Synthetic Resin Patents (Class 428/626)
  • Patent number: 10349527
    Abstract: The present invention relates to a composition for forming a conductive pattern, which is able to form a fine conductive pattern onto a variety of polymer resin products or resin layers by a very simple process, a method for forming the conductive pattern using the same, and a resin structure having the conductive pattern.
    Type: Grant
    Filed: April 17, 2014
    Date of Patent: July 9, 2019
    Assignee: LG CHEM, LTD.
    Inventors: Chee-Sung Park, Han Nah Jeong, Sang Yun Jung, Cheol-Hee Park, Chan Yeup Chung, Jae Hyun Kim, Shin Hee Jun
  • Patent number: 10312721
    Abstract: Systems, devices, and methods are disclosed for unlocking a vehicle. An example vehicle includes a power system, a remote unlock system controlled by a remote unlocking device, and a door applique. The door applique comprises a wireless charger coupled to the power system, configured to charge the remote unlocking device, and a ridge configured to engage the remote unlocking device, wherein the wireless charger is configured to charge the remote unlocking device for a limited time.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: June 4, 2019
    Assignee: Ford Global Technologies, LLC
    Inventors: David Joseph Orris, Nunzio DeCia, Stephen Jay Orris, David A. Herman, Howard Paul Tsvi Linden, Nicholas Alexander Scheufler
  • Patent number: 10301813
    Abstract: A prefabricated building module constructed at a central location and delivered to a construction site via shipping using the intermodal freight transport system and having cold formed wood bracing walls to resist forces in shear and uplift while providing a continuous load path to the foundation system. The module may include interior walls to section the module into rooms and further comprises mechanical, electrical, utility and plumbing aspects of a building, capable of inspection and certification prior to delivery to the construction site. Once arrived at the construction site the building module is anchored to the building foundation and the remainder of the house is built around the building module.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: May 28, 2019
    Inventor: John P. Hawkins
  • Patent number: 10208370
    Abstract: An aluminum alloy contains, in mass percent, Zn: 2.5% or more and less than 5.0%, Mg: 2.2% or more and 3.0% or less, and Ti: 0.001% or more and 0.05% or less, Cu: 0.10% or less, Zr: 0.10% or less, Cr: 0.03% or less, Fe: 0.30% or less, Si: 0.30% or less, and Mn: 0.03% or less, the remainder being composed of Al and unavoidable impurities. In addition, the tensile strength is 380 MPa or more; the electrical conductivity is 38.0% IACS or more; and the metallographic structure is composed of a recrystallized structure.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: February 19, 2019
    Assignee: UACJ CORPORATION
    Inventors: Hidenori Hatta, Satoshi Udagawa, Takero Watanabe
  • Patent number: 10093047
    Abstract: A manufacturing method of a glass fiber product is disclosed. A glass fiber resin is provided. The glass fiber resin includes a thermoplastic resin, a glass fiber, and an additive. The amount of the thermoplastic resin is between 30 wt % and 70 wt %, the content of the glass fiber is between 40 wt % and 70 wt % and the amount of the additive is between 0.1 wt % and 15 wt %. A molding process is performed for the glass fiber resin to mold the glass fiber resin into a semi-finished product. A mechanical machining process is performed on the semi-finished product to form at least one recessed structure in the semi-finished product, so as to form a final product.
    Type: Grant
    Filed: October 19, 2015
    Date of Patent: October 9, 2018
    Assignee: Getac Technology Corporation
    Inventors: Juei-Chi Chang, James Hwang
  • Patent number: 10012264
    Abstract: There is provided a sliding member formed by combining a resin overlay and a soft metal overlay. The sliding member has a soft layer comprising a metallic material with a hardness of less than 40 HV provided under a resin overlay layer comprising a solid lubricant and resin. In the event of contamination by a foreign matter, the soft layer under the resin overlay layer is capable of plastic deformation and the resin overlay layer is capable of partial deformation accompanying the plastic deformation due to the hardness (T1) (?m) of the soft layer and the hardness (T2) (?m) of the resin overlay layer being such that 0.2?T1/T2?7.0 and 3.0?T1?20.0. Consequently, a foreign matter is desirably embedded and resistance to a foreign matter can be improved. Low friction is maintained by the resin overlay layer even after contamination by a foreign matter.
    Type: Grant
    Filed: February 7, 2013
    Date of Patent: July 3, 2018
    Assignee: Daido Metal Company Ltd.
