Synthetic Resin Patents (Class 428/626)
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Patent number: 10871190Abstract: A sliding bearing includes a backing layer, a bonding layer with at least one fluorination-treated surface, and a sliding layer. A method for preparing the sliding bearing includes performing a fluorination treatment on a surface of the bonding layer, placing a surface of the bonding layer on a surface of the backing layer, and placing a surface of the sliding layer on a surface of the bonding layer to form a laminated assembly, heating and pressurizing the laminated assembly, and cooling the laminated assembly in a pressurized state.Type: GrantFiled: July 9, 2019Date of Patent: December 22, 2020Assignee: COB Precision Parts Inc.Inventor: Guoqiang Zhang
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Patent number: 10851467Abstract: A steel sheet for containers including a steel sheet, a Sn coated layer that is formed on at least one surface of the steel sheet, and a chemical treatment layer that is formed on the Sn coated layer. A variation amount in a yellowness index measured at one measurement point on the outermost surface of the chemical treatment layer is defined as ?YI, and represented by ?YI=YI?YI0, wherein YI is the yellowness index measured after the steel sheet for containers is subjected to a retort treatment at a temperature of 130° C. for 5 hours, and YI0 is the yellowness index measured before the retort treatment. An average of absolute values of the ?YI obtained at a plurality of measurement points included in a unit area of the outermost surface is 5.0 or less.Type: GrantFiled: June 23, 2015Date of Patent: December 1, 2020Assignee: NIPPON STEEL CORPORATIONInventors: Akira Tachiki, Shigeru Hirano, Yoshiaki Tani, Hirokazu Yokoya, Morio Yanagihara
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Patent number: 10808098Abstract: A nanocomposite material comprises polyethylene terephthalate (PET) as a base polymer and a nanoparticle that increases the strength of the base polymer.Type: GrantFiled: September 6, 2018Date of Patent: October 20, 2020Assignee: THE BOARD OF REGENTS FOR OKLAHOMA STATE UNIVERSITYInventor: Jay Clarke Hanan
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Patent number: 10767268Abstract: The present application relates to a method for enhancing metal corrosion resistance of a metal deposited on a substrate, the method comprises contacting the metal coated substrate with a treating composition comprising a film forming organic component which treating composition forms a hydrophobic film on the metal coated substrate with a thickness of less than 1 ?m. Furthermore, the present application relates to a method for making a mirror comprising a substrate having a metal coated thereon, the method comprises contacting the metal coated substrate with a treating composition comprising a film forming organic component which treating composition forms a hydrophobic film on the metal coated substrate with a thickness of less than 1 ?m. Preferably, the film forming organic component is selected from the group consisting of an aromatic triazole compound and a silicone resin. In addition the present application relates to the products obtainable by these methods.Type: GrantFiled: March 29, 2006Date of Patent: September 8, 2020Assignee: SWIMC LLCInventor: Harry J. Bahls
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Patent number: 10662290Abstract: This invention relates to a polyamide-imide precursor, a polyamide-imide obtained by imidizing the same, a polyamide-imide film, and an image display device including the film. The polyamide-imide precursor includes, in a molecular structure thereof, a first block, obtained by copolymerizing monomers including dianhydride and diamine, and a second block, obtained by copolymerizing monomers including an aromatic dicarbonyl compound and aromatic diamine. The dianhydride includes biphenyltetracarboxylic acid dianhydride (BPDA) and 2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), and the diamine includes bistrifluoromethylbenzidine (TFDB).Type: GrantFiled: December 30, 2015Date of Patent: May 26, 2020Assignee: KOLON INDUSTRIES, INC.Inventors: Jae Il Kim, Hak Gee Jung
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Patent number: 10577710Abstract: A method for forming an adhesion promoting layer and a corrosion resistant layer over the surfaces of a body-in-white (“BIW”) structure is provided. The method includes immersing the BIW structure in a pre-activating bath to pre-activate the surfaces of the BIW structure. The surfaces of the BIW structure comprise at least an aluminum alloy surface, at least a surface comprising ferrous metal, zinc, or TiZr, and the surfaces are substantially free of magnesium alloys. An adhesion promoting layer comprising cerium and a corrosion resistant layer comprising polymers are subsequently deposited over the pre-activated surfaces of the BIW structure by immersing the BIW structure in an aqueous bath comprising a source of cerium cations and a polymer precursor.Type: GrantFiled: November 6, 2017Date of Patent: March 3, 2020Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLCInventors: Surender Maddela, Blair E. Carlson
