Abstract: A surface-treated metal material of the present invention has a composite film on the surface of a metal material. The composite film includes an organic silicon compound (W) having cyclic siloxane bonds, at least one metal compound (X) selected from a group consisting of a titanium compound and a zirconium compound, a phosphate compound (Y) and a fluorine compound (Z). In each of the components of the composite film, the ratio of XS/WS is from 0.06 to 0.16, where WS is a solid mass of Si derived from the organic silicon compound (W) and XS is a solid mass of at least one metal component selected from a group consisting of Ti and Zr included in the metal compound (X); the ratio of YS/WS is from 0.15 to 0.31, where WS is the solid mass of Si and YS is a solid mass of P derived from the phosphate compound (Y); and the ratio of ZS/WS is from 0.08 to 0.50, where WS is the solid mass of Si and ZS is a solid mass of F derived from the fluorine compound (Z).

Abstract: Provided is a film formation composition for improving the blackening of the surface of a steel sheet, particularly, the surface of a steel sheet containing Mg on the surface thereof, such as a Mg sheet, a plated steel sheet having a plated layer comprising Mg, and the like, a steel sheet comprising a film formed by the composition, and a method for forming the film. Provided are a film formation composition for preventing the blackening of the surface of the steel sheet, comprising: 2.5-7.5 parts by weight of a water-soluble phenoxy resin; 0.1-0.5 parts by weight of a fluorometal acid; 0.1-0.5 parts by weight of a metal compound; and 1-5 parts by weight of a cross-linking agent.

Abstract: A two-layered copper-clad laminate material, in which one surface or both surfaces of a polyimide film having a thickness of 12.5 to 50 ?m is subjected to a modification treatment by means of a glow discharge plasma treatment in an oxygen gas atmosphere, and a copper layer having a thickness of 1 to 5 ?m is formed by means of sputtering or electroplating on one surface or both surfaces of the polyimide film after the modification treatment; characterized in that the integrated intensity ratio of a C1S peak at 287 to 290 eV to a C1S peak at 283 to 287 eV, obtained by analyzing the photoelectron spectroscopy (XPS) spectra of the surface of the polyimide film after the plasma treatment, is within the range of 0.03 to 0.11.

Abstract: Provided is a rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, wherein the copper foil comprises a heat resistance layer composed of zinc or zinc alloy or its oxide formed on an etching side of the rolled copper foil or electrolytic copper foil, and a layer of nickel or nickel alloy, which is a metal or alloy with a lower etching rate than copper, formed on the heat resistance layer.

Abstract: A method of imparting corrosion resistance to an edge of a multilayer window film having a metal layer arranged between a pair of polymeric layers includes the step of treating the edge of the window film with a corrosion inhibitor.

Abstract: The invention relates to a method for manufacturing a metallized plastic product with a gold or silver hue, comprising the steps: galvanization of a surface of the plastic body for forming a galvanized chromium layer; deposition by evaporation of a metal layer directly on the galvanized chromium layer, the metal being copper, a mixture of metals comprising at least 70% by weight of copper, a copper alloy comprising at least 70% by weight of copper, or aluminum. The invention also relates to a metallized plastic product (1) with a gold or silver hue, comprising a plastic body (2), a galvanized chromium layer (3, 4, 5, 6), and a metal layer (7), the metal being copper, a mixture of metals comprising at least 70% by weight of copper, an alloy containing copper in an amount of at least 70% by weight, or aluminum.

Abstract: The present invention relates to a metallic laminate and a manufacturing method of a light emitting diode package using the same. The present invention provides a metallic laminate including: a core layer made of an insulating material; a metal layer disposed on one surface of the core layer; a heat radiating metal layer disposed on the other surface of the core layer; and a protective metal oxide layer disposed along an outer surface of the heat radiating metal layer and made of an oxide of the heat radiating metal layer.

Abstract: Provided is a metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method, and a copper layer or a copper alloy layer formed thereon by electroplating, wherein the copper plated layer or copper alloy plated layer comprises three layers to one layer of the copper layer or copper alloy layer, and there is a concentrated portion of impurities at the boundary of the copper layer or copper alloy layer when the copper layer or copper alloy layer is three layers to two layers, and there is no concentrated portion of impurities when the copper layer or copper alloy layer is a single layer. Additionally provided are a method of producing the composite and a method of producing an electronic circuit board.