    Inventors: Hiroyuki Asakura, Mikihito Yasui, Shigeya Haneda
  • Patent number: 9986644
    Abstract: A process for the production of an entry sheet for drilling a printed wiring board material, which process comprises forming a multi-layered water-soluble resin composition layer on at least one surface of a metal foil, wherein an aqueous solution of a water-soluble resin composition is applied to the metal foil, dried and solidified to form one water-soluble resin composition layer, the application, drying and solidification of the aqueous solution of the water-soluble resin composition are repeated at least once to form at least one water-soluble resin composition layer on the above one water-soluble resin composition layer, the multi-layered water-soluble resin composition layer is composed of these water-soluble resin composition layers, the multi-layered water-soluble resin composition layer has a thickness of at least 50 ?m and is almost free from air bubbles, and an entry sheet for drilling a printed wiring board material obtained by the above process.
    Type: Grant
    Filed: June 24, 2009
    Date of Patent: May 29, 2018
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yousuke Matsuyama, Reiki Akita, Takuya Hasaki
  • Patent number: 9982147
    Abstract: The present invention relates to an aqueous coating composition (A) comprising at least one cathodically depositable binder (A1) and optionally at least one crosslinking agent (A2), for at least partly coating an electrically conductive substrate with an electrocoat material, where (A) comprises a total amount of at least 30 ppm of bismuth, based on the total weight of (A), and additionally at least one phosphorus-containing compound (P) blocked with at least one amine of the general formula (I), to the use of (A) for at least partly coating an electrically conductive substrate with an electrocoat material, to a corresponding coating method, and to an at least partly coated substrate obtainable by this method.
    Type: Grant
    Filed: December 10, 2013
    Date of Patent: May 29, 2018
    Assignees: BASF Coatings GmbH, HENKEL AG & Co. KGaA
    Inventors: Sabine Holtschulte, Andreas Niegemeier, Dominik Stoll
  • Patent number: 9884467
    Abstract: A copper-based material includes a base comprising copper and a surface treatment layer disposed on a surface of the base, the surface treatment layer including an amorphous layer containing a metal element that has a greater affinity for oxygen than for copper, oxygen, and, optionally, copper diffused from the base.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: February 6, 2018
    Assignee: HITACHI CABLE, LTD.
    Inventors: Seigi Aoyama, Hideyuki Sagawa, Toru Sumi, Keisuke Fujito, Hiromitsu Kuroda
  • Patent number: 9882108
    Abstract: This disclosure provides systems, methods, and apparatus related to thermoelectric materials. In one aspect, a method includes providing a plurality of nanostructures. The plurality of nanostructures comprise a thermoelectric material, with each nanostructure of the plurality of nanostructures having first ligands disposed on a surface of the nanostructure. The plurality of nanostructures is mixed with a solution containing second ligands and a ligand exchange process occurs in which the first ligands disposed on the plurality of nanostructures are replaced with the second ligands. The plurality of nanostructures is deposited on a substrate to form a layer. The layer is thermally annealed.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: January 30, 2018
    Assignee: The Regents of the University of California
    Inventors: Jeffrey J. Urban, Jared Lynch, Nelson Coates, Jason Forster, Ayaskanta Sahu, Michael Chabinyc, Boris Russ
  • Patent number: 9758890
    Abstract: PROBLEMS TO BE SOLVED: To provide a process for roughening both sides of a copper plate by forming a protrusion with a fine bump shape on the both sides of the copper plate, and then to provide a process for a deterioration of an electroplating solution for plating copper to become hard to progress therein. MEANS FOR SOLVING THE PROBLEMS: First of all, there is designed to be arranged electrodes (3, 3) as a similar pole for therebetween to be opposed to each other in an electroplating copper solution 2, and then to be arranged a copper plate 4 at therebetween. And then at first there becomes to be performed an anodic treatment for generating a copper fine particles on both surfaces of the copper plate 4, by performing an electrolytic process with the copper plate 4 as a positive electrode and the electrodes 3 as negative electrodes.
    Type: Grant
    Filed: July 22, 2014
    Date of Patent: September 12, 2017
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hajime Watanabe, Sadao Ishihama, Kiyoteru Yamamoto, Takahiro Imai, Toshihiro Oyoshi
  • Patent number: 9719185
    Abstract: The present invention provides a resin-coated stainless steel foil capable of maintaining a strong adherence force to the film even in an electrolytic solution to exhibit good corrosion resistance and excellent in the workability, design property and piecing resistance, and a container and a secondary battery each using the resin-coated stainless steel foil. A resin-coated stainless steel foil having a chromate treatment layer of 2 to 200 nm in thickness on at least one surface of a stainless steel foil and having at least a polyolefin-based resin (A) layer containing a functional group having polarity on the chromate treatment layer; and a container and a secondary battery each using the resin-coated stainless steel foil are also provided.