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Patent number: 10563028Abstract: A method of manufacturing a film or membrane includes: (a) dissolving at least one polymer comprising a poly(aryl ketone) in at least one solvent to form a dope; (b) depositing the dope on a substrate to form a coated substrate at appropriate conditions; and (c) drying the coated substrate to form the film or membrane. The dope may also include additional polymers or fillers, such as carbon nanotubes.Type: GrantFiled: August 30, 2018Date of Patent: February 18, 2020Assignee: Arkema Inc.Inventors: Christophe Roger, Manuel A. Garcia-Leiner, Jean-Alex Laffitte, Julie Boyer, Stephan Moyses, Lawrence H. Judovits
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Patent number: 10349527Abstract: The present invention relates to a composition for forming a conductive pattern, which is able to form a fine conductive pattern onto a variety of polymer resin products or resin layers by a very simple process, a method for forming the conductive pattern using the same, and a resin structure having the conductive pattern.Type: GrantFiled: April 17, 2014Date of Patent: July 9, 2019Assignee: LG CHEM, LTD.Inventors: Chee-Sung Park, Han Nah Jeong, Sang Yun Jung, Cheol-Hee Park, Chan Yeup Chung, Jae Hyun Kim, Shin Hee Jun
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Patent number: 10312721Abstract: Systems, devices, and methods are disclosed for unlocking a vehicle. An example vehicle includes a power system, a remote unlock system controlled by a remote unlocking device, and a door applique. The door applique comprises a wireless charger coupled to the power system, configured to charge the remote unlocking device, and a ridge configured to engage the remote unlocking device, wherein the wireless charger is configured to charge the remote unlocking device for a limited time.Type: GrantFiled: June 6, 2017Date of Patent: June 4, 2019Assignee: Ford Global Technologies, LLCInventors: David Joseph Orris, Nunzio DeCia, Stephen Jay Orris, David A. Herman, Howard Paul Tsvi Linden, Nicholas Alexander Scheufler
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Patent number: 10301813Abstract: A prefabricated building module constructed at a central location and delivered to a construction site via shipping using the intermodal freight transport system and having cold formed wood bracing walls to resist forces in shear and uplift while providing a continuous load path to the foundation system. The module may include interior walls to section the module into rooms and further comprises mechanical, electrical, utility and plumbing aspects of a building, capable of inspection and certification prior to delivery to the construction site. Once arrived at the construction site the building module is anchored to the building foundation and the remainder of the house is built around the building module.Type: GrantFiled: October 31, 2017Date of Patent: May 28, 2019Inventor: John P. Hawkins
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Patent number: 10208370Abstract: An aluminum alloy contains, in mass percent, Zn: 2.5% or more and less than 5.0%, Mg: 2.2% or more and 3.0% or less, and Ti: 0.001% or more and 0.05% or less, Cu: 0.10% or less, Zr: 0.10% or less, Cr: 0.03% or less, Fe: 0.30% or less, Si: 0.30% or less, and Mn: 0.03% or less, the remainder being composed of Al and unavoidable impurities. In addition, the tensile strength is 380 MPa or more; the electrical conductivity is 38.0% IACS or more; and the metallographic structure is composed of a recrystallized structure.Type: GrantFiled: September 26, 2014Date of Patent: February 19, 2019Assignee: UACJ CORPORATIONInventors: Hidenori Hatta, Satoshi Udagawa, Takero Watanabe
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Patent number: 10093047Abstract: A manufacturing method of a glass fiber product is disclosed. A glass fiber resin is provided. The glass fiber resin includes a thermoplastic resin, a glass fiber, and an additive. The amount of the thermoplastic resin is between 30 wt % and 70 wt %, the content of the glass fiber is between 40 wt % and 70 wt % and the amount of the additive is between 0.1 wt % and 15 wt %. A molding process is performed for the glass fiber resin to mold the glass fiber resin into a semi-finished product. A mechanical machining process is performed on the semi-finished product to form at least one recessed structure in the semi-finished product, so as to form a final product.Type: GrantFiled: October 19, 2015Date of Patent: October 9, 2018Assignee: Getac Technology CorporationInventors: Juei-Chi Chang, James Hwang