Abstract: A device housing includes a metallic substrate, a pattern element formed in the substrate, and a transparent or translucent decorative layer formed on the substrate and the pattern layer. The substrate defines a receiving space therein, and the pattern element is formed in the receiving space. The pattern element is made of thermosetting plastic. A method for making the device housing is also described.

Abstract: A method of producing a hot-dip galvanized steel sheet includes applying, to a hot-dip galvanized steel sheet having a Ra of 0.5 to 2.0 ?m and a PPI of 150 or more, a predetermined surface treatment agent, i.e., a surface treatment agent containing a specified resin compound, a specified urethane resin having cationy, a specified silane coupling agent having a functional group, a specified organic Ti chelate compound, and a tetravalent vanadyl compound at a specified ratio; and drying the surface treatment agent at a ultimate sheet temperature of 50° C. to 180° C. to form a surface treatment coating film with a coating weight of 0.2 to 1.0 g/m2 on the surface of the steel sheet.

Abstract: Provided is a copper foil for a printed wiring board, the copper foil being suitable for achieving finer pitch, favorable in terms of manufacturing cost, and excellent both in etching ability and adhesion to an insulating substrate. The copper foil for a printed wiring board comprises a copper foil base material and a covering layer for covering at least a portion of a surface of the copper foil base material, wherein the covering layer is formed by an nickel-vanadium alloy layer containing nickel and vanadium, and a chromium layer, laminated in this order from the surface of the copper foil base material; the chromium layer contains chromium in an amount of 15-210 ?g/dm2; the nickel-vanadium alloy layer contains nickel and vanadium in a combined covering amount of 20-600 ?g/dm2; and the nickel-vanadium alloy layer contains vanadium in an amount of 3-70 wt %.

Abstract: A method for manufacturing a component includes a step of providing at least one metallic element. A surface of the at least one metallic element is modified to facilitate a bonding of the at least one metallic element to a polymeric layer. The polymeric layer is then bonded to the at least one metallic element to form the component.

Abstract: The present invention provides a fixation member having a multi-layer metallic structure, which member comprises a substrate employing electroformed nickel for preventing image quality failure. The fixation member of the present invention includes a metallic substrate including a first layer formed of an electroformed seamless belt made of nickel or a nickel alloy, and a second layer formed of an electroformed seamless belt made of a metal having a thermal conductivity greater than that of the first layer; an adhesion layer disposed on the surface of the second layer; and a fluororesin layer disposed by the mediation of the adhesion layer, wherein the ratio of the thickness of the second layer to the total thickness of the metallic substrate is 0.66 to 0.95.

Abstract: A manufacturing method for steel sheets for containers produces steel sheets with excellent film adhesion qualities. This steel sheet for containers has, on a steel sheet, a chemical conversion coating with a metal Zr content of 1-100 mg/m2, a P content of 0.1-50 mg/m2, and an F content of no more than 0.1 mg/m2, upon which is formed a phenolic resin layer with a C content of 0.1-50 mg/m2. Moreover, the manufacturing method for steel sheets for containers is a method for obtaining the steel sheet for containers wherein the chemical conversion coating is formed on the steel sheet by subjecting the steel sheet to immersion in or electrolytic treatment with a treatment solution containing Zr ions, phosphoric acid ions, and F ions; and subsequently, the steel sheet upon which the chemical conversion coating has been formed is immersed in, or undergoes topical application of, an aqueous solution containing phenolic resin, then dried.

Abstract: Disclosed is a steel sheet for containers that maintains excellent corrosion resistance even when a surface treatment that replaces a chromate treatment has been conducted, and that has excellent film adhesion qualities and appearance. This steel plate for containers has, on at least one surface thereof, a chemical conversion coating including at least two coatings selected from a zirconium coating that contains zirconium and has a metal zirconium content of 0.1-9 mg/m2, a phosphate coating that contains phosphoric acid and has a phosphorous content of 0.1-8 mg/m2, and a phenolic resin coating that contains phenolic resin in an amount of 0.5-8 mg/m2 in terms of carbon, the percentage of the area of the surface of the chemical conversion coating layer having particles Of a prescribed size being 0.1-50%.

Abstract: A multi-layer composite getter is described. Also described is a method for the manufacturing of the multi-layer composite getter and electrochemical devices for energy storage that employ the multi-layer composite getter.