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: August 1, 2017
    Assignee: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
    Inventors: Masaharu Ibaragi, Hiroshi Kajiro, Hiroshi Ohishi
  • Patent number: 9718943
    Abstract: A composition for preparing a polyimide-inorganic particle composite including a reaction product of a tetracarboxylic dianhydride mixture and a diamine, and a precursor of an inorganic particle, wherein the tetracarboxylic dianhydride mixture includes a tetracarboxylic dianhydride represented by Chemical Formula 1, and a tetracarboxylic dianhydride represented by Chemical Formula 2, and wherein the diamine is represented by Chemical Formula 3: wherein in Chemical Formulae 1 to 3, groups and variable as described in the specification.
    Type: Grant
    Filed: May 19, 2015
    Date of Patent: August 1, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jungha Chae, Woo-Jin Bae, Byung Hee Sohn
  • Patent number: 9708519
    Abstract: Heat-curable adhesive composition: (a) a polyurethane composition (A) of formula: (i) in which R1 is a hydrocarbon-based radical; R2 is a polyester block; R3 is a linear C1-C3 alkylene radical; R4 and R5 are a C1-C4 alkyl; m is an integer such that the molar mass of the said polyurethanes is 900-27 000 Da; p=0, 1 or 2; obtained by producing polyester diols by polycondensation of: (i) dimerized fatty acids with an acid number of 190-200 mg KOH/g with a C2-C44 diol optionally having O or S; or (ii) dimerized fatty alcohols with a hydroxyl number of 200-220 mg KOH/g with a C4-C44 dicarboxylic acid optionally having O or S; (b) 22-62% of a compatible tackifying resin (B); and (c) 0.01-3% of a crosslinking catalyst (C). Self-adhesive support obtained by preheating the adhesive composition, coating onto a support layer and then curing. Manufacture of self-adhesive labels and/or tapes.
    Type: Grant
    Filed: October 23, 2014
    Date of Patent: July 18, 2017
    Assignee: BOSTIK S.A.
    Inventors: Olivier Laferte, Stephane Fouquay
  • Patent number: 9564255
    Abstract: A high-speed transmission cable conductor includes a core material includes mainly copper, and a surface treated layer formed around a surface of the core material. The surface treated layer includes an amorphous layer including a metal element having a higher affinity for oxygen than the copper, and oxygen.
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: February 7, 2017
    Assignee: HITACHI METALS, LTD.
    Inventors: Hideyuki Sagawa, Seigi Aoyama, Toru Sumi, Keisuke Fujito, Detian Huang
  • Patent number: 9486984
    Abstract: Provided is a steel sheet including an iron-based material, a first coating layer disposed on the iron-based material, and a second coating layer disposed on the first coating layer, wherein the first coating layer includes a zinc alloy and the second coating layer consists essentially of chromium and carbon.
    Type: Grant
    Filed: May 5, 2015
    Date of Patent: November 8, 2016
    Assignees: National Taiwan University, CHINA STEEL CORPORATION
    Inventors: Chao-Sung Lin, Tsung-Jung Chen, Chun-Hung Wu
  • Patent number: 9421645
    Abstract: A solder joint material includes a Zn-based metal material including mainly of Zn, an Al-based metal material including mainly of Al and provided on the Zn-based metal material, a Cu-based metal material including mainly of Cu and provided on the Al-based metal material, and a surface-treated layer provided on the Cu-based metal material and including an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: August 23, 2016
    Assignee: Hitachi Metals, Ltd.
    Inventors: Yuichi Oda, Hideyuki Sagawa, Kazuma Kuroki, Hiromitsu Kuroda, Kotaro Tanaka, Hiroaki Numata
  • Patent number: 9331141
    Abstract: CMOS structures with a replacement substrate and methods of manufacture are disclosed herein. The method includes forming a device on a temporary substrate. The method further includes removing the temporary substrate. The method further includes bonding a permanent electrically insulative substrate to the device with a bonding structure.
    Type: Grant
    Filed: February 21, 2013
    Date of Patent: May 3, 2016
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Paul S. Andry, Edmund J. Sprogis, Cornelia K. Tsang
  • Patent number: 9313904
    Abstract: A wiring board includes a first wiring layer including a first conductive layer and a second conductive layer coating a first surface and a side surface of the first conductive layer. A first insulating layer covers a first surface and a side surface of the second conductive layer so as to expose a second surface of the first conductive layer opposite to the first surface of the first conductive layer. A second wiring layer is stacked on a first surface of the first insulating layer and is electrically connected to the first wiring layer. The first surface and the side surface of the first conductive layer are smooth surfaces while the first surface and the side surface of the second conductive layer are roughened-surfaces.