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Patent number: 10012264Abstract: There is provided a sliding member formed by combining a resin overlay and a soft metal overlay. The sliding member has a soft layer comprising a metallic material with a hardness of less than 40 HV provided under a resin overlay layer comprising a solid lubricant and resin. In the event of contamination by a foreign matter, the soft layer under the resin overlay layer is capable of plastic deformation and the resin overlay layer is capable of partial deformation accompanying the plastic deformation due to the hardness (T1) (?m) of the soft layer and the hardness (T2) (?m) of the resin overlay layer being such that 0.2?T1/T2?7.0 and 3.0?T1?20.0. Consequently, a foreign matter is desirably embedded and resistance to a foreign matter can be improved. Low friction is maintained by the resin overlay layer even after contamination by a foreign matter.Type: GrantFiled: February 7, 2013Date of Patent: July 3, 2018Assignee: Daido Metal Company Ltd.Inventors: Hiroyuki Asakura, Mikihito Yasui, Shigeya Haneda
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Patent number: 9986644Abstract: A process for the production of an entry sheet for drilling a printed wiring board material, which process comprises forming a multi-layered water-soluble resin composition layer on at least one surface of a metal foil, wherein an aqueous solution of a water-soluble resin composition is applied to the metal foil, dried and solidified to form one water-soluble resin composition layer, the application, drying and solidification of the aqueous solution of the water-soluble resin composition are repeated at least once to form at least one water-soluble resin composition layer on the above one water-soluble resin composition layer, the multi-layered water-soluble resin composition layer is composed of these water-soluble resin composition layers, the multi-layered water-soluble resin composition layer has a thickness of at least 50 ?m and is almost free from air bubbles, and an entry sheet for drilling a printed wiring board material obtained by the above process.Type: GrantFiled: June 24, 2009Date of Patent: May 29, 2018Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Yousuke Matsuyama, Reiki Akita, Takuya Hasaki
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Patent number: 9982147Abstract: The present invention relates to an aqueous coating composition (A) comprising at least one cathodically depositable binder (A1) and optionally at least one crosslinking agent (A2), for at least partly coating an electrically conductive substrate with an electrocoat material, where (A) comprises a total amount of at least 30 ppm of bismuth, based on the total weight of (A), and additionally at least one phosphorus-containing compound (P) blocked with at least one amine of the general formula (I), to the use of (A) for at least partly coating an electrically conductive substrate with an electrocoat material, to a corresponding coating method, and to an at least partly coated substrate obtainable by this method.Type: GrantFiled: December 10, 2013Date of Patent: May 29, 2018Assignees: BASF Coatings GmbH, HENKEL AG & Co. KGaAInventors: Sabine Holtschulte, Andreas Niegemeier, Dominik Stoll
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Patent number: 9884467Abstract: A copper-based material includes a base comprising copper and a surface treatment layer disposed on a surface of the base, the surface treatment layer including an amorphous layer containing a metal element that has a greater affinity for oxygen than for copper, oxygen, and, optionally, copper diffused from the base.Type: GrantFiled: May 29, 2013Date of Patent: February 6, 2018Assignee: HITACHI CABLE, LTD.Inventors: Seigi Aoyama, Hideyuki Sagawa, Toru Sumi, Keisuke Fujito, Hiromitsu Kuroda
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Patent number: 9882108Abstract: This disclosure provides systems, methods, and apparatus related to thermoelectric materials. In one aspect, a method includes providing a plurality of nanostructures. The plurality of nanostructures comprise a thermoelectric material, with each nanostructure of the plurality of nanostructures having first ligands disposed on a surface of the nanostructure. The plurality of nanostructures is mixed with a solution containing second ligands and a ligand exchange process occurs in which the first ligands disposed on the plurality of nanostructures are replaced with the second ligands. The plurality of nanostructures is deposited on a substrate to form a layer. The layer is thermally annealed.Type: GrantFiled: September 1, 2016Date of Patent: January 30, 2018Assignee: The Regents of the University of CaliforniaInventors: Jeffrey J. Urban, Jared Lynch, Nelson Coates, Jason Forster, Ayaskanta Sahu, Michael Chabinyc, Boris Russ