Abstract: The present invention relates to thermosetting resin compositions which are suitably used for manufacturing circuit boards, such as flexible printed circuit boards (FPCs) and build-up circuit boards, and to multilayer bodies and circuit boards manufactured using such thermosetting resin compositions. A thermosetting resin composition contains a polyimide resin component (A), a phenol resin component (B), and an epoxy resin component (C). The mixing ratio by weight (A)/[(B)+(C)] is in a range of 0.4 to 2.0, the mixing ratio by weight being the ratio of the weight of the component (A) to the total weight of the component (B) and the component (C). By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. A thermosetting resin composition contains a polyimide resin (A), a phosphazene compound (D), and a cyanate ester compound (E).

Abstract: Provided are a polymer capsule in which an organic corrosion inhibitor is encapsulated, a method of preparing the same, a composition having the same, and a steel sheet whose surface is treated using the same. The polymer capsule prepared to include a core layer polymer having a hydrophilic acid group and at least one shell layer surrounding the core layer through continuous emulsion polymerization may have an organic corrosion inhibitor effectively encapsulated. The corrosion inhibitor may be released from the capsule in a corrosive environment, thereby enhancing corrosion resistance of the steel sheet.

Abstract: A production process for producing an iron-tin alloy layer on a packaging steel substrate and to a substrate provided with said layer wherein one or both sides of a SR- or DR-blackplate substrate is coated with an iron-tin alloy layer which contains at least 80 weight percent (wt. %) of FeSn (50 at. % tin and 50 at. % iron).

Abstract: A zinc or zinc alloy coated steel excellent in various properties including corrosion resistance and adhesion properties and, in particular, good conductivity is provided. A method for manufacturing a zinc or zinc alloy coated steel sheet includes: preparing a surface-treatment liquid for a the steel sheet, containing following components, by blending the including: (A) a specific resin emulsion; (B) a tetraalkoxysilane; (C) at least one type of silane coupling agent; (D) a chelating agent; (E) a vanadate compound; (F) a titanium compound; and water; and applying by coating the surface-treatment liquid to a surface of the steel sheet, heating and drying the surface of the steel sheet such that a coating amount per one surface is 200 to 1,000 mg/m2 to form a surface treatment coating film on the surface.

Abstract: The present invention provides a chromium-free surface treatment liquid which enables forming, on a metal material surface, a film excellent in corrosion resistance at bent portions of a steel sheet, solvent resistance, coating properties after alkaline degreasing, and sweat resistance. The surface treatment liquid contains a resin compound having a specific bisphenol skeleton, a cationic urethane resin emulsion, a silane coupling agent, an organic titanium chelate compound, a quadrivalent vanadyl compound, a molybdate compound, a fluorine compound, and water at predetermined proportions. The pH of the surface treatment liquid is in the range of 4 to 5.

Abstract: An exemplary method for manufacturing a circuit board includes, firstly, providing a substrate made of heat conductive, electrically insulative material. Then a copper layer is formed on the substrate. After that, nickel is plated on the copper layer to form a nickel layer. Finally, gold is and plated on the nickel layer to form a gold layer.

Abstract: A composite component comprising at least one first and one second sheet metal plate with at least one layer of a polymer arranged between the first and the second sheet metal plates provides for a component optimized with respect to the weight thereof, and which is at the same time simple to manufacture. The polymer layer of the composite component according to the invention comprises at least one foamed polymer layer of a thermoplastic polymer, wherein the foamed polymer layer comprises gas bubbles with a volume percentage of 1% to 80%, in particular 5% to 70%.

Abstract: Provided is a method of producing a two-layered copper-clad laminate with improved folding endurance, wherein the two-layered copper-clad laminate retains folding endurance of 150 times or more measured with a folding endurance test based on JIS C6471 by subjecting the laminate in which a copper layer is formed on a polyimide film through sputtering and plate processing to heat treatment at a temperature of 100° C. or more but not exceeding 175° C. Specifically, provided are a method of producing a two-layered copper-clad laminate (two-layered CCL material) in which a copper layer is formed on a polyimide film through sputtering and plate processing, wherein the rupture of the outer lead part of a circuit can be prevented due to the improvement in folding endurance; and a two-layered copper-clad laminate obtained from the foregoing method.

Abstract: A new substrate makes it possible to modify surface properties relating to biocompatibility. Said substrate has an electron donating surface, characterized in having metal particles on said surface, said metal particles comprising palladium and at least one metal chosen from gold, ruthenium, rhodium, osmium, iridium, and platinum, wherein the amount of said metal particles is from about 0.001 to about 8 ?g/cm2. The substrate is suggested for different uses, such as for modifying the hydrophobicity, protein adsorption; tissue ingrowth, complement activation, inflammatory response, thrombogenicity, friction coefficient, and surface hardness.