    Type: Grant
    Filed: June 20, 2014
    Date of Patent: April 12, 2016
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Kentaro Kaneko, Katsuya Fukase
  • Patent number: 9257498
    Abstract: Some embodiments relate to a metal-insulator-metal (MIM) capacitor, which includes a capacitor a capacitor bottom metal (CBM) electrode, a high k dielectric layer arranged over the CBM electrode, and a capacitor top metal (CTM) electrode arranged over the high k dielectric layer. In some embodiments, the MIM capacitor comprises CTM protective sidewall regions, which extend along vertical sidewall surfaces of the CTM electrode, and protect the CTM electrode from leakage, premature voltage breakdown, or burn out, due to metallic residue or etch damage formed on the sidewalls during one or more etch process(es) used to form the CTM electrode. In some embodiments, the MIM capacitor comprises CBM protective sidewall regions, which extend along vertical sidewall surfaces of the CBM electrode. In some embodiments, the MIM capacitor comprises both CBM and CTM protective sidewall regions.
    Type: Grant
    Filed: August 4, 2014
    Date of Patent: February 9, 2016
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chern-Yow Hsu, Shih-Chang Liu, Ching-Sheng Chu, Chia-Shiung Tsai
  • Patent number: 9200165
    Abstract: The present invention provides a chromium-free surface treatment liquid which enables forming, on a metal material surface, a film excellent in corrosion resistance at bent portions of a steel sheet, solvent resistance, coating properties after alkaline degreasing, and sweat resistance. The surface treatment liquid contains a resin compound having a specific bisphenol skeleton, a cationic urethane resin emulsion, a silane coupling agent, an organic titanium chelate compound, a quadrivalent vanadyl compound, a molybdate compound, a fluorine compound, and water at predetermined proportions. The pH of the surface treatment liquid is in the range of 4 to 5.
    Type: Grant
    Filed: September 20, 2011
    Date of Patent: December 1, 2015
    Assignee: JFE STEEL CORPORATION
    Inventors: Toru Imokawa, Takahiro Kubota, Etsuo Hamada, Masayasu Nagoshi
  • Patent number: 9186417
    Abstract: A hemostatic composition is provided. The hemostatic composition includes a hemostatically effective amount of a hemostatic agent that includes a nanoparticle and a polyphosphate polymer attached to the nanoparticle. Also provided are medical devices and methods of use to promote blood clotting.
    Type: Grant
    Filed: March 7, 2014
    Date of Patent: November 17, 2015
    Assignees: The Regents of the University of California, The Board of Trustees of the University of Illinois
    Inventors: Damien Kudela, Galen D. Stucky, Anna May-Masnou, Gary Bernard Braun, James H. Morrissey, Stephanie A. Smith
  • Patent number: 9112080
    Abstract: Provided are novel building integrable photovoltaic (BIP) modules and methods of fabricating thereof. A module may be fabricated from an insert having one or more photovoltaic cells by electrically interconnecting and mechanically integrating one or more connectors with the insert. Each connector may have one or more conductive elements, such as metal sockets and/or pins. At least two of all conductive elements are electrically connected to the photovoltaic cells using, for example, bus bars. These and other electrical components are electrically insulated using a temperature resistant material having a Relative Temperature Index (RTI) of at least about 115° C. The insulation may be provided before or during module fabrication by, for example, providing a prefabricated insulating housing and/or injection molding the temperature resistant material. The temperature resistant material and/or other materials may be used for mechanical integration of the one or more connectors with the insert.
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: August 18, 2015
    Assignee: Apollo Precision (Kunming) Yuanhong Limited
    Inventors: Jason S. Corneille, Michael Meyers, Adam C. Sherman, Nazir Ahmad
  • Patent number: 9096936
    Abstract: A method for manufacturing a patterned structural body by which a patterned structural body having a micropattern can be manufactured, a metal structural body-containing polymer film that can be used in the manufacture of the patterned structural body, and a method for manufacturing the polymer film are provided. The metal structural body-containing polymer film comprises a polymer film that includes a block copolymer having an ion-conductive segment and a non-ion-conductive segment and has a microphase-separated structure including ion-conductive domains and non-ion-conductive domains, and a metal structural body localized at the ion-conductive domains.
    Type: Grant
    Filed: February 6, 2014
    Date of Patent: August 4, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Wataru Kubo, Kazuhiro Yamauchi, Kenji Yamada, Mamiko Kumagai, Kyoko Kumagai, Toshiki Ito, Norishige Kakegawa
  • Publication number: 20150147588
    Abstract: The present invention concerns a plastic component with a coating system, wherein the coating system comprises a basecoat of paint which has been applied to the surface of the plastic and on which a coating applied by means of vapor phase deposition is provided, for its part covered by a top coat of paint, characterized in that the coating applied by vapor phase deposition comprises multiple layers.