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Patent number: 9758890Abstract: PROBLEMS TO BE SOLVED: To provide a process for roughening both sides of a copper plate by forming a protrusion with a fine bump shape on the both sides of the copper plate, and then to provide a process for a deterioration of an electroplating solution for plating copper to become hard to progress therein. MEANS FOR SOLVING THE PROBLEMS: First of all, there is designed to be arranged electrodes (3, 3) as a similar pole for therebetween to be opposed to each other in an electroplating copper solution 2, and then to be arranged a copper plate 4 at therebetween. And then at first there becomes to be performed an anodic treatment for generating a copper fine particles on both surfaces of the copper plate 4, by performing an electrolytic process with the copper plate 4 as a positive electrode and the electrodes 3 as negative electrodes.Type: GrantFiled: July 22, 2014Date of Patent: September 12, 2017Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Hajime Watanabe, Sadao Ishihama, Kiyoteru Yamamoto, Takahiro Imai, Toshihiro Oyoshi
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Patent number: 9719185Abstract: The present invention provides a resin-coated stainless steel foil capable of maintaining a strong adherence force to the film even in an electrolytic solution to exhibit good corrosion resistance and excellent in the workability, design property and piecing resistance, and a container and a secondary battery each using the resin-coated stainless steel foil. A resin-coated stainless steel foil having a chromate treatment layer of 2 to 200 nm in thickness on at least one surface of a stainless steel foil and having at least a polyolefin-based resin (A) layer containing a functional group having polarity on the chromate treatment layer; and a container and a secondary battery each using the resin-coated stainless steel foil are also provided.Type: GrantFiled: July 28, 2006Date of Patent: August 1, 2017Assignee: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.Inventors: Masaharu Ibaragi, Hiroshi Kajiro, Hiroshi Ohishi
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Patent number: 9718943Abstract: A composition for preparing a polyimide-inorganic particle composite including a reaction product of a tetracarboxylic dianhydride mixture and a diamine, and a precursor of an inorganic particle, wherein the tetracarboxylic dianhydride mixture includes a tetracarboxylic dianhydride represented by Chemical Formula 1, and a tetracarboxylic dianhydride represented by Chemical Formula 2, and wherein the diamine is represented by Chemical Formula 3: wherein in Chemical Formulae 1 to 3, groups and variable as described in the specification.Type: GrantFiled: May 19, 2015Date of Patent: August 1, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jungha Chae, Woo-Jin Bae, Byung Hee Sohn
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Patent number: 9708519Abstract: Heat-curable adhesive composition: (a) a polyurethane composition (A) of formula: (i) in which R1 is a hydrocarbon-based radical; R2 is a polyester block; R3 is a linear C1-C3 alkylene radical; R4 and R5 are a C1-C4 alkyl; m is an integer such that the molar mass of the said polyurethanes is 900-27 000 Da; p=0, 1 or 2; obtained by producing polyester diols by polycondensation of: (i) dimerized fatty acids with an acid number of 190-200 mg KOH/g with a C2-C44 diol optionally having O or S; or (ii) dimerized fatty alcohols with a hydroxyl number of 200-220 mg KOH/g with a C4-C44 dicarboxylic acid optionally having O or S; (b) 22-62% of a compatible tackifying resin (B); and (c) 0.01-3% of a crosslinking catalyst (C). Self-adhesive support obtained by preheating the adhesive composition, coating onto a support layer and then curing. Manufacture of self-adhesive labels and/or tapes.Type: GrantFiled: October 23, 2014Date of Patent: July 18, 2017Assignee: BOSTIK S.A.Inventors: Olivier Laferte, Stephane Fouquay
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Patent number: 9564255Abstract: A high-speed transmission cable conductor includes a core material includes mainly copper, and a surface treated layer formed around a surface of the core material. The surface treated layer includes an amorphous layer including a metal element having a higher affinity for oxygen than the copper, and oxygen.Type: GrantFiled: November 27, 2013Date of Patent: February 7, 2017Assignee: HITACHI METALS, LTD.Inventors: Hideyuki Sagawa, Seigi Aoyama, Toru Sumi, Keisuke Fujito, Detian Huang
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Patent number: 9486984Abstract: Provided is a steel sheet including an iron-based material, a first coating layer disposed on the iron-based material, and a second coating layer disposed on the first coating layer, wherein the first coating layer includes a zinc alloy and the second coating layer consists essentially of chromium and carbon.Type: GrantFiled: May 5, 2015Date of Patent: November 8, 2016Assignees: National Taiwan University, CHINA STEEL CORPORATIONInventors: Chao-Sung Lin, Tsung-Jung Chen, Chun-Hung Wu
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Patent number: 9421645Abstract: A solder joint material includes a Zn-based metal material including mainly of Zn, an Al-based metal material including mainly of Al and provided on the Zn-based metal material, a Cu-based metal material including mainly of Cu and provided on the Al-based metal material, and a surface-treated layer provided on the Cu-based metal material and including an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper.Type: GrantFiled: September 25, 2014Date of Patent: August 23, 2016Assignee: Hitachi Metals, Ltd.Inventors: Yuichi Oda, Hideyuki Sagawa, Kazuma Kuroki, Hiromitsu Kuroda, Kotaro Tanaka, Hiroaki Numata
