heat sink assembly is fabricated by assembling the piece of pyrolytic graphite within the disassembled elements of the metallic casing, and then simultaneously heating and pressing the initial assembly until it is substantially fully dense.

Abstract: The cladding material 10 comprises a metal substrate 1, an expanded metal mesh 3 placed on the metal substrate 1 and a corrosion resistant metal lining 4 is placed in contact with the metal mesh 3 in opposition to the metal substrate 1 with the metal mesh 3 inbetween. A metal mesh layer placed on said metal substrate 1 may comprise an expanded metal whose openings are formed by making staggered cuts in a metal plate over the whole part thereof so that each cut passes through the thickness of said metal plate, and expanding said metal plate in a direction intersecting the length of said cuts thereby opening each cut.

Abstract: A formed part having a multiple-plate structure of zonal design includes a base plate and a plurality of reinforcing plates fastened to the base plate. The multiple-plate structure is configured so that its strength is largely adapted to the load profile to be applied to the formed part and so that its cost of production is reduced. To this end, the thicknesses of the reinforcing plates vary as a function of the load structure to be applied to the formed part and the reinforcing plates engage each other in a positive locking manner so that the abutting edges are provided essentially with regularly arranged projections which are in mutual engagement.

Abstract: Metal wiring structures for integrated circuits include a seed layer formed on an integrated circuit substrate and a wetting layer formed on the seed layer opposite the integrated circuit substrate. A metal wiring layer is formed on the wetting layer opposite the seed layer. The seed layer and the metal wiring layer have the same crystal orientation. In a preferred embodiment, the seed layer is an aluminum layer having (111) crystal orientation and the metal wiring layer includes aluminum having (111) crystal orientation. The metal wiring layer may be aluminum or an aluminum alloy. The wetting layer preferably includes titanium.

Abstract: There is disclosed a composite material for an electronic part which has high thermal conductivity in a laminated direction, and also has low-thermal expansion characteristics. The composite material, used for a heat sink or a heat spreader, includes high-thermal conductivity layers of copper or a copper alloy and low-thermal expansion layers of a Fe--Ni alloy which are alternatively laminated to form a multi-layer structure having not less than 10 layers and preferably not less than 50 layers. Any two adjacent ones of the high-thermal conductivity layers, having the low-thermal expansion layer interposed therebetween, are continuous with each other through a plurality of through holes formed through the low-thermal expansion layer.

Abstract: A method for producing a metal matrix (32) which binds inclusions (12,15) in a stable structure (31) so that the surface areas of two opposing sides of each inclusion (12,15) are visible, thus enabling translucency. This method comprises the steps of securing inclusions (12,15) to a temporary backing (38) so that there are intervals (14) between the inclusions (12,15), depositing a metal fiber substrate (42) into the intervals (14) between the inclusions (12,15), and then melting a metal infiltrate (46) so that the infiltrate (46) coats the individual fibers and fills the spaces between the fibers. Upon cooling, the amalgam (48) of substrate (42) and infiltrate (46) thus formed constitutes the matrix (32) and border (34) of the structure (31). The inclusions (12,15) may be glass, marble, clay, metal, or other materials; the metal fiber substrate (42) is preferably fine bronze fiber and the infiltrate (46) is preferably conventional solder.

Abstract: A novel product composed of a ceramic phase particle dispersoid in metal, including uniformly distributed, finely sized carbide phase particles formed in situ in a molten metal and a novel method for producing such a ceramic phase particle dispersoid in metal are disclosed. A salt-based liquid state reaction involving a liquid metal/alloy containing a liquid Ti, B, Si, Sc, Hf, Nb, Ta, Zr, Mo, Al (when the molten metal matrix is not aluminum), or V and a halide salt containing carbon particles forms a uniform distribution of finely sized ceramic phase particles formed and dispersed in-situ in the metal matrix. The ceramic dispersoid in metal product of the present invention includes at least about 50 volume percent of a matrix metal of aluminum; and up to about 50 volume percent of a uniform distribution of finely sized ceramic phase particles formed and dispersed in-situ in the aluminum metal matrix, wherein the finely sized ceramic phase particles have an average particle diameter of less than about 2.

Abstract: An Al-base alloy prepared by hot-working a mixture of an Al alloy powder and dan Ni powder to join the powders and having a structure wherein Ni--Al intermetallic compounds are dispersed. The powder mixture can be hot-worked in the solid-phase temperature range, liquid phase temperature range or solid-liquid phase mixture temperature range of the Al alloy. A dispersion strengthening powder can be further admixed with the mixture of Al alloy powder and Ni powder.

Abstract: Shape-memory fibers are incorporated into a metal matrix material with a level of fiber-to-matrix bonding so that upon localized failure of matrix under load, the strains in fibers debond them from the matrix to the extent that fibers do not all rupture at the location of matrix failure. The pull-out process of fibers ruptured away from the matrix failure location provides the composite material with substantially increased ductility and energy absorption capacity after localized failure of the matrix. Pre-tensioning of shape-memory fibers impose sustained stresses on matrix which enhance the strength and energy absorption capacity of the composite material. The shape-memory fibers may be incorporated into a metal matrix at their end so that fibers pull out from the matrix under load and provide an energy-absorbing assembly.