    Type: Application
    Filed: May 30, 2013
    Publication date: May 28, 2015
    Applicant: Oerlikon Trading AG, Trubbach
    Inventors: Antal Keckes, Thomas Hermann, Peter Schuler, Ruediger Schaefer, Sascha Bauer
  • Publication number: 20150111059
    Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f3×t3)/(f2×t2)=>1 wherein t2 (mm) is a thickness of the copper foil, f2 (MPa) is a stress of the copper foil under tensile strain of 4%, t3 (mm) is a thickness of the resin layer, f3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2: 1<=33f1/(F×T) wherein f1 (N/mm) is 180° peeling strength between the copper foil and the resin layer, F(MPa) is strength of the copper foil composite under tensile strain of 30%, and T (mm) is a thickness of the copper foil composite, wherein a Sn layer having a thickness of 0.2 to 3.0 ?m is formed on a surface of the copper foil on which the resin layer is not laminated.
    Type: Application
    Filed: January 13, 2012
    Publication date: April 23, 2015
    Inventors: Koichiro Tanaka, Kazuki Kammuri
  • Publication number: 20150107760
    Abstract: Disclosed herein are a carrier and a method of manufacturing a printed circuit board using the same. More specifically, in the carrier according to the present invention, the carrier has characteristics of a coefficient of thermal expansion (CTE), a glass transition temperature (Tg), and a storage modulus which are improved by an insulating layer including an epoxy resin and a liquid crystal oligomer. In addition, a first metal layer is formed on the insulating layer, such that the printed circuit board stacked on one surface or both surfaces of the carrier may be protected from deformation by physical impact and the warpage phenomenon may be minimized.
    Type: Application
    Filed: January 21, 2014
    Publication date: April 23, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Seok Moon, Dae Hui Jo, Keung Jin Sohn, Seong Hyun Yoo
  • Publication number: 20150104668
    Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic having a plurality of accelerators dispersed in the plastic. The accelerators have a formula ABO3, wherein A is one or more elements selected from Groups 9, 10, and 11 of the Periodic Table of Elements, B is one or more elements selected from Groups 4B and 5B of the Periodic Table of Elements, and O is oxygen. The method includes the step of irradiating a surface of plastic substrate to expose at least a first accelerator. The method further includes plating the irradiated surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.
    Type: Application
    Filed: December 19, 2014
    Publication date: April 16, 2015
    Inventors: Qing GONG, Liang ZHOU, Weifeng MIAO, Xiong ZHANG
  • Patent number: 8999517
    Abstract: A steel pipe has a multi-layer coating including: a plating film formed on the surface of the steel pipe; a chemical conversion coating covering the plating film; a primer coating covering the chemical conversion coating and formed from a curable epoxy resin composition composed mainly of an epoxy compound and having an amide or imide bond introduced; and a polyamide resin coating covering the primer coating. The multi-layer coating can significantly enhance the adhesion force of the polyamide coating compared to the conventional pipe.
    Type: Grant
    Filed: November 20, 2008
    Date of Patent: April 7, 2015
    Assignee: Sanoh Kogyo Kabushiki Kaisha
    Inventors: Yoshihisa Tamura, Naoki Kawai
  • Patent number: 8987349
    Abstract: Disclosed are methods for making aqueous dispersions of polymer-enclosed particles, such as nanoparticles, polymerizable polymers useful in such a method, and cationic electrodepositable compositions comprising such aqueous dispersions.
    Type: Grant
    Filed: October 27, 2009
    Date of Patent: March 24, 2015
    Assignee: PPG Industries Ohio, Inc.
    Inventor: W. David Polk
  • Publication number: 20150079419
    Abstract: This relates to a process for manufacturing a recovery annealed coated steel substrate for packaging applications and a packaging steel product produced thereby.
    Type: Application
    Filed: March 28, 2013
    Publication date: March 19, 2015
    Inventors: Jean Joseph Campaniello, Jacques Hubert Olga Joseph Wijenberg, Ilja Portegies Zwart
  • Publication number: 20150072166
    Abstract: A black-plated steel sheet has a Zn-plating layer containing molten Al and Mg, containing Al in the amount of 1.0-22.0 mass %, containing Mg in the amount of 1.3-10.0 mass %, and having a Zn black oxide distributed in a lamella pattern in the plating layer. The Zn black oxide is a Zn oxide derived from a Zn2Mg phase. The brightness of the surface of the Zn-plating layer containing the molten Al and Mg has an L* value of 60 or less.