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Patent number: 9331141Abstract: CMOS structures with a replacement substrate and methods of manufacture are disclosed herein. The method includes forming a device on a temporary substrate. The method further includes removing the temporary substrate. The method further includes bonding a permanent electrically insulative substrate to the device with a bonding structure.Type: GrantFiled: February 21, 2013Date of Patent: May 3, 2016Assignee: GLOBALFOUNDRIES INC.Inventors: Paul S. Andry, Edmund J. Sprogis, Cornelia K. Tsang
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Patent number: 9313904Abstract: A wiring board includes a first wiring layer including a first conductive layer and a second conductive layer coating a first surface and a side surface of the first conductive layer. A first insulating layer covers a first surface and a side surface of the second conductive layer so as to expose a second surface of the first conductive layer opposite to the first surface of the first conductive layer. A second wiring layer is stacked on a first surface of the first insulating layer and is electrically connected to the first wiring layer. The first surface and the side surface of the first conductive layer are smooth surfaces while the first surface and the side surface of the second conductive layer are roughened-surfaces.Type: GrantFiled: June 20, 2014Date of Patent: April 12, 2016Assignee: Shinko Electric Industries Co., Ltd.Inventors: Kentaro Kaneko, Katsuya Fukase
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Patent number: 9257498Abstract: Some embodiments relate to a metal-insulator-metal (MIM) capacitor, which includes a capacitor a capacitor bottom metal (CBM) electrode, a high k dielectric layer arranged over the CBM electrode, and a capacitor top metal (CTM) electrode arranged over the high k dielectric layer. In some embodiments, the MIM capacitor comprises CTM protective sidewall regions, which extend along vertical sidewall surfaces of the CTM electrode, and protect the CTM electrode from leakage, premature voltage breakdown, or burn out, due to metallic residue or etch damage formed on the sidewalls during one or more etch process(es) used to form the CTM electrode. In some embodiments, the MIM capacitor comprises CBM protective sidewall regions, which extend along vertical sidewall surfaces of the CBM electrode. In some embodiments, the MIM capacitor comprises both CBM and CTM protective sidewall regions.Type: GrantFiled: August 4, 2014Date of Patent: February 9, 2016Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chern-Yow Hsu, Shih-Chang Liu, Ching-Sheng Chu, Chia-Shiung Tsai
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Patent number: 9200165Abstract: The present invention provides a chromium-free surface treatment liquid which enables forming, on a metal material surface, a film excellent in corrosion resistance at bent portions of a steel sheet, solvent resistance, coating properties after alkaline degreasing, and sweat resistance. The surface treatment liquid contains a resin compound having a specific bisphenol skeleton, a cationic urethane resin emulsion, a silane coupling agent, an organic titanium chelate compound, a quadrivalent vanadyl compound, a molybdate compound, a fluorine compound, and water at predetermined proportions. The pH of the surface treatment liquid is in the range of 4 to 5.Type: GrantFiled: September 20, 2011Date of Patent: December 1, 2015Assignee: JFE STEEL CORPORATIONInventors: Toru Imokawa, Takahiro Kubota, Etsuo Hamada, Masayasu Nagoshi
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Patent number: 9186417Abstract: A hemostatic composition is provided. The hemostatic composition includes a hemostatically effective amount of a hemostatic agent that includes a nanoparticle and a polyphosphate polymer attached to the nanoparticle. Also provided are medical devices and methods of use to promote blood clotting.Type: GrantFiled: March 7, 2014Date of Patent: November 17, 2015Assignees: The Regents of the University of California, The Board of Trustees of the University of IllinoisInventors: Damien Kudela, Galen D. Stucky, Anna May-Masnou, Gary Bernard Braun, James H. Morrissey, Stephanie A. Smith