Abstract: Disclosed is a chemical conversion coated Al-plated steel sheet which has excellent weather resistance, water resistance and coating film adhesion. Specifically, a chemical conversion coating liquid is applied over and dried on the surface of an Al alloy-plated steel sheet, thereby forming a chemical conversion coating film that has a film thickness of 0.5-10 ?m. The chemical conversion coating liquid contains: a fluorine-containing olefin resin, which contains 7-20% by mass of F atoms and 0.05-5% by mass of hydrophilic functional groups that are selected from among a carboxyl group, a sulfonic acid group and salts of carboxyl group and sulfonic acid group and has a number average molecular weight within the range of 1,000-2,000,000; and an oxygen acid salt, fluoride, hydroxide, organic acid salt, carbonate or peroxygenated salt of a group 4A metal.

Abstract: Composite elements have the following layer structure: (i) from 2 to 20 mm of metal, (ii) from 10 to 300 mm of plastic, and (iii) from 2 to 20 mm of metal, where (i) and/or (iii) have an opening which may, if desired, be sealable.

Abstract: Described herein are methods of preparing nanolaminated brass coatings and components having desirable and useful properties. Also described are nanolaminated brass components and plastic and polymeric substrates coated with nanolaminated brass coatings having desirable and useful properties.

Abstract: The present invention relates to a corrosion-protective composition containing a wax, an unsubstituted or substituted polyaniline in a doped form and a liquid paraffin, and articles comprising the composition applied on a substrate. It also relates to a process for manufacturing the composition, wherein i) a first dispersion of a polyaniline in a doped form is prepared; and ii) the first dispersion of the polyaniline is combined with a wax component to sufficiently disperse the polyaniline therein, and to the use of the composition as a single layer coating for the protection against corrosion of a substrate in need thereof.

Abstract: A sliding layer for a multi-layer bearing material that is free of lead. The sliding layer can include PTFE, sphalerite, and solid lubricants. The solid lubricants can include graphite and antimony oxide. In some embodiments, the sliding layer includes from 70 to 89 vol % PTFE, from 10 to 20 vol % sphalerite, and from 1 to 10 vol % solid lubricant (for example, graphite and antimony oxide).

Abstract: A coated steel sheet includes a corrosion-resistant coating composed of at least one layer selected from the group consisting of a Ni layer, a Sn layer, an Fe—Ni alloy layer, an Fe—Sn alloy layer, and an Fe—Ni—Sn alloy layer disposed on at least one surface of a steel sheet, and an adhesive coating disposed on the corrosion-resistant coating, the adhesive coating containing Zr and further containing at least one metal element selected from the group consisting of Co, Fe, Ni, V, Cu, Mn, and Zn, in total, at a ratio by mass of 0.01 to 10 with respect to Zr. The coated steel sheet has excellent humid resin adhesion and corrosion resistance, in which streaky surface defects do not occur.

Abstract: The present invention relates to a method of forming copper nanowires with a metallic coating. In a preferred embodiment, the metallic coating is copper. Due to the metal coating, the nanowires become magnetically guidable and chemically stable. As such, the nanowires can be used to form nanomesh. Further, the nanowire and nanomesh of the present invention can be used as transparent electrodes that are used in TV, PC, touch-control, and solar industries.

Abstract: A metal base circuit board, having an insulating layer with a linear expansion coefficient of 60 ppm per degree C. or higher and 120 ppm per degree C. or lower, a metal foil provided on one side of the insulating layer, comprising a metal material with a linear expansion coefficient of 10 ppm per degree C. or higher and 35 ppm per degree C. or lower, a circuit portion and a non-circuit potion having a linear expansion coefficient of 10 ppm per degree C. or higher and 35 ppm per degree C.

Abstract: A composition for a polyimide resin, comprising a polyamic acid and a perylene black pigment having an isoindole skeleton, wherein a content of the perylene black pigment is 1 to 10% by mass based on 100% by mass of a weight of a solid content of the polyamic acid.

Abstract: The present invention provides for an inorganic nanostructure-organic polymer heterostructure, useful as a thermoelectric composite material, comprising (a) an inorganic nanostructure, and (b) an electrically conductive organic polymer disposed on the inorganic nanostructure. Both the inorganic nanostructure and the electrically conductive organic polymer are solution-processable.