Abstract: A composite penetrator has a plurality of dispersed high aspect ratio bodies of refractory heavy metal such as tungsten wires. A matrix of metal surrounds and wets the dispersed bodies for forming an integral penetrator. The matrix metal is characterized by having localized shear band deformation when strained. The heavy metal is selected from the group consisting of tungsten, tantalum, hafnium, uranium and alloys thereof. A variety of matrix alloys may be used which will remain amorphous or microcrystalline in an object as large as the penetrator when cooled from the molten state. An exemplary amorphous alloy comprises 41.25 atomic percent zirconium, 41.25% titanium, 13.75% copper, 12.5% nickel and 22.5% beryllium.

Abstract: A method of fabricating a metal matrix composite containing electrically isolated areas and the MMC formed from the method. The method comprises: (a) providing a liquid pool of unreinforced aluminum alloy; (b) infiltrating the unreinforced aluminum alloy into a stack comprising upper and lower porous preforms and an electrical insulator material placed between the preforms; (c) solidifying the liquid-phase metal to form a metal matrix composite product that completely surrounds the stack; and (d) forming at least one groove in the solidified metal, the groove extending downward to the insulating substrate so as to electrically isolate at least one region on the surface of the metal matrix composite.

Abstract: A first pattern of bumps and a second pattern of bumps are formed on a substrate (10) with bumps (14,15). During a transfer process, only the bumps (14) of the first pattern of bumps are transferred to pad extensions (20) of a device (17). The bumps (15) of the second pattern of bumps are not affected by this process and can be later transferred to a second device.

Abstract: A method for manufacturing an elongated member from a superconducting ceramic material comprising the steps of providing a hollow supporting body of metal or a metallic compound having a hollow inside section therein, introducing a superconducting ceramic material into the hollow inside section of the hollow supporting body, drying the above liquid, so that the superconducting ceramic material is coated on the inside of the supporting body; and firing the supporting body and the ceramic material in an oxidizing atmosphere.

Abstract: A wear resistant metal composite which comprises formed porous fly ash obtained by forming fly ash into the desired shape and a metal impregnated into voids present in the interior of said formed fly ash, wherein the percentage by volume of said formed fly ash is 30% by volume or less, and wherein said fly ash is exposed on the surface of said wear resistant metal composite.

Abstract: A composite substrate on which a heat-generating semiconductor device is to be mounted, comprising a composite layer which includes a matrix made of a metal having a high thermal conductivity and a fibrous or particulate dispersion material having low thermal expansion properties present in the matrix, and a metal layer provided onto one main surface of the composite layer, wherein either one of a heat-generating semiconductor device or a substrate with low thermal expansion properties having a heat-generating semiconductor device provided thereon, is mounted on the other main surface of the composite layer.

Abstract: A method of making a casting reinforced with a reinforcement insert, such as a fiber reinforced metal matrix composite insert or intermetallic insert therein, wherein a preformed fiber reinforced metal matrix composite reinforcement insert is clad or covered with a material that is effective to avoid the aforementioned adverse reactions between the insert/melt and any exposed insert fibers/matrix, the clad insert is suspended in the mold cavity, a melt is introduced into the mold cavity about the clad insert, and the melt is solidified about the clad insert to provide a casting of the solidified melt having the clad insert disposed therein to reinforce the casting.

Abstract: A multilayer material is described, whose overlay exhibits improved hardness and improved wear-resistance. The multilayer material includes an overlay, which contains 8-18.5 wt. % tin and 2-16 wt. % copper, the balance being lead, wherein the tin is present as a finely crystalline deposit completely homogeneously distributed in the lead. A process for producing sliding elements in which the overlay of lead-tin-copper is applied to the prefabricated semi-finished product by electroplating provides that a ternary, fluoroborate-free electroplating bath is used without brighteners and with the addition of fatty acid polyglycol ester and a grain refining agent including a carboxylic acid.

Abstract: Thin automobile components, such as a transmission case made of an aluminum alloy, are provided which are less likely to create vibration-derived noise. An aluminum alloy member, with an insert provided therein, possessing improved damping capacity, comprising: an austempered graphite cast iron member inserted into an aluminum alloy with the thickness of a section constituting a product being not more than 6 mm. A process for producing an aluminum alloy member, with an insert provided therein, wherein cooling is performed so as for the temperature of a graphite cast iron material to reach 400.degree. C. or below within 10 sec after pouring of an aluminum alloy. The graphite cast iron material comprises by weight 2.5 to 4.0% of carbon, 2.0 to 3.5% of silicon, 0.1 to 0.8% of manganese, and at least one member selected from the group consisting of 0.1 to 2.0% of copper, 0.1 to 2.0% of nickel, and 0.05 to 0.5% of molybdenum with the balance consisting of iron and unavoidable impurities.