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Patent number: 9112080Abstract: Provided are novel building integrable photovoltaic (BIP) modules and methods of fabricating thereof. A module may be fabricated from an insert having one or more photovoltaic cells by electrically interconnecting and mechanically integrating one or more connectors with the insert. Each connector may have one or more conductive elements, such as metal sockets and/or pins. At least two of all conductive elements are electrically connected to the photovoltaic cells using, for example, bus bars. These and other electrical components are electrically insulated using a temperature resistant material having a Relative Temperature Index (RTI) of at least about 115° C. The insulation may be provided before or during module fabrication by, for example, providing a prefabricated insulating housing and/or injection molding the temperature resistant material. The temperature resistant material and/or other materials may be used for mechanical integration of the one or more connectors with the insert.Type: GrantFiled: March 11, 2011Date of Patent: August 18, 2015Assignee: Apollo Precision (Kunming) Yuanhong LimitedInventors: Jason S. Corneille, Michael Meyers, Adam C. Sherman, Nazir Ahmad
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Patent number: 9096936Abstract: A method for manufacturing a patterned structural body by which a patterned structural body having a micropattern can be manufactured, a metal structural body-containing polymer film that can be used in the manufacture of the patterned structural body, and a method for manufacturing the polymer film are provided. The metal structural body-containing polymer film comprises a polymer film that includes a block copolymer having an ion-conductive segment and a non-ion-conductive segment and has a microphase-separated structure including ion-conductive domains and non-ion-conductive domains, and a metal structural body localized at the ion-conductive domains.Type: GrantFiled: February 6, 2014Date of Patent: August 4, 2015Assignee: Canon Kabushiki KaishaInventors: Wataru Kubo, Kazuhiro Yamauchi, Kenji Yamada, Mamiko Kumagai, Kyoko Kumagai, Toshiki Ito, Norishige Kakegawa
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Publication number: 20150147588Abstract: The present invention concerns a plastic component with a coating system, wherein the coating system comprises a basecoat of paint which has been applied to the surface of the plastic and on which a coating applied by means of vapor phase deposition is provided, for its part covered by a top coat of paint, characterized in that the coating applied by vapor phase deposition comprises multiple layers.Type: ApplicationFiled: May 30, 2013Publication date: May 28, 2015Applicant: Oerlikon Trading AG, TrubbachInventors: Antal Keckes, Thomas Hermann, Peter Schuler, Ruediger Schaefer, Sascha Bauer
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Publication number: 20150111059Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f3×t3)/(f2×t2)=>1 wherein t2 (mm) is a thickness of the copper foil, f2 (MPa) is a stress of the copper foil under tensile strain of 4%, t3 (mm) is a thickness of the resin layer, f3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2: 1<=33f1/(F×T) wherein f1 (N/mm) is 180° peeling strength between the copper foil and the resin layer, F(MPa) is strength of the copper foil composite under tensile strain of 30%, and T (mm) is a thickness of the copper foil composite, wherein a Sn layer having a thickness of 0.2 to 3.0 ?m is formed on a surface of the copper foil on which the resin layer is not laminated.Type: ApplicationFiled: January 13, 2012Publication date: April 23, 2015Inventors: Koichiro Tanaka, Kazuki Kammuri
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Publication number: 20150107760Abstract: Disclosed herein are a carrier and a method of manufacturing a printed circuit board using the same. More specifically, in the carrier according to the present invention, the carrier has characteristics of a coefficient of thermal expansion (CTE), a glass transition temperature (Tg), and a storage modulus which are improved by an insulating layer including an epoxy resin and a liquid crystal oligomer. In addition, a first metal layer is formed on the insulating layer, such that the printed circuit board stacked on one surface or both surfaces of the carrier may be protected from deformation by physical impact and the warpage phenomenon may be minimized.Type: ApplicationFiled: January 21, 2014Publication date: April 23, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Seok Moon, Dae Hui Jo, Keung Jin Sohn, Seong Hyun Yoo
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Publication number: 20150104668Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic having a plurality of accelerators dispersed in the plastic. The accelerators have a formula ABO3, wherein A is one or more elements selected from Groups 9, 10, and 11 of the Periodic Table of Elements, B is one or more elements selected from Groups 4B and 5B of the Periodic Table of Elements, and O is oxygen. The method includes the step of irradiating a surface of plastic substrate to expose at least a first accelerator. The method further includes plating the irradiated surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.Type: ApplicationFiled: December 19, 2014Publication date: April 16, 2015Inventors: Qing GONG, Liang ZHOU, Weifeng MIAO, Xiong ZHANG