Abstract: Metal-clad polymer articles containing structural fine-grained and/or amorphous metallic coatings/layers optionally containing solid particulates dispersed therein, are disclosed. The fine-grained and/or amorphous metallic coatings are particularly suited for strong and lightweight articles, precision molds, sporting goods, automotive parts and components exposed to thermal cycling although the CLTE of the metallic layer and the one of the substrate is mismatched. The interface between the metallic layer and the polymer is suitably pretreated to withstand thermal cycling without failure.

Abstract: [Problems] To provide a bath for surface treatment capable of forming a surface-treating film having excellent corrosion resistance by a high-speed electrolytic treatment, and a method of producing a surface-treated steel plate having excellent corrosion resistance and closely adhering property to the coating maintaining good productivity. [Means for Solution] A bath for surface treatment used for forming a surface-treating film on the surface of a steel plate by cathodic electrolysis, the bath for surface treatment containing Zr and/or Ti, and a polycarboxylic acid.

Abstract: An object of the present invention is to provide a flexible printed wiring board and multilayered flexible printed wiring board in which, in methods of laminating substrates comprising a non-adhering section and an adhering section, adhesion of the FPC substrates of the flexure part can be prevented and adequate flex resistance can be maintained. The present invention provides a flexible printed wiring board comprising at least an electric insulating layer and a conductor layer wherein the surface of the electric insulating layer has a 10-point average roughness of at least 1.5 ?m and less than 2.0 ?m and contact angle of at least 60° and less than 120°, or has a 10-point average roughness of at least 2.0 ?m and less than 4.

Abstract: The present invention provides a battery or supercapacitor current collector which is prelithiated. The prelithiated current collector comprises: (a) an electrically conductive substrate having two opposed primary surfaces, and (b) a mixture layer of carbon (and/or other stabilizing element, such as B, Al, Ga, In, C, Si, Ge, Sn, Pb, As, Sb, Bi, Te, or a combination thereof) and lithium or lithium alloy coated on at least one of the primary surfaces, wherein lithium element is present in an amount of 1% to 99% by weight of the mixture layer. This current collector serves as an effective and safe lithium source for a wide variety of electrochemical energy storage cells, including the rechargeable lithium cell (e.g. lithium-metal, lithium-ion, lithium-sulfur, lithium-air, lithium-graphene, lithium-carbon, and lithium-carbon nanotube cell) and the lithium ion based supercapacitor cell (e.g, symmetric ultracapacitor, asymmetric ultracapacitor, hybrid supercapacitor-battery, or lithium-ion capacitor).

Abstract: Disclosed are a carrier substrate including an insulating base material with a copper foil layer formed on at least one surface thereof, a metal layer formed on the copper layer and having a length shorter than that of the copper foil layer, and an insulating layer formed on the metal layer, a fabrication method thereof, a printed circuit board (PCB) using the same, and a fabrication method thereof. Because there is no land at the via and core in the substrate, because a circuit pattern connected with the via can be formed to be finer, so the circuit pattern can be highly integrated and the substrate can become thinner. Thus, a printed circuit board (PCB) having a smaller size and reduced number of layers can be fabricated.

Abstract: A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part, containing: a metal base material having at least a surface formed of Cu or a Cu alloy; and an insulating film provided on at least a part of the metal base material; wherein a metal layer having Cu diffused in Ni or a Ni alloy is interposed between the metal base material and the insulating film; and wherein the ratio of the number of Cu atoms to the number of Ni atoms (Cu/Ni) obtained by analyzing the outermost surface of the metal layer by Auger electron spectroscopy is 0.005 or more.

Abstract: A galvanized steel sheet has an organic inorganic complex coating on the surface thereof which contains an organic resin and a crystalline layered substance and has an average film thickness of 0.10 to 2.0 ?m. The organic inorganic complex coating contains the crystalline layered substance in a solid content of not less than 0.5 parts by weight with respect to 100 parts by weight of the solid content of the organic resin.

Abstract: Provided is an electronic circuit as a laminated body configured from a layer (A) which is made of a copper or copper alloy foil formed on one surface or both surfaces of a resin substrate, a copper or copper alloy plated layer (B) formed on a part or whole surface of the (A) layer, a plated layer (C) formed on a part or whole surface of the (B) layer and having a slower etching rate than that of copper relative to a copper etching solution, and a copper or copper alloy plated layer (D) formed on the layer (C) and which has a thickness of 0.05 ?m or more and less than 1 ?m, and which is made of a copper circuit formed by etching and removing a part of the laminated portion of the (A) layer, the (B) layer, the (C) layer and the (D) layer up to the resin substrate surface. It is thereby possible to form a circuit having a uniform circuit width, improve the etching properties in pattern etching, and prevent the occurrence of short-circuits and defects in the circuit width.