Abstract: A process for making composite materials, namely reinforced Al-metal matrix composites based on either: (I) Al-W intermetallic phase and Al.sub.2 O.sub.3 ceramic whiskers, or (II) Al-Mo intermetallic phase and Al.sub.2 O.sub.3 ceramic whiskers. This process involves the oxidation of aluminum using tungsten oxide in powder form for product I, and that of aluminum and molybdenum oxide in powder form for product II. Product I contains an Al-W intermetallic phase, some sapphire whiskers, and a continuous Al-metal matrix. Product II contains an Al-Mo intermetallic phase, sapphire whiskers, and a continuous Al-metal matrix. The alumina whiskers are formed as a result of two reactions. They are: (i) the oxidation between the pre-mixed Al and the oxide, and (ii) the oxidation of Al with the atmospheric environment in the presence of the oxide, which acts as a catalytic agent for the reaction. These newly invented products are hard, strong and light.

Abstract: An Ag--Cu alloy for a sliding contact containing:a) 0.1 to 8.0 wt. % of Cu, based on the weight of the alloy, wherein at least 70 wt. % of the Cu contained in the alloy is solid-solubilized in an Ag-.alpha.-phase; andb) 0.1 to 4.0 wt. %, based on the weight of the alloy, of at least one metal selected from the group consisting of Ge, Ni, Sn, In, Zn, Mg, Mn, Sb, Pb and Bi.The Ag--Cu alloy is desirably utilized to form a composite with a Cu or Cu alloy base material. Such composite has been found to be very useful for fabricating the commutator of a compact DC motor.

Abstract: A Zn or part-Zn plated steel sheet has an MgO coating free of metallic Mg thereon which increases corrosion resistance and plating adherence. The MgO coating is formed by coating according to the sol-gel method or by dipping or treating by cathodic electrolysis a Zn or part-Zn plated steel sheet in a molten salt bath mainly containing a magnesium salt.

Abstract: A carbon-graphite/silicon carbide composite article is provided. The composite article includes a carbon-graphite body intimately bonded to a dense silicon carbide body by a transition/bonding region which links the two bodies. The transition/bonding region between the carbon-graphite body and the silicon carbide body typically includes a layer rich in silicon metal and a small silicon carbide/silicon metal/carbon graphite area where some of the carbon-graphite from the carbon-graphite body has been converted to silicon carbide. The carbon-graphite body may also include a variety of impregnants.

Abstract: A composite material made of continuous aluminum oxide fibers reinforcing an aluminum matrix to form a strand where the strands are formed into a structure and brazed together in a vacuum using an aluminum brazing alloy. The brazing alloy is preferably an aluminum silicon alloy.In winding filament wound vessels, an electric current may be used to heat the strands to cause a coating of the aluminum brazing alloy to melt.

Abstract: A method and apparatus are provided for forming an elongated solder joint between two soldered substrates of an electronic module or an electronic module in the process of being fabricated by using expandable solder bump means disposed between the substrates. The expandable solder bumps means comprise solder having a higher reflow temperature than the solder used to join the substrates and expansion means such as a compressed spring encased within the solder and are activated (expanded) by reflowing at a higher temperature than the melting point temperature of the solder joints.

Abstract: A method for controlling the interface in a titanium matrix composite between the titanium matrix material and a silicon carbide reinforcing filament or fiber which comprises treating such filament or fiber with a phosphorus-containing compound, and thereafter incorporating the treated fiber into a titanium matrix composite. The quantity of phosphorus remaining on the fiber, following treatment, can be miniscule, so long as at least a trace amount of phosphorus remains on the fiber.

Abstract: A conductor (112), a method for forming the conductor (112), and a method for attaching a discrete circuit device, such as a bond pad, chip capacitor, chip resistor, etc., to the conductor (112) with solder connections (16). Solder connections (16) formed by the method are characterized as being accurately located on the conductor (112) and having a shape and location that achieves an adequate and uniform stand-off height for the device, and improves thermal cycle fatigue life. Such benefits are achieved by forming a nonsolderable layer (114) on a substrate (10), and then forming a solderable conductor (112) on the substrate (10) such that a first portion of the conductor (112) overlies the nonsolderable layer (114) and a second portion of the conductor (112) does not overlie the nonsolderable layer (114).

Abstract: A titanium matrix composite laminate (42) includes alternating layers of a titanium matrix foil (12) and a fiber mat (14). The titanium matrix foil (12) is formed from a super alpha titanium alloy having a beta phase stabilizer equivalency of at least thirteen. The beta phase stabilizer is selected from the elements molybdenum, vanadium, niobium, tantalum, halfnium, tungsten or some combination thereof. The fiber mat (14) is formed of silicon carbide (SiC) and has a carbon coating. Once a layup (16) of the alternating layers is formed, it is placed in a mold (22). Heat and pressure are then applied in a step called consolidation (40). The result is a titanium matrix composite laminate (42).

Abstract: The present invention provides a clad steel plate of a base material and a cover material attached to the base material. The base material has holes with rising rims and the rims pass through the covering material and expand over its surface to unite the base and covering materials.