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Patent number: 8999517Abstract: A steel pipe has a multi-layer coating including: a plating film formed on the surface of the steel pipe; a chemical conversion coating covering the plating film; a primer coating covering the chemical conversion coating and formed from a curable epoxy resin composition composed mainly of an epoxy compound and having an amide or imide bond introduced; and a polyamide resin coating covering the primer coating. The multi-layer coating can significantly enhance the adhesion force of the polyamide coating compared to the conventional pipe.Type: GrantFiled: November 20, 2008Date of Patent: April 7, 2015Assignee: Sanoh Kogyo Kabushiki KaishaInventors: Yoshihisa Tamura, Naoki Kawai
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Patent number: 8987349Abstract: Disclosed are methods for making aqueous dispersions of polymer-enclosed particles, such as nanoparticles, polymerizable polymers useful in such a method, and cationic electrodepositable compositions comprising such aqueous dispersions.Type: GrantFiled: October 27, 2009Date of Patent: March 24, 2015Assignee: PPG Industries Ohio, Inc.Inventor: W. David Polk
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Publication number: 20150079419Abstract: This relates to a process for manufacturing a recovery annealed coated steel substrate for packaging applications and a packaging steel product produced thereby.Type: ApplicationFiled: March 28, 2013Publication date: March 19, 2015Inventors: Jean Joseph Campaniello, Jacques Hubert Olga Joseph Wijenberg, Ilja Portegies Zwart
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Publication number: 20150072166Abstract: A black-plated steel sheet has a Zn-plating layer containing molten Al and Mg, containing Al in the amount of 1.0-22.0 mass %, containing Mg in the amount of 1.3-10.0 mass %, and having a Zn black oxide distributed in a lamella pattern in the plating layer. The Zn black oxide is a Zn oxide derived from a Zn2Mg phase. The brightness of the surface of the Zn-plating layer containing the molten Al and Mg has an L* value of 60 or less.Type: ApplicationFiled: June 29, 2012Publication date: March 12, 2015Applicant: NISSHIN STEEL CO., LTD.Inventors: Tadashi Nakano, Masaya Yamamoto, Hirofumi Taketsu
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Patent number: 8974915Abstract: PU/ZnO nanocomposites are provided wherein the addition of less than 1 vol % 33 nm ZnO nanoparticles into a PU matrix effect a decrease in the Young's Modulus and storage modulus of the polymer, while simultaneously effecting an increase glass transition temperature of the polymer. Detailed experiments are described (e.g., FTIR, DMTA, FESEM and AFM) that suggest that the reaction between hydroxyl groups of the ZnO nanoparticles and isocyanate groups of the polyurethane prepolymer disrupts the self-assembly of the phase separation in PU. Phase separation is responsible for the good mechanical properties of PU. Further, detailed experiments suggest that the increase of the glass transition temperature results from the crosslinking effect of the ZnO nanoparticles.Type: GrantFiled: March 16, 2005Date of Patent: March 10, 2015Assignee: Rensselaer Polytechnic InstituteInventors: Junrong Zheng, Rahmi Ozisik, Richard W. Siegel
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Patent number: 8962143Abstract: A PTFE-based sliding material, wherein the porous sintered layer on the surface of backing metal is impregnated with baked PTFE, with one or both of the solid lubricant and wear-resistant additive together with fibrous PTFE forming an entangled fibrous PTFE structure, is used for a bearing of air-conditioner. Resistance of the bearing for local wear is required. Such wear resistance is to be enhanced. Carbides of an oligomer or polymer containing a hydrophilic group formed during baking are incorporated in the entangled structure of fibrous PTFE.Type: GrantFiled: October 26, 2009Date of Patent: February 24, 2015Assignee: Taiho Kogyo Co., Ltd.Inventors: Masaru Yoshikawa, Akira Sawamoto, Hiroshi Ueda
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Publication number: 20150047884Abstract: Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 ?m, and the ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil.Type: ApplicationFiled: March 26, 2013Publication date: February 19, 2015Inventors: Tomota Nagaura, Michiya Kohiki, Terumasa Moriyama
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Patent number: 8956734Abstract: Provided is a black resin steel plate having superior drawing ability and glossiness and particularly to a black resin steel plate in which the coefficient of friction of a black resin film is adjusted so as to block the transfer of a resin layer due to a reduction in thickness of the resin layer, thereby improving blackness and drawing ability, and to a method of manufacturing the same.Type: GrantFiled: November 4, 2011Date of Patent: February 17, 2015Assignee: PoscoInventors: Yon Kyun Song, Chang Hoon Choi, Yeon Ho Kim, Jae Dong Cho
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Publication number: 20150044500Abstract: This relates to a process for manufacturing a recovery annealed coated steel substrate for packaging applications and a packaging steel product produced thereby.Type: ApplicationFiled: March 28, 2013Publication date: February 12, 2015Inventors: Jean Joseph Campaniello, Jacques Hubert Olga Joseph Wijenberg, Ilja Portegies Zwart