Abstract: A thermal interface material includes a thermally conductive metal matrix and coarse polymeric particles dispersed therein. The composite can be used for both TIM1 and TIM2 applications in electronic devices.

Abstract: The present invention relates to a coating composition having excellent electro-conductivity and corrosion resistance, a method of preparing the coating composition, and an article coated with the coating composition. More particularly, the present invention relates to a coating composition having excellent surface electro-conductivity and corrosion resistance, comprising: one or more base resins selected from the group consisting of a polyester resin, an epoxy resin, a polyurethane resin, an acrylic resin, a polyolefin resin, a fluorine resin, a polycarbonate resin and a phenol resin; a melamine-based curing agent; one or more selected from among carbon black and carbon nanotubes; metal powder; and organo clay, a method of preparing the coating composition, and an article coated with the coating composition.

Abstract: Laminated metallic sheets which comprise an interior layer of a viscoelastic polymeric compound sandwiched between outer layers of metallic sheet may exhibit enhanced properties through modification of the viscoelastic phase. In a first embodiment the elastic modulus of the viscoelastic polymeric compound may be reduced by incorporating voids, bubbles or pores within the compound. These voids which may be introduced by introduction of polymeric microspheres are effective in reducing the internal stresses induced in the laminate by temperature changes. In a second embodiment, coating the microspheres with an electrically-conductive layer may be effective in enabling resistance spot welding of such laminated materials.

Abstract: An electrical steel sheet is provided with an insulating coating which has inorganic with some organic materials, the insulating coating including inorganic components and an organic resin, the insulating coating contains, as the inorganic components, a Zr compound, a B compound, and a Si compound, specifically, when expressed as percentages in the dry coating, 20% to 70% by mass of the Zr compound (in terms of ZrO2), 0.1% to 5% by mass of the B compound (in terms of B2O3), and 10% to 50% by mass of the Si compound (in terms of SiO2), and the balance containing the organic resin.

Abstract: An adhesiveless copper clad laminate, which does not have defects on a copper film part due to a pin hole generated at the time of forming a base metal layer on an insulating film by dry plating process, has excellent adhesion between the insulating film and the base metal layer and corrosion resistance, and has a copper film layer having high insulation reliability The adhesiveless copper clad laminate is provided by forming a base metal layer directly at least on one plane of an insulating film without having an adhesive in between, and then by forming a copper film layer on the base metal layer, the base metal layer having a film thickness of 3 to 50 nm is formed by dry plating method and mainly contains a chrome-molybdenum-nickel alloy wherein the chrome ratio is 4 to 22 weight %, the molybdenum ratio is 5 to 40 weight %, and the balance is nickel.

Abstract: Present invention provides an electrodeposited copper foil with carrier foil that assure high bonding strength between a surface of the bulk copper layer and a resin substrate layer even when surface roughness is low, and hardly occurs delamination even when pin holes and the like remain in a bulk copper layer or in the side wall of the through holes or via holes and the like after contact with a desmear solution and the like. To solve such a problem, electrodeposited copper foil with carrier foil with a primer resin layer comprising a bonding interface layer, a bulk copper layer, a plated Ni—Zn alloy layer and a primer resin layer which is formed in this order at least on one surface of the carrier foil is applied.

Abstract: An aqueous surface-treatment liquid is a treatment liquid containing a water-soluble zirconium compound, water-dispersive particulate silica, a silane coupling agent, a vanadic acid compound, a phosphoric acid compound, a nickel compound, and an acrylic resin emulsion in particular proportions. A surface-treated galvanized steel sheet produced using the treatment liquid is a galvanized steel sheet having a surface-treatment coating on a surface thereof, and the coating contains a zirconium compound, particulate silica, a silane-coupling-agent-derived component, a vanadic acid compound, a phosphoric acid compound, a nickel compound, and an acrylic resin in particular proportions. The amount of coating on a zirconium basis is 10 to 200 mg/m2. This surface-treated galvanized steel sheet is chromate-free and has superior flat-portion corrosion resistance, blackening resistance, and appearance and corrosion resistance after press forming.