    Type: Application
    Filed: June 29, 2012
    Publication date: March 12, 2015
    Applicant: NISSHIN STEEL CO., LTD.
    Inventors: Tadashi Nakano, Masaya Yamamoto, Hirofumi Taketsu
  • Patent number: 8974915
    Abstract: PU/ZnO nanocomposites are provided wherein the addition of less than 1 vol % 33 nm ZnO nanoparticles into a PU matrix effect a decrease in the Young's Modulus and storage modulus of the polymer, while simultaneously effecting an increase glass transition temperature of the polymer. Detailed experiments are described (e.g., FTIR, DMTA, FESEM and AFM) that suggest that the reaction between hydroxyl groups of the ZnO nanoparticles and isocyanate groups of the polyurethane prepolymer disrupts the self-assembly of the phase separation in PU. Phase separation is responsible for the good mechanical properties of PU. Further, detailed experiments suggest that the increase of the glass transition temperature results from the crosslinking effect of the ZnO nanoparticles.
    Type: Grant
    Filed: March 16, 2005
    Date of Patent: March 10, 2015
    Assignee: Rensselaer Polytechnic Institute
    Inventors: Junrong Zheng, Rahmi Ozisik, Richard W. Siegel
  • Patent number: 8962143
    Abstract: A PTFE-based sliding material, wherein the porous sintered layer on the surface of backing metal is impregnated with baked PTFE, with one or both of the solid lubricant and wear-resistant additive together with fibrous PTFE forming an entangled fibrous PTFE structure, is used for a bearing of air-conditioner. Resistance of the bearing for local wear is required. Such wear resistance is to be enhanced. Carbides of an oligomer or polymer containing a hydrophilic group formed during baking are incorporated in the entangled structure of fibrous PTFE.
    Type: Grant
    Filed: October 26, 2009
    Date of Patent: February 24, 2015
    Assignee: Taiho Kogyo Co., Ltd.
    Inventors: Masaru Yoshikawa, Akira Sawamoto, Hiroshi Ueda
  • Publication number: 20150047884
    Abstract: Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 ?m, and the ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil.
    Type: Application
    Filed: March 26, 2013
    Publication date: February 19, 2015
    Inventors: Tomota Nagaura, Michiya Kohiki, Terumasa Moriyama
  • Patent number: 8956734
    Abstract: Provided is a black resin steel plate having superior drawing ability and glossiness and particularly to a black resin steel plate in which the coefficient of friction of a black resin film is adjusted so as to block the transfer of a resin layer due to a reduction in thickness of the resin layer, thereby improving blackness and drawing ability, and to a method of manufacturing the same.
    Type: Grant
    Filed: November 4, 2011
    Date of Patent: February 17, 2015
    Assignee: Posco
    Inventors: Yon Kyun Song, Chang Hoon Choi, Yeon Ho Kim, Jae Dong Cho
  • Publication number: 20150044500
    Abstract: This relates to a process for manufacturing a recovery annealed coated steel substrate for packaging applications and a packaging steel product produced thereby.
    Type: Application
    Filed: March 28, 2013
    Publication date: February 12, 2015
    Inventors: Jean Joseph Campaniello, Jacques Hubert Olga Joseph Wijenberg, Ilja Portegies Zwart
  • Publication number: 20150037604
    Abstract: This relates to a coated substrate for packaging applications and a method for producing the coated substrate.
    Type: Application
    Filed: April 10, 2013
    Publication date: February 5, 2015
    Inventors: Jan Paul Penning, Jacques Hubert Olga Joseph Wijenberg, Ilja Portegies Zwart
  • Publication number: 20150020562
    Abstract: The present invention provides plated steel sheet for hot press use which is excellent in hot lubricity, coating adhesion, spot weldability, and coated corrosion resistance and a method of hot pressing plated steel sheet. The present invention is Plated steel sheet for hot press use and a method of hot pressing plated steel sheet characterized by being plated steel sheet for hot press use which contains an Al plating layer which is formed on one surface or both surfaces of said steel sheet, and a surface coating layer which is formed on said Al plating layer, said surface coating layer containing at least one Zn compound which is selected from a group comprised of Zn hydroxide, Zn phosphate, and a Zn organic acid.