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POLYMER COATED SUBSTRATE FOR PACKAGING APPLICATIONS AND A METHOD FOR PRODUCING SAID COATED SUBSTRATE
Publication number: 20150037604Abstract: This relates to a coated substrate for packaging applications and a method for producing the coated substrate.Type: ApplicationFiled: April 10, 2013Publication date: February 5, 2015Inventors: Jan Paul Penning, Jacques Hubert Olga Joseph Wijenberg, Ilja Portegies Zwart -
Publication number: 20150020562Abstract: The present invention provides plated steel sheet for hot press use which is excellent in hot lubricity, coating adhesion, spot weldability, and coated corrosion resistance and a method of hot pressing plated steel sheet. The present invention is Plated steel sheet for hot press use and a method of hot pressing plated steel sheet characterized by being plated steel sheet for hot press use which contains an Al plating layer which is formed on one surface or both surfaces of said steel sheet, and a surface coating layer which is formed on said Al plating layer, said surface coating layer containing at least one Zn compound which is selected from a group comprised of Zn hydroxide, Zn phosphate, and a Zn organic acid.Type: ApplicationFiled: February 8, 2013Publication date: January 22, 2015Inventors: Shintaro Yamanaka, Jun Maki, Masao Kurosaki, Kazuhisa Kusumi
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Patent number: 8920938Abstract: With the invention a metallic flat product can be systematically made available with such a fine, stochastic or quasi-stochastic surface texture that after a typical automotive paint application it is only minimally perceptible, if at all, by the human eye. At the same time, in the case of a surface topography constituted according to the invention, the transition between the peak plateaus and the valleys takes place via steep flanks. In this way, it is achieved that the morphology of the sheet metal surface is practically independent of the actual depth of the valleys. As a result therefore, the morphology of the sheet metal surface of a metallic flat product according to the invention is also independent of the skin-pass rate, which is obtained when the fine metal texture is produced by skin-pass rolling.Type: GrantFiled: June 20, 2008Date of Patent: December 30, 2014Assignees: ThyssenKrupp Steel Europe AG, Walzen-Service-Center GmbHInventors: Bodo Hesse, Karl-Heinz Kopplin, Folkert Schulze-Kraasch, Udo Schulokat, Hans-Gerd Weyen, Ingo Rogner, Torsten Herles, Roland Meier
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Patent number: 8920936Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic having a plurality of accelerators dispersed in the plastic. The accelerators have a formula ABO3, wherein A is one or more elements selected from Groups 9, 10, and 11 of the Periodic Table of Elements, B is one or more elements selected from Groups 4B and 5B of the Periodic Table of Elements, and O is oxygen. The method includes the step of irradiating a surface of plastic substrate to expose at least a first accelerator. The method further includes plating the irradiated surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.Type: GrantFiled: January 13, 2012Date of Patent: December 30, 2014Assignee: BYD Company LimitedInventors: Qing Gong, Liang Zhou, Weifeng Miao, Xiong Zhang
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Publication number: 20140370327Abstract: A high vacuum component, e.g. a vacuum chamber wall or a component that is operated or positioned within a vacuum chamber in use is described. The component is substantially formed of a layered material comprising a fibrous composite material layer having a surface that is coated with a copper intermediate layer and an impermeable outer layer of nickel. In use the outer layer is exposed to a high vacuum.Type: ApplicationFiled: December 8, 2011Publication date: December 18, 2014Applicant: GE Energy Power Conversion Technology Ltd.Inventor: Martin Richard Ingles
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Patent number: 8911878Abstract: Metal-clad polymer articles containing structural fine-grained and/or amorphous metallic coatings/layers optionally containing solid particulates dispersed therein. The fine-grained and/or amorphous metallic coatings are particularly suited for strong and lightweight articles, precision molds, sporting goods, automotive parts and components exposed to thermal cycling although the CLTE of the metallic layer and the one of the substrate is mismatched. The interface between the metallic layer and the polymer is suitably pretreated to withstand thermal cycling without failure.Type: GrantFiled: January 31, 2013Date of Patent: December 16, 2014Assignee: Integran Technologies Inc.Inventors: Klaus Tomantschger, Jonathan McCrea, Nandakumar Nagarajan, Francisco Gonzalez, Gino Palumbo, Konstantinos Panagiotopoulos, Herath Katugaha