    Type: Application
    Filed: February 8, 2013
    Publication date: January 22, 2015
    Inventors: Shintaro Yamanaka, Jun Maki, Masao Kurosaki, Kazuhisa Kusumi
  • Patent number: 8920938
    Abstract: With the invention a metallic flat product can be systematically made available with such a fine, stochastic or quasi-stochastic surface texture that after a typical automotive paint application it is only minimally perceptible, if at all, by the human eye. At the same time, in the case of a surface topography constituted according to the invention, the transition between the peak plateaus and the valleys takes place via steep flanks. In this way, it is achieved that the morphology of the sheet metal surface is practically independent of the actual depth of the valleys. As a result therefore, the morphology of the sheet metal surface of a metallic flat product according to the invention is also independent of the skin-pass rate, which is obtained when the fine metal texture is produced by skin-pass rolling.
    Type: Grant
    Filed: June 20, 2008
    Date of Patent: December 30, 2014
    Assignees: ThyssenKrupp Steel Europe AG, Walzen-Service-Center GmbH
    Inventors: Bodo Hesse, Karl-Heinz Kopplin, Folkert Schulze-Kraasch, Udo Schulokat, Hans-Gerd Weyen, Ingo Rogner, Torsten Herles, Roland Meier
  • Patent number: 8920936
    Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic having a plurality of accelerators dispersed in the plastic. The accelerators have a formula ABO3, wherein A is one or more elements selected from Groups 9, 10, and 11 of the Periodic Table of Elements, B is one or more elements selected from Groups 4B and 5B of the Periodic Table of Elements, and O is oxygen. The method includes the step of irradiating a surface of plastic substrate to expose at least a first accelerator. The method further includes plating the irradiated surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: December 30, 2014
    Assignee: BYD Company Limited
    Inventors: Qing Gong, Liang Zhou, Weifeng Miao, Xiong Zhang
  • Publication number: 20140370327
    Abstract: A high vacuum component, e.g. a vacuum chamber wall or a component that is operated or positioned within a vacuum chamber in use is described. The component is substantially formed of a layered material comprising a fibrous composite material layer having a surface that is coated with a copper intermediate layer and an impermeable outer layer of nickel. In use the outer layer is exposed to a high vacuum.
    Type: Application
    Filed: December 8, 2011
    Publication date: December 18, 2014
    Applicant: GE Energy Power Conversion Technology Ltd.
    Inventor: Martin Richard Ingles
  • Patent number: 8911878
    Abstract: Metal-clad polymer articles containing structural fine-grained and/or amorphous metallic coatings/layers optionally containing solid particulates dispersed therein. The fine-grained and/or amorphous metallic coatings are particularly suited for strong and lightweight articles, precision molds, sporting goods, automotive parts and components exposed to thermal cycling although the CLTE of the metallic layer and the one of the substrate is mismatched. The interface between the metallic layer and the polymer is suitably pretreated to withstand thermal cycling without failure.
    Type: Grant
    Filed: January 31, 2013
    Date of Patent: December 16, 2014
    Assignee: Integran Technologies Inc.
    Inventors: Klaus Tomantschger, Jonathan McCrea, Nandakumar Nagarajan, Francisco Gonzalez, Gino Palumbo, Konstantinos Panagiotopoulos, Herath Katugaha
  • Patent number: 8906527
    Abstract: A multi-layer composite getter is described. Also described is a method for the manufacturing of the multi-layer composite getter and electrochemical devices for energy storage that employ the multi-layer composite getter.
    Type: Grant
    Filed: November 10, 2011
    Date of Patent: December 9, 2014
    Assignee: Saes Getters S.p.A.
    Inventors: Enea Rizzi, Alessandra Fernicola, Paolo Vacca
  • Patent number: 8906515
    Abstract: Metal-clad polymer articles containing structural fine-grained and/or amorphous metallic coatings/layers optionally containing solid particulates dispersed therein, are disclosed. The fine-grained and/or amorphous metallic coatings are particularly suited for strong and lightweight articles, precision molds, sporting goods, automotive parts and components exposed to thermal cycling although the coefficient of linear thermal expansion (CLTE) of the metallic layer and the substrate are mismatched. The interface between the metallic layer and the polymer is suitably pretreated to withstand thermal cycling without failure.
    Type: Grant
    Filed: May 24, 2010
    Date of Patent: December 9, 2014
    Assignee: Integran Technologies, Inc.
    Inventors: Klaus Tomantschger, Jonathan McCrea, Nandakumar Nagarajan, Francisco Gonzalez, Gino Palumbo, Konstantinos Panagiotopoulos, Herath Katugaha, Diana Facchini, Jared J. Victor, Uwe Erb
  • Publication number: 20140356645
    Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic substrate having a plurality of accelerators dispersed in the plastic substrate. The accelerators have a formula selected from the group consisting of: CuFe2O4-?, Ca0.25Cu0.75TiO3-?, and TiO2-?, wherein ?, ?, ? denotes oxygen vacancies in corresponding accelerators and 0.05???0.8, 0.05???0.5, and 0.05???1.0. The method further includes removing at least a portion of a surface of the plastic substrate to expose at least a first accelerator. The method further includes plating the exposed surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.
    Type: Application
    Filed: August 18, 2014
    Publication date: December 4, 2014
    Inventors: Qing GONG, Liang ZHOU, Weifeng MIAO, Xiong ZHANG
  • Patent number: 8895152
    Abstract: The invention relates to a method for generating at least one electrically contactable area on a polymer which is doped with a conductive substance, wherein a contact material is applied onto the polymer, which has a lower specific resistance at 23° C. than the polymer. According to the invention the contact material is applied onto the polymer so tightly that close contact between the contact material and the conductive substance is achieved. Due to the tight application of the contact material, which has a lower specific resistance than the polymer, the input resistance of the doped polymer is effectively reduced. The invention further concerns a formed body made of a polymer which is doped with a conductive substance, which has at least one contactable area, within which a contact material is applied onto the polymer, which has a lower specific resistance at 23° C. than the polymer.
    Type: Grant
    Filed: October 25, 2004
    Date of Patent: November 25, 2014
    Assignee: Lonza Cologne GmbH
    Inventors: Herbert Mueller-Hartmann, Ewald Fernbach, Gregor Siebenkotten
  • Patent number: 8895153
    Abstract: Disclosed is a chemical conversion coated Al-plated steel sheet which has excellent weather resistance, water resistance and coating film adhesion. Specifically, a chemical conversion coating liquid is applied over and dried on the surface of an Al alloy-plated steel sheet, thereby forming a chemical conversion coating film that has a film thickness of 0.5-10 ?m. The chemical conversion coating liquid contains: a fluorine-containing olefin resin, which contains 7-20% by mass of F atoms and 0.05-5% by mass of hydrophilic functional groups that are selected from among a carboxyl group, a sulfonic acid group and salts of carboxyl group and sulfonic acid group and has a number average molecular weight within the range of 1,000-2,000,000; and an oxygen acid salt, fluoride, hydroxide, organic acid salt, carbonate or peroxygenated salt of a group 4A metal.
    Type: Grant
    Filed: June 17, 2011
    Date of Patent: November 25, 2014
    Assignee: Nisshin Steel Co., Ltd.
    Inventors: Masanori Matsuno, Koichiro Ueda, Masaya Yamamoto, Hirofumi Taketsu
  • Publication number: 20140342180
    Abstract: A zinc or zinc alloy coated steel sheet has a surface-treatment film formed thereon in a coating weight per one surface of 100 to 600 mg/m2. The surface-treatment film is obtained by applying, onto a surface of the zinc or zinc alloy coated steel sheet, the surface-treatment solution prepared by mixing the following components at specific ratios, the surface-treatment solution having pH of 8 to 10: a silane compound (A) having a hydrolyzable group, obtained from a silane coupling agent (a1) having a glycidyl group, a tetraalkoxysilane (a2), and a chelating agent (a3); a zirconium carbonate compound (B); a vanadate compound (C); a nitric compound (D); and water, and by subsequently heating and drying the surface-treatment solution thus applied.
    Type: Application
    Filed: September 12, 2012
    Publication date: November 20, 2014
    Applicant: JFE STEEL CORPORATION
    Inventors: Rie Kaneko, Takeshi Matsuda, Akira Matsuzaki, Yasuhide Oshima
  • Patent number: 8877348
    Abstract: It is an object to provide a surface-treated steel sheet which contains no Cr, which is excellent in wet resin adhesion, and which can be used as an alternative to a conventional tin-free steel sheet and to provide a resin-coated steel sheet produced by coating the surface-treated steel sheet with resin. A surface-treated steel sheet including an adhesive layer which is disposed on at least one surface of the steel sheet and which contains Ti and at least one selected from the group consisting of Co, Fe, Ni, V, Cu, Mn, and Zn, the ratio of the total amount of Co, Fe, Ni, V, Cu, Mn, and Zn to the amount of Ti contained therein being 0.01 to ten on a mass basis, and a method for producing the surface-treated steel sheet.
    Type: Grant
    Filed: October 30, 2008
    Date of Patent: November 4, 2014
    Assignee: JFE Steel Corporation
    Inventors: Yuka Nishihara, Takeshi Suzuki, Noriko Makiishi, Takumi Tanaka, Hiroki Iwasa, Norihiko Nakamura, Kaoru Sato, Takashi Kawano